CN112038380B - Display substrate and display device - Google Patents
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- CN112038380B CN112038380B CN202010936330.7A CN202010936330A CN112038380B CN 112038380 B CN112038380 B CN 112038380B CN 202010936330 A CN202010936330 A CN 202010936330A CN 112038380 B CN112038380 B CN 112038380B
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- 239000000758 substrate Substances 0.000 title claims abstract description 61
- 239000010409 thin film Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 97
- 238000009434 installation Methods 0.000 description 13
- 239000010408 film Substances 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
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- 239000004020 conductor Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Signal Processing (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Geometry (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The utility model provides a display substrate and display device belongs to and shows technical field, and it can solve among the correlation technique because the space is limited, and the quantity of signal connection line has received the restriction of the vertical size of pixel, the unable problem of arranging of a large amount of signal connection lines. The present disclosure provides a display substrate having a mounting area and a display area surrounding the mounting area, comprising: the display device comprises a substrate and a plurality of first pixel units positioned on the substrate; each of the plurality of first pixel units includes: the display device comprises a first driving circuit arranged in a display area, a first light-emitting device arranged in a mounting area and a signal connecting wire used for electrically connecting the first driving circuit and the first light-emitting device; and the signal connecting lines in at least partially different first pixel units are positioned in different layers.
Description
Technical Field
The disclosure belongs to the technical field of display, and particularly relates to a display substrate and a display device.
Background
With the continuous development of full-screen display, display devices with a camera under a screen gradually appear in the field of vision of people. In order to improve the light transmittance of the area where the under-screen camera is located and ensure the photographing effect of the under-screen camera, only the light-emitting device is reserved in the installation area of the camera, and the signal for controlling the light emission of the light-emitting device is led out by the driving circuit of the display area, and the signal connecting wire is generally made of transparent conductive materials.
The inventor finds that: as the size of cameras increases and the resolution increases, the number of signal connection lines that need to be arranged also increases. Due to the limited space, the number of signal connection lines is limited by the longitudinal size of the pixel, and a large number of signal connection lines cannot be arranged.
Disclosure of Invention
The present disclosure is directed to at least one of the problems of the prior art, and provides a display substrate and a display device.
In a first aspect, embodiments of the present disclosure provide a display substrate having a mounting area and a display area surrounding the mounting area, including: the display device comprises a substrate and a plurality of first pixel units positioned on the substrate;
each of the plurality of first pixel units includes: the display panel comprises a first driving circuit arranged in the display area, a first light-emitting device arranged in the mounting area and a signal connecting wire used for electrically connecting the first driving circuit and the first light-emitting device;
and the signal connecting lines in at least partially different first pixel units are positioned in different layers.
Optionally, some of the signal connection lines in the plurality of first pixel units are first signal connection lines, and another part of the signal connection lines are second signal connection lines;
each first signal connecting line and the first electrode of the first light-emitting device are arranged on the same layer; and each second signal connecting line and the source and drain electrodes of the thin film transistor in the first driving circuit are arranged on the same layer.
Optionally, the first electrode comprises: the first transparent conducting layer, the metal conducting layer and the second transparent conducting layer are sequentially arranged along the direction departing from the substrate; the first signal connection line is disposed on the same layer as any one of the first transparent conductive layer, the metal conductive layer, and the second transparent conductive layer.
Optionally, the first signal connection line and the first transparent conductive layer are of an integrally formed structure.
Optionally, the material of each of the first signal connection line and the second signal connection line includes indium tin oxide.
Optionally, the display area includes a plurality of pixel areas arranged in an array, each of the plurality of pixel areas includes a second pixel unit; the second pixel unit comprises a second driving circuit and a second light-emitting device electrically connected with the second driving circuit;
the first driving circuits of different first pixel units are arranged in different pixel areas.
Optionally, the arrangement density of the first light emitting devices is less than or equal to the arrangement density of the second light emitting devices.
Optionally, the display substrate further comprises: an optical device;
the optical device is arranged in the mounting area and is positioned between the substrate and the first light-emitting device.
Optionally, the optical device comprises a camera.
In a second aspect, embodiments of the present disclosure provide a display device including the display substrate provided as described above.
Drawings
FIG. 1 is a schematic plan view of a display substrate in the related art;
FIG. 2 is a schematic diagram of an exemplary driver circuit;
FIG. 3 isbase:Sub>A schematic cross-sectional view ofbase:Sub>A display substrate of the related art shown in FIG. 1 along the A-A' direction;
fig. 4 is a schematic structural diagram of a display substrate according to an embodiment of the disclosure.
Detailed Description
For a better understanding of the technical aspects of the present disclosure, reference is made to the following detailed description taken in conjunction with the accompanying drawings.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. Also, the use of the terms "a," "an," or "the" and similar referents do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that the element or item preceding the word comprises the element or item listed after the word and its equivalent, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used only to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
Fig. 1 is a schematic plan view of a display substrate in the related art, as shown in fig. 1, the display substrate has a mounting area (an area indicated by a circle in fig. 1) and a display area (an area except for the area indicated by the circle in fig. 1) surrounding the mounting area. The display substrate includes: the display device includes a substrate 101 and a plurality of first pixel units 102 disposed on the substrate 101, each of the plurality of first pixel units 102 includes: the display device comprises a first driving circuit 1021 arranged in the display area and a first light emitting device 1022 arranged in the mounting area, wherein the first driving circuit 1021 and the first light emitting device 1022 are connected in a one-to-one correspondence manner through signal connection lines 1023. The display substrate shown in fig. 1 is particularly suitable for a display device having a camera mounted under a screen. The installation area is correspondingly provided with a camera element, the camera element is used for realizing the camera function and simultaneously does not influence the display of the picture, and the display area is used for displaying the picture. In order to prevent the signal connection lines 1023 from shielding the light irradiated to the camera under the screen during the wiring process, the signal connection lines 1023 are generally made of transparent conductive materials.
Specifically, the first driving circuit 1021 in the display substrate at least includes a switching transistor and a driving transistor, and may further include a threshold compensation transistor, a reset transistor, a storage capacitor, and the like. Fig. 2 is a schematic diagram of an exemplary driving circuit, as shown in fig. 2, the driving circuit includes: a switching transistor T1, a driving transistor T2, and a storage capacitor C; the control electrode of the switching transistor T1 is connected to the control electrode signal line Gate, the first electrode is connected to the Data signal line Data, and the second electrode is connected to the first node N, where the first node N is a connection point between the second electrode of the switching transistor T1, the control electrode of the driving transistor T2, and one end of the storage capacitor C. The driving transistor T2 has a control electrode connected to the first node N, a first electrode connected to the first power line VDD, and a second electrode connected to the first electrode of the light emitting device D. One end of the storage capacitor C is connected to the first node N, and the other end is connected to the first power line VDD. The light emitting device D has a first electrode connected to the second electrode of the driving transistor T2 and a second electrode connected to the second power line VSS. It should be noted that the potential of the first power signal inputted from the first power line VDD is greater than the potential of the second power signal inputted from the second power line VSS, so that a voltage difference is formed between two ends of the light emitting device D to conduct the light emitting device D for emitting light. The light emitting device D may be an organic light emitting diode, a micro light emitting diode, an inorganic light emitting diode, etc., and the light emitting device D is exemplified as the organic light emitting diode in the present disclosure.
Fig. 3 isbase:Sub>A schematic cross-sectional view of the display substrate alongbase:Sub>A-base:Sub>A' direction in the related art shown in fig. 1, and as shown in fig. 3,base:Sub>A plurality of first light emitting devices 1022 in the mounting area may be respectively connected tobase:Sub>A first driving circuit 1021 in the display area through corresponding signal connection lines 1023, and for convenience of description, only thin film transistors in the first driving circuit 1021, which may be switching transistors or driving transistors, are shown in fig. 3, and are described in the present disclosure. It can be seen that the first light emitting device 1022 and the thin film transistor in the first driving circuit 1021 are connected through the signal connection line 1023, wherein the signal connection line 1023 in each first pixel unit 102 is disposed in the same layer as the source and drain electrodes of the thin film transistor, i.e. the signal connection line 1023 in each first pixel unit 102 is disposed in the same routing layer. As the size of the under-screen camera increases and the pixel resolution improves, the number of signal connection lines 1023 that need to be arranged also increases. Due to the limited space, the number of the signal connection lines 1023 is limited by the longitudinal size of the pixel, and a large number of the signal connection lines 1023 cannot be arranged, so that more signal connection lines 1023 cannot be arranged in the display substrate, and the display effect is affected.
In order to solve at least one of the above technical problems in the related art, an embodiment of the present disclosure provides a display substrate and a display device. The display substrate and the display device provided by the embodiments of the present disclosure will be described in further detail with reference to the accompanying drawings and the detailed description.
Example one
Fig. 4 is a schematic structural diagram of a display substrate according to an embodiment of the present disclosure, as shown in fig. 4, the display substrate having a mounting area and a display area surrounding the mounting area, including: a substrate 101 and a plurality of first pixel units 102 located on the substrate 101; each of the plurality of first pixel units 102 includes: a first driving circuit 1021 provided in the display area, a first light emitting device 1022 provided in the mounting area, and a signal connection line 1023 for electrically connecting the first driving circuit 1021 and the first light emitting device 1022; wherein, the signal connection lines 1023 in at least some of the different first pixel units 102 are located in different layers.
It should be noted that the signal connection lines 1023 are disposed in a one-to-one correspondence with the first light emitting devices 1022 in the mounting area, that is, one signal connection line 1023 provides a driving current for only one light emitting device 1022, so that each signal connection line 1023 is not shorted. In addition, the shapes of the display area and the mounting area may be various shapes such as a circle, a square, a polygon, and the like, and the shapes of the display area and the mounting area may be the same or different, and the shapes of the display area and the mounting area are not limited in the embodiment of the present disclosure. The camera may be mounted in the mounting area, and devices such as an ambient light sensor, a HOME key, an earpiece, or a speaker may also be mounted in the mounting area, which is not limited in the embodiments of the present disclosure, and the following description will be given by taking the example of mounting the camera in the mounting area as an example.
In the display substrate provided by the embodiment of the present disclosure, the plurality of first light emitting devices 1022 in the mounting area may be respectively connected to the first driving circuit 1021 in the display area through the corresponding signal connection lines 1023, and the first driving circuit 1021 in the display area provides a driving current for the first light emitting device 1021 in the mounting area to drive the first light emitting devices 1022 in the mounting area to emit light, so as to implement display of a picture in the mounting area. The first driving circuit 1021 is arranged in the display area, so that the situation that light rays in the installation area are shielded by film layers in devices such as thin film transistors in the first driving circuit 1021 can be avoided, the camera shooting function of the under-screen camera in the installation area is affected, and meanwhile, space can be saved for the camera in the installation area, so that arrangement of a large-size camera is facilitated. Moreover, in the embodiment of the present disclosure, the signal connection lines 1023 in at least partially different first pixel units 102 are located in different layers, so that the plurality of signal connection lines 1023 can be disposed in a plurality of different routing layers, and thus, under the condition that the installation space is limited, and the line width and the routing pitch of the signal connection lines 1023 are not changed, a greater number of signal connection lines 1023 can be arranged to meet the requirements of a large-size camera and high-resolution display.
In some embodiments, some of the signal connection lines 1023 in the first pixel units 102 are first signal connection lines 1024, and another part of the signal connection lines 1023 are second signal connection lines 1025; each of the first signal connection lines 1024 is disposed in the same layer as the first electrode of the first light emitting device 1022; each second signal connection line 1025 is disposed on the same layer as the source/drain electrode of the tft in the first driving circuit 1021.
It should be noted that, in the embodiment of the present disclosure, the first light emitting device 1022 may be an organic light emitting device including a first electrode, an organic functional layer, and a second electrode sequentially arranged along a direction away from the substrate 101. The thin film transistor in the first driving circuit 1021 comprises an active layer, a gate insulating layer, a gate electrode, an interlayer insulating layer and a source drain electrode which are sequentially arranged along the direction departing from the substrate 101; the source and drain electrodes are arranged on the same layer and are respectively connected with two ends of the active layer through via holes penetrating through the interlayer insulating layer and the gate insulating layer. In practical applications, a portion of the signal connection lines 1023 in the first pixel unit 102 may be referred to as a first signal connection line 1024, the first signal connection line 1024 may be disposed in the same layer as the first electrode of the first light emitting device 1022, another portion of the signal connection lines 1023 in the first pixel unit 102 may be referred to as a second signal connection line 1025, and the second signal connection line 1025 may be disposed in the same layer as the source and drain electrodes of the thin film transistor in the first driving circuit 1021. Thus, the signal connecting lines 1023 can be arranged on different wiring layers, the space of the installation area is limited, and a larger number of signal connecting lines 1023 can be arranged under the condition that the line width and the wiring distance of the signal connecting lines 1023 are not changed, so that the requirements of large-size cameras and high-resolution display are met. It is understood that the signal connection lines 1023 may be disposed on other wiring layers, for example, the first signal connection lines 1024 are disposed on the same layer as the second electrodes of the light emitting devices, and the second signal connection lines 1025 are disposed on the same layer as the gates of the thin film transistors, so as to further increase the number of wirings of the signal connection lines 1023. In each routing layer, the number of the signal connection lines 1023 may be the same or different, and in order to facilitate wiring and reduce process difficulty, in the embodiment of the present disclosure, the number of the signal connection lines 1023 disposed in each routing layer is the same.
In some embodiments, the first electrode includes a first transparent conductive layer, a metal conductive layer, and a second transparent conductive layer sequentially arranged in a direction away from the substrate 101; the first signal connecting line 1024 is disposed on the same layer as any one of the first transparent conductive layer, the metal conductive layer, and the second transparent conductive layer.
It should be noted that the first electrode may be an anode of the light emitting device 1022, and the anode may be formed by a three-layer structure, that is, the anode includes a first transparent conductive layer, a metal conductive layer, and a second transparent conductive layer that are sequentially disposed along a direction away from the substrate 101, where the metal conductive layer may be a thin film material made of silver or aluminum and having a high conductive performance, and has a certain light transmittance while being conductive, so as to prevent blocking light that irradiates the camera in the mounting area. The first signal connection line 1024 may be disposed in the same layer as any one of the first transparent conductive layer, the metal conductive layer, and the second transparent conductive layer of the anode to form a routing layer of the signal connection line 1023. The second signal connection line 1025 may be disposed at the same layer as the source-drain electrodes of the thin film transistors in the first driving circuit 1021. Like this, many signal connection lines 1023 can be located the routing layer of difference, and is limited in the installation area space like this, and signal connection line 1023 can arrange more signal connection lines 1023 under the unchangeable condition of line width and the routing interval of signal connection line 1023 to satisfy the requirement of jumbo size camera and high resolution display. Preferably, the first signal connecting line 1024 is disposed on the same layer as the first transparent conductive layer and is made of the same material. Since the first signal connecting line 1024 is generally made of a transparent conductive material, in order to facilitate the manufacturing, the first signal connecting line 1024 and the first transparent conductive layer may be disposed on the same layer and made of the same material, so as to save the manufacturing cost. It is understood that the first signal connecting line 1024 may be disposed on the same layer as the second transparent conductive layer and made of the same material. In the manufacturing process, since the first transparent conductive layer is closer to the thin film transistor in the first driving circuit 1021 connected to the first transparent conductive layer than the second transparent conductive layer, the first signal connection line 1024 and the first transparent conductive layer can be preferably disposed on the same layer, so that damage to other film layers of the anode when the connection via hole is disposed can be avoided.
In some embodiments, the first signal connecting line 1024 and the first transparent conductive layer are integrally formed.
It should be noted that the first signal connection line 1024 and the first transparent conductive layer may be an integrated structure, the same material may be used in the preparation process, and the first signal connection line 1024 and the first transparent conductive layer are formed in one step by the same process, so that the preparation steps are saved, the preparation cost is saved, the first signal connection line 1024 and the first transparent conductive layer are prevented from being independently connected to form a contact resistor, and the conductivity is improved.
In some embodiments, the material of the first and second signal connecting lines 1024, 1025 comprises indium tin oxide.
It should be noted that the material of the first signal connecting line 1024 and the second signal connecting line 1025 in the signal connecting line 1023 in the embodiment of the disclosure may be indium tin oxide, and of course, other conductive metal oxides such as indium tin oxide may also be used, which are not listed here.
In some embodiments, as shown in fig. 4, the display region includes a plurality of pixel regions arranged in an array, each of the plurality of pixel regions including the second pixel unit 103; the second pixel unit 103 includes a second driving circuit 1031 and a second light emitting device 1032 electrically connected to the second driving circuit 1031; the first driving circuits 1021 of different first pixel units 102 are disposed in different pixel regions.
It should be noted that the second driving circuit 1031 and the second light emitting device 1032 in the second pixel unit 103 are both disposed in the same pixel region of the display region and are connected in a one-to-one correspondence manner, and the second driving circuit 1031 may provide a driving current for the corresponding second light emitting device 1032 to drive the second light emitting device 1032 to emit light, so as to implement display of a display region picture. The first driving circuits 1021 of different first pixel units 102 are disposed in different pixel regions, and may be located in the same pixel as the second driving circuits of the second pixel units 103, so that the first driving circuits 1021 are uniformly arranged in each pixel region, and specifically, the first driving circuits 1021 may be disposed in a gap between adjacent second driving circuits 1031, so as to prevent the first driving circuits 1021 from intensively occupying a larger space and affecting the image display effect of the display region.
In some embodiments, the arrangement density of the first light emitting devices 1022 is less than or equal to the arrangement density of the second light emitting devices 1032.
It should be noted that, in order to ensure uniformity of display images of the display area and the mounting area, the second light emitting devices 1032 in the display area are arranged in the same manner as the first light emitting devices 1022 in the mounting area, for example, the second light emitting devices 1032 in the display area are arranged in an RGB manner, and the first light emitting devices 1022 in the mounting area are also arranged in an RGB manner. Meanwhile, since the requirement of the display screen in the mounting region is lower than that of the display screen in the display region, the arrangement density of the first light emitting devices 1022 may be less than or equal to that of the second light emitting devices 1032 in practical applications. Preferably, the arrangement density of the first light emitting devices 1022 is less than that of the second light emitting devices 1032, so that the manufacturing cost can be saved.
In some embodiments, the display substrate further comprises: an optical device; the optical device is disposed in the mounting region and located between the substrate 101 and the first light emitting device 1022.
It should be noted that the optical device in the embodiment of the present disclosure may be a camera, an ambient light sensor, or the like, and is particularly suitable for an off-screen camera. Therefore, the mounting area of the display substrate can not only realize the optical functions of camera shooting and the like, but also realize the picture display function, thereby improving the area of the display picture, being beneficial to full-screen display and further improving the display effect.
The display substrate provided by the embodiment of the disclosure can be prepared and formed by the following steps:
first, a first driving circuit of a first pixel unit and a second driving circuit of a second pixel unit are formed on a substrate, and a first planarization layer is formed on the first driving circuit and the second driving circuit so as to planarize source and drain electrodes of thin film transistors in each driving circuit, and subsequent film layers can be prepared and attached conveniently. A plurality of first via holes for connecting the thin film transistors in the first and second driving circuits are formed on the first planarization layer. A conductive layer, which may be indium tin oxide, is formed on the first planarization layer with the first via hole and patterned to leave only a portion of the conductive layer in the mounting region. A second planarizing layer is formed on the first planarizing layer on which the conductive layers are formed, and second via holes communicating with the respective conductive layers are formed. And sequentially forming a first electrode of a three-layer structure of a first transparent conductive layer, a metal conductive layer and a second transparent conductive layer on the second planarization layer with the second through hole. And partially etching the second transparent conductive layer and the metal conductive layer by a composition process, and reserving the first transparent conductive layer at the bottommost layer. And patterning the first transparent conductive layer at the bottommost layer to form a signal connecting wire connected with the first transparent conductive layer and connected to the thin film transistor in the first driving circuit. And finally, forming other devices and film layers such as a first light-emitting device, a second light-emitting device and the like in the display substrate to form the display substrate. It should be noted that, after the first driving circuit of the first pixel unit and the second driving circuit of the second pixel unit are formed on the substrate, a transparent conductive layer may be formed on the source/drain electrode layer, and then etching is performed to form a part of the signal connection lines. Therefore, a plurality of signal connecting wires can be arranged in a plurality of different wiring layers, so that a larger number of signal connecting wires can be arranged under the conditions that the space of an installation area is limited and the line width and the wiring distance of the signal connecting wires are not changed, and the requirements of large-size cameras and high-resolution display are met.
Example two
Embodiments of the present disclosure provide a display device including a display substrate as provided in any of the above embodiments. The display device can be a mobile phone, a tablet personal computer, an intelligent watch, a notebook computer and other terminal equipment. The implementation principle of the display substrate is similar to that of the display substrate provided in any of the above embodiments, and is not described herein again.
In the display substrate of the display apparatus provided by the embodiment of the disclosure, the plurality of first light emitting devices in the mounting area may be respectively connected to the first driving circuit of the display area through the corresponding signal connection line, and the first driving circuit of the display area provides a driving current for the first light emitting device of the mounting area to drive the first light emitting device of the mounting area to emit light, thereby realizing display of a picture in the mounting area. The first driving circuit is arranged in the display area, so that the shielding of films in devices such as thin film transistors in the display area on light rays in the installation area can be avoided, the camera shooting function of the under-screen camera in the installation area is influenced, and meanwhile, the space of the under-screen camera in the installation area can be saved, so that the arrangement of a large-size camera is facilitated. In addition, in the embodiment of the present disclosure, at least some of the signal connection lines in the different first pixel units are located in different layers, so that a plurality of signal connection lines can be disposed in a plurality of different routing layers, and thus, under the condition that the space of the installation area is limited and the line width and the routing pitch of the signal connection lines are not changed, a greater number of signal connection lines can be disposed, so as to meet the requirements of a large-size camera and high-resolution display.
It is to be understood that the above embodiments are merely exemplary embodiments that are employed to illustrate the principles of the present disclosure, and that the present disclosure is not limited thereto. It will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the disclosure, and these are to be considered as the scope of the disclosure.
Claims (7)
1. A display substrate having a mounting area and a display area surrounding the mounting area, comprising: the display device comprises a substrate and a plurality of first pixel units positioned on the substrate;
each of the plurality of first pixel units includes: the display panel comprises a first driving circuit arranged in the display area, a first light-emitting device arranged in the mounting area and a signal connecting wire used for electrically connecting the first driving circuit and the first light-emitting device; the signal connecting lines are connected with the first light-emitting devices in a one-to-one corresponding mode;
wherein the signal connection lines in the first pixel units which are at least partially different are located in different layers;
a part of the signal connecting lines in the plurality of first pixel units are first signal connecting lines, and the other part of the signal connecting lines are second signal connecting lines;
each first signal connecting line and the first electrode of the first light-emitting device are arranged on the same layer; each second signal connecting line and a source drain electrode of the thin film transistor in the first driving circuit are arranged on the same layer;
the first electrode includes: the first transparent conducting layer, the metal conducting layer and the second transparent conducting layer are sequentially arranged along the direction departing from the substrate; the first signal connecting wire and the first transparent conductive layer are arranged on the same layer, and the first signal connecting wire and the first transparent conductive layer are of an integrally formed structure.
2. The display substrate of claim 1, wherein the material of the first signal connection line and the second signal connection line comprises indium tin oxide.
3. The display substrate according to claim 1, wherein the display region comprises a plurality of pixel regions arranged in an array, each of the plurality of pixel regions comprising a second pixel unit; the second pixel unit comprises a second driving circuit and a second light-emitting device electrically connected with the second driving circuit;
the first driving circuits of different first pixel units are arranged in different pixel areas.
4. The display substrate according to claim 3, wherein the arrangement density of the first light emitting devices is less than or equal to the arrangement density of the second light emitting devices.
5. The display substrate of claim 1, further comprising: an optical device;
the optical device is arranged in the mounting area and is positioned between the substrate and the first light-emitting device.
6. The display substrate of claim 5, wherein the optical device comprises a camera.
7. A display device comprising the display substrate according to any one of claims 1 to 6.
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| CN112767839B (en) * | 2021-01-29 | 2022-08-19 | 昆山国显光电有限公司 | Display panel and display device |
| CN115241226A (en) * | 2021-04-23 | 2022-10-25 | 京东方科技集团股份有限公司 | Display panel and display device |
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| KR20080078089A (en) * | 2007-02-22 | 2008-08-27 | 삼성전자주식회사 | Display substrate and method for manufacturing the same, display apparatus |
| CN104183606A (en) * | 2014-08-07 | 2014-12-03 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method of display substrate, and display device |
| KR102465379B1 (en) * | 2015-12-02 | 2022-11-10 | 삼성디스플레이 주식회사 | Display apparatus |
| CN107293570B (en) * | 2017-05-12 | 2019-10-22 | 上海天马微电子有限公司 | A kind of display panel and display device |
| CN207183320U (en) * | 2017-09-22 | 2018-04-03 | 京东方科技集团股份有限公司 | Organic electroluminescent LED, display base plate and display device |
| US10707281B2 (en) * | 2018-08-10 | 2020-07-07 | Au Optronics Corporation | Display apparatus |
| CN110047901B (en) * | 2019-04-28 | 2021-08-31 | 厦门天马微电子有限公司 | Display panel and electronic equipment |
| CN110112202B (en) * | 2019-05-24 | 2021-04-30 | 京东方科技集团股份有限公司 | Display substrate and preparation method thereof |
| CN111293231B (en) * | 2020-02-24 | 2023-09-22 | 京东方科技集团股份有限公司 | WOLED display substrate, manufacturing method thereof and WOLED display device |
| CN111446282B (en) * | 2020-04-28 | 2022-04-22 | 京东方科技集团股份有限公司 | Display substrate and display device |
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