TWI747629B - Sealing method for server - Google Patents
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- TWI747629B TWI747629B TW109140988A TW109140988A TWI747629B TW I747629 B TWI747629 B TW I747629B TW 109140988 A TW109140988 A TW 109140988A TW 109140988 A TW109140988 A TW 109140988A TW I747629 B TWI747629 B TW I747629B
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Description
本揭露是有關於一種伺服器的密封方法。This disclosure is about a server sealing method.
兩相浸沒式冷卻系統用於冷卻以及保存電子系統(例如,伺服器)。透過冷卻系統內的介電液在氣態與液態之間的相變轉換,提升容置在其中的電子系統的散熱效率。並且此種冷卻系統還可以避免電子系統受到空氣、灰塵等接觸而造成的故障。Two-phase immersion cooling systems are used to cool and preserve electronic systems (for example, servers). Through the phase change conversion of the dielectric liquid in the cooling system between the gaseous state and the liquid state, the heat dissipation efficiency of the electronic system contained therein is improved. And this kind of cooling system can also prevent the electronic system from being contacted by air, dust, etc. to cause malfunctions.
為了減少冷卻系統內介電液蒸氣的外洩,冷卻系統的外殼需要具有氣密性。然而,電子系統又需要能夠穿過冷卻系統的外殼,以和外界進行電連接以及資料傳輸。一般的密封方法無法在進行電連接的狀態下同時保有冷卻系統外殼的氣密性。In order to reduce the leakage of dielectric liquid vapor in the cooling system, the housing of the cooling system needs to be airtight. However, the electronic system needs to be able to pass through the casing of the cooling system in order to be electrically connected to the outside world and transmit data. The general sealing method cannot maintain the airtightness of the cooling system shell at the same time when the electrical connection is made.
因此,如何提出一種可解決上述問題的伺服器的密封方法,是目前業界亟欲投入研發資源解決的問題之一。Therefore, how to propose a server sealing method that can solve the above-mentioned problems is one of the problems that the industry urgently wants to invest in research and development resources to solve.
本揭露是有關於一種伺服器的密封方法,其包含:以框體圍繞元件的部分;塗佈第一膠體於元件的部分以及框體的內表面上;填充第二膠體於元件的部分與框體之內表面之間且覆蓋第一膠體,其中第一膠體與第二膠體之黏滯係數不相同;將框體固定在殼體上;以及密封框體與殼體間之接縫。The present disclosure relates to a sealing method for a server, which includes: surrounding a part of a component with a frame; coating a first glue on the part of the component and the inner surface of the frame; filling a second glue on the part of the component and the frame Between the inner surfaces of the body and covering the first gel, the viscosity coefficients of the first gel and the second gel are different; the frame is fixed on the shell; and the seam between the frame and the shell is sealed.
在一些實施方式中,上述伺服器的密封方法包含在塗佈第一膠體之後以及在填充第二膠體之前固化第一膠體。In some embodiments, the server sealing method described above includes curing the first colloid after coating the first colloid and before filling the second colloid.
在一些實施方式中,框體具有本體。本體具有內表面以及位於內表面兩端的第一開口以及第二開口。填充第二膠體的步驟係使得第一開口與第二開口不連通。In some embodiments, the frame has a body. The body has an inner surface, and a first opening and a second opening located at two ends of the inner surface. The step of filling the second gel is such that the first opening and the second opening are not connected.
在一些實施方式中,元件的部分與框體之內表面共同形成空隙。填充第二膠體的步驟係使第二膠體填滿空隙。In some embodiments, the part of the element and the inner surface of the frame together form a void. The step of filling the second colloid is to fill the voids with the second colloid.
在一些實施方式中,框體具有凸緣。凸緣連接本體,且由第一開口向外延伸。接縫形成於凸緣與殼體之間。殼體具有第三開口。將元件以及框體固定在殼體的步驟進一步包含:將元件以及框體穿過第三開口,使得凸緣覆蓋第三開口;以及將殼體與凸緣以複數個螺絲鎖附固定。In some embodiments, the frame has a flange. The flange is connected to the body and extends outward from the first opening. A seam is formed between the flange and the shell. The housing has a third opening. The step of fixing the element and the frame to the housing further includes: passing the element and the frame through the third opening so that the flange covers the third opening; and fixing the housing and the flange with a plurality of screws.
在一些實施方式中,密封凸緣與殼體之接縫的步驟進一步包含使用填縫材料填補形成於凸緣與殼體之間的接縫。In some embodiments, the step of sealing the joint between the flange and the housing further includes filling the joint formed between the flange and the housing with a caulking material.
在一些實施方式中,上述伺服器的密封方法進一步包含將固定件固定至凸緣遠離殼體之側面並覆蓋凸緣。接縫形成於凸緣與固定件之間。In some embodiments, the above-mentioned sealing method of the server further includes fixing the fixing member to the side of the flange away from the housing and covering the flange. A seam is formed between the flange and the fixing member.
在一些實施方式中,上述伺服器的密封方法進一步包含使用填縫材料填補形成於凸緣與固定件之間的接縫。In some embodiments, the above-mentioned sealing method of the server further includes filling the seam formed between the flange and the fixing member with a caulking material.
在一些實施方式中,第一膠體的黏滯係數大於第二膠體。In some embodiments, the viscosity coefficient of the first colloid is greater than that of the second colloid.
在一些實施方式中,元件包含電路板以及輸入輸出端口。輸入輸出端口與電路板連接。以框體圍繞元件的部分的步驟包含:使框體環繞電路板的部分與輸入輸出端口的部分。In some embodiments, the components include circuit boards and input and output ports. The input and output ports are connected to the circuit board. The step of enclosing the part of the component with the frame includes: making the frame surround the part of the circuit board and the part of the input and output ports.
綜上所述,於本發明的伺服器的密封方法中,藉由塗佈第一膠體與第二膠體而填補框體以及元件之間的空隙,即可在框體的兩開口之間形成一個氣密牆結構。此結構能在維持元件連通的狀態下同時保有氣密性。將此結構的框體與殼體固定,並且在接縫處填充填縫材料,得以在保持殼體的氣密效果之下又能使元件連通殼體內、外兩側。In summary, in the sealing method of the server of the present invention, by coating the first gel and the second gel to fill the gap between the frame and the components, a gap between the two openings of the frame can be formed. Airtight wall structure. This structure can maintain the airtightness while maintaining the communication of the components. The frame body of this structure is fixed to the shell, and the joint is filled with caulking material, so that the components can be connected to the inner and outer sides of the shell while maintaining the airtight effect of the shell.
在本揭露的一實施方式中,本發明之伺服器係可用於人工智慧(英語:Artificial Intelligence,簡稱AI)運算、邊緣運算(edge computing),亦可當作5G伺服器、雲端伺服器或車聯網伺服器使用。In one embodiment of this disclosure, the server of the present invention can be used for artificial intelligence (English: Artificial Intelligence, AI) computing, edge computing, and can also be used as a 5G server, cloud server or car Used by networked servers.
以上所述僅係用以闡述本發明所欲解決的問題、解決問題的技術手段、及其產生的功效等等,本發明之具體細節將在下文的實施方式及相關圖式中詳細介紹。The above description is only used to illustrate the problem to be solved by the present invention, the technical means to solve the problem, and the effects produced by it, etc. The specific details of the present invention will be described in detail in the following embodiments and related drawings.
以下將以圖式揭露本發明之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。在所有圖式中相同的標號將用於表示相同或相似的元件。Hereinafter, a plurality of embodiments of the present invention will be disclosed in drawings. For clear description, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit the present invention. That is to say, in some embodiments of the present invention, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventionally used structures and elements are shown in the drawings in a simple and schematic manner. The same reference numerals will be used to indicate the same or similar elements in all the drawings.
請參照第1圖,其為繪示根據本發明一實施方式之伺服器的密封方法M1的流程圖。伺服器的密封方法M1主要包含步驟S101至步驟S105。Please refer to FIG. 1, which is a flowchart illustrating a server sealing method M1 according to an embodiment of the present invention. The server sealing method M1 mainly includes steps S101 to S105.
於步驟S101中,框體110圍繞元件120一部分122。請配合參照第2A圖,其為繪示根據本發明一實施方式之伺服器的密封方法M1的其中一個階段之剖面示意圖。如第2A圖所示,框體110之本體112具有內表面112a、第一開口112b與第二開口112c。第一開口112b與第二開口112c貫通。在一些實施方式中,第一開口112b與第二開口112c的形狀為方型,但本揭露不以此為限。在一些實施方式中,框體110之材料為壓克力,但本揭露並不以此為限。元件120同時穿過第一開口112b以及第二開口112c,並且元件120一部分122位於第一開口112b以及第二開口112c之間。在一些實施方式中,元件120具有電路板124以及輸入輸出端口126,且電路板124與輸入輸出端口126連接。元件120的一部分122包含電路板124的一部分與輸入輸出端口126的一部分。在前述實施方式中,電路板124穿過第二開口112c,輸入輸出端口126穿過第一開口112b,且兩者連接處位於第一開口112b與第二開口112c之間。In step S101, the
於步驟S102中,第一膠體130塗佈於元件120的部分122以及框體110的內表面112a上。請配合參照第2B圖,其為繪示根據本發明一實施方式之伺服器的密封方法M1的其中一個階段之剖面示意圖。如第2B圖所示,元件120的部分122表面不一定為氣密表面。框體110之製作材質也不一定具有氣密功能。此步驟S102將第一膠體130均勻塗佈在元件120的部分122以及本體112的內表面112a,以在這些部位上形成一層具有氣密功能的薄膜,以在元件120的部分122以及本體112的內表面112a達到初步氣體密封的效果。In step S102, the
於步驟S103中,第二膠體140填充於元件120的部分122與框體110的內表面112a之間且覆蓋第一膠體130。請配合參照第2C圖,其為繪示根據本發明一實施方式之伺服器的密封方法M1的其中一個階段之剖面示意圖。如第2C圖所示,第二膠體140塗佈在第一膠體130之上。第二膠體140填充在介於元件120的部分122與本體112的內表面112a之間的空隙112d(如第2B圖所示)中。第二膠體140的填充使得第一開口112b與第二開口112c不相互連通,以此達到氣密的功效。第一膠體130與第二膠體140具有不同的黏滯係數。在一些實施方式中,第一膠體130的黏滯係數大於第二膠體140的黏滯係數,但本揭露並不以此為限。In step S103, the
在一些實施方式中,步驟S103包含步驟S103a:第二膠體140的填充在第一膠體130完全固化後實施。在第一膠體130固化之後,第二膠體140除了用以填補第一開口112b、第二開口112c以及元件120的一部分122之間的間隙122d之外,也用於填補第一膠體130固化後存在於其上的縫隙。In some embodiments, step S103 includes step S103a: the filling of the
在一些實施方式中,步驟S103包含步驟S103b:第二膠體140完全填滿空隙112d。請配合參照第2C圖,在填充第二膠體140時,將第一開口112b、第二開口112c以及元件120的部分122之間的空隙112d填充並且填滿。框體110與元件120便形成一個實心的氣密牆結構100。此氣密牆結構100具有隔絕其兩側進行氣體交換之效果。In some embodiments, step S103 includes step S103b: the
於步驟S104中,框體110固定在殼體200上。請配合參照第2D圖,其為繪示根據本發明一實施方式之伺服器的密封方法M1的其中一個階段之剖面示意圖。殼體200具有第三開口202。框體110與元件120可穿過第三開口202並且固定在殼體200上。In step S104, the
於一些實施方式中,步驟S104包含步驟S104a:框體110與元件120穿過第三開口202而覆蓋在第三開口202上,並使框體110的凸緣114固定在殼體200上。請配合參照第2C圖以及第2D圖,在一些實施方式中,框體110具有凸緣114。凸緣114連接本體112,並由第一開口112b的邊緣向外延伸。凸緣114覆蓋第三開口202。在一些實施方式中,凸緣114完全覆蓋第三開口202,但本揭露並不以此為限。在一些實施方式中,凸緣114與殼體200可以透過多個螺絲220鎖附固定。In some embodiments, step S104 includes step S104a: the
於一些實施方式中,步驟S104包含步驟S104b:框體110透過固定件210固定在殼體200上。請配合參照第2D圖,在一些實施方式中,固定件210配置在凸緣114遠離殼體200的側面上。透過螺絲220鎖附固定件210、凸緣114以及殼體200以達到將框體110固定在殼體200上之目的。In some embodiments, step S104 includes step S104b: the
於步驟S105中,密封框體110與殼體200間之接縫240。請配合參照第3圖,其為繪示根據本發明一實施方式之伺服器的密封方法M1之剖面放大圖。如第3圖所示,接縫240位於殼體200與凸緣114之間。使用填縫材料230去填補並且密封接縫240。具體來說,在一些實施方式中,使用螺絲220固定殼體200與框體110,其填縫材料230為具彈性之O型環(O-ring)或墊片,但本揭露並不以此為限。In step S105, the joint 240 between the
於一些實施方式中,步驟S105包含步驟S105a:使用填縫材料230去填補並且密封接縫240、242。請配合參照第3圖,兩接縫240、242分別位於殼體200與凸緣114以及固定件210與凸緣114之間。使用填縫材料230分別密封接縫240、242,以達到在殼體200內外具有氣密效果的功效。In some embodiments, step S105 includes step S105a: using a
需要留意的是,在一些實施方式中,步驟S104與步驟S105是被同時完成的,但本揭露並不以此為限。舉例來說,殼體200以及框體110之凸緣114在用螺絲220鎖附之前,先在接縫240處填上填縫材料230,再以螺絲220鎖附殼體200以及凸緣114。螺絲220鎖附完成後,得以同時完成步驟S104的框體110固定在殼體200上以及步驟S105密封框體110與殼體200間之接縫240。It should be noted that in some embodiments, step S104 and step S105 are completed at the same time, but the disclosure is not limited to this. For example, before the
由以上對於本發明之具體實施方式之詳述,可以明顯地看出,於本發明的伺服器的密封方法中,藉由塗佈第一膠體與第二膠體,以填補框體以及元件之間的空隙,並且形成一個氣密牆結構。此結構能在維持元件連通的狀態下同時保有氣密性。將此結構的框體與殼體固定,並且在接縫處填充填縫材料,得以在保持殼體的氣密效果之下又能使殼體內、外兩側透過元件連通。From the above detailed description of the specific embodiments of the present invention, it can be clearly seen that in the sealing method of the server of the present invention, the first gel and the second gel are applied to fill the gap between the frame and the components. And form an airtight wall structure. This structure can maintain the airtightness while maintaining the communication of the components. The frame body of this structure is fixed to the shell, and the joint is filled with caulking material, so that the inner and outer sides of the shell can communicate through the elements while maintaining the airtight effect of the shell.
雖然本發明已以實施方式揭露如上,然其並不用以限定本發明,任何熟習此技藝者,在不脫離本發明的精神和範圍內,當可作各種的更動與潤飾,因此本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone who is familiar with the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be subject to the scope of the attached patent application.
100:氣密牆結構
110:框體
112:本體
112a:內表面
112b:第一開口
112c:第二開口
112d:空隙
114:凸緣
120:元件
122:部分
124:電路板
126:輸入輸出端口
130:第一膠體
140:第二膠體
200:殼體
202:第三開口
210:固定件
220:螺絲
230:填縫材料
240,242:接縫
M1:方法
S101,S102,S103,S104,S105:步驟
100: Airtight wall structure
110: Frame
112:
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1圖為繪示根據本發明一實施方式之伺服器的密封方法的流程圖。 第2A圖為繪示根據本發明一實施方式之伺服器的密封方法的其中一階段之剖面示意圖。 第2B圖為繪示根據本發明一實施方式之伺服器的密封方法的其中一階段之剖面示意圖。 第2C圖為繪示根據本發明一實施方式之伺服器的密封方法的其中一階段之剖面示意圖。 第2D圖為繪示根據本發明一實施方式之伺服器的密封方法的其中一階段之剖面示意圖。 第3圖為繪示根據本發明一實施方式之伺服器的密封方法之剖面放大圖。 In order to make the above and other objectives, features, advantages and embodiments of the present invention more comprehensible, the description of the accompanying drawings is as follows: FIG. 1 is a flowchart showing a sealing method of a server according to an embodiment of the present invention. FIG. 2A is a schematic cross-sectional view illustrating one stage of the sealing method of the server according to an embodiment of the present invention. FIG. 2B is a schematic cross-sectional view illustrating one stage of the sealing method of the server according to an embodiment of the present invention. FIG. 2C is a schematic cross-sectional view illustrating one stage of the sealing method of the server according to an embodiment of the present invention. FIG. 2D is a schematic cross-sectional view showing one stage of the sealing method of the server according to an embodiment of the present invention. FIG. 3 is an enlarged cross-sectional view showing a sealing method of a server according to an embodiment of the present invention.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic deposit information (please note in the order of deposit institution, date and number) none Foreign hosting information (please note in the order of hosting country, institution, date, and number) none
M1:方法 M1: Method
S101,S102,S103,S104,S105:步驟 S101, S102, S103, S104, S105: steps
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TWI747629B true TWI747629B (en) | 2021-11-21 |
TW202222125A TW202222125A (en) | 2022-06-01 |
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TW109140988A TWI747629B (en) | 2020-11-23 | 2020-11-23 | Sealing method for server |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114554769A (en) * | 2020-11-18 | 2022-05-27 | 英业达科技有限公司 | Sealing method of server |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7012191B1 (en) * | 2004-12-28 | 2006-03-14 | Nidec Corporation | Lead wire sealing device, recording disk drive, and method for sealing housing member |
CN203105006U (en) * | 2013-01-30 | 2013-07-31 | 同致电子科技(昆山)有限公司 | Multifunctional current limiter wire harness connecting seat |
CN111965387A (en) * | 2020-10-22 | 2020-11-20 | 宁波中车时代传感技术有限公司 | High-reliability acceleration sensor for motor train unit and preparation method thereof |
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2020
- 2020-11-23 TW TW109140988A patent/TWI747629B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7012191B1 (en) * | 2004-12-28 | 2006-03-14 | Nidec Corporation | Lead wire sealing device, recording disk drive, and method for sealing housing member |
CN203105006U (en) * | 2013-01-30 | 2013-07-31 | 同致电子科技(昆山)有限公司 | Multifunctional current limiter wire harness connecting seat |
CN111965387A (en) * | 2020-10-22 | 2020-11-20 | 宁波中车时代传感技术有限公司 | High-reliability acceleration sensor for motor train unit and preparation method thereof |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114554769A (en) * | 2020-11-18 | 2022-05-27 | 英业达科技有限公司 | Sealing method of server |
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