CN112164684A - Camera module and electronic equipment - Google Patents
Camera module and electronic equipment Download PDFInfo
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- CN112164684A CN112164684A CN202010908220.XA CN202010908220A CN112164684A CN 112164684 A CN112164684 A CN 112164684A CN 202010908220 A CN202010908220 A CN 202010908220A CN 112164684 A CN112164684 A CN 112164684A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The application discloses camera module and electronic equipment belongs to communication technology field. The camera module comprises a shell, a substrate and an image sensor. The substrate comprises a base body, a first conducting layer, a second conducting layer, an N-type semiconductor and a P-type semiconductor, wherein the first conducting layer and the second conducting layer are arranged on the base body, the first conducting layer is located between the image sensor and the second conducting layer, the N-type semiconductor and the P-type semiconductor are arranged between the first conducting layer and the second conducting layer in parallel, the first conducting layer comprises a plurality of first conducting parts which are arranged at intervals, the second conducting layer comprises a plurality of second conducting parts which are arranged at intervals, two ends of the N-type semiconductor are respectively contacted with the first conducting parts and the second conducting parts, two ends of the P-type semiconductor are respectively contacted with the first conducting parts and the second conducting parts, and under the condition that the substrate is electrified, heat is conducted to the second conducting parts from the first conducting parts. The scheme can improve the problem of poor heat dissipation effect of the existing camera module.
Description
Technical Field
The application belongs to the technical field of communication, and particularly relates to a camera module and electronic equipment.
Background
At present, a camera module becomes one of indispensable components of many electronic devices, such as a mobile phone, a tablet computer and other electronic devices, the camera module plays an important role in work, life, entertainment and other aspects of people, and the imaging quality of the camera module also directly affects the use experience of users.
The heat that the electronic equipment during operation produced can influence the formation of image quality of camera module, in order to reduce the influence of heat to formation of image quality, adopts attached conducting strip to carry out the conduction to the heat at present. However, since the heat-conducting sheet has a limited heat-conducting effect, it can transfer less heat. Therefore, the camera module of the scheme has poor heat dissipation effect.
Disclosure of Invention
The embodiment of the application aims to provide a camera module and electronic equipment, and the problem that the existing camera module is poor in heat dissipation can be solved.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a camera module, including:
a housing having a receiving space;
the substrate is arranged in the accommodating space;
an image sensor disposed on the substrate;
the substrate comprises a base body, a first conducting layer, a second conducting layer, an N-type semiconductor and a P-type semiconductor, wherein the first conducting layer and the second conducting layer are arranged on the base body, the first conducting layer is located between the image sensor and the second conducting layer, and the N-type semiconductor and the P-type semiconductor are arranged between the first conducting layer and the second conducting layer in parallel;
the first conducting layer comprises a plurality of first conducting parts arranged at intervals, the second conducting layer comprises a plurality of second conducting parts arranged at intervals, two ends of the N-type semiconductor are respectively contacted with the first conducting parts and the second conducting parts, two ends of the P-type semiconductor are respectively contacted with the first conducting parts and the second conducting parts, and heat is conducted from the first conducting parts to the second conducting parts under the condition that the substrate is electrified.
In a second aspect, an embodiment of the present application provides an electronic device, including a housing and a camera module disposed in the housing, where the camera module is the above-mentioned camera module.
In the embodiment of the application, the substrate of the camera module comprises a base body, a first conducting layer, a second conducting layer, an N-type semiconductor and a P-type semiconductor, and under the condition that the substrate is electrified, the heat generated by the image sensor can be conducted to the other side of the substrate from one side of the substrate according to the Peltier effect, so that the heat generated by the image sensor is prevented from being gathered in the camera module and cannot be dissipated. The camera module can greatly transfer the heat generated by the image sensor to one side of the substrate departing from the image sensor, so that the scheme can improve the heat dissipation effect of the camera module.
Drawings
Fig. 1 is a schematic structural diagram of a camera module disclosed in an embodiment of the present application;
fig. 2 is a schematic view of a partial structure of a camera module disclosed in an embodiment of the present application;
fig. 3 is a schematic diagram of a substrate and an image sensor according to an embodiment of the disclosure;
fig. 4 is a schematic structural view of a positive plate disclosed in an embodiment of the present application;
fig. 5 is a schematic structural view of a negative plate disclosed in an embodiment of the present application;
fig. 6 is a schematic view of a partial structure of an electronic device disclosed in an embodiment of the present application.
Description of reference numerals:
100-shell, 110-bracket, 120-bottom plate, 101-air inlet, 102-air outlet;
200-substrate, 210-base, 220-first conductive layer, 221-first conductive portion, 230-second conductive layer, 231-second conductive portion, 240-N type semiconductor, 250-P type semiconductor;
300-an image sensor;
400-ionization module, 410-positive plate, 420-negative plate and 430-vent;
500-shell, 510-battery compartment;
600-a heat collector;
700-a heat pipe;
810-a first drive mechanism, 820-a second drive mechanism;
900-lens.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The following describes in detail a camera module and an electronic device provided in the embodiments of the present application through specific embodiments and application scenarios thereof with reference to the accompanying drawings.
As shown in fig. 1 to 5, an embodiment of the present application discloses a camera module, which includes a housing 100, a substrate 200, a lens 900, and an image sensor 300, where the housing 100 has an accommodating space, the accommodating space provides an installation space for other components, the substrate 200 is disposed in the accommodating space, the image sensor 300 is disposed on the substrate 200, and the image sensor 300 is also located in the accommodating space. The substrate 200 may be electrically connected to a flexible circuit board to supply power to the camera module. The lens 900 is disposed on the housing 100, and the lens 900 may include a plurality of lenses.
The substrate 200 includes a base 210, a first conductive layer 220, a second conductive layer 230, an N-type semiconductor 240 and a P-type semiconductor 250, wherein the first conductive layer 220 and the second conductive layer 230 are disposed on the base 210, the first conductive layer 220 is disposed between the image sensor 300 and the second conductive layer 230, and the N-type semiconductor 240 and the P-type semiconductor 250 are disposed between the first conductive layer 220 and the second conductive layer 230 in parallel. Alternatively, the base 210 may be made of FR4 material, and the first and second conductive layers 220 and 230 may be made of copper material. The first conductive layer 220 is disposed parallel to the second conductive layer 230, and the N-type semiconductor 240 and the P-type semiconductor 250 are embedded in the substrate 210 and integrally connected to the first conductive layer 220 and the second conductive layer 230.
The first conductive layer 220 includes a plurality of first conductive portions 221 arranged at intervals, the second conductive layer 230 includes a plurality of second conductive portions 231 arranged at intervals, both ends of the N-type semiconductor 240 are respectively in contact with the first conductive portions 221 and the second conductive portions 231, both ends of the P-type semiconductor 250 are respectively in contact with the first conductive portions 221 and the second conductive portions 231, and heat is conducted from the first conductive portions 221 to the second conductive portions 231 when the substrate 200 is energized. Current can flow from one second conductive portion 231, through the N-type semiconductor 240, into the first conductive portion 221, through the P-type semiconductor 250, into the other second conductive portion 231, and so on, to conduct each of the first conductive layer 220, the second conductive layer 230, the N-type semiconductor 240, and the P-type semiconductor 250. According to the peltier effect, when the substrate 200 is powered on, heat generated by the image sensor 300 can be conducted from one side of the substrate 200 to the other side of the substrate 200, thereby preventing heat generated by the image sensor 300 from being collected in the camera module and not being dissipated. The camera module can greatly transfer the heat generated by the image sensor 300 to one side of the substrate 200 departing from the image sensor 300, so that the heat dissipation effect of the camera module can be improved.
In addition, the substrate 200 has the advantages of light weight, small thickness, low cost, and the like.
A direction perpendicular to the substrate 200 may be defined as a first direction, and optionally, orthographic projections of any two adjacent first conductive parts 221 in the first direction are overlapped with orthographic projections of the same second conductive part 231 in the first direction, and the N-type semiconductor 240 and the P-type semiconductor 250 extend in the first direction. Alternatively, the first conductive portion 221 and the second conductive portion 231 may be arranged at equal intervals, thereby facilitating the manufacturing process. In the first direction, the distance between the first conductive portion 221 and the second conductive portion 231 is substantially constant, so that the distance between the first conductive portion 221 and the second conductive portion 231 can be made smaller, thereby increasing the density of the N-type semiconductor 240 and the P-type semiconductor 250 and improving the heat dissipation effect. In addition, since the N-type semiconductor 240 and the P-type semiconductor 250 are both located below the same first conductive portion 221, the connection area between the N-type semiconductor 240 and the P-type semiconductor 250 and the first conductive portion 221 and the second conductive portion 231 can be increased, and the connection strength can be improved.
Further, the base 210 has a first surface and a second surface opposite to each other, the first conductive layer 220 is disposed on the first surface, and the second conductive layer 230 is disposed on the second surface. Compared with the first conductive layer 220 and the second conductive layer 230 embedded in the base 210, the first conductive layer 220 and the second conductive layer 230 are respectively disposed on the first surface and the second surface, so that the distance between the first conductive layer 220 and the image sensor 300 can be shortened, and the distance between the second conductive layer 230 and the housing 100 can be shortened, thereby improving the heat dissipation effect.
In an alternative embodiment, the camera module further includes an ionization module 400, the housing 100 includes a bracket 110 and a base plate 120, the bracket 110 is connected to the base plate 120, and both form the receiving space, and the ionization module 400 is disposed between the base plate 120 and the substrate 200. Ionization module 400 can the ionized air to form ionic wind, in order to accelerate air flow rate between bottom plate 120 and the base plate 200, and then can improve the radiating effect of camera module, promote the imaging quality of camera module.
In a further embodiment, the ionization module 400 includes a positive plate 410 and a negative plate 420, the positive plate 410 is opposite to the negative plate 420, and an ionization electric field is formed between the positive plate 410 and the negative plate 420 when the positive plate 410 and the negative plate 420 are both energized. The positive plate 410 is provided with an ionization needle which generates local high voltage under the action of the transformer, so that air around the ionization needle can be ionized to enable nearby air to be positively charged, the positive plate 410 and the negative plate 420 form a strong electric field, and the positive air is driven by the electric field to flow to the negative plate 420 at high speed, so that ion wind is formed. Compared with the traditional form of the motor-driven fan blades, the ionization module 400 occupies smaller space, has better heat dissipation effect, has no moving part, has good reliability and is more beneficial to the arrangement of various devices.
Optionally, at least one of the positive and negative plates 410, 420 is provided with a vent 430. The vent holes 430 are formed in the positive electrode plate 410 and/or the negative electrode plate 420, and the vent holes 430 can allow gas to pass through, so that the gas is not blocked from flowing between the positive electrode plate 410 and the negative electrode plate 420, the gas can flow more smoothly, the temperature of the camera module is effectively reduced, and the imaging quality of the camera module is improved. The shape of the vent 430 may be circular, rectangular or other shapes, and the number may be one or more, which is not limited by the embodiment of the present application.
In an alternative embodiment, the number of the positive electrode plates 410 and the negative electrode plates 420 is at least two, and the positive electrode plates 410 and the negative electrode plates 420 are arranged in pairs in a direction parallel to the substrate 200. After the number of positive plate 410 and negative plate 420 increases, whole ionization module 400 is bigger in the size that is on a parallel with the orientation of base plate 200 to drive gaseous longer flow path that produces, consequently this mode of setting can prolong gaseous flow path, can take away more heats, improves the radiating effect of camera module.
Further, the positive electrode plate 410 and the negative electrode plate 420 are perpendicular to the substrate 200, and the positive electrode plate 410 and the negative electrode plate 420 are parallel. The electric field between parallel positive plate 410 and the negative plate 420 is more even, and electric field strength is stronger overall, and compares in the setting of other forms, and the space that ionization module 400 occupied can be reduced to positive plate 410 and negative plate 420 equal perpendicular to base plate 200.
Optionally, the bottom plate 120 is an insulating plate. The insulating plate can prevent the ionization field from short-circuiting the bottom plate 120, which may cause the ionization module 400 to fail. Further alternatively, the insulating plate herein may be a ceramic or polymer material with high insulation, which is not limited in this embodiment.
In one embodiment, at least one of the bracket 110 and the bottom plate 120 is provided with a tuyere, and the tuyere is communicated with the accommodating space. The air with heat in the accommodating space can flow to the outside through the air opening rapidly, and simultaneously, the low-temperature air in the outside can flow into the accommodating space through the air opening rapidly, so that the heat generated by the camera module can be transferred through the Peltier effect and can be further dissipated to the outside through the air opening, and the heat dissipation effect can be further improved.
In a further embodiment, the air inlet includes an air inlet 101 and an air outlet 102, the bracket 110 has a first end connected to the bottom plate 120, the first end has the air inlet 101 and the air outlet 102, and the air inlet 101 is opposite to the air outlet 102. The camera module is provided with the air inlet 101 and the air outlet 102, so that air convection can be formed, and the heat dissipation effect can be improved.
In another embodiment, the bottom plate 120 is provided with an air inlet 101, the first end is provided with an air outlet 102, and the air inlet 101 and the air outlet 102 are located at two sides of the ionization module 400. The external air can flow in from the air inlet 101 and flow out from the air outlet 102 after flowing through the ionization module 400, at the moment, the distance between the air inlet 101 and the air outlet 102 is far away, and the air can be in contact with the substrate 200 in a large area in the flowing process, so that the carried heat can be increased, the heat discharging speed is increased, and the heat dissipation effect of the camera module is effectively improved.
Of course, the air inlets 101 may also be disposed on the bracket 110 and the bottom plate 120 at the same time, and the air inlets 101 of the bracket 110 and the bottom plate may be disposed in close proximity to each other, so that the amount of air entering the camera module in a unit time is larger, thereby further improving the heat dissipation effect.
Optionally, the camera module further includes a first driving mechanism 810 and a second driving mechanism 820, the first driving mechanism 810 and the second driving mechanism 820 are both disposed on the housing 100, the first driving mechanism 810 is connected to the lens 900 of the camera module and drives the lens 900 to move, and the second driving mechanism 820 is connected to the lens 900 and drives the lens 900 to rotate. The first driving mechanism 810 can drive the lens 900 to move, so as to adjust the distance between the lens 900 and the image sensor 300, and the second driving mechanism 820 can drive the lens 900 to rotate, so as to achieve the purposes of anti-shake and the like. It can be seen that the system function of the first driving mechanism 810 and the second driving mechanism 820 can further improve the imaging quality of the camera module.
Alternatively, the first driving mechanism 810 and the second driving mechanism 820 may be electromagnetic driving mechanisms or other mechanisms having driving functions.
As shown in fig. 6, based on the camera module disclosed in the embodiment of the present application, the embodiment of the present application further discloses an electronic device, which includes a housing 500 and a camera module disposed on the housing 500, where the camera module is the camera module described in any of the above embodiments.
In a further embodiment, the electronic device further includes a heat collector 600 and a heat pipe 700, the heat collector 600 and the heat pipe 700 are both disposed in the casing 500, the outer casing 100 is provided with an air outlet, the heat collector 600 is opposite to the air outlet, and a third end of the heat pipe 700 is communicated with the heat collector 600. The hot air blown out from the air outlet is transferred to the fins of the heat collector 600 by convection, then transferred to the heat pipes 700 at the bottom, and finally diffused to the casing 500 by phase change heat exchange. The housing 500 has a large heat dissipation area, so that the heat dissipation effect of the electronic device is improved, and the user experience is improved.
In an alternative embodiment, the housing 500 is provided with a battery chamber 510, and the fourth end of the heat pipe 700 extends to the battery chamber 510. The heat pipe 700 diffuses the heat generated by the camera module to the battery bin 510, the battery bin 510 has a larger heat dissipation area, the heat can be diffused to the outside more favorably, and the heat dissipation effect can be greatly improved.
The electronic device disclosed in the embodiment of the present application may be a smart phone, a tablet computer, an electronic book reader, a wearable device (e.g., a smart watch), an electronic game machine, and the like, and the specific kind of the electronic device is not limited in the embodiment of the present application.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (11)
1. A camera module is characterized by comprising a shell, a substrate and an image sensor, wherein the shell is provided with a containing space, the substrate is arranged in the containing space, the image sensor is arranged on the substrate,
the substrate comprises a base body, a first conducting layer, a second conducting layer, an N-type semiconductor and a P-type semiconductor, wherein the first conducting layer and the second conducting layer are arranged on the base body, the first conducting layer is positioned between the image sensor and the second conducting layer, the N-type semiconductor and the P-type semiconductor are arranged between the first conducting layer and the second conducting layer in parallel,
the first conducting layer comprises a plurality of first conducting parts arranged at intervals, the second conducting layer comprises a plurality of second conducting parts arranged at intervals, two ends of the N-type semiconductor are respectively contacted with the first conducting parts and the second conducting parts, two ends of the P-type semiconductor are respectively contacted with the first conducting parts and the second conducting parts, and heat is conducted from the first conducting parts to the second conducting parts under the condition that the substrate is electrified.
2. The camera module according to claim 1, wherein a direction perpendicular to the substrate is a first direction, an orthogonal projection of any two adjacent first conductive portions in the first direction coincides with an orthogonal projection of the same second conductive portion in the first direction, and the N-type semiconductor and the P-type semiconductor extend in the first direction.
3. The camera module of claim 1, further comprising an ionization module, wherein the housing comprises a bracket and a base plate, the bracket is connected to the base plate, the bracket and the base plate form the receiving space, and the ionization module is disposed between the base plate and the substrate.
4. The camera module of claim 3, wherein the ionization module comprises a positive plate and a negative plate, the positive plate opposing the negative plate, wherein an ionization field is formed between the positive plate and the negative plate when the positive plate and the negative plate are both energized.
5. The camera module of claim 4, wherein at least one of the positive and negative plates is provided with a vent.
6. The camera module according to claim 4, wherein the number of the positive electrode plates and the negative electrode plates is at least two, and the positive electrode plates and the negative electrode plates are arranged in pairs in a direction parallel to the substrate;
the positive plate and the negative plate are perpendicular to the substrate and parallel to the negative plate.
7. The camera module according to claim 3, wherein at least one of the bracket and the bottom plate is provided with an air opening, and the air opening is communicated with the accommodating space.
8. The camera module of claim 7, wherein the air opening comprises an air inlet and an air outlet, the bracket has a first end, the first end is coupled to the base plate,
the first end is provided with the air inlet and the air outlet, and the air inlet is opposite to the air outlet; and/or the presence of a gas in the gas,
the bottom plate is equipped with the air intake, first end is equipped with the air outlet, the air intake with the air outlet is located the both sides of ionization module.
9. The camera module according to claim 1, further comprising a first driving mechanism and a second driving mechanism, wherein the first driving mechanism and the second driving mechanism are disposed on the housing, the first driving mechanism is connected to the lens of the camera module and drives the lens to move, and the second driving mechanism is connected to the lens and drives the lens to rotate.
10. An electronic device, comprising a housing and a camera module disposed in the housing, wherein the camera module is the camera module according to any one of claims 1 to 9.
11. The electronic device of claim 10, further comprising a heat collector and a heat pipe, wherein the heat collector and the heat pipe are both disposed in the housing, the housing is provided with an air outlet, the heat collector is opposite to the air outlet, and a third end of the heat pipe is communicated with the heat collector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010908220.XA CN112164684B (en) | 2020-09-02 | 2020-09-02 | Camera module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010908220.XA CN112164684B (en) | 2020-09-02 | 2020-09-02 | Camera module and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN112164684A true CN112164684A (en) | 2021-01-01 |
| CN112164684B CN112164684B (en) | 2023-01-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010908220.XA Active CN112164684B (en) | 2020-09-02 | 2020-09-02 | Camera module and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114114878A (en) * | 2021-12-13 | 2022-03-01 | 维沃移动通信有限公司 | Dial structure and wearable equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006086306A (en) * | 2004-09-15 | 2006-03-30 | Seiko Instruments Inc | Sealed electronic parts, circuit board and electronic equipment |
| JP2006135659A (en) * | 2004-11-05 | 2006-05-25 | Seiko Instruments Inc | Imaging device module and electronic apparatus |
| CN101211939A (en) * | 2006-12-29 | 2008-07-02 | 东部高科股份有限公司 | CMOS-device and manufacture method of the cmos device |
| CN101266995A (en) * | 2007-03-14 | 2008-09-17 | 东部高科股份有限公司 | Image sensor and method for manufacturing the same |
-
2020
- 2020-09-02 CN CN202010908220.XA patent/CN112164684B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006086306A (en) * | 2004-09-15 | 2006-03-30 | Seiko Instruments Inc | Sealed electronic parts, circuit board and electronic equipment |
| JP2006135659A (en) * | 2004-11-05 | 2006-05-25 | Seiko Instruments Inc | Imaging device module and electronic apparatus |
| CN101211939A (en) * | 2006-12-29 | 2008-07-02 | 东部高科股份有限公司 | CMOS-device and manufacture method of the cmos device |
| CN101266995A (en) * | 2007-03-14 | 2008-09-17 | 东部高科股份有限公司 | Image sensor and method for manufacturing the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114114878A (en) * | 2021-12-13 | 2022-03-01 | 维沃移动通信有限公司 | Dial structure and wearable equipment |
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| CN112164684B (en) | 2023-01-03 |
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