CN111987051B - IGBT packaging structure with temperature measurement function and packaging method - Google Patents
IGBT packaging structure with temperature measurement function and packaging method Download PDFInfo
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- CN111987051B CN111987051B CN202010660423.1A CN202010660423A CN111987051B CN 111987051 B CN111987051 B CN 111987051B CN 202010660423 A CN202010660423 A CN 202010660423A CN 111987051 B CN111987051 B CN 111987051B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 27
- 238000009529 body temperature measurement Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title abstract description 7
- 230000017525 heat dissipation Effects 0.000 claims abstract description 98
- 238000009413 insulation Methods 0.000 claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000000741 silica gel Substances 0.000 claims abstract description 12
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 12
- 239000002274 desiccant Substances 0.000 claims abstract description 9
- 239000007787 solid Substances 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims description 9
- 239000003365 glass fiber Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 239000000110 cooling liquid Substances 0.000 description 5
- 238000007791 dehumidification Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Drying Of Gases (AREA)
Abstract
The invention discloses an IGBT packaging structure with a temperature measurement function and a packaging method, wherein the IGBT packaging structure comprises a heat dissipation base, two sides of the heat dissipation base are respectively communicated with a water inlet valve and a water discharge valve, two sides of the bottom of the heat dissipation base are both fixedly connected with mounting frames, mounting holes are formed in the front side and the rear side of the bottom of the mounting frames, and the top of the heat dissipation base is fixedly connected with heat-conducting silica gel. The invention solves the problems that the existing IGBT packaging structure does not have a temperature measuring function and has poor heat dissipation effect by matching the heat dissipation base, the second heat dissipation plate, the heat insulation plate, the first heat dissipation plate, the mounting rack, the water inlet valve, the first heat dissipation hole, the mounting hole, the air inlet pipe, the drain valve, the positioning frame, the coiled pipe, the heat conduction silica gel, the shell, the positioning rod, the temperature sensor, the outer cover, the IGBT module, the heat dissipation fan, the limiting plate, the spring, the first positioning hole, the second positioning hole, the threaded pipe, the second filter screen, the frame, the first filter screen, the solid drying agent and the second heat dissipation hole.
Description
Technical Field
The invention relates to the technical field of IGBT packaging, in particular to an IGBT packaging structure with a temperature measurement function and a packaging method.
Background
The IGBT and the insulated gate bipolar transistor are composite fully-controlled voltage-driven power semiconductor devices consisting of BJTs and MOS, and have the advantages of high input impedance of the MOSFET and low conduction voltage drop of GTR. The GTR saturation voltage is reduced, the current carrying density is high, but the driving current is large; the MOSFET has small driving power, high switching speed, large conduction voltage drop and small current carrying density. The IGBT integrates the advantages of the two devices, and has small driving power and reduced saturation voltage. The IGBT module is very suitable for being applied to the fields of converter systems with the direct-current voltage of 600V or more, such as alternating-current motors, frequency converters, switching power supplies, lighting circuits, traction transmission and the like, the application of the IGBT module in the aspect of circuits is more and more extensive, but the existing IGBT module does not have the function of accurate temperature measurement, and meanwhile, the heat transfer of other external equipment can also influence the operation of the IGBT module, so that the heat dissipation efficiency of the IGBT module can be reduced.
Disclosure of Invention
The invention aims to provide an IGBT packaging structure with a temperature measuring function, which has the advantages of temperature measuring function and good heat dissipation and dehumidification effects and solves the problems that the existing IGBT packaging structure does not have the temperature measuring function and is poor in heat dissipation effect.
In order to achieve the purpose, the invention provides the following technical scheme: the IGBT packaging structure with the temperature measurement function comprises a heat dissipation base, wherein two sides of the heat dissipation base are respectively communicated with a water inlet valve and a water discharge valve, two sides of the bottom of the heat dissipation base are fixedly connected with a mounting frame, mounting holes are respectively formed in the front side and the rear side of the bottom of the mounting frame, the top of the heat dissipation base is fixedly connected with heat-conducting silica gel, the top of the heat-conducting silica gel is fixedly connected with an IGBT module, the top of the heat dissipation base is fixedly connected with a positioning frame, two sides of the inner cavity of the positioning frame are respectively fixedly connected with a shell, the inner cavity of the shell is movably connected with a limiting plate, one side of the limiting plate, far away from the positioning frame, is fixedly connected with a spring, one side of the limiting plate, far away from the spring, is fixedly connected with a positioning rod, two sides of the positioning frame are respectively provided with a first positioning hole, the top of the heat dissipation base is movably connected with an outer cover, and two sides of the inner cavity of the outer cover are respectively and fixedly connected with a temperature sensor, the outer surface of the outer cover is fixedly connected with a heat insulation plate, second positioning holes are formed between two sides of the outer cover and two sides of the heat insulation plate, one end, away from the limiting plate, of each positioning rod penetrates through the first positioning hole and extends to the inner cavity of the second positioning hole, the outer surface of the outer cover is fixedly connected with a first heat dissipation plate, one side, away from the outer cover, of each first heat dissipation plate penetrates through the outer side of the heat insulation plate, the top of the inner cavity of the outer cover is fixedly connected with a heat dissipation fan, the top of the heat dissipation fan is communicated with an air inlet pipe, the top of the air inlet pipe sequentially penetrates through the outer cover and the heat insulation plate and extends to the top of the heat insulation plate, the bottom of the inner cavity of the air inlet pipe is fixedly connected with a first filter screen, a solid drying agent is placed at the top of the first filter screen, the top of the air inlet pipe is movably connected with a frame, the bottom of the frame is fixedly connected with a threaded pipe, and the threaded pipe is positioned in the inner cavity of the air inlet pipe, and a second filter screen is fixedly connected between the threaded pipe and the inner cavity of the frame.
Preferably, the number of the first heat dissipation plates is a plurality, and one side of the first heat dissipation plate is provided with a first heat dissipation hole.
Preferably, the bottom of the heat dissipation base is fixedly connected with a second heat dissipation plate, a second heat dissipation hole is formed in one side of the second heat dissipation plate, and the number of the second heat dissipation plates is a plurality.
Preferably, the front side and the rear side of the IGBT module are respectively provided with a coiled pipe, and two ends of each coiled pipe are communicated with the heat dissipation base.
Preferably, the bottom of the shell is fixedly connected with the heat dissipation base, and the outer surface of the threaded pipe is in threaded connection with the connection part of the air inlet pipe.
Preferably, the outer surface of the positioning frame is in contact with the inner wall of the outer cover, and the heat insulation plate is made of glass fiber.
Compared with the prior art, the invention has the following beneficial effects:
1. the IGBT packaging structure solves the problems that the existing IGBT packaging structure does not have a temperature measuring function and has a poor heat dissipation effect, and has the advantages of good temperature measuring function and good heat dissipation and dehumidification effects, and is worthy of popularization.
2. The heat insulation plate is arranged, so that excessive external heat is prevented from being transferred to the inner cavity of the outer cover, and the heat insulation effect is achieved;
through setting up the locating frame, stability when having increased the dustcoat installation.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a first sectional front view of a portion of the present invention;
FIG. 3 is a front cross-sectional view of the housing of the present invention;
FIG. 4 is a second sectional front view of a portion of the present invention;
FIG. 5 is a front cross-sectional view of the air inlet duct and frame of the present invention;
fig. 6 is a left side view of a second heat dissipation plate according to the present invention;
FIG. 7 is a top view of the mount of the present invention;
FIG. 8 is a top view of the positioning frame of the present invention.
In the figure: 1 heat dissipation base, 2 second heating panels, 3 heat insulating boards, 4 first heating panels, 5 mounting racks, 6 water inlet valves, 7 first heating holes, 8 mounting holes, 9 air inlet pipes, 10 drain valves, 11 positioning frames, 12 coiled pipes, 13 heat conduction silica gel, 14 shells, 15 positioning rods, 16 temperature sensors, 17 covers, 18IGBT modules, 19 cooling fans, 20 limiting plates, 21 springs, 22 first positioning holes, 23 second positioning holes, 24 threaded pipes, 25 second filter screens, 26 frames, 27 first filter screens, 28 solid drying agents and 29 second heating holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be configured in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The heat dissipation base 1, the second heat dissipation plate 2, the heat insulation plate 3, the first heat dissipation plate 4, the mounting rack 5, the water inlet valve 6, the first heat dissipation hole 7, the mounting hole 8, the air inlet pipe 9, the water discharge valve 10, the positioning frame 11, the coiled pipe 12, the heat conducting silica gel 13, the shell 14, the positioning rod 15, the temperature sensor 16, the outer cover 17, the IGBT module 18, the heat dissipation fan 19, the limiting plate 20, the spring 21, the first positioning hole 22, the second positioning hole 23, the threaded pipe 24, the second filter screen 25, the frame 26, the first filter screen 27, the solid drying agent 28, the second heat dissipation hole 29 and other parts are all universal standard parts or parts known by a person skilled in the art, and the structure and principle of the heat dissipation base can be known by a technical manual or a conventional experimental method.
Referring to fig. 1-8, the IGBT package structure with temperature measurement function includes a heat dissipation base 1, two sides of the heat dissipation base 1 are respectively communicated with a water inlet valve 6 and a water discharge valve 10, two sides of the bottom of the heat dissipation base 1 are both fixedly connected with a mounting frame 5, front and back sides of the bottom of the mounting frame 5 are both provided with mounting holes 8, the top of the heat dissipation base 1 is fixedly connected with a heat conductive silica gel 13, the top of the heat conductive silica gel 13 is fixedly connected with an IGBT module 18, the top of the heat dissipation base 1 is fixedly connected with a positioning frame 11, two sides of an inner cavity of the positioning frame 11 are both fixedly connected with a housing 14, an inner cavity of the housing 14 is movably connected with a limiting plate 20, one side of the limiting plate 20 away from the positioning frame 11 is fixedly connected with a spring 21, one side of the limiting plate 20 away from the spring 21 is fixedly connected with a positioning rod 15, two sides of the positioning frame 11 are both provided with first positioning holes 22, and the top of the heat dissipation base 1 is movably connected with an outer cover 17, both sides of an inner cavity of the outer cover 17 are fixedly connected with temperature sensors 16, the outer surface of the outer cover 17 is fixedly connected with a heat insulation plate 3, second positioning holes 23 are respectively arranged between both sides of the outer cover 17 and both sides of the heat insulation plate 3, one end of the positioning rod 15, far away from the limiting plate 20, penetrates through the first positioning hole 22 and extends to the inner cavity of the second positioning hole 23, the outer surface of the outer cover 17 is fixedly connected with a first heat dissipation plate 4, one side of the first heat dissipation plate 4, far away from the outer cover 17, penetrates through the outer side of the heat insulation plate 3, the top of the inner cavity of the outer cover 17 is fixedly connected with a heat dissipation fan 19, the top of the heat dissipation fan 19 is communicated with an air inlet pipe 9, the top of the air inlet pipe 9 sequentially penetrates through the outer cover 17 and the heat insulation plate 3 and extends to the top of the heat insulation plate 3, the bottom of the inner cavity of the heat insulation plate 9 is fixedly connected with a first filter screen 27, a solid desiccant 28 is placed on the top of the first filter screen 27, the top of the air inlet pipe 9 is movably connected with a frame 26, a threaded pipe 24 is fixedly connected to the bottom of the frame 26, the threaded pipe 24 is positioned in the inner cavity of the air inlet pipe 9, and a second filter screen 25 is fixedly connected between the threaded pipe 24 and the inner cavity of the frame 26;
the number of the first heat dissipation plates 4 is several, and one side of each first heat dissipation plate 4 is provided with a first heat dissipation hole 7;
the bottom of the heat dissipation base 1 is fixedly connected with a second heat dissipation plate 2, one side of the second heat dissipation plate 2 is provided with a second heat dissipation hole 29, and the number of the second heat dissipation plates 2 is several;
the front side and the rear side of the IGBT module 18 are both provided with a coiled pipe 12, and both ends of the coiled pipe 12 are both communicated with the heat dissipation base 1;
the bottom of the shell 14 is fixedly connected with the heat dissipation base 1, and the outer surface of the threaded pipe 24 is in threaded connection with the connection part of the air inlet pipe 9;
the outer surface of the positioning frame 11 is contacted with the inner wall of the outer cover 17, and the heat insulation plate 3 is made of glass fiber;
the heat insulation plate 3 is arranged, so that excessive external heat is prevented from being transferred to the inner cavity of the outer cover 17, and a heat insulation effect is achieved;
by providing the positioning frame 11, the stability of the housing 17 when mounted is increased.
The packaging method of the IGBT packaging structure with the temperature measurement function comprises the following specific operation steps:
a: firstly, the positioning rod 15 is accommodated in the inner cavity of the first positioning hole 22, then the outer cover 17 is communicated with the external structure of the outer cover and is arranged on the outer surface of the positioning frame 11, so that the positioning rod 15 corresponds to the second positioning hole 23, the limiting plate 20 is driven to reset by the elastic force of the spring 21, the limiting plate 20 drives the positioning rod 15 to enter the inner cavity of the second positioning hole 23, and the position of the outer cover 17 is positioned, so that the packaging purpose is achieved;
b: the structure is fixed with other devices by matching of the mounting hole 8 and an external bolt, after the structure is electrified, the temperature sensor 16 continuously monitors the temperature in the outer cover 17, cooling liquid is introduced into the heat dissipation base 1 through the water inlet valve 6, the cooling liquid usually flows into the inner cavity of the coiled pipe 12, the surface of the coiled pipe 12 is adsorbed with heat in the outer cover 17, the cooling liquid adsorbs the heat on the surface of the coiled pipe 12, meanwhile, the heat on the surface of the IGBT module 18 is transferred to the heat dissipation base 1 through the heat conducting silica gel 13, the cooling liquid in the heat dissipation base 1 usually adsorbs the heat and is discharged through the water discharge valve 10, and the cooling liquid is continuously introduced for heat dissipation;
c: in the heat dissipation process, the heat dissipation fan 19 is started, the heat dissipation fan 19 extracts outside air through the air inlet pipe 9 and blows into the inner cavity of the outer cover 17 at an accelerated speed so as to dissipate heat inside, in the process, the second filter screen 25 and the first filter screen 27 filter dust and impurities in the air, the solid desiccant 28 adsorbs moisture in the air, excessive wet air is prevented from entering the inner cavity of the outer cover 17, and a user needs to regularly rotate the frame 26 to drive the threaded pipe 24 to be separated from the inner cavity of the air inlet pipe 9, so that the first filter screen 27 and the second filter screen 25 are cleaned and maintained conveniently, and meanwhile, the solid desiccant 28 is replaced conveniently;
d: the heat absorbed on the surface of the outer cover 17 can be transferred to the outside through the first heat dissipation plate 4, so that the heat dissipation efficiency of the outer cover 17 is improved through the cooperation of the first heat dissipation plate 4 and the first heat dissipation holes 7, and the heat dissipation efficiency of the heat dissipation base 1 can be accelerated through the cooperation of the second heat dissipation plate 2 and the second heat dissipation holes 29.
In summary, the following steps: this IGBT packaging structure with temperature measurement function, through setting up heat dissipation base 1, second heating panel 2, heat insulating board 3, first heating panel 4, mounting bracket 5, water intaking valve 6, first louvre 7, mounting hole 8, air-supply line 9, the drain valve 10, locating frame 11, coiled pipe 12, heat conduction silica gel 13, casing 14, locating lever 15, temperature sensor 16, dustcoat 17, IGBT module 18, radiator fan 19, limiting plate 20, spring 21, first locating hole 22, second locating hole 23, screwed pipe 24, second filter screen 25, frame 26, first filter screen 27, the cooperation of solid drying agent 28 and second louvre 29 is used, the problem that current IGBT packaging structure does not possess the temperature measurement function and dispel the fact the effect relatively poor is solved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. IGBT packaging structure with temperature measurement function, including heat dissipation base (1), its characterized in that: the heat dissipation device is characterized in that the two sides of the heat dissipation base (1) are respectively communicated with a water inlet valve (6) and a water discharge valve (10), mounting frames (5) are fixedly connected to the two sides of the bottom of the heat dissipation base (1), mounting holes (8) are formed in the front side and the rear side of the bottom of each mounting frame (5), heat-conducting silica gel (13) is fixedly connected to the top of the heat dissipation base (1), an IGBT module (18) is fixedly connected to the top of each heat-conducting silica gel (13), a positioning frame (11) is fixedly connected to the top of the heat dissipation base (1), a shell (14) is fixedly connected to the two sides of the inner cavity of each positioning frame (11), a limiting plate (20) is movably connected to the inner cavity of the shell (14), a spring (21) is fixedly connected to one side of the limiting plate (20) far away from the positioning frame (11), a positioning rod (15) is fixedly connected to one side of the limiting plate (20) far away from the spring (21), the heat dissipation device is characterized in that first positioning holes (22) are formed in two sides of the positioning frame (11), an outer cover (17) is movably connected to the top of the heat dissipation base (1), temperature sensors (16) are fixedly connected to two sides of an inner cavity of the outer cover (17), a heat insulation plate (3) is fixedly connected to the outer surface of the outer cover (17), second positioning holes (23) are formed between two sides of the outer cover (17) and two sides of the heat insulation plate (3), one end, far away from the limiting plate (20), of the positioning rod (15) penetrates through the first positioning holes (22) and extends to the inner cavity of the second positioning holes (23), a first heat dissipation plate (4) is fixedly connected to the outer surface of the outer cover (17), one side, far away from the outer cover (17), of the first heat dissipation plate (4) penetrates through the outer side of the heat insulation plate (3), and a heat dissipation fan (19) is fixedly connected to the top of the inner cavity of the outer cover (17), the top intercommunication of radiator fan (19) has air-supply line (9), the top of air-supply line (9) runs through dustcoat (17) and heat insulating board (3) in proper order and extends to the top of heat insulating board (3), the first filter screen of bottom fixedly connected with (27) of air-supply line (9) inner chamber, solid desiccant (28) have been placed at the top of first filter screen (27), the top swing joint of air-supply line (9) has frame (26), the bottom fixedly connected with screwed pipe (24) of frame (26), screwed pipe (24) are located the inner chamber of air-supply line (9), fixedly connected with second filter screen (25) between the inner chamber of screwed pipe (24) and frame (26).
2. The IGBT packaging structure with temperature measurement function of claim 1, characterized in that: the number of the first heat dissipation plates (4) is a plurality, and one side of each first heat dissipation plate (4) is provided with a first heat dissipation hole (7).
3. The IGBT packaging structure with temperature measurement function of claim 1, characterized in that: the bottom fixedly connected with second heating panel (2) of heat dissipation base (1), second louvre (29) have been seted up to one side of second heating panel (2), the quantity of second heating panel (2) is a plurality of.
4. The IGBT packaging structure with temperature measurement function of claim 1, characterized in that: the front side and the rear side of the IGBT module (18) are respectively provided with a coiled pipe (12), and two ends of each coiled pipe (12) are communicated with the heat dissipation base (1).
5. The IGBT packaging structure with temperature measurement function of claim 1, characterized in that: the bottom of the shell (14) is fixedly connected with the heat dissipation base (1), and the outer surface of the threaded pipe (24) is in threaded connection with the connection part of the air inlet pipe (9).
6. The IGBT packaging structure with temperature measurement function of claim 1, characterized in that: the outer surface of the positioning frame (11) is in contact with the inner wall of the outer cover (17), and the heat insulation plate (3) is made of glass fiber.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010660423.1A CN111987051B (en) | 2020-07-10 | 2020-07-10 | IGBT packaging structure with temperature measurement function and packaging method |
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| CN202010660423.1A CN111987051B (en) | 2020-07-10 | 2020-07-10 | IGBT packaging structure with temperature measurement function and packaging method |
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| CN111987051A CN111987051A (en) | 2020-11-24 |
| CN111987051B true CN111987051B (en) | 2022-04-01 |
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| CN112635419A (en) * | 2020-12-22 | 2021-04-09 | 国网智慧能源交通技术创新中心(苏州)有限公司 | Packaging structure of inverter IGBT module |
| CN113488418B (en) * | 2021-09-06 | 2021-11-05 | 江苏煜晶光电科技有限公司 | Cooling device for semiconductor production |
| CN115763396B (en) * | 2022-11-03 | 2024-02-02 | 江苏东海半导体股份有限公司 | Antistatic IGBT module |
| CN116261316B (en) * | 2023-05-16 | 2023-09-08 | 维宏感应(山东)科技有限公司 | IGBT packaging structure with temperature measurement function |
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|---|---|---|---|---|
| CN210298383U (en) * | 2019-07-09 | 2020-04-10 | 沈阳鹏程伟业智能工程有限公司 | Thing networked control equipment that radiating effect is good |
| CN111182765A (en) * | 2019-12-13 | 2020-05-19 | 西安世锐软件有限责任公司 | Computer network equipment box that radiating effect is good |
| CN210694747U (en) * | 2019-10-21 | 2020-06-05 | 无锡奥润汽车技术有限公司 | New forms of energy battery is with heat dissipation shock mounting |
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| TWM286410U (en) * | 2005-07-22 | 2006-01-21 | Channel Well Technology Co Ltd | Power supply with a cooling function |
| JP2014022114A (en) * | 2012-07-13 | 2014-02-03 | Sanyo Electric Co Ltd | Power supply device, and vehicle having the same |
| CN107291199B (en) * | 2017-08-16 | 2020-11-10 | 北京神州数码云科信息技术有限公司 | Computer mainframe convenient to heat dissipation |
| CN207503138U (en) * | 2017-12-20 | 2018-06-15 | 白城师范学院 | It is a kind of to have both heat dissipation and dust-proof computer motherboard bracing means |
| CN208507518U (en) * | 2018-06-15 | 2019-02-15 | 中航建设集团成套装备股份有限公司 | A kind of distribution transforming automation heat dissipation switch |
| CN109167123B (en) * | 2018-09-18 | 2021-03-16 | 王大幸 | Adjustable heat radiation structure for new energy automobile battery |
| CN210004353U (en) * | 2019-07-13 | 2020-01-31 | 中山市品诚光电实业有限公司 | overheating protection LED driving power supply |
| CN210073550U (en) * | 2019-08-07 | 2020-02-14 | 绿能(富民)太阳能科技有限公司 | Booster box type transformer convenient to install |
| CN210605582U (en) * | 2019-11-05 | 2020-05-22 | 烟台毓璜顶医院 | Vehicle-mounted shockproof computer host |
| CN110941315B (en) * | 2019-11-20 | 2021-02-09 | 西安微城信息科技有限公司 | Electronic device with heat dissipation and dust prevention functions and method thereof |
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| CN210298383U (en) * | 2019-07-09 | 2020-04-10 | 沈阳鹏程伟业智能工程有限公司 | Thing networked control equipment that radiating effect is good |
| CN210694747U (en) * | 2019-10-21 | 2020-06-05 | 无锡奥润汽车技术有限公司 | New forms of energy battery is with heat dissipation shock mounting |
| CN111182765A (en) * | 2019-12-13 | 2020-05-19 | 西安世锐软件有限责任公司 | Computer network equipment box that radiating effect is good |
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