CN112133661B - Wafer position correction device and semiconductor process equipment - Google Patents
Wafer position correction device and semiconductor process equipment Download PDFInfo
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- CN112133661B CN112133661B CN202010989232.XA CN202010989232A CN112133661B CN 112133661 B CN112133661 B CN 112133661B CN 202010989232 A CN202010989232 A CN 202010989232A CN 112133661 B CN112133661 B CN 112133661B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 12
- 230000005540 biological transmission Effects 0.000 claims abstract description 92
- 230000007246 mechanism Effects 0.000 claims abstract description 63
- 235000012431 wafers Nutrition 0.000 claims description 123
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
Abstract
The invention discloses a wafer position correction device and semiconductor process equipment. The wafer position correction device comprises a first correction element, a second correction element, a transmission mechanism and a driving mechanism, wherein the first correction element is arranged adjacent to a first side of the wafer, and the second correction element is arranged adjacent to a second side of the wafer; wherein the first side and the second side are opposite sides of the wafer; the transmission mechanism is respectively connected with the first correction element and the second correction element; the driving mechanism is in driving connection with the transmission mechanism, the transmission mechanism drives the first correction element and the second correction element to be close to each other, the wafer is corrected from the first side and the second side, and after correction is completed, the transmission mechanism drives the first correction element and the second correction element to be far away from each other. The problem that the correction efficiency is lower and the correction effect is poor in the existing wafer position correction device can be solved through the scheme.
Description
Technical Field
The present invention relates to the field of semiconductor manufacturing technology, and in particular, to a wafer position correction device and a semiconductor processing apparatus.
Background
Because the semiconductor chip belongs to an extremely precise device, the requirement on the placement position of the wafer in the production process is extremely high, and the wafer is scrapped because the wafer is slightly shifted in the placement position, which results in process failure.
At present, the existing wafer position correction device needs to be corrected on two opposite sides of a wafer respectively, and the device time of the wafer is definitely too long due to the fact that the two sides of the wafer need to be corrected in sequence; meanwhile, after one side of the wafer is corrected, the opposite side of the wafer is easily shifted, resulting in a deterioration of the overall correction effect of the device.
Disclosure of Invention
The invention discloses a wafer position correction device and semiconductor process equipment, which are used for solving the problems of lower correction efficiency and poorer correction effect of the conventional wafer position correction device.
In order to solve the problems, the invention adopts the following technical scheme:
in a first aspect, the present invention provides a wafer position correction apparatus adapted to correct a position of a wafer on a carrier. The wafer position correction device includes:
a first correction element disposed adjacent a first side of the wafer;
a second correction element disposed adjacent a second side of the wafer; wherein the first side and the second side are opposite sides of the wafer;
the transmission mechanism is respectively connected with the first correction element and the second correction element;
the driving mechanism is in driving connection with the transmission mechanism, the transmission mechanism drives the first correction element and the second correction element to be close to each other, correction is carried out on the wafer from the first side and the second side, and after correction is completed, the transmission mechanism drives the first correction element and the second correction element to be far away from each other.
In a second aspect, the present invention provides a semiconductor processing apparatus comprising a process chamber and a loading chamber, wherein the process chamber and/or the loading chamber is provided with the wafer position correction device.
The technical scheme adopted by the invention can achieve the following beneficial effects:
in the wafer position correction device disclosed by the invention, a first correction element is arranged adjacent to a first side of a wafer, and a second correction element is arranged adjacent to a second side of the wafer, wherein the first side and the second side are opposite sides of the wafer; the driving mechanism can drive the first correcting element and the second correcting element to be close to or far from each other through the transmission mechanism, so that the first correcting element and the second correcting element can be controlled to be switched between an initial position and a correcting position, and the wafer is corrected from two opposite sides.
Compared with the prior art, the wafer position correction device disclosed by the invention can correct the two opposite sides of the wafer at the same time, so that the time of a correction procedure is definitely saved, and the correction efficiency is improved; meanwhile, the correction mode also avoids the problem of opposite side offset after single-side correction, and further optimizes the correction effect of the whole correction device.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention. In the drawings:
FIGS. 1 and 4 are front cross-sectional views of a wafer position correction apparatus according to an embodiment of the present invention in a non-operating state and an operating state, respectively;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
fig. 3 and fig. 5 are top cross-sectional views of a wafer position correction device according to an embodiment of the present invention in a non-operating state and an operating state, respectively;
FIGS. 6 and 7 are perspective views of a first guide member (second guide member) according to an embodiment of the present invention from different angles;
FIG. 8 is an isometric view of a first support (second support) disclosed in an embodiment of the invention;
reference numerals illustrate:
100-carrier, 200-wafer, 300-first correction element, 400-second correction element,
510-drive element, 511-roller bearing, 512-extension, 520-first connecting arm, 530-second connecting arm, 540-first guide element, 541-first runner, 542-first mounting hole, 550-second guide element, 551-second runner, 552-second mounting hole,
600-mounting base, 610-first support, 611-first shaft, 620-second support, 621-second shaft, 630-third support, 640-fourth support,
710-telescoping connection, 711-bearing surface, 712-mating portion, 720-elastic member.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to specific embodiments of the present invention and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The technical scheme disclosed by each embodiment of the invention is described in detail below with reference to the accompanying drawings.
Referring to fig. 1 to 8, an embodiment of the present invention discloses a wafer position correction device, which is suitable for correcting a position of a wafer 200 on a carrier 100. In the present embodiment, the specific application environment of the wafer position correction device is not limited, and for example, the wafer position correction device may be applied to a loading chamber, a process chamber, and the like in a semiconductor apparatus. The disclosed wafer position correction apparatus includes a first correction element 300, a second correction element 400, a transmission mechanism, and a drive mechanism.
The first correction element 300 and the second correction element 400 are functional components of the wafer position correction device, and can be directly contacted with the wafer 200, and apply a correction driving function to the offset wafer 200 to achieve a correction effect.
The driving mechanism and the transmission mechanism are mutually matched, the driving mechanism is a power component of the wafer position correction device, the transmission mechanism is a power transmission component of the wafer position correction device, the driving mechanism is in driving connection with the transmission mechanism, and the transmission mechanism is respectively connected with the first correction element 300 and the second correction element 400, so that under the condition, the transmission mechanism can output the power action of the driving mechanism to the first correction element 300 and the second correction element 400, and the correction driving action can be applied to the wafer 200 based on the first correction element 300 and the second correction element 400, so that the offset compensation of the wafer 200 is realized.
In this embodiment, the first correction element 300 is disposed adjacent to a first side of the wafer 200, and the second correction element 400 is disposed adjacent to a second side of the wafer 200; the first side and the second side are opposite sides of the wafer 200. It should be understood that the carrier 100 has a standard position for loading the wafer 200, where the standard position is a position where the wafer 200 is located without a positional deviation. The first side and the second side refer to the peripheral area in the radial direction of the wafer 200, so that the first correction element 300 acts on the edge portion of the wafer 200 on the first side, and the second correction element 400 acts on the edge portion of the wafer 200 on the second side.
It should be noted that when the wafer 200 is loaded on the carrier 100, the wafer 200 may deviate from the carrier 100, and the deviations may exist in two opposite directions of the carrier 100, and the first side and the second side are opposite sides of the wafer 200, respectively, and it should be understood that the compensation effect of the wafer 200 on the first side and the second side is matched with the deviation of the wafer 200 in two direction areas of the carrier 100, so that the first correction element 300 and the second correction element 400 can generate an effective correction effect.
In a specific operation, the transmission mechanism drives the first correction element 300 and the second correction element 400 to approach each other, and simultaneously corrects the wafer 200 from the first side and the second side to compensate the offset of the wafer 200 on the first side and the second side. It should be understood that the first correction element 300 and the second correction element 400 can be moved between an initial position and a correction position, where the first correction element 300 and the second correction element 400 are at a distance from the edge region of the wafer 200, that is, a gap is formed between the wafer 200 and the first correction element 300 and the second correction element 400, as shown in fig. 3; these clearance spaces may be used for wafer 200 transfer operations, such as providing operating space for robot picking to avoid interference.
During the process of switching the first correction element 300 and the second correction element 400 from the initial position to the correction position, the first correction element 300 and the second correction element 400 are close to each other and respectively abut against the corresponding parts of the wafer 200 at the first side and the second side, and then respectively move continuously until moving to the correction position, and during the process of moving the first correction element 300 and the second correction element 400, the wafer 200 has an offset at the first side or the second side, and the offset is corrected and compensated by the first correction element 300 or the second correction element 400 respectively.
When both the first correction element 300 and the second correction element 400 reach the correction position, the wafer 200 is limited on both the first side and the second side thereof and is positioned at the standard position by the first correction element 300 and the second correction element 400, so that the problem of single-side correction and opposite-side offset in the prior art is avoided after the wafer 200 is corrected.
After the correction is completed, the transmission mechanism drives the first correction element 300 and the second correction element 400 to be far away from each other. It should be understood that if the first correction element 300 and the second correction element 400 are always in the correction positions, the processes including transferring the wafer 200 are hindered, and thus the first correction element 300 and the second correction element 400 need to be returned to the initial positions. In the process of switching the first correction element 300 and the second correction element 400 from the correction position to the initial position, the first correction element 300 and the second correction element 400 are far away from each other, and a gap space is left between the first correction element 300 and the second correction element 400 and the wafer 200 after the first correction element 300 and the second correction element 400 are moved to the initial position.
In the present embodiment, the first correction element 300 and the second correction element 400 are not limited to be moved linearly toward each other or linearly away from each other, and may be moved along other paths as long as the first correction element 300 and the second correction element 400 have a movement component of being moved toward each other or away from each other.
In the present embodiment, the specific types of the first correction element 300 and the second correction element 400 are not limited, and for example, they may be stopper structures, and one stopper structure may be corrected against one or two wafers 200. The carrier 100 may carry a plurality of wafers 200, and in general, the wafers 200 are sequentially arranged along a straight line in one direction, the first correction element 300 may be a first pushing rod, and the second correction element 400 may be a second pushing rod, where the first pushing rod and the second pushing rod are both extended along the arrangement direction of the plurality of wafers 200.
With this arrangement, in each calibration process, the first pushing rod can be pushed against all the wafers 200 at the first side of the wafer 200, the second pushing rod can be pushed against all the wafers 200 at the second side of the wafer 200, and the wafer position calibration device can calibrate all the wafers 200 on the carrier 100 at one time based on the first pushing rod and the second pushing rod, so as to avoid the need of multiple calibration due to the arrangement of more calibration elements. The above embodiment can certainly improve the correction efficiency.
As can be seen from the above description, in the wafer position correction device disclosed in the embodiment of the invention, the first correction element 300 is disposed adjacent to the first side of the wafer 200, and the second correction element 400 is disposed adjacent to the second side of the wafer 200, wherein the first side and the second side are opposite sides of the wafer 200; moreover, the driving mechanism can drive the first correcting element 300 and the second correcting element 400 to be close to or far from each other through the transmission mechanism, so that the first correcting element 300 and the second correcting element 400 can be controlled to be switched between the initial position and the correcting position, and the wafer 200 is corrected from two opposite sides at the same time.
Compared with the prior art, the wafer position correction device disclosed by the embodiment of the invention can correct the two opposite sides of the wafer 200 at the same time, so that the time of a correction procedure is certainly saved, and the correction efficiency is improved; meanwhile, the correction mode also avoids the problem of opposite side offset after single-side correction, and further optimizes the correction effect of the whole correction device.
In order to make the first correction element 300 and the second correction element 400 apply a relatively uniform correction effect on the wafer 200 on the first side and the second side, respectively, in an alternative, the first correction element 300 and the second correction element 400 may be symmetrically arranged along a first central axis of the carrier 100, where the first central axis is a central axis of the carrier 100 perpendicular to the surface of the wafer 200, that is, the first correction element 300 and the second correction element 400 are symmetrically arranged with respect to a standard position on the carrier 100, and the first correction element 300 and the second correction element 400 have a substantially uniform distance from the standard position, respectively.
The driving mechanism drives the transmission mechanism to drive the first correcting element 300 to move on a first path, and the driving mechanism drives the transmission mechanism to drive the second correcting element 400 to move on a second path, wherein the first path and the second path are symmetrical along a first central axis. It should be appreciated that in the case where the first correction element 300 and the second correction element 400 have a substantially uniform pitch from the standard position, respectively, the first path and the second path are symmetrical along the first central axis, that is, the distance that the first correction element 300 and the second correction element 400 move toward the wafer 200 is substantially uniform, and the first correction element 300 and the second correction element 400 implement mirror image movement along the first central axis; in this case, when the first correction element 300 and the second correction element 400 are moved to the correction station, they are symmetrically distributed on both sides of the standard position, which avoids the problem that one of them is offset or deviated from the other, thereby ensuring that the wafer 200 is corrected to the standard position.
In this embodiment, there may be various matching relationships between the driving mechanism and the transmission mechanism, for example, the driving mechanism includes two driving units, the transmission mechanism includes two transmission links, one driving unit and one transmission link form a group, and the two groups drive the first correction element 300 and the second correction element 400 to implement the correction function.
In another particular embodiment, the transmission mechanism may include a transmission element 510, a first connecting arm 520, a second connecting arm 530, and a guide assembly.
The driving control of the first correcting element 300 can be achieved by the cooperation of the transmission element 510 and the first connecting arm 520, and the driving control of the second correcting element 400 can be achieved by the cooperation of the transmission element 510 and the second connecting arm 530. Specifically, the first end of the first connecting arm 520 is connected to the first correcting element 300, the second end is hinged to the driving element 510, the first end of the second connecting arm 530 is connected to the second correcting element 400, the second end is hinged to the driving element 510, and the driving mechanism drives the driving element 510 to move. It should be understood that when the transmission element 510 is driven by the driving mechanism to move, the second end of the first connecting arm 520 and the second end of the second connecting arm 530 move along with the movement of the transmission element 510, so as to drive the first correcting element 300 located at the first end of the first connecting arm 520 to move, and drive the second correcting element 400 located at the first end of the second connecting arm 530 to move, where the first correcting element 300 and the second correcting element 400 correct the wafer 200 during the movement.
Meanwhile, the first connection arm 520 and the second connection arm 530 are symmetrically disposed at both sides of the transmission element 510, and the guide assembly is engaged with the first connection arm 520 and the second connection arm 530 or engaged with the first correction element 300 and the second correction element 400 to guide the first correction element 300 and the second correction element 400 to approach each other or to be apart from each other. It should be understood that the guiding assembly may limit the movement paths of the first connection arm 520 and the second connection arm 530, and thus indirectly limit the movement paths of the first correction element 300 and the second correction element 400, so that the first correction element 300 approaches each other to correct the wafer 200, or moves away from each other to return to the initial position; of course, the guide assembly may also directly constrain the first correction element 300 and the second correction element 400.
Based on the above-described embodiments, it is ensured that the first correction element 300 moves on the first path and the second correction element 400 moves on the second path, such that the first correction element 300 and the second correction element 400 mirror-move along the first central axis on the first side and the second side of the wafer 200.
The present embodiment is not limited to the specific type of the guide assembly, for example, the guide assembly may be an abutment panel against which both the first correction element 300 and the second correction element 400 are abutted, and in the case that the first connection arm 520 and the second connection arm 530 are far away from the abutment panel, the first correction element 300 and the second correction element 400 are gradually moved toward each other to the correction position; in the case where the first and second connection arms 520 and 530 are close to the abutment panel, the first and second correction elements 300 and 400 are far away from each other to return to the original positions.
In another specific embodiment, the guide assembly may include a first guide member 540 and a second guide member 550, each of the first guide member 540 and the second guide member 550 being rotatably disposed on the mounting base 600, and the mounting base 600 may be a chamber wall of a loading chamber, a process chamber, or the like; and the rotation axes of the first guide element 540 and the second guide element 550 pass through the surface of the wafer 200, so that the first connecting arm 520 and the second connecting arm 530 are limited in a plane approximately parallel to the surface of the wafer 200 when moving, and the first correction element 300 and the second correction element 400 can be effectively driven to correct the wafer.
The symmetrical arrangement of the first guide element 540 and the second guide element 550 along the transmission element 510 also facilitates mirror-image movement of the first correction element 300 and the second correction element 400 along the first central axis on the first side and the second side of the wafer 200.
The first guide member 540 is provided with a first slide groove 541, the first connecting arm 520 is slidably fitted in the first slide groove 541, the second guide member 550 is provided with a second slide groove 551, and the second connecting arm 530 is slidably fitted in the second slide groove 551. So configured, in conjunction with the foregoing, when the transmission element 510 moves, the first connecting arm 520 and the second connecting arm 530 slide in the first sliding groove 541 and the second sliding groove 551, and the first sliding groove 541 generates a limit constraint on the first connecting arm 520, and the second sliding groove 551 generates a limit constraint on the second connecting arm 530, so that the first guiding element 540 and the second guiding element 550 rotate to drive the first ends of the first connecting arm 520 and the second connecting arm 530 to approach each other, and the first correcting element 300 and the second correcting element 400 approach each other, and at this time, the first ends of the first correcting element 300 and the second correcting element 400 are driven to move from the initial position to the corrected position, or the first ends of the first connecting arm 520 and the second connecting arm 530 are driven to move away from each other, and the first correcting element 300 and the second correcting element 400 are driven to move from each other, and at this time, the first correcting element 300 and the second correcting element 400 are driven from the corrected position to the initial position, as shown in fig. 3 and 5.
To facilitate the above-mentioned transmission mechanism on the mounting base 600, in an alternative, the first guide member 540 is provided with the first mounting hole 542, the second guide member 550 is provided with the second mounting hole 552, the mounting base 600 may be provided with the first support 610 and the second support 620, the first support 610 is provided with the first rotation shaft 611 matching the first mounting hole 542, the second support 620 is provided with the second rotation shaft 621 matching the second mounting hole 552, the first guide member 540 is rotationally matched with the first support 610 through the matching of the first mounting hole 542 and the first rotation shaft 611, and the second guide member 550 is rotationally matched with the second support 620 through the matching of the second mounting hole 552 and the second rotation shaft 621.
Specifically, as shown in fig. 6 to 8, the first rotating shaft 611 (the second rotating shaft 621) may be fitted in the first mounting hole 542 (the second mounting hole 552) to achieve a rotation fit; of course, the mounting holes and the positions of the rotating shafts may be exchanged, and taking the first guide element 540 and the first support 610 as examples, the first rotating shaft 611 may be disposed on the first guide element 540, and the first mounting hole 542 is correspondingly disposed on the first support 610.
The first and second supports 610 and 620 may function to support the first and second guide members 540 and 550, respectively, and thus indirectly support the first and second connection arms 520 and 530, and the first and second correction members 300 and 400; meanwhile, the first support 610 and the second support 620 can also adjust the spacing of part of the components in the transmission mechanism from the mounting base 600, and thus can facilitate the adjustment of the spatial layout of these components.
Of course, the present embodiment is not limited to a specific type of structure in which the transmission mechanism provides support, for example, the transmission element 510 is movably disposed on the support structure, the transmission element 510 provides a mounting support base for other components of the transmission mechanism, and the first guide element 540 and the second guide element 550 are directly rotatably disposed on the cavity wall of the mounting base 600.
As previously described, the drive mechanism is of various types. In a specific embodiment, as shown in fig. 1, 2 and 4, the driving mechanism may include a driving module, a telescopic connection 710 and an elastic member 720, where the telescopic connection 710 is movably disposed on the mounting base 600, that is, the telescopic connection 710 may move relatively to the mounting base 600, and the driving module drives the telescopic connection 710 to move.
Meanwhile, the telescopic connecting piece 710 is provided with a bearing surface 711, the transmission element 510 is a transmission rod, the first end of the transmission rod is propped against the bearing surface 711, the second end of the transmission rod is connected with the first end of the elastic piece 720, and the second end of the elastic piece 720 is connected with the mounting base 600; the bearing surface 711 is provided with a mating portion 712, the mating portion 712 is a protruding portion or a recessed portion, and when the telescopic connecting member 710 moves, the transmission rod can pass through the mating portion 712.
Specifically, due to the elastic property of the elastic member 720, the elastic member 720 releases a force applied to the transmission rod, so that the first end of the transmission rod is always abutted against the bearing surface 711; when the driving module drives the telescopic connecting piece 710 to move, the bearing surface 711 and the first end of the transmission rod can move relatively, and when the matching part 712 abuts against the first end of the transmission rod, the transmission rod can also move telescopically due to the fact that the matching part 712 is a protruding part or a recessed part: when the matching part 712 is a protruding part, the transmission rod is propped against the protruding part to generate retraction movement, and the transmission rod is separated from the protruding part to generate extension movement; when the mating portion 712 is a concave portion, the transmission rod is pushed against the concave portion to generate an extending movement, and the transmission rod is separated from the concave portion to generate a retracting movement. Based on the movement of the transmission rod, the position correction of the wafer 200 by the first correction element 300 and the second correction element 400 can be realized by the driving of the transmission mechanism.
Of course, the present embodiment does not limit the specific type of the fitting portion 712; the specific surface configuration of the mating portion 712 is not limited in this embodiment, and in order to promote the consistency and smoothness of the movement of the transmission rod on the bearing surface 711, the surface of the mating portion 712 may be selected to be a cambered surface configuration; the specific type of the elastic member 720 may be various, such as a compression spring, a rubber elastic sheet, foam, etc.
Further, the first end of the drive rod may be provided with a roller bearing 511, through which roller bearing 511 the drive rod is in sliding engagement with the bearing surface 711. With the arrangement, the friction resistance between the transmission rod and the bearing surface 711 can be certainly reduced, the sliding smoothness of the transmission rod on the bearing surface 711 can be further optimized, and the correction efficiency of the wafer position correction device is finally improved.
In order to optimize the structural layout, in an alternative solution, the driving mechanism may further include a third supporting member 630, where the third supporting member 630 is disposed on the mounting base 600, the third supporting member 630 is provided with a receiving groove, the second end of the transmission rod is movably disposed in the receiving groove, and the elastic member 720 is disposed in the receiving groove and located between the second end of the transmission rod and the bottom end of the receiving groove. It should be appreciated that the accommodating groove may play a limiting role on the elastic member 720 and the driving rod, so that the elastic member releases the elastic action to the driving rod in the preset direction, and ensures that the driving rod moves in the preset direction, so that the driving rod abuts against the bearing surface 711. Normally, the preset direction of the transmission rod is perpendicular to the bearing surface 711. The third supporting member 630 also supports the driving lever, thus indirectly supporting the first and second connection arms 520 and 530, and the first and second correction elements 300 and 400.
Since the second end of the driving rod is movably disposed in the receiving groove, a portion of the driving rod may be protruded into the receiving groove during the moving process, so that the third supporting member 630 may interfere with the first and second connection arms 520 and 530. Based on this, in an alternative, the transmission rod may be provided with an outer extension 512, the second end of the first connection arm 520 being hinged to the outer extension 512, and the second end of the second connection arm 530 being hinged to the outer extension 512.
It should be appreciated that the extension 512 may extend beyond the interference area of the third support 630, and at this time, the first connection arm 520 and the second connection arm 530 may smoothly achieve a rotational fit relationship with the transmission rod without interfering with the third support 630. The specific type of the extension portion 512 is various, and in general, the extension portion 512 may have a link structure, so that the transmission rod may have an inverted "T" shape, as shown in fig. 2.
In the present embodiment, the arrangement of the second ends of the first and second connection arms 520 and 530 on the transmission element 510 is not limited, and alternatively, the first and second connection arms 520 and 530 may be stacked in the height direction of the transmission element 510, as shown in fig. 2; alternatively, the first and second connecting arms 520, 530 are arranged adjacent side-by-side on the transmission element 510.
In the alternative, a first end of the telescopic link 710 is connected to the drive module and a second end of the telescopic link 710 may be connected to the carrier 100. It should be understood that, with this arrangement, the driving module can further drive the carrier 100 based on driving the telescopic connection 710, so that the carrier 100 can have a telescopic function, so that the carrier 100 can adapt to the arrangement requirements in different module chambers.
In order to facilitate the ability to carry the carrier 100 within the chambers of different modules, a fourth support 640 is typically provided within the chambers, the fourth support 640 providing a support mounting basis for the carrier 100.
Further, the wafer position correction device may further include a detection mechanism, where the detection mechanism is configured to detect whether the wafer 200 is at the standard position, so as to determine whether the wafer 200 is corrected in place, and if not, correct the wafer 200 again. Specifically, the detection mechanism may realize the detection function by a structure of a photoelectric sensor, a position sensor, or the like.
Based on the wafer position correction device, the embodiment of the invention also discloses semiconductor process equipment, which comprises a process chamber and a loading chamber, wherein at least one of the process chamber and the loading chamber is provided with the wafer position correction device. The present embodiment is not limited to a specific type of semiconductor processing apparatus, and may be a diffusion apparatus, an etching apparatus, a photolithography apparatus, or the like.
The foregoing embodiments of the present invention mainly describe differences between the embodiments, and as long as there is no contradiction between different optimization features of the embodiments, the embodiments may be combined to form a better embodiment, and in view of brevity of line text, no further description is provided herein.
The foregoing is merely exemplary of the present invention and is not intended to limit the present invention. Various modifications and variations of the present invention will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are to be included in the scope of the claims of the present invention.
Claims (11)
1. A wafer position correction device adapted to perform position correction of a wafer (200) on a carrier (100), the wafer position correction device comprising:
-a first correction element (300), the first correction element (300) being arranged adjacent to a first side of the wafer (200);
-a second correction element (400), the second correction element (400) being arranged adjacent to a second side of the wafer (200); wherein the first side and the second side are opposite sides of the wafer (200);
the transmission mechanism is respectively connected with the first correction element (300) and the second correction element (400);
the driving mechanism is in driving connection with the transmission mechanism, the transmission mechanism drives the first correcting element (300) and the second correcting element (400) to be close to each other, the wafer (200) is corrected from the first side and the second side, and after the correction is completed, the transmission mechanism drives the first correcting element (300) and the second correcting element (400) to be far away from each other;
the transmission mechanism comprises a transmission element (510), a first connecting arm (520), a second connecting arm (530) and a guide assembly; the first end of the first connecting arm (520) is connected with the first correcting element (300), the second end of the first connecting arm is hinged with the transmission element (510), the first end of the second connecting arm (530) is connected with the second correcting element (400), the second end of the second connecting arm is hinged with the transmission element (510), and the driving mechanism drives the transmission element (510) to move;
the first connecting arm (520) and the second connecting arm (530) are arranged at two sides of the transmission element (510), and the guide assembly is matched with the first connecting arm (520) and the second connecting arm (530) to guide the first correction element (300) and the second correction element (400) to be close to or far from each other;
the guide assembly comprises a first guide element (540) and a second guide element (550), wherein the first guide element (540) and the second guide element (550) are rotatably arranged on a mounting base (600), and the rotation axes of the first guide element (540) and the second guide element (550) pass through the surface of the wafer (200); the first guide element (540) is provided with a first sliding groove (541), the first connecting arm (520) is in sliding fit in the first sliding groove (541), the second guide element (550) is provided with a second sliding groove (551), and the second connecting arm (530) is in sliding fit in the second sliding groove (551).
2. The wafer position correction device according to claim 1, wherein the first correction element (300) and the second correction element (400) are symmetrically arranged along a first central axis of the carrier (100), the first central axis is a central axis perpendicular to the surface of the wafer (200) of the carrier (100), the driving mechanism drives the transmission mechanism to drive the first correction element (300) to move on a first path, and the driving mechanism drives the transmission mechanism to drive the second correction element (400) to move on a second path, and the first path and the second path are symmetrical along the first central axis.
3. The wafer position correction device according to claim 2, wherein the first connecting arm (520) and the second connecting arm (530) are symmetrically disposed on both sides of the transmission element (510).
4. A wafer position correction device according to claim 3, characterized in that the first guide element (540) and the second guide element (550) are symmetrically arranged along the transmission element (510).
5. The wafer position correction device according to claim 4, wherein the first guide member (540) is provided with a first mounting hole (542), the second guide member (550) is provided with a second mounting hole (552), the mounting base (600) is provided with a first support (610) and a second support (620), the first support (610) is provided with a first rotation shaft (611) matching the first mounting hole (542), the second support (620) is provided with a second rotation shaft (621) matching the second mounting hole (552), the first guide member (540) is in a running fit with the first support (610) through the cooperation of the first mounting hole (542) and the first rotation shaft (611), and the second guide member (550) is in a running fit with the second support (620) through the cooperation of the second mounting hole (552) and the second rotation shaft (621).
6. The wafer position correction device according to any one of claims 3 to 5, wherein the driving mechanism includes a driving module, a telescopic link (710), a third support member (630), and an elastic member (720), the telescopic link (710) being movably provided to a mounting base (600), the driving module driving the telescopic link (710) to move; the telescopic connecting piece (710) is provided with a bearing surface (711), the transmission element (510) is a transmission rod, and the first end of the transmission rod is propped against the bearing surface (711); the third supporting piece (630) is arranged in the mounting base (600), the third supporting piece (630) is provided with a containing groove, the second end of the transmission rod is movably arranged in the containing groove, and the elastic piece (720) is arranged in the containing groove and is positioned between the second end of the transmission rod and the bottom end of the containing groove; the bearing surface (711) is provided with a matching part (712), the matching part (712) is a protruding part or a recessed part, and when the telescopic connecting piece (710) moves, the transmission rod can pass through the matching part (712).
7. The wafer position correction device according to claim 6, characterized in that a first end of the transmission rod is provided with a roller bearing (511), and the transmission rod is slidably fitted with the bearing surface (711) through the roller bearing (511).
8. The wafer position correction device according to claim 6, characterized in that the transmission rod is provided with an extension (512), the second end of the first connecting arm (520) is hinged to the extension (512), and the second end of the second connecting arm (530) is hinged to the extension (512).
9. The wafer position correction device according to claim 6, characterized in that a first end of the telescopic link (710) is connected to the drive module and a second end of the telescopic link (710) is connected to the carrier (100).
10. The wafer position correction device according to claim 1, wherein the carrier (100) is capable of carrying a plurality of wafers (200), the first correction element (300) is a first pushing rod, the second correction element (400) is a second pushing rod, and the first pushing rod and the second pushing rod are both disposed to extend along a layout direction of the plurality of wafers (200).
11. Semiconductor processing apparatus comprising a process chamber and a loading chamber, wherein the process chamber and/or the loading chamber has a wafer position correction device according to any one of claims 1 to 10 provided therein.
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| CN202010989232.XA CN112133661B (en) | 2020-09-18 | 2020-09-18 | Wafer position correction device and semiconductor process equipment |
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| JPH11204612A (en) * | 1998-01-09 | 1999-07-30 | Mitsubishi Electric Corp | Equipment and method for carrying wafer |
| KR20050002501A (en) * | 2003-06-30 | 2005-01-07 | 주식회사 하이닉스반도체 | apparatus for wafer alignment |
| CN103350886A (en) * | 2013-07-19 | 2013-10-16 | 深圳市华星光电技术有限公司 | Article position correcting device |
| CN209487486U (en) * | 2019-04-28 | 2019-10-11 | 德淮半导体有限公司 | A kind of device correcting wafer position |
| CN110335834A (en) * | 2019-06-03 | 2019-10-15 | 厦门通富微电子有限公司 | Wafer dryer and position-limit mechanism for wafer dryer |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6270307B1 (en) * | 1999-01-25 | 2001-08-07 | Chartered Semiconductor Manufacturing Company | Method for aligning wafers in a cassette |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11204612A (en) * | 1998-01-09 | 1999-07-30 | Mitsubishi Electric Corp | Equipment and method for carrying wafer |
| KR20050002501A (en) * | 2003-06-30 | 2005-01-07 | 주식회사 하이닉스반도체 | apparatus for wafer alignment |
| CN103350886A (en) * | 2013-07-19 | 2013-10-16 | 深圳市华星光电技术有限公司 | Article position correcting device |
| CN209487486U (en) * | 2019-04-28 | 2019-10-11 | 德淮半导体有限公司 | A kind of device correcting wafer position |
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