CN112077749A - Micro-groove jet polishing device and polishing method - Google Patents
Micro-groove jet polishing device and polishing method Download PDFInfo
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- CN112077749A CN112077749A CN202011080103.5A CN202011080103A CN112077749A CN 112077749 A CN112077749 A CN 112077749A CN 202011080103 A CN202011080103 A CN 202011080103A CN 112077749 A CN112077749 A CN 112077749A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/08—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for polishing surfaces, e.g. smoothing a surface by making use of liquid-borne abrasives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
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Abstract
The invention discloses a micro-groove jet polishing device and a polishing method, wherein the polishing device comprises a base, a liquid supply system, a polishing nozzle and a workbench, wherein a workpiece fixing component is detachably arranged on the upper surface of the workbench and used for placing a workpiece to be processed, and the workpiece fixing component is correspondingly arranged below the polishing nozzle; the workpiece fixing assembly comprises an object placing table and a fixing element, the object placing table is placed on the upper surface of the workbench, a first groove and a second groove are vertically formed in the upper surface of the object placing table, and the vertical depth of the first groove is larger than that of the second groove; the polishing nozzle comprises a millimeter-scale polishing nozzle and a micron-scale polishing nozzle, and the fixed element comprises a cover plate and a mask; when the polishing nozzle is a micron-sized polishing nozzle, the fixed element is a cover plate; when the polishing nozzle is a millimeter-scale polishing nozzle, the fixing element is a mask.
Description
Technical Field
The invention belongs to the field of microstructure processing, and particularly relates to a micro-groove jet polishing device and a polishing method.
Background
In recent years, with the development of science and technology, products are gradually developed towards precision, integration and high performance, and parts with micro-groove structural features are widely applied in various fields, including optics, chemistry, biomedicine, microelectronics and the like. For example, the optical glass micro-groove array has the functions of reducing the light reflectivity, improving the transmissivity and the diffraction efficiency, controlling the light energy general distribution and the like; in cell research, a glass device with a micro groove is needed to simulate the microenvironment of cells and research the differentiation, growth, migration and other behaviors of the cells; the micro-groove structure of devices such as an electrode plate of a fuel cell, an antifriction resistance reduction device on a fluid machine, a grating cover of a display and the like has remarkable advantages in the aspects of heat transfer characteristics, fluid dynamic characteristics, mechanical characteristics, friction characteristics, bionic characteristics and the like.
At present, the methods for manufacturing the surface of the microstructure mainly include chemical etching, ion beam, imprinting, laser processing, micro-machining and the like. Chemical etching is commonly used for processing glass devices and is divided into dry etching and wet etching. The wet etching adopts hydrofluoric acid solution as an etching agent to etch the glass, the etching rate is difficult to control, and the quality of the etched surface is poor. The dry etching adopts fluorine-based gas such as CF4, CHF3, SF6 and the like and auxiliary gas such as argon, helium and the like to etch the glass under plasma, so that the equipment cost is high and the etching rate is slow. The laser processing has high requirements on energy density, high energy consumption, large processing heat affected zone, easy generation of problems of fragmentation, edge breakage and the like. The micro-machining process usually adopts a diamond cutter with high wear resistance and high sharpness, and burrs are easily generated on a microstructure. The methods for processing the micro-groove have the main problems of poor surface quality, complex equipment, high cost and low processing efficiency, and limit the application of the micro-groove structure, so that a proper micro-groove polishing method and device are needed.
Disclosure of Invention
The invention aims to overcome the defects in the existing micro-groove processing technology, and the surface quality of the micro-groove is improved by adopting a jet polishing method. When a jet polishing technology is used for polishing the micro-groove, the diameter of a jet beam needs to be small and the width of the groove under the general condition, otherwise, the rest surface of a workpiece can be damaged, and the smaller the aperture of a nozzle is, the larger the processing difficulty is and the higher the cost is; in addition, the precise positioning and tool setting of the moving platform are required during processing, the operation is complex, therefore, the method is also improved, the small-aperture polishing nozzle and the workpiece fixing component are matched for use, the micro-groove jet polishing device which is low in manufacturing cost, low in technical requirement level, high in processing efficiency and free of precise positioning and tool setting is provided, and a crack-free surface can be formed, so that the surface quality of the micro-groove is improved.
The micro-groove jet polishing device comprises a base, a liquid supply system, a polishing nozzle and a workbench, wherein the liquid supply system is arranged close to one side wall of the base and used for conveying polishing liquid containing abrasive particles to the polishing nozzle so as to impact a micro-groove to be polished; a five-axis motion platform or a mechanical arm is fixedly arranged on the base, and the polishing nozzle is arranged at the end part of the five-axis motion platform or the mechanical arm; the workbench is placed on the upper surface of the base. The upper surface of the workbench is detachably provided with a workpiece fixing component for placing a workpiece to be processed, and the workpiece fixing component is correspondingly arranged below the polishing nozzle.
Further, the workpiece fixing assembly comprises an object placing table and a fixing element, the object placing table is fixedly arranged on the upper surface of the workbench, a first groove and a second groove are vertically arranged on the upper surface of the object placing table, and the vertical depth of the first groove is greater than that of the second groove; the first groove is used for embedding the workpiece to be processed into the first groove, the second groove is used for placing the fixing element, the fixing element is used for fixing the workpiece on the object placing table, and a hole is correspondingly formed in the fixing element and detachably connected with the object placing table.
Further, the polishing nozzle comprises a millimeter-scale polishing nozzle and a micron-scale polishing nozzle, and the aperture of the micron-scale polishing nozzle is smaller than the width of the micro groove to be polished; the aperture of the millimeter-scale polishing nozzle is larger than the width of the micro-groove to be polished.
Further, the fixing element comprises a cover plate and a mask; the mask is provided with a groove, and the width of the bottom of the groove of the mask is the same as that of the micro groove to be polished.
Further, the width of the first groove in the longitudinal axis direction is greater than or equal to the length of the workpiece in the longitudinal axis direction; the width of the second groove in the transverse axis direction is greater than or equal to the width of the workpiece in the transverse axis direction.
Further, when the polishing nozzle is a micron-sized polishing nozzle, the fixing element is a cover plate; when the polishing nozzle is a millimeter-scale polishing nozzle, the fixing element is a mask.
Furthermore, the inclination angle of the side wall of the groove of the mask is within the range of 30-70 degrees.
Further, the micro-groove jet polishing device is suitable for polishing V-shaped, U-shaped and rectangular micro-grooves.
Further, the micro-groove jet polishing device is suitable for polishing micro-grooves on metal materials and hard and brittle materials.
In order to achieve the object of the present invention, the present invention also provides a micro-groove polishing method using a micro-scale polishing nozzle, comprising:
step 1: preparing polishing solution according to the size of a micro groove of a workpiece to be processed, and mounting a micron-sized polishing nozzle on a five-axis motion platform or a mechanical arm, wherein the aperture of the micron-sized polishing nozzle is smaller than the width of the micro groove to be polished;
step 2: designing a motion track of the polishing nozzle according to the size of the micro-groove and generating a corresponding numerical control program;
and step 3: fixedly mounting the object placing table on a workbench, embedding a workpiece to be processed into a first groove of the object placing table, adjusting the position of the workpiece, pressing a cover plate on the workpiece and embedding the cover plate into a second groove of the object placing table, and fixing the cover plate to further fix the workpiece;
and 4, step 4: and (3) starting the liquid supply system, operating the numerical control program generated in the step (2) after the pressure fluctuation range of the liquid supply system is stabilized within +/-3% of a preset pressure value, ejecting the polishing liquid through the micron-sized polishing nozzle to form polishing liquid jet flow, polishing the workpiece, and recovering and recycling the polishing liquid after impacting the surface of the workpiece.
The invention also provides a micro-groove polishing method using the millimeter-scale polishing nozzle, which comprises the following steps:
step 1: preparing polishing solution according to the size of a micro groove of a workpiece to be processed, and mounting a millimeter-grade polishing nozzle on a five-axis motion platform or a mechanical arm, wherein the aperture of the millimeter-grade polishing nozzle is larger than the width of the micro groove to be polished;
step 2: designing a motion track of the polishing nozzle according to the size of the micro-groove and generating a corresponding numerical control program;
and step 3: fixedly mounting an object placing table on a workbench, embedding a workpiece to be processed into a first groove of the object placing table, adjusting the position of the workpiece, pressing a mask on the workpiece and embedding the mask into a second groove of the object placing table, adjusting the position of the mask to align a groove on the mask with a micro groove to be polished, and fixing the mask;
and 4, step 4: starting a liquid supply system, operating the numerical control program generated in the step 2 after the pressure fluctuation range of the liquid supply system is stabilized within +/-3% of a preset pressure value, ejecting polishing liquid through the millimeter-scale polishing nozzle to form polishing liquid jet flow, and after the polishing liquid is ejected from the millimeter-scale polishing nozzle, impacting the surface of the workpiece to be processed through the groove on the mask to remove materials in the exposed area of the workpiece so as to polish the micro-groove; the polishing solution is recycled after impacting the surface of the workpiece for cyclic utilization.
Compared with the prior art, the embodiment of the invention has the beneficial effects and obvious progress that:
1. the micro-groove jet polishing device and the method provided by the invention have the advantages that a polishing liquid jet is adopted to impact a workpiece, the corresponding polishing nozzle and the workpiece fixing component are selected according to the condition of the workpiece to be processed, and the small-aperture polishing nozzle and the workpiece fixing component are matched for use, so that the micro-groove jet polishing device and the method are low in manufacturing cost, low in technical requirement level and high in processing efficiency;
2. the polishing device provided by the invention adopts the millimeter-scale polishing nozzle to be matched with the mask, the position of the nozzle does not need to be accurately positioned, and the flow direction of jet flow on the surface of a workpiece is controlled through the mask to process the micro-groove. The controllability of the processing process is high, the process repeatability is good, and the automatic processing is easy to realize. The equipment is simple, the production cost is low, and the material removal rate and efficiency are high;
3. by adopting the workpiece provided by the invention, a crack-free surface can be formed, and the surface quality of the micro-groove is improved; and the cover plate and the mask can be reused and used for polishing micro grooves of different workpieces, so that the processing efficiency is improved, and meanwhile, the production cost is reduced.
Drawings
FIG. 1 is a schematic view of the overall structure of a micro-groove jet polishing device according to the present invention;
FIG. 2 is a schematic view showing a cover plate holding a workpiece placed on the stand in FIG. 1;
FIG. 3a is a front view of FIG. 2; FIG. 3b is a side view of FIG. 2;
FIG. 4a shows a front view of the cover plate of FIG. 2; FIG. 4b shows a side view of the cover plate of FIG. 1;
FIG. 5 is a schematic view showing a mask holding workpiece placed on the stage in FIG. 1;
FIG. 6a is a front view of FIG. 5; FIG. 6b is a side view of FIG. 5;
FIG. 7a shows a front view of the mask of FIG. 5; fig. 7b shows a side view of the mask of fig. 5.
In the figure:
1: a liquid supply system 2: base seat
3: and (4) sliding block: first connecting rod
5: second link 6: nozzle mounting location
7: polishing nozzle 8: working table
9: the object placing table 10: workpiece
11: cover plate 12: and (5) masking.
Detailed Description
In order to make the objects, technical solutions, advantages and significant progress of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings provided in the embodiments of the present invention, and it is obvious that all of the described embodiments are only some embodiments of the present invention, but not all embodiments; all other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "fixed," "connected," and the like are to be understood broadly, and for example, may be fixedly connected, detachably connected or movably connected, or may be integrated; the connection can be direct connection, indirect connection through an intermediate medium or invisible signal connection, and can be the communication inside two elements or the interaction relation of the two elements; unless otherwise specifically defined, specific meanings of the above terms in the present invention can be understood as specific conditions by those of ordinary skill in the art.
It should be further noted that the following embodiments may be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments.
Example 1
As shown in fig. 1, a micro-groove jet polishing device comprises a base 2, a liquid supply system 1, a polishing nozzle 7 and a workbench 8, wherein the liquid supply system 1 is arranged adjacent to one side wall of the base 2, and the liquid supply system 1 is used for delivering polishing liquid containing abrasive particles to the polishing nozzle so as to impact a micro-groove to be polished. Wherein, the interaction between the abrasive particles in the polishing solution and the workpiece is carried out for nano removal, thereby realizing the polishing of the micro-groove; the liquid supply system 1 delivers the prepared polishing liquid to the polishing nozzle 7 through a liquid supply pipeline at a certain pressure. And a five-axis motion platform is fixedly arranged on the base 2 and used for adjusting the pose of the polishing nozzle relative to a workpiece to be processed, and the five-axis motion platform comprises a three-axis linear motion mechanism and a two-axis rotary motion mechanism. And the polishing nozzle 7 is arranged at the end part of the five-axis motion platform. The three-axis linear motion mechanism drives the polishing nozzle 7 to linearly move along the X-axis direction, the Y-axis direction and the Z-axis direction, the two-axis rotary motion mechanism comprises a first connecting rod 4 and a second connecting rod 5, the first connecting rod 4 is pivoted with a sliding block 3 of the three-axis linear motion mechanism and used for driving the polishing nozzle to rotate relative to the sliding block 3360 degrees, the first connecting rod 4 is pivoted with the second connecting rod 5 and used for driving the polishing nozzle to rotate relative to the first connecting rod 360 degrees, and the polishing nozzle 7 is detachably mounted at the tail end, close to the base, of the two-axis rotary motion mechanism; the polishing nozzle can be overturned at any space angle by matching the two rotating shafts.
The table 8 is placed on the upper surface of the base 2. The upper surface of the workbench 8 is provided with a T-shaped groove, the workpiece fixing component is fixed on the workbench by using a T-shaped nut and a screw and used for placing a workpiece to be processed, and the workpiece fixing component is correspondingly arranged below the polishing nozzle 7. The workpiece fixing assembly comprises an object placing table 9 and a cover plate 11, the object placing table 9 is fixedly arranged on the upper surface of the workbench 8, a first groove and a second groove which are vertically arranged are formed in the upper surface of the object placing table 9, and the vertical depth of the first groove is larger than that of the second groove; the first groove is used for embedding the workpiece to be machined into the first groove, the second groove is used for placing the cover plate 11, the cover plate 11 is used for fixing the workpiece on the object placing table, a threaded hole is formed in the object placing table, a hole corresponding to the threaded hole in the object placing table is formed in the cover plate 11, and the cover plate is riveted with the object placing table through a screw, so that the workpiece is fixed. Further, the width of the first groove in the Y direction is equal to the length of the workpiece in the Y direction; the width of the second groove in the X direction is larger than the width of the workpiece in the X direction.
Fig. 2 to 4 show a schematic view of a workpiece fixed by a cover plate 11, wherein the cover plate 11 is square, and the end of the cover plate 11 is correspondingly provided with a hole for riveting with the object placing table 9, and the cover plate 11 is pressed on the workpiece and then riveted with the object placing table 9.
The polishing nozzle 7 comprises a millimeter-scale polishing nozzle and a micron-scale polishing nozzle; the aperture of the micron-sized polishing nozzle is smaller than the width of the micro-groove to be polished; the aperture of the millimeter-scale polishing nozzle is larger than the width of the micro-groove to be polished.
When the micron-sized polishing nozzle is used for polishing micro grooves, a workpiece to be machined is embedded into a first groove of the object placing table, the position of the workpiece is adjusted, the cover plate 11 is pressed on the workpiece and embedded into a second groove of the object placing table, the workpiece is fixed by the cover plate 11, the jet flow impacts the micro grooves to be polished through accurate tool setting and positioning of the five-axis motion platform, and the slider 3 of the five-axis motion platform drives the polishing nozzle 7 to move along the direction of the grooves to polish.
The polishing method of the micro-groove jet polishing device using the micron-sized polishing nozzle comprises the following steps:
step 1: preparing polishing solution according to the size of a micro groove of a workpiece to be processed, and mounting a micron-sized polishing nozzle 7 on a five-axis motion platform, wherein the aperture of the micron-sized polishing nozzle 7 is smaller than the width of the micro groove to be polished;
step 2: designing a motion track of the polishing nozzle according to the size of the micro-groove, and generating a numerical control program;
and step 3: fixedly mounting the object placing table on a workbench 8, embedding a workpiece to be processed into a first groove of the object placing table 9, adjusting the position of the workpiece, pressing a cover plate 11 on the workpiece and embedding the cover plate 11 into a second groove of the object placing table, and fixing the cover plate 11 to further fix the workpiece;
and 4, step 4: and starting the liquid supply system, operating a designed numerical control program before operation after the pressure fluctuation range of the liquid supply system is stabilized within +/-3% of a preset pressure value, ejecting polishing liquid through the micron-sized polishing nozzle to form polishing liquid jet flow, polishing the workpiece, and recovering and recycling the polishing liquid after impacting the surface of the workpiece.
Example 2
This embodiment is substantially the same as embodiment 1 except that the cover plate 11 is replaced with the mask 12. As shown in FIGS. 1 and 5 to 7, the micro-groove jet polishing device of the present invention comprises a base 2, a liquid supply system 1, a polishing nozzle 7 and a work table 8, and a mask 12 for micro-groove polishing.
Fig. 5 to 7 show a schematic view of a mask 12 for fixing a workpiece, the end of which is correspondingly provided with a hole for riveting with the stage 9, the mask 12 being pressed against the workpiece and then riveted with the stage 9. The mask 12 is provided with a groove, and the width of the bottom of the groove of the mask is the same as that of the micro groove to be polished. As shown in fig. 7, the side wall of the trench of the mask has an inclination angle of 45 °, and the side wall of the trench of the mask can control the polishing liquid jet ejected by the polishing nozzle 4 to flow on the surface of the workpiece 10 along the direction of the trench of the mask, thereby increasing the material removal efficiency.
The grooves on the mask 12 of the present invention can be designed according to the micro-groove polishing requirements of the workpiece 10, and grooves with different widths, different inclination angles and different numbers are designed according to different requirements.
The same mask 12 of the present invention can be used for micro-groove polishing of different workpieces 10, reducing the cost of manufacturing the mask 12 and improving efficiency.
When the millimeter-scale polishing nozzle is used for polishing the micro-groove, a workpiece to be processed is embedded into the first groove of the object placing table 9, the position of the workpiece is adjusted, the mask 12 is pressed on the workpiece and embedded into the second groove of the object placing table, the position of the mask 12 is adjusted, the groove on the mask 12 is aligned with the micro-groove to be polished, and the mask is fixed; after the polishing solution is sprayed out of the millimeter-scale polishing nozzle, the polishing solution impacts the surface of the workpiece to be processed through the groove on the mask, and material removal is generated in an exposed area of the workpiece, so that micro-groove polishing is performed; the mask has a protection effect, can protect the covered area of the workpiece to be processed, and the micro-groove polishing can be completed by the motion platform without accurate positioning and tool setting.
The invention also provides a micro-groove polishing method using the millimeter-scale polishing nozzle, which comprises the following steps:
step 1: preparing polishing solution according to the size of a micro groove of a workpiece to be processed, and mounting a millimeter-scale polishing nozzle on a five-axis motion platform, wherein the aperture of the millimeter-scale polishing nozzle is larger than the width of the micro groove to be polished;
step 2: designing a motion track of the polishing nozzle according to the size of the micro-groove, and generating a numerical control program;
and step 3: fixedly mounting an object placing table 9 on a workbench 8, embedding a workpiece to be processed into a first groove of the object placing table, adjusting the position of the workpiece, pressing a mask 12 on the workpiece and embedding the mask into a second groove of the object placing table 9, adjusting the position of the mask to align a groove on the mask 12 with the micro groove to be polished, and fixing the mask;
and 4, step 4: starting a liquid supply system, after the pressure fluctuation range of the liquid supply system is stabilized within +/-3% of a preset pressure value, operating a designed numerical control program before operation, when the preset pressure value of the liquid supply system is 1MPa, stabilizing the pressure of polishing liquid within 0.97-1.03 MPa, ejecting the polishing liquid through a millimeter-scale polishing nozzle to form polishing liquid jet flow, ejecting the polishing liquid from a millimeter-scale polishing nozzle 7, impacting the surface of a workpiece to be processed through a groove on a mask, and removing materials in an exposed area of the workpiece so as to polish the micro-groove; the polishing solution is recycled after impacting the surface of the workpiece for cyclic utilization.
Although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made on the technical solutions described in the foregoing embodiments, or some or all of the technical features of the embodiments can be replaced with equivalents, without departing from the scope of the embodiments of the present invention, and the technical solutions can not be modified or replaced by the modifications, the modifications and the substitutions in the non-essential scope of the present invention.
Claims (10)
1. A micro-groove jet polishing device comprises a base (2), a liquid supply system (1), a polishing nozzle (7) and a workbench (8), wherein the liquid supply system (1) is arranged close to one side wall of the base (2), and the liquid supply system (1) is used for conveying polishing liquid containing abrasive particles to the polishing nozzle (7) so as to impact a micro-groove to be polished; a five-axis motion platform or a mechanical arm is fixedly arranged on the base (2), and the polishing nozzle (7) is arranged at the end part of the five-axis motion platform or the mechanical arm; the workbench (8) is placed on the upper surface of the base (2); the polishing device is characterized in that a workpiece fixing component is detachably mounted on the upper surface of the workbench (8) and used for placing a workpiece to be processed, and the workpiece fixing component is correspondingly arranged below the polishing nozzle (7);
the workpiece fixing assembly comprises an object placing table (9) and a fixing element, the object placing table (9) is fixedly arranged on the upper surface of the workbench (8), a first groove and a second groove which are vertically arranged are formed in the upper surface of the object placing table (9), and the vertical depth of the first groove is larger than that of the second groove; the first groove is used for embedding the workpiece to be processed into the first groove, the second groove is used for placing the fixing element, the fixing element is used for fixing the workpiece on the object placing table, and a hole is correspondingly formed in the fixing element and detachably connected with the object placing table;
the polishing nozzle comprises a millimeter-scale polishing nozzle and a micron-scale polishing nozzle, and the fixed element comprises a cover plate and a mask;
when the polishing nozzle is a micron-sized polishing nozzle, the fixed element is a cover plate;
when the polishing nozzle is a millimeter-scale polishing nozzle, the fixing element is a mask.
2. The micro-groove jet polishing device according to claim 1, wherein the micron-sized polishing nozzle aperture is smaller than the width of the micro-groove to be polished; the aperture of the millimeter-scale polishing nozzle is larger than the width of the micro-groove to be polished.
3. The micro-groove jet polishing device according to claim 1, wherein the mask has a groove, and the width of the bottom of the groove of the mask is the same as the width of the micro-groove to be polished.
4. The micro-groove jet polishing device according to claim 1, wherein the width of the first groove in the longitudinal axis direction is equal to or greater than the length of the workpiece in the longitudinal axis direction; the width of the second groove in the transverse axis direction is greater than or equal to the width of the workpiece in the transverse axis direction.
5. The micro-groove jet polishing apparatus according to claim 4, wherein the width of the first groove in the longitudinal direction is equal to the length of the work piece in the longitudinal direction.
6. The micro-groove jet polishing apparatus of claim 3, wherein the inclination angle of the groove sidewall of the mask is in the range of 30 ° to 70 °.
7. The micro-groove jet polishing device according to claim 1, wherein the micro-groove jet polishing device is suitable for polishing V-shaped, U-shaped and rectangular micro-grooves.
8. The micro-groove jet polishing device according to claim 1, wherein the micro-groove jet polishing device is suitable for polishing micro-grooves on metal materials and hard and brittle materials.
9. A micro-groove polishing method using a micro-scale polishing nozzle, the polishing method comprising:
step 1: preparing polishing solution according to the size of a micro groove of a workpiece to be processed, and mounting a micron-sized polishing nozzle on a five-axis motion platform or a mechanical arm, wherein the aperture of the micron-sized polishing nozzle is smaller than the width of the micro groove to be polished;
step 2: designing a motion track of the polishing nozzle according to the size of the micro-groove and generating a corresponding numerical control program;
and step 3: fixedly mounting the object placing table on a workbench, embedding a workpiece to be processed into a first groove of the object placing table, adjusting the position of the workpiece, pressing a cover plate on the workpiece and embedding the cover plate into a second groove of the object placing table, and fixing the cover plate to further fix the workpiece;
and 4, step 4: and (3) starting the liquid supply system, operating the numerical control program generated in the step (2) after the pressure fluctuation range of the liquid supply system is stabilized within +/-3% of a preset pressure value, ejecting the polishing liquid through the micron-sized polishing nozzle to form polishing liquid jet flow, polishing the workpiece to be processed, and recovering and recycling the polishing liquid after impacting the surface of the workpiece.
10. A micro-groove polishing method using a millimeter-sized polishing nozzle, characterized by comprising:
step 1: preparing polishing solution according to the size of a micro groove of a workpiece to be processed, and mounting a millimeter-grade polishing nozzle on a five-axis motion platform or a mechanical arm, wherein the aperture of the millimeter-grade polishing nozzle is larger than the width of the micro groove to be polished;
step 2: designing a motion track of the polishing nozzle according to the size of the micro-groove and generating a corresponding numerical control program;
and step 3: fixedly mounting an object placing table on a workbench, embedding a workpiece to be processed into a first groove of the object placing table, adjusting the position of the workpiece, pressing a mask on the workpiece and embedding the mask into a second groove of the object placing table, adjusting the position of the mask to align a groove on the mask with a micro groove to be polished, and fixing the mask;
and 4, step 4: starting a liquid supply system, operating the numerical control program generated in the step 2 after the pressure fluctuation range of the liquid supply system is stabilized within +/-3% of a preset pressure value, ejecting polishing liquid through the millimeter-scale polishing nozzle to form polishing liquid jet flow, and after the polishing liquid is ejected from the millimeter-scale polishing nozzle, impacting the surface of the workpiece to be processed through the groove on the mask to remove materials in the exposed area of the workpiece so as to polish the micro-groove; the polishing solution is recycled after impacting the surface of the workpiece for cyclic utilization.
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