CN112146788A - Thermal resistance verification system and method - Google Patents

Abstract

The embodiment of the application provides a thermal resistance verification system and a method, wherein the system comprises: the transfer mechanism, the first constant temperature tank, the second constant temperature tank and the cleaning tank are arranged in the first constant temperature tank; the transfer mechanism includes: the first lifting platform and the first rotating platform are arranged on the first lifting platform, a first rotating arm is arranged on the first rotating platform, a first placing frame is arranged on the first rotating arm, and the first placing frame is used for installing a thermal resistor; the transfer mechanism is used for inserting the target thermal resistor arranged in the first placing frame into the first constant temperature bath for thermal resistor verification through the first lifting table, the first rotating table and the first rotating arm; the transfer mechanism is also used for transferring the target thermal resistor from the first constant temperature bath to the cleaning bath for cleaning when the target thermal resistor completes the thermal resistor verification process in the first constant temperature bath; and the transfer mechanism is also used for transferring the target thermal resistor from the cleaning tank to the second constant temperature tank for thermal resistor verification when the target thermal resistor cleaning is finished. Therefore, the thermal resistance verification efficiency can be improved.

Description

Thermal resistance verification system and method

technical field

The present application relates to the technical field of thermal resistance verification, and in particular, to a thermal resistance verification system and method.

Background technique

Thermal resistance verification system is a set of equipment used to verify thermal resistance, usually including computer, test instrument, standard thermal resistance, scanning switch, temperature control device, constant temperature bath, etc. The traditional thermal resistance verification process is verified according to the verification requirements in "Industrial Platinum and Copper Thermal Resistance".

According to the verification procedures given in "JJG229-2010 Industrial Platinum and Copper Thermal Resistance", the verification points of thermal resistance include 0°C and 100°C.

The temperature field of 0°C is generally provided by a constant temperature water tank with 0°C, and the temperature field of 100°C is generally provided by a constant temperature oil tank with 100°C.

In the existing verification process, in order to improve the verification efficiency, it is usually considered to realize the automation of the data acquisition process at a single constant temperature tank. For example, some intelligent test instruments near the constant temperature tank transmit the verification results to the computer for processing, thereby reducing human effort. data processing process.

However, the thermal resistance processing process other than the data processing process still relies on human operation, so the thermal resistance verification efficiency is low.

SUMMARY OF THE INVENTION

The purpose of the present application is to provide a thermal resistance verification system and method, which can improve the existing problem of low thermal resistance verification efficiency.

In a first aspect, an embodiment of the present invention provides a thermal resistance verification system, including: a transfer mechanism, a first constant temperature tank, a second constant temperature tank, and a cleaning tank;

The transfer mechanism includes: a first lift table and a first rotary table mounted on the first lift table, a first rotary arm is mounted on the first rotary table, and a first rotary arm is mounted on the first rotary arm. a placement rack, the first placement rack is used to install the thermal resistance;

The transfer mechanism is used for inserting the target thermal resistance installed in the first placing rack into the first constant temperature bath through the first lifting table, the first rotating table and the first rotating arm Carry out thermal resistance verification;

The transfer mechanism is also used to transfer the target thermal resistance from the first constant temperature tank to the cleaning tank when the target thermal resistance completes the thermal resistance verification process in the first constant temperature tank. cleaning;

The transfer mechanism is further configured to transfer the target thermal resistance from the cleaning tank to the second constant temperature tank for thermal resistance verification when the target thermal resistance is cleaned.

In the above thermal resistance verification system, the temperature field switching of the target thermal resistance in the entire thermal resistance verification process can be realized through the transfer mechanism, the rapid transfer of the thermal resistance can be realized, and the target thermal resistance can be transferred during the temperature field switching process. Cleaning in the cleaning tank is conducive to the realization of efficient and reliable thermal resistance verification, and is conducive to improving the thermal resistance verification efficiency.

In an optional embodiment, the first rotating arm includes a rotating connecting plate, a main arm and a sub-arm; the main arm is mounted on the rotating connecting plate; the sub-arm is mounted on the main arm; The first placement rack is mounted on the auxiliary arm; the main arm is used for rotating around the rotating connecting plate; the auxiliary arm is used for reciprocating movement in the extension direction of the main arm to The first placing rack can drive the target thermal resistance to a designated position, and the designated position includes the upper part of the first constant temperature bath, the second constant temperature bath and the cleaning bath.

Through the above implementation manner, based on the cooperation of the main arm and the auxiliary arm, the target thermal resistance on the first placement frame can be moved to a designated position, and the rapid transfer of the target thermal resistance can be realized during the thermal resistance verification process.

In an optional embodiment, the jib is provided with a purge gas interface and a connection hole, and the first placement rack is provided with a hollow connection column and a thermal resistance placement hole; the first placement rack passes through the The hollow connection column is inserted into the connection hole to connect the first placement frame and the auxiliary arm; the thermal resistance placement hole is used for installing the target thermal resistance; the transfer mechanism is used for the external air source Introduce the air channel formed by the purge gas interface, the connection hole, the hollow connection column and the thermal resistance placement hole, so as to purge the target thermal resistance in the thermal resistance placement hole by air flow clean.

Through the above implementation manner, the target thermal resistance can be purged and cleaned, which is beneficial to reduce the probability of medium contamination and to improve the reliability of verification.

In an optional embodiment, a telescopic rod and a rotator are arranged on the auxiliary arm; under the rotation of the rotator, the auxiliary arm can be rotated to be parallel or perpendicular to the main arm; The rod is used to perform telescopic motion with the position of the rotator as a reference position, and the auxiliary arm is used to drive the first placement rack to move through the telescopic motion of the telescopic rod.

Through the above-mentioned implementation manner, the jib mounted on the main arm can be rotated and can be extended and retracted, which is conducive to realizing the multi-directional transfer requirements for the target thermal resistance. Collision conflict occurs.

In an optional embodiment, the first constant temperature bath and the second constant temperature bath are constant temperature baths that provide a temperature field with different constant temperature media; both the first constant temperature bath and the second constant temperature bath are provided with There is a verification hole matched with the first placement rack; the target thermal resistance installed in the first placement rack is used to insert the verification hole for thermal resistance verification; the first constant temperature tank is a constant temperature water tank, so The second constant temperature tank is a constant temperature oil tank; or, the first constant temperature tank is a constant temperature oil tank, and the second constant temperature tank is a constant temperature water tank.

In an optional embodiment, the transfer mechanism further includes: a second lifting platform and a second rotating platform mounted on the second lifting platform; a second rotating arm is mounted on the second rotating platform, so A second placement rack is installed on the second rotating arm, and the second placement rack is used for installing thermal resistance; the transfer mechanism is also used to pass the second lifting platform, the second rotating platform, the The second rotating arm and the second placing rack transfer the target thermal resistance installed in the second placing rack to the first constant temperature bath, the cleaning bath or the second constant temperature bath, so as to simultaneously realize Temperature field switching and thermal resistance verification of multiple thermal resistances.

Through the above implementation manner, the temperature field switching of multiple thermal resistances and the thermal resistance verification can be realized, and the verification efficiency can be improved.

In an optional embodiment, when the first rotating arm and the second rotating arm perform thermal resistance transfer, the lifting heights of the first lifting platform and the second lifting platform are different.

Through the above implementation manner, it is beneficial to avoid collision and conflict during the thermal resistance transfer process.

In a second aspect, an embodiment of the present invention provides a thermal resistance verification method, which is applied to the thermal resistance verification system described in the first aspect. The thermal resistance verification system includes a transfer mechanism, and the method includes:

When the target thermal resistance that has been wired is placed on the first placement rack in the transfer mechanism, control the first lift table in the transfer mechanism to rise;

When the first lifting platform rises to a set first height, the first rotating platform and the first rotating arm in the transfer mechanism are controlled to move in coordination, so as to pass the first rotating arm mounted on the first rotating arm. The first placing rack places the target thermal resistance close to the first thermostatic bath;

Insert the target thermal resistance into the first thermostatic bath through the transfer mechanism to perform thermal resistance verification;

When it is determined that the target thermal resistance has completed the thermal resistance verification process in the first constant temperature bath, the transfer mechanism drives the target thermal resistance to move, so that the target thermal resistance is moved from the first constant temperature bath. Transfer to the cleaning tank for cleaning;

When it is determined that the cleaning of the target thermal resistance is completed, the transfer mechanism drives the target thermal resistance to move, so that the target thermal resistance is transferred from the cleaning tank to the second constant temperature tank for thermal resistance verification.

Through the above method, the high-efficiency verification of the target thermal resistance can be achieved, and the temperature field switching of the target thermal resistance in the entire thermal resistance verification process can be quickly realized through the transfer mechanism, and the rapid transfer of the thermal resistance can be realized. Transfer the target thermal resistance to the cleaning tank for cleaning, which is conducive to the realization of efficient and reliable thermal resistance verification, and is conducive to improving the thermal resistance verification efficiency.

In an optional embodiment, the first rotating arm includes a main arm and a secondary arm, and the first rotating table and the first rotating arm in the transfer mechanism are controlled to move cooperatively, so as to pass the first rotating arm on the first rotating arm. The realization process of placing the target thermal resistance close to the first thermostatic bath by the installed first placing rack includes:

controlling the auxiliary arm to rotate to be parallel with the main arm;

The main arm is driven to rotate by the first rotary table, and the auxiliary arm is controlled to move along the extension direction of the main arm, so that the rotation center of the auxiliary arm is moved above the first thermostatic bath;

Controlling the rotation of the jib, so that the first placing frame installed on the jib moves to the top of the first thermostatic bath, and the target thermal resistance installed on the first placing frame is connected to the The verification holes set on the first constant temperature bath are on the same axis.

Through the above implementation manner, the target thermal resistance installed on the first placement rack can be quickly moved to a position matching the first thermostatic bath, which is beneficial to quickly realize the thermal resistance verification process of the thermal resistance at the first constant temperature bath.

In an optional embodiment, the auxiliary arm includes a telescopic rod, and the target thermal resistance is inserted into the first constant temperature tank by the transfer mechanism to perform thermal resistance verification, including:

When the target thermal resistance installed on the first placement rack and the verification hole set on the first constant temperature bath are on the same axis, the first lifting platform is controlled to descend and/or the telescopic rod is controlled to move, so that the first placement rack is close to the first thermostatic bath, and the target thermal resistance is inserted into the first thermostatic bath to a specified depth;

The temperature of the first constant temperature bath is controlled at the set verification temperature by the temperature control device in the thermal resistance verification system;

After it is detected that the target thermal resistance reaches thermal equilibrium, the telescopic rod is controlled to move so as to extend the target thermal resistance towards the first constant temperature bath for a specified distance, and when the target thermal resistance reaches thermal equilibrium again , and read to obtain the verification result of the thermal resistance verification of the target thermal resistance in the first constant temperature bath.

Through the above implementation manner, it is beneficial to quickly complete the thermal resistance verification process of the target thermal resistance on the first placing rack at the first constant temperature bath, and the detection accuracy can be improved.

In an optional embodiment, the method further includes:

When the verification result of the thermal resistance verification performed by the target thermal resistance in the first constant temperature bath is obtained, it is determined that the target thermal resistance has completed the thermal resistance verification process in the first constant temperature bath;

When it is determined that the target thermal resistance has completed the thermal resistance verification process in the first constant temperature bath, the target thermal resistance is driven to move by the transfer mechanism, so that the target thermal resistance is changed from the first constant temperature The tank is transferred to the cleaning tank for cleaning, including:

controlling the movement of the first lifting platform and/or the telescopic rod, so as to keep the target thermal resistance away from the first constant temperature bath;

Controlling the auxiliary arm to rotate to be parallel with the main arm, and controlling the main arm to rotate above the cleaning tank, so that the target thermal resistance is close to the cleaning tank;

controlling the movement of the first lifting platform and/or the telescopic rod, so that the target thermal resistance enters the cleaning tank;

The cleaning tank is controlled to clean the target thermal resistance.

Through the above implementation manner, when the target thermal resistance on the first placement rack completes the thermal resistance verification process at the first constant temperature tank, the target thermal resistance can be quickly cleaned, which can reduce the influence of medium pollution on the verification process.

In an optional embodiment, the first rotating arm is provided with a purge gas interface and a connection hole, the first placement rack is provided with a hollow connection column and a thermal resistance placement hole, and the first placement rack and The first rotating arms are connected through the hollow connecting column and the connecting hole, and the method further includes:

When it is determined that the cleaning of the target thermal resistance is completed, through the air channel formed by the purge gas interface, the connecting hole, the hollow connecting column and the thermal resistance placing hole, the air passages in the thermal resistance placing hole are cleaned. The target thermal resistance is purged and cleaned.

Through the above implementation manner, the probability of medium contamination can be reduced.

In an optional embodiment, the transfer mechanism further includes: a second lifting platform, a second rotating platform, a second rotating arm and a second placing rack, the second rotating platform being mounted on the second lifting platform , the second rotating arm is mounted on the second rotating table, the second placing frame is mounted on the second rotating table, and the method further includes:

When the target thermal resistance that has been wired is placed on the second placing rack, the second lifting platform is controlled to rise;

When the second lifting platform rises to a set second height, the second rotating platform and the second rotating arm are controlled to move in coordination, so as to pass the second placing frame installed on the second rotating arm transferring the target thermal resistance to the second thermostatic bath;

Carry out thermal resistance verification on the target thermal resistance installed in the second placing rack;

When it is determined that the target thermal resistance in the second placing rack completes the thermal resistance verification process at the second constant temperature bath, the second lifting platform, the second rotating platform, and the second rotating arm are used Move in coordination with the second placing rack to transfer the target thermal resistance installed in the second placing rack from the second constant temperature bath to the cleaning bath for cleaning;

When it is determined that the target thermal resistance in the second placing rack has completed the cleaning process, the second lifting table, the second rotating table, the second rotating arm and the second placing rack are used for coordinated movement, The thermal resistance test is performed by transferring the target thermal resistance installed in the second placing rack from the cleaning tank to the first constant temperature tank.

Through the above implementation manner, it is beneficial to realize the simultaneous verification of different thermal resistances through the structure associated with the first rotating arm and the second rotating arm, and is beneficial to improve the verification efficiency.

Description of drawings

In order to explain the technical solutions of the embodiments of the present application more clearly, the following briefly introduces the accompanying drawings that need to be used in the embodiments of the present application. It should be understood that the following drawings only show some embodiments of the present application, therefore It should not be regarded as a limitation of the scope. For those of ordinary skill in the art, other related drawings can also be obtained from these drawings without any creative effort.

FIG. 1 is a schematic diagram of a thermal resistance verification system provided by an embodiment of the present application.

FIG. 2 is a schematic diagram of a transfer mechanism according to an embodiment of the present application.

FIG. 3 is a schematic diagram of a thermal resistance placing rack in an example provided by an embodiment of the present application.

FIG. 4 is a schematic diagram of a first lifting platform in an example provided by an embodiment of the present application.

FIG. 5 is a schematic diagram of a first rotary table in an example provided by an embodiment of the present application.

FIG. 6 is a schematic diagram of a first rotating arm in an example provided by an embodiment of the present application.

FIG. 7 is a schematic diagram of a first constant temperature bath in an example provided by the embodiments of the present application.

FIG. 8 is a schematic diagram of a cleaning tank in an example provided by the embodiments of the present application.

FIG. 9 is a flowchart of a thermal resistance verification method provided by an embodiment of the present application.

FIG. 10 is a partial flowchart of a thermal resistance verification method provided by an embodiment of the present application.

Reference numerals: 100-transfer mechanism; 200-first thermostatic bath; 300-second thermostatic bath; 400-cleaning bath; 500-table; A-first actuator; B-second actuator; 110a-th A lifting platform; 110b-second lifting platform; 120a-first rotating platform; 120b-second rotating platform; 130a-first rotating arm; 130b-second rotating arm; 140-thermal resistance placing frame; 111-base; 112-shell; 113-lifting column; 114-lifting connection plate; 121-support; 122-rotating plate; 131-rotating connection plate; 132-main arm; 133-auxiliary arm; 201-trough body; ; 203 - temperature control device; 401 - shell; 402 - cleaning container.

Detailed ways

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

In the existing verification process, if the thermal resistance verification of the thermal resistance to be tested under different temperature fields is to be realized, the thermal resistance to be tested needs to be switched between two constant temperature baths, namely, a constant temperature water tank and a constant temperature oil tank. Before switching, it is necessary to remove the connecting wire of the thermal resistance, and then carry out necessary cleaning of the thermal resistance. After cleaning, take the thermal resistance to the next calibration constant temperature bath and reconnect the thermal resistance, and then Then verify the thermal resistance after the wiring is completed. When it comes to operations such as temperature field switching, cleaning, and wiring after switching, the operation process relies on manual implementation, so the processing efficiency is low.

In view of this, the inventor proposes the following embodiments for improvement. Through the thermal resistance verification system and method provided in the embodiments of the present application, efficient and accurate verification of thermal resistance can be realized, temperature field switching can be quickly realized, and thermal resistance transfer can be quickly realized. , The entire transfer and switching process can be automated, reducing human intervention, and there is no need to repeat wiring and disconnection when verifying and transferring the thermal resistance. In the case that the thermal resistance verification system includes the first rotating arm and the second rotating arm, it is advantageous to realize the simultaneous verification of multiple thermal resistances.

Please refer to FIG. 1 , which is a schematic diagram of a thermal resistance verification system provided by an embodiment of the present application.

As shown in FIG. 1 , the thermal resistance verification system includes: a transfer mechanism 100 , a first constant temperature bath 200 , a second constant temperature bath 300 and a cleaning bath 400 .

The first constant temperature bath 200 and the second constant temperature bath 300 are used to provide a constant temperature field (eg, a temperature field of 0 degrees Celsius and 100 degrees Celsius) required for thermal resistance verification.

In the embodiment of the present application, the first constant temperature bath 200 and the second constant temperature bath 300 are constant temperature baths that provide a temperature field with different constant temperature media. For example, the first constant temperature tank 200 is a constant temperature water tank and the second constant temperature tank 300 is a constant temperature oil tank, or the first constant temperature tank 200 is a constant temperature oil tank and the second constant temperature tank 300 is a constant temperature water tank.

In this embodiment of the present application, the transfer mechanism 100 may include two sets of execution devices, and the two sets of execution devices may be denoted as a first execution device A and a second execution device B, respectively. The two sets of execution devices have similar structures and the same working principles. In the subsequent description, the first execution device will be used as an example for introduction.

In the embodiment of the present application, all the thermal resistances can be wired and disconnected at the workbench 500, and the transfer mechanism 100 can transfer the thermal resistance of the target thermal resistance that has been wired through the first execution device or the second execution device. Both the executing device and the second executing device can independently complete the transfer process for a group of thermal resistances to be tested in the entire thermal resistance verification process. In the process of using the transfer mechanism 100 to transfer the thermal resistance, it is not necessary to wire and disconnect the target thermal resistance at the constant temperature bath and the cleaning bath 400 .

When two sets of actuators work at the same time, multiple sets of thermal resistances to be tested can be tested simultaneously. For example, when the first actuator moves a set of thermal resistances to the first thermostatic bath 200 for verification, the second actuator can Move the other group of thermal resistances to the second constant temperature tank 300 for verification, and the two sets of execution devices can work independently to realize the verification of dual tanks and dual controls (group control).

As shown in FIG. 2 , the first execution device in the transfer mechanism 100 may include: a first lifting platform 110a, a first rotating platform 120a, a first rotating arm 130a and a first placing frame. Similar to the first executing device, the second executing device in the transfer mechanism 100 may include a second lifting platform 110b, a second rotating platform 120b, a second rotating arm 130b and a second placing frame.

Both the first placement rack and the second placement rack are thermal resistance placement racks 140 (as shown in FIG. 3 ), both of which can be used to install or place a target thermal resistor.

Both the first execution device and the second execution device can be used to transfer the target thermal resistance to realize temperature field switching. In the embodiment of the present application, the thermal resistance installed and placed on the thermal resistance placing rack 140 is the thermal resistance that has been wired.

The target thermal resistance can be a group of thermal resistances, and the target thermal resistance can include standard thermal resistances and to-be-detected thermal resistances.

In a specific application, the thermal resistance verification system may also include a measurement system. The measurement system may include a computer, a scanning switch, a temperature control device 203 and other equipment related to data acquisition and data processing. The temperature control device 203 is used to regulate the temperature. The scanning switch can collect and forward the multi-channel data related to the standard thermal resistance and the thermal resistance to be tested during the verification process, and can also send the data obtained in the verification process to the computer through the special measuring instrument and communication interface to For computer processing and analysis of these data. A specific measurement system will not be limited in this application.

The thermal resistance verification system will be described in detail below by taking the first execution device in the transfer mechanism 100 as an example.

As shown in FIG. 2 , the first rotating table 120a is installed on the first lifting table 110a. The first rotating arm 130a is mounted on the first rotating table 120a. The first placing frame is mounted on the first rotating arm 130a.

The transfer mechanism 100 is used for inserting the target thermal resistance installed in the first placing rack into the first constant temperature bath 200 through the first lifting table 110a, the first rotating table 120a and the first rotating arm 130a for thermal resistance verification.

The transfer mechanism 100 is also used for transferring the target thermal resistance from the first constant temperature tank 200 to the cleaning tank 400 for cleaning when the target thermal resistance completes the thermal resistance verification process in the first constant temperature tank 200 .

The transfer mechanism 100 is also used for: when the cleaning of the target thermal resistance is completed, the target thermal resistance is transferred from the cleaning tank 400 to the second constant temperature tank 300 for thermal resistance verification.

Through the above thermal resistance verification system, the temperature field switching of the target thermal resistance in the whole thermal resistance verification process can be realized through the transfer mechanism 100, the rapid transfer of the thermal resistance can be realized, and the target thermal resistance can be transferred during the temperature field switching process. Cleaning in the cleaning tank 400 is conducive to realizing efficient and reliable thermal resistance verification, and is conducive to improving the thermal resistance verification efficiency.

As shown in FIG. 4 , the first lifting platform 110a may include: a base 111 , a housing 112 , a lifting column 113 , a lifting connecting plate 114 and a lifting controller (not shown).

The first lifting platform 110a can be fixed on a designated plane (eg, on the ground) through the base 111 . The lifting column 113 can be wrapped and protected by the casing 112 . The lifting height of the first lifting platform 110a can be controlled by the lifting controller, that is, the position of the bearing surface of the first lifting platform 110a can be changed.

The lift connecting plate 114 is arranged at the top of the lift column 113 and is used for installing the first rotary table 120a.

The structure of the second lifting platform 110b is similar to that of the first lifting platform 110a, and the only difference is that when the thermal resistance is transferred, the second lifting platform 110b may have a different lifting height from that of the first lifting platform 110a.

In one example, the maximum lifting position of the first lifting platform 110a and the maximum lifting position of the second lifting platform 110b are on different horizontal planes, and the lowest bearing surface of the first lifting platform 110a and the lowest bearing surface of the second lifting platform may be at different levels. on different levels. It can be understood that, in addition to limiting the lifting height by the setting height of the device itself, the lifting height of the lifting platform can also be set by a corresponding lifting controller.

As shown in FIG. 5 , the first rotary table 120 a may include: a rotary disk 122 , a rotary controller (not shown) and a support 121 . The structure of the second rotary table 120b is the same as that of the first rotary table 120a.

Wherein, the first rotating table 120a can be connected with the lifting connecting plate 114 in the first lifting table 110a through the support 121, so as to realize the connection between the first rotating table 120a and the first lifting table 110a. The first rotating table 120a may be connected with the first rotating arm 130a through the rotating disk 122 . The rotation of the first rotating table 120a can be controlled by the rotation controller, thereby driving the first rotating arm 130a on the first rotating table 120a to rotate around the first rotating table 120a.

As shown in FIG. 6 , the first rotating arm 130 a may include: a rotating connecting plate 131 , a main arm 132 and a sub-arm 133 . The structure of the second rotating arm 130b is the same as that of the first rotating arm 130a.

Wherein, the rotating connection plate 131 of the first rotating arm 130a is mounted on the first rotating table 120a. The rotary connection disk 131 is connected to the rotary disk 122 in the first rotary table 120a.

The main arm 132 is mounted on the rotating connection plate 131 . The auxiliary arm 133 is mounted on the main arm 132 . The first placement frame is mounted on the auxiliary arm 133 .

Wherein, the main arm 132 is used to rotate around the rotating connection plate 131 .

The auxiliary arm 133 is used for reciprocating movement in the extending direction of the main arm 132 , so that the first placing frame can drive the target thermal resistance to a designated position. The designated position may include above the first constant temperature bath 200 , the second constant temperature bath 300 and the cleaning bath 400 .

Based on the cooperation between the main arm 132 and the auxiliary arm 133, the target thermal resistance on the thermal resistance placing frame 140 can be moved to a specified position, and the rapid transfer of the target thermal resistance can be realized during the thermal resistance verification process.

In the embodiment of the present application, the auxiliary arm 133 is provided with a telescopic rod and a rotator.

The position of the rotator can be used as the rotation center of the auxiliary arm 133 , and the rotator can move back and forth along the extension direction of the main arm 132 . The spinner can be turned.

Under the rotating action of the rotator, the auxiliary arm 133 can be rotated. For example, the auxiliary arm 133 can be rotated to be parallel or perpendicular to the main arm 132. It can be understood that, except for 0 degrees and 90 degrees, the auxiliary arm 133 and the main arm The included angle between 132 may also be other angles.

The telescopic rod is used to perform telescopic motion with the position of the rotator as a reference position, and the auxiliary arm 133 is used to drive the thermal resistance placing rack 140 (eg, the first placing rack) to move through the telescopic motion of the telescopic rod.

As an implementation manner, the telescopic rod can be extended or retracted from the rotator, and the position of the target thermal resistance can be changed through the extension or retraction of the telescopic rod.

As another implementation, the telescopic rod can be moved through the rotator in the direction of approaching or away from the thermostatic bath, so as to realize the telescopic movement, thereby driving the position of the target thermal resistance to change. In this implementation, the inherent length of the telescopic rod can remain unchanged.

Based on the above implementation manner, the auxiliary arm 133 installed on the main arm 132 can be rotated and can be extended and retracted, so as to facilitate the realization of the multi-directional transfer requirements for the target thermal resistance. Collision conflict occurs during resistance transfer.

Optionally, a controller dedicated to controlling the movement of the auxiliary arm 133 may be provided for the auxiliary arm 133 to control the movement state of the auxiliary arm 133 on the main arm 132 , and also to control the rotation of the auxiliary arm 133 and the telescopic rod. exercise.

Wherein, a purge gas interface and a connection hole may be provided on the auxiliary arm 133 . The first placement rack may be provided with a hollow connecting column and a placement hole for the thermal resistance. The air outlet of the hollow connecting column can be communicated with the thermal resistance placement hole provided in the first placement rack.

The RTD placement holes are used to mount the target RTD. There may be a gap between the target RTD and the RTD placement hole for airflow to flow through.

The first placing frame can be inserted into the connecting hole on the auxiliary arm 133 through the hollow connecting column, so as to connect the first placing frame and the auxiliary arm 133 .

The transfer mechanism 100 is used to introduce an external air source into the air channel formed by the purge gas interface, the connection hole, the hollow connection column and the thermal resistance placement hole, so as to purge and clean the target thermal resistance in the thermal resistance placement hole by air flow.

Based on the above implementation manner, the target thermal resistance can be purged and cleaned, which is conducive to reducing the probability of medium pollution and improving the verification reliability.

In the embodiments of the present application, media pollution refers to mixing different media into the same thermostatic bath.

It can be understood that the positions of the connecting hole and the hollow connecting column can be exchanged, that is, the connecting hole can be arranged on the first placing frame, and the hollow connecting column can be arranged on the auxiliary arm 133 .

In the embodiment of the present application, each thermal resistance placement rack 140 (a first placement rack, a second placement rack) may include: a disk body and a plurality of thermal resistance placement holes provided on the disk body. The plurality of thermal resistance placement holes include a first placement hole and a plurality of second placement holes. The plurality of second placement holes are disposed around the first placement holes.

The first placement hole is used for installing the target thermal resistance as a standard thermal resistance, and the second placement hole is used for installing the target thermal resistance as the thermal resistance to be tested.

Since the second actuator B and the first actuator A have the same structure and working principle except for the difference in lifting height, the second actuator B is the same as the second lifting platform 110b, the second rotary table 120b, the second rotary table For the content of the arm 130b and the second placing rack, reference may be made to the description about the first execution device A.

The second rotating table 120b is mounted on the second lifting table 110b, the second rotating arm 130b is mounted on the second rotating table 120b, and the second placing frame is mounted on the second rotating arm 130b.

The above-mentioned transfer mechanism 100 is also used for: transferring the target thermal resistance installed in the second placing frame to the first constant temperature bath through the second lifting table 110b, the second rotating table 120b, the second rotating arm 130b and the second placing frame 200. The cleaning tank 400 or the second constant temperature tank 300 is used to simultaneously realize the temperature field switching and the thermal resistance verification of a plurality of thermal resistances.

Among them, the simultaneous realization of the temperature field switching of multiple thermal resistances and the thermal resistance verification has two meanings. One of the meanings refers to that when the thermal resistance is transferred by the transfer mechanism 100, a group (multiple) of thermal resistances installed on the same placement rack can be checked simultaneously and the temperature field can be switched at the same time. One of its meanings means that the transfer mechanism 100 can simultaneously perform the two sets of the two rotating arms through the first actuator A associated with the first rotary arm 130a and the second actuator B associated with the second rotary arm 130b. The thermal resistance verification is performed on the target thermal resistance, that is, the temperature field switching of multiple thermal resistances in different positions is realized at the same time.

Based on the above implementation manner, the temperature field switching of multiple thermal resistances and the thermal resistance verification can be realized, and the verification efficiency can be improved.

As an implementation manner, when the first rotating arm 130a and the second rotating arm 130b are used for thermal resistance transfer at the same time, the lifting heights of the first lifting platform 110a and the second lifting platform 110b are different. For example, in the process of transferring the target thermal resistance in the first placement rack from the first thermostatic bath 200 to the second constant temperature bath 300 by the first rotating arm 130a, or, in the second placement rack by the second rotating arm 130b During the process of transferring the target thermal resistance from the second constant temperature bath 300 to the first constant temperature bath 200, the first lifting platform 110a and the second lifting platform 110b can be controlled to be at different lifting heights.

This is beneficial to avoid collision and conflict during the thermal resistance transfer process.

Optionally, for the structure of the first thermostatic bath 200 or the second thermostatic bath 300 , reference may be made to FIG. 7 . The first thermostatic bath 200 and the second thermostatic bath 300 each include a bath body 201 and a plurality of verification holes 202 corresponding to the aforementioned thermal resistance placement holes.

The first constant temperature tank 200 and the second constant temperature tank 300 may further include respective temperature control devices 203 and a constant temperature medium accommodated in the tank body 201 . The temperature control devices 203 on the first constant temperature bath 200 and the second constant temperature bath 300 are connected to a main control device (eg, a computer) in the thermal resistance verification system.

As shown in FIG. 8 , the cleaning tank 400 may include: a housing 401 and a cleaning container 402 opened in the housing 401 . The cleaning container 402 can contain cleaning agents. The cleaning tank 400 is connected to the main control device (for example, a host computer equipment such as a computer) in the thermal resistance verification system, and the automatic cleaning function can be turned on under the control of the main control device. Resistors are cleaned.

For the thermal resistance cleaned through the cleaning tank 400, the thermal resistance cleaned through the cleaning tank 400 can be purged and cleaned by the aforementioned airflow cleaning method (implemented based on the aforementioned air passage).

Optionally, there may be two cleaning tanks 400 . Exemplarily, the two cleaning tanks 400 may be disposed at positions close to the first constant temperature tank 200 and the second constant temperature tank 300, respectively.

In one example, the first constant temperature tank 200 is a constant temperature oil tank that provides a temperature field of 100 degrees Celsius, the second constant temperature tank 300 is a constant temperature water tank that provides a temperature field of 0 degrees Celsius, and the constant temperature oil tank and the constant temperature water tank are respectively arranged on both sides of the transfer mechanism 100, The cleaning tank 400 and the table 500 are respectively provided in front of and behind the transfer mechanism 100 . The transfer mechanism 100 uses two sets of parallel execution devices to perform thermal resistance verification on the two sets of thermal resistances at the same time. During the rotation process, they will not collide with each other. The thermal resistance verification system communicates with each lift table, each rotary table and each rotary arm in the transfer mechanism 100 with the selected main control device. The main control device can send control instructions (including instructions related to lifting and rotation) to each equipment component in the transfer mechanism 100, so that the corresponding components in the transfer mechanism 100 perform corresponding operations according to the received control instructions, so as to realize the Thermal resistance's temperature field switching, transfer, cleaning and other verification related processes.

Based on the same inventive concept, the embodiments of the present application also provide a thermal resistance verification method that can be applied to the aforementioned thermal resistance verification system. Before performing this method, the thermal resistance verification system needs to be calibrated in position (including the position calibration of the transfer mechanism), so that each rotating arm in the thermal resistance system can cooperate with the lifting table to place the thermal resistance on the corresponding thermal resistance rack. The resistance accurately extends into the selected thermostatic bath.

As shown in Figure 9, the method includes: S61-S65.

S61 : When the target thermal resistance that has been wired is placed on the first placing rack in the transfer mechanism, control the first lift table in the transfer mechanism to ascend.

Wherein, before S61, the first placement rack in the transfer mechanism may be moved to the worktable, and the thermal resistor may be placed in the first placement rack. A target thermal resistance as a standard thermal resistance can be installed in the center position of the first placement rack, and each placement hole provided around the center position on the first placement rack can be installed as a target thermal resistance as a thermal resistance to be detected. After the staff completes the installation and wiring of all the thermal resistances that need to be verified on the first placement rack, the thermal resistance verification system can receive the start verification command for this part of the thermal resistance, start to execute S61, and control the first lifting platform to rise .

When the first lifting platform rises, the first rotating arm and the first placing rack mounted on the first rotating arm can be driven to rise.

S62: When the first lifting platform rises to the set first height, control the first rotating platform and the first rotating arm in the transfer mechanism to cooperate to move, so as to move the target through the first placing frame installed on the first rotating arm The thermal resistance is close to the first constant temperature bath.

Wherein, when the first lifting platform rises to the set first height, the first rotating platform can be controlled to drive the first rotating arm to rotate, and the main arm and the auxiliary arm on the first rotating arm can be controlled to cooperate with each other, so as to make the auxiliary arm rotate. The first placement rack on the arm brings the target thermal resistance mounted on the first placement rack close to the first thermostatic bath.

S63: Insert the target thermal resistance into the first constant temperature bath through the transfer mechanism to perform thermal resistance verification.

Wherein, the first lifting platform in the transfer mechanism and/or the jib on the first rotating arm can be used to drive the first placing frame to descend, so as to insert the target thermal resistance installed in the first placing frame into the first thermostatic bath for thermal resistance measurement. Check.

S64: When it is determined that the target thermal resistance has completed the thermal resistance verification process in the first constant temperature tank, the transfer mechanism drives the target thermal resistance to move, so that the target thermal resistance is transferred from the first constant temperature tank to the cleaning tank for cleaning.

Wherein, when the verification result measured by the target thermal resistance in the temperature field provided by the first constant temperature bath is obtained, it can be considered that the target thermal resistance has completed the thermal resistance verification process in the first constant temperature bath (but at this time the target thermal resistance Thermal resistance verification has not been performed under the temperature field provided by the second thermostatic bath). When the target thermal resistance is determined and the thermal resistance verification process in the first constant temperature bath is completed, the first placing frame can be driven to move by the first rotating arm, so that the target thermal resistance installed on the first placing frame is transferred from the first constant temperature bath to the first placing frame. Cleaning at the cleaning tank.

S65: When it is determined that the cleaning of the target thermal resistance is completed, the transfer mechanism drives the target thermal resistance to move, so that the target thermal resistance is transferred from the cleaning tank to the second constant temperature tank for thermal resistance verification.

When it is determined that the cleaning of the target thermal resistance is completed, the first placing frame is driven to move by the first rotating arm, so that the target thermal resistance installed on the first placing frame is transferred from the cleaning tank to the second constant temperature tank for thermal resistance verification.

Based on the above methods of S61-S65, the efficient verification of the target thermal resistance can be achieved, and the temperature field switching of the target thermal resistance during the entire thermal resistance verification process can be quickly realized through the transfer mechanism, and the rapid transfer of the thermal resistance can be realized. During the temperature field switching process, the target thermal resistance is transferred to the cleaning tank for cleaning, which is conducive to realizing efficient and reliable thermal resistance verification and improving the thermal resistance verification efficiency.

As an implementation of S62, the first rotating arm includes a main arm and a sub-arm, and S62 may include sub-steps S621-S623.

S621: Control the auxiliary arm to rotate to be parallel with the main arm.

S622: The main arm is driven to rotate by the first rotary table, and the auxiliary arm is controlled to move along the extension direction of the main arm, so that the rotation center of the auxiliary arm is moved above the first thermostatic bath.

Wherein, when the first lifting platform rises to the set first height, the auxiliary arm is controlled to rotate to be parallel to the main arm (the extension direction of the entire first rotating arm can be horizontal). Since the thermal resistance is usually relatively long, each upgrade The height difference of the stage is not large (the height difference is not large to avoid the transfer time due to the too large height difference during the transfer of the thermal resistance). It is beneficial to avoid collision and conflict during the rotation of the main arm, for example, it can avoid collision between the auxiliary arm on the first rotating arm and the auxiliary arm on the second rotating arm during operation.

The rotation angle of the first rotary table/main arm and the moving distance of the auxiliary arm on the main arm can be determined according to the actual position of the thermostatic bath. For example, when a coordinate system is established for the transfer mechanism, each constant temperature tank, cleaning tank, and worktable in advance, the transfer mechanism can be controlled according to the predetermined positions of each constant temperature tank, cleaning tank, and worktable in the coordinate system. The set execution logic moves, so that the target thermal resistance can be efficiently verified in the set verification processing sequence.

S623: Control the rotation of the jib, so that the first placing frame installed on the jib moves to the top of the first constant temperature bath, and the target thermal resistance installed on the first placing frame and the verification hole set on the first constant temperature bath are on the same axis superior.

When the rotator of the auxiliary arm is used as the rotation center, when the rotator moves above the first thermostatic bath, the rotation of the auxiliary arm can be controlled to make the auxiliary arm rotate to be aligned with the first thermostatic bath. The alignment of the auxiliary arm with the first constant temperature tank may be that the extension direction of the telescopic rod on the auxiliary arm at this time points to the verification hole provided on the first constant temperature tank. In this case, the up and down movement of the telescopic rod and/or the up and down movement of the first lifting platform can drive the target thermal resistance installed on the first placing frame to gradually approach the verification hole on the first thermostatic bath.

Based on the implementation of S621-S623, the target thermal resistance installed on the first placement rack can be quickly moved to a position matching the first thermostatic bath, which is beneficial to quickly realize the thermal resistance verification process of the thermal resistance at the first constant temperature bath .

Based on the above S62 (or S621-S623), the above S63 may include: S631-S633.

S631: When the target thermal resistance installed on the first placement rack and the verification hole set on the first thermostatic bath are on the same axis, control the first lifting platform to descend and/or control the telescopic rod on the jib to move, so that the first Place the rack close to the first bath and insert the target RTD to the specified depth in the first bath.

Among them, the thermal resistance can be greatly moved in the vertical direction through the lifting motion of the lifting platform, and the thermal resistance can be fine-tuned in the vertical direction through the movement of the telescopic rod to improve the control accuracy.

S632: Control the temperature of the first constant temperature bath at the set verification temperature through the temperature control device in the thermal resistance verification system.

In this way, the first constant temperature bath provides a constant temperature field for the verification process of the target thermal resistance.

S633: After detecting that the target thermal resistance on the first placing rack has reached thermal equilibrium, control the telescopic rod to move, so that the target thermal resistance continues to extend into a specified distance toward the first thermostatic bath, and when the target thermal resistance reaches thermal equilibrium again , read and obtain the verification result of the thermal resistance verification of the target thermal resistance in the first constant temperature bath.

The value of the specified depth, the value of the verification temperature, and the value of the specified distance are determined according to the thermal resistance verification requirements and verification specifications. In one example, the target thermal resistance is first extended into the first half of the medium in the constant temperature bath by the transfer mechanism, and then the first constant temperature bath is controlled at a specified calibration temperature by the temperature control device. It can be shown that the temperature change within 10 minutes does not exceed 0.02 degrees Celsius), control the telescopic rod on the jib to continue to insert the target thermal resistance into the first thermostatic bath by 1 cm, and read the verification result when it is detected that the thermal equilibrium is reached again. . The embodiments of the present application do not limit the specific data collection, reading, analysis and processing procedures.

Through the above implementation manner, it is beneficial to quickly complete the thermal resistance verification process of the target thermal resistance on the first placing rack at the first constant temperature bath, and the detection accuracy can be improved.

Wherein, when the verification result of the thermal resistance verification performed by the target thermal resistance in the first constant temperature bath is obtained, the target thermal resistance is determined to complete the thermal resistance verification process in the first constant temperature bath. The above S64 may include: S641-S644.

S641: Control the movement of the first lifting platform and/or the telescopic rod to keep the target thermal resistance away from the first constant temperature bath.

S642: Control the auxiliary arm to rotate to be parallel with the main arm, and control the main arm to rotate above the cleaning tank, so that the target thermal resistance is close to the cleaning tank.

S643: Control the movement of the first lifting platform and/or the telescopic rod, so that the target thermal resistance enters the cleaning tank.

S644: Control the cleaning tank to clean the target thermal resistance.

In this way, when the target thermal resistance on the first placement rack completes the thermal resistance verification process at the first constant temperature bath, the target thermal resistance can be quickly cleaned, which can reduce the influence of medium pollution on the verification process.

Optionally, when the first rotating arm is provided with the aforementioned purge gas interface and the connection hole, and the first placement rack is provided with the aforementioned hollow connection column and the thermal resistance placement hole, the above method may further include S645: When it is determined that the cleaning of the target thermal resistance is completed, the target thermal resistance in the thermal resistance placing hole is purged and cleaned through the air channel formed by the purging gas interface, the connecting hole, the hollow connecting column and the thermal resistance placing hole. This reduces the probability of media contamination.

When it is determined that the cleaning of the target thermal resistance is completed, or when S645 is executed, S65 can be executed. Since the thermal resistance verification process of the target thermal resistance at the second constant temperature tank is the same as the thermal resistance verification process at the first constant temperature tank, the details of S65 can refer to the content related to S63, which will not be repeated below.

The aforementioned methods of S61-S65 can be regarded as a method of performing thermal resistance verification on a group of thermal resistors under the temperature fields provided by two constant temperature baths through the first execution device in the transfer mechanism.

Based on the foregoing method and the principles related to the first execution device and the second execution structure in the foregoing structure, when the transfer mechanism further includes: a second lifting platform, a second rotating platform, a second rotating arm and a second placing rack, As shown in FIG. 10 , the above method may further include S66-S70.

Since the methods of S66-S70 and the methods of S61-S65 can be implemented based on different execution devices, they can be executed independently in parallel. For example, the methods of S66-S70 and the methods of S61-S65 can be executed simultaneously. Exemplarily, two methods can be controlled simultaneously. It can control the rotation of two rotating arms at the same time, and at the same time insert the target thermal resistance corresponding to the two rotating arms into two constant temperature baths for simultaneous verification.

S66 : when the target thermal resistance that has been wired is placed on the second placing rack, the second lifting platform is controlled to rise.

S67: When the second lifting platform rises to the set second height, control the second rotating platform and the second rotating arm to cooperate to move, so as to transfer the target thermal resistance to the second placing frame installed on the second rotating arm. at the second thermostat.

S67: Perform thermal resistance verification on the target thermal resistance installed in the second placing rack.

S69: When it is determined that the target thermal resistance in the second placing rack has completed the thermal resistance verification process at the second constant temperature bath, the second lifting table, the second rotating table, the second rotating arm and the second placing rack are used for coordinated movement , so as to transfer the target thermal resistance installed in the second placing rack from the second constant temperature bath to the cleaning bath for cleaning.

S70: When it is determined that the target thermal resistance in the second placing rack has completed the cleaning process, the second lifting table, the second rotating table, the second rotating arm and the second placing rack are coordinated to move to install the second placing rack in the second placing rack. The target thermal resistance is transferred from the cleaning tank to the first constant temperature tank for thermal resistance verification.

The methods of S66-S70 can be regarded as a method of performing thermal resistance verification on another group of thermal resistors under the temperature field provided by the two constant temperature baths through the second execution device in the transfer mechanism. Due to the implementation principle of the second lifting table, the second rotating table, the second rotating arm and the second placing rack in the transfer mechanism and the first lifting table, the first rotating table, the first rotating arm and the first placing rack in the transfer mechanism The same, so the implementation details of S66-S70 can refer to the foregoing descriptions about S61-S65, for example, in the method of S66-S70, between the second lifting table, the second rotating table, the second rotating arm and the second placing frame For the coordinated movement process, refer to the methods of S61-S65.

Based on the method of S66-S70 and the method of S61-S65, it is beneficial to realize the simultaneous verification of different thermal resistances through the structure associated with the first rotating arm and the second rotating arm, which is beneficial to improve the verification efficiency.

In one example, after the target thermal resistance has completed the verification process in a constant temperature bath, the lifting platform is controlled to rise to lift the target thermal resistance, and then the auxiliary arm is controlled to rotate to the horizontal direction, the main arm is controlled to rotate to the position of the cleaning tank, and then controlled The lifting table descends to send the target thermal resistance into the cleaning tank, and the target thermal resistance entering the cleaning tank is soaked or rinsed in the cleaning tank. After cleaning, the lifting table is controlled to rise and the target thermal resistance is lifted again, and the auxiliary arm is controlled to heat the thermal resistance. The target thermal resistance on the resistance placement rack is purged and cleaned, and after the dirt on the target thermal resistance is purged (regardless of which calibration process of the constant temperature bath is performed first, as long as the medium of the constant temperature bath is different, in order to avoid medium pollution, Therefore, it is necessary to clean and purge the target thermal resistance, and control the main arm to rotate to another constant temperature tank to complete the verification process of the target thermal resistance at another temperature point according to the same processing logic sequence.

After the same thermal resistance has been verified at the specified two temperature points (0 degrees Celsius, 100 degrees Celsius), the target thermal resistance that has completed the verification can be transferred to the workbench through the transfer mechanism for wire removal, and the thermal resistance can be placed on the shelf. target thermal resistance.

In order to verify and distinguish each thermal resistance, the thermal resistances to be tested can be coded before all the thermal resistances to be tested are verified. The verification data of each thermal resistance is collected and the verification results are automatically distinguished and judged.

In the embodiments provided in the present application, it should be understood that the above-described embodiments are only illustrative, for example, the division of structures, modules, and devices is only a logical function division, and there may be other divisions in actual implementation. The way of division, for another example, multiple units or components can be combined or can be integrated into another system. Those skilled in the art can select some or all of the contents according to actual needs to achieve the purpose of the solution in this embodiment.

It should be noted that, if the functions of the above method are implemented in the form of software function modules and sold or used as independent products, they may be stored in a computer-readable storage medium. Based on such understanding, the technical solution of the present application can be embodied in the form of a software product in essence, or the part that contributes to the prior art or the part of the technical solution. The computer software product is stored in a storage medium, including Several instructions are used to cause a computer device to perform all or part of the steps of the methods of various embodiments of the present application.

In this document, relational terms such as first and second, etc. are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such existence between these entities or operations. The actual relationship or sequence.

The above are only examples of the present application, and are not intended to limit the protection scope of the present application. For those skilled in the art, the present application may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this application shall be included within the protection scope of this application.

Claims (13)

1. A thermal resistance verification system, comprising: the transfer mechanism, the first constant temperature tank, the second constant temperature tank and the cleaning tank are arranged in the first constant temperature tank;

the transfer mechanism includes: the device comprises a first lifting table and a first rotating table arranged on the first lifting table, wherein a first rotating arm is arranged on the first rotating table, a first placing frame is arranged on the first rotating arm, and the first placing frame is used for installing a thermal resistor;

the transfer mechanism is used for inserting the target thermal resistor installed in the first placing frame into the first constant temperature bath for thermal resistor verification through the first lifting table, the first rotating table and the first rotating arm;

the transfer mechanism is further used for transferring the target thermal resistor from the first constant temperature bath to the cleaning bath for cleaning when the target thermal resistor completes the thermal resistor verification process in the first constant temperature bath;

and the transfer mechanism is also used for transferring the target thermal resistor from the cleaning tank to the second constant temperature tank for thermal resistor verification when the target thermal resistor is cleaned.

2. The thermal resistance verification system according to claim 1, wherein the first rotating arm comprises a rotating connection disc, a primary arm, and a secondary arm;

the main arm is arranged on the rotary connecting disc;

the auxiliary arm is arranged on the main arm;

the first placing frame is arranged on the auxiliary arm;

the main arm is used for rotating around the rotating connecting disc;

the auxiliary arm is used for moving back and forth in the extending direction of the main arm, so that the first placing frame can drive the target thermal resistor to a specified position, and the specified position comprises the upper parts of the first constant temperature groove, the second constant temperature groove and the cleaning groove.

3. The thermal resistance verification system according to claim 2, wherein a purge gas interface and a connecting hole are arranged on the auxiliary arm, and a hollow connecting column and a thermal resistance placing hole are arranged on the first placing frame;

the first placing frame is inserted into the connecting hole through the hollow connecting column so as to connect the first placing frame with the auxiliary arm;

the thermal resistor placing hole is used for installing the target thermal resistor;

the transfer mechanism is used for introducing an external air source into the air passage formed by the purge air interface, the connecting hole, the hollow connecting column and the thermal resistor placing hole so as to purge and clean the target thermal resistor in the thermal resistor placing hole through air flow.

4. The thermal resistance verification system according to claim 2, wherein the auxiliary arm is provided with a telescopic rod and a rotator;

under the rotating action of the rotator, the auxiliary arm can rotate to be parallel or vertical to the main arm;

the telescopic rod is used for performing telescopic motion by taking the position of the rotator as a reference position, and the auxiliary arm is used for driving the first placing frame to move through the telescopic motion of the telescopic rod.

5. The thermal resistance verification system according to claim 1, wherein the first constant temperature bath and the second constant temperature bath are constant temperature baths that provide temperature fields with different constant temperature media;

the first constant temperature bath and the second constant temperature bath are both provided with verification holes matched with the first placing rack;

the target thermal resistor arranged in the first placing frame is used for being inserted into the verification hole to conduct thermal resistor verification;

the first constant temperature bath is a constant temperature water bath, and the second constant temperature bath is a constant temperature oil bath;

or, the first constant temperature bath is a constant temperature oil bath, and the second constant temperature bath is a constant temperature water bath.

6. A thermal resistance verification system according to any one of claims 1 to 5,

the transfer mechanism further comprises: the second lifting platform and a second rotating platform arranged on the second lifting platform;

a second rotating arm is mounted on the second rotating table, a second placing frame is mounted on the second rotating arm, and the second placing frame is used for mounting a thermal resistor;

the transfer mechanism is further used for transferring the target thermal resistor mounted in the second placing frame to the first constant temperature bath, the cleaning bath or the second constant temperature bath through the second lifting table, the second rotating arm and the second placing frame so as to simultaneously realize the temperature field switching and the thermal resistor verification of the multiple thermal resistors.

7. A thermal resistance verification system according to claim 6,

when the first rotating arm and the second rotating arm perform thermal resistance transfer, the lifting heights of the first lifting platform and the second lifting platform are different.

8. A method of thermal resistance verification, applied to a thermal resistance verification system as claimed in any one of claims 1 to 7, the thermal resistance verification system comprising a transfer mechanism, the method comprising:

when a target thermal resistor which is finished in wiring is placed on a first placing frame in the transfer mechanism, controlling a first lifting table in the transfer mechanism to ascend;

when the first lifting platform rises to a set first height, a first rotating platform and a first rotating arm in the transfer mechanism are controlled to move in a matching mode, so that the target thermal resistor is close to the first constant temperature bath through a first placing frame arranged on the first rotating arm;

inserting the target thermal resistor into the first constant temperature bath through the transfer mechanism to perform thermal resistor verification;

when the target thermal resistor is determined to finish the thermal resistor verification process in the first constant temperature bath, the transfer mechanism drives the target thermal resistor to move so as to transfer the target thermal resistor from the first constant temperature bath to a cleaning bath for cleaning;

and when the target thermal resistor is determined to be cleaned, driving the target thermal resistor to move through the transfer mechanism, so that the target thermal resistor is transferred from the cleaning tank to the second constant-temperature tank for thermal resistor verification.

9. The method according to claim 8, wherein the first rotating arm comprises a primary arm and a secondary arm, and the implementation process of controlling the first rotating table and the first rotating arm in the transferring mechanism to cooperatively move so as to approach the target thermal resistor to the first thermostatic bath through a first placing frame mounted on the first rotating arm comprises the following steps:

controlling the auxiliary arm to rotate to be parallel to the main arm;

the main arm is driven to rotate through the first rotating platform, and the auxiliary arm is controlled to move along the extending direction of the main arm, so that the rotating center of the auxiliary arm moves to the position above the first constant temperature groove;

the auxiliary arm is controlled to rotate, so that the first placing frame arranged on the auxiliary arm moves to the position above the first constant temperature bath, and the target thermal resistor arranged on the first placing frame and the verification hole arranged on the first constant temperature bath are located on the same axis.

10. The method of claim 9, wherein the secondary arm comprises a telescoping rod, and the inserting the target thermal resistor into the first thermostatic bath via the transfer mechanism for thermal resistance verification comprises:

when the target thermal resistor arranged on the first placing frame and the verification hole arranged on the first constant temperature bath are positioned on the same axis, controlling the first lifting table to descend and/or controlling the telescopic rod to move so as to enable the first placing frame to be close to the first constant temperature bath, and inserting the target thermal resistor to a specified depth in the first constant temperature bath;

controlling the temperature of the first constant temperature bath at a set verification temperature through a temperature control device in the thermal resistance verification system;

and after the target thermal resistor is detected to reach thermal balance, controlling the telescopic rod to move so as to enable the target thermal resistor to continuously extend into the first constant temperature bath for a specified distance, and reading to obtain a verification result of the target thermal resistor for thermal resistor verification in the first constant temperature bath when the target thermal resistor reaches thermal balance again.

11. The method of claim 10, further comprising:

when a verification result that the target thermal resistor is subjected to thermal resistor verification in the first constant temperature bath is obtained through reading, determining that the target thermal resistor completes a thermal resistor verification process in the first constant temperature bath;

when it is determined that the target thermal resistor completes the thermal resistor verification process in the first constant temperature bath, the transfer mechanism drives the target thermal resistor to move so that the target thermal resistor is transferred from the first constant temperature bath to the cleaning bath for cleaning, including:

controlling the first lifting platform and/or the telescopic rod to move so as to enable the target thermal resistor to be far away from the first constant temperature bath;

controlling the auxiliary arm to rotate to be parallel to the main arm and controlling the main arm to rotate to be above the cleaning groove so that the target thermal resistor is close to the cleaning groove;

controlling the first lifting platform and/or the telescopic rod to move so that the target thermal resistor enters the cleaning tank;

and controlling the cleaning tank to clean the target thermal resistor.

12. The method according to claim 8, wherein a purge gas port and a connecting hole are arranged on the first rotating arm, a hollow connecting column and a thermal resistor placing hole are arranged on the first placing frame, the first placing frame and the first rotating arm are connected through the hollow connecting column and the connecting hole, and the method further comprises:

when the target thermal resistor is determined to be cleaned, the target thermal resistor in the thermal resistor placing hole is cleaned in a purging mode through the purging gas interface, the connecting hole, the hollow connecting column and the air passage formed by the thermal resistor placing hole.

13. The method of claim 8, wherein the transfer mechanism further comprises: the method comprises the following steps of installing a second lifting table, a second rotating arm and a second placing frame, wherein the second rotating table is installed on the second lifting table, the second rotating arm is installed on the second rotating table, the second placing frame is installed on the second rotating table, and the method further comprises the following steps:

when the target thermal resistor with the completed wiring is placed on the second placing frame, controlling the second lifting table to ascend;

when the second lifting platform rises to a set second height, the second rotating platform and the second rotating arm are controlled to move in a matching mode, so that the target thermal resistor is transferred to the second constant temperature bath through the second placing frame arranged on the second rotating arm;

carrying out thermal resistance verification on the target thermal resistance arranged in the second placing frame;

when the target thermal resistor in the second placing frame is determined to finish the thermal resistor verification process at the second constant temperature bath, the target thermal resistor installed in the second placing frame is transferred from the second constant temperature bath to the cleaning bath for cleaning through the matching movement of the second lifting table, the second rotating arm and the second placing frame;

when the target thermal resistor in the second placing frame is determined to finish the cleaning process, the target thermal resistor installed in the second placing frame is transferred from the cleaning tank to the first constant-temperature tank for thermal resistor verification through the second lifting table, the second rotating arm and the second placing frame in a matched mode.

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