CN112087121A

CN112087121A - Modular power module

Info

Publication number: CN112087121A
Application number: CN202010736401.9A
Authority: CN
Inventors: 辛纪元; 朱楠; 向礼
Original assignee: Zhizhan Technology Shanghai Co ltd
Current assignee: Zhizhan Technology Shanghai Co ltd
Priority date: 2020-07-28
Filing date: 2020-07-28
Publication date: 2020-12-15
Anticipated expiration: 2040-07-28
Also published as: CN112087121B

Abstract

The embodiment of the invention provides a modular power module, and belongs to the technical field of high-power electronic devices. The power module includes: at least one set of power components connected in parallel, each of the power components comprising: a heat dissipation assembly comprising: a bracket fixing mechanism; a cold plate; a power module disposed on the cold plate; the current sensor is electrically connected with the power module and used for acquiring the current of the current sensor in real time; the bracket is used for fixing the current sensor and is connected with the bracket fixing structure; a bus capacitor; the bus bar is arranged on the bus capacitor and the power module and is used for connecting the bus capacitor and the power module; and the driving board is arranged on the busbar and is used for being connected with the power module of each power assembly. The power module can overcome the technical defects of long development period, high cost, poor compatibility and difficult material management of a high-power module in the prior art.

Description

Modular power module

Technical Field

The invention relates to the technical field of high-power electronic devices, in particular to a modular power module.

Background

The traditional high-power module scheme can design different devices aiming at different power grades, such as designing bus capacitors with different sizes, radiators with different sizes, different PCB driving boards and the like, and can cause the defects of long development period, high cost, poor compatibility, difficult material management and the like of a high-power electronic device.

Disclosure of Invention

The invention aims to provide a modular power module which can overcome the technical defects of long development period, high cost, poor compatibility and difficult material management of a high-power module in the prior art.

In order to achieve the above object, an embodiment of the present invention provides a modular power module, including:

at least one set of power components connected in parallel, each of the power components comprising:

a heat dissipation assembly comprising:

a bracket fixing mechanism;

a cold plate;

a power module disposed on the cold plate;

the current sensor is electrically connected with the power module and used for acquiring the current of the current sensor in real time;

the bracket is used for fixing the current sensor and is connected with the bracket fixing structure;

a bus capacitor;

the bus bar is arranged on the bus capacitor and the power module and is used for connecting the bus capacitor and the power module; and

and the driving board is arranged on the busbar and is used for being connected with the power module of each power component.

Optionally, the power module further comprises:

the mica sheet is arranged between the busbar and the driving plate;

and the isolation gasket is arranged on the mica sheet and used for isolating the busbar from the driving plate.

Optionally, the heat dissipation assembly comprises:

the bracket fixing mechanism and the cold plate are arranged on the upper surface of the main body;

the liquid cooling runner is arranged at the bottom of the cold plate internally tangent to the main body;

the water outlet is arranged on the lower surface of the main body;

the water inlet is arranged on the lower surface of the main body and is connected with the water outlet through the liquid cooling flow channel;

the power module further comprises a main water channel, and the main water channel is connected with the water inlet and/or the water outlet.

Optionally, a flow channel plug connected with the liquid cooling flow channel is arranged on the side surface of the main body.

Optionally, the lower surface of the main body is provided with a plurality of first grooves, and the first grooves are arranged around the liquid cooling flow channel and used for supplying the liquid in the liquid cooling flow channel to perform primary heat dissipation.

Optionally, a second groove is disposed on the back of the main body, and the second groove is disposed on the back of the main body and opposite to the position of the bracket fixing mechanism.

Optionally, one of the water inlet and the water outlet of each heat dissipation assembly is connected to the other of the water inlet and the water outlet of the adjacent heat dissipation assembly, and the water inlets or the water outlets of the heat dissipation assemblies at two ends are connected to the main water channel.

Optionally, the water inlet and the water outlet of each heat dissipation assembly are respectively connected with the main water channel.

Optionally, the bus capacitor includes:

a substrate;

a positive polarity terminal disposed on the substrate;

the negative terminals are arranged on the substrate, the number of one of the positive terminals and the negative terminals is twice that of the other terminal, and the positive terminals and the negative terminals are uniformly distributed on two sides of the other terminal.

Alternatively, the other one is connected to each other, and the positive polarity terminal or the negative polarity terminal located on both sides of the other one are respectively connected to each other.

Through the technical scheme, the modular power module provided by the invention has the advantages that the power module, the heat dissipation assemblies, the bus capacitor and the current sensor are modularized, and the same drive plate is adopted to connect each power assembly, so that the power module can face working conditions with different power grades by increasing or decreasing the number of actual power assemblies, the technical problem that the corresponding power modules need to be developed respectively aiming at the working conditions with various powers in the prior art is solved, and the technical defects that the development period of the high-power module is long, the cost is high, the compatibility is poor and materials are difficult to manage in the prior art are overcome.

Additional features and advantages of embodiments of the invention will be set forth in the detailed description which follows.

Drawings

The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the embodiments of the invention without limiting the embodiments of the invention. In the drawings:

FIG. 1 is an exploded view of a power assembly according to one set of embodiments of the present invention;

FIG. 2 is an overall schematic diagram of a power assembly according to one set of embodiments of the invention;

FIG. 3 is a schematic structural view of a heat sink assembly according to one embodiment of the present invention;

FIG. 4a is a rear view of a heat dissipation assembly according to an embodiment of the present invention;

FIG. 4b is a rear view of a heat sink assembly according to one embodiment of the present invention;

FIG. 4c is a rear view of a heat sink assembly according to one embodiment of the present invention;

FIG. 4d is a rear view of a heat sink assembly according to one embodiment of the present invention;

FIG. 5 is a schematic view of the connection of the water inlet and outlet to the main waterway in accordance with one embodiment of the present invention;

FIG. 6 is a schematic view of the connection of the water inlet and outlet to the main waterway in accordance with one embodiment of the present invention;

FIG. 7 is a schematic diagram of the structure of a bus capacitor according to one embodiment of the present invention; and

fig. 8 is a schematic diagram of a bus capacitor according to an embodiment of the present invention.

Detailed Description

The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating embodiments of the invention, are given by way of illustration and explanation only, not limitation.

In the embodiments of the present invention, unless otherwise specified, the use of directional terms such as "upper, lower, top, and bottom" is generally used with respect to the orientation shown in the drawings or the positional relationship of the components with respect to each other in the vertical, or gravitational direction.

In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between the various embodiments can be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not be within the protection scope of the present invention.

The invention provides a modular power module, which comprises at least one power component connected in parallel. The explosion diagram of each power assembly is shown in fig. 1, and the schematic diagram after the assembly is completed is shown in fig. 2. In fig. 1, the power assembly may include a heat sink assembly 10, a power module 20, a current sensor 30, a bracket 31, a bus capacitor 40, a bus bar 41, and a driving board 50.

In fig. 1, the power module 20 may further include a bracket fixing mechanism 11 and a cold plate 12. The bracket fixing mechanism 11 may be configured to fix a bracket 31, the bracket 31 may be configured to fix the current sensor 30, and the current sensor 30 may be electrically connected to the power module 20, and configured to obtain a current of the current sensor 30 in real time, where the current may be used to transmit a state of the power module 20 to the outside in real time. The power module 20 may be disposed on the cold plate 12 such that the cold plate 12 may perform a heat sinking operation of the power module 20.

In fig. 1, a bus bar 41 may be disposed on the bus bar capacitor 40 and the power module 20 for connecting the bus bar capacitor 40 and the power module 20. The driving board 50 may be disposed on the bus bar 41 for connecting with the power module 20 of each power assembly, thereby achieving parallel connection between the respective power assemblies.

It is contemplated that the power module 20 may generate a significant amount of heat during operation. Although this heat is absorbed by the cold plate 12 disposed at the bottom of the power module 20, the driving plate 50 is mostly made of metal, and thus has a strong thermal conductivity, and the heat of the power module 20 is easily absorbed, thereby increasing the temperature of the driving plate 50 and affecting the electrical conductivity thereof. Therefore, in one embodiment of the present invention, the power module may further include a mica sheet 51 and a spacer 52. The mica sheet 51 may be disposed between the bus bar 41 and the driving board 50 so as to prevent heat conduction therebetween. The isolation spacer 52 may be disposed on the mica sheet 51 for further isolating the busbar 41 and the driving plate 50, thereby improving the thermal insulation effect.

In this embodiment, the heat dissipating assembly 10 may have various structures known to those skilled in the art. However, the inventor considers that the power module provided by the invention is designed to solve the technical problem that the corresponding power modules need to be developed respectively according to the working conditions of various powers in the prior art. Therefore, in the case where each power component in the power module can be separated and combined, the heat dissipation component 10 should also be separated and combined. The inventors have designed a heat sink assembly 10 as shown in fig. 3. In fig. 3, the heat dissipating assembly 10 may include a main body 13, a liquid cooling flow passage, a water outlet 14, and a water inlet 15. The water inlet 15 may be connected to the water outlet 14 via a liquid cooling flow path. Correspondingly, to achieve the coolant circulation operation for each heat dissipation assembly 10, the power module may further include a main water channel 53. The main water channel 53 may be connected to the water inlet 14 and/or the water outlet 15. In the heat dissipation assembly 10, the upper surface of the body 13 may be provided with a cold plate 12 and a holder fixing mechanism 11. Since the cold plate 12 itself is used for heat conduction and does not have the function of a fixing device, the bracket fixing mechanism 11 and the cold plate 12 are simultaneously arranged on the upper surface of the main body 13, so that the bracket fixing mechanism 11 can fix the power module 20 through the bracket 31 while fixing the bracket 31. Specifically, when the bracket 31 is fixed, the bracket 31 on one side of the power module 20 and the bus bar capacitor 40 on the other side of the power module 20 simultaneously form a limit to the power module 20, thereby fixing the power module 20.

In one embodiment of the present invention, as shown in fig. 3, a flow path stopper 16 connected to the liquid cooling flow path may be provided on a side surface of the main body 13.

Since the cooling liquid enters the liquid-cold flow channel from the main water channel 53 through the water inlet 15, when passing through the bottom of the cold plate 12, the cooling liquid absorbs the heat of the power module 20, and then is injected into the main water channel 53 again through the water outlet 14, thereby completing the whole energy exchange process. In the process, the energy exchange efficiency of the cooling fluid decreases with the increase of the temperature of the cooling fluid, and the heat dissipation effect is gradually reduced due to the increase of the temperature of the cooling fluid when the cooling fluid flows through the bottom of the cold plate 12. Thus, in one embodiment of the present invention, as shown in fig. 4a to 4d, the back surface of the main body 13 may be provided with a first groove 17. This first recess 17 can set up around the liquid cooling runner, and the area of contact of coolant liquid and outside can be improved to the structure of its recess to liquid (coolant liquid) in the liquid cooling runner carries out preliminary heat dissipation, finally improves the radiating efficiency of whole liquid cooling system.

In this embodiment, since the front surface of the heat dissipating module 10 is provided with the cold plate 12 and the holder fixing mechanism 11, and since only the vicinity of the cold plate 12 is required to dissipate heat, the bottom of the holder fixing mechanism 11 does not need to be provided with a liquid cooling flow passage. Thus, as shown in fig. 4a to 4d, in one embodiment of the present invention, the back of the main body 13 may be provided with a second groove 18. The second recess 18 may reduce the physical size of the liquid cooling module, thereby reducing the mass of the overall liquid cooling system.

In this embodiment, the connection mode of the main water channel 13 with the water inlet 15 and the water outlet 14 may be different due to different structures of different power modules 20. For the case of relatively narrow bottom space of the device, the connection mode may be as shown in fig. 5. In fig. 5, one of the water inlet 15 and the water outlet 14 of the heat dissipating module 10 is connected to the other of the water inlet 15 and the water outlet 14 of the adjacent heat dissipating module 10, and the water inlet 15 or the water outlet 14 of the heat dissipating module 10 at both ends is connected to the main water channel 53. In the case of a relatively large space at the bottom of the device, the connection may be as shown in fig. 6. In fig. 6, the water inlet 15 and the water outlet 14 of each heat dissipation assembly 10 are connected to the main water channel 53.

In one embodiment of the present invention, in consideration of the installation of the heat dissipation assembly 20, as shown in fig. 3, the heat dissipation assembly 20 may further include an installation mechanism 19 provided at the bottom of the main body 13. The specific form of the mounting mechanism 19 can be any of a variety of structures known to those skilled in the art, such as a mating bolt and nut arrangement, a snap-fit arrangement, and welding, among others.

Fig. 7 is a schematic diagram of one configuration of bus capacitor 40. In fig. 7, the bus capacitor 40 may include a substrate 41, a positive terminal 42, and a negative terminal 43. Both the positive terminal 42 and the negative terminal 43 may be disposed on the substrate 41. One of the positive polarity terminal 42 and the negative polarity terminal 43 may be twice as many as the other, and the one may be uniformly distributed at both sides of the other. In fig. 7, since the conventional single polarity terminal is split into a plurality of polarity terminals, the single capacitor is also equivalent to a plurality of capacitors connected in parallel, which makes the parasitic inductance greatly reduced (by 50%) compared with the single capacitor when the voltage overshoot is generated instantaneously by the switching device (power module 20) after the dc bus (busbar 41) is connected. Therefore, the structure as shown in fig. 7 can reduce the parasitic inductance between the capacitor of the dc bus and the switching device greatly.

Further, the inventors have found, when designing the structure shown in fig. 7, that the parasitic inductance can be further reduced if the positive terminal 42 and the negative terminal 43 in the structure shown in fig. 7 are connected correspondingly. Thus, the inventors devised a structure that is a bus capacitor 40 as shown in fig. 8. In fig. 8, the other one, half the number of which is one, is connected to each other, and the positive polarity terminal 42 or the negative polarity terminal 43 positioned on both sides of the other one are connected to each other, respectively.

Although the embodiments of the present invention have been described in detail with reference to the accompanying drawings, the embodiments of the present invention are not limited to the details of the above embodiments, and various simple modifications can be made to the technical solution of the embodiments of the present invention within the technical idea of the embodiments of the present invention, and the simple modifications all belong to the protection scope of the embodiments of the present invention.

It should be noted that the various features described in the above embodiments may be combined in any suitable manner without departing from the scope of the invention. In order to avoid unnecessary repetition, the embodiments of the present invention will not be described separately for the various possible combinations.

Those skilled in the art can understand that all or part of the steps in the method for implementing the above embodiments may be implemented by a program instructing related hardware, where the program is stored in a storage medium and includes several instructions to enable a single chip, a chip, or a processor (processor) to execute all or part of the steps in the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.

In addition, various different embodiments of the present invention may be arbitrarily combined with each other, and the embodiments of the present invention should be considered as disclosed in the disclosure of the embodiments of the present invention as long as the embodiments do not depart from the spirit of the embodiments of the present invention.

Claims

1. A modular power module, comprising:

a heat dissipation assembly comprising:

a bracket fixing mechanism;

a cold plate;

a power module disposed on the cold plate;

a bus capacitor;

2. The power module of claim 1, further comprising:

the mica sheet is arranged between the busbar and the driving plate;

3. The power module of claim 1, wherein the heat sink assembly comprises:

the water outlet is arranged on the lower surface of the main body;

4. The power module as claimed in claim 3, wherein a channel stopper connected to the liquid cooling channel is provided on a side surface of the main body.

5. The power module as claimed in claim 3, wherein the lower surface of the main body is provided with a plurality of first grooves, and the first grooves are disposed around the liquid-cooling flow channel for primarily dissipating heat of the liquid in the liquid-cooling flow channel.

6. The power module of claim 3, wherein the back of the body is provided with a second recess provided in the back of the body and positioned relative to the bracket securing mechanism.

7. The power module of claim 3, wherein one of the water inlet and the water outlet of each heat dissipation assembly is connected to the other of the water inlet and the water outlet of the adjacent heat dissipation assembly, and the water inlet or the water outlet of the heat dissipation assembly at both ends is connected to the main water channel.

8. The power module of claim 3, wherein the water inlet and the water outlet of each heat sink assembly are connected to the main water channel.

9. The power module of claim 1, wherein the bus capacitor comprises:

a substrate;

a positive polarity terminal disposed on the substrate;

10. The power module according to claim 4, wherein the other is connected to each other, and the positive polarity terminal or the negative polarity terminal on both sides of the other are respectively connected to each other.