CN112077411A - Reflow furnace with air conditioner - Google Patents
Reflow furnace with air conditioner Download PDFInfo
- Publication number
- CN112077411A CN112077411A CN201910564220.XA CN201910564220A CN112077411A CN 112077411 A CN112077411 A CN 112077411A CN 201910564220 A CN201910564220 A CN 201910564220A CN 112077411 A CN112077411 A CN 112077411A
- Authority
- CN
- China
- Prior art keywords
- cold air
- circuit board
- oven
- transmission
- cooling air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000005540 biological transmission Effects 0.000 claims abstract description 31
- 238000010438 heat treatment Methods 0.000 claims abstract description 29
- 238000005476 soldering Methods 0.000 claims abstract description 18
- 238000001816 cooling Methods 0.000 claims description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 238000003860 storage Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 abstract description 4
- 238000003466 welding Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 235000011089 carbon dioxide Nutrition 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a reflow oven with cold air, comprising: a furnace body; an upper fan or fan bank layer; an upper heating device layer; a cold air pipe; a furnace chamber; a circuit board transmission mesh belt; a lower heating device layer; a circuit board inlet; a circuit board outlet; a temperature control device; a transmission motor driving the transmission net belt; the transmission belt is provided with one or more cold air ports, cold air is directly blown out to the oven cavity and the plate surface for refrigeration, the cold air pipes with the cold air ports are arranged above and below the transmission belt, or the cold air pipes with the cold air ports are only arranged above or on the side surface of the transmission belt, and the purpose of the cold air pipes is to stop heating once the circuit board heats reflow soldering elements in the oven and stops when the circuit board fails in the oven and needs to be stopped, then open the cold air to blow out the cold air from the cold air ports through the cold air pipes, blow out the cold air to directly enter the oven cavity, and rapidly cool the oven cavity and the circuit board.
Description
Technical Field
The invention relates to the field of SMT (surface mount technology) surface mount welding, in particular to a reflow oven with cold air.
Background
With the rapid development of the flexible board industry, the whole process is all the way to the SMT, and is more and more developed towards the direction of automatic operation of a whole roll of ultra-long boards, but the equipment of the current SMT processing flow operation is still in the operation mode of a single short board, so that the SMT is transferred into a reflow oven for heating and welding after components are pasted on the whole roll, and thus a very long connection table is needed, namely, if a board with the length of 50 meters is manufactured, a connection table with the length of at least 50 meters is needed, and if a board with the length of 100 meters is manufactured, a connection table with the length of at least 100 meters is needed, and after the whole long board is pasted with components, the connection table can be transferred into the reflow oven, because the existing reflow oven has two problems, the connection table is not suitable for direct butt joint of the long board with an SMT chip mounter, and because of a continuous flow type heating mode and a second mode is not capable of rapid cooling, so that if the SMT is directly butt-jointed with, the front-section circuit board is in the reflow furnace and cannot be stopped, the furnace cannot be cooled quickly after the circuit board is stopped, the circuit board continues to be heated in the reflow furnace for a long time, elements and the circuit board are baked to be damaged, in addition, after the circuit board is stopped, the soldering tin states of components on the circuit board in the furnace are different, the solder paste which just enters the circuit board is not melted, the components which are positioned at the tail part are already soldered, and if the circuit board is reheated, the soldering flux of the solder paste is volatilized, so that the soldering is seriously bad, and the soldering quality of the whole-section element is inconsistent.
In order to overcome the defects and the shortcomings and solve the technical problems, the reflow oven with the cold air is provided with a quick cooling device in the reflow oven, after the reflow oven is stopped and heated, the interior of the equipment is quickly cooled, the temperature of the oven is quickly reduced, the cold air in the oven cavity is directly connected to an air conditioner or directly connected to a liquid nitrogen storage tank or connected to a dry ice storage tank and directly blown into the oven cavity to realize quick cooling, in addition, the reflow oven is designed into a clearance type reflow soldering mode, namely, a long circuit board enters the reflow oven in sections and then stops heating in a static state, the long circuit board is quickly conveyed out from the oven after being soldered, the next section is connected to the oven and then stops heating in the static state, thus ensuring the consistent soldering tin conditions of each soldering point on the circuit board, and solving the problem of poor product soldering caused by the fault in the butt joint production of long board SMT and reflow soldering, the invention is suitable for continuous reflow soldering production of long boards.
Disclosure of Invention
The invention relates to a reflow oven with cold air, comprising: a furnace body; an upper fan or fan bank layer; an upper heating device layer; a cold air pipe; a furnace chamber; a circuit board transmission mesh belt; a lower heating device layer; a circuit board inlet; a circuit board outlet; a temperature control device; a transmission motor driving the transmission net belt; the transmission belt is provided with one or more cold air ports, cold air is directly blown out to the oven cavity and the plate surface for refrigeration, the cold air pipes with the cold air ports are arranged above and below the transmission belt, or the cold air pipes with the cold air ports are only arranged above or on the side surface of the transmission belt, and the purpose of the cold air pipes is to stop heating once the circuit board heats reflow soldering elements in the oven and stops when the circuit board fails in the oven and needs to be stopped, then open the cold air to blow out the cold air from the cold air ports through the cold air pipes, blow out the cold air to directly enter the oven cavity, and rapidly cool the oven cavity and the circuit board.
According to the present invention, there is provided a reflow oven with cold air, comprising: a furnace body; an upper fan or fan bank layer; an upper heating device layer; a cold air pipe; a furnace chamber; a circuit board transmission mesh belt; a lower heating device layer; a circuit board inlet; a circuit board outlet; a temperature control device; a transmission motor driving the transmission net belt; the transmission belt is provided with one or more cold air ports, cold air is directly blown out to the oven cavity and the plate surface for refrigeration, the cold air pipes with the cold air ports are arranged above and below the transmission belt, or the cold air pipes with the cold air ports are only arranged above or on the side surface of the transmission belt, and the purpose of the cold air pipes is to stop heating once the circuit board heats reflow soldering elements in the oven and stops when the circuit board fails in the oven and needs to be stopped, then open the cold air to blow out the cold air from the cold air ports through the cold air pipes, blow out the cold air to directly enter the oven cavity, and rapidly cool the oven cavity and the circuit board.
According to a preferred embodiment of the present invention, the reflow soldering oven with cold air is characterized in that the cold air pipe is connected to the cold air machine, the cold air machine and the reflow soldering oven are connected into a whole, or the cold air machine is separated independently and is only connected with the cold air pipe.
According to a preferred embodiment of the invention, the reflow oven with cold air is characterized in that the cold air pipe is connected to a liquid nitrogen storage tank or a dry ice storage tank.
According to a preferred embodiment of the present invention, the reflow oven with cold air is characterized in that the temperature control device can control the temperature of the oven cavity to be raised in steps and lowered in steps.
According to a preferred embodiment of the present invention, the reflow oven with cooling air is characterized in that the circuit board is moved to the oven cavity, then the circuit board is still and heated to solder the components on the circuit board.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
FIG. 1 is a schematic cross-sectional view of a reflow oven with a cooling apparatus.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
As shown in fig. 1, 1 is a furnace body, 2 is an upper fan set layer, 3 is an upper heating device layer, 4 is an upper cold air pipe, 5 is a furnace chamber, 6 is a circuit board transmission mesh belt, 7 is a lower cold air pipe, 8 is a lower heating device layer, 9 is a circuit board inlet, 10 is a circuit board outlet, 11 is a temperature control device, 12 is a transmission motor for driving the transmission mesh belt, the upper cold air pipe 4 is below the upper heating device layer 3, and the lower cold air pipe 7 is above the lower heating device layer 8, and the working principle is as follows:
when heating is needed, the upper cold air pipe 4 and the lower cold air pipe 7 are closed and are in a stop working state, the upper fan unit layer 2, the upper heating device layer 3, the circuit board transmission mesh belt 6, the lower heating device layer 8, the temperature control device 11 and the transmission motor 12 driving the transmission mesh belt are in a working state, wind generated by the upper fan unit layer 2 passes through the upper heating device layer 3 to heat the wind, then is blown into the furnace chamber 5, passes through the lower heating device layer 8 and then flows back to the upper fan unit layer 2 to circulate, and the temperature of the furnace chamber 5 is controlled at the temperature required by welding through the temperature control device 11.
When the external butt SMT mounting fails and needs to stop reflow soldering, and the furnace temperature is rapidly reduced through refrigeration, the upper heating device layer 3 and the lower heating device layer 8 are closed, the transmission motor 12 of the transmission mesh belt is driven, the upper cold air pipe 3 and the lower cold air pipe 8 are started, the temperature control device 11 and the upper fan set layer 2 are still in a working state, the upper cold air pipe 3 and the lower cold air pipe 8 directly blow cold air into the furnace chamber 5, the temperature in the furnace chamber 5 is rapidly reduced, and the furnace 5 stops working after the temperature is reduced to the normal temperature until the failure is processed.
The cold air pipe is used for heating reflow soldering elements in the furnace, stopping heating once the circuit board fails in the furnace and needs to be stopped, starting cold air, blowing out the cold air from the cold air port through the cold air pipe, directly blowing out the cold air into the furnace chamber, and rapidly cooling the furnace chamber and the circuit board.
The present invention has been described in detail with reference to the accompanying drawings in which a specific embodiment of a reflow oven with cold air is illustrated. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (5)
1. A reflow oven with cooling air, comprising:
a furnace body;
an upper fan or fan bank layer;
an upper heating device layer;
a cold air pipe;
a furnace chamber;
a circuit board transmission mesh belt;
a lower heating device layer;
a circuit board inlet;
a circuit board outlet;
a temperature control device;
a transmission motor driving the transmission net belt;
the cold air pipe with cold air ports is set on the transmission net belt, or only set on the upper and/or side of the transmission belt, when the circuit board heats the reflow soldering element in the furnace, once the circuit board is still in the furnace and the production line is out of order and needs to be shut down, the heating can be stopped, then the cold air is started to blow out the cold air from the cold air ports through the cold air pipe, the blown cold air is directly fed into the furnace chamber, the furnace chamber and the circuit board are cooled rapidly.
2. A reflow oven with cooling air as set forth in claim 1, wherein the cooling air pipe is connected to a cooling air machine, the cooling air machine and the reflow oven are connected as a single body, or the cooling air machine is separated independently and is connected to the cooling air pipe only.
3. A reflow oven with cool air in accordance with claim 1, wherein said cool air pipe is connected to a liquid nitrogen storage tank.
4. A reflow oven with cooling air as set forth in claim 1, wherein the temperature control device controls the temperature of the oven cavity to be raised and lowered in steps.
5. A reflow oven with cooling air as set forth in claim 1, wherein the circuit board is moved to the oven cavity, is left still, and is then heated to solder the components to the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910564220.XA CN112077411A (en) | 2019-06-15 | 2019-06-15 | Reflow furnace with air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910564220.XA CN112077411A (en) | 2019-06-15 | 2019-06-15 | Reflow furnace with air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112077411A true CN112077411A (en) | 2020-12-15 |
Family
ID=73734579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910564220.XA Withdrawn CN112077411A (en) | 2019-06-15 | 2019-06-15 | Reflow furnace with air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112077411A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11589488B1 (en) * | 2021-07-28 | 2023-02-21 | Ableprint Iechnology Co., Ltd. | Warpage suppressing reflow oven |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006156487A (en) * | 2004-11-25 | 2006-06-15 | Furukawa Electric Co Ltd:The | Equipment and method of reducing nitrogen gas consumption of reflow furnace |
| CN103128391A (en) * | 2011-11-25 | 2013-06-05 | 陕西子竹电子有限公司 | Desk type reflow soldering machine |
| CN104551305A (en) * | 2015-01-21 | 2015-04-29 | 李战胜 | Structure modified through-hole reflow soldering machine |
| CN105414694A (en) * | 2015-12-31 | 2016-03-23 | 深圳市大创自动化设备有限公司 | Double-channel reflow furnace |
| CN207835960U (en) * | 2018-01-23 | 2018-09-07 | 广州勤润电子有限公司 | A kind of fast welder of SMT double applyings piece |
-
2019
- 2019-06-15 CN CN201910564220.XA patent/CN112077411A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006156487A (en) * | 2004-11-25 | 2006-06-15 | Furukawa Electric Co Ltd:The | Equipment and method of reducing nitrogen gas consumption of reflow furnace |
| CN103128391A (en) * | 2011-11-25 | 2013-06-05 | 陕西子竹电子有限公司 | Desk type reflow soldering machine |
| CN104551305A (en) * | 2015-01-21 | 2015-04-29 | 李战胜 | Structure modified through-hole reflow soldering machine |
| CN105414694A (en) * | 2015-12-31 | 2016-03-23 | 深圳市大创自动化设备有限公司 | Double-channel reflow furnace |
| CN207835960U (en) * | 2018-01-23 | 2018-09-07 | 广州勤润电子有限公司 | A kind of fast welder of SMT double applyings piece |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11589488B1 (en) * | 2021-07-28 | 2023-02-21 | Ableprint Iechnology Co., Ltd. | Warpage suppressing reflow oven |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20201215 |
|
| WW01 | Invention patent application withdrawn after publication |