CN111965387B - High-reliability acceleration sensor for motor train unit and preparation method thereof - Google Patents

High-reliability acceleration sensor for motor train unit and preparation method thereof Download PDF

Info

Publication number
CN111965387B
CN111965387B CN202011138746.0A CN202011138746A CN111965387B CN 111965387 B CN111965387 B CN 111965387B CN 202011138746 A CN202011138746 A CN 202011138746A CN 111965387 B CN111965387 B CN 111965387B
Authority
CN
China
Prior art keywords
shell
circuit board
printed circuit
inner shell
sealant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202011138746.0A
Other languages
Chinese (zh)
Other versions
CN111965387A (en
Inventor
孙炎
姚福龙
周冲
黄文斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo CRRC Times Transducer Technology Co Ltd
Original Assignee
Ningbo CRRC Times Transducer Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo CRRC Times Transducer Technology Co Ltd filed Critical Ningbo CRRC Times Transducer Technology Co Ltd
Priority to CN202011138746.0A priority Critical patent/CN111965387B/en
Publication of CN111965387A publication Critical patent/CN111965387A/en
Application granted granted Critical
Publication of CN111965387B publication Critical patent/CN111965387B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P21/00—Testing or calibrating of apparatus or devices covered by the preceding groups
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing

Abstract

The invention provides a high-reliability acceleration sensor for a motor train unit, which comprises a shell assembly and a connector assembly, wherein the shell assembly is provided with a plurality of through holes; the shell assembly is sequentially provided with a printed circuit board, an inner shell and a shell from inside to outside, and the shell comprises a shell cover and an outer shell; the connector assembly includes a cable and a connector; one end of the cable is welded with the printed circuit board, a welding point is formed on the printed circuit board, and the other end of the cable is connected with the connector; wherein, the inner shell is filled with sealant and organic silicone gel, or the inner shell is filled with sealant and sponge adhesive tape; and sealant is filled in a gap between the shell and the inner shell. According to the invention, the inner shell is additionally arranged in the outer shell of the acceleration sensor to form a double-layer structure, and different glue is filled between the inner shell and the outer shell, so that the temperature resistance and the vibration resistance of the acceleration sensor are improved.

Description

High-reliability acceleration sensor for motor train unit and preparation method thereof
Technical Field
The invention belongs to the technical field of sensors, and relates to a high-reliability acceleration sensor for a motor train unit and a preparation method thereof.
Background
The train of the motor train unit consists of a plurality of powered vehicles (motor trains) and unpowered vehicles (trailers) and operates in an integral fixed marshalling mode in the normal service life. Compared with the traditional train, the motor train unit has the advantages of large traction force, high acceleration and the like, is suitable for small-marshalling and large-density passenger transportation organizations, and is widely applied to various high-speed railways and urban rail transit. When a motor train unit train runs, particularly runs at a high speed, if the vibration acceleration value caused by snaking is too large, the train has the risk of derailment. At present, an acceleration sensor is assembled on a instability detection system on a motor train unit, so that the vibration acceleration can be detected, and when the vibration acceleration value reaches an early warning value, the system can adjust a driving strategy to ensure the driving safety. The acceleration sensor is arranged on a bogie of the motor train unit train and used for detecting horizontal transverse vibration acceleration of the bogie and outputting a current signal in a certain proportion to the acceleration so as to judge whether the snaking instability motion of the bogie occurs. The existing acceleration sensor also has the defects of poor vibration resistance, poor temperature resistance and the like, so that the reliability of the measurement result of the acceleration sensor is lower to a certain extent.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a novel acceleration sensor for a motor train unit.
The invention provides a high-reliability acceleration sensor for a motor train unit, which comprises a shell assembly and a connector assembly;
the shell assembly is sequentially provided with a printed circuit board, an inner shell and a shell from inside to outside, the shell comprises a shell cover and an outer shell, and the printed circuit board is arranged in the inner shell;
the connector assembly includes a cable and a connector;
one end of the cable is welded with the printed circuit board, a welding point is formed on the printed circuit board, and the other end of the cable is connected with the connector;
wherein, the inner shell is filled with sealant and organic silicone gel, or the inner shell is filled with sealant and sponge adhesive tape; and sealant is filled in a gap between the shell and the inner shell.
Preferably, the inner shell is filled with sealant and silicone gel, the sealant is filled at the bottom of the inner shell and used for immersing the welding points of the printed circuit board, and the silicone gel is filled at the upper part of the sealant and used for immersing the printed circuit board.
Preferably, the inner shell is filled with sealant and a sponge adhesive tape, the sponge adhesive tape is coated on part of the printed circuit board, the part of the printed circuit board is a part of the printed circuit board, which is not welded with the cable, above the welding point, and the sealant is filled in other parts of the inner shell.
Preferably, the sealant is polyurethane potting adhesive and/or epoxy resin adhesive.
Preferably, the sealant is an epoxy resin adhesive.
Preferably, the Shore hardness of the epoxy resin adhesive is more than or equal to 85D, and the heat is higher than or equal to the heatThe expansion coefficient is 20-35 x 10-6The tensile strength is more than or equal to 70MPa, the shear bonding strength is more than or equal to 20MPa, and the volume resistivity is more than or equal to 1 multiplied by 1015Omega, cm, and the temperature-resistant range is-40 to 180 ℃.
Preferably, the sponge adhesive tape comprises an adhesive layer and a substrate layer, wherein the adhesive layer is distributed on one side of the substrate layer, the adhesive layer is made of acrylate adhesive, and the substrate layer is made of one or more of silicone sponge, polyurethane sponge and polyvinyl alcohol sponge.
Preferably, the thickness of the adhesive layer of the sponge adhesive tape is 0.5-2.0 mm, and the thickness of the substrate layer is 1.5-3.0 mm.
In another aspect, the present invention provides a method for manufacturing a highly reliable acceleration sensor for a motor train unit, including the following steps:
s1, welding one end of the cable on the printed circuit board;
s2, assembling the printed circuit board at the bottom of the inner shell, sleeving the inner shell in the outer shell, and sequentially assembling the printed circuit board, the inner shell and the outer shell from inside to outside;
s3, the other end of the cable which is not welded on the printed circuit board faces downwards, the openings of the inner shell and the outer shell face upwards, and sealant is filled in the inner shell until the welding point of the printed circuit board is immersed;
s4, after the sealant is cured, continuously encapsulating organic silicon gel in the inner shell until the printed circuit board is immersed;
s5, after the organic silicon gel is solidified, encapsulating the sealant again to enable the sealant to be completely filled in the gap between the inner shell and the shell;
and S6, laser welding the shell cover to the shell, and connecting the other end of the cable with the connector.
The invention provides another method for preparing the high-reliability acceleration sensor for the motor train unit, which comprises the following steps:
s1, welding one end of the cable on the printed circuit board;
s2, assembling the printed circuit board at the bottom of the inner shell, sleeving the inner shell in the outer shell, and sequentially assembling the printed circuit board, the inner shell and the outer shell from inside to outside;
s3, the other end of the cable which is not welded on the printed circuit board faces downwards, the openings of the inner shell and the outer shell face upwards, and sealant is filled in the inner shell until the welding point of the printed circuit board is immersed;
s4, after the sealant is solidified, covering a sponge adhesive tape on the part of the cable which is not welded above the welding point of the printed circuit board;
s5, encapsulating the sealant again to enable the sealant to be completely filled in gaps between the sponge adhesive tape and the inner shell and gaps between the inner shell and the shell;
and S6, laser welding the shell cover to the shell, and connecting the other end of the cable with the connector.
Compared with the prior art, the invention has the beneficial effects that:
(1) according to the acceleration sensor for the motor train unit, the sealant is filled below the welding points of the printed circuit board and in the gaps between the inner shell and the shell, so that the relative positions of the printed circuit board, the inner shell and the outer shell are not displaced, and insulation protection is provided for the printed circuit board; the organic silicon gel is used for filling the inner cavity of the inner shell and coating the printed circuit board, so that insulation protection and vibration buffering are provided for the printed circuit board, and the printed circuit board is prevented from being influenced by thermal stress and mechanical stress in use.
(2) According to the acceleration sensor for the motor train unit, the sponge adhesive tape covers part of the printed circuit board, so that insulation protection and vibration buffering are provided for the printed circuit board, and the influence of mechanical and thermal stress is reduced; and the epoxy resin glue is used for filling other parts in the inner shell and filling the gap between the shell and the inner shell, so that the relative positions of the printed circuit board, the inner shell and the outer shell are not displaced, and the insulation protection is provided for the printed circuit board.
(3) The acceleration sensor for the motor train unit has excellent temperature resistance and vibration resistance, can meet the vibration requirements of a long-life test of 3 types of vibration simulation in GB/T21563-2008 and GB/T2423.22-2012 high-low temperature alternating temperature test cycle of more than 1000 cycles, and greatly improves the application reliability of the acceleration sensor on the motor train unit train.
Drawings
Fig. 1 is a schematic structural diagram of an acceleration sensor provided in the present invention;
fig. 2 is a schematic diagram of an explosion structure of an acceleration sensor provided by the present invention;
FIG. 3 is a schematic view of the internal structure of a housing assembly according to the present invention;
fig. 4 is a schematic view of the internal structure of another housing assembly provided by the present invention.
In the figure, 100, a housing assembly; 200. a connector assembly; 101. an inner shell; 102. a printed circuit board; 103. a housing; 104. a shell cover; 105. sealing glue; 106. a silicone gel; 107. a sponge tape; 108. a welding point; 201. a cable; 202. a connector is provided.
Detailed Description
Hereinafter, the technical solution of the present invention will be further described and illustrated by specific embodiments and the accompanying drawings. However, these embodiments and drawings are illustrative, and the present disclosure is not limited thereto.
As shown in fig. 1 and 2, an acceleration sensor for a motor train unit includes a housing assembly 100 and a connector assembly 200;
the shell assembly 100 is sequentially provided with a printed circuit board 102, an inner shell 101 and a shell from inside to outside, the shell comprises a shell cover 104 and an outer shell 103, and the printed circuit board 102 is arranged in the inner shell 101;
the connector assembly 200 includes a cable 201 and a connector 202;
one end of the cable 201 is soldered to the printed circuit board 102 and to the rear end of the printed circuit board 102, a solder joint 108 is formed on the printed circuit board, and the other end of the cable 201 is connected to the connector 202.
The material of the inner case 101, the cover 104, and the outer case 103 is preferably stainless steel.
As shown in fig. 3, the internal structure of the housing assembly 100 according to an embodiment of the present invention includes a sealant 105 and a silicone gel 106 filled in the inner casing 101, the sealant 105 is filled in the bottom of the inner casing 101 and submerges the soldering points of the printed circuit board 102, and the silicone gel 106 is filled in the upper portion of the sealant 105 and submerges the printed circuit board 102. The gaps between the inner shell 101 and the shell cover 104 and between the inner shell 101 and the outer shell 103 are further filled with a sealant 105, so that the gaps between the shell cover 104 and the inner shell 101 and between the outer shell 103 and the inner shell 101 are filled with the sealant, and the shell components are protected from being immersed by moisture or other impurities.
The sealant 105 for the inner and outer shells is preferably a polyurethane potting adhesive and/or an epoxy adhesive. The polyurethane pouring sealant is prepared by stepwise polymerizing oligomer polyol such as polyester, polyether and the like, polyisocyanate and dihydric alcohol or diamine as a chain extender. The epoxy resin glue is an epoxy resin liquid packaging material prepared by taking epoxy resin as a main component and adding some functional materials. The polyurethane encapsulating glue and the epoxy resin glue have good viscosity, can well realize the bonding between elements, are encapsulated in element gaps, and have the functions of water resistance, moisture resistance, dust resistance, heat conduction and the like. Polyurethane potting adhesive and epoxy resin adhesive sold in the market can be used in the invention.
Preferably, the sealant 105 of the inner and outer shells is an epoxy resin adhesive.
The epoxy resin adhesive is further preferably higher than or equal to 85D in Shore hardness and 20-35 multiplied by 10 in coefficient of thermal expansion-6The tensile strength is more than or equal to 70MPa, the shear bonding strength is more than or equal to 20MPa, and the volume resistivity is more than or equal to 1 multiplied by 1015Omega, cm, and the temperature-resistant range is-40 to 180 ℃.
Epoxy glue in the inner shell 101 fills the bottom and submerges the solder joints of the printed circuit board 102 for securing the printed circuit board 102. The epoxy resin adhesive with high hardness, high strength and high volume resistivity is selected, so that the adhesive has a good adhesive effect on the printed circuit board 102 and the stainless steel inner shell 101, and the printed circuit board 102 is effectively fixed in the inner shell; in addition, the selected epoxy resin adhesive has a thermal expansion coefficient close to that of the printed circuit board 102 and the inner shell 101 made of stainless steel, so that the influence of thermal stress caused by mismatching of expansion rates during potting is reduced, the relative position between the printed circuit board 102 and the inner shell 101 is not changed, the sensitive direction of the acceleration sensor chip is always consistent with the detection direction of the acceleration sensor, and the signal output precision is ensured.
The silicone gel has a wide temperature resistance range and low mechanical strength, and is generally considered as a 'stress-free' potting material, so that the silicone gel is filled in the inner cavity of the inner shell 101 to wrap the printed circuit board 102, provides insulation protection and vibration buffering for the printed circuit board 102, and ensures that the printed circuit board 102 is not affected by thermal stress and mechanical stress in use.
In the embodiment of the invention, the epoxy resin adhesive is filled below the welding points of the printed circuit board 102 and in the gap between the inner shell and the shell, so that the relative positions of the printed circuit board 102, the inner shell 101 and the outer shell 103 are not displaced, and the insulation protection is provided for the printed circuit board 102; and the organic silicon gel is used for filling the inner cavity of the inner shell 101, coating the printed circuit board 102, protecting the printed circuit board 102 and reducing the influence of mechanical and thermal stress.
In another embodiment of the present invention, as shown in fig. 4, a gap of an inner casing 101 is filled with a sealant 105 and a sponge tape 107, the sponge tape 107 is coated on a portion of the printed circuit board, the portion of the printed circuit board is a portion of the printed circuit board 102 above the solder joint where no cable is soldered, and the remaining gap of the inner casing is filled with the sealant 105. The gaps between the inner shell 101 and the shell cover 104 and between the inner shell 101 and the outer shell 103 are further filled with a sealant 105, so that the gaps between the shell cover 104 and the inner shell 101 and between the outer shell 103 and the inner shell 101 are filled with the sealant, and the shell components are protected from being immersed by moisture or other impurities.
The sealant 105 for the inner and outer shells is preferably a polyurethane potting adhesive and/or an epoxy adhesive.
Preferably, the sealant 105 of the inner and outer shells is an epoxy resin adhesive.
The epoxy resin adhesive is further preferably higher than or equal to 85D in Shore hardness and 20-35 multiplied by 10 in coefficient of thermal expansion-6The tensile strength is more than or equal to 70MPa, the shear bonding strength is more than or equal to 20MPa, and the volume resistivity is more than or equal to 1 multiplied by 1015Omega, cm, and the temperature-resistant range is-40 to 180 ℃.
The sponge tape 107 comprises an adhesive layer and a substrate layer, wherein the adhesive layer is distributed on one side of the substrate layer, the adhesive layer is made of acrylate adhesive, and the substrate layer is made of one or more of silicone sponge, polyurethane sponge and polyvinyl alcohol sponge, preferably silicone sponge.
The sponge tape 107 is adhered to a portion of the printed circuit board by an adhesive layer, and a layer of the sponge tape 107 is adhered to a portion of the printed circuit board.
The thickness of the adhesive layer of the sponge tape 107 is preferably 0.5-2.0 mm, and the thickness of the substrate layer is preferably 1.5-3.0 mm.
The epoxy glue in the inner housing 101 immerses the solder joints of the printed circuit board 102 for fixing the printed circuit board 102. The epoxy resin adhesive with high hardness, high strength and high volume resistivity is selected, so that the adhesive has a good adhesive effect on the printed circuit board 102 and the stainless steel inner shell 101, and the printed circuit board 102 is effectively fixed in the inner shell 101; in addition, the selected epoxy resin adhesive has a thermal expansion coefficient close to that of the printed circuit board 102 and the inner shell 101 made of stainless steel, so that the influence of thermal stress caused by mismatching of expansion rates during potting is reduced, the relative position between the printed circuit board 102 and the inner shell 101 is not changed, the sensitive direction of the acceleration sensor chip is always consistent with the detection direction of the acceleration sensor, and the signal output precision is ensured.
The thermal expansion of the colloid is a main reason for generating stress, and the sponge adhesive tape 107 is covered on part of the printed circuit board, so that on one hand, the volume of the sponge adhesive tape 107 is increased to reduce the using amount of the epoxy resin adhesive, and further reduce the stress generated by deformation caused by the thermal expansion of the colloid; on the other hand, the soft sponge tape 107 also plays a role of elastic buffer, and reduces the impact force caused by vibration.
According to the embodiment of the invention, the sponge adhesive tape 107 covers part of the printed circuit board, so that the printed circuit board 102 is provided with insulation protection and vibration buffering, and the influence of mechanical and thermal stress is reduced; and the epoxy resin glue is used for filling other parts in the inner shell 101 and filling the gap between the shell and the inner shell 101, so that the relative positions of the printed circuit board 102, the inner shell 101 and the outer shell 103 are not displaced, and the insulation protection is provided for the printed circuit board 102 in the acceleration sensor.
In the following embodiment of the acceleration sensor, the epoxy adhesive B is shanghai zhuo ZR6102, the shore hardness is 90D, and the thermal expansion coefficient is 25 × 10-6/° C, tensile strength 85MPa, shear adhesion strength 23MPa, and volume resistivity 1X 1015Omega, cm, and the temperature resistant range is-40 to 180 ℃; the type A of the epoxy resin adhesive is American EFI 91-66R1/91-71H, the Shore hardness is 80D, and the thermal expansion coefficient is 38 multiplied by 10-6/° C, tensile strength 47MPa, shear adhesion strength 22MPa, and volume resistivity 1.6 × 1014Omega, cm, and the temperature-resistant range is-40 to 150 ℃. The type of the organic silicon gel is Shanghai Daorin ZR 351; the sponge adhesive tape is RS PRO single-sided foam adhesive tape.
Example 1
The method for manufacturing the acceleration sensor for the motor train unit comprises the following steps:
s1, welding one end of the cable at the tail end of the printed circuit board, and forming a welding point on the printed circuit board;
s2, assembling the printed circuit board at the bottom of the inner shell, sleeving the inner shell in the outer shell, and sequentially assembling the printed circuit board, the inner shell and the outer shell from inside to outside;
s3, the other end of the cable which is not welded on the printed circuit board faces downwards, the openings of the inner shell and the outer shell face upwards, and epoxy resin glue B is filled and sealed in the inner shell until the welding point of the printed circuit board is immersed;
s4, after the epoxy resin adhesive B is cured, continuously encapsulating organic silicon gel in the inner shell until the printed circuit board is immersed;
s5, after the organic silicon gel is solidified, encapsulating the epoxy resin adhesive B again to enable the epoxy resin adhesive B to be completely filled in the gap between the inner shell and the shell;
and S6, laser welding the shell cover to the shell, and connecting the other end of the cable with the connector to obtain the acceleration sensor for the motor train unit.
Example 2
In the method for manufacturing the acceleration sensor for the motor train unit according to example 2, the epoxy resin adhesive a is used instead of the epoxy resin adhesive B, and the rest is the same as that of example 1.
Example 3
The method for manufacturing the acceleration sensor for the motor train unit comprises the following steps:
s1, welding one end of the cable at the tail end of the printed circuit board, and forming a welding point on the printed circuit board;
s2, assembling the printed circuit board at the bottom of the inner shell, sleeving the inner shell in the outer shell, and sequentially assembling the printed circuit board, the inner shell and the outer shell from inside to outside;
s3, the other end of the cable which is not welded on the printed circuit board faces downwards, the openings of the inner shell and the outer shell face upwards, and epoxy resin glue B is filled and sealed in the inner shell until the welding point of the printed circuit board is immersed;
s4, after the epoxy resin adhesive B is cured, covering a layer of sponge adhesive tape on the part, above the welding point of the printed circuit board, of the cable which is not welded;
s5, encapsulating the epoxy resin adhesive B again to enable the epoxy resin adhesive B to be completely filled in the gap between the sponge adhesive tape and the inner shell and the gap between the inner shell and the shell;
and S6, laser welding the shell cover to the shell, and connecting the other end of the cable with the connector to obtain the acceleration sensor for the motor train unit.
Comparative example 1
The method for manufacturing the acceleration sensor for the motor train unit according to the comparative example 1 comprises the following steps:
s1, welding one end of the cable at the tail end of the printed circuit board, and forming a welding point on the printed circuit board;
s2, assembling the printed circuit board at the bottom of the inner shell, sleeving the inner shell in the outer shell, and sequentially assembling the printed circuit board, the inner shell and the outer shell from inside to outside;
s3, the other end of the cable which is not welded on the printed circuit board faces downwards, the openings of the inner shell and the outer shell face upwards, and epoxy resin glue B is filled and sealed in the inner shell until the welding point of the printed circuit board is immersed;
s4, after the epoxy resin glue B is cured, continuously encapsulating the epoxy resin glue B in the inner shell until the printed circuit board is immersed;
s5, after the epoxy resin glue B in the inner shell is cured, encapsulating the epoxy resin glue B again to enable the epoxy resin glue B to be completely filled in the gap between the inner shell and the shell;
and S6, laser welding the shell cover to the shell, and connecting the other end of the cable with the connector to obtain the acceleration sensor for the motor train unit.
Comparative example 2
In the method for manufacturing the acceleration sensor for the motor train unit of comparative example 2, the epoxy resin adhesive a is used instead of the epoxy resin adhesive B, and the rest is the same as that of comparative example 1.
Comparative example 3
The method for manufacturing the acceleration sensor for the motor train unit according to the comparative example 3 comprises the following steps:
s1, welding one end of the cable at the tail end of the printed circuit board, and forming a welding point on the printed circuit board;
s2, assembling the printed circuit board at the bottom of the inner shell, sleeving the inner shell in the outer shell, and sequentially assembling the printed circuit board, the inner shell and the outer shell from inside to outside;
s3, the other end of the cable which is not welded on the printed circuit board faces downwards, the inner shell and the outer shell are both open upwards, and organic silicon gel is filled and sealed in the inner shell until the welding point of the printed circuit board is immersed;
s4, after the organic silicon gel is solidified, continuously encapsulating the organic silicon gel in the inner shell until the printed circuit board is immersed;
s5, after the organic silicon gel in the inner shell is solidified, encapsulating the organic silicon gel again to enable the organic silicon gel to be completely filled in the gap between the inner shell and the shell;
and S6, laser welding the shell cover to the shell, and connecting the other end of the cable with the connector to obtain the acceleration sensor for the motor train unit.
Comparative example 4
The method for preparing the acceleration sensor for the motor train unit according to the comparative example 4 comprises the following steps:
s1, welding one end of the cable at the tail end of the printed circuit board, and forming a welding point on the printed circuit board;
s2, assembling the printed circuit board at the bottom of the inner shell, sleeving the inner shell in the outer shell, and sequentially assembling the printed circuit board, the inner shell and the outer shell from inside to outside;
s3, the other end of the cable which is not welded on the printed circuit board faces downwards, the inner shell and the outer shell are both open upwards, and organic silicon gel is filled and sealed in the inner shell until the welding point of the printed circuit board is immersed;
s4, after the organic silicon gel is solidified, continuously encapsulating the organic silicon gel in the inner shell until the printed circuit board is immersed;
s5, encapsulating an epoxy resin adhesive B after the organic silicon gel in the inner shell is cured, so that the epoxy resin adhesive B is completely filled in the gap between the inner shell and the shell;
and S6, laser welding the shell cover to the shell, and connecting the other end of the cable with the connector to obtain the acceleration sensor for the motor train unit.
The acceleration sensors obtained in examples 1 to 3 and comparative examples 1 to 4 were subjected to the alternating temperature test and the vibration limit test in the following procedures, and the test results are shown in table 1.
a. Alternating temperature test:
the test method comprises the following steps: according to test Nb of GB/T2423.22-2012.
The test chamber temperature ranges were set as: the low temperature limit is-50 ℃, the high temperature limit is 85 ℃, the temperature change rate is 10 ℃/min, the heat preservation time of each limit temperature is 30min, and the test cycle number is 200, 400, 600, 800, 1000 and 1200. And detecting whether the performance of the acceleration sensor is normal after the test cycle, and detecting whether an internal welding spot device is abnormal by the X-Ray.
b. Vibration limit test
The ambient temperature is 25 +/-10 ℃, and the relative humidity is not more than 90%.
Installing a sensor on the table top of the vibration test table, wherein the sensitive direction of the sensor is consistent with the vibration direction of the vibration table; and the vibration acceleration value of the vibration table is set to be two times of the range of the sensor, and the output of the sensor is tested and recorded for 1h under the condition that the vibration frequency is consistent with the vibration frequency of the vibration simulation long-life test in GB/T21563-2008. In the test process, the acceleration sensor has normal performance, and the X-Ray detects that no abnormality exists in an internal welding spot device.
Table 1 results of performance test of acceleration sensors of examples 1 to 3 and comparative examples 1 to 4
Alternating temperature test Vibration limit test
Example 1 Cycle 1200 times Meets the national standard of 3 types△
Example 2 Circulating 1000 times Meets the national standard of 3 types
Example 3 Circulating 1200 times Meets the national standard of 3 types
Comparative example 1 Circulating 1000 times Meets the national standard of 3 types
Comparative example 2 Circulating for 200 times Meets the national standard class 2△Unsatisfied national standard class 3
Comparative example 3 Circulating for 400 times The output signal of the acceleration sensor is abnormal, and the performance is abnormal.
Comparative example 4 Circulating for 600 times Acceleration sensorThe output signal is abnormal and the performance is abnormal.
*: the cycle of 1200 times means that after the cycle of 1200 times of the alternating temperature test, the performances of the acceleration sensor are normal, and the xray detects that no abnormality exists in the internal welding spot device. The cycle is 1000 times, 800 times, 600 times, 400 times and 200 times as same as the above.△: the national standard 3 type and the national standard 2 type respectively mean that the vibration frequency adopted by the vibration limit test is consistent with the vibration frequency of the 3 type and 2 type vibration simulation long-life test in GB/T21563-2008.
As shown in table 1, the acceleration sensor for the motor train unit prepared in examples 1 to 3 has excellent temperature resistance and vibration resistance, and can meet the vibration requirements of the high and low temperature alternating temperature test cycle of GB/T2423.22-2012 for more than 1000 cycles and the 3-class vibration simulation long life test in GB/T21563-2008. Epoxy resin B is filled in the inner shell and the outer shell of the acceleration sensor in the comparative example 1, and compared with the acceleration sensor in the example 1, the cycle period of the high-low temperature alternating temperature test is shortened, and the density is increased; and when the acceleration sensor breaks down, the comparative example 1 is more difficult to repair compared with the example 1 because the inner and outer shells are filled with the epoxy resin B. The inner shells of the comparative examples 3 and 4 are filled with the organic silicon gel, so that the position fixing effect on the printed circuit board is poor, and the acceleration sensor output signal is abnormal and the performance is abnormal during the vibration test.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.

Claims (8)

1. A high-reliability acceleration sensor for a motor train unit comprises a shell assembly and a connector assembly, and is characterized in that the shell assembly is sequentially provided with a printed circuit board, an inner shell and a shell from inside to outside, and the shell comprises a shell cover and an outer shell;
the connector assembly includes a cable and a connector;
one end of the cable is welded with the printed circuit board, a welding point is formed on the printed circuit board, and the other end of the cable is connected with the connector;
the inner shell is filled with sealant and organic silica gel, the sealant is filled at the bottom of the inner shell, welding points of the printed circuit board are immersed, and the organic silica gel is filled at the upper part of the sealant and is immersed in the printed circuit board; or the inner shell is filled with sealant and a sponge adhesive tape, the sponge adhesive tape is coated on part of the printed circuit board, the part of the printed circuit board is a part of the printed circuit board, which is not welded with cables above welding points of the printed circuit board, and the sealant is filled in other parts in the inner shell;
and sealant is filled in a gap between the shell and the inner shell.
2. The acceleration sensor for the motor train unit with high reliability as claimed in claim 1, wherein the sealant is polyurethane potting adhesive and/or epoxy resin adhesive.
3. The acceleration sensor for the motor train unit with high reliability as set forth in claim 2, wherein the sealant is epoxy resin glue.
4. The acceleration sensor for the EMUs of claim 3, characterized in that, the Shore hardness of the epoxy resin glue is greater than or equal to 85D, and the coefficient of thermal expansion is 20~35 x 10-6The tensile strength is more than or equal to 70MPa, the shear bonding strength is more than or equal to 20MPa, and the volume resistivity is more than or equal to 1 multiplied by 1015Omega, cm, and the temperature-resistant range is-40 to 180 ℃.
5. The acceleration sensor for the EMUs of high reliability of claim 1, characterized in that, the sponge sticky tape includes viscose layer and substrate layer, and the viscose layer distributes in substrate layer one side, and the viscose layer material is acrylate glue, and the substrate layer material is one or more of silicone sponge, polyurethane sponge, polyvinyl alcohol sponge.
6. The acceleration sensor for the EMUs of high reliability of claim 5, characterized in that, the viscose layer thickness of sponge sticky tape is 0.5~2.0mm, substrate layer thickness is 1.5~3.0 mm.
7. The method for manufacturing the acceleration sensor for the motor train unit with high reliability as claimed in claim 1, characterized by comprising the following steps:
s1, welding one end of the cable on the printed circuit board;
s2, assembling the printed circuit board at the bottom of the inner shell, sleeving the inner shell in the outer shell, and sequentially assembling the printed circuit board, the inner shell and the outer shell from inside to outside;
s3, the other end of the cable which is not welded on the printed circuit board faces downwards, the openings of the inner shell and the outer shell face upwards, and sealant is filled in the inner shell until the welding point of the printed circuit board is immersed;
s4, after the sealant is cured, continuously encapsulating organic silicon gel in the inner shell until the printed circuit board is immersed;
s5, after the organic silicon gel is solidified, encapsulating the sealant again to enable the sealant to be completely filled in the gap between the inner shell and the shell;
and S6, laser welding the shell cover to the shell, and connecting the other end of the cable with the connector.
8. The method for manufacturing the acceleration sensor for the motor train unit with high reliability as claimed in claim 1, characterized by comprising the following steps:
s1, welding one end of the cable on the printed circuit board;
s2, assembling the printed circuit board at the bottom of the inner shell, sleeving the inner shell in the outer shell, and sequentially assembling the printed circuit board, the inner shell and the outer shell from inside to outside;
s3, the other end of the cable which is not welded on the printed circuit board faces downwards, the openings of the inner shell and the outer shell face upwards, and sealant is filled in the inner shell until the welding point of the printed circuit board is immersed;
s4, after the sealant is solidified, covering a sponge adhesive tape on the part of the cable which is not welded above the welding point of the printed circuit board;
s5, encapsulating the sealant again to enable the sealant to be completely filled in gaps between the sponge adhesive tape and the inner shell and gaps between the inner shell and the shell;
and S6, laser welding the shell cover to the shell, and connecting the other end of the cable with the connector.
CN202011138746.0A 2020-10-22 2020-10-22 High-reliability acceleration sensor for motor train unit and preparation method thereof Active CN111965387B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011138746.0A CN111965387B (en) 2020-10-22 2020-10-22 High-reliability acceleration sensor for motor train unit and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011138746.0A CN111965387B (en) 2020-10-22 2020-10-22 High-reliability acceleration sensor for motor train unit and preparation method thereof

Publications (2)

Publication Number Publication Date
CN111965387A CN111965387A (en) 2020-11-20
CN111965387B true CN111965387B (en) 2020-12-22

Family

ID=73387647

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011138746.0A Active CN111965387B (en) 2020-10-22 2020-10-22 High-reliability acceleration sensor for motor train unit and preparation method thereof

Country Status (1)

Country Link
CN (1) CN111965387B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI747629B (en) * 2020-11-23 2021-11-21 英業達股份有限公司 Sealing method for server
JP7159379B2 (en) * 2021-03-19 2022-10-24 Ｊｆｅアドバンテック株式会社 DETECTION DEVICE AND INSULATION RESISTANCE TEST METHOD AND SYSTEM
CN114034402A (en) * 2021-10-25 2022-02-11 深圳市深思泰电子科技有限公司 Water inlet warning sensor and processing technology thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102141150A (en) * 2011-04-08 2011-08-03 湖南威铭能源科技有限公司 Method for sealing intellectualized water meter
CN202008377U (en) * 2011-04-08 2011-10-12 湖南威铭能源科技有限公司 Sealing structure of intelligent water meter
CN203824603U (en) * 2014-05-13 2014-09-10 湖南威铭能源科技有限公司 Teletransmission intelligent valve-control water meter
CN104696606B (en) * 2015-03-17 2016-12-07 常州依科迪环境科技有限公司 A kind of seal sensor
CN105807079B (en) * 2016-04-20 2019-02-26 宁波中车时代传感技术有限公司 The speed sensor assembly and its manufacturing method of high speed automobile motor
CN207466265U (en) * 2017-10-19 2018-06-08 襄阳群龙汽车部件股份有限公司 A kind of automotive tyre pressure monitoring sensor
CN207703496U (en) * 2017-11-07 2018-08-07 南京高华科技股份有限公司 One kind being used for standard EMU Cross deformation detection device
CN107991346A (en) * 2017-11-27 2018-05-04 南京越博动力系统股份有限公司 A kind of silicon gel embedding and the method for detection circuit plate
CN109580987A (en) * 2018-10-30 2019-04-05 宁波中车时代传感技术有限公司 A kind of single-axis acceleration sensors device and preparation method

Also Published As

Publication number Publication date
CN111965387A (en) 2020-11-20

Similar Documents

Publication Publication Date Title
CN111965387B (en) High-reliability acceleration sensor for motor train unit and preparation method thereof
US6455354B1 (en) Method of fabricating tape attachment chip-on-board assemblies
JP4281630B2 (en) Manufacturing method of sensor device
JP4379360B2 (en) Mechanical quantity measuring device
JP5188327B2 (en) Transfer mold type electronic control device, method for manufacturing the same, and transmission
KR20140098069A (en) Electronic module for a control unit
CN101088000A (en) Exhaust gas recirculation system using absolute micromachined pressure sense die
JP2006220456A (en) Pressure sensor and its manufacturing method
US20080296750A1 (en) Semiconductor device
CN107182171B (en) A kind of seal protection structure and its encapsulating method of BGA device
JP6184495B2 (en) Mounting board manufacturing method and mounting board
JP2007248187A (en) Angular velocity sensor
WO2006065547A1 (en) Use of visco-elastic polymer to reduce acoustic and/or vibration induced error in microelectromechanical devices and systems
CN109580987A (en) A kind of single-axis acceleration sensors device and preparation method
JPS6148945A (en) Hibrid ic module
CN115285934A (en) Assembly method for solving welding stress of MEMS inertial chip and assembly shell
KR100709175B1 (en) Semiconductor module
CN101915594B (en) Glue-free connection method for optical fiber stress/strain sensing devices
JPH0258357A (en) Pin grid array type semiconductor device
CN114340281A (en) Method for sealing internal space of contact net monitoring device
CN110849400B (en) Instability detection sensor and packaging method
CN217786378U (en) Combined central axle temp. sensor for railway passenger train
JPH08316373A (en) Resin sealed power module and production thereof
JP3627036B2 (en) Semiconductor pressure sensor
JPH01225142A (en) Hybrid integrated circuit device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant