CN208425084U - Automatic navigator and its electric-control system - Google Patents
Automatic navigator and its electric-control system Download PDFInfo
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- CN208425084U CN208425084U CN201820819965.7U CN201820819965U CN208425084U CN 208425084 U CN208425084 U CN 208425084U CN 201820819965 U CN201820819965 U CN 201820819965U CN 208425084 U CN208425084 U CN 208425084U
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- circuit board
- electric
- control system
- heat
- radiating surface
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Abstract
The utility model discloses a kind of electric-control system of automatic navigator, the radiator of heat transfer cooperation is formed including circuit board assemblies and with circuit board assemblies, circuit board assemblies include the first circuit board being cascading from the bottom to top, heat sink and the second circuit board being electrically connected with first circuit board, wherein, it is formed and is thermally isolated between first circuit board and heat sink, form heat transfer cooperation between heat sink and second circuit board.Meanwhile the invention also discloses a kind of automatic navigators.The circuit board layout scheme of setting is stacked by using two layers, on the one hand the installation space of circuit board can be saved, on the other hand heat sink is embedded between two-tier circuit plate to radiate to the circuit board for being wherein equipped with core element, it is ensured that good heat dissipation effect.
Description
Technical field
The utility model relates to vehicle electronic device technical fields, and in particular to a kind of automatic navigator and its automatically controlled system
System.
Background technique
The main composition part of vehicle multimedia navigation product is display panel and electric-control system, electric-control system it is all polynary
Device and functional module are integrated on same circuit board, and this design scheme is on the one hand to cause circuit there are many drawbacks
The overall dimensions of plate are larger, cause the overall dimensions of vehicle multimedia navigation product excessive, and then make to the installation of product adaptation
At difficulty, on the other hand it is that each component is arranged on same substrate, good running environment can not be formed, such as micro-
Processor (MCU) and power amplifier module are all core components, can generate amount of heat during product use, radiate not in time
If will be greatly reduced the operational efficiency of automatically controlled host, to influence the normal use of product.
Utility model content
The main purpose of the utility model is the electric-control system for proposing a kind of automatic navigator, it is intended to be solved in the prior art
Electric-control system layout type occupied space is big and the problem of heat dissipation effect difference.
To achieve the above object, the utility model proposes a kind of electric-control systems of automatic navigator comprising circuit board group
Part and the radiator that heat transfer cooperation is formed with the circuit board assemblies, the circuit board assemblies include successively layer from the bottom to top
First circuit board, heat sink and the second circuit board being electrically connected with the first circuit board of folded setting, wherein first circuit board
It is formed and is thermally isolated between the heat sink, form heat transfer cooperation between the heat sink and the second circuit board.
Preferably, female connectors are arranged by row's needle between the first circuit board and the second circuit board to be electrically connected,
Described in row's needle row's female connectors include arranging needle and the row that be adapted to row's needle is female, one of row's needle and row mother, which are arranged, to exist
On the first circuit board, another is arranged on the second circuit board.
Preferably, the heat sink is heat-dissipating aluminium plate, and the first circuit board is equipped with the support for supporting the heat sink
Table top.
Preferably, power amplifier element is set on the first circuit board, on the second circuit board setting micro-control unit and
IC chip, and the signal shielding cover for covering the IC chip is provided on the second circuit board.
Preferably, the radiator is shell structure, is configured to swell and have for accommodating towards side
The inner cavity of circuit board assemblies is stated, radiator part corresponding to the bottom surface of the inner cavity constitutes main radiating surface, the main heat dissipation
Face includes the power amplifier radiating surface and MCU radiating surface for being respectively formed with several radiating fins, the radiating fin on the MCU radiating surface
Group is combined into MCU radiating fin group, the radiating fin on the power amplifier radiating surface adjacent thereto of the periphery of the MCU radiating fin group
Heat-insulated gap is provided between piece.
Preferably, it is equipped on the main radiating surface with position corresponding to the heat-insulated gap several along MCU heat dissipation
The periphery of fins set is spaced apart and in leptosomatic heat dam.
Preferably, the radiating fin is successively parallel on the main radiating surface and is equally spaced.
Preferably, the main radiating surface is equipped with several thermal vias, and the thermal vias is distributed in two radiating fins
Between piece.
The utility model also proposes a kind of automatic navigator, including shell, display panel and aforementioned any one technical solution
In electric-control system.
Electric-control system provided by the utility model suitable for automatic navigator stacks the electricity of setting by using two layers
Road plate arrangement, on the one hand can save the installation space of circuit board, and heat dissipation is on the other hand embedded between two-tier circuit plate
Plate is to radiate to the circuit board for being wherein equipped with core element, it is ensured that core element normal work under high temperature environment
Make;In addition, also largely increasing radiating surface by using the design scheme that shell and radiator structure become one
Product, and heat-delivery surface open in the work environment also substantially increases radiating efficiency.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of one embodiment of automatic navigator of the utility model;
Fig. 2 is the structural schematic diagram of one embodiment of circuit board assemblies in the electric-control system of the utility model;
Fig. 3 is the partial structural diagram of one embodiment of circuit board assemblies in the electric-control system of the utility model.
Fig. 4 is the structural schematic diagram of one embodiment of radiator in the electric-control system of the utility model;
Fig. 5 is the partial structural diagram of radiator shown in Fig. 4;
Fig. 6 is the partial enlargement diagram of structure shown in A in Fig. 5.
Specific embodiment
The embodiments of the present invention are described more fully below, the example of embodiment is shown in the accompanying drawings, wherein from beginning extremely
Last phase indicates identical element or element with the same function with label.Embodiment below with reference to attached drawing description is to show
Example property, it is intended to for explaining the utility model, and should not be understood as limiting the present invention, based in the utility model
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts,
It fall within the protection scope of the utility model.
In order to solve the above technical problems, being installed in the vehicle the spy in portion the utility model proposes a kind of automatic navigator
(such as console of vehicle) is set in positioning, by the control device and other related equipment communication connection with vehicle, to realize
Such as running information is shown, digital map navigation, audio and video playing, back-up video are shown and many application functions such as immediate communication.Before
The global shape construction for stating automatic navigator can be designed to all Suresh Kumars, to adapt to the installation requirement of different model vehicle.
As a wherein preferable examples structure for the automatic navigator, referring to Fig. 1 and Fig. 2, the automatic navigator is generally rectangular, tool
There is the backside structure of smooth faceplate part and protrusion.Specifically, the automatic navigator includes shell 100, display panel (figure
Do not show) and electric-control system, which includes circuit board assemblies 300 and forms heat transfer cooperation with the circuit board assemblies 300
Radiator 200, it is to be understood that herein " heat transfer cooperation " refer specifically on circuit board assemblies 300 have radiating requirements
Electronic component and radiator 200 form the matching relationship contacted so that electronic component mainly passes through the side of heat transfer
Formula realizes heat transfer to radiator 200, meets heat dissipation design requirement.
Specifically, circuit board assemblies 300 include first circuit board 310, the heat sink 320 being cascading from the bottom to top
With the second circuit board 330 being electrically connected with first circuit board 310, wherein formed between first circuit board 310 and heat sink 320
It is thermally isolated, forms heat transfer cooperation between heat sink 320 and second circuit board 330.As shown in Figure 1,310 structure of first circuit board
It is in the shape knot of rectangle setting with biggish component loaded area, in the present embodiment at the mainboard structure of electric-control system
Structure is as an example, wherein second circuit board 330 has occupied about the loaded area of half, and is arranged on first circuit board 310
There are outlet 312, multi-functional socket 313 and line socket mouth 314 for communication connection etc., with realization and external equipment
Connection, it is to be understood that the above-mentioned associated socket enumerated is only for example, be not to function on first circuit board 310 insert
The limitation of mouth.Heat sink 320 is arranged between first circuit board 310 and second circuit board 330, is mainly used for the second electricity
Core component heat dissipation on road plate 330, and being thermally isolated between first circuit board heat sink 320 and heat sink 320 is logical
It crosses and keeps certain intervals to realize therebetween, to reduce the heat affecting between two-tier circuit plate.
In conjunction with Fig. 3, in the preferred embodiment, above-mentioned heat sink 320 is heat-dissipating aluminium plate, and first circuit board 310 is equipped with
The supporting bable tops 316 of the heat sink 320 are supported, wherein 320 support level of heat sink at one are illustrated only in attached drawing, in order to keep scattered
The position of hot plate 320 is stablized, and is additionally provided with other supporting bable tops on first circuit board 310, but the angle by view is influenced place
In not visible state.Supporting bable tops 316 in the present embodiment are actually one of the connection pillar on first circuit board 310
Face can also be supported certainly by other any suitable mesa structures (such as boss, step surface) to be formed to heat sink 320
Effect, to form suitable insulated space between first circuit board 310 and heat sink 320.
Also, in order to keep the independence between first circuit board 310 and second circuit board 330, while reducing heat biography
The influence led is arranged female connectors by row's needle between first circuit board 310 and second circuit board 330 and is electrically connected, wherein row needle row
Female connectors include arranging needle 331 and mother row 311 that be adapted to row's needle 331, and in the present embodiment, 311 setting of mother row is electric first
On road plate 310, row needle 331 be arranged on second circuit board 330, certainly, in other embodiments, can also will row mother 311 with
The position of row's needle 331 is exchanged.As shown in Figure 2,3, the side of 310 longer sides of first circuit board is arranged in row's needle row female connectors,
To provide convenience to the disassembling operations between first circuit board 310 and second circuit board 330.
In addition, in order to adapt to the cooling requirements of the circuit board layout scheme of two layers of stacking setting in the utility model, in member
In the location arrangements scheme of device, the present embodiment has also been made and being correspondingly improved, i.e., power amplifier element is arranged on first circuit board 310
(such as power tube 315) micro-control unit and IC chip (not shown) are arranged on second circuit board 330, by by signal, data
Processing element is arranged on independent second circuit board 330, and configures the heat sink 320 independently to radiate, can make second circuit
Component on plate 330 is steadily run.And in order to realize that signal shielding acts on, it is provided on second circuit board 330 and covers IC
The signal shielding cover 332 of chip, such as in embodiment by taking adjacent signal shielding cover 332 at setting two as an example.
Referring next to fig. 4 to fig. 6, as the core thermal component of electric-control system, aforementioned radiator 200 is shell knot
Structure, for the benefit of metal material of heat transfer, for example the light materials such as aluminium alloy, almag can be used and be made, it is configured to
It is swelled towards side and there is the inner cavity for accommodating circuit board assemblies 300, radiator portion corresponding to the bottom surface of the inner cavity
Divide and constitute main radiating surface, which is in open state in the installation environment of automatic navigator, therefore can be improved scattered
The thermal efficiency.
Specifically, main radiating surface includes power amplifier radiating surface 210 and the MCU heat dissipation for being respectively formed with several radiating fins 230
Face 220, in the assembly finished product of automatic navigator, (such as the power tube corresponding with the position of power discharging device of power amplifier radiating surface 210
315), MCU radiating surface 220 is corresponding with the position of microprocessor (MCU), and the radiating fin 230 on MCU radiating surface 220 combines
For MCU radiating fin group, between the radiating fin on the power amplifier radiating surface 210 adjacent thereto of the periphery of the MCU radiating fin group
It is provided with heat-insulated gap 221.According to the radiating requirements of electric control element during operation, main radiating surface is divided into multiple regions,
The influence of produced heat between different electric control elements can be reduced.In the present embodiment, radiating fin 230 is used as main heat sink knot
Structure can realize power amplifier radiating surface 210 and MCU radiating surface 220 in the case where heat-insulated gap 221 are arranged to a certain extent
Possessed independent heat sinking function is avoided the occurrence of with adapting to the radiating requirements of different components because of a part of component calorific value
Height, another part component calorific value is low and the influence that causes heat dissipation effect bad.In addition, radiator 200 is structure as a whole,
Realize that different heat sinking functions, this design scheme are gone back simultaneously by using the radiating fin 230 that subregion, discontinuous are arranged
Product structure design is simplified, production cost is advantageously reduced.
Radiating fin 230 is successively parallel on main radiating surface and is equally spaced, as better embodiment, several radiating fins
Piece 230 is arranged along length direction as shown in Figure 4, the height of radiating fin 230 and adjacent distance between the two according to
Actual conditions selection, this is not restricted.In addition, being set on main radiating surface to reinforce the heat spreading function that air-flow exchanges and reaches
There are several thermal vias 240, thermal vias 240 is distributed between two radiating fins 230.But it should be noted that thermal vias
240 should avoid contacting on main radiating surface with element device and the region radiated, therefore the arrangement mode of thermal vias 240 have it is random
Property and have both selectivity.
In conjunction with Fig. 6, in a better embodiment, in order to obstruct the conduction of the heat between different heat dissipation regions, aforementioned
On the basis of radiator 200 has heat-insulated gap 221, if being equipped on main radiating surface with position corresponding to heat-insulated gap 221
It is dry to be spaced apart along the periphery of MCU radiating fin group and be in leptosomatic heat dam 222, as shown, the heat dam 222 is
Through structure, possessed connection structure size is small between adjacent two heat dam 222, reduces power amplifier radiating surface to a greater extent
Heat transfer between 210 and MCU radiating surface 220 meets the functional requirement independently to radiate.Meanwhile be added the heat dam 222 this
Structure design, also adds the airflow area being distributed on main radiating surface, by heat-insulated and heat sinking function together as one.It should manage
It solves, it is only a preferred embodiment that the heat dam 222 being integrally rectangle is shown in figure, and in practical applications, heat dam 222 is also
Can be presented by other any suitable contour structures, such as arc, the utility model to this with no restriction.
In another better embodiment, by reasonably selecting the phase between power amplifier radiating surface 210 and MCU radiating surface 220
Heat dissipation effect is improved to reduce because radiator 200 is using influence brought by integral structure to positional relationship.Specifically,
Power amplifier radiating surface 210 includes the main radiating surface 211 of power amplifier and the auxiliary radiating surface 212 of power amplifier, relative to the main radiating surface 211 of power amplifier, power amplifier
Auxiliary radiating surface 212 occupies most of heat dissipation area, and the main radiating surface 211 of power amplifier is used to be engaged with power amplifier component, thus
The heat that power amplifier component generates is conducted to the main radiating surface 211 of power amplifier and the auxiliary radiating surface 212 of power amplifier, MCU radiating surface 220
Among the auxiliary radiating surface 212 of power amplifier, is realized and be thermally isolated by the heat-insulated gap 221 referred in previous embodiment, the main heat dissipation of power amplifier
Face 211 and MCU radiating surface 220 are spaced setting, such heat dissipation region on the length direction (seeing Fig. 4) of radiator 220
The heat that layout mainly considers that power amplifier generates impacts microprocessor (MCU).Specifically, the main radiating surface 211 of power amplifier
Positioned at one end Jiao Chu of main radiating surface.Also, in further embodiment, the inner cavity that is constructed by radiator 200
Side in position corresponding to the main radiating surface 211 of power amplifier, equipped with the fixation hole 213 for fixing power amplifier element, using tight
The fixation of power amplifier element can be realized in firmware outside, to guarantee that power amplifier element and radiating surface are in close contact, improves heat transfer
Efficiency, while also having the advantages that installation is easy to operate.
Finally, as the automatic navigator connecting with controller of vehicle and peripheral device communication, many function are needed to configure
It can interface.As a specific embodiment, the auxiliary radiating surface 210 of power amplifier be equipped with power outlet mouth 250, multi-function jack mouth 260,
Radio reception socket port 270 and external antenna mouth 280, to meet the communication connection demand of automatically controlled host.In addition to this it is possible to
Configure other equipment connection ports, quantity and position determines according to actual conditions, herein also with no restriction.
In conclusion elaborating the inventive concept of the utility model by specific embodiment, stacked by using two layers
The circuit board layout scheme of setting, on the one hand can save the installation space of circuit board, on the other hand between two-tier circuit plate
Heat sink is embedded in radiate to the circuit board for being wherein equipped with core element, it is ensured that core element is under high temperature environment
It works normally;In addition, also largely being increased by using the design scheme that shell and radiator structure become one
Heat dissipation area, and heat-delivery surface open in the work environment also substantially increases radiating efficiency;Further, it is respectively set
Power amplifier radiating surface and MCU radiating surface, and interval is formed between the two, to adapt to the radiating requirements of different components.
Therefore above part for being only the utility model or preferred embodiment, either text or attached drawing cannot all limit
The range of the utility model protection processed is illustrated under all designs with one entirety of the utility model using the utility model
Equivalent structure transformation made by book and accompanying drawing content, or directly/be used in other related technical areas indirectly and be included in this
In the range of utility model protection.
Claims (9)
1. a kind of electric-control system of automatic navigator, which is characterized in that including circuit board assemblies and with the circuit board assemblies shape
At the radiator that heat transfer cooperates, the circuit board assemblies include the first circuit board being cascading from the bottom to top, dissipate
Hot plate and the second circuit board being electrically connected with the first circuit board, wherein formed between first circuit board and the heat sink
It is thermally isolated, forms heat transfer cooperation between the heat sink and the second circuit board.
2. electric-control system as described in claim 1, which is characterized in that between the first circuit board and the second circuit board
Female connectors electrical connection is arranged by row's needle, wherein row's needle row's female connectors include the row for arranging needle and being adapted to row's needle
Mother, one of row's needle and row mother are arranged on the first circuit board, another is arranged on the second circuit board.
3. electric-control system as described in claim 1, which is characterized in that the heat sink is heat-dissipating aluminium plate, first circuit
Plate is equipped with the supporting bable tops for supporting the heat sink.
4. electric-control system as described in claim 1, which is characterized in that power amplifier element is set on the first circuit board, it is described
Micro-control unit and IC chip are set on second circuit board, and is provided on the second circuit board and covers the IC chip
Signal shielding cover.
5. electric-control system as described in claim 1, which is characterized in that the radiator is shell structure, is configured to
It is swelled towards side and there is the inner cavity for accommodating the circuit board assemblies, radiator corresponding to the bottom surface of the inner cavity
Part constitutes main radiating surface, and the main radiating surface includes power amplifier radiating surface and the MCU heat dissipation for being respectively formed with several radiating fins
Face, the radiating fin group on the MCU radiating surface are combined into MCU radiating fin group, the periphery of the MCU radiating fin group and it is adjacent
Heat-insulated gap is provided between radiating fin on the close power amplifier radiating surface.
6. electric-control system as claimed in claim 5, which is characterized in that on the main radiating surface and corresponding to the heat-insulated gap
Position be equipped with several peripheries along the MCU radiating fin group and be spaced apart and in leptosomatic heat dam.
7. such as electric-control system described in claim 5 or 6, which is characterized in that the radiating fin on the main radiating surface according to
It is secondary parallel and be equally spaced.
8. such as electric-control system described in claim 5 or 6, which is characterized in that the main radiating surface is equipped with several thermal vias,
The thermal vias is distributed between two radiating fins.
9. a kind of automatic navigator, including shell, display panel and electric-control system, which is characterized in that the electric-control system is power
Benefit require any one of 1 to 8 described in electric-control system.
Priority Applications (1)
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CN201820819965.7U CN208425084U (en) | 2018-05-29 | 2018-05-29 | Automatic navigator and its electric-control system |
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CN201820819965.7U CN208425084U (en) | 2018-05-29 | 2018-05-29 | Automatic navigator and its electric-control system |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112087893A (en) * | 2019-06-14 | 2020-12-15 | 杭州海康威视数字技术股份有限公司 | Interference unit |
WO2021054379A1 (en) * | 2019-09-17 | 2021-03-25 | 株式会社デンソー | Display device |
-
2018
- 2018-05-29 CN CN201820819965.7U patent/CN208425084U/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112087893A (en) * | 2019-06-14 | 2020-12-15 | 杭州海康威视数字技术股份有限公司 | Interference unit |
CN112087893B (en) * | 2019-06-14 | 2021-08-24 | 杭州海康威视数字技术股份有限公司 | Interference unit |
WO2021054379A1 (en) * | 2019-09-17 | 2021-03-25 | 株式会社デンソー | Display device |
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