JP6184495B2 - Mounting board manufacturing method and mounting board - Google Patents

Description

  The present invention relates to a mounting substrate manufacturing method and a mounting substrate.

  As a method of covering the connection terminal with an insulating material on the mounting board, a weir member is provided so as to surround the component soldered to the control circuit board, and the molten insulating resin material is potted inside the weir member, A method of curing is known (see Patent Document 1). The dam member functions to stop the flow of the molten insulating resin material.

  In the mounting substrate described in Patent Document 1, a dam member is disposed around a connector attached to the circuit board. The weir member has an opening portion that is substantially perpendicular to the arrangement direction of the connection terminals and an opening / closing portion that opens and shields the opening portion. When covering the connection terminal with the insulating resin material, after potting from the opening, the opening / closing part is closed, and potting is performed from the direction perpendicular to the connector mounting surface of the circuit board.

Japanese Unexamined Patent Publication No. 2012-54025

  In the coating method described in Patent Document 1, since potting is performed from two directions using a weir member for stopping the flow of the molten insulating resin material, it takes time to perform the coating operation.

According to one aspect of the present invention, a mounting board in which a connector provided with a plurality of connection terminals is mounted on a circuit board includes: an opening surface through which a connection line connected to the outside is inserted; and the opening. A connector main body having a bottom plate facing the surface, wherein the connection terminal is drawn out of the connector main body from the through portion penetrating the bottom plate into the connector main body, and from the through portion to the outside of the connector main body. An externally exposed portion attached to the circuit board, and the space between the externally exposed portion and the externally exposed portion of each of the plurality of connection terminals is covered with a semi-cured insulating material .
According to one aspect of the present invention, there is provided a method for manufacturing a mounting board in which a connector provided with a plurality of connection terminals is mounted on a circuit board, wherein an externally exposed portion of each of the connection terminals of the connector is the circuit board. Soldered to the paste, and applied between the externally exposed portion and the externally exposed portion of each connection terminal by an insulating material in a paste state, and then heat-treating the insulating material to a semi-cured state by heating, The semi-cured state is maintained and the heat treatment is finished.

  ADVANTAGE OF THE INVENTION According to this invention, the efficiency of the operation | work which coat | covers the terminal for a connection with an insulating material can be improved.

The block diagram which shows the drive system of the rotary electric machine for vehicles. The perspective view which shows the external appearance of a battery unit. The exploded perspective view of a battery unit. The perspective view of the mounting substrate (state before application | coating of an insulating material) which comprises a battery monitoring apparatus. FIG. 5 is an enlarged perspective view of the first connector illustrated in FIG. 4. FIG. 5 is an enlarged perspective view of a second connector illustrated in FIG. 4. The perspective view of the mounting substrate (state after application | coating of an insulating material) which comprises a battery monitoring apparatus. The figure for demonstrating the process of manufacturing a mounting board | substrate. The graph which shows the sclerosis | hardenability at the time of heat-processing with respect to an insulating material in predetermined temperature atmosphere. The graph which shows the characteristic of the Young's modulus of the insulating material in a semi-hardened state.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing a drive system for a vehicular rotating electrical machine. A drive system shown in FIG. 1 includes a battery unit 900 having a battery module 9 and a battery monitoring device 100 that monitors the battery module 9, an inverter device 220 that converts DC power from the battery module 9 into three-phase AC power, and A motor 230 for driving the vehicle is provided. Motor 230 is driven by the three-phase AC power from inverter device 220. Inverter device 220 and battery monitoring device 100 are each connected to host controller 110 by CAN communication, and operate based on command information from host controller 110. The battery monitoring device 100 is connected to the host controller 110 via the second connector 3 described later.

  The inverter device 220 includes a power module 226, an MCU 222, and a driver circuit 224 for driving the power module 226. The power module 226 converts the DC power supplied from the battery module 9 into three-phase AC power for driving the motor 230. Although not shown, a large-capacity smoothing capacitor of about 700 μF to about 2000 μF is provided between the high voltage lines HV + and HV− connected to the power module 226. The smoothing capacitor serves to reduce voltage noise applied to the integrated circuit provided in the battery monitoring device 100.

  When the inverter device 220 starts operating, the charge of the smoothing capacitor is substantially zero, and when the relay RL is closed, a large initial current flows into the smoothing capacitor. At this time, a large current flows through the relay RL, and the relay RL may be fused and damaged. For this reason, the MCU 222 sets the precharge relay RLp from the open state to the closed state and charges the smoothing capacitor in accordance with a command from the host controller 110, and then changes the relay RL from the open state to the closed state. Then, power supply from the battery module 9 to the inverter device 220 is started. When charging the smoothing capacitor, charging is performed while limiting the maximum current via the resistor Rp. By performing such an operation, the relay circuit can be protected, and the maximum current flowing through the battery cell and the inverter device 220 can be reduced to a predetermined value or less, and high safety can be maintained.

  Inverter device 220 controls the phase of AC power generated by power module 226 with respect to the rotor of motor 230, and operates motor 230 as a generator during vehicle braking. That is, regenerative braking control is performed, and the battery module 9 is charged by regenerating the power generated by the generator operation to the battery module 9. When the charging state of the battery module 9 is lower than the reference state, the inverter device 220 operates using the motor 230 as a generator. The three-phase AC power generated by the motor 230 is converted into DC power by the power module 226 and supplied to the battery module 9. As a result, the battery module 9 is charged.

  On the other hand, when powering the motor 230, the MCU 222 controls the driver circuit 224 to generate a rotating magnetic field in the advance direction with respect to the rotation of the rotor of the motor 230 in accordance with a command from the host controller 110, and Controls the switching operation. In this case, DC power is supplied from the battery module 9 to the power module 226. When the battery module 9 is charged by regenerative braking control, the MCU 222 controls the driver circuit 224 so as to generate a rotating magnetic field that is delayed with respect to the rotation of the rotor of the motor 230, and Controls the switching operation. In this case, electric power is supplied from the motor 230 to the power module 226, and DC power of the power module 226 is supplied to the battery module 9. As a result, the motor 230 acts as a generator.

  The power module 226 of the inverter device 220 conducts and cuts off at high speed and performs power conversion between DC power and AC power. At this time, since a large current is interrupted at a high speed, a large voltage fluctuation occurs due to the inductance of the DC circuit. In order to suppress this voltage fluctuation, the above-described large-capacity smoothing capacitor is provided.

  The battery module 9 includes two battery blocks 9A and 9B connected in series. Each battery block 9A, 9B includes a plurality of battery cells connected in series. The battery block 9A and the battery block 9B are connected in series via a maintenance / inspection service disconnect SD in which a switch and a fuse are connected in series. By opening the service disconnect SD, the direct circuit of the electric circuit is cut off, and even if a connection circuit is formed at one location between the battery blocks 9A and 9B and the vehicle, no current flows. With such a configuration, high safety can be maintained. Further, even if a human touches between HV + and HV− during inspection, it is safe because a high voltage is not applied to the human body.

  A high-voltage line HV + between the battery module 9 and the inverter device 220 is provided with a battery disconnect unit BDU including a relay RL, a resistor Rp, and a precharge relay RLp. A series circuit of the resistor Rp and the precharge relay RLp is connected in parallel with the relay RL.

  The battery monitoring apparatus 100 mainly performs voltage measurement of each battery cell, measurement of total voltage, measurement of current, cell temperature, cell capacity adjustment, and the like. For this purpose, integrated circuits IC1 to IC6 as cell controllers and a microcomputer (hereinafter referred to as microcomputer 30) are provided. The plurality of battery cells provided in each of the battery blocks 9A and 9B are divided into three cell groups, and one integrated circuit is provided for each cell group. The battery block 9A and the integrated circuits IC1 to IC3 are connected by the first connector 2A, and the battery block 9B and the integrated circuits IC4 to IC6 are connected by the first connector 2B.

  The integrated circuits IC <b> 1 to IC <b> 6 include a communication system 602 and a 1-bit communication system 604. In a communication system 602 for reading a cell voltage value and transmitting various commands, serial communication with the microcomputer 30 is performed in a daisy chain manner via an insulating element (for example, a photocoupler) PH. The 1-bit communication system 604 transmits an abnormal signal when cell overcharge is detected. In the example shown in FIG. 1, the communication system 602 is divided into an upper communication path for the integrated circuits IC1 to IC3 of the battery block 9A and a lower communication path for the integrated circuits IC4 to IC6 of the battery block 9B.

  Each of the integrated circuits IC1 to IC6 performs an abnormality diagnosis, and transmits an abnormality signal from the transmission terminal when it determines that it is abnormal or when it receives an abnormality signal from the previous integrated circuit at the reception terminal. On the other hand, when an abnormal signal that has already been received at the receiving terminal disappears or when the abnormality determination of itself becomes normal, the abnormal signal transmitted from the transmitting terminal disappears. This abnormal signal is a 1-bit signal in this embodiment.

  Although the microcomputer 30 does not transmit an abnormal signal to the integrated circuit, in order to diagnose that the 1-bit communication system 604 that is the transmission path of the abnormal signal operates correctly, a test signal that is a pseudo abnormal signal is sent to the 1-bit communication system 604. Send it out. The integrated circuit IC1 that has received the test signal transmits an abnormal signal to the 1-bit communication system 604, and the abnormal signal is received by the integrated circuit IC2. The abnormal signal is transmitted from the integrated circuit IC2 to the integrated circuit IC3, the integrated circuit IC4, the integrated circuit IC5, and the integrated circuit IC6 in order, and finally returned from the integrated circuit IC6 to the microcomputer 30. If the 1-bit communication system 604 is operating normally, the pseudo abnormal signal transmitted from the microcomputer 30 returns to the microcomputer 30 via the 1-bit communication system 604. Thus, the microcomputer 30 can send and receive the pseudo-abnormal signal so that the 1-bit communication system 604 can be diagnosed, and the reliability of the system is improved.

  A current sensor Si such as a Hall element is installed in the battery disconnect unit BDU, and the output of the current sensor Si is input to the microcomputer 30. Signals related to the total voltage and temperature of the battery module 9 are also input to the microcomputer 30. Each input signal is measured by an AD converter (ADC) of the microcomputer 30. Temperature sensors (not shown) are provided at a plurality of locations in the battery blocks 9A and 9B.

2 and 3 are diagrams showing an example of a specific configuration of the battery unit 900. FIG. 2 is a perspective view showing an appearance of the battery unit 900, and FIG. 3 is an exploded perspective view of the battery unit 900. As shown in FIG.
The battery unit 900 has a substantially rectangular parallelepiped battery case 900 a composed of a metal upper lid 46 and a lower lid 45.

  As shown in FIG. 3, a plurality of battery cells 1 are accommodated in the battery case 900a. There are many wirings for detecting voltage and temperature in the components constituting the battery unit 900, but these are covered with a battery case 900a which is a metal case, so that they are protected from external electrical noise. Yes.

  The battery cell 1 is a cylindrical lithium secondary battery in which a positive electrode active material is lithium manganese double oxide, a negative electrode active material is amorphous carbon, and is covered with a casing having high thermal conductivity. The battery cell 1 has a nominal voltage of 3.6 V and a capacity of 5.5 Ah. However, when the state of charge changes, the terminal voltage of the battery cell 1 changes. For example, when the charge amount of the battery cell 1 decreases, it decreases to about 2.0V, and when the charge amount of the battery cell 1 increases, it increases to about 4.0V.

  In the lower lid 45, a plurality of battery cells 1 connected in series are arranged in two rows in the case longitudinal direction. Each row in which a plurality of battery cells 1 are connected in series constitutes battery blocks 9A and 9B, respectively.

  The battery blocks 9A and 9B arranged side by side on the lower lid 45 are connected in series by a service disconnect SD (see FIG. 1, not shown in FIG. 3). On one side surface of the lower lid 45 in the longitudinal direction, terminals 810 and 820 for supplying the power of the positive high voltage cable 81 (see FIG. 1) and the negative high voltage cable 82 (see FIG. 1) to the outside or receiving power from the outside. Is provided.

  A rectangular box-shaped storage case 79a is disposed on the other side surface of the lower lid 45 in the longitudinal direction, and a mounting substrate 79 (see FIG. 4) constituting the battery monitoring device 100 is screwed to the storage case 79a.

  FIG. 4 is a perspective view of a mounting substrate 79 (state before application of the insulating material 5) constituting the battery monitoring device 100. FIG. FIG. 5 is an enlarged perspective view of the first connectors 2A and 2B shown in FIG. 4, and FIG. 6 is an enlarged perspective view of the second connector 3 shown in FIG. FIG. 7 is a perspective view of a mounting substrate 79 (state after application of the insulating material 5) constituting the battery monitoring device 100. FIG.

  As shown in FIG. 4, the battery monitoring apparatus 100 is configured by a mounting substrate 79 in which integrated circuits IC1 to IC6, a microcomputer 30, first connectors 2A and 2B, a second connector 3 and the like are mounted on a circuit board 83. Yes.

  The circuit board 83 has a rectangular shape having a pair of long sides LS1, LS2 and a pair of short sides SS1, SS2. The first connectors 2A and 2B and the second connector 3 are attached to one surface side of the circuit board 83. The integrated circuits IC1 to IC6 are attached to one surface side of the circuit board 83, and the microcomputer 30 is attached to the other surface side of the circuit board 83. The first connectors 2A and 2B are provided side by side in the longitudinal direction near the short side SS1 in the vicinity of the long side LS1 of the circuit board 83. The second connector 3 is provided in the center in the short direction of the circuit board 83 in the vicinity of the short side SS2 of the circuit board 83.

  The first connectors 2 </ b> A and 2 </ b> B are connected to each battery cell 1 through a voltage detection connection line of the battery cell 1. The second connector 3 is connected to the host controller 110 via a connection line for communication with the host controller 110.

  The first connector 2A connects each battery cell 1 constituting the battery block 9A on the middle / high voltage side of the battery module 9 and the circuit board 83, and the first connector 2B is a medium / low voltage of the battery block 9B. The battery cells 1 constituting the battery block 9B on the side and the circuit board 83 are connected. By using such distributed wiring, the voltage difference in the range that each of the first connectors 2A and 2B is responsible for can be reduced. Although a partial connection state in which only a part of the first connectors 2A and 2B is connected momentarily occurs when the first connectors 2A and 2B are connected or opened, the voltage difference in the range that each of the first connectors 2A and 2B takes can be reduced. The adverse effect caused by the condition can be reduced.

  As shown in FIG. 2, a cooling air intake port 14 is provided on the lower side of one side surface of the lower lid 45 in the longitudinal direction, and an exhaust port 15 is provided on the lower side of the other side surface facing the one side surface. ing. Although not shown, a duct having ventilation holes formed between the battery cells 1 is disposed between the bottom surface of the lower lid 45 and the lower portion of each battery cell 1. Cooling air blown by driving a blower fan (not shown) is introduced from the air inlet 14, circulates in the duct, and is blown out from each ventilation hole to the room side where the battery cell 1 is disposed. The cooling air flows around each battery cell 1, collects in a space formed between the battery cell 1 and the upper lid 46, and escapes from the exhaust port 15.

  A part of the cooling air introduced into the battery case 900 a for forcibly cooling the battery cell 1 also enters the housing case 79 a of the mounting substrate 79 constituting the battery monitoring device 100. For this reason, it is necessary to employ a protective structure for the mounting substrate 79 against a short circuit and electric corrosion caused by moisture, salt, conductive foreign matter, etc. contained in the cooling air.

  As shown in FIGS. 4 to 6, the first connectors 2 </ b> A and 2 </ b> B and the second connector 3 are connectors in which Z-shaped connection terminals 50 are arranged in a plurality of rows. The first connector 2A and the first connector 2B have the same structure. The first connectors 2A and 2B and the second connector 3 have substantially the same structure, although the number of connection terminals 50 is different.

  Since the first connectors 2A and 2B and the second connector 3 have substantially the same structure, the first connector 2A will be described as a representative, and the structure of the first connector 2B and the second connector 3 will be described. Is omitted. As shown in FIG. 5, the first connector 2 </ b> A includes a connector main body 53 and a plurality of connection terminals 50. The connector main body 53 holds the plurality of connection terminals 50 in an insulated state. The connector main body 53 is formed in a substantially rectangular box shape, and a plurality of connection terminals 50 are drawn from the opening surface side of the connector main body 53 through the bottom plate 53a facing the opening surface, and the connection pads (see FIG. (Not shown).

  Each connection terminal 50 has a through portion 50a, a vertical portion 50b, and an attachment portion 50c, and has a substantially Z shape. The through portion 50 a extends so as to be parallel to the connector mounting surface of the circuit board 83, and penetrates the bottom plate 53 a of the connector main body 53. The vertical portion 50b is bent toward the circuit board 83 from the end of the through portion 50a. The attachment portion 50c is bent by approximately 90 degrees from the end portion on the connector attachment surface side of the vertical portion 50b, and extends so as to be parallel to the connector attachment surface.

  The through portions 50a are arranged in two rows in the longitudinal direction of the bottom plate 53a. The upper row of through portions 50a and the lower row of through portions 50a are arranged at the same pitch along the longitudinal direction of the bottom plate 53a, but are shifted from each other by a half pitch in the arrangement direction. It has been. That is, the through portions 50a in the upper row in the drawing and the through portions 50a in the lower row in the drawing are alternately arranged along the longitudinal direction of the bottom plate 53a.

  The mounting portions 50c are arranged in a line along the longitudinal direction of the bottom plate 53a, and are soldered to connection pads (not shown) of the circuit board 83. A pair of side plates 53 s that protrude from the bottom plate 53 a of the connector main body 53 are provided outside both ends of the mounting portion 50 c in the arrangement direction.

  A coating agent having an insulating property is applied to the mounting substrate 79. The coating agent is applied to substantially the entire mounting substrate 79 except for the connection terminals 50 of the first connectors 2A and 2B and the second connector 3. The reason for applying the coating by avoiding the connection terminal 50 is that when the coating agent is applied to the connection terminal 50, the coating agent penetrates through the through hole of the bottom plate 53 a to the contact that is the tip of the connection terminal 50, This is because an electrical connection failure may occur.

  As described above, since the coating agent is not applied to the connection terminal 50, the connection terminal 50 is insulated so as not to cause a short circuit when a conductive foreign substance enters the housing case 79a. It is necessary to cover with. In the present embodiment, as the insulating material 5, a silicone resin material including a silicone resin having a property of becoming a semi-cured state by applying a heat treatment for a predetermined time after application in a paste state at the time of application is used. .

  In this embodiment, as schematically shown by hatching in FIG. 7, the entire connection terminals 50 are insulated so that the connection terminals 50 of the first connectors 2A and 2B and the second connector 3 are not exposed. Covered with material 5.

-Manufacturing method of mounting substrate-
An embodiment of a method for manufacturing a mounting substrate 79 according to the present invention will be described. FIG. 8 is a diagram for explaining a process for manufacturing the mounting substrate 79. The manufacturing method of the mounting substrate 79 includes a component mounting step S101, a coating step S111, insulating material coating steps S121 and S131, and a heating step S151.

-Component mounting process-
In the component mounting step S101, components such as the circuit board 83 and the integrated circuits IC1 to IC6, the first connectors 2A and 2B and the second connector 3, the photocoupler PH, and the microcomputer 30 to be mounted on the circuit board 83 are prepared. These components are mounted on the circuit board 83.

-Coating process-
In the coating step S <b> 111, the first connector 2 </ b> A, 2 </ b> B and the second connector 3 are covered with a curing member (not shown) such as a curing tape or a curing sheet, and then a moisture-proof insulating coating agent is applied to the entire circuit board 83. A coating layer (not shown) is formed by drying for a predetermined time after application.

-Insulation coating process-
The insulating material coating step is a step of covering the connection terminal 50 with the insulating material 5 in a paste state, and includes a pre-application preparation step S121 and a coating step S131. In the pre-application preparation step S121, the curing member (not shown) is removed, the circuit board 83 is placed on a mounting table, the circuit board 83 is horizontally arranged, and the insulating material 5 is prepared. In the application step S131, the insulating material 5 is applied to the connection terminals 50 of the first connectors 2A and 2B and the second connector 3. For the insulating material 5, a silicone resin material in a paste state at normal temperature (5 ° C. to 35 ° C.) was adopted.

  Specifically, the insulating material 5 is a silicone-based resin material whose viscosity is adjusted by mixing silicone oil with a powder of aluminum oxide as a main material and further applying an adhesion assistant. The viscosity is preferably adjusted to about 90 to 110 Pa · s. For the application of the insulating material 5, a dispenser that discharges the insulating material 5 in a paste state while applying pressure was used. Since the insulating material 5 is in a paste state, the insulating material 5 is prevented from spreading unintentionally in the horizontal direction in the coating process of the insulating material 5.

  In the present specification, the paste state refers to a state having thixotropic characteristics (thixotropic properties). The thixotropic property is a gel that does not have fluidity when an object is left standing, but changes to a sol that shows fluidity when an external force is applied, and returns to the gel when left standing. Point to.

  When the insulating material 5 is applied, the insulating material 5 in a paste state is applied while being pressed by a dispenser or the like, thereby covering the whole connecting terminal 50 with the insulating material 5 (see FIG. 7), and each connecting terminal 50. The insulating material 5 is filled between the connection terminals 50 and the circuit board 83. Thereby, the connection terminals 50 of the connectors 2A, 2B, 3 are sealed by the insulating material 5.

-Heating process-
In the heating step S151 after sealing, a heat treatment is performed for about 60 minutes in an atmosphere of 120 ° C. to make the insulating material 5 in a semi-cured state. Thereby, the mounting substrate 79 is completed. In the present embodiment, the semi-cured insulating material 5 has a hardness of about ASKER C 40.

  Generally, the cured state can be divided into an A stage state that is a completely uncured state, a B stage state that is a semi-cured state, and a C stage state that is a fully cured state in which curing has proceeded. That is, in the present embodiment, the semi-cured state refers to an intermediate state until the paste-like insulating material 5 that is an uncured state is completely cured.

  Insulating material 5 according to the present embodiment is difficult to be completely cured by adjusting the amount of components applied to insulating material 5, such as polytetrafluoroethylene, polyethylene, and silicone rubber, and can maintain a semi-cured state. It has characteristics. FIG. 9 is a graph showing curability when the insulating material 5 is heat-treated in an atmosphere at a predetermined temperature. The horizontal axis represents the heat treatment time, and the vertical axis represents the torque on the measurement method as a value that substitutes for the material hardness. In FIG. 9, the curing characteristics of the insulating material 5 of the present embodiment are indicated by a solid line (temperature 100 ° C.) and a one-dot chain line (temperature 120 ° C.). As a comparative example, the characteristics of a thermosetting resin that is completely cured under predetermined curing conditions are indicated by broken lines. When the thermosetting resin shown in the comparative example is left in an atmosphere of 100 ° C. for about 10 minutes, the crosslinking reaction proceeds rapidly, the torque reaches its maximum value in about 30 minutes, and completes in about 50 to 60 minutes. It has the property of curing.

  On the other hand, the present embodiment does not have a characteristic that the crosslinking reaction rapidly proceeds under a predetermined curing condition, that is, a predetermined temperature and time. The insulating material 5 of the present embodiment has a characteristic that the crosslinking reaction gradually proceeds as the heat treatment time elapses, and even when left in an atmosphere of at least 100 ° C. to 120 ° C. for about 90 minutes, the crosslinking reaction Does not advance rapidly. In other words, the insulating material 5 of the present embodiment has a predetermined heat treatment time as an inflection point, and the torque change rate with respect to the heat treatment time does not increase rapidly. The characteristic gradually decreases.

  Thus, since the insulating material 5 of this Embodiment has the specification which hardens | cures gradually according to heat processing time, the adjustment of the hardness of the insulating material 5 can be performed easily.

  FIG. 10 is a graph showing the Young's modulus characteristics of the insulating material 5 in a semi-cured state. As shown in FIG. 10, the Young's modulus of the insulating material 5 is a characteristic that gradually decreases as the temperature rises, and is about 7.5 MPa at −50 ° C., about 5.0 MPa at −40 ° C., and about 10 MPa at 10 ° C. It becomes about 0.6 MPa at 1.0 MPa and 100 ° C.

  The Young's modulus characteristic of the insulating material 5 is a range of about −40 ° C. to about 100 ° C. and a maximum Young's modulus of 5 to 10 MPa or less in consideration of the use environment of a hybrid electric vehicle or a pure electric vehicle. It is preferable that In the present embodiment, the maximum Young's modulus is about 5 MPa in the range of about −40 ° C. to about 100 ° C.

In the present embodiment, the material of the connection terminal 50 is brass, and its linear expansion coefficient is about 17.5 × 10 ⁻⁶ (1 / K). On the other hand, the linear expansion coefficient of the insulating material 5 is about 2.0 × 10 ^{−4 to} 4.0 × 10 ⁻⁴ (1 / K), and the line between the connection terminal 50 and the insulating material 5 is a line. There is a difference in expansion coefficient. Further, as described above, the insulating material 5 is filled between the connection terminals 50 and between the connection terminals 50 and the circuit board 83 by being applied while being pressurized by a dispenser or the like.

  However, as described above, the insulating material 5 of the present embodiment has a maximum Young's modulus of about 5 MPa. That is, since the insulating material 5 is flexible, the insulating material 5 is deformed by a reaction force from the connecting terminal 50 when the insulating material 5 is thermally expanded, so that the insulating material 5 acts on the connecting terminal 50. The force to do can be reduced. As a result, it is possible to reduce the stress generated in the soldered portion between the connection terminal 50 and the circuit board 83.

According to this embodiment described above, the following operational effects can be obtained.
(1) Since the connection terminal 50 is covered with the insulating material 5, it is possible to prevent an electrical short circuit from occurring even when a conductive foreign substance enters from the outside. In addition, since the insulating material 5 is filled between the connection terminals 50 or between the connection terminals 50 and the circuit board 83, the withstand voltage between the connection terminals 50 can be improved.

(2) In the technique described in Patent Document 1 (hereinafter referred to as conventional technique), a molten insulating resin material is applied by potting and then cured. The molten insulating resin material used for potting has fluidity. For this reason, in the prior art, the flow of the insulating resin material melted by the weir member is stopped, and the side surface of the cured insulating resin is covered by the weir member. In other words, the side surface of the insulating resin after curing in the prior art is not exposed.
In contrast, in the present embodiment, the insulating material 5 is in a paste state at the time of application. For this reason, when applying the insulating material 5 to the connection terminal 50, it is not necessary to use a weir member that suppresses the insulating material 5 from unintentionally spreading naturally. According to the present embodiment, it is possible to easily insulate the connection terminal 50 by applying the paste insulating material 5 without preparing a weir member for preventing the insulating material 5 from flowing naturally. Since it can be covered with the material 5, the component cost can be reduced. In the present embodiment, since no dam member is provided to cover the side of the insulating material 5, as shown in FIG. 7, the cured insulating material 5 is not only from its upper surface but also from the circuit board 83. The rising side surface 5s is exposed.

(3) In the prior art, in the process of applying the molten insulating resin material, potting is performed from two directions, so that work is troublesome. On the other hand, in this Embodiment, the terminal 50 for a connection can be easily covered with the insulating material 5 by apply | coating the insulating material 5 of a paste state. That is, according to the present embodiment, the workability is improved as compared with the prior art, so that the production cost can be reduced.

(4) After the connection terminal 50 was covered with the insulating material 5, heat treatment was performed for a predetermined time, so that the insulating material 5 applied to the connection terminal 50 was in a semi-cured state. Since the semi-cured insulating material 5 has appropriate flexibility (preferably the maximum value of Young's modulus is 5 to 10 MPa or less), the connection terminals 50 and the circuit board 83 are connected to each other. When the insulating material 5 filled in between is thermally expanded, the insulating material 5 is deformed, whereby the force acting on the connecting terminal 50 from the insulating material 5 can be reduced. Thereby, the stress which generate | occur | produces in the soldering part which is a connection part of the terminal 50 for a connection and the circuit board 83 can be suppressed.

(5) When the viscosity of the insulating material 5 is small at the time of application, for example, when the viscosity of the insulating material 5 is about 0.6 to 1.2 Pa · s, the insulating material 5 is a through hole in the bottom plate 53 a of the connector body 53 This may penetrate into the contact side of the tip of the connection terminal 50 and reduce the reliability of electrical connection with a connection member (not shown). On the other hand, in this Embodiment, it is set as the paste state by which the viscosity of the insulating material 5 at the time of application | coating was adjusted to about 90-110 Pa.s. For this reason, according to the present embodiment, the insulating material 5 applied to the connection terminal 50 penetrates into the contact side of the distal end portion of the connection terminal 50 through the through hole of the bottom plate 53a of the connector main body 53. There is no. As a result, the reliability of electrical connection with a connection member (not shown) is ensured.

The following modifications are also within the scope of the present invention, and one or a plurality of modifications can be combined with the above-described embodiment.
(1) In the above-described embodiment, the material containing the silicone resin is used as the insulating material 5, but the present invention is not limited to this. Various materials that can be made into a semi-cured state by heat treatment in a paste state during the coating step can be used as the insulating material 5.

(2) In the embodiment described above, the first connectors 2A and 2B provided with the connection terminals 50 to which the connection lines for detecting the voltage of the battery cells 1 are connected, and the connection for connection to the host controller 110. Although the example which seals the 2nd connector 3 with which the terminal 50 was provided with the insulating material 5 was demonstrated, this invention is not limited to this. The present invention can be applied to various connection terminals.

(3) In the above-described embodiment, the second connector 3 is connected to the host controller 110, but the present invention is not limited to this. A contact to which a connection line for detecting the temperature of the battery cell 1 is connected, a contact to which a connection line for detecting a current flowing through the battery module 9 is connected, and a contact to which a connection line for detecting the total voltage of the battery module 9 is connected May be provided in the second connector 3.

(4) In the above-described embodiment, when a forced cooling method for forcibly cooling each battery cell 1 with cooling air generated by a blower fan (not shown) is employed, the cooling air enters from the opening. Although the example which prevents that a short circuit arises by the electroconductive foreign material to perform was demonstrated, this invention is not limited to this. The present invention can be applied to the housing case 79a that houses the mounting substrate and the battery case 900a in which the housing case 79a is disposed, where a gap communicating with the outside is provided.

(5) In the above-described embodiment, the example in which the pair of side plates 53s protruding from the bottom plate 53a of the connector main body 53 is provided outside the both ends in the arrangement direction of the mounting portion 50c has been described. 53s may be omitted.

(6) In the above-described embodiment, a cylindrical lithium secondary battery has been described as an example of a power storage element mounted on the battery unit 900, but the present invention is not limited to this. For example, the present invention may be applied to the mounting substrate 79 constituting the battery monitoring device 100 of the battery unit 900 including a plurality of rectangular lithium secondary batteries having a flat rectangular parallelepiped container. Although the lithium secondary battery has been described as an example of the power storage element, the present invention can also be applied to other secondary batteries such as a nickel metal hydride battery. Further, the present invention may be applied to a mounting substrate 79 constituting a storage module monitoring device in which an electric double layer capacitor or a lithium ion capacitor is mounted as a storage element.

(7) In the above-described embodiment, the mounting board 79 constituting the battery monitoring device 100 of the battery unit 900 mounted on a hybrid electric vehicle or a pure electric vehicle has been described as an example, but the present invention is not limited thereto. Not. This mounting board constitutes a control device that can be used for power storage devices such as other electric vehicles, such as railway vehicles such as hybrid trains, passenger cars such as buses, cargo vehicles such as trucks, and industrial vehicles such as battery-powered forklift trucks. The invention may be applied. The present invention may be applied to a mounting board constituting a control device incorporated in a stationary power storage device.

  Although various embodiments and modifications have been described above, the present invention is not limited to these contents. Other embodiments conceivable within the scope of the technical idea of the present invention are also included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Battery cell, 2A 1st connector, 2B 1st connector, 3rd connector, 5 Insulation material, 5s side surface, 9 Battery module, 9A, 9B Battery block, 14 Inlet, 15 Exhaust, 30 Microcomputer, 45 Lower lid , 46 Top cover, 50 connection terminal, 50a penetrating part, 50b vertical part, 50c mounting part, 53 connector body, 53a bottom plate, 79 mounting board, 79a housing case, 81 positive high voltage cable, 82 negative high voltage cable, 83 circuit board, 100 battery monitoring device, 110 host controller, 220 inverter device, 224 driver circuit, 226 power module, 230 motor, 602 communication system, 604 1-bit communication system, 810,820 terminal, 900 battery unit, 900a battery case, BDU battery display Connect unit HV high voltage line, IC1 integrated circuit to IC6 integrated circuit, LS1 long side, LS2 long side, PH photocoupler, RL relay, Rp resistor, RLp precharge relay, SS1 short side, SS2 short side, SD service disconnect, Si current Sensor

Claims (6)

A connector on which a connector provided with a plurality of connection terminals is mounted on a circuit board,
The connector includes a connector main body having an opening surface through which a connection line connected to the outside is inserted, and a bottom plate facing the opening surface;
The connection terminal has an internal drawer portion that is drawn into the connector body from a through portion that penetrates the bottom plate, and an external exposed portion that is pulled out of the connector body from the through portion and attached to the circuit board. And
A mounting substrate in which a space between the externally exposed portion and the externally exposed portion of each of the plurality of connection terminals is covered with a semi-cured insulating material. The mounting board according to claim 1,
The insulating material is a mounting board containing a silicone resin. In the mounting substrate according to claim 1 or 2 ,
The insulating material is a mounting substrate having a Young's modulus of 10 MPa or less in a range of −40 ° C. to 100 ° C. A method of manufacturing a mounting board in which a connector provided with a plurality of connection terminals is mounted on a circuit board,
Solder externally exposed portions of the connection terminals of the connector to the circuit board,
Apply between the externally exposed portion and the externally exposed portion of each connection terminal by an insulating material in a paste state,
Then, the manufacturing method of the mounting substrate which performs the heat processing which makes the said insulating material a semi-hardened state by heating, complete | finishes the heat processing, maintaining this semi-hardened state. In the manufacturing method of the mounting substrate according to claim 4,
The method for manufacturing a mounting board, wherein the insulating material includes a silicone resin. In the manufacturing method of the mounting substrate according to claim 4 or 5,
The said insulating material is a manufacturing method of the mounting board | substrate which has a thixotropic characteristic in a paste state.

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