CN114378704A - Ultra-precise and efficient polishing device and method suitable for large-size KDP crystals - Google Patents
Ultra-precise and efficient polishing device and method suitable for large-size KDP crystals Download PDFInfo
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- CN114378704A CN114378704A CN202210037263.4A CN202210037263A CN114378704A CN 114378704 A CN114378704 A CN 114378704A CN 202210037263 A CN202210037263 A CN 202210037263A CN 114378704 A CN114378704 A CN 114378704A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses an ultra-precise and efficient polishing device and method suitable for large-size KDP crystals, wherein the polishing device comprises a supporting unit, a precise horizontal movement sliding table, a workpiece polishing and clamping unit, a multi-point concentration continuous adjustable polishing solution supply unit, a base, a precise rotary worktable, a polishing pad trimming unit, an online measuring unit, a polishing residual liquid continuous absorbing and recovering unit and an equipment control system unit; the polishing method comprises three stages of rough polishing, fine polishing and ultra-precise polishing, different types of polishing liquid are adopted in each processing stage, the full-caliber rough, fine and ultra-precise multi-procedure integrated polishing of the large-size KDP crystal can be realized through the control system, and the polishing method has the characteristics of high processing efficiency, high processing precision and the like. The invention can realize the ultra-precise polishing processing of the large KDP crystal, improve the processing efficiency and realize the high-efficiency, high-quality and near-damage ultra-precise processing of the large KDP crystal.
Description
Technical Field
The invention belongs to the technical field of precision and ultra-precision polishing, and particularly relates to an ultra-precision efficient polishing device and method suitable for large-size KDP crystals.
Background
A class of deliquescent or water-soluble crystalline materials exists in nature, such as sodium chloride NaCl crystals, potassium dihydrogen phosphate KH2PO4KDP crystal for short, and the like. The KDP crystal as a high-quality nonlinear optical material can be used as a frequency doubling conversion element and a photoelectric switch, and has great engineering application value. KDP crystal material used as optical element usually requires to be processed to ultra-precision, for example, KDP crystal optical element used in inertial confinement nuclear fusion system, not only the size is larger than 400mm x 400mm, but also the processing precision requires near damage of surface and sub-surface layer, the surface roughness RMS is less than 4nm, the distortion of transmitted wave front is less than lambda/6, the processing requirement is almost close to the limit of manufacture, and the material itself has the characteristics of softness, brittleness, easy moisture release, extremely sensitive processing temperature and the like, so that the material becomes a recognized crystal material which is extremely difficult to be processed, and the existing mechanical method is almost difficult to realize near damage and ultra-precisionAnd (6) processing. Although the applicant of the patent innovatively provides a KDP crystal polishing method and patent based on water dissolution, and the polishing solution, polishing method and polishing device of the easily deliquescent KDP crystal based on the water dissolution characteristic of the material are continuously provided in the follow-up process, the problems that the surface oil coating needs to be cleaned subsequently, the large-size crystal is polished by a small grinding head, the automatic coarse and fine polishing switching is difficult to realize, the polishing efficiency is low and the like still exist, and the engineering application of the water dissolution polishing method of the large-size crystal is restricted, so that a novel ultra-precise and efficient polishing method suitable for the engineering processing of the large-size KDP crystal is urgently needed.
In the past ultra-precision processing techniques for deliquescent crystals, including KDP crystals, there are some patents and examples of related types:
chinese patent ZL200910010268.2 discloses a non-water-based non-abrasive polishing solution for soft and brittle deliquescent crystals, introduces a non-water-based non-abrasive chemical mechanical polishing solution which is suitable for ultra-precise polishing of soft and brittle crystals, adopts an oily substance as a polishing solution-based carrier liquid, forms a water-in-oil structure by a nonionic surfactant and water, is a colorless and transparent non-toxic and non-corrosive liquid, does not change after being placed for a long time, has good stability, has the advantage of avoiding embedding of abrasive particles, and realizes high-quality processing of KDP crystals. However, the overall processing efficiency is low, and the oily polishing solution is liable to remain on the crystal surface, is not easy to clean, and no special equipment has been developed for processing.
Chinese patent CN101310922A discloses a method for deliquescing and polishing monopotassium phosphate crystals, which uses absolute ethyl alcohol and water in a certain proportion to prepare polishing solution to process KDP samples cut by diamond, and due to the rapid volatilization and water absorption of the absolute ethyl alcohol, the concentration of the polishing solution is easily unbalanced, and the processed surface is rapidly deliquesced. Meanwhile, KDP crystals and polishing equipment are placed in a closed protective cover and polished by mixed steam at high temperature, sensitive cracking of the KDP crystals is easily caused by high temperature, and meanwhile, the closed protective cover cannot realize processing of large-size KDP crystals.
Chinese patent CN102615555B discloses a KDP crystal micro-nano deliquescence ultra-precise polishing method based on ultrasonic atomization water vapor, which is characterized in that KDP is processed by using clean water mist gas formed by mixing water mist generated by ultrasonic and clean and dry gas, and the polishing track is controlled by means of a computer, so that the global planarization polishing of the crystal surface is realized. But the overall processing efficiency is low and the requirements on processing conditions are high.
Chinese patent CN105150078B discloses a nondestructive numerical control water dissolution removal method for micro-nano textures on the surface of a KDP crystal, which selects an aqueous polishing solution, uses a small-size polishing head to process the KDP crystal, and combines computer trajectory planning to remove residual small-scale fly-cutting knife textures on the surface of the crystal, thereby realizing ultra-precision processing of the KDP crystal. However, the small-size grinding head has low overall efficiency, high requirement on track planning and high cost.
Chinese patent CN106926139B discloses a KDP crystal water-soluble micro-nano processing system and a processing method, introduces a KDP crystal water-soluble micro-nano processing system comprising a polishing solution performance continuous real-time regulating and controlling device, a polishing device and a clamping device, and configures a series of potassium dihydrogen phosphate solutions with different temperatures and mass percentage concentrations to efficiently process KDP crystals. However, due to the single type of the polishing solution and the limitation of a micro-nano processing system, the KDP processed by the method has small size, and the surface after processing has crystallization residues, so that the high-quality processing of large-size KDP crystals is difficult to realize.
Disclosure of Invention
In order to overcome the problems in the prior art, the invention provides an ultra-precise and efficient polishing device and method suitable for large-size KDP crystals, which can realize ultra-precise polishing processing of the large-size KDP crystals and improve processing efficiency.
In order to achieve the purpose, the invention adopts the technical scheme that: an ultraprecise and efficient polishing device suitable for large-size KDP crystals comprises a supporting unit, a precise horizontal movement sliding table, a workpiece polishing clamping unit, a multi-point concentration continuous adjustable polishing solution supply unit, a base, a precise rotary worktable, a polishing pad trimming unit, an online measuring unit, a polishing residual liquid continuous absorbing and recovering unit and an equipment control system unit;
the supporting unit comprises three upright supports, a Y-shaped cross beam and a central auxiliary support, the lower ends of the three upright supports are respectively connected with the base, the upper ends of the three upright supports are respectively connected with the three outer ends of the Y-shaped cross beam, the lower end of the central auxiliary support penetrates through the hollow precise rotary worktable and is connected with the base, the upper end of the central auxiliary support is connected with the center of the Y-shaped cross beam, and the three upright supports, the Y-shaped cross beam and the central auxiliary support form a three-upright support + central auxiliary support structure; the upright post support is hollow inside, and the side edge of the upright post support is provided with a wire pipe orifice for arranging a control cable;
the Y-shaped cross beam consists of three supporting beams, and a hanging ring is arranged at the upper part of each supporting beam; each supporting beam is provided with a precise horizontal movement sliding table, the precise horizontal movement sliding table of the first supporting beam is provided with a polishing pad trimming unit and an online measurement unit, the precise horizontal movement sliding table of the second supporting beam is provided with a workpiece polishing clamping unit, and the precise horizontal movement sliding table of the third supporting beam is provided with a workpiece polishing clamping unit or is empty; a cantilever support is arranged between the two supporting beams of the Y-shaped cross beam, and a multi-point concentration continuously adjustable polishing solution supply unit is arranged on the cantilever support;
the multi-point concentration continuous adjustable polishing solution supply unit comprises a multi-point solution supply pipe group, a distributed integrated control solution supply pump and a polishing solution heating system which are distributed along the radial direction of the precision rotary worktable, and the multi-point solution supply pipe group, the distributed integrated control solution supply pump and the polishing solution heating system are connected with the equipment control system unit;
the workpiece polishing and clamping unit comprises a balancing weight, a workpiece clamp and a shifting fork; the shifting fork is installed on the precise horizontal movement sliding table, the workpiece clamp is arranged inside the shifting fork, a workpiece is placed below the workpiece clamp, and the balancing weight is placed above the workpiece clamp;
the precise rotary worktable comprises a polishing pad, a marble worktable and a precise rotary table; the precise turntable is arranged on the base and is connected with the base through a positioning ring; the marble worktable is arranged on the precision rotary table; the polishing pad is stuck on the marble worktable;
the continuous absorption and recovery unit for the polishing residual liquid comprises a multi-point arrangement suction pipe group, a residual liquid recovery groove and a recovery groove support, wherein the multi-point arrangement suction pipe group is radially distributed along the precise rotary worktable, the multi-point arrangement suction pipe group is installed on a cantilever bracket of a Y-shaped cross beam, and the residual liquid recovery groove is installed above a base through the recovery groove support;
the polishing pad trimming unit comprises a servo motor, a vertical tool rest sliding table and a trimming cutter, wherein the servo motor is installed on one side of the upper end of the vertical tool rest sliding table, the trimming cutter is installed below the vertical tool rest sliding table, the polishing pad trimming unit is installed on a precise horizontal movement sliding table on a first supporting beam through the vertical tool rest sliding table, and the polishing pad trimming unit is controlled by the servo motor to move precisely in the horizontal direction of a polishing area so as to trim and process a polishing pad;
the online measuring unit comprises a measuring head support, a contact measuring head and a measuring system, wherein the contact measuring head is arranged below the measuring head support, the measuring system is arranged below the measuring head support and is connected and controlled by a cable, the online measuring unit is arranged on a precise horizontal movement sliding table on a first supporting beam by the measuring head support, and is controlled by the measuring system to controllably and precisely displace in the horizontal direction of a polishing area, so that the surface shape of a workpiece is measured in real time;
the device control system unit is arranged on one side outside the base, and the multipoint concentration continuous adjustable polishing solution supply unit is used for realizing multipoint continuous real-time adjustment and control supply of polishing solutions with different types and different water solution concentrations through program adjustment and control of the control system, so that automatic conversion of different procedures of rough polishing, fine polishing and ultra-fine polishing in the polishing process of the large-size KDP crystal is realized.
Further, the diameter range of the precision rotary table is phi 1000-phi 2000mm, and the precision rotary table is used for 100 multiplied by 100mm2To 600X 600mm2Polishing and processing the large-size KDP crystal.
An ultra-precise and efficient polishing method suitable for large-size KDP crystals comprises the following steps:
the method comprises the following steps: laying a polishing pad, and finishing the polishing pad by using a polishing pad finishing unit;
step two: clamping a workpiece in a workpiece clamp, and loading a balancing weight;
step three: a rough polishing processing stage; inputting corresponding polishing parameters in an equipment control system unit, starting a precision turntable to reach the corresponding rough polishing rotating speed parameter range, and continuously titrating polishing solution A for rough polishing to a polishing pad according to a program by using a multipoint concentration continuously adjustable polishing solution supply unit to perform rough polishing;
step four: a fine polishing processing stage; inputting corresponding polishing parameters in an equipment control system unit, and continuously titrating polishing solution B for finish polishing onto a polishing pad by using a multi-point concentration continuously adjustable polishing solution supply unit according to a program to perform finish polishing;
step five: ultra-precision polishing processing stage; the device comprises a polishing pad, a polishing residual liquid continuous absorbing and recovering unit, a polishing pad control system unit, a polishing residual liquid continuous absorbing and recovering unit, a polishing residual liquid control unit and a polishing pad control unit.
Further, the polishing solution A is deionized water; the polishing solution B is a KDP solution consisting of KDP crystal particles and deionized water; the polishing solution C is a micro-emulsion consisting of deionized water, a surfactant and an oily substance.
Furthermore, three intersection points formed by pairwise crossing the central axes of the three supporting beams of the Y-shaped cross beam form three vertexes of an equilateral triangle, and the central point of the equilateral triangle is positioned on the central axis of the precision rotary worktable; the inner ends of the three support beams are connected into a whole to form an equilateral triangle central structure, and the joints of the support beams and the outer edges of the support beams are in arc transition.
Furthermore, a rotary flow passage structure is arranged in the marble worktable, and liquid with a specified temperature circularly flows through the rotary flow passage structure, so that the temperature of the surface of the marble worktable is kept unchanged during working.
Further, the height of the center auxiliary support is adjusted through a rotating handle arranged on the side edge of the center of the Y-shaped cross beam, the rotating handle is provided with scales, and the horizontal precision of the Y-shaped cross beam is accurately adjusted through adjusting the scales.
Further, a filter screen is arranged at the outlet of the raffinate recovery tank.
Furthermore, a measuring head of the online measuring unit is a metal probe type measuring head or a laser type measuring head, and the metal probe type measuring head is used for realizing contact type measurement on the polishing pad; the laser type measuring head is used for realizing the online measurement of the surface shape precision of the workpiece.
Further, the dressing tool of the polishing pad dressing unit is replaced with a diamond grinding wheel.
Compared with the prior art, the invention has the following beneficial effects:
1. the supporting unit adopts a three-upright-column supporting and center auxiliary supporting structure, can ensure the stress balance of a large-span upper cross beam structure and the parallelism requirement with a workbench caused by the design of a large-size workbench, furthest prevent the deformation of the Y-shaped cross beam structure from influencing the accuracy of a machined surface, and realize quick installation and disassembly by arranging the lifting ring at the upper part of the Y-shaped cross beam; the deformation of the cross beam caused by self weight can be avoided, and the parallelism of a polishing system and the stability of the polishing process are improved;
2. the center structure of the equilateral triangle formed by the three support beams avoids gravity concentration; the area of the central area is increased, which is beneficial to the gravity balance. For the corbel with the length of L and the width of D, compared with a trisection concentric structure, the moving distance D & tan30 DEG/2 of the precise horizontal movement sliding table arranged on the corbel can be prolonged, the stroke of the precise horizontal movement sliding table is increased, and meanwhile, displacement interference is avoided; further, the deformation of the beam caused by self weight or polishing pressure can be avoided, and the precision of the ultra-precise polishing surface of the large-size KDP crystal is improved.
3. The polishing solution supply unit with continuously adjustable multi-point concentration is adopted, multi-point and continuous and uniform titration supply of different types of polishing solutions is realized through a numerical control program, one-time installation of a workpiece is realized, integrated automatic switching machining of three procedures of rough polishing, precise polishing and ultra-precise polishing of the workpiece is completed, repeated positioning errors of the workpiece are obviously reduced, and polishing efficiency is improved.
4. The device can realize the online measurement of the surface type precision of the workpiece through the online measurement unit, and realize the real-time finishing of the polishing pad through the polishing pad finishing unit.
5. Two supporting beams in the Y-shaped cross beam can realize simultaneous polishing of two workpieces, and the processing efficiency is improved.
6. The continuous absorption and recovery unit for the polishing residual liquid is used for absorbing the polishing residual liquid remained on the polishing pad after polishing, and ensures the uniformity and consistency of the concentration of the polishing liquid in a polishing area.
7. The polishing pad trimming unit is arranged on the precise horizontal movement sliding table, and the polishing pad trimming unit can be controlled to move precisely in the horizontal direction of a polishing area under the control of the servo motor, so that the polishing pad is trimmed.
8. The diameter range of the precision rotary worktable is phi 1000-phi 2000mm, and the precision rotary worktable is used for 100 multiplied by 100mm2To 600X 600mm2The size of the precise rotary worktable is larger than that of the workpiece, and the workpiece can be integrally processed in a processing area, namely full-caliber annular polishing can be realized; the ultra-precision polishing machine can realize the ultra-precision processing of large-size KDP crystals, and can be popularized and used for polishing the planes of workpieces made of other materials by replacing process parameters such as polishing solution, polishing pads, the rotation speed of a precision turntable and the like.
9. The method is an automatic processing technology for high-quality and high-efficiency polishing of a planar workpiece, which can be applied in an engineering way and comprises three stages of rough polishing, precise polishing and ultra-precise polishing, wherein the rough polishing stage realizes the high-efficiency polishing of a large-size KDP crystal through polishing solution A and rough processing parameters, and the precise polishing stage realizes the high-efficiency removal of surface scratches of the large-size KDP crystal through polishing solution B and fine processing parameters. In the ultra-precision polishing processing stage, high-surface-quality and near-damage ultra-precision micro-nano processing of the large-size KDP crystal is realized through the polishing solution C and the ultra-precision processing parameters, micro-nano damage on the surface of the crystal is removed, nano-scale surface roughness is obtained, and finally ultra-precision processing of the large-size KDP crystal is realized.
10. In conclusion, the ultra-precise and efficient polishing device and method for the large-size KDP crystal, which are oriented to engineering application, can realize the full-caliber coarse, fine and ultra-precise multi-procedure integrated polishing and machining of the large-size KDP crystal, and have the characteristics of remarkable high machining efficiency and high machining precision.
Drawings
Fig. 1 is a schematic diagram of the structure of the device of the present invention (cables not shown).
Fig. 2 is a schematic view of the K-direction expanded structure of fig. 1.
Fig. 3 is a schematic view of a structure of a Y-shaped beam.
Fig. 4 is a partially enlarged schematic view at a in fig. 3.
Fig. 5 is a schematic structural view of a workpiece polishing clamping unit.
Fig. 6 is a schematic view of a polishing pad conditioning unit.
Fig. 7 is a schematic diagram of the structure of the on-line measuring unit.
In the figure: 1. a support unit; 2. a precision horizontal motion slide table; 3. a workpiece polishing clamping unit; 4. a multi-point liquid supply tube group; 5. the multi-point concentration can continuously regulate and control the polishing solution supply unit; 6. a base; 7. a precision rotary table; 8. a hoisting ring; 9. a polishing pad dressing unit; 10. an online measurement unit; 11. a polishing residual liquid continuous absorbing and recovering unit; 12. a distributed integrated control liquid supply pump; 13. a polishing solution heating system; 14. an equipment control system unit; 15. supporting by using an upright post; 16. a Y-shaped beam; 17. a central auxiliary support; 18. a workpiece; 19. a balancing weight; 20. a workpiece holder; 21. a shifting fork; 22. a polishing pad; 23. a marble work table 24, a precision turntable; 25. a positioning ring; 26. the suction pipe groups are arranged at multiple points; 27. a raffinate recovery tank; 28. a recovery tank support; 29. a servo motor; 30. a vertical tool rest sliding table; 31. trimming the cutter; 32. a probe holder; 33. a contact measurement head; 34. and (4) a measuring system.
Detailed Description
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings. As shown in fig. 1, in order to achieve the above object, the present invention adopts the following technical solutions: an ultraprecise and efficient polishing device suitable for large-size KDP crystals comprises a supporting unit 1, a precise horizontal movement sliding table 2, a workpiece polishing clamping unit 3, a multi-point concentration continuous adjustable polishing solution supply unit 5, a base 6, a precise rotary worktable 7, a polishing pad trimming unit 9, an online measuring unit 10, a polishing residual liquid continuous absorbing and recovering unit 11 and an equipment control system unit 14;
the supporting unit 1 comprises three upright supports 15, a Y-shaped cross beam 16 and a central auxiliary support 17, the lower ends of the three upright supports 15 are respectively connected with the base 6, the upper ends of the three upright supports are respectively connected with the three outer ends of the Y-shaped cross beam 16, the lower end of the central auxiliary support 17 penetrates through the hollow precise rotary worktable 7 to be connected with the base 6, the upper end of the central auxiliary support 17 is connected with the center of the Y-shaped cross beam 16, and the three upright supports 15, the Y-shaped cross beam 16 and the central auxiliary support 17 form a three-upright support 15+ central auxiliary support 17 structure; the upright post support 15 is hollow, and the side edge of the upright post support is provided with a wire pipe orifice for arranging a control cable;
the Y-shaped cross beam 16 consists of three support beams, and a lifting ring 8 is arranged at the upper part of each support beam, as shown in FIG. 3; each supporting beam is provided with a precise horizontal movement sliding table 2, the precise horizontal movement sliding table 2 of the first supporting beam is provided with a polishing pad dressing unit 9 and an online measuring unit 10, the precise horizontal movement sliding table 2 of the second supporting beam is provided with a workpiece polishing clamping unit 3, and the precise horizontal movement sliding table 2 of the third supporting beam is provided with the workpiece polishing clamping unit 3 or is empty; a cantilever support is arranged between the two support beams of the Y-shaped cross beam 16, and a multi-point concentration continuously adjustable polishing solution supply unit 5 is arranged on the cantilever support;
the multi-point concentration continuous adjustable polishing solution supply unit 5 comprises a multi-point solution supply pipe group 4, a distributed integrated control solution supply pump 12 and a polishing solution heating system 13 which are distributed along the radial direction of the precision rotary worktable 7, and the multi-point solution supply pipe group 4, the distributed integrated control solution supply pump 12 and the polishing solution heating system 13 are connected with an equipment control system unit 14;
the workpiece polishing clamping unit 3 comprises a balancing weight 19, a workpiece clamp 20 and a shifting fork 21, as shown in fig. 5; the shifting fork 21 is installed on the precise horizontal movement sliding table 2, the workpiece clamp 20 is arranged inside the shifting fork 21, the workpiece 18 is placed below the workpiece clamp 20, and the balancing weight 19 is placed above the workpiece clamp 20;
the precision rotary table 7 comprises a polishing pad 22, a marble table 23 and a precision turntable 24, as shown in fig. 2; the precision turntable 24 is arranged on the base 6 and is connected with the base 6 through a positioning ring 25; the marble worktable 23 is arranged on a precise rotary table 24; the polishing pad 22 is adhered to the marble work table 23;
the continuous polishing raffinate absorbing, removing and recycling unit 11 comprises a multipoint arrangement suction pipe group 26, a raffinate recycling groove 27 and a recycling groove support 28, wherein the multipoint arrangement suction pipe group 26 is radially distributed along the precision rotary worktable 7, the multipoint arrangement suction pipe group 26 is arranged on a cantilever support of the Y-shaped beam 16, and the raffinate recycling groove 27 is arranged above the base 6 through the recycling groove support 28;
the polishing pad dressing unit 9 comprises a servo motor 29, a vertical tool rest sliding table 30 and a dressing tool 31, as shown in fig. 6, the servo motor 29 is installed on one side of the upper end of the vertical tool rest sliding table 30, the dressing tool 31 is installed below the vertical tool rest sliding table 30, the polishing pad dressing unit 9 is installed on the precise horizontal movement sliding table 2 on the first support beam through the vertical tool rest sliding table 30, the polishing pad dressing unit 9 is controlled by the servo motor 29 to move precisely in the horizontal direction of a polishing area, and dressing processing of the polishing pad 22 is realized;
the online measuring unit 10 comprises a measuring head support 32, a contact measuring head 33 and a measuring system 34, the measuring head 33 is installed below the measuring head support 32, the measuring system 34 is installed below the measuring head support 32 and is connected and controlled with the contact measuring head 33 through a cable, the online measuring unit 10 is installed on a precise horizontal movement sliding table 2 on a first supporting beam through the measuring head support 32, the online measuring unit 10 is controlled to be controllably and precisely displaced in the horizontal direction of a polishing area through the measuring system 34, and the surface shape of the workpiece 18 is measured in an online manner in real time;
the equipment control system unit 14 is arranged on one side outside the base 6, and through program regulation and control of the control system, the multi-point concentration continuous adjustable polishing solution supply unit 5 can realize multi-point continuous real-time regulation and control supply of polishing solutions of different types and different aqueous solution concentrations, and automatic conversion of different procedures of rough polishing, fine polishing and ultra-fine polishing in the polishing process of the large-size KDP crystal is realized.
An ultra-precise and efficient polishing method suitable for large-size KDP crystals comprises the following steps:
the method comprises the following steps: laying the polishing pad 22 and dressing the polishing pad 22 using the polishing pad dressing unit 9;
step two: clamping the workpiece 18 in the workpiece holder 20 and loading the counterweight 19;
step three: a rough polishing processing stage; inputting corresponding polishing parameters into an equipment control system unit 14, wherein the rotating speed of a rotary table is 6r/min, the rotation speed of a KDP crystal is 150r/min, the flow of polishing solution is 1ml/min, no loading is carried out, the polishing time is 1min, starting a precision rotary table 24 to reach the corresponding rough polishing rotating speed parameter range, continuously titrating the polishing solution A for rough polishing to a polishing pad 22 by using a multi-point concentration continuously adjustable polishing solution supply unit 5 according to a program, carrying out rough polishing, distributing disordered scratches on the surface of the large-size KDP crystal after polishing, and enabling the surface roughness Sa to reach 23.504 nm;
step four: a fine polishing processing stage; inputting corresponding polishing parameters into an equipment control system unit 14, wherein the rotating speed of a rotary table is 5r/min, the rotation speed of a KDP crystal is 100r/min, the flow rate of polishing solution is 30ml/min, the polishing pressure is 11kPa, the polishing time is 5min, a polishing solution supply unit 5 with continuously adjustable and controllable multi-point concentration is used for continuously titrating polishing solution B for finish polishing onto a polishing pad 22 according to a program, finish polishing is carried out, fine and small tide points exist on the surface of a large-size KDP crystal after polishing, and the surface roughness Sa reaches 8.617 nm;
step five: ultra-precision polishing processing stage; the processing parameters are input into the equipment control system unit 14, the rotating speed of the rotary table is 7r/min, the rotation speed of the KDP crystal is 120r/min, the flow rate of polishing liquid is 10ml/min, the polishing pressure is 15kPa, the polishing liquid supply unit 5 with continuously adjustable and controllable concentration at multiple points is used for titrating the ultra-precision polishing liquid C onto the polishing pad 22 for ultra-precision processing, meanwhile, the polishing residual liquid continuous suction recovery unit 11 is started, residual liquid on the polishing pad 22 is adsorbed in time, the concentration of the ultra-precision polishing liquid C in the contact surface of the workpiece 18 and the polishing pad 22 is ensured to be uniform, the surface roughness Sa of the large-size KDP crystal after polishing reaches 2.742nm, the surface quality is improved, and the processing requirements are met.
Further, the diameter range of the precision rotary table 7 is phi 1000-phi 2000mm, and the precision rotary table is used for 100 multiplied by 100mm2To 600X 600mm2Polishing and processing the large-size KDP crystal.
Further, the polishing solution A is deionized water; the polishing solution B is a KDP solution consisting of KDP crystal particles and deionized water; the polishing solution C is a micro-emulsion consisting of deionized water, a surfactant and an oily substance.
Furthermore, three intersection points formed by pairwise crossing the central axes of the three support beams of the Y-shaped cross beam 16 form three vertexes of an equilateral triangle, and the central point of the equilateral triangle is located on the central axis of the precision rotary table 7; the inner ends of the three support beams are connected into a whole to form an equilateral triangle central structure, and the joints of the support beams and the outer edges of the support beams are in arc transition.
Furthermore, a rotary flow channel structure is arranged inside the marble worktable 23, and the rotary flow channel structure circulates and flows liquid with a specified temperature, so that the temperature of the surface of the marble worktable 23 is kept unchanged during working.
Further, the center auxiliary support 17 is height-adjusted by a rotary handle installed at the center side of the Y-shaped beam 16, the rotary handle having a scale, and the horizontal accuracy of the Y-shaped beam 16 is precisely adjusted by adjusting the scale, as shown in fig. 4.
Further, a filter screen is installed at the outlet of the raffinate recovery tank 27.
Further, the probe of the online measurement unit 10 is a metal probe type probe or a laser type probe, and the metal probe type probe is used for performing contact measurement on the polishing pad 22; the laser type measuring head is used for realizing online measurement of surface shape precision of the workpiece 18.
Further, the dressing tool 31 of the polishing pad dressing unit 9 is replaced with a diamond wheel.
The present invention is not limited to the embodiment, and any equivalent idea or change within the technical scope of the present invention is to be regarded as the protection scope of the present invention.
Claims (10)
1. The utility model provides an ultra-precise high-efficient burnishing device suitable for jumbo size KDP crystal which characterized in that: the polishing device comprises a supporting unit (1), a precise horizontal movement sliding table (2), a workpiece polishing clamping unit (3), a multi-point concentration continuous adjustable polishing solution supply unit (5), a base (6), a precise rotary worktable (7), a polishing pad trimming unit (9), an online measuring unit (10), a polishing residual liquid continuous absorbing and recovering unit (11) and an equipment control system unit (14);
the supporting unit (1) comprises three upright supports (15), a Y-shaped cross beam (16) and a central auxiliary support (17), the lower ends of the three upright supports (15) are respectively connected with the base (6), the upper ends of the three upright supports are respectively connected with the three outer ends of the Y-shaped cross beam (16), the lower end of the central auxiliary support (17) penetrates through the hollow precise rotary worktable (7) to be connected with the base (6), the upper end of the central auxiliary support is connected with the center of the Y-shaped cross beam (16), and the three upright supports (15), the Y-shaped cross beam (16) and the central auxiliary support (17) form a three-upright support (15) + central auxiliary support (17) structure; the upright post support (15) is hollow, and the side edge of the upright post support is provided with a wire pipe orifice for arranging a control cable;
the Y-shaped cross beam (16) consists of three supporting beams, and a hanging ring (8) is arranged at the upper part of each supporting beam; each supporting beam is provided with a precise horizontal movement sliding table (2), a polishing pad trimming unit (9) and an online measuring unit (10) are arranged on the precise horizontal movement sliding table (2) of the first supporting beam, a workpiece polishing clamping unit (3) is arranged on the precise horizontal movement sliding table (2) of the second supporting beam, and the workpiece polishing clamping unit (3) is arranged on the precise horizontal movement sliding table (2) of the third supporting beam or is empty; a cantilever support is arranged between two supporting beams of the Y-shaped cross beam (16), and a multi-point concentration continuously adjustable polishing solution supply unit (5) is arranged on the cantilever support;
the multi-point concentration continuous adjustable polishing solution supply unit (5) comprises a multi-point solution supply pipe group (4), a distributed integrated control solution supply pump (12) and a polishing solution heating system (13) which are distributed along the radial direction of the precision rotary worktable (7), and the multi-point solution supply pipe group (4), the distributed integrated control solution supply pump (12) and the polishing solution heating system (13) are connected with an equipment control system unit (14);
the workpiece polishing and clamping unit (3) comprises a balancing weight (19), a workpiece clamp (20) and a shifting fork (21); the shifting fork (21) is installed on the precise horizontal movement sliding table (2), the workpiece clamp (20) is arranged in the shifting fork (21), a workpiece (18) is placed below the workpiece clamp (20), and the balancing weight (19) is placed above the workpiece clamp (20);
the precise rotary worktable (7) comprises a polishing pad (22), a marble worktable (23) and a precise rotary table (24); the precision turntable (24) is arranged on the base (6) and is connected with the base (6) through a positioning ring (25); the marble worktable (23) is arranged on the precise rotary table (24); the polishing pad (22) is stuck on the marble worktable (23);
the continuous polishing raffinate absorbing and recovering unit (11) comprises multipoint arrangement suction pipe groups (26), a raffinate recovering groove (27) and a recovering groove support (28), wherein the multipoint arrangement suction pipe groups (26) are radially distributed along the precision rotary worktable (7), the multipoint arrangement suction pipe groups (26) are installed on a cantilever support of a Y-shaped beam (16), and the raffinate recovering groove (27) is installed above a base (6) through the recovering groove support (28);
the polishing pad trimming unit (9) comprises a servo motor (29), a vertical tool rest sliding table (30) and a trimming cutter (31), the servo motor (29) is installed on one side of the upper end of the vertical tool rest sliding table (30), the trimming cutter (31) is installed below the vertical tool rest sliding table (30), the polishing pad trimming unit (9) is installed on the precise horizontal movement sliding table (2) on the first supporting beam through the vertical tool rest sliding table (30), the polishing pad trimming unit (9) is controlled through the servo motor (29) to move precisely in the horizontal direction of a polishing area, and trimming processing of the polishing pad (22) is achieved;
the online measurement unit (10) comprises a measuring head support (32), a contact measuring head (33) and a measurement system (34), the contact measuring head (33) is installed below the measuring head support (32), the measurement system (34) is installed below the measuring head support (32), the contact measuring head (33) is connected and controlled through a cable, the online measurement unit (10) is installed on a precise horizontal movement sliding table (2) on a first supporting beam through the measuring head support (32), the online measurement unit (10) is controlled to controllably and precisely displace in the horizontal direction of a polishing area through the measurement system (34), and the surface shape of a workpiece (18) is measured online in real time;
the device control system unit (14) is arranged on one side outside the base (6), and through program regulation and control of the control system, the multi-point concentration continuous adjustable polishing solution supply unit (5) can realize multi-point continuous real-time regulation and control supply of polishing solutions of different types and different aqueous solution concentrations, and automatic conversion of different procedures of rough polishing, fine polishing and ultra-fine polishing in the polishing process of the large-size KDP crystal is realized.
2. The ultra-precise and efficient polishing device suitable for the large-size KDP crystal, as claimed in claim 1, wherein: the diameter range of the precision rotary worktable (7) is phi 1000-phi 2000mm, and the precision rotary worktable is used for 100 multiplied by 100mm2To 600X 600mm2Polishing and processing the large-size KDP crystal.
3. The ultra-precise and efficient polishing method suitable for the large-size KDP crystal is used for polishing by the ultra-precise and efficient polishing device suitable for the large-size KDP crystal, and is characterized in that: the method specifically comprises the following steps:
the method comprises the following steps: laying a polishing pad (22), and dressing the polishing pad (22) by using a polishing pad dressing unit (9);
step two: clamping a workpiece (18) in a workpiece clamp (20) and loading a balancing weight (19);
step three: a rough polishing processing stage; inputting corresponding polishing parameters into an equipment control system unit (14), starting a precision rotary table (24) to a corresponding rough polishing rotating speed parameter range, and continuously titrating polishing solution A for rough polishing onto a polishing pad (22) by using a multipoint concentration continuous adjustable polishing solution supply unit (5) according to a program to perform rough polishing;
step four: a fine polishing processing stage; inputting corresponding polishing parameters into an equipment control system unit (14), and continuously titrating polishing solution B for finish polishing onto a polishing pad (22) by using a multi-point concentration continuously adjustable polishing solution supply unit (5) according to a program to perform finish polishing;
step five: ultra-precision polishing processing stage; processing parameters are input into an equipment control system unit (14), a polishing solution supply unit (5) with continuously adjustable and controllable multi-point concentration is used for titrating the ultra-precision polishing solution C onto a polishing pad (22) for ultra-precision machining, a polishing residual solution continuous absorbing and recovering unit (11) is started simultaneously, residual solution on the polishing pad (22) is adsorbed in time, and the concentration uniformity of the ultra-precision polishing solution C in the contact surface of a workpiece (18) and the polishing pad (22) is ensured.
4. The ultra-precision and high-efficiency polishing method suitable for the large-size KDP crystal according to the claim 3, which is characterized in that: the polishing solution A is deionized water; the polishing solution B is a KDP solution consisting of KDP crystal particles and deionized water; the polishing solution C is a micro-emulsion consisting of deionized water, a surfactant and an oily substance.
5. The ultra-precision and high-efficiency polishing method suitable for the large-size KDP crystal according to the claim 3, which is characterized in that: three intersection points formed by pairwise crossing the central axes of the three support beams of the Y-shaped cross beam (16) form three vertexes of an equilateral triangle, and the central point of the equilateral triangle is positioned on the central axis of the precision rotary worktable (7); the inner ends of the three support beams are connected into a whole to form an equilateral triangle central structure, and the joints of the support beams and the outer edges of the support beams are in arc transition.
6. The ultra-precision and high-efficiency polishing method suitable for the large-size KDP crystal according to the claim 3, which is characterized in that: a rotary flow channel structure is arranged in the marble working table (23), and liquid with a specified temperature circularly flows through the rotary flow channel structure, so that the temperature of the table top of the marble working table (23) is kept unchanged during working.
7. The ultra-precision and high-efficiency polishing method suitable for the large-size KDP crystal according to the claim 3, which is characterized in that: the height of the central auxiliary support (17) is adjusted through a rotating handle arranged on the side edge of the center of the Y-shaped cross beam (16), the rotating handle is provided with scales, and the horizontal precision of the Y-shaped cross beam (16) is accurately adjusted through adjusting the scales.
8. The ultra-precision and high-efficiency polishing method suitable for the large-size KDP crystal according to the claim 3, which is characterized in that: the ultra-precision and high-efficiency polishing device and method suitable for the large-size KDP crystal according to the claim 1, wherein: and a filter screen is arranged at the outlet of the residual liquid recovery tank (27).
9. The ultra-precision and high-efficiency polishing method suitable for the large-size KDP crystal according to the claim 3, which is characterized in that: the ultra-precision and high-efficiency polishing device and method suitable for the large-size KDP crystal according to the claim 1, wherein: the measuring head of the online measuring unit (10) is a metal probe type measuring head or a laser type measuring head, and the metal probe type measuring head is used for realizing contact type measurement on the polishing pad (22); the laser type measuring head is used for realizing the online measurement of the surface shape precision of the workpiece (18).
10. The ultra-precision and high-efficiency polishing method suitable for the large-size KDP crystal according to the claim 3, which is characterized in that: the dressing tool (31) of the polishing pad dressing unit (9) is replaced by a diamond grinding wheel.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117506711A (en) * | 2024-01-04 | 2024-02-06 | 苏州博宏源机械制造有限公司 | Polishing equipment and method for improving flatness of wafer |
| CN117943974A (en) * | 2024-03-26 | 2024-04-30 | 平坦然(苏州)技术有限公司 | Polishing pad trimmer device |
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| CN117506711A (en) * | 2024-01-04 | 2024-02-06 | 苏州博宏源机械制造有限公司 | Polishing equipment and method for improving flatness of wafer |
| CN117506711B (en) * | 2024-01-04 | 2024-03-22 | 苏州博宏源机械制造有限公司 | Polishing equipment and method for improving flatness of wafer |
| CN117943974A (en) * | 2024-03-26 | 2024-04-30 | 平坦然(苏州)技术有限公司 | Polishing pad trimmer device |
| CN117943974B (en) * | 2024-03-26 | 2024-05-31 | 平坦然(苏州)技术有限公司 | Polishing pad trimmer device |
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