CN111970851A - Liquid waterproof glue flow choking method - Google Patents
Liquid waterproof glue flow choking method Download PDFInfo
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- CN111970851A CN111970851A CN202010867419.2A CN202010867419A CN111970851A CN 111970851 A CN111970851 A CN 111970851A CN 202010867419 A CN202010867419 A CN 202010867419A CN 111970851 A CN111970851 A CN 111970851A
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- circuit board
- glue
- flow blocking
- flow
- frame
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a liquid waterproof glue flow choking method, and relates to the technical field of circuit board manufacturing. In the liquid waterproof glue flow blocking method provided by the invention, in the character process, a flow blocking frame is designed on a film; transferring the flow resisting frame to a circuit board by ink printing; at least one bonding pad group is arranged in the waterproof area of the circuit board, and the bonding pad group comprises at least one bonding pad; the choke frame surrounds the pad group. When the conventional liquid waterproof glue is used for spraying and printing the circuit board, the flow blocking frame is formed on the periphery of the bonding pad group in the waterproof area, so that the flow of the liquid waterproof glue can be effectively prevented, the glue overflow range is controlled within a preset range, and the problem that the board surface is polluted by the glue dispensing glue is greatly solved.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a liquid waterproof glue flow choking method.
Background
With the development of the electronic industry, consumer products such as mobile phones and tablet computers are developed towards light, thin and multifunctional directions, and more functions are compatible in a limited space, the thickness and size of each part need to be controlled, and the FPC is used as an essential part in electronic products, so that the design of the FPC greatly affects the structure of the whole computer.
The FPC generally comprises a main body and components, wherein the components are required to be waterproof, anticorrosive, and insulating, and dispensing treatment is required on the FPC. Two kinds of glue used for dispensing are available, one is an oxygen-proof resin UV glue, the thickness of the glue dispensed on a device can only be 0.2mm at the thinnest, and the light and thin requirements of a consumer electronic circuit board cannot be met; the other type of the liquid waterproof adhesive is liquid waterproof adhesive, the total thickness after dispensing can be controlled to be 0.01-0.03 um, the light and thin requirements of smart phones and flat plates can be met, but the liquidity of the liquid waterproof adhesive is large, the liquid waterproof adhesive is coated by a conventional method, the glue flowing range in an FPC device area reaches more than 1.5mm, the plate surface and an effective gold surface are seriously polluted, and the problem that the FPC has influence on quality and functions is caused.
Disclosure of Invention
The technical problem to be solved by the invention is that the liquidity of the liquid waterproof glue is large, and the product performance is influenced because the glue flowing range after coating is too large.
In order to solve the above problems, the present invention proposes the following technical solutions:
a liquid waterproof glue flow blocking method is applied to a circuit board manufacturing process, and in a character process, a flow blocking frame is designed on a film; transferring the flow resisting frame to a circuit board by ink printing;
at least one bonding pad group is arranged in the waterproof area of the circuit board, and the bonding pad group comprises at least one bonding pad; the choke frame surrounds the pad group.
The technical scheme is that the distance between the single side of the flow resisting frame and the nearest pad edge is 0.5-0.7 mm.
The technical scheme is that the line width of the flow resisting frame is 0.15-0.25 mm.
The further technical scheme is that the mesh number of the character screen plate is 120-.
The technical scheme is that in the dispensing process, a cover plate jig is used for covering the non-waterproof area of the circuit board.
The cover plate jig performs windowing yielding on the positions of the bonding pad groups, exposes components on the bonding pad groups, and is smaller than the flow blocking frame.
The technical scheme is that the single side of the windowing is 0.1-0.2mm smaller than the single side of the current-blocking frame.
The technical scheme is that the thickness of the cover plate jig is 0.3-0.5 mm.
The technical scheme is that in the dispensing process, the circuit board is carried by the support plate jig, the cover plate jig is covered, and dispensing is carried out.
The invention also provides a circuit board manufacturing process which comprises the liquid waterproof glue flow blocking method.
Compared with the prior art, the invention can achieve the following technical effects:
according to the liquid waterproof glue flow blocking method provided by the invention, when the conventional liquid waterproof glue is used for spraying and printing the circuit board, the flow blocking frame is formed on the periphery of the bonding pad group in the waterproof area, so that the flow of the liquid waterproof glue can be effectively prevented, the glue overflow range is controlled within a preset range, and the problem that the board surface is polluted by glue dispensing glue is greatly improved.
By the liquid waterproof glue flow blocking method, the glue dispensing thickness can be reduced to 0.01-0.03 um, the glue flowing area is controllable, the whole machine assembling space compression of mobile phone electronics is greatly improved, and the light and thin effect is achieved.
By the liquid waterproof glue flow-resisting method provided by the invention, the reject ratio of the glue dispensing process is reduced to 0 from the original 100%, and the product quality is absolutely guaranteed.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view of a flow-impeding frame transferred to a circuit board for ink printing;
FIG. 2 is a schematic cross-sectional view of the cover plate jig and the carrier plate jig in the dispensing process;
fig. 3 is a schematic view of a choke frame on a circuit board.
Reference numerals
The device comprises a circuit board 1, a screen plate 2, ink 3, a flow blocking frame 4, a cover plate jig 5, a support plate jig 6, a positioning hole 7, waterproof glue 8 and a component 9.
Detailed Description
The technical solutions in the embodiments will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, wherein like reference numerals represent like elements in the drawings. It is apparent that the embodiments to be described below are only a part of the embodiments of the present invention, and not all of them. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the embodiments of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the invention. As used in the description of embodiments of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
Referring to fig. 1 to 3, an embodiment of the present invention provides a method for blocking flow of a liquid waterproof adhesive, which is applied to a circuit board manufacturing process, and in a character process, a pattern of a flow blocking frame is designed on a film; the ink 3 is printed on the screen 2, and a flow blocking frame 4 is formed on the circuit board 1 (see fig. 1 and 3).
In an embodiment, the character process itself needs to design a character film according to a circuit board, and then the character is printed on the circuit board, the original character film can be used, the design of the flow blocking frame is added, the printing of the character and the flow blocking frame can be completed simultaneously during printing, other processes are not additionally added, and the original production flow is not changed.
At least one bonding pad group is arranged in the waterproof area of the circuit board 1, and the bonding pad group comprises at least one bonding pad; the pads are used for welding the components 9, and the choke frame 4 surrounds the pad group.
The circuit board is different according to design performance, and some components and parts have waterproof requirement, can form pad group to a plurality of areas that need waterproof components and parts 9 intensive.
Through the liquid waterproof glue choked flow method that this embodiment provided, when using conventional liquid waterproof glue to spout the seal to the circuit board, be formed with the choked flow frame in the periphery of pad group, can effectively prevent the flow of liquid waterproof glue, with the excessive gluey scope management and control within the scope of predetermineeing, improved the problem that glue pollutes the face of gluing greatly.
In one embodiment, the distance between the single edge of the flow blocking frame 4 and the nearest pad edge is 0.5-0.7 mm.
By controlling the distance between the single side of the flow blocking frame and the nearest pad edge, the glue flowing area of the liquid glue can be controlled, generally speaking, the glue flowing area is 0.5-0.7mm and can meet the product quality requirement. The flow area is controlled within 0.5mm or between 0.7 and 1.0mm by the person skilled in the art based on the inventive concept, and the invention also belongs to the protection scope.
In one embodiment, the line width of the flow blocking frame 4 is 0.15-0.25 mm.
The line width of the flow blocking frame is the ink width of the flow blocking frame after printing.
In one embodiment, the mesh size of the mesh plate 2 is 120-140T.
The thickness of the ink can be controlled between 15 and 25 micrometers by adopting a screen plate for printing, the screen plate uses a mesh of 120-140T, and the image of the flow-blocking frame on the film is transferred to the screen plate by exposure/development. Wherein, the character thickness is controlled between 15-25 microns to effectively block the flow of waterproof glue.
In other embodiments, the ink used for printing is white varnish, and those skilled in the art may also use other colors and other types of inks for printing, which is not limited by the present invention.
In one embodiment, in the dispensing process, the non-waterproof area of the circuit board 1 is covered by the cover plate fixture 5.
The cover plate jig can prevent glue from splashing to the non-waterproof area of the circuit board during glue dispensing.
In an embodiment, the cover plate jig 5 performs a window opening abdication on the solder pad group, so as to expose the component 9, and the window opening is smaller than the flow blocking frame 4.
The cover plate jig is used for windowing and yielding the bonding pad group, so that components on the bonding pad group are exposed, the cover plate jig can not crush the components during production, the flow blocking frame can be covered, and glue is prevented from splashing on a non-waterproof area of the circuit board during dispensing.
In one embodiment, the windowed single side is 0.1-0.2mm smaller than the single side of the current-blocking frame 4.
I.e. the distance from the single edge of the fenestration to the nearest pad edge is 0.4-0.6 mm. Can expose the components and parts on the pad group, guarantee that the apron tool can not crush the device when producing, can cover the choked flow frame again simultaneously, prevent that glue from splashing on the non-waterproof region of circuit board when the point is glued.
In one embodiment, the thickness of the cover plate fixture 5 is 0.3-0.5 mm.
The thickness of the cover plate jig is too thin and is easy to deform, so that the processing precision is influenced; too thick processing difficulty is big, and is with high costs.
In one embodiment, the cover fixture 5 is made of a steel plate.
It should be noted that before dispensing production, the cover plate jig needs to be sleeved on the circuit board according to the positioning hole 7, so as to expose the component 9.
In one embodiment, a carrier jig 6 is used in the dispensing process, and since some circuit boards are thinner, such as FPC, the circuit boards need to be carried by the carrier jig, transported to a machine, covered by a cover plate jig, and then dispensed.
In one embodiment, the carrier jig 6 is made of aluminum material and has a thickness of 2.5-3.0 mm.
In the specific implementation, four corners of the peripheries of the cover plate jig 5 and the carrier plate jig 6 are also provided with 4 pin positioning holes 7 with the diameter of 2.0mm, and the cover plate jig and the circuit board are sleeved on the carrier plate jig according to the positioning holes 7 before dispensing; correspondingly, 4 positioning holes 7 with the diameter of 2.0mm are designed on the circuit board 1 for positioning (as shown in fig. 2).
In specific implementation, the color of the liquid waterproof glue used in the glue dispensing process is orange; those skilled in the art can also use other colors and other types of liquid waterproof glue, and the invention is not limited thereto.
The embodiment of the invention also provides a circuit board manufacturing process, which comprises the following steps: cutting → drilling → black hole → VCP → pattern transfer → AOI → laminating → rapid pressing/Curing (COV) → solder resist (curing) → gold deposition → character → die cutting → assembling → die cutting → FQC/FQA → SMT → dispensing → die cutting → FQC/FQA-packaging.
Specifically, taking the FPC as an example, the character and dispensing process is introduced, and the rest of the processes are performed according to the normal processes:
a character process:
step 11, drying the screen, namely using a film negative film, and converting the film graph (characters and a flow blocking frame) to a screen plate with the screen mesh of 120-140T by the film through an exposure mode;
step 12, printing; sleeving the FPC on a workbench, aligning the screen plate to the FPC design fixed position, and printing the white oil line on the surface of the FPC;
step 13, the angle of the printing scraper is preferably 30-60 degrees;
step 14, appearance inspection is carried out to check whether the printing deviation exists;
step 15, curing, temperature: 120 ℃, time: 30-60 min.
Dispensing:
step 21, preparing a cover plate and a carrier plate jig according to the data of the product;
step 22, sequentially placing the cover plate and the FPC on a carrier plate jig through positioning nails;
step 23: and placing the superposed FPC on a dispensing machine table, and carrying out alignment and dispensing through the alignment optical points.
The glue flowing area of the liquid waterproof glue can be controlled through the flow, the liquid waterproof glue cannot flow to other positions on the board, and the appearance of the board surface is ensured.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
While the invention has been described with reference to specific embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A liquid waterproof glue flow blocking method is applied to a circuit board manufacturing process and is characterized in that in a character process, a flow blocking frame is designed on a film; transferring the flow resisting frame to a circuit board by ink printing;
at least one bonding pad group is arranged in the waterproof area of the circuit board, and the bonding pad group comprises at least one bonding pad; the choke frame surrounds the pad group.
2. A liquid waterproof glue flow blocking method as claimed in claim 1, characterized in that the distance between one side of the flow blocking frame and the nearest pad edge is 0.5-0.7 mm.
3. A liquid waterproof glue flow blocking method as claimed in claim 2, wherein the line width of the flow blocking frame is 0.15-0.25 mm.
4. The method as claimed in claim 3, wherein the number of the character net is 120-140T.
5. A liquid waterproof glue flow blocking method according to claim 1, wherein in the glue dispensing process, the non-waterproof area of the circuit board is covered by a cover plate jig.
6. The method for stopping flow of water-proof glue according to claim 5, wherein the cover plate fixture makes a window to the position of the welding disc group, and the window is smaller than the flow stopping frame.
7. A liquid waterproof glue flow blocking method as claimed in claim 6, wherein the single edge of the fenestration is 0.1-0.2mm smaller than the single edge of the flow blocking frame.
8. The method for preventing water-proof glue flow blocking according to claim 7, wherein the thickness of the cover plate jig is 0.3-0.5 mm.
9. The method of claim 7, wherein during the dispensing step, the circuit board is carried by the carrier fixture, covered by the cover fixture, and then dispensed.
10. A process for manufacturing a circuit board, comprising a liquid water-resistant glue flow-resistant method according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010867419.2A CN111970851A (en) | 2020-08-25 | 2020-08-25 | Liquid waterproof glue flow choking method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010867419.2A CN111970851A (en) | 2020-08-25 | 2020-08-25 | Liquid waterproof glue flow choking method |
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| Publication Number | Publication Date |
|---|---|
| CN111970851A true CN111970851A (en) | 2020-11-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010867419.2A Pending CN111970851A (en) | 2020-08-25 | 2020-08-25 | Liquid waterproof glue flow choking method |
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| CN (1) | CN111970851A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07214958A (en) * | 1994-02-07 | 1995-08-15 | Ibiden Co Ltd | Printed circuit board for ic card |
| JP2010118634A (en) * | 2008-11-12 | 2010-05-27 | Samsung Electro-Mechanics Co Ltd | Printed circuit board having flow preventing dam and manufacturing method therefor |
| CN104853543A (en) * | 2015-05-18 | 2015-08-19 | 惠州市金百泽电路科技有限公司 | Flex-rigid circuit board dispensing control method |
| CN105377449A (en) * | 2013-07-10 | 2016-03-02 | 柯尼卡美能达株式会社 | Coating film formation method, base material with transparent conducting film, device and electronic apparatus |
| CN107231760A (en) * | 2017-06-27 | 2017-10-03 | 北京计算机技术及应用研究所 | A kind of high-precision mold encapsulating method of circuit board assemblies |
-
2020
- 2020-08-25 CN CN202010867419.2A patent/CN111970851A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07214958A (en) * | 1994-02-07 | 1995-08-15 | Ibiden Co Ltd | Printed circuit board for ic card |
| JP2010118634A (en) * | 2008-11-12 | 2010-05-27 | Samsung Electro-Mechanics Co Ltd | Printed circuit board having flow preventing dam and manufacturing method therefor |
| CN105377449A (en) * | 2013-07-10 | 2016-03-02 | 柯尼卡美能达株式会社 | Coating film formation method, base material with transparent conducting film, device and electronic apparatus |
| CN104853543A (en) * | 2015-05-18 | 2015-08-19 | 惠州市金百泽电路科技有限公司 | Flex-rigid circuit board dispensing control method |
| CN107231760A (en) * | 2017-06-27 | 2017-10-03 | 北京计算机技术及应用研究所 | A kind of high-precision mold encapsulating method of circuit board assemblies |
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Application publication date: 20201120 |
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| RJ01 | Rejection of invention patent application after publication |