CN117154433A

CN117154433A - Power supply system

Info

Publication number: CN117154433A
Application number: CN202311116899.9A
Authority: CN
Inventors: 杨雯; 任汝婷; 陈宇
Original assignee: Zhangzhou Kehua Electric Technology Co Ltd
Current assignee: Zhangzhou Kehua Electric Technology Co Ltd
Priority date: 2023-08-31
Filing date: 2023-08-31
Publication date: 2023-12-01

Abstract

The invention provides a power supply system, which belongs to the technical field of communication equipment and comprises two subsystems connected in parallel, wherein each subsystem comprises a heat dissipation shell and a printed circuit board fixedly arranged in an inner cavity of the heat dissipation shell; the two heat dissipation shells are buckled and butted; the two printed circuit boards are connected through a copper bar assembly; a locking piece detachably connected with one end of the copper bar assembly is arranged on one of the printed circuit boards; the side wall of one of the heat dissipation shells is provided with a mounting opening, and the mounting opening corresponds to the locking piece; the mounting opening is also detachably connected with a sealing plate; after the sealing plate is detached from the heat dissipation shell, the locking piece is exposed out of the mounting opening. According to the power supply system provided by the invention, each subsystem can be used as an independent power supply for supplying power to a reference, parallel connection can be realized through the copper bar assembly, parallel connection operation of the two printed circuit boards is performed at the mounting port of the outer side wall of one heat dissipation shell through the copper bar assembly, and the operation mode is simple and convenient.

Description

Power supply system

Technical Field

The invention belongs to the technical field of communication equipment, and particularly relates to a power supply system.

Background

In the field of communication technology, it is often necessary to separately install and configure a corresponding power supply system for a base station to supply power to relevant communication devices of the base station outdoors.

In the prior art, a single power supply system can be used for supplying power to a base station; in order to save installation space and simplify the fixing procedure of the power supply system on the premise of increasing the power of the power supply system, two groups of independent power supply systems can be connected in parallel and then power is supplied to the base station.

Taking 5G power supply system as an example, the inside of the shell of each power supply system is provided with a printed circuit board, and because the size of the shell of the 5G power supply system is small, after the two shells are correspondingly connected, the two printed circuit boards are packaged in the shell, so that the parallel connection operation of the two printed circuit boards is difficult.

Disclosure of Invention

The invention aims to provide a power supply system, which aims to solve the technical problem that two printed circuit boards are difficult to operate in parallel after two power supply systems are in butt joint in the prior art.

In order to achieve the above purpose, the invention adopts the following technical scheme: the power supply system comprises two subsystems connected in parallel, wherein each subsystem comprises a heat dissipation shell and a printed circuit board fixedly arranged in an inner cavity of the heat dissipation shell; the two radiating shells are buckled and butted; the two printed circuit boards are connected through a copper bar assembly;

one of the printed circuit boards is provided with a locking piece which is detachably connected with one end of the copper bar assembly;

a mounting opening is formed in the side wall of one of the heat dissipation shells, and the mounting opening corresponds to the locking piece; a sealing plate is detachably connected to the mounting opening;

after the sealing plate is detached from the heat dissipation shell, the locking piece is exposed out of the mounting opening.

In one possible implementation manner, two printed circuit boards are arranged in parallel, the front board surfaces of the two printed circuit boards are opposite, and two ends of the copper bar assembly are respectively arranged on the front board surfaces of the two printed circuit boards.

In one possible implementation manner, another printed circuit board is provided with an anti-rotation table which is in plug-in connection with the other end of the copper bar assembly.

In one possible implementation manner, the two heat dissipation shells are buckled and butted and then placed in the up-down direction; the outer side wall of each radiating shell is provided with a radiating tooth group; the heat dissipation tooth group comprises a plurality of heat dissipation teeth which are distributed at intervals, and each heat dissipation tooth extends upwards from the bottom end of the heat dissipation shell to the top end of the heat dissipation shell.

In some embodiments, the two heat dissipation shells are buckled and butted and then placed in the up-down direction; a heat dissipation space is formed between the upper edges of the two printed circuit boards and the corresponding upper inner wall of the heat dissipation shell; and a radiator is fixedly arranged in the radiating space.

In some embodiments, the heat sink is provided with a first insulating pad, and the first insulating pad is provided with a first electronic component group;

the printed circuit board is provided with a first avoidance hole, a second electronic element group is arranged at the first avoidance hole, and the second electronic element group is attached to the inner side wall of the heat dissipation shell;

the first electronic element group and the second electronic element group are respectively and electrically connected with the printed circuit board, and the heating value of the first electronic element group is larger than that of the second electronic element group.

In some embodiments, an insulating stop collar is embedded on the heat sink, and the first electronic component group, the first insulating gasket and the insulating stop collar are fixedly connected through a fastener.

In some embodiments, a third electronic component group is disposed on the back surface of the printed circuit board, and the third electronic component group is attached to the inner side wall of the heat dissipation housing; the heating value of the third electronic element group is smaller than that of the first electronic element group;

the front surface of the printed circuit board is provided with a fourth electronic element group, and the heating value of the fourth electronic element group is smaller than that of the third electronic element group.

In some embodiments, a first boss is disposed on a portion of the inner side wall of the heat dissipation housing corresponding to the second electronic component group, and a second insulating spacer is disposed on the first boss; the second insulating gasket is abutted with the second electronic element group;

a second boss is arranged at a position of the inner side wall of the heat dissipation shell, corresponding to the third electronic element group, and a third insulating gasket is arranged on the second boss; the third insulating gasket is abutted with the third electronic element group.

In some embodiments, an insulating board is further disposed between each printed circuit board and the corresponding inner side wall of the heat dissipation housing, and the positions of the insulating board corresponding to the second electronic component group and the third electronic component group are respectively provided with a second avoidance hole.

In the power supply system, before two subsystems are connected in parallel, the copper bar assembly is not connected with two printed circuit boards, the two subsystems can be assembled, transported and fixed independently, and each subsystem can be used as an independent power supply for supplying power to a base station; if two subsystems are required to be connected in parallel, the copper bar assembly is connected with one of the printed circuit boards, then the two heat dissipation shells are buckled and butted, then the sealing plate is opened, the mounting port is externally leaked, the copper bar assembly is locked on the other printed circuit board by using the locking piece from the mounting port, connection of the two printed circuit boards is realized, and finally the sealing plate is covered at the mounting port.

Compared with the prior art, each subsystem can be used as an independent power supply to supply power for a reference, parallel connection can be realized through the copper bar assembly, parallel connection operation of the two printed circuit boards is performed on the mounting port of the outer side wall of one heat dissipation shell through the copper bar assembly, the operation mode is simple and convenient, and stable connection of the two subsystems can be realized.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments or the description of the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of an explosion structure of a power supply system according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a power supply system with a heat dissipation housing removed according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a power supply system according to an embodiment of the present invention (a sealing plate is not shown in the drawings);

fig. 4 is a schematic structural diagram of an anti-rotation table of a power supply system according to an embodiment of the present invention;

FIG. 5 is an exploded view of one of the subsystems of the power system according to an embodiment of the present invention (the heat dissipation case is not shown);

FIG. 6 is an exploded view of another subsystem of the power system according to an embodiment of the present invention (the heat dissipating housing is not shown);

fig. 7 is a schematic structural diagram of one heat dissipation housing of the power supply system according to the embodiment of the present invention;

fig. 8 is a schematic structural diagram of another heat dissipation housing of the power supply system according to the embodiment of the present invention;

fig. 9 is a schematic structural diagram of one subsystem of the power supply system according to the embodiment of the present invention;

fig. 10 is a schematic structural diagram of a radiator of a power supply system according to an embodiment of the present invention after removing an IGBT tube and a fastener;

FIG. 11 is an enlarged schematic view of the structure of circle A in FIG. 6;

fig. 12 is a schematic diagram of an installation structure of a power supply system according to an embodiment of the present invention.

In the figure: 1. a heat dissipation housing; 11. a heat dissipation space; 13. a heat dissipation tooth set; 14. a mounting port; 15. a sealing plate; 16. a first boss; 17. a boss; 2. a printed circuit board; 21. a first avoidance hole; 31. a first electronic component group; 32. a second electronic component group; 33. a third electronic component group; 34. a fourth electronic component group; 4. a copper bar assembly; 41. a locking member; 42. anti-rotation table; 421. positioning columns; 422. a limit column; 43. a power supply anode copper bar; 44. a power supply negative electrode copper bar; 45. a direct current positive copper bar; 46. a direct current negative copper bar; 51. an insulating plate; 511. a second avoidance hole; 53. a first insulating spacer; 54. an insulating limit sleeve; 6. a heat sink; 7. a fastener; 81. a connecting seat; 82. a second output plug; 9. a pole holding structure; 91. a wire pole.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.

Referring to fig. 1 to 3, a power supply system provided by the present invention will now be described. The power supply system comprises two subsystems connected in parallel, wherein each subsystem comprises a heat dissipation shell 1 and a printed circuit board 2 fixedly arranged in the inner cavity of the heat dissipation shell 1; the two heat dissipation shells 1 are buckled and butted; the two printed circuit boards 2 are connected through a copper bar assembly 4; a locking piece 41 detachably connected with one end of the copper bar assembly 4 is arranged on one printed circuit board 2; a mounting opening 14 is formed in the side wall of one of the heat dissipation shells 1, and the mounting opening 14 corresponds to the locking piece 41; a sealing plate 15 is detachably connected to the mounting opening 14; after the sealing plate 15 is removed from the heat dissipation housing 1, the locking member 41 is exposed at the mounting opening 14.

It should be noted that, the structural dimensions of the two heat dissipation shells 1 are substantially the same, or the two heat dissipation shells 1 are the same, so that the heat dissipation shells 1 can be produced by using the same mold to reduce the production cost.

The two heat dissipation shells 1 are buckled and butted, specifically, threaded holes can be respectively added on the butted surfaces of the two heat dissipation shells 1, and the threaded holes of the two heat dissipation shells 1 are aligned and connected through threaded fasteners.

The inner cavity of the heat dissipation shell 1 can be a closed inner cavity, and the printed circuit board 2 is sealed in the inner cavity, so that each subsystem has good sealing and waterproof performances. However, the closed cavity can be opened, that is, the heat dissipation housing 1 is at least formed by two parts, and after one part is removed, the cavity is leaked to facilitate assembling the printed circuit board 2 and the copper bar assembly 4.

The two subsystems can be used as independent power supplies for reference power supply, and can also be connected in parallel to form a power supply system with higher power for reference power supply. Specifically, the copper bar assembly 4 is not connected to the two printed circuit boards 2 before the two subsystems are connected in parallel, the two subsystems can be assembled, transported and fixed separately, and each subsystem can be used independently.

If two subsystems are required to be connected in parallel, the copper bar assembly 4 is firstly connected with one of the printed circuit boards 2, then the two heat dissipation shells 1 are buckled and butted, then the sealing plate 15 is opened, the mounting port 14 is externally leaked, the copper bar assembly 4 is locked on the other printed circuit board 2 by using the locking piece 41 from the mounting port 14, the connection of the two printed circuit boards 2 is realized, and finally the sealing plate 15 is covered at the mounting port 14, so that the parallel connection of the two subsystems is completed.

Because the locking piece 41 penetrates the copper bar assembly 4 from the mounting opening 14, the operation space of the locking piece 41 is large, so that an operator can conveniently fasten the copper bar assembly 4, the operation time is saved, the efficiency is improved, and the operator can be effectively protected in an insulating way.

Compared with the prior art, each subsystem can be used as an independent power supply to supply power for a reference, parallel connection can be realized through the copper bar assembly 4, parallel connection operation of the two printed circuit boards 2 is performed at the mounting port 14 of the outer side wall of one heat dissipation shell 1 through the copper bar assembly 4, and the operation mode is simple and convenient, so that stable connection of the two subsystems can be realized.

In some embodiments, the two printed circuit boards 2 may be configured as shown in fig. 2, referring to fig. 2, where the two printed circuit boards 2 are disposed in parallel, and the front surfaces of the two printed circuit boards 2 are opposite, and two ends of the copper bar assembly 4 are disposed on the front surfaces of the two printed circuit boards 2 respectively.

In general, the front board surfaces of the printed circuit boards 2 are used for disposing electronic components, the front board surfaces of the two printed circuit boards 2 are opposite, that is, the two front board surfaces are disposed face to face, the electronic components are limited between the two printed circuit boards 2, on one hand, the electronic components can increase the spacing distance between the two printed circuit boards 2, that is, each printed circuit board 2 is closer to the side wall of the heat dissipation housing 1, and heat accumulation generated by the two printed circuit boards 2 is avoided; on the other hand, the distance between the two printed circuit boards 2 is ensured to exceed the specified distance, so that the copper bar assembly 4 is convenient to assemble.

In some embodiments, the structure shown in fig. 4 may be further adopted between the copper bar assembly 4 and the other printed circuit board 2, and referring to fig. 4, the other printed circuit board 2 is provided with a turntable 42 that is inserted and connected with the other end of the copper bar assembly 4.

Specifically, a positioning column 421 is arranged on the anti-rotation table 42, one end of the copper bar assembly 4 is provided with a positioning hole, and the positioning column 421 is limited in the positioning hole in an inserting way so as to realize the connection between the copper bar assembly 4 and the anti-rotation table 42; in addition, two sets of limiting posts 422 are further disposed on the anti-rotation table 42 around the positioning posts 421, and the two sets of limiting posts 422 are respectively abutted against two side walls of the copper bar assembly 4 to limit the copper bar assembly 4 to rotate.

The anti-rotation table 42 is connected with the copper bar assembly 4, and when the locking piece 41 is rotated and locked, the copper bar assembly 4 can be prevented from rotating along with the locking piece 41, so that the accuracy of the fixing position of the copper bar assembly 4 is ensured, and the connection stability of the copper bar assembly 4 and the printed circuit board 2 is ensured.

Specifically, the copper bar assembly 4 includes a power positive copper bar 43, a power negative copper bar 44, a direct current positive copper bar 45, and a direct current negative copper bar 46. It should be noted that one end of each copper bar is fixed to one anti-rotation table 42, and the other end is locked by one locking member 41.

In some embodiments, the heat dissipation shell 1 may have a structure as shown in fig. 7 and 8, and referring to fig. 7 and 8, the two heat dissipation shells 1 are buckled and abutted and then placed in an up-down direction; one side surface of the heat dissipation shell 1 is an opening surface, and the opening surfaces of the two heat dissipation shells 1 are buckled and butted; the outer side wall of each heat dissipation shell 1 is provided with a heat dissipation tooth group 13. The heat dissipation teeth set 13 includes a plurality of heat dissipation teeth distributed at intervals, and each heat dissipation tooth extends from the bottom end of the heat dissipation housing 1 to the top end.

The heat dissipation tooth groups 13 may be fully distributed on the outer side wall of the heat dissipation casing 1, or may be distributed on only one of the outer side walls of the heat dissipation casing 1, i.e. the heat dissipation tooth groups 13 correspond to the printed circuit board 2. The heat emitted by the electronic component can be brought out of the heat dissipation shell 1 through the heat dissipation tooth group 13, so that the power supply system can utilize the self structure of the heat dissipation shell 1 to dissipate heat of the printed circuit board 2.

It should be noted that, since the two heat dissipation shells 1 need to be buckled and butted, and the copper bar assembly 4 needs to be disposed in the inner cavity where the two heat dissipation shells 1 are buckled, the two heat dissipation shells 1 have an opening surface; when the two subsystems are not required to be connected in parallel, a cover plate can be arranged on the opening surface of the heat dissipation shell 1, and the inner cavity of the heat dissipation shell 1 is blocked, so that the subsystems can be independently used.

Preferably, the heat radiating tooth sets 13 are distributed on the vertical side wall and the top side wall of the heat radiating housing 1. The vertical side wall is a side wall corresponding to the printed circuit board 2 (i.e., corresponding to the opening surface), and is also a vertical side wall having the largest surface area. The heat dissipation tooth group 13 extends upwards from the bottom end to the top end of the vertical side wall.

Because the heat dissipation shell 1 is arranged along the up-down direction, each heat dissipation tooth extends upwards from the bottom end of the heat dissipation shell 1 to the top end of the heat dissipation shell 1, that is to say, the extending direction of the heat dissipation tooth is the same as the air flow direction, thus the air flow is not blocked, and the air flow passing through the upper part of the heat dissipation shell 1 is ensured; in addition, in the air flow process, the flow resistance is gradually reduced, the speed is gradually increased, and the rapidly flowing air flow can also rapidly take away the heat of the radiator 6, so that the normal operation of the power supply system is ensured.

In addition, the heat dissipation tooth groups 13 are further distributed on the top wall of the heat dissipation shell 1, and the heat dissipation tooth groups 13 of the top wall are also corresponding to the top of the inner cavity of the heat dissipation shell 1 because the heat of the top of the inner cavity of the heat dissipation shell 1 is most concentrated, so that the area of the heat dissipation tooth groups 13 is increased, and the heat dissipation effect is improved.

In some embodiments, the power supply system may also adopt the structure shown in fig. 9 and fig. 12, referring to fig. 9 and fig. 12, a heat dissipation space 11 is formed between the upper edges of the two printed circuit boards 2 and the upper inner wall of the corresponding heat dissipation housing 1; the radiator 6 is fixedly arranged in the radiating space 11.

Specifically, the heat dissipation housing 1 may be hung on a wall, or be fixed on a pole 91 or a steel frame by using a pole structure 9, and the heat dissipation housing 1 is disposed along an up-down direction, as shown in fig. 12, that is, a height direction of the power supply system is an up-down direction, and is also an axial direction of the pole 91 after the power supply system is installed.

The air flow generally flows from bottom to top, so that the air flow at the lower part has low temperature and large flow resistance inside the heat dissipation shell 1; as the air flow rises to take away heat, the temperature rises after the air flow flows to the upper portion of the heat dissipation case 1. Because there is the heat dissipation space 11 between the upper edge of printed circuit board 2 and the upside inner wall of heat dissipation casing 1, in order to avoid heat to gather at heat dissipation space 11, can't dispel, set up radiator 6 in heat dissipation space 11 to absorb the heat of the last part in the heat dissipation casing 1, and the air current flow in-process, the flow resistance diminishes gradually, and the speed increases gradually, and the heat of radiator 6 can also be taken away fast to the air current of quick flow, and then guarantees this electrical power generating system normal work.

In some embodiments, the power supply system may further adopt a structure as shown in fig. 5, 6 and 9, referring to fig. 5, 6 and 9, the heat sink 6 is provided with a first insulating pad 53, and the first insulating pad 53 is provided with the first electronic component group 31; the printed circuit board 2 is provided with a first avoidance hole 21, a second electronic element group 32 is arranged at the first avoidance hole 21, and the second electronic element group 32 is attached to the inner side wall of the heat dissipation shell 1; the first electronic component group 31 and the second electronic component group 32 are electrically connected to the printed circuit board 2, respectively, and the heat generation amount of the first electronic component group 31 is larger than that of the second electronic component group 32.

The first electronic component group 31 with large heating value is arranged on the radiator 6, and the radiator 6 is utilized to directly radiate the heat of the first electronic component group 31, so that heat concentration is avoided; in addition, set up heat dissipation tooth group 13 at the outside surface of heat dissipation casing 1, utilize heat dissipation casing 1 self to dispel the heat to printed circuit board 2, set up first dodge hole 21 moreover on printed circuit board 2, second electronic component group 32 is located first dodge hole 21 department, just can laminate with the inside wall of heat dissipation casing 1, reduced the heat circulation route, the heat of second electronic component group 32 can directly pass through heat dissipation casing 1, avoid the heat to concentrate.

In some embodiments, the power supply system may further adopt a structure as shown in fig. 5 and 6, referring to fig. 5 and 6, a third electronic component group 33 is disposed on the back surface of the printed circuit board 2, and the third electronic component group 33 is attached to the inner side wall of the heat dissipation housing 1; the third electronic component group 33 generates less heat than the first electronic component group 31; the front surface of the printed circuit board 2 is provided with a fourth electronic component group 34, and the heat generation amount of the fourth electronic component group 34 is smaller than that of the third electronic component group 33.

In general, the front board surface of the printed circuit board 2 is used for setting the electronic component group, in this embodiment, in order to improve the heat dissipation effect, the third electronic component group 33 with a large part of heat dissipation capacity is set on the back board surface of the printed circuit board 2, so that the third electronic component group 33 is attached to the inner side wall of the heat dissipation housing 1, the heat circulation path is reduced, and the heat concentration is avoided.

The first electronic component group 31, the second electronic component group 32, and the third electronic component group 33 are electronic components having a large heat generation amount, and the fourth electronic component group 34 is an electronic component having a small heat generation amount.

The first electronic component group 31 generates the largest amount of heat, and therefore is disposed on the heat sink 6, and the heat sink 6 is used to directly dissipate the heat of the first electronic component group 31; the second electronic component group 32 is sunk in the first avoidance hole 21, and the third electronic component group 33 is arranged on the back surface of the printed circuit board 2, so that the second electronic component group 32 and the third electronic component group 33 are both attached to the inner side wall of the heat dissipation shell 1, and the heat circulation path is reduced.

Wherein the second electronic component group 32 is an electronic component having a larger thickness, such as a magnetic device; the third electronic component group 33 is an electronic component with a smaller thickness, such as a MOS transistor or a bridge stack.

Although the second electronic component group 32 is disposed in the first escape hole 21, the second electronic component group 32 is connected to the printed circuit board 2 by the solder tail.

In some embodiments, the heat dissipation housing 1 may also have a structure as shown in fig. 7 and 8, referring to fig. 7 and 8, where the inner side wall of the heat dissipation housing 1 corresponds to the second electronic component group 32, is provided with a first boss 16, and the first boss 16 is provided with a second insulating spacer; the second insulating spacer abuts against the second electronic component group 32.

In order to avoid the short circuit, the second electronic component group 32 and the first boss 16 cannot be directly contacted, and a second insulating spacer is further provided between the second electronic component group 32 and the first boss 16. The second insulating spacer has an insulating effect on one hand, and also has a heat conducting effect on the other hand, so that the second electronic component group 32 can be contacted with the first boss 16 through the second insulating spacer, and the heat circulation path is further reduced, so that heat is rapidly dissipated.

Preferably, referring to fig. 7 and 8, based on the above embodiment, the second electronic component set 32 is a magnetic device, and the first boss 16 is a strip-shaped tooth set; the second insulating gasket is made of flexible materials and can deform along with the strip-shaped tooth groups.

Specifically, the strip-shaped tooth group comprises a plurality of strip-shaped teeth which are arranged at intervals, clamping grooves can be formed between every two adjacent strip-shaped teeth, and a plurality of coils of the magnetic device can be correspondingly clamped in the clamping grooves through the second heat dissipation gaskets, so that the contact area between the magnetic device and the strip-shaped tooth group is increased, namely the heat dissipation surface area is increased.

It should be noted that the second insulating spacer is not a hard plate structure and can deform along with the strip-shaped tooth set so as to ensure that the magnetic device can be correspondingly clamped in each clamping groove.

In some embodiments, the heat dissipation housing 1 may also have a structure as shown in fig. 7 and 8, referring to fig. 7 and 8, where the inner side wall of the heat dissipation housing 1 corresponds to the third electronic component group 33, is provided with a second boss 17, and a third insulating spacer is provided on the second boss 17; the third insulating pad abuts against the third electronic component group 33.

The second boss 17 is added on the inner sidewall of the heat dissipation housing 1, so as to increase the heat dissipation volume of the third electronic component group 33, prolong the heat dissipation path from the third electronic component group 33 to the heat dissipation tooth group 13, and improve the heat dissipation efficiency of the third electronic component group 33.

In addition, a third insulating spacer is disposed between the second boss 17 and the third electronic component group 33 to avoid short-circuiting due to direct contact between the third electronic component group 33 and the second boss 17; the third insulating spacer has an insulating effect on one hand, and also has a heat conducting effect on the other hand, so that the third electronic component group 33 can be contacted with the second boss 17 through the third insulating spacer, the heat circulation path is further reduced, and the heat is rapidly dissipated.

In some embodiments, the heat sink 6 may also have a structure as shown in fig. 9 and 10, and referring to fig. 9 and 10, the heat sink 6 is further embedded with an insulating stop collar 54; specifically, the radiator 6 is provided with a mounting hole, and the insulating spacer 54 is fitted in the mounting hole. The first electronic component group 31, the first insulating spacer 53 and the insulating spacer 54 are fixedly connected by the fastener 7.

In order to insulate the first electronic component group 31 from the heat sink 6, a first insulating spacer 53 is provided on the heat sink 6, and the first electronic component group 31, the first insulating spacer 53, and the heat sink 6 are stacked in this order, and preferably, the first insulating spacer 53 may be a ceramic insulating pad.

In order to insulate the fastening member 7 from the heat sink 6, an insulating stop collar 54 is provided inside the heat sink 6, preferably the fastening member 7 is a bolt,

the screw portion of the bolt is fastened in the insulating spacer 54, and the nut portion of the bolt abuts against the first electronic component group 31.

In some embodiments, the side wall of the heat sink 6 is abutted against the inner side wall of the heat dissipation housing 1, that is, the heat sink 6 and the heat dissipation housing 1 are arranged at a constant distance, and the heat absorbed by the heat sink 6 can be directly transferred to the heat dissipation housing 1, so that the heat flow path is further reduced, and the heat dissipation effect is improved.

Since the heat dissipation housing 1 is typically a sheet metal part or an aluminum chassis, in order to avoid short circuit caused by contact between each electronic component set and the printed circuit board 2 and the heat dissipation housing 1, referring to fig. 1, 5 and 6, an insulating plate 51 is further disposed between the printed circuit board 2 and the inner side wall of the heat dissipation housing 1, and the insulating plate 51 is used for isolating the printed circuit board 2 and the heat dissipation housing 1.

The insulating plate 51 is provided with second escape holes 511 corresponding to the second electronic component group 32 and the third electronic component group 33, respectively. The second electronic component group 32 and the third electronic component group 33 are also disposed in the second avoiding hole 511.

In some embodiments, the front surface of the printed circuit board 2 is coated with a metal connection layer, and a first output plug is arranged on the metal connection layer; the printed circuit board 2 is further provided with a connection seat 81, and the connection seat 81 is connected with a second output plug 82, as shown in fig. 11.

The metal connecting layer and the connecting seat 81 all play the role of electric connection, the first output plug can be directly electrically connected with the printed circuit board 2 through the metal connecting layer, and the second output plug 82 can be directly electrically connected with the printed circuit board 2 through the connecting seat 81, so that welding pins of the first output plug and the second output plug 82 are not needed, and the assembly process is simplified.

The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.

Claims

1. The power supply system is characterized by comprising two subsystems connected in parallel, wherein each subsystem comprises a heat dissipation shell (1) and a printed circuit board (2) fixedly arranged in an inner cavity of the heat dissipation shell (1); the two radiating shells (1) are buckled and butted; the two printed circuit boards (2) are connected through a copper bar assembly (4);

a locking piece (41) detachably connected with one end of the copper bar assembly (4) is arranged on one printed circuit board (2);

a mounting opening (14) is formed in the side wall of one of the heat dissipation shells (1), and the mounting opening (14) corresponds to the locking piece (41); a sealing plate (15) is detachably connected to the mounting opening (14);

wherein, after the sealing plate (15) is removed from the heat dissipation shell (1), the locking piece (41) is exposed at the mounting opening (14).

2. The power supply system according to claim 1, wherein the two printed circuit boards (2) are arranged in parallel, and the front faces of the two printed circuit boards (2) are opposite, and the two ends of the copper bar assembly (4) are respectively arranged on the front faces of the two printed circuit boards (2).

3. A power supply system according to claim 1, characterized in that the other printed circuit board (2) is provided with a turntable (42) which is in plug-in connection with the other end of the copper bar assembly (4).

4. The power supply system according to claim 1, wherein the two heat dissipation housings (1) are placed in the up-down direction after being buckled and butted; the outer side wall of each radiating shell (1) is provided with a radiating tooth group (13); the heat dissipation tooth group (13) comprises a plurality of heat dissipation teeth which are distributed at intervals, and each heat dissipation tooth extends upwards from the bottom end of the heat dissipation shell (1) to the top end of the heat dissipation shell (1).

5. The power supply system according to claim 4, characterized in that a heat dissipation space (11) is present between the upper edges of both printed circuit boards (2) and the corresponding upper inner wall of the heat dissipation housing (1); the radiator (6) is fixedly arranged in the radiating space (11).

6. The power supply system according to claim 5, characterized in that the heat sink (6) is provided with a first insulating spacer (53), the first insulating spacer (53) being provided with a first group of electronic components (31);

a first avoidance hole (21) is formed in the printed circuit board (2), a second electronic element group (32) is arranged at the first avoidance hole (21), and the second electronic element group (32) is attached to the inner side wall of the heat dissipation shell (1);

the first electronic component group (31) and the second electronic component group (32) are respectively and electrically connected with the printed circuit board (2), and the heating value of the first electronic component group (31) is larger than that of the second electronic component group (32).

7. The power supply system according to claim 6, wherein an insulating spacer (54) is embedded on the heat sink (6), and the first electronic component group (31), the first insulating spacer (53) and the insulating spacer (54) are fixedly connected by a fastener (15).

8. The power supply system according to claim 6, wherein a third electronic component group (33) is provided on the back surface of the printed circuit board (2), and the third electronic component group (33) is attached to the inner side wall of the heat dissipation case (1); the third electronic component group (33) generates less heat than the first electronic component group (31);

the front surface of the printed circuit board (2) is provided with a fourth electronic element group (34), and the heating value of the fourth electronic element group (34) is smaller than that of the third electronic element group (33).

9. The power supply system according to claim 8, wherein a first boss (16) is provided at a position of the inner side wall of the heat dissipation case (1) corresponding to the second electronic component group (32), and a second insulating spacer is provided on the first boss (16); the second insulating spacer is abutted against the second electronic component group (32);

a second boss (17) is arranged at a position of the inner side wall of the heat dissipation shell (1) corresponding to the third electronic element group (33), and a third insulating gasket is arranged on the second boss (17); the third insulating spacer is in contact with the third electronic component group (33).

10. The power supply system according to claim 8, wherein an insulating board (51) is further disposed between each printed circuit board (2) and the inner side wall of the corresponding heat dissipation housing (1), and a second avoiding hole (511) is disposed on the insulating board (51) at a position corresponding to the second electronic component group (32) and the third electronic component group (33).