CN112087893A

CN112087893A - Interference unit

Info

Publication number: CN112087893A
Application number: CN201910516944.7A
Authority: CN
Inventors: 杨丛富
Original assignee: Hangzhou Hikvision Digital Technology Co Ltd
Current assignee: Hangzhou Hikvision Digital Technology Co Ltd
Priority date: 2019-06-14
Filing date: 2019-06-14
Publication date: 2020-12-15
Anticipated expiration: 2039-06-14
Also published as: CN112087893B

Abstract

The invention discloses an interference unit, comprising: a housing provided with a vent hole; the radio frequency board comprises a radio frequency substrate and a radio frequency electric device, and a heat conduction area is arranged on the back surface of the radio frequency substrate; the heat dissipation module comprises a base and a heat dissipation fin arranged on the back of the base, wherein the base comprises a first heat transfer area and a second heat transfer area, the front side of the first heat transfer area is overlapped with the heat conduction area, the second heat transfer area is positioned on the periphery of the radio frequency substrate, and heat of the first heat transfer area and the second heat transfer area is transferred to the heat dissipation fin; the radiating metal plate comprises a fixing area and a radiating area, wherein the back surface of the fixing area is overlapped on the front surface of the radio frequency substrate, the radiating area is positioned on the periphery of the radio frequency substrate, and the radiating area is overlapped on the second heat transfer area; and the power panel is overlapped on the heat dissipation metal plate, and the heat of the power panel is transferred to the heat dissipation fins through the heat dissipation area. By the arrangement, the simultaneous heat dissipation of the radio frequency and the power panel can be realized, and the heat dissipation efficiency of the interference unit is improved.

Description

Interference unit

Technical Field

The invention relates to the technical field of communication, in particular to an interference unit.

Background

The radio frequency size of interference ware is little, and the consumption is big, and heat flux density is very high, generally adopts radio frequency board back surface sintering aluminum plate to this type of product, and the form of directly laminating with metal casing is directly dispelled the heat again or adopts the forced cooling form to dispel the heat after increasing the fin on sintering aluminum plate, takes the heat out of interference ware. However, for the small-sized jammer products with plastic housing, if the protection level requirement is very high (such as meeting the IP68 requirement), the heat dissipation effect of the above heat dissipation method is poor.

Disclosure of Invention

The embodiment of the invention provides an interference unit, which is used for solving the problem that the heat dissipation effect of the interference unit with higher requirement on the protection level is poorer in the prior art.

The embodiment of the invention adopts the following technical scheme:

the jammer of the present invention includes:

a housing provided with a vent hole;

the radio frequency board comprises a radio frequency substrate and a radio frequency electric device arranged on the radio frequency substrate, and a heat conduction area is arranged on the back surface of the radio frequency substrate;

the heat dissipation module comprises a base fixed with the shell and a heat dissipation fin arranged on the back of the base, wherein the base comprises a first heat transfer area and a second heat transfer area, the front surface of the first heat transfer area is overlapped with the heat conduction area, the second heat transfer area is positioned on the periphery of the radio frequency substrate, heat of the first heat transfer area and heat of the second heat transfer area are transferred to the heat dissipation fin, and heat of the heat dissipation fin is dissipated to the outside through the vent hole;

the radiating metal plate comprises a fixing area and a radiating area, wherein the back surface of the fixing area is overlapped on the front surface of the radio frequency substrate, the radiating area is positioned on the periphery of the radio frequency substrate, and the radiating area is overlapped on the second heat transfer area; and

and the power panel is overlapped on the heat dissipation metal plate, and the heat of the power panel is transferred to the heat dissipation fins through the heat dissipation area.

Optionally, the radio frequency electric device includes a radio frequency chip disposed on the front surface of the radio frequency substrate, and a heat conductor for conducting heat of the radio frequency chip to the heat conducting area is disposed inside the radio frequency substrate.

Optionally, the radio frequency electric device further includes a component disposed on the back surface of the radio frequency substrate, the component is separated from the heat conduction area, and the first heat conduction area is provided with a first hollow portion for accommodating the component.

Optionally, the second heat transfer area is exposed to the heat dissipation fins, and the interference unit further includes a heat dissipation fan disposed on the second heat transfer area.

Optionally, the air outlet of the heat dissipation fan faces away from the heat dissipation fins, and the interference unit further includes a heat transfer plate located in front of the air outlet and connected to the second heat transfer area.

Optionally, an air deflector for guiding the air of the cooling fan to the ventilation hole is arranged inside the housing, the air deflector is located in front of the air outlet, one end of the air deflector is connected with the housing, and the other end of the air deflector abuts against the substrate.

Optionally, the power board includes a power substrate and a power device disposed on a back side of the power substrate, the front side of the power substrate is attached to the housing, and the back side of the power substrate is disposed on the front side of the fixing area.

Optionally, the heat dissipation area is attached to the housing, and the fixing area is bent toward the heat dissipation module.

Optionally, the shell including be equipped with fenestrate inferior valve, with the epitheca and the cover of inferior valve lock are established fenestrate dustcoat, heat dissipation module fixes the epitheca just follows the perforation is worn out, the dustcoat is equipped with the ventilation hole.

Optionally, a water retaining groove surrounding the substrate is formed in the back of the substrate, a water retaining plate is further arranged on the housing, the upper end of the water retaining plate is connected with the housing in a sealing mode, and the lower end of the water retaining plate abuts against the water retaining groove in a sealing mode.

Optionally, gaps between the heat dissipation region and the second heat transfer region, between the radio frequency substrate and the first heat transfer region, and between the heat dissipation metal plate and the power supply plate are filled with a heat conductive interface material.

The embodiment of the invention adopts at least one technical scheme which can achieve the following beneficial effects:

the radiating of radio frequency and power supply board simultaneously can be realized, the radiating efficiency of the interference unit is improved, the interference unit can face to high protection level (such as meeting the requirement of IP68), and the effective radiating under the protection level is realized.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural diagram of an interferer according to an embodiment of the present invention;

fig. 2 is a schematic diagram of an exploded structure of a jammer according to an embodiment of the present invention;

fig. 3 is a schematic structural view of a lower case provided in an embodiment of the present invention;

fig. 4 is a schematic structural diagram of an upper case according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of an enclosure according to an embodiment of the present invention;

fig. 6 is a schematic view of a back side structure of the heat dissipation module in one direction according to the embodiment of the present invention;

fig. 7 is a schematic view of a back side structure of the heat dissipation module in another direction according to the embodiment of the present invention;

fig. 8 is a schematic front structure view of a heat dissipation module according to an embodiment of the invention;

fig. 9 is a schematic back side view of the rf board according to the embodiment of the present invention;

fig. 10 is a schematic structural diagram of a heat dissipation metal plate according to an embodiment of the present invention;

fig. 11 is a schematic structural diagram of the jammer with the cover removed according to the embodiment of the present invention.

Wherein the following reference numerals are included in figures 1-11:

a housing-1; a heat dissipation module-2; a radio frequency board-3; a heat dissipation metal plate-4; a power panel-5; a radiator fan-6; a heat transfer plate-7; a lower shell-11; -an upper shell-12; a housing-13; a vent-14; a water baffle-15; an air deflector-16; perforation-111; a substrate-21; heat radiation fins-22; a first heat transfer zone-211; a second heat transfer zone-212; a water retaining groove-213; a first hollowed-out portion-214; a radio frequency substrate-31; -32 heat transfer areas; a component-33; -41, an immobilization zone; heat sink region-42.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1 and fig. 2, the jammer of the present invention includes a housing 1 having a vent 14, and a heat dissipation module 2, a radio frequency board 3, a heat dissipation metal plate 4, and a power board 5 respectively disposed in the housing 1. As shown in fig. 9, the radio frequency board 3 includes a radio frequency substrate 31 provided with a thermal conduction region 32 on the back surface thereof and a radio frequency electric device 33 provided on the radio frequency substrate 31. As shown in fig. 6-8, the heat sink module 2 is disposed on the back of the rf board 3, and includes a base 21 and heat dissipation fins 22 disposed on the back of the base 21. The base 21 is fixedly connected with the housing 1, and the base 21 includes a first heat transfer area 211 overlapping the heat conduction area 32 at the front surface and a second heat transfer area 212 located at the periphery of the radio frequency substrate 31. As shown in fig. 10, the heat dissipation metal plate 4 includes a fixing region 41 stacked on the front surface of the rf substrate 31 and a heat dissipation region 42 located at the periphery of the rf substrate 31, and the heat dissipation region 42 is stacked on the second heat transfer region 212. The power supply board 5 is stacked on the heat dissipation metal plate 4. In the interference unit, the heat of the rf board 3 can be conducted to the first heat transfer area 211 through the heat conduction area 32, and then conducted to the heat dissipation fins 22 through the first heat transfer area 211. The heat of the power board 5 is conducted to the second heat transfer area 212 through the heat dissipation area 42, and then conducted to the heat dissipation fins 22 through the second heat transfer area 212. The heat of the radiator fins 22 is finally dissipated to the outside through the vent holes 14. Therefore, by the scheme of the invention, the simultaneous heat dissipation of the radio frequency board 3 and the power board 5 can be realized, and the heat dissipation efficiency of the interference unit is improved.

To achieve the above object, the various parts of the interference unit can be arranged in various ways, and the structure of each part will be described in detail below by taking a specific embodiment as an example.

As shown in fig. 3 to 5, the housing 1 includes a lower case 11, an upper case 12, and a cover 13. The lower shell 11 is buckled with the upper shell 12 to form a mounting cavity for mounting all the components. The lower case 11 is provided with a through hole 111 near the front end (the end near the rf antenna), and the through hole 111 is a substantially rectangular hole. The lower shell 11 is also provided with a water baffle 15 at the position surrounding the perforation 111, and the water baffle 15 and the lower shell 11 can be of an integrated structure, so that the upper end of the water baffle 15 is hermetically connected with the outer edge of the perforation 111 of the lower shell 11, and the structure is simple. The lower end of the breakwater 15 extends obliquely into the lower case 11.

The cover 13 is fastened to the through hole 111 of the lower case 11 to shield the through hole 111. The housing 13 includes a top surface and a side surface surrounding the top surface, the side surface is connected to the lower case 11, and the top surface protrudes from the lower case 11 to reserve an accommodating space for the heat dissipation module 2. The outer cover 13 is provided with ventilation holes 14 on both the side far from the front end of the lower case 11 and the side near the front end of the lower case 11, and these two sides are disposed obliquely to further facilitate heat dissipation.

The substrate 21 of the heat dissipation module 2 may be made of other high thermal conductivity materials such as aluminum and copper. The substrate 21 includes a rectangular substrate surface, which is bent into a step along the length direction, wherein the higher surface is the first heat transfer area 211, and the lower surface is the second heat transfer area 212. A first hollow portion 214 is disposed at one side of the first heat transfer area 211, and a portion of the first heat transfer area 211 not hollow is formed in a substantially concave shape. The periphery of the first heat transfer area 211 is sequentially provided with three circles of connecting holes, the connecting holes of the inner circle are positioned in the first hollow-out part 214 and are arranged on the connecting lugs protruding towards the inner side of the first heat transfer area 211, the connecting holes of the middle circle are arranged on the boss protruding towards the front side of the substrate 21, and the connecting holes of the outer circle are arranged on the connecting lugs protruding towards the outer side of the first heat transfer area 211.

The base 21 also includes base sidewalls that surround the first heat transfer region 211 and extend to the second heat transfer region 212, with the base sidewalls reinforcing the strength of the base surface. The side wall of the substrate can be provided with wire outlet holes penetrating through the two surfaces and used for providing power for the cooling fan 6, and meanwhile, the wire outlet holes are sealed by sealant after being assembled, so that the sealing performance of the parts is ensured.

A water retaining groove 213 is provided around the periphery of the substrate surface, wherein the water retaining groove 213 is located on the substrate sidewall at the portion where the substrate sidewall is provided. The lower end of the water baffle 15 is abutted against the water baffle groove 213 and is bonded by a sealant, the water baffle 15 and the ground surface are waterproof, water or dust is prevented from permeating from the water baffle groove 213, the waterproof treatment of other areas of the shell 1 is combined, the internal waterproofness of the whole machine is formed, the waterproof and dustproof requirements are met, the interference device can effectively radiate heat under a high protection level (such as IP68), and the reliability of the whole machine is improved.

The radiator fins 22 include a rectangular box body and fins on the rectangular box body. The length and the width of the rectangular box body are slightly smaller than those of the first heat transfer area 211, the heat dissipation fins 22 are fixed on the back of the first heat transfer area 211, and the second heat transfer area 212 is exposed outside the heat dissipation fins 22, so that the heat dissipation fan 6 can be installed on the back of the second heat transfer area 212, and the heat dissipation fan 6 performs air cooling heat dissipation, thereby further improving the heat dissipation efficiency of the interference device.

The heat dissipation fan 6 may be a high protection fan 6 meeting IP68, or an air cooler meeting other waterproof and dustproof requirements, such as a piezoelectric fan 6 or a jet fan 6. An air outlet (which may be an air blowing port or an air suction port) of the heat dissipation fan 6 may be back to the heat dissipation fins 22, and the heat inside the interference unit is blown out by the heat dissipation fan 6. At this time, the heat transfer plate 7 (as shown in fig. 6) is further disposed in the second heat transfer area 212, the heat transfer plate 7 is perpendicular to the second heat transfer area 212 and extends to the front of the air outlet, and the heat transfer plate 7 transfers heat of the second heat transfer area 212, thereby further improving heat dissipation efficiency. The heat transfer plate 7 can be a metal plate, the heat transfer plate 7 is fixedly connected with the second heat transfer area 212 through a screw, and the heat dissipation fan 6 is fixedly connected with the heat transfer plate 7, so that the structure is simple, and the operation is convenient.

In addition, the air deflector 16 may be disposed on the side of the through hole 111 of the lower case 11, specifically, on the side away from the front end of the lower case 11, and the air deflector 16 is located in front of the air outlet of the heat dissipation fan 6, so that the air deflector 16 guides the air to improve the heat dissipation efficiency. The air deflector 16 can be an inward concave arc-shaped surface, and the water baffle 15 on one side far away from the front end of the lower shell 11 can be concave to form the air deflector 16, namely the water baffle 15 and the air deflector 16 are of an integrated structure, so that the structure is simple and the processing is convenient.

The length and width of the rf substrate 31 are substantially the same as the length and width of the first heat transfer region 211. The outer ring of the radio frequency substrate 31 is provided with a connecting hole, and a screw penetrates through the connecting hole of the radio frequency substrate 31 and the connecting hole of the inner ring of the first heat transfer region 211 to fixedly connect the radio frequency substrate 31 and the substrate 21. The back surface of the radio frequency substrate 31 is copper-plated to form a copper-plated area in a substantially concave shape, and the copper-plated area forms a heat-transfer area 32. After the radio frequency substrate 31 and the base 21 are fixedly connected, the heat conduction area 32 faces the first heat conduction area 211 and overlaps with the first heat conduction area 211. When there is a gap between the heat conduction region 32 and the first heat transfer region 211, a heat conduction interface material may be filled in the gap, and the heat conduction interface material may be a heat conduction gel or a heat conduction silicone grease, so as to improve heat transfer efficiency. Typically the thickness of the thermally conductive interface material is less than or equal to 0.1 mm.

The rf electrical device includes an rf chip and a component 33. The radio frequency chip is fixed on the front surface of the radio frequency substrate 31 and faces away from the heat dissipation module 2. At this time, a heat conductor may be disposed inside the rf substrate 31, for example, copper is embedded inside the rf substrate 31, and the heat of the rf chip is conducted to the heat conducting area 32 in the form of a via hole, and then conducted from the heat conducting area 32 to the heat dissipation module 2 for heat dissipation.

The components 33 may be a variety of resistors, capacitors, inductors, crystal oscillators, ceramic filters, mechanical switches, connectors, diodes, transistors, and thyristors. The component 33 is arranged on the back surface of the radio frequency substrate 31, is specifically and intensively arranged in a non-copper-spreading area on one side of the copper-spreading area, is separated from the copper-spreading area, and is prevented from being short-circuited with the copper-spreading area. After the rf board 3 is fixed to the heat dissipation module 2, the component 33 is located in the first hollow portion 214 of the first heat transfer area 211. The first hollow portion 214 may also be provided with a thermal interface material to transfer heat of the component 33 to the substrate 21, thereby enhancing heat dissipation.

The heat dissipation metal plate 4 is made of copper, and is rectangular, and is bent into a one-step shape along the length direction, and the higher surface forms the fixing area 41 and the lower surface forms the heat dissipation area 42. The periphery of the fixed area 41 is provided with three circles of connecting holes, the inner circle and the middle circle of connecting holes penetrate through the back and the front of the fixed area 41, and the outer circle of connecting holes are arranged on the protruding columns on the front of the fixed area 41. Screws are inserted through the center ring connection holes of the fixing region 41 and the center ring connection holes of the first heat transfer region 211 to fix the heat dissipation metal plate 4 to the base 21. After the heat dissipation metal plate 4 is fixed, a small gap or no gap is left between the heat dissipation metal plate 4 and the radio frequency substrate 31. At this time, the fixing area 41 is provided with a second hollow portion for avoiding the rf chip, and the rf chip passes through the second hollow portion.

The length and width of the heat dissipation area 42 are substantially the same as those of the second heat transfer area 212, and after the heat dissipation metal plate 4 is fixed, the heat dissipation area 42 is overlapped on the second heat transfer area 212. When a gap is left between the heat dissipation region 42 and the second heat transfer region 212, a heat conduction interface material is filled in the gap, so that the heat conduction efficiency of the heat dissipation region 42 and the second heat transfer region 212 is improved.

The power supply board 5 includes a power supply substrate and a power supply device. The length and width of the power supply substrate are substantially the same as those of the fixing section 41. The power substrate is provided with a connecting hole, and a screw penetrates through the connecting hole of the power substrate and the connecting hole of the inner ring of the fixing area 41, so that the power substrate is fixed on the front surface of the fixing area 41 of the heat dissipation metal plate 4.

The power supply device is the same as a general power supply device. The power supply device is arranged on the back of the power supply substrate, the power supply substrate is fixed on the heat dissipation metal plate 4, the power supply device is attached to the heat dissipation metal plate 4, and a heat conduction interface material is filled in a gap between the power supply substrate and the heat dissipation metal plate 4.

After the components are assembled, screws penetrate through the outer ring connecting holes of the first heat transfer area 211, the outer ring connecting holes of the fixing area 41 and the upper shell 12 connecting holes, and the components are fixed in the upper shell 12. After the fixing, the heat dissipation fins 22 are extended out from the through holes 111 (shown in fig. 11), the heat dissipation fins 22 are covered by the housing 13, and the front surface of the power substrate and the front surface of the heat dissipation area 42 are both attached to the inner surface of the upper case 12, so as to reduce the overall thickness of the housing 1 at the position where the heat dissipation module 2 is disposed as much as possible.

After the interference unit works, the heat dissipation path of the radio frequency board 3 is as follows: rf chip → rf substrate 31 → thermal interface material (between the thermal conductive region 32 and the first thermal conductive region 11) → base 21 → heat sink fin 22 → heat sink fan 6 → external environment. The heat dissipation path of the power panel 5 is as follows: power supply device → thermal interface material (between power supply substrate and heat dissipation metal plate 4) → heat dissipation metal plate 4 → thermal interface material (between heat dissipation metal plate 4 and base 21) → base 21 → heat dissipation fins 22 → heat dissipation fan 6 → external environment.

Of course, in other embodiments, the power board 5 may also be disposed between the substrate 21 and the heat dissipation metal plate 4, and the power board 5 and the rf board 3 are located in the same layer; or, the radio frequency component 33 and the radio frequency chip are both arranged on the front surface of the radio frequency substrate 31; alternatively, the water deflector 15 and the air deflector 16 may be separate plates.

The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A jammer, comprising:

a housing provided with a vent hole;

2. The jammer of claim 1, wherein the rf electrical device includes an rf chip disposed on a front side of the rf substrate, and wherein the rf substrate has a thermal conductor disposed therein for conducting heat from the rf chip to the thermal conductive area.

3. The jammer of claim 2, wherein the rf electrical device further comprises a component disposed on a back side of the rf substrate, the component being separated from the thermal conduction region, the first thermal conduction region having a first cutout to receive the component.

4. The jammer of claim 1, wherein the second heat transfer region is exposed to the heat sink fins, the jammer further comprising a heat sink fan disposed on the second heat transfer region.

5. The jammer of claim 4, wherein the outlet of the heat dissipation fan faces away from the heat dissipation fins, the jammer further comprising a heat transfer plate located in front of the outlet and connected to the second heat transfer area.

6. The jammer of claim 5, wherein a wind deflector is disposed inside the housing to guide wind of the heat dissipation fan to the vent, the wind deflector is located in front of the wind outlet, one end of the wind deflector is connected to the housing, and the other end of the wind deflector abuts against the base.

7. The jammer of claim 1, wherein the power board includes a power substrate and a power device disposed on a back side of the power substrate, wherein a front side of the power substrate is attached to the housing and a back side of the power substrate is disposed on a front side of the mounting area.

8. The jammer of claim 7, wherein the heat dissipating region is attached to the housing and the fastening region is bent toward the heat dissipating module.

9. The jammer of claim 1, wherein the housing includes a lower shell having a through hole, an upper shell fastened to the lower shell, and an outer cover covering the through hole, the heat dissipation module is fixed to the upper shell and extends through the through hole, and the outer cover has the vent hole.

10. The jammer of claim 1, wherein the back of the base has a water retaining groove around the base, and the housing further has a water retaining plate, wherein the upper end of the water retaining plate is sealingly connected to the housing, and the lower end of the water retaining plate is sealingly abutted against the water retaining groove.

11. The jammer of any one of claims 1-10, wherein gaps between the heat dissipation region and the second heat transfer region, between the radio frequency substrate and the first heat transfer region, and between the heat dissipation metal plate and the power supply plate are filled with a thermally conductive interface material.