CN215420434U - Photosensitive heat dissipation structure, camera module and electronic equipment - Google Patents
Photosensitive heat dissipation structure, camera module and electronic equipment Download PDFInfo
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- CN215420434U CN215420434U CN202121079113.7U CN202121079113U CN215420434U CN 215420434 U CN215420434 U CN 215420434U CN 202121079113 U CN202121079113 U CN 202121079113U CN 215420434 U CN215420434 U CN 215420434U
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Abstract
The application discloses sensitization heat radiation structure, camera module and electronic equipment, sensitization heat radiation structure include casing, circuit board subassembly, photosensitive element and at least one fan. The casing is internally provided with a containing cavity, the casing is provided with at least one air inlet and at least one air outlet, and the air inlet and the air outlet are communicated with the containing cavity. The circuit board assembly is arranged in the accommodating cavity. The photosensitive element is electrically connected with the circuit board assembly. The fan is electrically connected with the circuit board assembly and located in the containing cavity, the fan is used for leading gas outside the shell into the containing cavity through the air inlet to dissipate heat of the circuit board assembly, and discharging the gas after heat exchange from the air outlet, so that quick heat dissipation of the photosensitive element and the circuit board assembly is realized, the heat dissipation effect is further improved, and the stability of the photosensitive element and the circuit board assembly during working is ensured.
Description
Technical Field
The application relates to the technical field of camera modules, in particular to a photosensitive heat dissipation structure, a camera module and electronic equipment.
Background
The camera module generally images through photosensitive element, and photosensitive element generally is connected with the circuit board, because electronic component such as photosensitive element, circuit board all concentrate the setting in the casing, and in the imaging process, photosensitive element, circuit board produce a large amount of heats, produce the too high problem of temperature in the casing easily when making camera module move.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a sensitization heat radiation structure, camera module and electronic equipment, through setting up into wind gap and air outlet on the casing, and be provided with the fan in the casing, the fan inhales low temperature gas through going into the wind gap, can dispel the heat to photosensitive element, circuit board assembly in the casing, effectively reduces the temperature in the casing.
In a first aspect, an embodiment of the present application provides a photosensitive heat dissipation structure, including:
the air inlet and the air outlet are communicated with the accommodating cavity;
the circuit board assembly is arranged in the accommodating cavity;
the photosensitive element is arranged in the accommodating cavity and is electrically connected with the circuit board assembly;
and the fan is electrically connected with the circuit board assembly, is positioned in the accommodating cavity and is used for introducing gas outside the shell into the accommodating cavity through the air inlet and discharging the heat-exchanged gas from the air outlet.
The beneficial effects of the embodiment of the application are as follows: in the formation of image in-process, photosensitive element and circuit board assembly can produce a large amount of heats, and this embodiment is through seting up into wind gap, air exit on the casing and set up the fan in the casing, and the fan during operation introduces outside low temperature gas from going into the wind gap to discharge the high temperature gas after the heat transfer from the air exit, with the holding intracavity forms the air current that can last the heat transfer, realizes the quick heat dissipation to photosensitive element and circuit board assembly, and then improves the radiating effect, guarantees the stability of photosensitive element and circuit board assembly during operation.
In some of these embodiments, the fan comprises:
the air inlet fan is arranged corresponding to the air inlet so as to introduce the air outside the shell into the accommodating cavity through the air inlet; and/or
And the air exhaust fan is arranged corresponding to the air exhaust port so as to exhaust the heat-exchanged gas from the air exhaust port.
Based on above-mentioned embodiment, through corresponding the setting into the air fan in the income wind gap, the income air fan can accurately introduce the holding intracavity with external low temperature gas, dispels the heat to circuit board subassembly, through correspond the setting in the air exit and air exhaust the fan, the fan of airing exhaust can accurately discharge the high temperature gas after the heat transfer, sets up into the air fan simultaneously and air exhaust the fan, makes the flow velocity of gas accelerate, has improved holistic radiating efficiency.
In some embodiments, the number of the air inlet fans corresponds to the number of the air inlets, and/or the number of the air outlet fans corresponds to the number of the air outlets.
Based on above-mentioned embodiment, through setting up the fan of intaking of corresponding quantity and the fan of airing exhaust, can improve the velocity of flow and improve intake and/or the volume of airing exhaust of air current to increase radiating airflow, make the radiating effect better.
In some embodiments, the air inlet and the air outlet are arranged opposite to each other relative to the circuit board assembly, and the circuit board assembly is located between the air inlet and the air outlet.
Based on above-mentioned embodiment, through setting up circuit board subassembly and being located between income wind gap and the air exit, the air current directly exchanges heat with circuit board subassembly after entering through income wind gap, and the high temperature gas that passes through at last is discharged from the air exit, and the route of flowing through of air current is short, and directly acts on circuit board subassembly, has improved heat exchange efficiency, makes the radiating rate faster.
In some embodiments, the photosensitive heat dissipation structure further includes: the waterproof breathable piece is arranged on the shell and covers the air inlet and/or the air outlet.
Based on the above embodiment, the waterproof and breathable piece is arranged at the air inlet and/or the air outlet, so that the photosensitive heat dissipation structure has the waterproof and breathable functions, and further, the parts in the accommodating cavity cannot be damaged due to liquid immersion.
In some embodiments, the photosensitive heat dissipation structure further includes:
the protection net, the protection net set up in the casing, and be located waterproof ventilative spare deviates from one side of fan, the protection net covers the income wind gap and/or the air exit.
Based on above-mentioned embodiment, through setting up the protecting net at income wind gap and air exit, can prevent that foreign matter and dust from getting into the holding intracavity, provide good operational environment for circuit board subassembly and photosensitive element, the protecting net is located the one side that waterproof ventilative spare deviates from the fan simultaneously, can prevent that the foreign matter from stabbing the waterproof ventilative spare of damage.
In some of these embodiments, the circuit board assembly comprises:
the first circuit board is electrically connected with the photosensitive element; and
the second circuit board is stacked and arranged at intervals with the first circuit board and is electrically connected with the fan;
the photosensitive element, the first circuit board and the second circuit board are sequentially arranged in the direction of projecting light rays to the photosensitive element.
Based on above-mentioned embodiment, through setting up first circuit board into with photosensitive element electric connection, second circuit board and fan electric connection make photosensitive element and fan can independent work, each other do not influence, simultaneously, first circuit board and second circuit board interval set up, make low temperature gas pass through between first circuit board and the second circuit board, have increased the area of contact of low temperature gas and first circuit board and second circuit board, and the radiating effect is better.
In some embodiments, the surface of the first circuit board, on which the photosensitive element is disposed, includes a mounting region, on which the photosensitive element is mounted, and an edge region, which is disposed around the mounting region; the sensitization heat radiation structure still includes:
and the isolation piece is arranged between the inner wall of the shell and the edge area so as to isolate the space where the photosensitive element is located from the fan.
Based on above-mentioned embodiment, through setting up isolated piece, make photosensitive element and fan keep apart, avoid the air current that the fan produced to drive the inside small dust fall of holding chamber to adhere to on photosensitive element and influence the image quality to make photosensitive element's whole working property keep good.
In some embodiments, the photosensitive heat dissipation structure further includes:
the heat conducting piece is arranged in the accommodating cavity and connected with the shell, and the heat conducting piece is connected with the first circuit board and/or the second circuit board.
Based on above-mentioned embodiment, through setting up the heat-conducting piece, make the heat direct conduction that first circuit board and/or second circuit board produced to the casing, casing and outside air contact heat transfer adopt the heat-conduction mode to further dispel the heat to first circuit board and/or second circuit board on carrying out radiating basis through the fan, have strengthened sensitization heat radiation structure's whole radiating effect.
In a second aspect, an embodiment of the present application provides a camera module, including:
a connector;
a lens barrel in which an optical assembly is disposed; and the photosensitive heat dissipation structure as described above, wherein the lens barrel is disposed in the housing.
Based on the camera module in this application embodiment, make camera module have the formation of image function through setting up optical assembly, photosensitive element and circuit board subassembly, however at the imaging in-process, photosensitive element and circuit board subassembly can produce a large amount of heats, and this embodiment is through seting up into wind gap, air exit on the casing and set up the fan in the casing, and outside low temperature gas is introduced from going into the wind gap to discharge high temperature gas after the heat transfer from the air exit with the holding intracavity forms the air current that can last the heat transfer, realizes the quick heat dissipation to photosensitive element and circuit board subassembly, and then improves the radiating effect, guarantees the stability of photosensitive element and circuit board subassembly during operation, makes camera module be difficult for generating heat.
In a third aspect, an embodiment of the present application provides an electronic device, including: a mounting structure; and the camera module is arranged on the mounting structure.
Based on electronic equipment in this application embodiment, make sensitization heat radiation structure have the formation of image function through setting up optical assembly, photosensitive element and circuit board subassembly, however at the formation of image in-process, photosensitive element and circuit board subassembly can produce a large amount of heats, and this embodiment is through seting up into wind gap, air exit on the casing and set up the fan in the casing, and the fan during operation is from going into the wind gap and introducing outside low temperature gas to discharge high temperature gas after the heat transfer from the air exit, with the holding intracavity forms the air current that can last the heat transfer, realizes the quick heat dissipation to photosensitive element and circuit board subassembly, and then improves the radiating effect, guarantees the stability of photosensitive element and circuit board subassembly during operation, makes electronic equipment be difficult for generating heat.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a cross-sectional view of a camera module according to an embodiment of the present disclosure;
fig. 2 is a cross-sectional view of an embodiment of a photosensitive heat dissipation structure provided in an embodiment of the present application;
fig. 3 is a cross-sectional view of another embodiment of a photosensitive heat dissipation structure according to an embodiment of the present disclosure;
fig. 4 is a cross-sectional view of another embodiment of a photosensitive heat dissipation structure provided in the present application;
fig. 5 is a cross-sectional view of another embodiment of a photosensitive heat dissipation structure according to an embodiment of the present disclosure;
fig. 6 is a schematic view of a fan of a photosensitive heat dissipation structure according to an embodiment of the present disclosure;
fig. 7 is a schematic view of a camera module and an electronic device according to an embodiment of the present disclosure.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The camera module generally images through photosensitive element, and photosensitive element generally is connected with the circuit board, because electronic component such as photosensitive element, circuit board all concentrate the setting in the casing, and in the imaging process, photosensitive element, circuit board produce a large amount of heats, produce the too high problem of temperature in the casing easily when making camera module move.
The embodiment of the application provides a sensitization heat radiation structure, camera module and electronic equipment, through setting up into wind gap and air outlet on the casing, and be provided with the fan in the casing, the fan inhales low temperature gas through going into the wind gap, can dispel the heat to photosensitive element and circuit board subassembly in the casing, and then effectively reduces the temperature in the casing.
In a first aspect, please refer to fig. 2, an embodiment of the present application provides a photosensitive heat dissipation structure 100, and the photosensitive heat dissipation structure 100 may include a housing 110, a circuit board assembly 120, a photosensitive element 130, and at least one fan 140. The circuit board assembly 120 has functions of providing power to the light sensing element 130 and the fan 140, and the light sensing element 130 is used for converting an optical signal into an electrical signal.
Referring to fig. 2, a receiving cavity 111 is formed in the housing 110, at least one air inlet 112 and at least one air outlet 113 may be formed on the housing 110, and the air inlet 112 and the air outlet 113 are both communicated with the receiving cavity 111. The circuit board assembly 120 may be disposed in the receiving cavity 111. The photosensitive element 130 may be disposed in the accommodating cavity 111 and electrically connected to the circuit board assembly 120. The fan 140 is electrically connected to the circuit board assembly 120 and located in the accommodating cavity 111, and the fan 140 is configured to introduce the gas outside the casing 110 into the accommodating cavity 111 through the air inlet 112 and discharge the heat-exchanged gas from the air outlet 113.
In the formation of image process, photosensitive element 130 and circuit board assembly 120 can produce a large amount of heats, this embodiment is through seting up into wind gap 112 on the casing, air exit 113 and set up fan 140 in casing 110, fan 140 during operation, introduce outside low temperature gas from income wind gap 112, and discharge high temperature gas after the heat transfer from air exit 113, with can form the air current that lasts the heat transfer in holding chamber 111, realize the quick heat dissipation to photosensitive element 130 and circuit board assembly 120, and then improve the radiating effect, guarantee the stability of photosensitive element 130 and circuit board assembly 120 during operation.
Referring to fig. 2 to 6, the fan 140 may include at least one air inlet fan 141 or at least one air outlet fan 142, the air inlet fan 141 is disposed corresponding to the air inlet 112, and the air inlet fan 141 may accurately introduce the low-temperature gas into the accommodating cavity 111 to dissipate heat of the circuit board assembly 120; the exhaust fan 142 is disposed corresponding to the exhaust port 113, and the exhaust fan 142 can accurately exhaust the heat-exchanged high-temperature gas. By simultaneously providing the air inlet fan 141 and the air outlet fan 142, the flow rate of the air is increased, and the overall heat dissipation efficiency can be improved. It is understood that the inlet fan 141 and the outlet fan 142 may be directly connected to the inside of the case 110. Referring to fig. 2, in order to make the connection between the air inlet fan 141 and the air outlet fan 142 more stable, the fixing portion 114 may extend from the inside of the casing 110, and the air inlet fan 141 and the air outlet fan 142 may be sandwiched between the fixing portion 114 and the peripheral sidewall of the casing 110. Further, the fan 140 may be a shaft suction cross discharge fan or a shaft suction shaft discharge fan.
In some embodiments, referring to fig. 3 to 4, the number of the air inlet fans 141 may correspond to the number of the air inlets 112, and/or the number of the air outlet fans 142 may correspond to the number of the air outlets 113, so that the flow rate of the air flow and the air inlet amount and/or the air outlet amount can be increased, thereby increasing the amount of the air flow for heat dissipation and improving the heat dissipation effect.
Referring to fig. 2 to 4, in order to improve the heat exchange efficiency, the air inlet 112 and the air outlet 113 may be disposed opposite to the circuit board assembly 120, and the circuit board assembly 120 is located between the air inlet 112 and the air outlet 113. By arranging the circuit board assembly 120 between the air inlet 112 and the air outlet 113, the air flow enters through the air inlet 112 and then directly exchanges heat with the circuit board assembly 120, and finally is discharged through the air outlet 113, the flowing path of the air flow is short, and the air flow directly acts on the circuit board assembly 120, so that the heat dissipation speed is higher. It is understood that the air inlet 112 and the air outlet 113 may be disposed non-oppositely, and the air inlet 112 and the air outlet 113 may also be replaced by an annular grid structure on the housing 110.
Referring to fig. 2, the photosensitive heat dissipation structure 100 may further include a waterproof air-permeable member 150, and the waterproof air-permeable member 150 is disposed on the housing 110 to cover the air inlet 112 and/or the air outlet 113. The waterproof and air-permeable member 150 is disposed at the air inlet 112 and/or the air outlet 113, so that the photosensitive heat dissipation structure 100 has waterproof and air-permeable functions, and further, the components in the accommodating cavity 111 are not damaged by liquid immersion. Further, the waterproof and air-permeable member 150 may be made of polymer material, metal or plastic.
Further, referring to fig. 2, the photosensitive heat dissipation structure 100 may further include a protection net 160, the protection net 160 is disposed on the casing 110 and located on a side of the waterproof air-permeable member 150 away from the fan 140, and the protection net 160 covers the air inlet 112 and/or the air outlet 113. Through setting up protection net 160 at air inlet 112 and air exit 113, can prevent that foreign matter and dust from getting into the holding chamber 111 in to provide good operational environment for circuit board assembly 120 and photosensitive element 130, protection net 160 is located the one side that waterproof ventilative piece 150 deviates from fan 140 simultaneously, can prevent that the waterproof ventilative piece 150 of damage from being stabbed to the foreign matter. The protection net 160 may be made of polymer material, metal or plastic.
Referring to fig. 2 to 4, the circuit board assembly 120 may include a first circuit board 121 and a second circuit board 122, wherein the first circuit board 121 is electrically connected to the photosensitive element 130. The second circuit board 122 and the first circuit board 121 are stacked and spaced apart from each other, and the second circuit board 122 is electrically connected to the fan 140. The light sensing element 130, the first circuit board 121 and the second circuit board 122 are sequentially disposed in a direction in which the light is projected onto the light sensing element 130. Through setting up first circuit board 121 to be with photosensitive element 130 electric connection, second circuit board 122 and fan 140 electric connection make photosensitive element 130 and fan 140 independently work, each other does not influence, and simultaneously, first circuit board 121 and second circuit board 122 interval set up, make low temperature gas can follow and pass through between first circuit board 121 and the second circuit board 122, have increased the area of contact of low temperature gas and first circuit board 121 and second circuit board 122, and the radiating effect is better. The circuit board assembly 120 may be a circuit board such as FR4 board or a rigid-flex board. It is understood that the first circuit board 121 and the second circuit board 122 may be integrated into a same circuit board, that is, the circuit board assembly 120 includes only one circuit board, and of course, the circuit board assembly 120 may include three or more circuit boards.
Further, referring to fig. 3, the surface of the first circuit board 121 on which the photosensitive element 130 is disposed may include a mounting region 1211 and an edge region 1212, and the photosensitive element 130 is mounted on the mounting region 1211. The edge region 1212 is disposed around the mounting region 1211. The photosensitive heat dissipation structure 100 may further include an isolation member 170, the isolation member 170 is disposed between the inner wall of the housing 110 and the edge region 1212, so as to isolate the space where the photosensitive element 130 is located from the fan 140, and thus, the air flow generated by the fan 140 can be prevented from driving the micro dust falling inside the accommodating cavity 111 to adhere to the photosensitive element 130 to affect the image quality, so that the overall working performance of the photosensitive element 130 is kept excellent, and the first circuit board 121 and the housing 110 are connected through the isolation member 170, so that the first circuit board 121 is more stable. The insulating member 170 may be made of foam polymer or dust-proof glue.
Further, referring to fig. 4, the photosensitive heat dissipation structure 100 may further include a heat conducting member 180, the heat conducting member 180 is disposed in the accommodating cavity 111 and connected to the housing 110, and the heat conducting member 180 is connected to the first circuit board 121 and/or the second circuit board 122. Through setting up heat-conducting piece 180, make the heat that first circuit board 121 and/or second circuit board 122 produced directly conduct casing 110, casing 110 and outside air contact heat transfer, on the basis of dispelling the heat through fan 140, adopt the heat-conduction mode to further dispel the heat to first circuit board 121 and/or second circuit board 122, the whole radiating effect of sensitization heat radiation structure 100 has been strengthened, and heat-conducting piece 180 is connected with casing 110, first circuit board 121 and second circuit board 122 simultaneously, can improve sensitization heat radiation structure 100's overall structure intensity.
In some embodiments, referring to fig. 5, the heat conducting member 180 may penetrate through the first circuit board 121 and/or the second circuit board 122, and a contact area between the heat conducting member 180 and the first circuit board 121 and/or the second circuit board 122 is larger, so that heat can be more quickly conducted to the housing 100, the heat dissipation efficiency is improved, and the overall structural strength of the photosensitive heat dissipation structure 100 can be enhanced.
In a second aspect, please refer to fig. 1, an embodiment of the present application provides a camera module 200, where the camera module 200 includes a lens barrel 210, a connector 220, and any of the photosensitive heat dissipation structures 100 described above. The lens barrel 210 is provided with an optical assembly 211 therein, and the lens barrel 210 is disposed in the housing 110 of the photosensitive heat dissipation structure 100. The connector 220 is electrically connected to the circuit board assembly 120. The optical assembly 211, the photosensitive element 130, the first circuit board 121, and the second circuit board 122 are sequentially disposed from an object side to an image side of the camera module 200.
Based on camera module 200 in this application embodiment, through setting up optical assembly 211, photosensitive element 130 and circuit board assembly 120 make camera module 200 have the imaging function, however in the imaging process, photosensitive element 130 and circuit board assembly 120 can produce a large amount of heats, this embodiment is through seting up into wind gap 112 on the casing, air exit 113 and set up fan 140 in the casing, fan 140 during operation, introduce outside low temperature gas from going into wind gap 112, from and discharge high temperature gas after the heat transfer from air exit 113, in order to form the air current that can last the heat transfer in holding chamber 111, realize the quick heat dissipation to photosensitive element 130 and circuit board assembly 120, and then improve the radiating effect, guarantee photosensitive element 130 and circuit board assembly 120 stability during operation, make camera module 200 be difficult for generating heat.
In a third aspect, referring to fig. 7, an embodiment of the present disclosure provides an electronic device 300, where the electronic device 300 includes a mounting structure (not shown) and the camera module 200, and the camera module 200 is disposed on the mounting structure (not shown).
Based on electronic equipment 300 in this application embodiment, through setting up optical assembly 211, photosensitive element 130 and circuit board assembly 120 make camera module 200 have the imaging function, however in the imaging process, photosensitive element 130 and circuit board assembly 120 can produce a large amount of heats, this embodiment is through seting up into wind gap 112 on the casing, air exit 113 and set up fan 140 in the casing, fan 140 during operation, introduce outside low temperature gas from going into wind gap 112, and discharge high temperature gas after the heat transfer from air exit 113, in order to form the air current that can last the heat transfer in holding the chamber 111, realize the quick heat dissipation to photosensitive element 130 and circuit board assembly 120, and then improve the radiating effect, guarantee photosensitive element 130 and circuit board assembly 120 stability of during operation, make electronic equipment 300 be difficult for generating heat.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it is to be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the above terms may be understood by those skilled in the art according to specific situations.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (11)
1. A photosensitive heat dissipation structure, comprising:
the air inlet and the air outlet are communicated with the accommodating cavity;
the circuit board assembly is arranged in the accommodating cavity;
the photosensitive element is arranged in the accommodating cavity and is electrically connected with the circuit board assembly; and
the fan is positioned in the accommodating cavity and used for introducing gas outside the shell into the accommodating cavity through the air inlet and discharging the gas subjected to heat exchange from the air outlet.
2. A photosensitive heat dissipating structure according to claim 1, wherein the blower comprises:
the air inlet fan is arranged corresponding to the air inlet so as to introduce the air outside the shell into the accommodating cavity through the air inlet; and/or
And the air exhaust fan is arranged corresponding to the air exhaust port so as to exhaust the heat-exchanged gas from the air exhaust port.
3. A photosensitive heat dissipating structure according to claim 2, wherein the number of the air inlet fans corresponds to the number of the air inlets, and/or the number of the air outlet fans corresponds to the number of the air outlets.
4. A photosensitive heat dissipating structure according to claim 1, wherein the air inlet and the air outlet are disposed opposite to the circuit board assembly, and the circuit board assembly is disposed between the air inlet and the air outlet.
5. The photosensitive heat dissipation structure of claim 1, further comprising:
the waterproof breathable piece is arranged on the shell and covers the air inlet and/or the air outlet.
6. The photosensitive heat dissipating structure of claim 5, further comprising:
the protection net, the protection net set up in the casing, and be located waterproof ventilative spare deviates from one side of fan, the protection net covers the income wind gap and/or the air exit.
7. A photosensitive heat dissipating structure according to claim 1, wherein the circuit board assembly comprises:
the first circuit board is electrically connected with the photosensitive element; and
the second circuit board is stacked and arranged at intervals with the first circuit board and is electrically connected with the fan;
the photosensitive element, the first circuit board and the second circuit board are sequentially arranged in the direction of projecting light rays to the photosensitive element.
8. The photosensitive heat dissipation structure of claim 7, wherein the surface of the first circuit board on which the photosensitive element is disposed includes a mounting region and an edge region, the photosensitive element is mounted on the mounting region, and the edge region is disposed around the mounting region; the sensitization heat radiation structure still includes:
and the isolation piece is arranged between the inner wall of the shell and the edge area so as to isolate the space where the photosensitive element is located from the fan.
9. The photosensitive heat dissipating structure of claim 7, further comprising:
the heat conducting piece is arranged in the accommodating cavity and connected with the shell, and the heat conducting piece is connected with the first circuit board and/or the second circuit board.
10. The utility model provides a camera module which characterized in that includes:
a connector;
a lens barrel in which an optical assembly is disposed; and
the photosensitive heat dissipating structure according to any one of claims 1 to 9, wherein the barrel is disposed in the housing, and the connector is electrically connected to the circuit board assembly.
11. An electronic device, comprising:
a mounting structure; and
the camera module of claim 10, wherein said camera module is mounted to said mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121079113.7U CN215420434U (en) | 2021-05-19 | 2021-05-19 | Photosensitive heat dissipation structure, camera module and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121079113.7U CN215420434U (en) | 2021-05-19 | 2021-05-19 | Photosensitive heat dissipation structure, camera module and electronic equipment |
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| Publication Number | Publication Date |
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| CN215420434U true CN215420434U (en) | 2022-01-04 |
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| CN202121079113.7U Active CN215420434U (en) | 2021-05-19 | 2021-05-19 | Photosensitive heat dissipation structure, camera module and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118156281A (en) * | 2024-05-10 | 2024-06-07 | 东莞市湃泊科技有限公司 | Camera module chip packaging structure and intelligent heat dissipation method thereof |
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2021
- 2021-05-19 CN CN202121079113.7U patent/CN215420434U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118156281A (en) * | 2024-05-10 | 2024-06-07 | 东莞市湃泊科技有限公司 | Camera module chip packaging structure and intelligent heat dissipation method thereof |
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