CN112055529B - Feeding method and feeding assembly for SMT chip mounter - Google Patents
Feeding method and feeding assembly for SMT chip mounter Download PDFInfo
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- CN112055529B CN112055529B CN201910492991.2A CN201910492991A CN112055529B CN 112055529 B CN112055529 B CN 112055529B CN 201910492991 A CN201910492991 A CN 201910492991A CN 112055529 B CN112055529 B CN 112055529B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0419—Feeding with belts or tapes tape feeders
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Abstract
The invention relates to a feeding method and a feeding assembly for an SMT chip mounter, wherein the method comprises the steps of placing material trays on a plurality of material taking stations on a material placing table in a one-to-one correspondence mode, identifying component types on the material trays and the material taking stations corresponding to the material trays by an identification component, then transmitting component type data on the material trays and material taking station data of the components to a control host on the chip mounter by the identification component, and grabbing the components to be mounted according to the material taking station data of the components, wherein a manipulator on the chip mounter reaches the material taking stations to pick the components to be mounted, the material trays are placed without following stack position numbers in EDA files, all the material trays are placed on the material placing table, the feeding flexibility is improved, and the feeding speed is also greatly improved.
Description
Technical Field
The invention relates to the technical field of chip mounter feeding, in particular to a feeding method and a feeding assembly for an SMT chip mounter.
Background
As the functions of electronic devices are more and more diversified, the circuit board on the electronic device also needs to correspondingly load more electronic components to meet the functional requirements. Before starting the surface mounting, the feeding work of the electronic components needs to be completed, and the current feeding mode is as follows: firstly, manually inputting relevant parameters (such as size) of each electronic component and relevant parameters (such as circuit board placing position, setting of a coordinate system on the circuit board and component mounting position on the circuit board) of the circuit board; further, the control host adjusts the original EDA (electronic design automation) file according to the relevant parameters, so that a new EDA file is generated to determine the motion path of the manipulator, and the manipulator can reach a specified position to pick up a corresponding electronic component; after a new EDA file is generated, workers need to determine the stack bit table number of each electronic component according to the new EDA file and fill each electronic component on a specified material channel, and the feeding method consumes a large amount of manpower and time, which is not beneficial to improving the production efficiency.
Disclosure of Invention
The invention provides a feeding method for an SMT chip mounter and a feeding assembly for the SMT chip mounter, aiming at the above-mentioned defects in the prior art.
The invention solves the technical problems that:
in one aspect, a feeding method for an SMT pick & place machine is provided, which includes the following steps:
after the material trays are correspondingly placed on the material taking stations on the material placing table one by one, the identification component identifies the types of the components on each material tray and the material taking stations corresponding to each material tray;
the identification component transmits component model data on each tray and component taking work position data of each component to a control host on the chip mounter;
and according to the position of the material taking station where each component is located, the manipulator on the chip mounter reaches the material taking station to grab the component to be mounted.
Preferably, only one feeding groove is arranged on the chip mounter, and the feeding groove is positioned between the feeding assembly and the material tray; a component carrier tape is wound on the tray, and the feeding component is used for pulling the component carrier tape to feed the feeding trough; an upper cover tape is fixedly bonded on the component carrier tape;
before the step of grabbing the components to be mounted by the manipulator on the chip mounter to the material taking station according to the material taking station data of each component, the method further comprises the following steps:
moving the feeding trough downwards to avoid component carrier tapes;
according to the position of the material taking station where each component is located, transversely moving the feeding groove to the material taking station;
adjusting the width of the feeding trough according to the model data of the components on each tray;
and moving the feeding trough upwards to support the component carrier tape.
Preferably, before the step of moving the feeding trough downwards to avoid the component carrier tape, the method further comprises:
the feeding component stops feeding the feeding trough;
after the step of moving the feed trough upwardly to support a component carrier tape, the method further comprises:
the feeding assembly feeds materials to the feeding trough.
Preferably, after the step of stopping the feeding assembly from feeding the feeding trough, the method further comprises:
the film stripping component for stripping the upper cover tape stops stripping the film;
after the step of moving the feed trough upwardly to support a component carrier tape, the method further comprises:
the stripping assembly strips the upper cover tape.
On the other hand, the feeding assembly for the SMT chip mounter is further provided, and based on the feeding method, the feeding assembly comprises a material placing table, wherein a plurality of material tray positions are sequentially arranged from left to right; the feeding assembly also comprises an identification assembly for identifying the type of the components on each material tray and the material taking station corresponding to each material tray; the identification assembly is in communication connection with the control host on the chip mounter and used for transmitting the model data of the components on each material tray to the control host and indicating the material taking station data corresponding to each material tray for the manipulator on the chip mounter.
Preferably, the tray is wound with a component carrier tape; an upper cover tape is fixedly bonded on the component carrier tape;
the chip mounter comprises a feeding trough; the feeding grooves are only provided with one group, the feeding grooves are positioned between a feeding component and a material tray, and the feeding component is used for pulling the component carrier tape to feed the feeding grooves; the feeding trough comprises a carrier band supporting plate and a movable guide plate which are arranged from top to bottom in sequence; the carrier tape supporting plate is provided with a carrier tape position for placing a component carrier tape; the feeding assembly further comprises a first driving mechanism for driving the carrier tape supporting plate to move transversely, and a second driving mechanism which is fixed with the lower surface of the carrier tape supporting plate and drives the movable guide plate to move longitudinally; the two sides of the upper surface of the movable guide plate are respectively provided with a left guide post and a right guide post which is matched with the left guide post to guide the component carrier tape; the carrier band supporting plate is provided with a first guide through hole corresponding to the left guide column and a second guide through hole corresponding to the right guide column; the left guide post with all be provided with on the face that the right guide post is relative and be longitudinal extension's first spigot surface, with first spigot surface meets and faces away from the inclined plane of carrying position one side up-extending, and with the higher one end on inclined plane meets and is longitudinal extension's second material area spigot surface.
Preferably, the middle part of the material tray is provided with a circular through groove; the material placing table is provided with a first damping rotating shaft which corresponds to the through groove and one end of which is fixed with the material placing table; the first damping rotating shafts correspond to the material tray positions one by one;
the feeding assembly comprises a mounting seat fixed with the chip mounter, a second damping rotating shaft with one end fixed with the mounting seat, and a first driven gear sleeved on the second damping rotating shaft; the second damping rotating shaft, the first driven gear and the mounting seat are in one-to-one correspondence with the material tray positions;
the feeding assembly further comprises a feeding motor; a first driving gear meshed with the first driven gear is sleeved on a motor shaft of the feeding motor; the feeding motor further comprises a third driving mechanism which is fixed on the lower surface of the carrier tape supporting plate and used for driving the feeding motor to move towards or away from the first driven gear.
Preferably, a connecting column extends from one end of the first damping rotating shaft, which is far away from the material placing table, along the axial direction; the outer diameter of the connecting column is smaller than that of the first damping rotating shaft; the connecting column is provided with an external thread;
the feeding assembly also comprises a film stripping assembly for stripping the upper cover tape; the membrane stripping assembly comprises a third damping rotating shaft which is positioned above the first damping rotating shaft and one end of which is fixed with the material placing table; the upper cover tape is fixed with the outer circular surface of the third damping rotating shaft; a second driven gear is sleeved at one end of the third damping rotating shaft, which is far away from the material placing table; the film stripping assembly further comprises a connecting sleeve and a second driving gear which is sleeved outside the connecting sleeve and meshed with the second driven gear; the connecting sleeve is provided with an internal thread corresponding to the external thread.
Preferably, a two-dimensional code label A for identifying the model of the component by the identification assembly is pasted on the material tray; the material placing table is provided with a two-dimensional code label B for the identification assembly to identify the material taking station; the two-dimension code labels B correspond to the material tray positions one by one; the identification assembly comprises a base, a two-dimensional code identifier and a carbon steel pipe, wherein the base is connected with the material placing table in a sliding mode, the two-dimensional code identifier is connected with the two ends of the carbon steel pipe, and the base and the two-dimensional code identifier are connected with the carbon steel pipe.
The invention has the beneficial effects that: after the material trays are placed on the material placing stations in a one-to-one correspondence mode, the identification assembly identifies the types of the components on each material tray and the material taking stations corresponding to the material trays, then the identification assembly transmits the data of the types of the components on each material tray and the data of the material taking stations where the components are located to the control host computer on the chip mounter, and then the data of the material taking stations where the components are located are obtained, the manipulator on the chip mounter reaches the material taking stations to pick the components to be mounted, the number of stack positions in an EDA file is not required to be followed when the material trays are placed, only all the material trays need to be placed on the material placing station, the flexibility of material loading is improved, and the material loading speed is greatly improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described with reference to the accompanying drawings and embodiments, wherein the drawings in the following description are only part of the embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive efforts according to the accompanying drawings:
fig. 1 is a flowchart illustrating an implementation of a feeding method for an SMT pick and place machine according to an embodiment of the present invention;
fig. 2 is a schematic diagram illustrating operation of a circuit board in a feeding method for an SMT pick and place machine according to an embodiment of the present invention;
fig. 3 is a flowchart illustrating an implementation of a feeding method for an SMT pick and place machine according to a second embodiment of the present invention;
fig. 4 is a schematic structural diagram of a feeding assembly for an SMT chip mounter according to a third embodiment of the present invention (in a top view, a C1 box indicates a chip mounter processing station, and a B1-B3 dashed box indicates 3 pick-up stations);
fig. 5 is a cross-sectional view of a material table in a feeding assembly for an SMT pick and place machine according to a third embodiment of the present invention;
fig. 6 is a schematic working diagram of a film stripping assembly in a feeding assembly for an SMT chip mounter according to a third embodiment of the present invention;
fig. 7 is an operational diagram of a feeding trough in a feeding assembly for an SMT pick and place machine according to a third embodiment of the present invention;
fig. 8 is a schematic working diagram (in a cut-away state) of a feeding trough in a feeding assembly for an SMT pick and place machine according to a third embodiment of the present invention;
fig. 9 is a schematic working diagram (in a cut-away state) of a feeding trough in a feeding assembly for an SMT pick and place machine according to a third embodiment of the present invention;
FIG. 10 is an enlarged view at A of FIG. 7;
fig. 11 is a schematic view of the structure of the tray used in the second and third embodiments of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without inventive step, are within the scope of the present invention.
Example one
The embodiment provides a feeding method for an SMT pick & place machine, and as shown in fig. 1, the method includes the following steps:
step S101: after the material trays are placed on the material taking stations on the material placing table in a one-to-one correspondence mode, the identification component identifies the types of the components on the material trays and the material taking stations corresponding to the material trays.
The embodiment of the invention is suitable for feeding of the SMT chip mounter, and can quickly finish feeding work and greatly improve the production efficiency.
In the embodiment of the invention, the material tray can be randomly placed on the material placing table during feeding, and stack position numbers of all electronic components in an EDA (electronic design automation) file do not need to be checked, so that the checking time of manual feeding is saved; after the placement work of a plurality of charging trays is finished, the recognition component recognizes the charging trays on the charging platform to determine the models of components on the charging trays and the material taking stations corresponding to the charging trays, so that the moving path of the manipulator on the chip mounter can be conveniently adjusted subsequently, and the chip mounting work can be finished smoothly.
In the embodiment of the invention, the identification can be realized by scanning the two-dimensional code or comparing the images of the components on the pickup tray.
Step S102: the identification component transmits the component model data on each tray and the material taking work position data of each component to the control host machine on the chip mounter.
In the embodiment of the invention, the data of the moving path of the manipulator is stored in the control host, after a new material tray is filled, the control host needs to adjust the material taking path of the manipulator, and the model data of the components on each material tray and the material taking position data of each component are taken as the standard during adjustment so as to ensure that the manipulator can reach the correct position to take materials.
Step S103: and according to the position of the taking station where each component is located, the manipulator on the chip mounter reaches the taking station to grab the component to be mounted.
In the embodiment of the invention, various types of components need to be pasted during pasting, the material taking stations of different components are different, the material taking station of each component can be known according to the material taking station position of each component, and the manipulator can reach the correct position to take materials. As an example, as shown in fig. 2, the size of the circuit board to be mounted is 7cm x 9cm, and three components are required: the chip mounter comprises a resistor with the length of 5.0mm and the length of 2.5mm, a capacitor with the length of 3.5mm and an M7 diode, wherein the origin of coordinates O of a circuit board is the geometric center of the circuit board, the mounting position of a component is also determined during the design of the circuit board, the mounting position of the resistor is A1, the mounting position of the capacitor is A2, the mounting position of the diode is A3, the mounting sequence of the resistor, the capacitor and the diode is sequentially performed, and the production data are prestored in a control host of the chip mounter;
when the material is loaded, the B1 tray, the B2 tray and the B3 tray are randomly placed on the material placing table, and after the identification component identifies, the obtained data are as follows:
therefore, according to the sequence of the resistor, the capacitor and the diode, the change of the material taking destination of the manipulator is that the 2 nd material taking station takes the material, the 1 st material taking station takes the material and the 3 rd material taking station.
According to the embodiment of the invention, after the material trays are placed on the material placing stations in a one-to-one correspondence manner, the identification component identifies the types of the components on each material tray and the material taking stations corresponding to each material tray, then the identification component transmits the data of the types of the components on each material tray and the data of the material taking stations where the components are located to the control host computer on the chip mounter, and then according to the data of the material taking stations where the components are located, the manipulator on the chip mounter reaches the material taking stations to grab the components to be mounted, and when the material trays are placed, the stack position table numbers in the EDA files are not required to be followed, only all the material trays are placed on the material placing stations, so that the flexibility of material loading is improved, and the material loading speed is also greatly improved.
Example two
The embodiment provides a feeding method for an SMT pick & place machine, and as shown in fig. 3, the method includes the following steps:
step S201: after the material trays are placed on the material taking stations on the material placing table in a one-to-one correspondence mode, the identification component identifies the types of the components on the material trays and the material taking stations corresponding to the material trays.
Step S202: the identification component transmits the component model data on each tray and the material taking work position data of each component to the control host machine on the chip mounter.
Steps S201 to S202 in this embodiment are the same as steps S101 to S102 in the first embodiment, and are not described herein again.
Different from the prior art that a plurality of fixed feeding grooves are transversely arranged, only one feeding groove is arranged on the chip mounter in the embodiment of the invention, and the feeding groove is movable, so that the feeding requirement of a plurality of material discs is met under the condition of reducing the feeding grooves, and the use flexibility and the applicability of the feeding grooves are improved; the winding has the components and parts carrier band on the charging tray, and the components and parts carrier band is provided with a plurality of components and parts storage tanks along its length direction equidistance, and in order to prevent to transport in-process components and parts and drop, the bonding is fixed with the upper cover area that is used for sheltering from the components and parts on the components and parts carrier band, just tears the upper cover area when carrying out the paster to the components and parts on the components and parts carrier band are taken out to the manipulator.
Step S203: the feeding assembly stops feeding the feeding trough.
In this embodiment, because there is only one feeding trough, the feeding trough is located between feed subassembly and the charging tray, and the feed subassembly is used for pulling the components and parts carrier band in order to feed the feeding trough, and each components and parts need paste according to the subsides dress order that predetermine, consequently, the feed only need provide this components and parts that need paste the dress at every turn, not paste the then not feed of components and parts this time, avoid causing the components and parts extravagant, consequently before the feeding trough reachs the next material station of getting of waiting to paste the dress components and parts, need stop the feed.
Step S204: the stripping assembly for stripping the upper cover tape stops stripping.
In this embodiment, need tear upper cover tape earlier before carrying out the paster to the components and parts on the components and parts carrier band are taken out to the manipulator, stop promptly after the feed work stops to shell the membrane, avoid upper cover tape to peel off the condition that too much leads to the components and parts of winding on the charging tray to drop.
Step S205: and moving the feeding trough downwards to avoid the component carrier tape.
In this embodiment, the component carrier tape is in a tensioned state when the manipulator picks the material, and is in the feeding trough, so when the next component is to be pasted, the feeding trough needs to be moved downwards first to be away from the component carrier tape, and the component carrier tape is prevented from being broken in the moving process.
Step S206: and transversely moving the feeding groove to the material taking station according to the material taking station position of each component.
In this embodiment, dodge the components and parts carrier band after, the feeding trough can quick travel to next the getting of pasting dress components and parts station to for components and parts carrier band provides the support, the manipulator of being convenient for is got the material.
Step S207: and adjusting the width of the feeding trough according to the model data of the components on each tray.
In this embodiment, the component model data still includes the width of components and parts carrier band, and the used components and parts carrier band width of different components and parts is different, can be applicable to the components and parts carrier band of different widths through adjusting the feeding trough width in real time, has improved the suitability of feeding trough.
Step S208: the feed trough is moved upward to support the component carrier tape.
In this embodiment, after adjusting the width of the feeding trough, can ensure that the feeding trough can not interfere with the component carrier tape, then the feeding trough is moved upwards to support the component carrier tape, so that the manipulator absorbs the component.
Step S209: the feeding assembly feeds materials to the feeding groove, and the film stripping assembly strips the upper cover tape.
Step S210: and according to the position of the material taking station where each component is located, the manipulator on the chip mounter reaches the material taking station to grab the component to be mounted.
Step S210 in this embodiment is the same as step S103 in the first embodiment, and will not be described in detail here.
According to the embodiment of the invention, after the material trays are placed on the material placing stations in a one-to-one correspondence manner, the identification component identifies the types of the components on each material tray and the material taking stations corresponding to each material tray, then the identification component transmits the data of the types of the components on each material tray and the data of the material taking stations where the components are located to the control host computer on the chip mounter, and then according to the data of the material taking stations where the components are located, the manipulator on the chip mounter reaches the material taking stations to grab the components to be mounted, and when the material trays are placed, the stack position table numbers in the EDA files are not required to be followed, only all the material trays are placed on the material placing stations, so that the flexibility of material loading is improved, and the material loading speed is also greatly improved.
EXAMPLE III
The embodiment provides a feeding assembly for an SMT chip mounter, as shown in fig. 4 to 11, the feeding assembly includes a material placing table 10, which is provided with a plurality of material tray positions 180 in sequence from left to right; the feeding assembly also comprises an identification assembly 11 for identifying the type of the components on each material tray and the material taking station corresponding to each material tray; the identification component 11 is in communication connection with a control host (not shown in the figure) on a chip mounter (not shown in the figure), and transmits component model data on each tray and material taking position data corresponding to each tray, which is used for indicating a material taking position for a manipulator (not shown in the figure) on the chip mounter, before chip mounting, a circuit board is fixed well by a tool clamp, after a plurality of trays 2 are placed on the material placing table 10, the identification component 11 identifies the component model on each tray and the material taking position corresponding to each tray, then the identification component 11 transmits the component model data on each tray and the material taking position data of each component to the control host on the chip mounter, and according to the material taking position data of each component, the manipulator on the chip mounter reaches the material taking position to pick the component to be mounted, when placing the trays 2, the stack position number in an EDA file is not required, only all the trays are placed on the material placing table, the flexibility of material loading has been improved, the material loading speed has also been improved by a wide margin.
As shown in fig. 4 and fig. 6 to 10, the tray 2 is wound with component carrier tapes 20; an upper cover tape 21 is bonded and fixed on the component carrier tape 20;
the chip mounter includes a feeding trough 12; only one group of feeding grooves 12 are arranged, the feeding grooves are positioned between the feeding component and the material tray, and the feeding component is used for pulling the component carrier tape to feed the feeding grooves; the feeding trough 12 comprises a carrier band supporting plate 13 and a movable guide plate 14 which are arranged from top to bottom in sequence; the carrier tape support plate 13 is provided with a carrier tape position 181 for placing the component carrier tape 20; the feeding assembly further comprises a first driving mechanism 15 for driving the carrier tape supporting plate 13 to move transversely, and a second driving mechanism 16 which is fixed with the lower surface of the carrier tape supporting plate 13 and drives the movable guide plate 14 to move longitudinally; the two sides of the upper surface of the movable guide plate 14 are respectively provided with a left guide post 17 and a right guide post 18 which is matched with the left guide post 17 to guide the component carrier tape 20; the carrier tape support plate 13 is provided with a first guide through hole 182 corresponding to the left guide post 17, and a second guide through hole 183 corresponding to the right guide post 18; the opposite surfaces of the left guide post 17 and the right guide post 18 are respectively provided with a first guide surface 184 extending longitudinally, an inclined surface 185 connected with the first guide surface 184 and extending upwards towards one side away from the tape carrying position 181, and a second tape guide surface 186 connected with the higher end of the inclined surface 185 and extending longitudinally, when a next component needs to be attached, the second driving mechanism 16 drives the movable guide plate 14 to move downwards, so that the left guide post 17 and the right guide post 18 are both lower than the upper plane of the tape carrying support plate 13, the component carrying tape 20 of each tray is avoided, and the component carrying tape 20 is prevented from being accidentally torn off in the subsequent process of transversely moving the tape carrying support plate 13; further, the first driving mechanism 15 drives the carrier tape support plate 13 to move transversely to reach the material taking station of the next component to be mounted; then, the second driving mechanism 16 drives the movable guide plate 14 to move upwards to guide the movement of the component carrier tape 20; when the component carrier tape 20 is wide, the second tape guide surface 186 is selected for guiding, and when the component carrier tape 20 is narrow, the first guide surface 184 is selected for guiding, and the inclined surface 185 can help the component carrier tape 20 to quickly reach the first guide surface 184; it should be noted that, the number of the guide surfaces is not limited to 2, and the guide surfaces may be correspondingly set according to the width value of the component carrier tape 20, and if the tray for mounting has 3 component carrier tape widths, three guide surfaces may be set.
The first driving mechanism 15 may be a rodless cylinder, which is preferably fixed on a processing table of the chip mounter, and the second driving mechanism 16 may be a linear cylinder.
As shown in fig. 4, 5, and 11, the middle part of the tray 2 is provided with a circular through groove 280; the material placing table 10 is provided with a first damping rotating shaft 19 which corresponds to the through groove 280 and one end of which is fixed with the material placing table 10; the first damping rotating shafts 19 correspond to the material tray positions 180 one by one; the feeding assembly 110 comprises a mounting base 111 fixed with the chip mounter, a second damping rotating shaft 112 with one end fixed with the mounting base 111, and a first driven gear 113 sleeved on the second damping rotating shaft 112; the second damping rotating shaft 112, the first driven gear 113 and the mounting seat 111 are in one-to-one correspondence with the material tray positions 180; the feeding assembly 110 further comprises a feeding motor 114; a first driving gear 115 meshed with the first driven gear 113 is sleeved on a motor shaft of the feeding motor 114; the feeding motor 114 further comprises a third driving mechanism 116 fixed to the lower surface of the carrier tape supporting plate 13 and used for driving the feeding motor 114 to move towards or away from the first driven gear 115, when the material is fed, the material tray 2 is inserted onto the first damping rotating shaft 19, the component carrier tape 20 and the second damping rotating shaft 112 are bonded together, after the feeding trough 12 reaches the material taking station, the feeding motor 114 drives the first driving gear 115 to rotate, so as to drive one first driven gear 113 to rotate, and then the second damping rotating shaft 112 pulls the component carrier tape 20 to realize feeding; because the feeding assembly only has one group of feeding grooves 12 and the feeding motor 114 moves along with the feeding grooves 12, the feeding of a plurality of groups of material trays can be realized only by one motor in the design, and compared with the prior art that a plurality of groups of independent driving motors are arranged, the feeding assembly can save installation space and use cost.
The third driving mechanism 116 may be a linear cylinder, and in order to ensure a good transmission effect, a guide support plate 128 may be additionally disposed on the lower surface of the carrier tape support plate 13, so that the feeding motor 114 may move along the guide support plate 128, the shaking range is small, and the feeding effect is better; the outer diameter of the first driven gear 113 is larger than the outer diameter of the tray 2.
As shown in fig. 5 and fig. 6, a connection column 117 extends in an axial direction from one end of the first damping rotating shaft 19 away from the material placing table 10; the outer diameter of the connecting column 117 is smaller than that of the first damping rotating shaft 19; the connecting post 117 is provided with external threads;
the loading assembly further comprises a stripping assembly 118 for stripping the upper cover tape 21; the membrane stripping assembly 118 comprises a third damping rotating shaft 119 which is positioned above the first damping rotating shaft 19 and one end of which is fixed with the material placing table 10; the upper cover tape 21 is fixed to the outer circumferential surface of the third damping rotating shaft 119; a second driven gear 120 is sleeved at one end of the third damping rotating shaft 119, which is far away from the material placing table 10; the membrane peeling assembly 118 further comprises a connecting sleeve 121, and a second driving gear 122 sleeved outside the connecting sleeve 121 and engaged with the second driven gear 120; connecting sleeve 121 is provided with the internal thread that corresponds with the external screw thread, first damping pivot 19 rotates under second damping pivot 112's drive, thereby carry out the feed, simultaneously through the meshing of second driven gear 120 and second driving gear 122, the upper cover tape can twine on third damping pivot 119, thereby be convenient for the manipulator snatch the components and parts on the components and parts carrier band, just need not to set up solitary driving motor for shelling membrane module 118 from this, save installation space and use cost.
As shown in fig. 5 and 11, a two-dimensional code label a123 for the identification component 11 to identify the model of the component is pasted on the tray 3; the material placing table 10 is provided with a two-dimensional code label B124 for the identification component 11 to identify the material taking station; the two-dimensional code labels B124 correspond to the tray positions 180 one by one; the identification component 11 comprises a base 125 and a two-dimensional code recognizer 126 which are in sliding connection with the material placing table 10, and a carbon steel pipe 127 with two ends connected with the base 125 and the two-dimensional code recognizer 126, the pipe made of carbon steel can be bent for multiple times, the using method is the same as that of a lazy support, and a user can flexibly adjust the shape and the supporting height of the carbon steel pipe 127 according to the using requirement.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (7)
1. A feeding method for an SMT chip mounter is characterized by comprising the following steps:
after the material trays are correspondingly placed on the material taking stations on the material placing table one by one, the identification component identifies the types of the components on each material tray and the material taking stations corresponding to each material tray;
the identification component transmits component model data on each tray and component taking work position data of each component to a control host on the chip mounter;
according to the position of the material taking station where each component is located, the manipulator on the chip mounter reaches the material taking station to grab the component to be mounted;
only one feeding groove is arranged on the chip mounter, and the feeding groove is positioned between the feeding assembly and the material tray; a component carrier tape is wound on the tray, and the feeding component is used for pulling the component carrier tape to feed the feeding trough; an upper cover tape is fixedly bonded on the component carrier tape;
before the step of grabbing the components to be mounted by the manipulator on the chip mounter to the material taking station according to the material taking station data of each component, the method further comprises the following steps:
moving the feeding trough downwards to avoid component carrier tapes;
according to the position of the material taking station where each component is located, transversely moving the feeding groove to the material taking station;
adjusting the width of the feeding trough according to the model data of the components on each tray;
and moving the feeding trough upwards to support the component carrier tape.
2. The charging method according to claim 1,
before the step of moving the feeding trough downwards to avoid the component carrier tape, the method further comprises the following steps:
the feeding component stops feeding the feeding trough;
after the step of moving the feed trough upwardly to support a component carrier tape, the method further comprises:
the feeding assembly feeds materials to the feeding trough.
3. The charging method according to claim 2,
after the step of stopping the feeding assembly from feeding the feeding trough, the method further comprises the following steps:
the film stripping component for stripping the upper cover tape stops stripping the film;
after the step of moving the feed trough upwardly to support a component carrier tape, the method further comprises:
the stripping assembly strips the upper cover tape.
4. A feeding assembly for an SMT chip mounter based on the feeding method of any one of claims 1-3, wherein the feeding assembly comprises a material placing table, a plurality of material tray positions are sequentially arranged from left to right; the feeding assembly also comprises an identification assembly for identifying the type of the components on each material tray and the material taking station corresponding to each material tray; the identification assembly is in communication connection with the control host on the chip mounter and is used for transmitting the model data of components on each material tray and the material taking station data corresponding to each material tray, which is used for indicating the material taking station for the manipulator on the chip mounter; the tray is wound with a component carrier tape; an upper cover tape is fixedly bonded on the component carrier tape;
the chip mounter comprises a feeding trough; the feeding grooves are only provided with one group, the feeding grooves are positioned between a feeding component and a material tray, and the feeding component is used for pulling the component carrier tape to feed the feeding grooves; the feeding trough comprises a carrier band supporting plate and a movable guide plate which are arranged from top to bottom in sequence; the carrier tape supporting plate is provided with a carrier tape position for placing a component carrier tape; the feeding assembly further comprises a first driving mechanism for driving the carrier tape supporting plate to move transversely, and a second driving mechanism which is fixed with the lower surface of the carrier tape supporting plate and drives the movable guide plate to move longitudinally; the two sides of the upper surface of the movable guide plate are respectively provided with a left guide post and a right guide post which is matched with the left guide post to guide the component carrier tape; the carrier band supporting plate is provided with a first guide through hole corresponding to the left guide column and a second guide through hole corresponding to the right guide column; the left guide post with all be provided with on the face that the right guide post is relative and be longitudinal extension's first spigot surface, with first spigot surface meets and faces away from the inclined plane of carrying position one side up-extending, and with the higher one end on inclined plane meets and is longitudinal extension's second material area spigot surface.
5. The feeding assembly according to claim 4, wherein a circular through groove is formed in the middle of the tray; the material placing table is provided with a first damping rotating shaft which corresponds to the through groove and one end of which is fixed with the material placing table; the first damping rotating shafts correspond to the material tray positions one by one;
the feeding assembly comprises a mounting seat fixed with the chip mounter, a second damping rotating shaft with one end fixed with the mounting seat, and a first driven gear sleeved on the second damping rotating shaft; the second damping rotating shaft, the first driven gear and the mounting seat are in one-to-one correspondence with the material tray positions;
the feeding assembly further comprises a feeding motor; a first driving gear meshed with the first driven gear is sleeved on a motor shaft of the feeding motor; the feeding motor further comprises a third driving mechanism which is fixed on the lower surface of the carrier tape supporting plate and used for driving the feeding motor to move towards or away from the first driven gear.
6. The feeding assembly according to claim 5, wherein a connecting column extends in an axial direction from one end of the first damping rotating shaft, which faces away from the material placing table; the outer diameter of the connecting column is smaller than that of the first damping rotating shaft; the connecting column is provided with an external thread;
the feeding assembly also comprises a film stripping assembly for stripping the upper cover tape; the membrane stripping assembly comprises a third damping rotating shaft which is positioned above the first damping rotating shaft and one end of which is fixed with the material placing table; the upper cover tape is fixed with the outer circular surface of the third damping rotating shaft; a second driven gear is sleeved at one end of the third damping rotating shaft, which is far away from the material placing table; the film stripping assembly further comprises a connecting sleeve and a second driving gear which is sleeved outside the connecting sleeve and meshed with the second driven gear; the connecting sleeve is provided with an internal thread corresponding to the external thread.
7. The feeding assembly according to claim 4, wherein a two-dimensional code label A for identifying the type of the component by the identification assembly is pasted on the tray; the material placing table is provided with a two-dimensional code label B for the identification assembly to identify the material taking station; the two-dimension code labels B correspond to the material tray positions one by one; the identification assembly comprises a base, a two-dimensional code identifier and a carbon steel pipe, wherein the base is connected with the material placing table in a sliding mode, the two-dimensional code identifier is connected with the two ends of the carbon steel pipe, and the base and the two-dimensional code identifier are connected with the carbon steel pipe.
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| CN201910492991.2A CN112055529B (en) | 2019-06-06 | 2019-06-06 | Feeding method and feeding assembly for SMT chip mounter |
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| CN201910492991.2A CN112055529B (en) | 2019-06-06 | 2019-06-06 | Feeding method and feeding assembly for SMT chip mounter |
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| CN112055529B true CN112055529B (en) | 2022-04-05 |
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| CN113441368B (en) * | 2021-08-31 | 2021-11-23 | 常州欣盛半导体技术股份有限公司 | COF carrier tape baking flow channel and baking method |
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