CN112152426B

CN112152426B - Frequency converter with intra-cavity environment detection function and working method thereof

Info

Publication number: CN112152426B
Application number: CN202010942280.3A
Authority: CN
Inventors: 余子先; 庞世杰; 秦忠根; 吴兴刚; 董志刚
Original assignee: Huainan Wantai Electric Co ltd
Current assignee: Huainan Wantai Electric Co ltd
Priority date: 2020-09-09
Filing date: 2020-09-09
Publication date: 2023-07-28
Anticipated expiration: 2040-09-09
Also published as: CN112152426A

Abstract

The invention discloses a frequency converter with an intra-cavity environment detection function and a working method thereof, wherein the frequency converter comprises a CPU chip, a first temperature sensor, a first radiator, a first semiconductor patch, an IGBT chip, a second temperature sensor, a second radiator, a second semiconductor patch, a rectifier, a third temperature sensor, a third radiator, a third semiconductor patch, a filter, a fourth temperature sensor, a fourth radiator, a fourth semiconductor patch, an inverter, a fifth temperature sensor, a fifth radiator, a fifth semiconductor patch, a harmful gas sensor, a humidity sensor, a smoke sensor, a wireless transmission chip, a capacitor and a heat dissipation shell, the working state of each chip can be timely found through the real-time monitoring of the temperature sensor, the working temperature of each chip can be maintained stably through the semiconductor patch, and the obtained environmental parameters are uploaded for real-time environment monitoring.

Description

Frequency converter with intra-cavity environment detection function and working method thereof

Technical Field

The invention relates to the technical field of frequency converters, in particular to a frequency converter with an intra-cavity environment detection function and a working method thereof.

Background

The frequency converter mainly comprises electronic devices such as rectification, filtering, inversion and the like, and output is regulated by means of an internal IGBT chip, in practical application, severe environments exceeding the maximum or minimum limiting temperature specified by the frequency converter are frequently encountered, so that means such as an optimized heat dissipation air duct, water cooling heat dissipation, air conditioning heat dissipation and the like are adopted to cool the frequency converter at high temperature, and at low temperature, an auxiliary heat source such as an electric heater is added in a cavity of the frequency converter to heat the frequency converter.

However, different structures and circuit schemes are adopted for high temperature and low temperature respectively, so that the universality of the equipment is poor, the structure is complex, and the cost is high; the electric heater is added to heat the air around the device, so that the heating effect is poor for devices such as IGBT chips and the like which are clung to the radiator; meanwhile, the installation of the electric heating device is also limited by the space of the cavity of the frequency converter and the structure of equipment; in addition, the common frequency converter does not have the functions of electricity leakage detection, environment monitoring and the like, and has poor use safety.

Disclosure of Invention

The invention aims to solve the problems and the shortcomings, and provides a frequency converter with an intra-cavity environment detection function and a working method thereof, wherein the frequency converter is simple in structural design, does not have a complex heat dissipation heating mechanism and a control mechanism, can maintain all parts of the frequency converter within a working temperature range, can be directly hung and installed without punching during installation, and can monitor the frequency converter and the environment in real time so as to adjust all equipment in time.

The aim of the invention can be achieved by the following technical scheme:

a frequency converter with an intracavity environment detection function, which comprises a frequency converter body and a shock absorption box, wherein the frequency converter body comprises a CPU chip, a first temperature sensor, a first radiator, a first semiconductor patch, an IGBT chip, a second temperature sensor, a second radiator, a second semiconductor patch, a rectifier, a third temperature sensor, a third radiator, a third semiconductor patch, a filter, a fourth temperature sensor, a fourth radiator, a fourth semiconductor patch, an inverter, a fifth temperature sensor, a fifth radiator, a fifth semiconductor patch, a harmful gas sensor, a humidity sensor, a smoke sensor, a wireless transmission chip, a capacitor, a heat dissipation shell, a circuit board, an air inlet fan, an exhaust fan, a power supply, a heat insulation board, a dust screen, a frequency converter shell, a leakage detector, a sixth temperature sensor, a display screen, a control button, an input terminal and an output terminal, a first temperature sensor is arranged on one side of the CPU chip, a first semiconductor patch is arranged on the upper surface of the CPU chip, a first radiator is arranged on the upper surface of the first semiconductor patch, a second temperature sensor is arranged on one side of the IGBT chip, a second semiconductor patch is arranged on the upper surface of the IGBT chip, a second radiator is arranged on the upper surface of the second semiconductor patch, a third temperature sensor is arranged on one side of the rectifier, a third semiconductor patch is arranged on the other side of the rectifier, a third radiator is arranged on the other side of the third semiconductor patch, a fourth temperature sensor is arranged on one side of the filter, a fourth semiconductor patch is arranged on the other side of the filter, a fourth radiator is arranged on the other side of the fourth semiconductor patch, a fifth temperature sensor is arranged on one side of the inverter, a fifth semiconductor patch is arranged on the upper surface of the inverter, the upper surface of the fifth semiconductor patch is provided with a fifth radiator, the capacitor is sleeved with a radiating shell, a circuit board is provided with a CPU chip, an IGBT chip, a rectifier, a filter, an inverter, a harmful gas sensor, a humidity sensor, a smoke sensor, a wireless transmission chip and a capacitor, the first temperature sensor, the first semiconductor patch, the IGBT chip, the second temperature sensor, the second semiconductor patch, the rectifier, the third temperature sensor, the third semiconductor patch, the filter, the fourth temperature sensor, the fourth semiconductor patch, the inverter, the fifth temperature sensor, the fifth semiconductor patch, the harmful gas sensor, the humidity sensor, the smoke sensor, the wireless transmission chip and the capacitor are connected with the CPU chip through wires on the circuit board, the circuit board is arranged inside the shell of the frequency converter through screws, the air inlet fan is symmetrically arranged at the inner bottom side of the shell of the frequency converter, the exhaust fan is arranged at the top side of the interior of the frequency converter shell, the air inlet fan and the exhaust fan are connected to the circuit board through wires and are connected with the CPU chip, the dust screen is arranged at the outer side of the air inlet fan, the leakage detector is arranged in the frequency converter shell, the sixth temperature sensor is arranged on the frequency converter shell, the power supply is arranged at one side of the frequency converter shell, the heat insulation board is arranged between the power supply and the frequency converter shell and is connected with the power supply and the frequency converter shell, the display screen is arranged at the other side of the frequency converter shell, the control button is arranged on the frequency converter shell and is arranged at the lower side of the display screen, the input terminal is arranged on the same side of the control button, the output terminal is arranged on the same side of the input terminal, the power supply, the leakage detector, the sixth temperature sensor, the display screen, the control button, the input terminal and the output terminal are connected to the circuit board through wires and are connected with the CPU chip, the shock-absorbing box is internally provided with a frequency converter body.

Preferably, the shock attenuation case includes box, first spring, the heat dissipation grid, the screen panel, the filter, the support, the permanent magnet piece, the sucking disc, the supporting seat, the second spring, support section of thick bamboo and cushion, the box is equipped with the chamber door, box internally mounted has the converter body, a plurality of first springs distribute around the converter body, the one end of first spring links to each other with the converter body, the other end links to each other with the inner wall of box, box top and both sides trompil and install the filter, the heat dissipation grid is installed at the box top and is installed in the filter outside, the screen panel is installed in the box both sides and is installed in the filter outside, the support is L shape and is installed in the box both sides, the permanent magnet piece is installed to the support upper end, the sucking disc is installed in the upper end of support and is lived the permanent magnet piece, the lower extreme at the support is installed to the support, the one end fluting of support section of thick bamboo and cover are in the supporting seat tip, the cushion is installed to the other end of support section of thick bamboo, the second spring is installed in the supporting seat, second spring one end is even in the supporting seat, the other end is even in the support section of thick bamboo.

A working method of a frequency converter with an intra-cavity environment detection function comprises the following specific steps:

step one: setting initial data such as voltage, current, frequency, phase and the like of the output current of the frequency converter body through a control button;

step two: obtaining a first temperature of the CPU chip through a first temperature sensor, obtaining a second temperature of the IGBT chip through a second temperature sensor, obtaining a third temperature of the rectifier through a third temperature sensor, obtaining a fourth temperature of the filter through a fourth temperature sensor, obtaining a fifth temperature of the inverter through a fifth temperature sensor, and then transmitting the temperature data to the CPU chip through a circuit board;

step three: the CPU chip conducts heat flow from the CPU chip, the IGBT chip, the rectifier, the filter and the inverter to the radiators respectively by respectively carrying out forward power on the semiconductor patches when the obtained first to fifth temperatures are respectively higher than the corresponding rated temperatures, and heats the CPU chip, the IGBT chip, the rectifier, the filter and the inverter to maintain the working temperature by respectively carrying out reverse power on the semiconductor patches when the obtained first to fifth temperatures are respectively lower than the corresponding rated temperatures;

step four: the CPU chip judges whether the frequency converter needs to radiate heat or heat, when radiating heat, the heat radiated by each radiator is transmitted to the outside of the frequency converter body through the air inlet fan and the exhaust fan, and when heating, only the exhaust fan is started for ventilation;

step five: the CPU chip analyzes the data of the leakage detector, judges whether the frequency converter body leaks electricity, closes all electronic devices when the leakage occurs, and sends out maintenance requests by using the wireless transmission chip;

step six: the CPU chip analyzes the data of the harmful gas sensor, the humidity sensor, the smoke sensor and the sixth temperature sensor to obtain the air composition, the humidity and the temperature of the environment;

step seven: the CPU chip sends all data outwards through the wireless transmission chip, receives all instructions at the same time, and adjusts the output of the IGBT chip, the rectifier, the filter, the inverter and other devices, so that the output current of the frequency converter body is adjusted.

The invention has the beneficial effects that:

the current flow direction of the semiconductor patch is different, and the heat conduction direction is changed, so that each electronic unit can be conveniently radiated or heated through the semiconductor patch, and the stable working temperature is maintained.

The working state of each chip can be timely found through the real-time monitoring of the temperature sensor to each chip, so that the temperature sensor can be adjusted in a targeted manner, and the damage to the frequency converter and the influence on other equipment caused by the overheating problem of the chip are prevented.

The harmful gas sensor, the humidity sensor and the smoke sensor are used for detecting the air in the environment where the frequency converter is located, and all obtained environmental parameters can be uploaded to the Internet, so that real-time environmental monitoring can be carried out, the safety is ensured, and accidents are avoided.

The wireless transmission chip is used for carrying out data exchange outwards, so that each frequency converter can be managed by network access, real-time monitoring of each frequency converter is realized, each frequency converter can be controlled in a refined mode according to different requirements at any time, adjustment time is shortened, monitoring efficiency is improved, and a large amount of manpower and material resources are saved.

The radiators of the frequency converter are distributed near the central line of the frequency converter, the air duct of the frequency converter is also designed on the central line, and heat flow can be rapidly conducted to the outside by all devices, so that rapid temperature reduction and control are realized.

The frequency converter is small in size and compact in structure, can adapt to different size requirements, can be replaced by each component, can be stably hung outside other equipment, does not need to punch other equipment and the like, and can be conveniently installed and carried due to the fact that the lifting handles are arranged on the upper portion of the frequency converter.

Drawings

The present invention is further described below with reference to the accompanying drawings for the convenience of understanding by those skilled in the art.

FIG. 1 is a front view of a transducer body according to the present invention;

FIG. 2 is a side view of the transducer body of the present invention;

FIG. 3 is a front view of the inverter body of the present invention;

FIG. 4 is a front view of the shock absorbing tank of the present invention;

FIG. 5 is a schematic view of the internal structure of the damper box according to the present invention;

FIG. 6 is a side view of the structure of the damper box of the present invention;

FIG. 7 is a schematic diagram of a heat dissipation structure of a CPU chip according to the present invention;

FIG. 8 is a schematic diagram of heat dissipation of an IGBT chip of the present invention;

FIG. 9 is a schematic diagram illustrating heat dissipation of a rectifier according to the present invention;

FIG. 10 is a schematic diagram of a heat dissipation of a filter according to the present invention;

FIG. 11 is a schematic diagram illustrating heat dissipation of an inverter according to the present invention;

in the figure: 1. a CPU chip; 2. a first temperature sensor; 3. a first heat sink; 4. a first semiconductor patch; 5. an IGBT chip; 6. a second temperature sensor; 7. a second heat sink; 8. a second semiconductor patch; 9. a rectifier; 10. a third temperature sensor; 11. a third heat sink; 12. a third semiconductor patch; 13. a filter; 14. a fourth temperature sensor; 15. a fourth radiator; 16. a fourth semiconductor patch; 17. an inverter; 18. a fifth temperature sensor; 19. a fifth radiator; 20. a fifth semiconductor patch; 21. a harmful gas sensor; 22. a humidity sensor; 23. a smoke sensor; 24. a wireless transmission chip; 25. a capacitor; 26. a heat dissipation housing; 27. a circuit board; 28. an air inlet fan; 29. an exhaust fan; 30. a power supply; 31. a heat insulating plate; 32. a dust screen; 33. a frequency converter housing; 34. a leakage detector; 35. a sixth temperature sensor; 36. a display screen; 37. a control button; 38. an input terminal; 39. an output terminal; 40. a transducer body; 41. a damper box; 42. a case; 43. a first spring; 44. a heat-dissipating grille; 45. a mesh enclosure; 46. a filter plate; 47. a bracket; 48. permanent magnet pieces; 49. a suction cup; 50. a support base; 51. a second spring; 52. a support cylinder; 53. rubber cushion.

Description of the embodiments

The technical solutions of the present invention will be clearly and completely described in connection with the embodiments, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

Referring to fig. 1 to 11, a frequency converter with intra-cavity environment detection function includes a frequency converter body 40 and a damper box 41, the frequency converter body 40 includes a CPU chip 1, a first temperature sensor 2, a first radiator 3, a first semiconductor chip 4, an IGBT chip 5, a second temperature sensor 6, a second radiator 7, a second semiconductor chip 8, a rectifier 9, a third temperature sensor 10, a third radiator 11, a third semiconductor chip 12, a filter 13, a fourth temperature sensor 14, a fourth radiator 15, a fourth semiconductor chip 16, an inverter 17, a fifth temperature sensor 18, a fifth radiator 19, a fifth semiconductor chip 20, a harmful gas sensor 21, a humidity sensor 22, a smoke sensor 23, a wireless transmission chip 24, a capacitor 25, a heat dissipation case 26, a circuit board 27, an intake fan 28, an exhaust fan 29, a power supply 30, 31, a dust-proof net 32, a frequency converter case 33, a leakage detector 34, a sixth temperature sensor 35, a display screen 36, a control button 37, a heat shield 39, and a CPU chip 1 mounted on one side of the CPU chip 1, a CPU chip mounted with the temperature sensor chip 1, the upper surface of the first semiconductor patch 4 is provided with a first radiator 3, one side of the IGBT chip 5 is provided with a second temperature sensor 6, the upper surface of the IGBT chip 5 is provided with a second semiconductor patch 8, the model of the IGBT chip 5 is UCC27511DBVR, the upper surface of the second semiconductor patch 8 is provided with a second radiator 7, one side of the rectifier 9 is provided with a third temperature sensor 10, the other side of the rectifier 9 is provided with a third semiconductor patch 12, the other side of the third semiconductor patch 12 is provided with a third radiator 11, the model of the rectifier 9 is U7710, a fourth temperature sensor 14 is mounted on one side of the filter 13, a fourth semiconductor patch 16 is mounted on the other side of the filter 13, a fourth radiator 15 is mounted on the other side of the fourth semiconductor patch 16, the model of the filter 13 is EMI2121MTTAG, a fifth temperature sensor 18 is mounted on one side of the inverter 17, a fifth semiconductor patch 20 is mounted on the upper surface of the inverter 17, a fifth radiator 19 is mounted on the upper surface of the fifth semiconductor patch 20, the model of the inverter 17 is sg3525, a heat dissipation housing 26 is mounted on the surface of the capacitor 25, a CPU chip 1, an IGBT chip 5, a rectifier 9, the filter 13, the inverter 17, a harmful gas sensor 21, a humidity sensor 22, a smoke sensor 23, a wireless transmission chip 24 and a capacitor 25 are mounted on the circuit board 27, the first temperature sensor 2, the first semiconductor patch 4, the IGBT chip 5, the second temperature sensor 6, the second semiconductor patch 8, the rectifier 9, the third temperature sensor 10, the third semiconductor patch 12, the filter 13, the fourth temperature sensor 14, the fourth semiconductor patch 16, the inverter 17, the fifth temperature sensor 18, the fifth semiconductor patch 20, the harmful gas sensor 21, the humidity sensor 22, the smoke sensor 23, the wireless transmission chip 24, and the capacitor 25 are connected to the CPU chip 1 through wires on the circuit board 27, the harmful gas sensor 21 is of the model MC106, the humidity sensor 22 is of the model HTS2230SMD, the smoke sensor 23 is of the model MQ-2, the circuit board 27 is mounted inside the inverter case 33 by screws, the air intake fan 28 is symmetrically mounted on the inner bottom side of the inverter case 33, the air exhaust fan 29 is mounted on the inner top side of the inverter case 33, the air intake fan 28 and the air exhaust fan 29 are connected to the circuit board 27 through wires and to the CPU chip 1, the dust screen 32 is installed outside the air intake fan 28, the leakage detector 34 is installed inside the inverter housing 33, the sixth temperature sensor 35 is installed on the inverter housing 33, the power supply 30 is installed on one side of the inverter housing 33, the heat shield 31 is installed between and connected to the power supply 30 and the inverter housing 33, the display screen 36 is installed on the other side of the inverter housing 33, the control button 37 is installed on the inverter housing 33 and installed on the lower side of the display screen 36, the input terminal 38 is installed on the inverter housing 33 and installed on the same side as the control button 37, the output terminal 39 is installed on the same side as the input terminal 38, the power supply 30, the leakage detector 34, the sixth temperature sensor 35, the display screen 36, the control button 37, the input terminal 38 and the output terminal 39 are connected to the circuit board 27 by wires and connected to the CPU chip 1, the inverter body 40 is installed in the damper 41, all temperature sensors are of the model GA2K7MCD1, all semiconductor patches are of the model FPH1-12708AC, the CPU chip 1 monitors the temperature of each chip by receiving temperature data of each temperature sensor, the working state of each chip is mastered in real time, one side of each semiconductor patch is a cold end, the other side of each semiconductor patch is a hot end, and the semiconductor chip is controlled to radiate or heat by controlling forward current or reverse current, so that each chip is maintained in a working temperature range, each radiator is matched with an air inlet fan 28 and an exhaust fan 29 to quickly conduct heat flow out of the frequency converter body 40, the heat conduction rate is greatly improved, the working environment of the frequency converter can be monitored at any time by monitoring the air flowing through the frequency converter body 40 in real time through the harmful GAs sensor 21, the humidity sensor 22 and the smoke sensor 23, and safety is ensured.

The shock absorbing box 41 comprises a box body 42, a first spring 43, a heat dissipating grille 44, a net cover 45, a filter plate 46, a bracket 47, permanent magnet sheets 48, suckers 49, a supporting seat 50, a second spring 51, supporting cylinders 52 and rubber pads 53, wherein the box body 42 is provided with a box door, a frequency converter body 40 is arranged in the box body 42, a plurality of first springs 43 are distributed around the frequency converter body 40, one end of each first spring 43 is connected with the frequency converter body 40, the other end of each first spring is connected with the inner wall of the box body 42, the top and two sides of the box body 42 are provided with holes and are provided with the filter plate 46, the heat dissipating grille 44 is arranged at the top of the box body 42 and outside the filter plate 46, the net cover 45 is arranged at two sides of the box body 42 and outside the filter plate 46, the bracket 47 is L-shaped and is arranged at two sides of the box body 42, the permanent magnet sheets 48 are arranged at the upper end of the bracket 47, the suckers 49 are arranged at the upper end of the bracket 47 and wrap the permanent magnet sheets 48, the supporting seat 50 is arranged at the lower end of the bracket 47, one end of the supporting cylinder 52 is slotted and sleeved at the end part of the supporting seat 50, the other end of the supporting cylinder 52 is provided with the rubber pad 53, the second spring 51 is arranged in the supporting seat 50, one end of the second spring 51 is connected in the supporting seat 50, the other end is connected in the supporting cylinder 52, the first spring 43 plays a role in supporting and damping the frequency converter body 40, so that each chip can not be affected by vibration to reduce efficiency in working, the filter plate 46 can effectively filter dust and water vapor in gas circulation, dust and dryness of the environment in a box are maintained, the upper part of the bracket 47 is provided with a handle, the sucker 49 and the permanent magnet piece 48 at the upper end can fixedly hang the frequency converter on the shell of other equipment, the second spring 51, the supporting cylinder 52 and the rubber pad 53 at the lower end play roles in supporting and damping, helping the stable installation of the frequency converter.

A working method of a frequency converter with an intra-cavity environment detection function comprises the following specific steps of;

step one: initial data such as output voltage, output current, output frequency, output phase and the like of the inverter body 40 are set by the control button 37;

step two: obtaining a first temperature of the CPU chip 1 by the first temperature sensor 2, obtaining a second temperature of the IGBT chip 5 by the second temperature sensor 6, obtaining a third temperature of the rectifier 9 by the third temperature sensor 10, obtaining a fourth temperature of the filter 13 by the fourth temperature sensor 14, obtaining a fifth temperature of the inverter 17 by the fifth temperature sensor 18, and then transmitting these temperature data to the CPU chip 1 by the circuit board 27;

step three: the CPU chip 1 conducts heat flow from the CPU chip 1, the IGBT chip 5, the rectifier 9, the filter 13, and the inverter 17 to the respective heat sinks by respectively energizing the respective semiconductor patches forward when the obtained first to fifth temperatures are respectively higher than the respective corresponding rated temperatures, and heats the CPU chip 1, the IGBT chip 5, the rectifier 9, the filter 13, and the inverter 17 to maintain at the operating temperature by respectively energizing the respective semiconductor patches reversely when the obtained first to fifth temperatures are respectively lower than the respective corresponding rated temperatures;

step four: the CPU chip 1 judges whether the frequency converter needs to radiate heat or heat, when radiating heat, the heat radiated by each radiator is transmitted to the outside of the frequency converter body 40 through the air inlet fan 28 and the air outlet fan 29, and when heating, only the air outlet fan 29 is started for ventilation;

step five: the CPU chip 1 analyzes the data of the leakage detector 34, judges whether the frequency converter body 40 leaks electricity, closes all electronic devices when the electricity leakage occurs, and sends out maintenance requests by using the wireless transmission chip 24;

step six: the CPU chip 1 obtains the air composition, humidity and temperature of the environment by analyzing the data of the harmful gas sensor 21, the humidity sensor 22, the smoke sensor 23 and the sixth temperature sensor 35;

step seven: the CPU chip 1 transmits all data to the outside through the wireless transmission chip 24, and receives various instructions to adjust the output of the IGBT chip 5, the rectifier 9, the filter 13, the inverter 17, and other devices, thereby adjusting the output current of the inverter body 40.

When the invention is used, the frequency converter is manually set through the control button 37, the temperature data of the corresponding chip and the frequency converter are obtained through each temperature sensor, each chip is adjusted through the CPU chip 1 and judged whether the chip needs to dissipate heat or heat, each chip is maintained within the working temperature range through the semiconductor patch, ventilation and flow guidance are carried out through the air inlet fan 28 and the air outlet fan 29, the environment where the frequency converter is positioned is subjected to gas analysis and monitoring through the harmful gas sensor 21, the humidity sensor 22 and the smoke sensor 23, all data are transmitted outwards through the wireless transmission chip 24 and instructions are received so that the CPU chip 1 adjusts the frequency converter, the frequency converter is quickly installed on needed equipment through the shock absorption box 41, the frequency converter can work in various severe environments, the wireless transmission chip 24 connects the frequency converter into the Internet, the connection with other equipment is enhanced, the frequency converter can detect the environment and adjust output, the centralized design of the heat flow of the frequency converter can be quickly discharged out of the frequency converter body 40, the shock absorption box 41 is convenient for carrying out on the outer shell of other equipment, the frequency converter is not only subjected to perforation operation on the outer shell of the equipment, the frequency converter is not influenced by the perforating operation, the working efficiency is not influenced by the working environment is stable, and the working efficiency is not influenced by the working environment is also can be processed.

In the description of the present invention, it should be understood that the terms "upper," "lower," "left," "right," and the like indicate an orientation or a positional relationship based on that shown in the drawings, and are merely for convenience of description and for simplifying the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, as well as a specific orientation configuration and operation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

The foregoing describes one embodiment of the present invention in detail, but the description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. All equivalent changes and modifications within the scope of the present invention are intended to be covered by the present invention.

Claims

1. The frequency converter with the intra-cavity environment detection function is characterized by comprising a frequency converter body (40) and a shock absorption box (41), wherein the frequency converter body (40) comprises a circuit board (27), a first temperature sensor (2), a first radiator (3), a first semiconductor patch (4), a second temperature sensor (6), a second radiator (7), a second semiconductor patch (8), a third temperature sensor (10), a third radiator (11), a third semiconductor patch (12), a fourth temperature sensor (14), a fourth radiator (15), a fourth semiconductor patch (16), a fifth temperature sensor (18), a fifth radiator (19), a fifth semiconductor patch (20), a heat dissipation shell (26), an air inlet fan (28), an exhaust fan (29), a power supply (30), a heat insulation board (31), a dust screen (32), a frequency converter shell (33), a leakage detector (34), a sixth temperature sensor (35), a display screen (36), a control button (37), an input terminal (38) and an output terminal (39);

the CPU chip (1), the IGBT chip (5), the rectifier (9), the filter (13), the inverter (17), the harmful gas sensor (21), the humidity sensor (22), the smoke sensor (23), the wireless transmission chip (24) and the capacitor (25) are installed on the circuit board (27), a first temperature sensor (2) is installed on one side of the CPU chip (1), a first semiconductor patch (4) is installed on the upper surface of the CPU chip (1), a first radiator (3) is installed on the upper surface of the first semiconductor patch (4), a second temperature sensor (6) is installed on one side of the IGBT chip (5), a second radiator (7) is installed on the upper surface of the second semiconductor patch (5), a third temperature sensor (10) is installed on one side of the rectifier (9), a third semiconductor (12) is installed on the other side of the rectifier (9), a filter patch (16) is installed on the other side of the third semiconductor patch (12), a filter patch (13) is installed on the other side of the third semiconductor patch (13), a fourth radiator (15) is arranged on the other side of the fourth semiconductor patch (16), a fifth temperature sensor (18) is arranged on one side of the inverter (17), a fifth semiconductor patch (20) is arranged on the upper surface of the inverter (17), a fifth radiator (19) is arranged on the upper surface of the fifth semiconductor patch (20), a radiating shell (26) is sleeved outside the capacitor (25), and the circuit board (27) is arranged inside the frequency converter shell (33) through screws;

the utility model provides a frequency converter, including frequency converter shell (33) and electric leakage detector, air inlet fan (28), air inlet fan (29), air inlet fan (28) are installed at the inside bottom side of frequency converter shell (33), air inlet fan (28) and air outlet fan (29) are installed at the inside top side of frequency converter shell (33), air inlet fan (28) are connected to circuit board (27) through the wire and are connected with CPU chip (1), dust screen (32) are installed in air inlet fan (28) outside, electric leakage detector (34) are installed in frequency converter shell (33), sixth temperature sensor (35) are installed on frequency converter shell (33), power supply (30) are installed in frequency converter shell (33) one side, heat insulating board (31) are installed between and are connected with both frequency converter shell (33), display screen (36) are installed at frequency converter shell (33) opposite side, control button (37) are installed on frequency converter shell (33), are located display screen (36) downside, input terminal (38) are installed on frequency converter shell (33) and are installed on control button (37) and are installed on control terminal (37) and are installed on the same side, output terminal (39), and input terminal (37) are installed on the same side (37) and the same side of frequency converter shell (33), electric leakage detector (37) is installed on the same side The input terminal (38) and the output terminal (39) are connected to the circuit board (27) through wires and are connected with the CPU chip (1), and the frequency converter body (40) is arranged in the shock absorption box (41).

2. The transducer with intra-cavity environment detection function according to claim 1, wherein the shock absorbing box (41) comprises a box body (42), a first spring (43), a heat radiation grille (44), a mesh enclosure (45), a filter plate (46), a bracket (47), permanent magnet sheets (48), a sucker (49), a supporting seat (50), a second spring (51), a supporting cylinder (52) and a rubber pad (53), wherein a box door is arranged on the box body (42), the box body (42) is internally provided with a transducer body (40), a plurality of first springs (43) are distributed around the transducer body (40), one end of each first spring (43) is connected with the transducer body (40), the other end of each first spring is connected with the inner wall of the box body (42), the top and two sides of the box body (42) are provided with holes and are provided with the filter plate (46), the heat radiation grille (44) is arranged on the top of the box body (42) and is arranged on the outer side of the filter plate (46), the 45) is arranged on two sides of the box body (42) and is arranged on the outer side of the filter plate (46), the bracket (47) is arranged on the two sides of the box body (47), the sucking disc (49) is installed in the upper end of support (47) and wraps permanent magnet piece (48), supporting seat (50) are installed in the lower extreme of support (47), the one end of support section of thick bamboo (52) is slotted and overlaps in supporting seat (50) tip, and cushion (53) are installed to the other end of support section of thick bamboo (52), second spring (51) are installed in supporting seat (50), and second spring (51) one end links in supporting seat (50), and the other end links in supporting section of thick bamboo (52).

3. The working method of the frequency converter with the intra-cavity environment detection function, which is characterized by comprising the following specific steps of:

step one: initial data such as output voltage, output current, output frequency, output phase and the like of the frequency converter body (40) are set through the control button (37);

step two: obtaining a first temperature of the CPU chip (1) by a first temperature sensor (2), obtaining a second temperature of the IGBT chip (5) by a second temperature sensor (6), obtaining a third temperature of the rectifier (9) by a third temperature sensor (10), obtaining a fourth temperature of the filter (13) by a fourth temperature sensor (14), obtaining a fifth temperature of the inverter (17) by a fifth temperature sensor (18), and then transmitting these temperature data to the CPU chip (1) by a circuit board (27);

step three: the CPU chip (1) respectively conducts heat flow from the CPU chip (1), the IGBT chip (5), the rectifier (9), the filter (13) and the inverter (17) to the radiators by respectively carrying out forward power on the semiconductor patches when the first to fifth temperatures obtained in the step two are respectively higher than the respective corresponding rated temperatures, and the CPU chip (1) respectively carries out reverse power on the semiconductor patches to heat the CPU chip (1), the IGBT chip (5), the rectifier (9), the filter (13) and the inverter (17) to maintain the working temperature when the first to fifth temperatures obtained in the step two are respectively lower than the respective corresponding rated temperatures;

step four: the CPU chip (1) judges whether the frequency converter needs to radiate heat or heat, when radiating heat, the heat radiated by each radiator is transmitted to the outside of the frequency converter body (40) through the air inlet fan (28) and the exhaust fan (29), and when heating, only the exhaust fan (29) is started for ventilation;

step five: the CPU chip (1) analyzes the data of the leakage detector (34) and judges whether the frequency converter body (40) leaks electricity or not, and when the leakage occurs, the electronic devices are closed and a maintenance request is sent outwards by the wireless transmission chip (24);

step six: the CPU chip (1) obtains the air composition, humidity and temperature of the environment by analyzing the data of the harmful gas sensor (21), the humidity sensor (22), the smoke sensor (23) and the sixth temperature sensor (35);

step seven: the CPU chip (1) sends all data outwards through the wireless transmission chip (24), and receives various instructions to regulate the output of the IGBT chip (5), the rectifier (9), the filter (13), the inverter (17) and other devices, so that the output current of the frequency converter body (40) is regulated.