CN112071645B - 一种引线框式电子元器件封装方法 - Google Patents
一种引线框式电子元器件封装方法 Download PDFInfo
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- CN112071645B CN112071645B CN202010949570.0A CN202010949570A CN112071645B CN 112071645 B CN112071645 B CN 112071645B CN 202010949570 A CN202010949570 A CN 202010949570A CN 112071645 B CN112071645 B CN 112071645B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000011347 resin Substances 0.000 claims abstract description 61
- 229920005989 resin Polymers 0.000 claims abstract description 61
- 239000000463 material Substances 0.000 claims abstract description 49
- 239000003292 glue Substances 0.000 claims abstract description 27
- 238000012858 packaging process Methods 0.000 claims abstract description 11
- 238000007789 sealing Methods 0.000 claims abstract description 11
- 239000010410 layer Substances 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 19
- 230000001070 adhesive effect Effects 0.000 claims description 19
- 239000003990 capacitor Substances 0.000 claims description 19
- 229920001971 elastomer Polymers 0.000 claims description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 239000003989 dielectric material Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 230000007547 defect Effects 0.000 claims description 4
- 239000003792 electrolyte Substances 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 229920002943 EPDM rubber Polymers 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 239000010405 anode material Substances 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims description 3
- 229920005549 butyl rubber Polymers 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000007784 solid electrolyte Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 239000013013 elastic material Substances 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 claims 1
- 238000010923 batch production Methods 0.000 abstract description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000012536 packaging technology Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/0029—Processes of manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202010949570.0A CN112071645B (zh) | 2020-09-10 | 2020-09-10 | 一种引线框式电子元器件封装方法 |
Applications Claiming Priority (1)
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CN202010949570.0A CN112071645B (zh) | 2020-09-10 | 2020-09-10 | 一种引线框式电子元器件封装方法 |
Publications (2)
Publication Number | Publication Date |
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CN112071645A CN112071645A (zh) | 2020-12-11 |
CN112071645B true CN112071645B (zh) | 2022-03-08 |
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CN202010949570.0A Active CN112071645B (zh) | 2020-09-10 | 2020-09-10 | 一种引线框式电子元器件封装方法 |
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CN (1) | CN112071645B (zh) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007052652A1 (ja) * | 2005-11-01 | 2007-05-10 | Showa Denko K. K. | 固体電解コンデンサ及びその製造方法 |
CN101409157A (zh) * | 2008-11-21 | 2009-04-15 | 福建国光电子科技股份有限公司 | 固体电解电容器封装技术 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4519398B2 (ja) * | 2002-11-26 | 2010-08-04 | Towa株式会社 | 樹脂封止方法及び半導体装置の製造方法 |
TWI281265B (en) * | 2005-07-13 | 2007-05-11 | Chih-Chen Chou | A SMD type LED package method |
JP2009094118A (ja) * | 2007-10-04 | 2009-04-30 | Panasonic Corp | リードフレーム、それを備える電子部品及びその製造方法 |
JP5330191B2 (ja) * | 2009-10-27 | 2013-10-30 | サン電子工業株式会社 | 固体電解コンデンサ及びその製造方法 |
CN103325889A (zh) * | 2012-03-19 | 2013-09-25 | 展晶科技(深圳)有限公司 | 发光二极管封装方法 |
CN105508916A (zh) * | 2016-02-22 | 2016-04-20 | 深圳市敏杰电子科技有限公司 | 防水型led发光管灯带及其生产设备和方法 |
CN108491113B (zh) * | 2018-03-05 | 2021-03-23 | 业成科技(成都)有限公司 | 超声波触控装置及其制作方法 |
CN108398063B (zh) * | 2018-03-15 | 2019-07-30 | 深圳大成创安达电子科技发展有限公司 | 一种电子雷管芯片及其封装方法 |
CN108461604A (zh) * | 2018-05-31 | 2018-08-28 | 福建鸿博光电科技有限公司 | 一种led灯集成封装方法及封装结构 |
CN109637811B (zh) * | 2018-12-13 | 2021-03-23 | 福建国光电子科技有限公司 | 一种超薄型聚合物片式叠层固体铝电解电容器及制备方法 |
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2020
- 2020-09-10 CN CN202010949570.0A patent/CN112071645B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007052652A1 (ja) * | 2005-11-01 | 2007-05-10 | Showa Denko K. K. | 固体電解コンデンサ及びその製造方法 |
CN101409157A (zh) * | 2008-11-21 | 2009-04-15 | 福建国光电子科技股份有限公司 | 固体电解电容器封装技术 |
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CN112071645A (zh) | 2020-12-11 |
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Effective date of registration: 20240119 Address after: 230000 floor 1, building 2, phase I, e-commerce Park, Jinggang Road, Shushan Economic Development Zone, Hefei City, Anhui Province Patentee after: Dragon totem Technology (Hefei) Co.,Ltd. Address before: 200 xiyuangong Road, Shangjie Town, Minhou County, Fuzhou City, Fujian Province Patentee before: MINJIANG University |
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Effective date of registration: 20240304 Address after: 518000 Factory Building No.2, No. 349 Pinglong East Road, Lichang Community, Pinghu Street, Longgang District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN DIANTONG WINTRONIC MICROELECTRONICS Co.,Ltd. Country or region after: China Address before: 230000 floor 1, building 2, phase I, e-commerce Park, Jinggang Road, Shushan Economic Development Zone, Hefei City, Anhui Province Patentee before: Dragon totem Technology (Hefei) Co.,Ltd. Country or region before: China |