CN112146788A

CN112146788A - Thermal resistance verification system and method

Info

Publication number: CN112146788A
Application number: CN202011037274.XA
Authority: CN
Inventors: 陈克武; 米保军; 郑建忠; 胡明; 李建东; 张达; 撖伟; 黄晟; 周永椗; 刘长风; 程坤; 许伟; 朱杰; 陈锐; 许嘉欣
Original assignee: SGIS Songshan Co Ltd
Current assignee: SGIS Songshan Co Ltd
Priority date: 2020-09-28
Filing date: 2020-09-28
Publication date: 2020-12-29

Abstract

The embodiment of the application provides a thermal resistance verification system and a method, wherein the system comprises: the transfer mechanism, the first constant temperature tank, the second constant temperature tank and the cleaning tank are arranged in the first constant temperature tank; the transfer mechanism includes: the first lifting platform and the first rotating platform are arranged on the first lifting platform, a first rotating arm is arranged on the first rotating platform, a first placing frame is arranged on the first rotating arm, and the first placing frame is used for installing a thermal resistor; the transfer mechanism is used for inserting the target thermal resistor arranged in the first placing frame into the first constant temperature bath for thermal resistor verification through the first lifting table, the first rotating table and the first rotating arm; the transfer mechanism is also used for transferring the target thermal resistor from the first constant temperature bath to the cleaning bath for cleaning when the target thermal resistor completes the thermal resistor verification process in the first constant temperature bath; and the transfer mechanism is also used for transferring the target thermal resistor from the cleaning tank to the second constant temperature tank for thermal resistor verification when the target thermal resistor cleaning is finished. Therefore, the thermal resistance verification efficiency can be improved.

Description

Thermal resistance verification system and method

Technical Field

The application relates to the technical field of thermal resistance verification, in particular to a thermal resistance verification system and a thermal resistance verification method.

Background

The thermal resistance verification system is a set of equipment for verifying the thermal resistance, and generally comprises a computer, a test instrument, a standard thermal resistance, a scanning switch, a temperature control device, a constant temperature bath and the like. The traditional thermal resistance verification process is verified according to the verification requirements in the industrial platinum and copper thermal resistance.

The calibration points for the thermal resistors included 0 ℃ and 100 ℃ according to the calibration protocol given in JJG229-2010 industrial platinum, copper thermal resistors.

The 0 ℃ temperature field is typically provided by a thermostatic water bath having a temperature of 0 ℃ and the 100 ℃ temperature field is typically provided by a thermostatic oil bath having a temperature of 100 ℃.

In the existing verification process, in order to improve the verification efficiency, automation of the data acquisition process at a single constant temperature bath is generally considered, for example, the verification result is transmitted to a computer for processing by some intelligent test instruments near the constant temperature bath, so as to reduce the manual data processing process.

However, the thermal resistance processing process other than the data processing process still depends on human operation, and therefore, the thermal resistance verification efficiency is low.

Disclosure of Invention

The application aims to provide a thermal resistance verification system and a thermal resistance verification method, which can solve the problem that the existing thermal resistance verification efficiency is low.

In a first aspect, an embodiment of the present invention provides a thermal resistance verification system, including: the transfer mechanism, the first constant temperature tank, the second constant temperature tank and the cleaning tank are arranged in the first constant temperature tank;

the transfer mechanism includes: the device comprises a first lifting table and a first rotating table arranged on the first lifting table, wherein a first rotating arm is arranged on the first rotating table, a first placing frame is arranged on the first rotating arm, and the first placing frame is used for installing a thermal resistor;

the transfer mechanism is used for inserting the target thermal resistor installed in the first placing frame into the first constant temperature bath for thermal resistor verification through the first lifting table, the first rotating table and the first rotating arm;

the transfer mechanism is further used for transferring the target thermal resistor from the first constant temperature bath to the cleaning bath for cleaning when the target thermal resistor completes the thermal resistor verification process in the first constant temperature bath;

and the transfer mechanism is also used for transferring the target thermal resistor from the cleaning tank to the second constant temperature tank for thermal resistor verification when the target thermal resistor is cleaned.

In foretell thermal resistance verification system, can realize the thermal field of target thermal resistance in whole thermal resistance verification process through transfer mechanism and switch, can realize the quick transfer of thermal resistance to can shift the target thermal resistance to the washing tank and wash at the thermal field in-process of switching, be favorable to realizing high-efficient reliable thermal resistance verification, be favorable to promoting thermal resistance verification efficiency.

In an alternative embodiment, the first rotating arm includes a rotating connection disc, a main arm, and an auxiliary arm; the main arm is arranged on the rotary connecting disc; the auxiliary arm is arranged on the main arm; the first placing frame is arranged on the auxiliary arm; the main arm is used for rotating around the rotating connecting disc; the auxiliary arm is used for moving back and forth in the extending direction of the main arm, so that the first placing frame can drive the target thermal resistor to a specified position, and the specified position comprises the upper parts of the first constant temperature groove, the second constant temperature groove and the cleaning groove.

Through above-mentioned implementation, can remove the target thermal resistance to the assigned position on the first rack based on the cooperation of main arm, fly jib, can realize the quick transfer to the target thermal resistance at thermal resistance verification in-process.

In an optional embodiment, a purging air interface and a connecting hole are arranged on the auxiliary arm, and a hollow connecting column and a thermal resistor placing hole are arranged on the first placing frame; the first placing frame is inserted into the connecting hole through the hollow connecting column so as to connect the first placing frame with the auxiliary arm; the thermal resistor placing hole is used for installing the target thermal resistor; the transfer mechanism is used for introducing an external air source into the air passage formed by the purge air interface, the connecting hole, the hollow connecting column and the thermal resistor placing hole so as to purge and clean the target thermal resistor in the thermal resistor placing hole through air flow.

Through the implementation mode, the target thermal resistor can be swept and cleaned, the medium pollution probability is favorably reduced, and the verification reliability is favorably improved.

In an optional embodiment, a telescopic rod and a rotator are arranged on the auxiliary arm; under the rotating action of the rotator, the auxiliary arm can rotate to be parallel or vertical to the main arm; the telescopic rod is used for performing telescopic motion by taking the position of the rotator as a reference position, and the auxiliary arm is used for driving the first placing frame to move through the telescopic motion of the telescopic rod.

Through above-mentioned implementation, the fly jib of installing on the main arm can rotate to can stretch out and draw back, be favorable to realizing the diversified demand of shifting to the target thermal resistance with this, can avoid appearing the collision conflict at thermal resistance transfer in-process through can rotating, flexible fly jib.

In an alternative embodiment, the first constant temperature bath and the second constant temperature bath are constant temperature baths that provide temperature fields with different constant temperature media; the first constant temperature bath and the second constant temperature bath are both provided with verification holes matched with the first placing rack; the target thermal resistor arranged in the first placing frame is used for being inserted into the verification hole to conduct thermal resistor verification; the first constant temperature bath is a constant temperature water bath, and the second constant temperature bath is a constant temperature oil bath; or, the first constant temperature bath is a constant temperature oil bath, and the second constant temperature bath is a constant temperature water bath.

In an alternative embodiment, the transfer mechanism further comprises: the second lifting platform and a second rotating platform arranged on the second lifting platform; a second rotating arm is mounted on the second rotating table, a second placing frame is mounted on the second rotating arm, and the second placing frame is used for mounting a thermal resistor; the transfer mechanism is further used for transferring the target thermal resistor mounted in the second placing frame to the first constant temperature bath, the cleaning bath or the second constant temperature bath through the second lifting table, the second rotating arm and the second placing frame so as to simultaneously realize the temperature field switching and the thermal resistor verification of the multiple thermal resistors.

Through the implementation mode, the temperature field switching and the thermal resistance verification of the multiple thermal resistors can be realized, and the verification efficiency can be improved.

In an optional embodiment, when the first rotating arm and the second rotating arm perform thermal resistance transfer, the first lifting table and the second lifting table have different lifting heights.

Through above-mentioned implementation, be favorable to avoiding appearing the collision conflict in thermal resistance transfer process.

In a second aspect, an embodiment of the present invention provides a thermal resistance verification method applied to the thermal resistance verification system described in the first aspect, where the thermal resistance verification system includes a transfer mechanism, and the method includes:

when a target thermal resistor which is finished in wiring is placed on a first placing frame in the transfer mechanism, controlling a first lifting table in the transfer mechanism to ascend;

when the first lifting platform rises to a set first height, a first rotating platform and a first rotating arm in the transfer mechanism are controlled to move in a matching mode, so that the target thermal resistor is close to the first constant temperature bath through a first placing frame arranged on the first rotating arm;

inserting the target thermal resistor into the first constant temperature bath through the transfer mechanism to perform thermal resistor verification;

when the target thermal resistor is determined to finish the thermal resistor verification process in the first constant temperature bath, the transfer mechanism drives the target thermal resistor to move so as to transfer the target thermal resistor from the first constant temperature bath to a cleaning bath for cleaning;

and when the target thermal resistor is determined to be cleaned, driving the target thermal resistor to move through the transfer mechanism, so that the target thermal resistor is transferred from the cleaning tank to the second constant-temperature tank for thermal resistor verification.

By the method, efficient verification of the target thermal resistor can be achieved, temperature field switching of the target thermal resistor in the whole thermal resistor verification process can be achieved rapidly through the transfer mechanism, rapid transfer of the thermal resistor can be achieved, the target thermal resistor can be transferred to the cleaning tank to be cleaned in the temperature field switching process, efficient and reliable thermal resistor verification is achieved, and thermal resistor verification efficiency is improved.

In an optional embodiment, the implementation process of controlling a first rotating platform and a first rotating arm in the transfer mechanism to cooperatively move so as to approach the target thermal resistor to the first thermostatic bath through a first placing frame mounted on the first rotating arm includes:

controlling the auxiliary arm to rotate to be parallel to the main arm;

the main arm is driven to rotate through the first rotating platform, and the auxiliary arm is controlled to move along the extending direction of the main arm, so that the rotating center of the auxiliary arm moves to the position above the first constant temperature groove;

the auxiliary arm is controlled to rotate, so that the first placing frame arranged on the auxiliary arm moves to the position above the first constant temperature bath, and the target thermal resistor arranged on the first placing frame and the verification hole arranged on the first constant temperature bath are located on the same axis.

Through above-mentioned implementation, can remove the target thermal resistance of first placing shelf location to the position that matches with first constant temperature bath fast, be favorable to realizing the thermal resistance verification process of this thermal resistance in first constant temperature bath department fast.

In an alternative embodiment, the sub-arm includes a telescopic rod, and the inserting the target thermal resistor into the first constant temperature bath through the transfer mechanism for thermal resistor verification includes:

when the target thermal resistor arranged on the first placing frame and the verification hole arranged on the first constant temperature bath are positioned on the same axis, controlling the first lifting table to descend and/or controlling the telescopic rod to move so as to enable the first placing frame to be close to the first constant temperature bath, and inserting the target thermal resistor to a specified depth in the first constant temperature bath;

controlling the temperature of the first constant temperature bath at a set verification temperature through a temperature control device in the thermal resistance verification system;

and after the target thermal resistor is detected to reach thermal balance, controlling the telescopic rod to move so as to enable the target thermal resistor to continuously extend into the first constant temperature bath for a specified distance, and reading to obtain a verification result of the target thermal resistor for thermal resistor verification in the first constant temperature bath when the target thermal resistor reaches thermal balance again.

Through above-mentioned implementation, be favorable to accomplishing the thermal resistance verification process of target thermal resistance on first rack in first constant temperature bath department fast, can promote the detection accuracy.

In an alternative embodiment, the method further comprises:

when a verification result that the target thermal resistor is subjected to thermal resistor verification in the first constant temperature bath is obtained through reading, determining that the target thermal resistor completes a thermal resistor verification process in the first constant temperature bath;

when it is determined that the target thermal resistor completes the thermal resistor verification process in the first constant temperature bath, the transfer mechanism drives the target thermal resistor to move so that the target thermal resistor is transferred from the first constant temperature bath to the cleaning bath for cleaning, including:

controlling the first lifting platform and/or the telescopic rod to move so as to enable the target thermal resistor to be far away from the first constant temperature bath;

controlling the auxiliary arm to rotate to be parallel to the main arm and controlling the main arm to rotate to be above the cleaning groove so that the target thermal resistor is close to the cleaning groove;

controlling the first lifting platform and/or the telescopic rod to move so that the target thermal resistor enters the cleaning tank;

and controlling the cleaning tank to clean the target thermal resistor.

Through above-mentioned implementation, can accomplish the thermal resistance verification process of first constant temperature bath department at the target thermal resistance on first rack, wash this target thermal resistance fast, can reduce the influence of medium pollution to verification process.

In an optional embodiment, a purge gas interface and a connecting hole are arranged on the first rotating arm, a hollow connecting column and a thermal resistor placing hole are arranged on the first placing frame, the first placing frame and the first rotating arm are connected through the hollow connecting column and the connecting hole, and the method further comprises the following steps:

when the target thermal resistor is determined to be cleaned, the target thermal resistor in the thermal resistor placing hole is cleaned in a purging mode through the purging gas interface, the connecting hole, the hollow connecting column and the air passage formed by the thermal resistor placing hole.

Through the implementation mode, the medium pollution probability can be reduced.

In an alternative embodiment, the transfer mechanism further comprises: the method comprises the following steps of installing a second lifting table, a second rotating arm and a second placing frame, wherein the second rotating table is installed on the second lifting table, the second rotating arm is installed on the second rotating table, the second placing frame is installed on the second rotating table, and the method further comprises the following steps:

when the target thermal resistor with the completed wiring is placed on the second placing frame, controlling the second lifting table to ascend;

when the second lifting platform rises to a set second height, the second rotating platform and the second rotating arm are controlled to move in a matching mode, so that the target thermal resistor is transferred to the second constant temperature bath through the second placing frame arranged on the second rotating arm;

carrying out thermal resistance verification on the target thermal resistance arranged in the second placing frame;

when the target thermal resistor in the second placing frame is determined to finish the thermal resistor verification process at the second constant temperature bath, the target thermal resistor installed in the second placing frame is transferred from the second constant temperature bath to the cleaning bath for cleaning through the matching movement of the second lifting table, the second rotating arm and the second placing frame;

when the target thermal resistor in the second placing frame is determined to finish the cleaning process, the target thermal resistor installed in the second placing frame is transferred from the cleaning tank to the first constant-temperature tank for thermal resistor verification through the second lifting table, the second rotating arm and the second placing frame in a matched mode.

Through above-mentioned implementation, be favorable to realizing examining in the time to different thermal resistance through the structure with first swinging boom, second swinging boom relevance, be favorable to promoting examination efficiency.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.

Fig. 1 is a schematic diagram of a thermal resistance verification system according to an embodiment of the present application.

Fig. 2 is a schematic view of a transfer mechanism according to an embodiment of the present disclosure.

FIG. 3 is a schematic diagram of a thermal resistor holder according to an example provided by an embodiment of the present application.

Fig. 4 is a schematic diagram of a first lifting table in an example provided by an embodiment of the present application.

Fig. 5 is a schematic view of a first rotating table according to an example provided in the present application.

Fig. 6 is a schematic diagram of a first rotating arm in an example provided by an embodiment of the present application.

Fig. 7 is a schematic view of a first thermostatic bath in one example provided by an embodiment of the present application.

Fig. 8 is a schematic view of a cleaning tank in one example provided in the embodiments of the present application.

Fig. 9 is a flowchart of a thermal resistance verification method according to an embodiment of the present application.

Fig. 10 is a partial flowchart of a thermal resistance verification method according to an embodiment of the present application.

Reference numerals: 100-a transfer mechanism; 200-a first thermostatic bath; 300-a second thermostatic bath; 400-a cleaning tank; 500-a workbench; a-a first execution device; b-a second execution means; 110 a-a first lift stage; 110 b-a second lifting platform; 120 a-a first rotating table; 120 b-second rotating stage; 130 a-a first rotating arm; 130 b-a second rotating arm; 140-thermal resistor placement frame; 111-a base; 112-a housing; 113-a lifting column; 114-lifting connecting disc; 121-a support; 122-rotating the disc; 131-a rotating connecting disc; 132-a main arm; 133-secondary arm; 201-a trough body; 202-assay wells; 203-temperature control device; 401-a housing; 402-cleaning the container.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

In the existing verification process, if the verification of the thermal resistance to be detected under different temperature fields is to be realized, the verification of the thermal resistance to be detected needs to be switched between two constant temperature baths, namely a constant temperature water bath and a constant temperature oil bath. Before switching, the connecting wire of the thermal resistor needs to be removed, then necessary cleaning is carried out on the thermal resistor, after cleaning is finished, the thermal resistor is taken to the thermostatic bath for next detection, connection is carried out on the thermal resistor again, and then detection is carried out on the thermal resistor after connection is finished. When the operations of temperature field switching, cleaning and wiring after switching are involved, the operation process depends on manual realization, so the processing efficiency is low.

In view of the above, the following embodiments are provided to improve, and by using the thermal resistor verification system and the method provided by the embodiments of the present application, efficient and accurate verification of a thermal resistor can be achieved, temperature field switching can be rapidly achieved, thermal resistor transfer can be rapidly achieved, automation processing can be achieved in the whole transfer switching process, human intervention links are reduced, and repeated wiring and disconnection are not required when verification and transfer of the thermal resistor are performed. Under the condition that the thermal resistance verification system comprises the first rotating arm and the second rotating arm, the simultaneous verification of a plurality of thermal resistors is facilitated.

Referring to fig. 1, fig. 1 is a schematic diagram of a thermal resistance verification system according to an embodiment of the present disclosure.

As shown in fig. 1, the thermal resistance verification system includes: a transfer mechanism 100, a first constant temperature bath 200, a second constant temperature bath 300, and a cleaning bath 400.

The first and second

constant temperature baths

200 and 300 are used to provide constant temperature fields (e.g., temperature fields of 0 degrees celsius and 100 degrees celsius) required for thermal resistance verification.

In the embodiment of the present application, the first constant temperature bath 200 and the second constant temperature bath 300 are constant temperature baths providing temperature fields with different constant temperature media. For example, the first constant temperature bath 200 is a constant temperature water bath and the second constant temperature bath 300 is a constant temperature oil bath, or the first constant temperature bath 200 is a constant temperature oil bath and the second constant temperature bath 300 is a constant temperature water bath.

In the embodiment of the present application, the transfer mechanism 100 may include two sets of actuators, which may be respectively referred to as a first actuator a and a second actuator B. The two sets of actuators have similar structures and the same working principle, and in the following description, the first actuator will be taken as an example for description.

In the embodiment of the present application, all the thermal resistors can be wired and disconnected at the work table 500, the transfer mechanism 100 can transfer the target thermal resistor that is wired through the first execution device or the second execution device, and both the first execution device and the second execution device can separately complete the transfer process of a group of thermal resistors to be detected in the whole thermal resistor verification process. In the process of transferring the thermal resistor by using the transfer mechanism 100, the target thermal resistor does not need to be wired or disconnected at the thermostatic bath or the cleaning bath 400.

When the two sets of execution devices work simultaneously, multiple groups of thermal resistors to be detected can be simultaneously verified, for example, when the first execution device moves one group of thermal resistors to the first constant temperature bath 200 for verification, the second execution device can move the other group of thermal resistors to the second constant temperature bath 300 for verification, and the two sets of execution devices can respectively and independently work to realize double-bath double-control (group control) verification.

As shown in fig. 2, the first actuator of the transfer mechanism 100 may include: a first lifting table 110a, a first rotating table 120a, a first rotating arm 130a and a first placing frame. Similar to the first actuator, the second actuator of the transfer mechanism 100 may include a second lifting stage 110b, a second rotating stage 120b, a second rotating arm 130b, and a second rack.

The first and second holders are thermal resistor holders 140 (as shown in fig. 3), and both can be used for mounting or holding a target thermal resistor.

The first executing device and the second executing device can be used for transferring the target thermal resistor, and temperature field switching is achieved. In the embodiment of the present application, the thermal resistor mounted and placed on the thermal resistor placing frame 140 is a thermal resistor whose wiring has been completed.

The target thermal resistance may be a set of thermal resistances, which may include a standard thermal resistance and a to-be-inspected thermal resistance.

In a specific application, the thermal resistance verification system may further include a measurement system, the measurement system may include a computer, a scan switch, a temperature control device 203, and other devices related to data acquisition and data processing, and the temperature control device 203 is used to regulate and control the temperature of each thermostatic bath. The scanning switch can collect and transmit multi-path data related to the standard thermal resistor and the thermal resistor to be detected in the verification process, and can also transmit the data obtained in the verification process to the computer through a special measuring instrument and a communication interface so that the computer can process and analyze the data. The specific measurement system will not be limited in this application.

The thermal resistance verification system will be described in detail below by taking the first execution device in the transfer mechanism 100 as an example.

As shown in fig. 2, the first rotating table 120a is mounted on the first elevation table 110 a. The first rotating arm 130a is mounted on the first rotating table 120 a. The first rack is mounted on the first rotating arm 130 a.

The transfer mechanism 100 is configured to insert the target thermal resistor mounted in the first rack into the first constant temperature bath 200 through the first lifting table 110a, the first rotating table 120a, and the first rotating arm 130a to perform thermal resistor verification.

The transfer mechanism 100 is also used to: when the target heat resistor completes the heat resistor verification process in the first thermostatic bath 200, the target heat resistor is transferred from the first thermostatic bath 200 to the cleaning bath 400 for cleaning.

The transfer mechanism 100 is also used to: at the end of the target heat-resistance cleaning, the target heat-resistance is transferred from the cleaning bath 400 to the second constant-temperature bath 300 for heat-resistance verification.

Through foretell thermal resistance verification system, can realize the thermal field of target thermal resistance in whole thermal resistance verification process through transfer mechanism 100 and switch, can realize the quick transfer of thermal resistance to can shift the target thermal resistance to washing tank 400 and wash at the thermal field in-process of switching, be favorable to realizing high-efficient reliable thermal resistance verification, be favorable to promoting thermal resistance verification efficiency.

As shown in fig. 4, the first elevating stage 110a may include: a base 111, a housing 112, a lifting column 113, a lifting interface plate 114, and a lifting controller (not shown).

The first elevating platform 110a can be fixed on a designated plane (e.g., the ground) by the base 111. The lifting column 113 can be protected by the housing 112. The elevation height of the first elevation table 110a may be controlled by the elevation controller, that is, the position of the bearing surface of the first elevation table 110a may be changed.

The elevating coupling plate 114 is provided at the top end of the elevating column 113 for mounting the first rotating table 120 a.

The second lifting platform 110b is similar in structure to the first lifting platform 110a, except that: when the heat resistance transfer is performed, the second elevation table 110b may have an elevation height different from that of the first elevation table 110 a.

In one example, the maximum rising position of the first elevating stage 110a and the maximum rising position of the second elevating stage 110b are on different levels, and the lowest bearing surface of the first elevating stage 110a and the lowest bearing surface of the second elevating stage may be on different levels. It will be appreciated that, in addition to the lifting height being limited by the set height of the apparatus itself, the lifting height of the lifting table can be set by a corresponding lifting controller.

As shown in fig. 5, the first rotating stage 120a may include: a rotary disk 122, a rotary controller (not shown), and a support 121. The second turntable 120b has the same structure as the first turntable 120 a.

The first rotating table 120a may be connected to the elevating connecting plate 114 of the first elevating table 110a through a support 121, so that the first rotating table 120a and the first elevating table 110a are connected to each other. The first rotating table 120a may be connected to the first rotating arm 130a by the rotating disc 122. The rotation controller can control the first rotating platform 120a to rotate, so as to drive the first rotating arm 130a on the first rotating platform 120a to rotate around the first rotating platform 120 a.

As shown in fig. 6, the first rotating arm 130a may include: a rotary connection plate 131, a main arm 132, and an auxiliary arm 133. The second rotating arm 130b has the same structure as the first rotating arm 130 a.

The rotary connecting disc 131 of the first rotary arm 130a is mounted on the first rotary table 120 a. The rotary connecting plate 131 is connected to the rotary plate 122 of the first rotary table 120 a.

The main arm 132 is mounted on the rotating connection plate 131. The sub-arm 133 is mounted on the main arm 132. The first rack is mounted on the sub-arm 133.

Wherein the main arm 132 is used for rotating around the rotating connecting disc 131.

The sub-arm 133 is configured to reciprocate in the extending direction of the main arm 132, so that the first holder can bring the target thermal resistor to a predetermined position. The designated position may include the upper sides of the first and second

constant temperature baths

200 and 300 and the cleaning bath 400.

Based on the cooperation between the main arm 132 and the auxiliary arm 133, the target thermal resistor on the thermal resistor placing frame 140 can be moved to a specified position, and the target thermal resistor can be quickly transferred in the thermal resistor verification process.

In the embodiment of the present application, the sub-arm 133 is provided with a telescopic rod and a rotator.

The rotator is located at a position as a rotation center of the sub-arm 133, and the rotator is reciprocally movable along the extending direction of the main arm 132. The rotator may be rotatable.

The secondary arm 133 can be rotated by the rotation of the rotator, for example, the secondary arm 133 can be rotated to be parallel or perpendicular to the primary arm 132, and it is understood that the angle between the secondary arm 133 and the primary arm 132 can be other than 0 degree and 90 degrees.

The telescopic rod is used for performing telescopic motion by taking the position of the rotator as a reference position, and the auxiliary arm 133 is used for driving the thermal resistor placing frame 140 (for example, a first placing frame) to move through the telescopic motion of the telescopic rod.

As one implementation mode, the telescopic rod can extend out of or retract into the rotator, and the position of the target thermal resistor is changed through extension or retraction of the telescopic rod.

As another implementation manner, the telescopic rod can pass through the rotator to move in a direction close to or far away from the thermostatic bath, so as to realize telescopic motion, and therefore, the target thermal resistance is driven to change in position.

Based on the above implementation, the sub-arm 133 installed on the main arm 132 can rotate and stretch out and draw back, thereby being beneficial to realizing the multi-azimuth transferring requirement for the target thermal resistor, and the collision conflict can be avoided in the thermal resistor transferring process through the rotatable and stretchable sub-arm 133.

Alternatively, a controller dedicated to motion control of the sub-arm 133 may be provided for the sub-arm 133, for controlling the motion state of the sub-arm 133 on the main arm 132, and also for controlling the rotation of the sub-arm 133 and the motion of the telescopic rod.

Wherein, the sub-arm 133 may be provided with a purge gas port and a connection hole. Hollow connecting columns and thermal resistor placing holes can be arranged on the first placing frame. The air outlet of the hollow connecting column can be communicated with a thermal resistor placing hole arranged in the first placing frame.

The heat resistor placement hole is used for mounting the target heat resistor. A gap for flowing an air current may exist between the target heat resistor and the heat resistor placing hole.

The first rack may be inserted into the coupling hole on the sub-arm 133 through the hollow coupling post to couple the first rack and the sub-arm 133.

The transfer mechanism 100 is used for introducing an external air source into the air passage formed by the purge air interface, the connecting hole, the hollow connecting column and the thermal resistor placing hole so as to purge and clean the target thermal resistor in the thermal resistor placing hole through air flow.

Based on the implementation mode, the target thermal resistor can be swept and cleaned, the medium pollution probability is favorably reduced, and the verification reliability is favorably improved.

In the present embodiment, the media contamination means mixing different media into the same thermostatic bath.

It can be understood that the positions of the connecting holes and the hollow connecting columns can be exchanged, namely the connecting holes can be arranged on the first placing frame, and the hollow connecting columns can be arranged on the auxiliary arms 133.

In the embodiment of the present application, each of the thermal resistance holders 140 (first holder, second holder) may include: the disk body and set up a plurality of thermal resistance on the disk body and place the hole. The plurality of heat resistance placing holes include a first placing hole and a plurality of second placing holes. The plurality of second placement holes are provided around the first placement hole.

The first placing hole is used for installing a target thermal resistor serving as a standard thermal resistor, and the second placing hole is used for installing a target thermal resistor serving as a thermal resistor to be detected.

Since the rest of the structure and the operation principle of the second actuator B are the same as those of the first actuator a except for the difference in elevation height, the contents of the second actuator B, the second elevation table 110B, the second rotation table 120B, the second rotating arm 130B and the second rack can be referred to the description of the first actuator a.

The second rotating table 120b is mounted on the second elevating table 110b, the second rotating arm 130b is mounted on the second rotating table 120b, and the second rack is mounted on the second rotating arm 130 b.

The above-described transfer mechanism 100 is also used for: through the second lifting table 110b, the second rotating table 120b, the second rotating arm 130b and the second placing frame, the target thermal resistor installed in the second placing frame is transferred to the first constant temperature bath 200, the cleaning bath 400 or the second constant temperature bath 300, so that the thermal field switching and the thermal resistor verification of a plurality of thermal resistors can be realized simultaneously.

The method has two meanings of simultaneously realizing the temperature field switching of a plurality of thermal resistors and the verification of the thermal resistors. One of the meanings is that when the transfer mechanism 100 is used for transferring the thermal resistors, a group (a plurality of) of thermal resistors mounted on the same placing frame can be simultaneously detected and the temperature field can be simultaneously switched. One layer of meaning of the present invention means that the transfer mechanism 100 can perform thermal resistance verification on two groups of target thermal resistors on the two rotating arms simultaneously through the first actuator a associated with the first rotating arm 130a and the second actuator B associated with the second rotating arm 130B, that is, simultaneously implement temperature field switching on multiple thermal resistors at different positions.

Based on the implementation mode, the temperature field switching and the thermal resistance verification of the multiple thermal resistors can be realized, and the verification efficiency can be improved.

As one implementation manner, when the first and second

rotating arms

130a and 130b are used simultaneously to perform the thermal resistance transfer, the first and second elevating

platforms

110a and 110b have different elevating heights. For example, the first and second elevating

stages

110a and 110b may be controlled to be at different elevating heights during the transfer of the target thermal resistance in the first rack from the first thermostatic bath 200 to the second thermostatic bath 300 by the first rotating arm 130a, or during the transfer of the target thermal resistance in the second rack from the second thermostatic bath 300 to the first thermostatic bath 200 by the second rotating arm 130 b.

This is advantageous in order to avoid collision collisions during the transfer of the thermal resistance.

Alternatively, reference may be made to fig. 7 regarding the structure of the first constant temperature bath 200 or the second constant temperature bath 300. The first and second

constant temperature tanks

200 and 300 each include: a tank 201 and a plurality of verification holes 202 corresponding to the thermal resistance placement holes.

The first and second

constant temperature baths

200 and 300 may further include respective temperature control devices 203 and constant temperature media accommodated in the bath body 201. The temperature control devices 203 on the first and second

constant temperature chambers

200 and 300 are connected to a main control apparatus (e.g., a computer) in the thermal resistance verification system.

As shown in fig. 8, the cleaning tank 400 may include: a housing 401 and a cleaning vessel 402 opened in the housing 401. The cleaning vessel 402 may contain a cleaning agent therein. The cleaning tank 400 is connected to a main control device (e.g., a computer or other upper computer device) in the thermal resistance verification system, and can be controlled by the main control device to start an automatic cleaning function, so that the thermal resistance entering the cleaning tank 400 is cleaned by a flowing cleaning agent.

For the thermal resistor cleaned by the cleaning tank 400, the thermal resistor cleaned by the cleaning tank 400 can be cleaned by purging in the aforementioned air flow cleaning manner (based on the aforementioned air passage).

Alternatively, there may be two cleaning tanks 400. Illustratively, two cleaning tanks 400 may be disposed adjacent to the first and second

constant temperature baths

200 and 300, respectively.

In one example, the first constant temperature bath 200 is a constant temperature oil bath providing a temperature field of 100 degrees celsius, the second constant temperature bath 300 is a constant temperature water bath providing a temperature field of 0 degrees celsius, the constant temperature oil bath and the constant temperature water bath are respectively disposed at both sides of the transfer mechanism 100, and the cleaning bath 400 and the work table 500 are respectively disposed at the front and rear of the transfer mechanism 100. The transfer mechanism 100 adopts two sets of parallel execution devices to simultaneously carry out thermal resistance detection on two sets of thermal resistors, and the lifting platforms in the two sets of execution devices work at different lifting heights so as to ensure that the two rotating arms on the two lifting platforms cannot collide with each other in the rotation process. The thermal resistance verification system communicates with the selected master control equipment with each lift station, each rotary table, and each rotary arm in the transfer mechanism 100. The main control device can send control instructions (including instructions related to lifting and lowering and rotation) to each device component in the transfer mechanism 100, so that the corresponding components in the transfer mechanism 100 execute corresponding operations according to the received control instructions, and verification related processes such as temperature field switching, transfer, cleaning and the like of the thermal resistor are realized.

Based on the same inventive concept, the embodiment of the application also provides a thermal resistance verification method which can be applied to the thermal resistance verification system. Before the method is executed, the position calibration (including the position calibration of the transfer mechanism) needs to be carried out on the thermal resistance verification system, so that each rotating arm in the thermal resistance verification system can be matched with the lifting table to accurately extend the thermal resistance on the corresponding thermal resistance placing frame into the selected constant temperature bath.

As shown in fig. 9, the method includes: S61-S65.

S61: when the target thermal resistor with finished wiring is placed on the first placing frame in the transfer mechanism, the first lifting platform in the transfer mechanism is controlled to ascend.

Wherein, before S61, the first placing rack in the transferring mechanism may be moved to the workbench to wait for the thermal resistor to be placed in the first placing rack. The central position of first rack can install the target thermal resistance as standard thermal resistance, and each of placing the hole mountable that sets up around central position on the first rack can be regarded as the target thermal resistance of waiting to examine thermal resistance. After the worker completes the installation and wiring of all the thermal resistors needing to participate in verification on the first placing frame, the thermal resistor verification system can receive a starting verification instruction for the thermal resistors, and starts to execute S61 to control the first lifting platform to ascend.

When the first lifting platform rises, the first rotating arm and the first placing frame arranged on the first rotating arm can be driven to rise.

S62: when the first lifting platform rises to a set first height, the first rotating platform and the first rotating arm in the transfer mechanism are controlled to move in a matched mode, and therefore the target thermal resistor is close to the first constant temperature bath through the first placing frame arranged on the first rotating arm.

When the first lifting platform rises to a set first height, the first rotating platform can be controlled to drive the first rotating arm to rotate, and the main arm and the auxiliary arm on the first rotating arm are controlled to perform matching action, so that the target thermal resistor arranged on the first placing frame is close to the first thermostatic bath by the first placing frame on the auxiliary arm.

S63: and inserting the target thermal resistor into the first constant temperature bath through the transfer mechanism to perform thermal resistor verification.

The first placing frame can be driven to descend by the aid of the first lifting platform in the transfer mechanism and/or the auxiliary arm on the first rotating arm, so that the target thermal resistor installed in the first placing frame is inserted into the first constant temperature bath to be subjected to thermal resistor detection.

S64: when the target thermal resistor is determined to finish the thermal resistor verification process in the first constant temperature bath, the target thermal resistor is driven to move through the transfer mechanism, so that the target thermal resistor is transferred from the first constant temperature bath to the cleaning bath for cleaning.

When a verification result that the target thermal resistor is detected in the temperature field provided by the first constant temperature bath is obtained, the target thermal resistor can be regarded as completing a thermal resistor verification process in the first constant temperature bath (but the target thermal resistor is not verified in the temperature field provided by the second constant temperature bath). When the target thermal resistor is determined to finish the thermal resistor calibration process in the first constant temperature bath, the first placing frame can be driven to move by the first rotating arm, so that the target thermal resistor arranged on the first placing frame is transferred to the cleaning tank from the first constant temperature bath for cleaning.

S65: and when the target thermal resistor is determined to be cleaned, driving the target thermal resistor to move through the transfer mechanism so as to transfer the target thermal resistor from the cleaning tank to the second constant-temperature tank for thermal resistor verification.

When the target thermal resistor is determined to be cleaned, the first placing frame is driven to move through the first rotating arm, so that the target thermal resistor arranged on the first placing frame is transferred to the second constant-temperature tank from the cleaning tank to be subjected to thermal resistor detection.

Based on the method of above-mentioned S61-S65, can realize the high-efficient examination to the target thermal resistance, can realize fast the warm field switching of target thermal resistance in whole thermal resistance examination process through transfer mechanism, can realize the quick transfer of thermal resistance to can shift the target thermal resistance to the washing tank and wash at the warm field switching in-process, be favorable to realizing the high-efficient reliable thermal resistance examination, be favorable to promoting thermal resistance examination efficiency.

As an implementation of S62, the first rotating arm includes a main arm and a sub arm, and S62 may include sub steps S621 to S623.

S621: the auxiliary arm is controlled to rotate to be parallel to the main arm.

S622: the main arm is driven to rotate through the first rotating platform, and the auxiliary arm is controlled to move along the extending direction of the main arm, so that the rotating center of the auxiliary arm moves to the position above the first constant temperature groove.

Wherein, when first elevating platform rises to the first height of settlement, control the fly jib rotate to being parallel with the main arm (the extending direction of whole first swinging boom can be the horizontal direction), because the thermal resistance is longer usually, the altitude difference of each staging is not big (the altitude difference is not big and is to avoid consuming more transfer time because of the altitude difference is too big in the thermal resistance transfer process), rotate to controlling the main arm with the main arm under the parallel condition of main arm at the fly jib, be favorable to avoiding the main arm to rotate in-process and bump, for example can avoid the fly jib on the first swinging boom and the fly jib on the second swinging boom to bump at the operation in-process.

The rotation angle of the first rotating table/main arm and the moving distance of the auxiliary arm on the main arm can be determined according to the actual position of the thermostatic slot. For example, when a coordinate system is established for the transfer mechanism, each of the thermostatic bath, the cleaning bath, and the table in advance, the transfer mechanism can be controlled to move according to a set execution logic according to the predetermined positions of each of the thermostatic bath, the cleaning bath, and the table in the coordinate system, and thus the target thermal resistance can be efficiently verified in a set verification process sequence.

S623: the auxiliary arm is controlled to rotate, so that the first placing frame arranged on the auxiliary arm is moved to the position above the first constant temperature groove, and the target thermal resistor arranged on the first placing frame and the verification hole arranged on the first constant temperature groove are located on the same axis.

With the rotator of the sub-arm as the center of rotation, when the rotator moves above the first thermostatic bath, the sub-arm can be controlled to rotate so that the sub-arm is rotated to be aligned with the first thermostatic bath. The alignment of the secondary arm with the first thermostatic bath may be: the extension direction of the telescopic rod on the auxiliary arm at this moment points to the verification hole arranged on the first constant temperature bath. Under the condition, the target thermal resistor arranged on the first placing frame can be driven to gradually approach the verification hole on the first constant temperature bath through the up-and-down movement of the telescopic rod and/or the up-and-down movement of the first lifting platform.

Based on the implementation mode of S621-S623, the target thermal resistor arranged on the first placing frame can be rapidly moved to the position matched with the first constant temperature bath, and the thermal resistor verification process of the thermal resistor at the first constant temperature bath can be rapidly realized.

Based on the above S62 (or S621 to S623), the above S63 may include: S631-S633.

S631: when a target thermal resistor arranged on the first placing frame and a verification hole arranged on the first constant temperature groove are located on the same axis, the first lifting platform is controlled to descend and/or the telescopic rod on the auxiliary arm is controlled to move, so that the first placing frame is close to the first constant temperature groove, and the target thermal resistor is inserted into the specified depth of the first constant temperature groove.

Wherein, the elevating movement through the elevating platform can carry out by a relatively large margin movement control to the thermal resistance in the vertical direction, can finely tune the thermal resistance in the vertical direction through the removal of telescopic link, promotes the control accuracy.

S632: and controlling the temperature of the first constant temperature bath at the set verification temperature through a temperature control device in the thermal resistance verification system.

Therefore, the first constant temperature bath provides a constant temperature field for the verification process of the target thermal resistor.

S633: after detecting that the target thermal resistance on the first placing frame reaches thermal balance, controlling the telescopic rod to move so as to enable the target thermal resistance to continuously extend into the first constant temperature bath for a specified distance, and reading a verification result of thermal resistance verification of the target thermal resistance in the first constant temperature bath when the target thermal resistance reaches thermal balance again.

The values of the specified depth, the values of the verification temperature and the specified distance are determined according to the thermal resistance verification requirements and the verification specifications. In one example, the target thermal resistor is firstly extended into the first thermostatic bath by a transfer mechanism to the depth of half of the medium, then the first thermostatic bath is controlled at a specified verification temperature by a temperature control device, after the thermal equilibrium is detected to be reached (the thermal equilibrium can be represented as the temperature change within 10 minutes not exceeding 0.02 ℃), the telescopic rod on the auxiliary arm is controlled to continuously insert the target thermal resistor into the first thermostatic bath for 1 cm, and when the thermal equilibrium is detected to be reached again, the verification result is read. The embodiment of the application does not limit the specific data acquisition, reading and analysis processing processes.

Through foretell implementation mode, be favorable to accomplishing the thermal resistance verification process of target thermal resistance on first rack in first constant temperature bath department fast, and can promote the detection accuracy.

And when the verification result that the target thermal resistor is subjected to thermal resistor verification in the first constant temperature bath is obtained through reading, determining that the target thermal resistor completes the thermal resistor verification process in the first constant temperature bath. The S64 may include: S641-S644.

S641: and controlling the first lifting platform and/or the telescopic rod to move so as to enable the target thermal resistor to be far away from the first constant temperature bath.

S642: the auxiliary arm is controlled to rotate to be parallel to the main arm, and the main arm is controlled to rotate to be above the cleaning groove, so that the target thermal resistor is close to the cleaning groove.

S643: and controlling the first lifting platform and/or the telescopic rod to move so that the target thermal resistor enters the cleaning tank.

S644: and controlling the cleaning tank to clean the target thermal resistor.

Therefore, when the target thermal resistor on the first placing frame is used for completing the thermal resistor verification process at the first constant temperature tank, the target thermal resistor can be rapidly cleaned, and the influence of medium pollution on the verification process can be reduced.

Optionally, when the first rotating arm is provided with the purge gas interface and the connecting hole, and the first rack is provided with the hollow connecting column and the thermal resistor placing hole, the method may further include S645: when the target thermal resistor is determined to be cleaned, the target thermal resistor in the thermal resistor placing hole is cleaned in a purging mode through the purging air interface, the connecting hole, the hollow connecting column and the air channel formed by the thermal resistor placing hole. Thereby reducing the probability of media contamination.

When it is determined that the target heat resistance washing is finished, or when S645 is finished, S65 may be performed. Since the thermal resistance verification process of the target thermal resistance at the second constant temperature bath is the same in principle as the thermal resistance verification process at the first constant temperature bath, reference may be made to the contents related to S63 for details of S65, which will not be described in detail below.

The aforementioned methods of S61-S65 can be regarded as methods of performing thermal resistance verification on a group of thermal resistors under the temperature fields provided by two constant temperature chambers by the first actuator in the transfer mechanism.

Based on the principle related to the first executing device and the second executing structure in the method and the structure, the transferring mechanism further comprises: in the case of the second elevation stage, the second rotation stage, the second rotating arm, and the second placing frame, as shown in fig. 10, the method may further include S66-S70.

The methods of S66-S70 and S61-S65 can be implemented based on different execution devices, and thus can be executed independently in parallel, for example, the methods of S66-S70 and S61-S65 can be executed simultaneously, for example, two lifting platforms can be controlled to lift and lower simultaneously, two rotating arms can be controlled to rotate simultaneously, and target thermal resistors corresponding to the two rotating arms can be inserted into two thermostatic baths respectively to be verified simultaneously.

S66: and when the target thermal resistor with the completed wiring is placed on the second placing frame, the second lifting platform is controlled to ascend.

S67: when the second lifting platform rises to a set second height, the second rotating platform and the second rotating arm are controlled to move in a matched mode, and the target thermal resistor is transferred to the second constant temperature bath through a second placing frame installed on the second rotating arm.

S67: and carrying out thermal resistance verification on the target thermal resistance arranged in the second placing frame.

S69: when confirming the hot resistance verification process of target hot resistance completion in the second rack in the second constant temperature bath, carry out the cooperation through second elevating platform, second revolving stage, second swinging boom and second rack and remove to shift the target hot resistance of installation in the second rack to washing tank department from the second constant temperature bath and wash.

S70: when confirming the target thermal resistance in the second rack and finishing the cleaning process, carry out the cooperation through second elevating platform, second revolving stage, second swinging boom and second rack and remove to shift the target thermal resistance of installation in the second rack from the washing tank to first constant temperature bath department and carry out the thermal resistance examination.

The method of S66-S70 can be regarded as a method of performing thermal resistance verification of another set of thermal resistors under the temperature fields provided by the two constant temperature chambers by the second actuator in the transfer mechanism. Since the second lifting table, the second rotating arm and the second placing frame in the transferring mechanism are implemented in the same principle as the first lifting table, the first rotating arm and the first placing frame in the transferring mechanism, reference may be made to the foregoing description of S61-S65 for implementation details of S66-S70, for example, in the method of S66-S70, reference may be made to the method of S61-S65 for the cooperating movement process between the second lifting table, the second rotating arm and the second placing frame.

The method based on S66-S70 and the method based on S61-S65 are beneficial to simultaneous verification of different thermal resistances through structures associated with the first rotating arm and the second rotating arm, and beneficial to improvement of verification efficiency.

In one example, after a target thermal resistor completes a verification link in a thermostatic bath, the lifting platform is controlled to ascend to lift the target thermal resistor, the auxiliary arm is controlled to rotate to the horizontal direction, the main arm is controlled to rotate to the position of the cleaning bath, then the lifting platform is controlled to descend to send the target thermal resistor into the cleaning bath, the target thermal resistor entering the cleaning bath is soaked and cleaned or washed in the cleaning bath, after cleaning is finished, the lifting platform is controlled to ascend to lift the target thermal resistor again, the auxiliary arm is controlled to sweep and clean the target thermal resistor on the thermal resistor placing frame, and after dirt on the target thermal resistor is swept and cleaned (no matter which thermostatic bath is firstly performed, as long as media of the thermostatic baths are different, in order to avoid media pollution, the target thermal resistor needs to be cleaned and swept and cleaned), the main arm is controlled to rotate to the other thermostatic bath to complete a verification process of the target thermal resistor at another temperature point according to the same processing logic sequence.

After the same thermal resistor is verified and completed at two specified temperature points (0 ℃ and 100 ℃), the target thermal resistor which is verified and completed can be transferred to the workbench through the transfer mechanism to be disconnected, and the target thermal resistor on the thermal resistor placing frame is taken down.

In order to verify and distinguish all the thermal resistors, the thermal resistors to be tested can be coded before all the thermal resistors to be tested are verified, and an upper computer (main control equipment) in the thermal resistor verification system can acquire verification data of all the thermal resistors through a multi-path data acquisition unit and automatically distinguish and judge verification results.

In the embodiments provided in the present application, it should be understood that the above described embodiments are merely illustrative, and for example, the division of the structure, the module and the device is only one division of the logic function, and there may be other division ways in the actual implementation, and for example, a plurality of units or components may be combined or may be integrated into another system. The skilled person can select some or all of them according to the actual needs to achieve the objectives of the solution of the present embodiment.

It should be noted that the functions of the above method, if implemented in the form of software functional modules and sold or used as independent products, can be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the present application, or portions thereof, which substantially or substantially contribute to the prior art, may be embodied in the form of a software product stored in a storage medium and including instructions for causing a computer device to perform all or part of the steps of the methods of the embodiments of the present application.

In this document, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.

The above embodiments are merely examples of the present application and are not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A thermal resistance verification system, comprising: the transfer mechanism, the first constant temperature tank, the second constant temperature tank and the cleaning tank are arranged in the first constant temperature tank;

2. The thermal resistance verification system according to claim 1, wherein the first rotating arm comprises a rotating connection disc, a primary arm, and a secondary arm;

the main arm is arranged on the rotary connecting disc;

the auxiliary arm is arranged on the main arm;

the first placing frame is arranged on the auxiliary arm;

the main arm is used for rotating around the rotating connecting disc;

the auxiliary arm is used for moving back and forth in the extending direction of the main arm, so that the first placing frame can drive the target thermal resistor to a specified position, and the specified position comprises the upper parts of the first constant temperature groove, the second constant temperature groove and the cleaning groove.

3. The thermal resistance verification system according to claim 2, wherein a purge gas interface and a connecting hole are arranged on the auxiliary arm, and a hollow connecting column and a thermal resistance placing hole are arranged on the first placing frame;

the first placing frame is inserted into the connecting hole through the hollow connecting column so as to connect the first placing frame with the auxiliary arm;

the thermal resistor placing hole is used for installing the target thermal resistor;

the transfer mechanism is used for introducing an external air source into the air passage formed by the purge air interface, the connecting hole, the hollow connecting column and the thermal resistor placing hole so as to purge and clean the target thermal resistor in the thermal resistor placing hole through air flow.

4. The thermal resistance verification system according to claim 2, wherein the auxiliary arm is provided with a telescopic rod and a rotator;

under the rotating action of the rotator, the auxiliary arm can rotate to be parallel or vertical to the main arm;

the telescopic rod is used for performing telescopic motion by taking the position of the rotator as a reference position, and the auxiliary arm is used for driving the first placing frame to move through the telescopic motion of the telescopic rod.

5. The thermal resistance verification system according to claim 1, wherein the first constant temperature bath and the second constant temperature bath are constant temperature baths that provide temperature fields with different constant temperature media;

the first constant temperature bath and the second constant temperature bath are both provided with verification holes matched with the first placing rack;

the target thermal resistor arranged in the first placing frame is used for being inserted into the verification hole to conduct thermal resistor verification;

the first constant temperature bath is a constant temperature water bath, and the second constant temperature bath is a constant temperature oil bath;

or, the first constant temperature bath is a constant temperature oil bath, and the second constant temperature bath is a constant temperature water bath.

6. A thermal resistance verification system according to any one of claims 1 to 5,

the transfer mechanism further comprises: the second lifting platform and a second rotating platform arranged on the second lifting platform;

a second rotating arm is mounted on the second rotating table, a second placing frame is mounted on the second rotating arm, and the second placing frame is used for mounting a thermal resistor;

the transfer mechanism is further used for transferring the target thermal resistor mounted in the second placing frame to the first constant temperature bath, the cleaning bath or the second constant temperature bath through the second lifting table, the second rotating arm and the second placing frame so as to simultaneously realize the temperature field switching and the thermal resistor verification of the multiple thermal resistors.

7. A thermal resistance verification system according to claim 6,

when the first rotating arm and the second rotating arm perform thermal resistance transfer, the lifting heights of the first lifting platform and the second lifting platform are different.

8. A method of thermal resistance verification, applied to a thermal resistance verification system as claimed in any one of claims 1 to 7, the thermal resistance verification system comprising a transfer mechanism, the method comprising:

9. The method according to claim 8, wherein the first rotating arm comprises a primary arm and a secondary arm, and the implementation process of controlling the first rotating table and the first rotating arm in the transferring mechanism to cooperatively move so as to approach the target thermal resistor to the first thermostatic bath through a first placing frame mounted on the first rotating arm comprises the following steps:

controlling the auxiliary arm to rotate to be parallel to the main arm;

10. The method of claim 9, wherein the secondary arm comprises a telescoping rod, and the inserting the target thermal resistor into the first thermostatic bath via the transfer mechanism for thermal resistance verification comprises:

11. The method of claim 10, further comprising:

and controlling the cleaning tank to clean the target thermal resistor.

12. The method according to claim 8, wherein a purge gas port and a connecting hole are arranged on the first rotating arm, a hollow connecting column and a thermal resistor placing hole are arranged on the first placing frame, the first placing frame and the first rotating arm are connected through the hollow connecting column and the connecting hole, and the method further comprises:

13. The method of claim 8, wherein the transfer mechanism further comprises: the method comprises the following steps of installing a second lifting table, a second rotating arm and a second placing frame, wherein the second rotating table is installed on the second lifting table, the second rotating arm is installed on the second rotating table, the second placing frame is installed on the second rotating table, and the method further comprises the following steps: