CN114473409B

CN114473409B - Assembling equipment, assembling method and assembling control device

Info

Publication number: CN114473409B
Application number: CN202111681704.6A
Authority: CN
Inventors: 黄文锋
Original assignee: Fulian Yuzhan Technology Shenzhen Co Ltd
Current assignee: Fulian Yuzhan Technology Shenzhen Co Ltd
Priority date: 2021-12-30
Filing date: 2021-12-30
Publication date: 2023-05-30
Anticipated expiration: 2041-12-30
Also published as: CN114473409A

Abstract

The application provides an equipment for bond first work piece and second work piece through sizing material, include: the feeding mechanism is used for transferring at least one sizing material, and each sizing material is provided with a first binding surface and a second binding surface which are arranged in a back-to-back manner; the first transfer mechanism is used for transferring at least one first workpiece; the second transfer mechanism is used for transferring at least one second workpiece; and the assembly mechanism is coupled with the feeding mechanism, the first transferring mechanism and the second transferring mechanism and is used for: transferring at least one first workpiece from the first transfer mechanism to the feeding mechanism, so that each first workpiece is bonded with a corresponding first bonding surface; the self-feeding mechanism transfers the at least one first workpiece to the second transfer mechanism, so that each second workpiece is bonded with a corresponding second bonding surface. The production efficiency of workpiece bonding is improved, and the labor cost is reduced. The application also provides an assembly method and an assembly control device.

Description

Assembling equipment, assembling method and assembling control device

Technical Field

The present disclosure relates to the field of workpiece assembly, and in particular, to an assembly apparatus, an assembly method, and an assembly control device.

Background

At present, two independent workpieces are adhered by glue materials, wherein the two independent workpieces are manually taken and placed, only one group of products can be assembled at a time, the production efficiency is low, and the manual labor intensity is high. When the basic size of the workpiece is mostly smaller than 1cm, such as the length and/or the width and/or the height is smaller than 1cm, the manual material taking and discharging can lead to lower assembly precision due to the smaller size of the workpiece, and in some occasions with high-precision assembly, the manual material taking and discharging can also be difficult to achieve higher yield.

Disclosure of Invention

In view of the foregoing, it is desirable to provide an assembling apparatus, an assembling method and an assembling control device, which solve the drawbacks of the related art.

To achieve the above object, an assembling apparatus for bonding a first workpiece and a second workpiece by a glue, includes:

the feeding mechanism is used for transferring at least one sizing material, and each sizing material is provided with a first binding surface and a second binding surface which are arranged in a back-to-back manner;

the first transfer mechanism is used for transferring at least one first workpiece;

the second transfer mechanism is used for transferring at least one second workpiece; and

the assembly mechanism is coupled with the feeding mechanism, the first transfer mechanism and the second transfer mechanism, and transfers at least one first workpiece from the first transfer mechanism to the feeding mechanism so that each first workpiece is adhered to a corresponding first bonding surface; the assembly mechanism transfers at least one first workpiece bonded with the sizing material from the feeding mechanism to the second transfer mechanism, so that each second workpiece is bonded with a corresponding second bonding surface.

The present application also provides an assembly method for bonding a first workpiece and a second workpiece by a glue, comprising: controlling an assembling mechanism to transfer at least one first workpiece loaded on a first transfer mechanism to a feeding mechanism, wherein the feeding mechanism is loaded with at least one sizing material, and each sizing material is provided with a first bonding surface and a second bonding surface which are oppositely arranged;

controlling the assembly mechanism to bond each first workpiece with a corresponding first bonding surface;

controlling the assembling mechanism to transfer at least one first workpiece adhered with the sizing material to a second transferring mechanism; and

and controlling the assembly mechanism to bond the second bonding surface of each sizing material to a corresponding one of the second workpieces.

The present application also provides an assembly control device comprising a controller coupled to a memory, the memory storing instructions that when executed by the controller perform the assembly method.

Compared with the prior art, the technical effect of this application is: through first transfer mechanism, the second moves the cooperation of mechanism with assembly mechanism, realize at least one first work piece with at least one the bonding of second work piece improves the production efficiency that the work piece bonded, reduces artifical intensity of labour to can improve the equipment precision, and then improve the yield of assembled piece.

Drawings

FIG. 1 is a schematic view of an assembly apparatus provided herein;

FIG. 2 is a schematic view of a feeding mechanism of the assembling apparatus shown in FIG. 1;

FIG. 3 is a schematic view of a connection structure between the first transfer mechanism and the first light source of the assembling apparatus shown in FIG. 1;

FIG. 4 is a schematic view of an assembly mechanism, a detection mechanism and a second light source connection structure of the assembly apparatus shown in FIG. 1;

fig. 5 is an enlarged view of a portion a of the first transfer mechanism shown in fig. 2;

FIG. 6 is an enlarged view of portion B of the assembly device depicted in FIG. 4;

fig. 7 is a schematic structural diagram of a rubber compound provided in an embodiment of the present application;

fig. 8 is a schematic structural diagram of a first workpiece according to an embodiment of the present disclosure;

fig. 9 is a schematic diagram of bonding a first workpiece and a second workpiece according to an embodiment of the present disclosure;

FIG. 10 is a flow chart of an assembly method according to an embodiment of the present disclosure;

FIG. 11 is a flow chart of an assembly method according to another embodiment of the present disclosure;

fig. 12 is a flowchart illustrating step S205 in the assembling method shown in fig. 11;

fig. 13 is a flowchart of S205 when the first detection information is image information in the assembling method shown in fig. 11;

FIG. 14 is a flowchart illustrating a method for determining a relative position error between a first workpiece and a first bonding surface according to the second detection information in the assembling method shown in FIG. 11;

FIG. 15 is a flow chart of the assembly method of FIG. 10 for removing the glue material that has not yet been bonded to the protective film;

fig. 16 is a connection block diagram of an assembly control device according to an embodiment of the present application.

Description of the main reference signs

Assembly apparatus 100

Feeding mechanism 10

Transfer unit 11

Feed end 111

Discharge end 112

Membrane removal assembly 12

Connection portion 121

First mating end 1211

Support portion 122

First portion 1221

Second portion 1222

Second mating end 1223

Receiving and discharging assembly 13

First receiving box 131

Second receiving box 132

Coil stock box 133

First transfer mechanism 20

Transport assembly 21

First detection bit 213

Load port 211

Carry-out end 212

Second transfer mechanism 30

Carrier assembly 31

Adjustment assembly 32

Assembling mechanism 40

Moving assembly 41

First guide 411

Second guide 412

Connecting arm 413

Connection end 4131

Free end 4132

Adsorption assembly 42

Suction head 421

First direction x

Second direction y

Third direction z

Detection mechanism 50

Imaging assembly 51

Light source assembly 60

First light source 61

Second light source 62

Controller 70

Sizing material 80

First bonding surface 81

Second bonding surface 82

First workpiece 90

Third bonding surface 91

Second workpiece 110

Memory 120

Tray 130

Assembly control device 200

Detailed Description

In order that the above-recited objects, features and advantages of the present application will be more clearly understood, a more particular description of the application will be rendered by reference to the appended drawings and appended detailed description.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, and the described embodiments are merely some, rather than all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

Referring to fig. 1-6, the present application provides an assembly apparatus 100, the assembly apparatus 100 for bonding a first workpiece 90 and a second workpiece 110 by a glue stock 80. The assembly apparatus 100 includes a supply mechanism 10, a first transfer mechanism 20, a second transfer mechanism 30, and an assembly mechanism 40.

The feeding mechanism 10 is used for transferring at least one glue stock 80, and each glue stock 80 has a first bonding surface 81 and a second bonding surface 82 (refer to fig. 7) disposed opposite to each other. The first and second bonding surfaces 81 and 82 are provided with protective films (not shown).

In this embodiment, referring to fig. 2, the feeding mechanism 10 includes a transfer assembly 11, a film removal assembly 12, and a collecting and discharging assembly 13.

The transfer assembly 11 is for transferring at least one gum material 80. The transfer assembly 11 includes oppositely disposed feed and discharge ends 111, 112. The discharge end 112 is provided with a second detection bit (not shown).

Referring to fig. 2 and 5, the membrane removal module 12 includes a connection portion 121 and a support portion 122, one end of the connection portion 121 is connected to the transfer module 11, and the other end of the connection portion 121 is provided with a first mating end 1211. In this embodiment, the first mating end 1211 is a wedge-shaped land. The supporting portion 122 includes a first portion 1221, a second portion 1222 and a second mating end 1223 that are sequentially connected, where the first portion 1221 is connected to the feeding mechanism 10, in this embodiment, the second mating end 1223 is a wedge table, and the second mating end 1223 is disposed at a distance from the first mating end 1211 in a staggered manner, so as to remove the glue 80 on the protective film that is not adhered to the first workpiece 90 by mating with the first mating end 1211. In this embodiment, the second portion 1222 forms an acute angle with the connecting portion 121, and the acute angle is 30-40 degrees. The setting of acute angle can be with the striking off of the sizing material 80 of being not laminated by first work piece 90, avoids causing the receipts material unevenness, and then influences the material loading position of sizing material 80, avoids causing the error of laminating.

Referring to fig. 2, the receiving and discharging assembly 13 is used for providing the glue 80, and a first bonding surface 81 and a second bonding surface 82 of the glue 80 are connected with protective films. The winding and unwinding assembly 13 is also used for peeling off the protective film and winding up the peeled protective film. The take-up and pay-off assembly 13 includes a first take-up cartridge 131, a second take-up cartridge 132, and a roll cartridge 133. The first material receiving box 131 is used for rolling up the protective film stripped by the first bonding surface 81, the second material receiving box 132 is used for rolling up the protective film stripped by the second bonding surface 82, and the material rolling box 133 is used for loading the sizing material 80 with the protective film.

In some embodiments, after the glue 80 that is not adhered by the first work piece 90 is scraped off, the protective film that is attached to the second adhering surface 82 is passed through the gap between the first and second mating ends 1211, 1223 and is rolled up within the second magazine 132.

The first transfer mechanism 20 is used for transferring at least one first workpiece 90, referring to fig. 3, in this embodiment, the first transfer mechanism 20 includes a conveying assembly 21, and the conveying assembly 21 is used for receiving a tray 130 carrying at least one first workpiece 90. The transport assembly 21 includes oppositely disposed loading and unloading ends 211 and 212. The carry-out end 212 is provided with a first detection bit 213. After loading the loading end 211, the conveying assembly 21 transfers the tray 130 to the first detecting position 213 of the loading end 212.

The second transfer mechanism 30 is configured to transfer at least one second workpiece 110, referring to fig. 1, the second transfer mechanism 30 includes a carrier assembly 31 and an adjusting assembly 32, and the carrier assembly 31 is configured to carry the at least one second workpiece 110. The adjusting assembly 32 is connected to the carrying assembly 31 for adjusting the position of the at least one second workpiece 110. In the present embodiment, the adjustment unit 32 includes a DD motor, and the accuracy of the assembly apparatus 100 can be improved by using the DD motor, but the present invention is not limited thereto, and may be an apparatus capable of controlling the output, such as a stepping motor. In use, the adjustment assembly 32 drives the rotation of the carrier assembly 31 to rotate the at least one second workpiece 110.

The assembly mechanism 40 is coupled to the feeding mechanism 10, the first transferring mechanism 20 and the second transferring mechanism 30, and the assembly mechanism 40 is configured to transfer at least one first workpiece 90 from the first transferring mechanism 20 to the feeding mechanism 10, so that each first workpiece 90 is adhered to a corresponding first adhering surface 81. The assembly mechanism 40 is also configured to transfer at least one first workpiece 90 of the bonded gum material 80 from the supply mechanism 10 to the second transfer mechanism 30 to bond the second bonding surface 82 of each gum material 80 to a corresponding one of the second workpieces 110.

In the present embodiment, referring to fig. 4 and 6, the assembly mechanism 40 includes a moving assembly 41 and an adsorbing assembly 42, the adsorbing assembly 42 is disposed on the moving assembly 41, and the adsorbing assembly 42 is used for sucking at least one first workpiece 90.

As a specific example, referring to fig. 4, the moving assembly 41 includes two first rails 411, one second rail 412 and one connecting arm 413. The two first guide rails 411 are arranged at intervals in parallel and extend along the first direction x, so that the overall stability of the moving assembly 41 can be increased, and the connecting arm 413 can also bear more assemblies. The second guide rail 412 is connected between the two first guide rails 411 and extends in a second direction y perpendicular to the first direction x. The connecting arm 413 includes a connecting end 4131 and a free end 4132 disposed opposite to each other, and the connecting end 4131 is slidably connected to the second rail 412. In this embodiment, the adsorption element 42 is disposed at the free end 4132. The suction assembly 42 slides along the third direction z and, illustratively, linear movement along the third direction z may be accomplished by a lead screw or guide rail. The third direction z is perpendicular to the first direction x and the second direction y. With the above arrangement, the adsorption assembly 42 realizes three-dimensional movement.

As a specific example, referring to fig. 6, the adsorption assembly 42 includes at least one suction head 421, and in this embodiment, the adsorption assembly 42 includes 4 suction heads 421, with the suction heads 421 being disposed in parallel. The plurality of adsorption assemblies 42 improves the working efficiency of the assembling apparatus 100.

In the present embodiment, referring to fig. 6 and 11, the assembly apparatus 100 may further include a detection mechanism 50 and a controller 70. The detection mechanism 50 includes an imaging assembly 51, and the imaging assembly 51 is connected to the assembly mechanism 40. Specifically, the imaging assembly 51 is disposed at the free end 4132 opposite the suction assembly 42. In this way, the mutual interference between the imaging assembly 51 and the adsorption assembly 42 can be avoided, and only the preset angle is required, so that the imaging assembly can enable the suction head 421 to adsorb the sizing material 80, and the suction head 421 and other mechanisms or assemblies or environments to form clear images, which are not described herein.

The controller 70 is coupled to the detecting mechanism 50 and the assembling mechanism 40, and the controller 70 is used for controlling the assembling mechanism 40 to drive the imaging assembly 51 to move. In some embodiments, the controller 70 is further configured to control the assembly mechanism 40 to drive the imaging assembly 51 to the first detection position 213 to obtain a first image representing the at least one first workpiece 90 carried by the tray 130, and control the assembly mechanism 40 to transfer the at least one first workpiece 90 to the feeding mechanism 10 according to a preset requirement according to the first image.

In an exemplary embodiment, 100 first workpieces 90 are loaded in one tray 130, and the controller 70 determines, according to the acquired first image, that all the first workpieces 90 that are not in the correct position, for example, the third bonding surface 91 of the first workpiece 90 is displayed in the first image, for example, one symbol or groove is formed on the third bonding surface 91, and it can be directly determined by visual means whether the third bonding surface 91 is displayed in the first image, or only that the symbol or groove on the other surface is different from or does not exist in the third bonding surface 91, or vice versa, and the symbol or groove on the other surface is formed and the third bonding surface 91 does not exist. The controller 70 groups the first workpieces 90 on the tray 130 according to the number of the suction heads 421, for example, if 4 suction heads 421 arranged side by side correspond to 4 first workpieces 90 arranged side by side on the tray 130, then there are 25 groups of first workpieces 90 in one tray 130, and each group has 4 first workpieces 90. All the corresponding groups of the first workpieces 90 which are not in the correct positions are identified by the controller 70 as not being transferred, for example, the 25 groups of the first workpieces 90 are sequentially divided into the 1 st, 2 nd, … … th and 25 th groups, if the third bonding surface 91 of at least one first workpiece 90 in the 2 nd group is displayed on the first image, which indicates that the first workpiece 90 is placed in the incorrect positions (reversed), the controller 70 controls the assembly mechanism 40 not to transfer the group of the first workpieces 90 which are not in the correct positions according to the preset requirement, and the assembly mechanism 40 directly skips the 2 nd group of the first workpieces when transferring the 25 th group of the first workpieces 90, and transfers only the group of the 1 st, 3 rd group and each third bonding surface 91 of other first workpieces 90 in the correct positions to the feeding mechanism 10. This can prevent more time from being consumed in this step while ensuring accurate assembly, thereby improving the assembly efficiency of the entire assembly apparatus 100.

In some embodiments, the controller 70 is further configured to control the assembly mechanism 40 to drive the imaging assembly 51 to the second detection position, obtain a second image representing the at least one glue 80, and adjust the position of the at least one first workpiece 90 on the assembly mechanism 40 according to the second image, so that each first workpiece 90 is adhered to a corresponding first bonding surface 81 according to a preset requirement.

For example, when the assembly mechanism 40 drives the imaging device 51 to the second detection position, the adsorbing device 42 also carries a set of first workpieces 90 to the upper side of the feeding mechanism 10. When the number of the first workpieces 90 is 4, the number of the glue materials 80 is also 4, and according to the position of the glue materials 80 in the second image, whether the position of the first workpiece 90 or the glue materials 80 is correct is determined by converting a machine coordinate system and a camera coordinate system, which is a conventional technical means and will not be repeated here. The preset requirement may be that the position of the at least one first workpiece 90 or the set of first workpieces 90 is directly above the corresponding at least one glue 80 or the corresponding set of glue 80, and the controller 70 determines that the position of the glue 80 or the corresponding at least one first workpiece 90 or the set of first workpieces 90 is correct according to the preset requirement, i.e. the glue 80 or the corresponding at least one first workpiece 90 or the set of first workpieces 90 can be accurately adhered according to the precision requirement, then the assembly mechanism 40 is controlled to control the at least one first workpiece 90 or the set of first workpieces 90 to move along the third direction z until the glue 80 or the corresponding set of glue 80 is pressed against. The controller 70 determines that the position of the at least one first workpiece 90 or the group of first workpieces 90 is incorrect according to the preset requirement, and adjusts the position of the at least one first workpiece 90 or the group of first workpieces 90 until the sizing material 80 or the corresponding at least one first workpiece 90 or the group of first workpieces 90 can be accurately adhered according to the precision requirement. It will be appreciated that the holding-down may also be maintained for a period of time after the pressing-down to ensure the bonding effect. In this way, the assembly efficiency of the entire assembly apparatus 100 can be improved by mass bonding while ensuring the assembly accuracy.

In the above embodiment, the controller 70 adjusts the adhesion between at least one first workpiece 90 and the corresponding glue 80 according to the image information, and in other embodiments, the controller 70 may adjust the adhesion between the first workpiece 90 and the glue 80 according to other information, for example, reflectivity, that is, determining the position through light reflection, which is not described herein.

In this way, after the first workpieces 90 and the glue 80 are bonded, the second bonding surface 82 is separated from the protective film by the suction force of the assembly mechanism 40 and the bonding force of the first workpiece 90 and the first bonding surface 81 of the glue 80, and by the structures of the connecting portion 121 and the second receiving box 132, the assembly mechanism 40 drives the bonded first workpieces 90 and glue 80 to the position right above the bearing assembly 31 of the second transfer mechanism 30 bearing the corresponding second workpieces 110, and the bonding process of the first workpieces 90 and the second workpieces 110 is completed by the movement along the third direction z.

In this embodiment, to provide a light source to the detection mechanism 50, the assembly apparatus 100 may further include a light source assembly 60. Referring to fig. 1 and 3, the light source assembly 60 includes a first light source 61 and a second light source 62. The first light source 61 is disposed at one side of the first detection position 213, the first light source 61 is a contoured annular light source, and the first light source 61 is configured to emit light toward the tray 130 and the first workpiece 90 on the tray 130. The second light source 62 is disposed at the free end 4132, and the second light source is disposed at a side of the imaging assembly 51 away from the connection end 4131. The second light source 62 is an annular light source, and the second light source 62 is configured to emit light toward the glue 80 and the protective film thereof located at the second detection position. In this embodiment, the imaging assembly 51 photographs at least one first workpiece 90 located at the first inspection location 213 through the opening of the first light source 61, and the imaging assembly 51 photographs the glue 80 located at the second inspection location through the opening of the second light source 62. The arrangement of the first light source 61 and the second light source 62 facilitates a clearer image obtained by the imaging assembly 51.

The specific operation is as follows: when the imaging assembly 51 photographs the first workpiece 90, the first light source 61 is turned on, and the second light source 62 is turned off; when the imaging assembly 51 photographs the glue 80, the first light source 61 is turned off and the second light source 62 is turned on. In this embodiment, the imaging assembly 51 is a CCD camera, and in other embodiments, the imaging assembly 51 may be selected according to actual needs. When the first detecting position 213 is detected, the second light source 62 is turned on, the first light source 61 is turned off, so that overexposure is prevented, and the first light source 61 is a contoured annular light source, so that the tray 130 with a large area and the first workpiece 90 thereon can be uniformly exposed, and imaging quality is improved. And in the second test position, the first light source 61 is turned on to provide a light source for the position detection of the compound 80.

In the above embodiment, the first transfer mechanism 20, the second transfer mechanism 30 and the assembly mechanism 40 are matched to bond at least one first workpiece 90 and at least one second workpiece 110, so that the production efficiency of workpiece bonding is improved, and the labor intensity is reduced. In addition, by adding the controller 70 to the assembling apparatus 100, automation of the assembling apparatus 100 is realized, further improving production efficiency.

In another embodiment, the present application also provides an assembly method for bonding the first workpiece 90 and the second workpiece 110 by the glue 80, which may be implemented by the assembly apparatus 100 described above, and the assembly method may be performed by the controller 70 of the assembly apparatus 100 as a program, but is not limited thereto. Referring to fig. 10, the assembly method includes the steps of:

s201: controlling the assembly mechanism 40 to transfer at least one first workpiece 90 loaded on the first transfer mechanism 20 to the feeding mechanism 10, wherein the feeding mechanism 10 is loaded with at least one sizing material 80, and each sizing material 80 is provided with a first bonding surface 81 and a second bonding surface 82 which are oppositely arranged;

s202: controlling the assembly mechanism 40 to bond each first workpiece 90 to the first bonding surface 81 of the corresponding glue stock 80;

s203: the control assembly mechanism 40 transfers at least one first workpiece 90 of the bonded glue stock 80 to the second transfer mechanism 30 and the control assembly mechanism 40 will bond the second bonding surface 82 of each glue stock 80 to a corresponding one of the second workpieces 110.

In still other embodiments, referring to fig. 11, the first workpieces 90 have a third bonding surface 91 (referring to fig. 8), the third bonding surface 91 is used to bond with the first bonding surface 81, and the assembly mechanism 40 obtains a set of first workpieces 90 at a time, the set of first workpieces 90 including a plurality of first workpieces 90. Before step S201, it is required to determine whether the third bonding surfaces are all in the correct positions, and the method further includes the following steps:

s204: the control inspection mechanism 50 acquires first inspection information of a set of first workpieces 90.

Exemplary, the first detection information includes, but is not limited to, picture information and reflectivity information.

S205: based on the first inspection information, it is determined whether a set of first workpieces 90 are in the correct position.

In some embodiments, referring to fig. 12, step S205 includes:

s2051: determining that at least one third bonding surface 91 of the group of first workpieces 90 is not in the correct position according to the first detection information;

s2052: based on at least one third abutment surface 91 of a set of first workpieces 90 being out of position, the assembly mechanism 40 is controlled to skip acquisition of a corresponding set of first workpieces 90.

In this way, errors in acquiring a set of first workpieces 90 from the beginning can be avoided, and the influence on the subsequent bonding process can be avoided.

S2053: determining that each third bonding surface 91 in the group of first workpieces 90 is in a correct position according to the first detection information;

s2054: the assembly mechanism 40 is controlled to transfer the set of first workpieces 90 carried by the first transfer mechanism 20 to the feed mechanism 10 based on each third abutment surface 91 of the set of first workpieces 90 being in the correct position.

In some embodiments, referring to fig. 13, the first inspection information is a first image including a representation of a set of first workpieces 90, the inspection tool 50 includes an imaging assembly 51, and step S205 further includes:

s2051a: determining from the first image that at least one third faying surface 91 of the set of first workpieces 90 does not have an identifying feature;

s2052a: based on at least one third abutment surface 91 of a set of first workpieces 90 not having an identification feature, the assembly mechanism 40 is controlled to skip acquisition of a corresponding set of first workpieces 90.

Similarly, step S205 further includes:

s2053a: determining from the first image that each third abutment surface 91 of the set of first workpieces 90 has an identification feature;

s2054a: based on each third abutment surface 91 of the set of first workpieces 90 having the identification feature, it is determined that each third abutment surface 91 of the set of first workpieces 90 is in the correct position, and the assembly mechanism 40 is controlled to transfer the set of first workpieces 90 carried by the first transfer mechanism 20 to the feed mechanism 10.

Specifically, the identification features are smooth surfaces and patterns, the third bonding surface 91 is a smooth surface, the surface opposite to the third bonding surface 91 is provided with a pattern, each first workpiece 90 in the first image obtained by the imaging assembly 51 is provided with a pattern, each third bonding surface 91 in the group of first workpieces 90 is determined to be in a correct position, and if any image in the group of first workpieces 90 in the first image is not provided with a pattern, at least one third bonding surface 91 in the group of first workpieces 90 is determined to be not in a correct position.

In an exemplary embodiment, 100 first workpieces 90 are loaded in one tray 130, the controller 70 determines, according to the acquired first image, that all the first workpieces 90 are not in the correct position, for example, the third bonding surface 91 of the first workpiece 90 is displayed in the first image, for example, one symbol or groove is formed on the third bonding surface 91, and it can be directly determined by visual means whether the third bonding surface 91 is displayed in the first image, that is, it is determined that a group of first workpieces 90 all have identification features representing the third bonding surface 91, only needs that the other surface is different from the symbol or groove of the third bonding surface 91 or has no symbol or groove, or may be opposite, and the other surface has a symbol or groove and the third bonding surface 91 has no symbol or groove. The controller 70 groups the first workpieces 90 on the tray 130 according to the number of the suction heads 421, for example, if 4 suction heads 421 arranged side by side correspond to 4 first workpieces 90 arranged side by side on the tray 130, then there are 25 groups of first workpieces 90 in one tray 130, and each group has 4 first workpieces 90. All the corresponding groups of the first workpieces 90 which are not in the correct positions are identified by the controller 70 as not being transferred, for example, the 25 groups of the first workpieces 90 are sequentially divided into the 1 st, 2 nd, … … th and 25 th groups, if the third bonding surface 91 of at least one first workpiece 90 in the 2 nd group is displayed on the first image, which indicates that the first workpiece 90 is placed in the incorrect positions (reversed), the controller 70 controls the assembly mechanism 40 not to transfer the group of the first workpieces 90 which are not in the correct positions according to the preset requirement, and the assembly mechanism 40 directly skips the 2 nd group of the first workpieces when transferring the 25 th group of the first workpieces 90, and only transfers the 1 st group, the 3 rd group and groups of the other first workpieces 90, wherein each third bonding surface 91 is in the correct positions. Thus, the assembly efficiency of the whole assembly device 100 can be improved without staying for an excessive time in this step while ensuring the assembly accuracy.

In some further embodiments, referring to fig. 11, the assembly method further includes, after step S201:

step S206: after transferring at least one first workpiece 90 to the feeding mechanism 10, controlling the detecting mechanism 50 to obtain second detection information representing the relative position of each first workpiece 90 and a corresponding first bonding surface 81;

step S207: based on the second detection information, it is determined that the relative position of each first workpiece 90 and the corresponding one of the first bonding surfaces 81 is correct.

Step S208: the assembly mechanism 40 is controlled to bond each first workpiece 90 to a corresponding one of the first bonding surfaces 81 based on the relative position of each first workpiece 90 to the corresponding one of the first bonding surfaces 81.

In other embodiments, referring to fig. 11 and 14, after step S206 and before step S207, further comprising:

step S2061: determining a relative position error of at least one first workpiece 90 and a corresponding first bonding surface 81 according to the second detection information;

step S2062: based on the error in the relative position of the at least one first workpiece 90 and the corresponding one of the first bonding surfaces 81, the control assembly mechanism 40 adjusts the position of the at least one first workpiece 90 until the relative position of each first workpiece 90 and the corresponding one of the first bonding surfaces 81 is correct.

In other embodiments, referring to fig. 15, after each first workpiece 90 is bonded to a corresponding one of the first bonding surfaces 81, the second bonding surface 82 is further coated with a protective film. After step S202, the method further comprises:

step S209: determining that each first workpiece 90 is not adhered to the first adhesive surface 81 of a corresponding one of the adhesives 80;

step S210: the feed mechanism 10 is controlled to remove the unfinished adhesive 80 on the protective film based on the unfinished adhesive of each first workpiece 90 to the first bonding surface 81 of a corresponding one of the adhesives 80.

For example, when the assembly mechanism 40 drives the imaging device 51 to the second detection position, the adsorbing device 42 also carries a set of first workpieces 90 to the upper side of the feeding mechanism 10. When the number of the first workpieces 90 is 4, the number of the glue materials 80 is also 4, and according to the position of the glue materials 80 in the second image, whether the position of the first workpiece 90 or the glue materials 80 is correct is determined by converting a machine coordinate system and a camera coordinate system, which is a conventional technical means and will not be repeated here. The preset requirement may be that the position of the at least one first workpiece 90 or the set of first workpieces 90 is directly above the corresponding at least one glue 80 or the corresponding set of glue 80, and the controller 70 determines that the position of the glue 80 or the corresponding at least one first workpiece 90 or the set of first workpieces 90 is correct according to the preset requirement, i.e. the glue 80 or the corresponding at least one first workpiece 90 or the set of first workpieces 90 can be accurately adhered according to the precision requirement, then the assembly mechanism 40 is controlled to control the at least one first workpiece 90 or the set of first workpieces 90 to move along the third direction z until the glue 80 or the corresponding set of glue 80 is pressed against. The controller 70 determines that the position of the at least one first workpiece 90 or the group of first workpieces 90 is incorrect according to the preset requirement, and adjusts the position of the at least one first workpiece 90 or the group of first workpieces 90 until the sizing material 80 or the corresponding at least one first workpiece 90 or the group of first workpieces 90 can be accurately adhered according to the precision requirement. It will be appreciated that the holding-down may also be maintained for a period of time after the pressing-down to ensure the bonding effect. Thus, the assembly efficiency can be improved by mass adhesion while ensuring the assembly accuracy.

Referring to fig. 16, in some embodiments, there is also provided an assembly control device 200, including a controller 70, the controller 70 being coupled to a memory 120, the memory 120 storing instructions that when executed by the controller 70 perform the assembly method of any of the above embodiments.

In the above embodiment, referring to fig. 9 as a specific example, the first workpiece 90 is a pad of a bluetooth headset, and the diameter of the pad is 4-7mm. The second workpiece 110 is a button of a bluetooth headset, a groove is arranged on the button, the aperture of the groove is 4.2-7.2mm, and the gasket is adhered in the groove through the glue 80 during assembly. In order to accommodate the small size of the first and

second workpieces

90, 110, the axial spacing of the tips 421 in the above-described embodiment is 4-7m. In other embodiments, the suction assembly 42 is adaptable according to the dimensions of the first and

second workpieces

90, 110. The first workpiece 90 and the second workpiece 110 are selected according to actual needs.

Finally, it should be noted that the above embodiments are merely for illustrating the technical solution of the present application and not for limiting, and although the present application has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solution of the present application may be modified or substituted without departing from the spirit and scope of the technical solution of the present application.

Claims

1. An assembly apparatus for bonding a first workpiece and a second workpiece by a glue, comprising:

the feeding mechanism comprises a transfer assembly and a film removing assembly, wherein the transfer assembly is used for transferring at least one sizing material to a second detection position and comprises a feeding end and a discharging end which are oppositely arranged, each sizing material is provided with a first bonding surface and a second bonding surface which are oppositely arranged, the second bonding surface is provided with a protective film, the film removing assembly comprises a connecting part and a supporting part, the connecting part is parallel to the transfer assembly, one end of the connecting part is connected with the discharging end, the other end of the connecting part is provided with a first matching end part, the supporting part is arranged on one side, deviating from the sizing material, of the connecting part and comprises a second part and a second matching end part which are connected, the second matching end part and the first matching end part are arranged in a staggered mode at intervals, the included angle between the second part and the connecting part is an acute angle, and the first matching end part and the second matching end part are wedge-shaped tables;

the first transfer mechanism is used for transferring at least one first workpiece and comprises a transmission assembly, and the transmission assembly is used for receiving a tray carrying at least one first workpiece and transferring the tray to a first detection position;

the assembly mechanism is coupled with the feeding mechanism, the first transfer mechanism and the second transfer mechanism, and transfers at least one first workpiece from the first transfer mechanism to the feeding mechanism so that each first workpiece is adhered to a corresponding first bonding surface; the assembly mechanism transfers at least one first workpiece which is bonded to the second transfer mechanism from the feeding mechanism, so that each second workpiece is bonded with a corresponding second bonding surface;

the detection mechanism comprises an imaging assembly, and the imaging assembly is connected with the assembly mechanism;

the controller is coupled with the detection mechanism and the assembly mechanism and is used for controlling the assembly mechanism to drive the imaging assembly to the first detection position so as to acquire a first image representing at least one first workpiece carried by the material tray, controlling the assembly mechanism to transfer the at least one first workpiece to the feeding mechanism according to a preset requirement according to the first image, and controlling the assembly mechanism to drive the imaging assembly to the second detection position so as to acquire a second image representing at least one sizing material; and according to the second image, adjusting the position of at least one first workpiece on the assembly mechanism so as to bond each first workpiece with a corresponding first bonding surface according to a preset requirement.

2. The assembly apparatus of claim 1, wherein the second transfer mechanism comprises:

a bearing assembly for bearing at least one second workpiece; and

and the adjusting assembly is connected with the bearing assembly and is used for adjusting the position of at least one second workpiece.

3. The assembly apparatus of claim 1, wherein the assembly mechanism comprises:

a moving assembly; and

and the adsorption assembly is arranged on the moving assembly and is used for sucking at least one first workpiece.

4. An assembly method for bonding a first workpiece and a second workpiece by a compound, each compound having a first bonding surface and a second bonding surface disposed opposite each other, the first workpiece having a third bonding surface, comprising:

the method comprises the steps that a detection mechanism is controlled to obtain first detection information of a group of first workpieces loaded on a first transfer mechanism, the group of first workpieces comprise a plurality of first workpieces, each third joint surface in the group of first workpieces is determined to be at a correct position according to the first detection information, an assembly mechanism is controlled to transfer the group of first workpieces to a feeding mechanism based on each third joint surface in the group of first workpieces at the correct position, and the feeding mechanism comprises a transfer assembly which is used for loading at least one sizing material and comprises a feeding end and a discharging end which are oppositely arranged;

after the first workpieces are transferred to the feeding mechanism, controlling the detecting mechanism to obtain second detection information representing the relative positions of each first workpiece and a corresponding first bonding surface, determining that the relative positions of each first workpiece and a corresponding first bonding surface are correct according to the second detection information, and controlling the assembling mechanism to bond each first workpiece and a corresponding first bonding surface based on the correct relative positions of each first workpiece and a corresponding first bonding surface;

controlling the assembly mechanism to bond the second bonding surface of each sizing material to a corresponding one of the second workpieces;

after each first workpiece is adhered to a corresponding first bonding surface, a protective film is adhered to the second bonding surface, and the assembly method further comprises the following steps:

determining that each first workpiece is not adhered to the first bonding surface of the corresponding one of the sizing materials;

controlling the feeding mechanism to remove the adhesive material which is not adhered on the protective film on the basis of incomplete adhesion between each first workpiece and the first adhesive surface of the corresponding adhesive material;

the feeding mechanism further comprises a membrane removing assembly, the membrane removing assembly comprises a connecting portion and a supporting portion, the connecting portion is parallel to the transfer assembly, one end of the connecting portion is connected with the discharging end, the other end of the connecting portion is provided with a first matching end portion, the supporting portion is arranged on one side, away from the rubber material, of the connecting portion, the second matching end portion and the first matching end portion are arranged in a staggered mode at intervals, the included angle between the second portion and the connecting portion is an acute angle, the first matching end portion and the second matching end portion are wedge-shaped platforms, and the rubber material which is bonded on the protecting film is removed through the first matching end portion and the second matching end portion.

5. The assembly method of claim 4, wherein the assembly method further comprises:

determining that at least one third bonding surface in the group of first workpieces is not in the correct position according to the first detection information; and

and controlling the assembly mechanism to skip the acquisition of the corresponding group of first workpieces based on the fact that at least one third joint surface in the group of first workpieces is not in the correct position.

6. The assembly method of claim 4, wherein the first inspection information is a first image including a representation of the set of first workpieces, the inspection mechanism including an imaging component, the assembly method further comprising:

determining, from the first image, that the set of first workpieces all have identifying features that characterize the third faying surface;

and

each of the third faying surfaces in the set of first workpieces is determined to be in the correct position based on the set of first workpieces all having identification features that characterize the third faying surfaces.

7. The assembly method of claim 4, further comprising:

determining the relative position error of at least one first workpiece and a corresponding first bonding surface according to the second detection information;

and controlling the assembly mechanism to adjust the position of at least one first workpiece based on the error of the relative position of the at least one first workpiece and the corresponding first bonding surface until the relative position of each first workpiece and the corresponding first bonding surface is correct.

8. An assembly control device comprising a controller coupled to a memory, the memory storing instructions that when executed by the controller perform the assembly method of any one of claims 4 to 7.