CN111922511A - Laser processing device, processing equipment, processing system and processing method - Google Patents
Laser processing device, processing equipment, processing system and processing method Download PDFInfo
- Publication number
- CN111922511A CN111922511A CN202010533864.5A CN202010533864A CN111922511A CN 111922511 A CN111922511 A CN 111922511A CN 202010533864 A CN202010533864 A CN 202010533864A CN 111922511 A CN111922511 A CN 111922511A
- Authority
- CN
- China
- Prior art keywords
- processing
- laser
- signal
- processing mechanism
- path selection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003672 processing method Methods 0.000 title claims abstract description 13
- 230000007246 mechanism Effects 0.000 claims abstract description 274
- 230000003287 optical effect Effects 0.000 claims abstract description 63
- 238000004891 communication Methods 0.000 claims abstract description 22
- 230000011664 signaling Effects 0.000 claims abstract description 16
- 230000010287 polarization Effects 0.000 claims description 56
- 238000003754 machining Methods 0.000 claims description 34
- 238000006243 chemical reaction Methods 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 18
- 230000033001 locomotion Effects 0.000 claims description 10
- 238000007599 discharging Methods 0.000 claims description 7
- 230000000007 visual effect Effects 0.000 description 19
- 238000010586 diagram Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 230000005684 electric field Effects 0.000 description 2
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 2
- 230000002085 persistent effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
- B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The embodiment of the invention discloses a laser processing device, processing equipment, a processing system and a processing method. The optical path selection mechanism of the device is arranged between the laser and the first processing mechanism and the second processing mechanism; the laser is used for emitting initial laser; the controller is used for being in communication connection with the light path selection mechanism, the first processing mechanism and the second processing mechanism so as to obtain a first signal, controlling the light path selection mechanism to send initial laser to the first processing mechanism according to the first signal, and controlling the first processing mechanism to carry out laser processing according to the first signal; the controller is further used for acquiring a second signal, controlling the light path selection mechanism to send the initial laser to the second processing mechanism according to the second signal, and controlling the second processing mechanism to perform laser processing according to the second signal. The invention realizes that the initial laser emitted by the laser is used for the first processing mechanism and the second processing mechanism to carry out laser processing in a time-sharing manner, improves the utilization rate of laser energy and improves the efficiency of laser processing.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a laser processing device, processing equipment, a processing system and a processing method.
Background
The current laser processing flow places the material piece on the processing station through the manipulator so as to realize feeding, through visual shooting and positioning, laser processing is carried out again, and the processed material piece is taken out from the processing station through the manipulator so as to realize discharging. The processing flow has the problems that the laser processing time of the material sheet is shorter than the total time of the three processes of visual photographing positioning, feeding and discharging, so that the laser energy utilization rate is not high, and the laser processing efficiency is improved.
Disclosure of Invention
In view of the above, it is necessary to provide a laser processing apparatus, a processing device, a processing system, and a processing method. The method is used for solving the technical problem that the laser energy utilization rate is not high in the laser processing flow in the prior art.
In a first aspect, the present invention provides a laser processing apparatus, the apparatus comprising: the device comprises a laser, a light path selection mechanism, a first processing mechanism, a second processing mechanism and a controller;
the optical path selection mechanism is arranged between the laser and the first processing mechanism and the second processing mechanism;
the laser is used for emitting initial laser;
the controller is used for being in communication connection with the light path selection mechanism, the first processing mechanism and the second processing mechanism so as to obtain a first signal, controlling the light path selection mechanism to send the initial laser to the first processing mechanism according to the first signal, and controlling the first processing mechanism to perform laser processing according to the first signal;
the controller is further configured to acquire a second signal, control the optical path selection mechanism to send the initial laser to the second processing mechanism according to the second signal, and control the second processing mechanism to perform laser processing according to the second signal.
In one embodiment, the optical path selection mechanism comprises a first reflector, a telescopic component;
the first reflector is connected with the telescopic component;
the controller is in communication connection with the telescopic component so as to control the telescopic component to do telescopic motion according to the first signal and control the telescopic component to do telescopic motion according to the second signal;
the telescopic component drives the first reflector to be close to the initial laser and reflect the initial laser to the first processing mechanism, and the telescopic component drives the first reflector to be far away from the initial laser so that the laser is directly injected into the second processing mechanism.
In one embodiment, the optical path selection mechanism further comprises a second mirror, a rotating member;
the second reflector is connected with the rotating component;
the controller is in communication connection with the rotating component so as to control the rotating component to drive the second reflector to rotate to a first position according to the first signal and control the rotating component to drive the second reflector to rotate to a second position according to the second signal;
wherein the second mirror reflects the initial laser light to the first processing mechanism when the second mirror is in the first position and reflects the initial laser light to the second processing mechanism when the second mirror is in the second position.
In one embodiment, the optical path selection mechanism further comprises an acousto-optic deflection member;
the controller is in communication connection with the acousto-optic deflection component to control the acousto-optic deflection component to diffract the initial laser to enter the first processing mechanism according to the first signal, and control the acousto-optic deflection component to diffract the initial laser to enter the second processing mechanism according to the second signal.
In one embodiment, the optical path selection mechanism further comprises a polarization conversion component and a polarization splitting prism;
the controller is in communication connection with the polarization conversion component to control the polarization conversion component to perform polarization conversion on the initial laser according to the first signal to obtain laser in a first polarization state, and control the polarization conversion component to perform polarization conversion on the initial laser according to the second signal to obtain laser in a second polarization state;
the polarization beam splitter prism is used for reflecting the laser in the first polarization state to the first processing mechanism and transmitting the laser in the second polarization state to the second processing mechanism.
In one embodiment, the initial laser has a wavelength of 300nm to 1100 nm;
the pulse repetition frequency of the initial laser is 1MHz to 10 MHz;
the pulse width of the initial laser is less than 50 ns.
In one embodiment, the first processing mechanism comprises a first galvanometer scanner, a first field lens;
the second processing mechanism comprises a second scanning galvanometer and a second field lens;
the first scanning galvanometer is positioned between the light path selection mechanism and the first field lens;
the second scanning galvanometer is positioned between the light path selection mechanism and the second field lens;
the controller is in communication connection with the first scanning galvanometer and the second scanning galvanometer so as to control the first scanning galvanometer to carry out processing scanning according to the first signal and control the second scanning galvanometer to carry out processing scanning according to the second signal.
In a second aspect, the present invention also provides a laser processing apparatus comprising at least one laser processing device according to any one of the first aspects.
In a third aspect, the present invention further provides a laser processing system, including: at least one laser machining device according to any one of the first aspect or at least one laser machining apparatus according to the second aspect.
In a fourth aspect, the present invention further provides a laser processing method applied to a laser processing apparatus, where the laser processing apparatus includes at least one laser processing device according to any one of the first aspects;
the method comprises the following steps:
acquiring a processing signal, wherein the processing signal comprises a first signal and a second signal;
when the processing signal is a first signal, controlling the optical path selection mechanism to send the initial laser to the first processing mechanism according to the first signal, and controlling the first processing mechanism to perform laser processing;
and when the processing signal is a second signal, controlling the optical path selection mechanism to send the initial laser to the second processing mechanism according to the second signal, and controlling the second processing mechanism to perform laser processing.
In one embodiment, the apparatus further comprises a gripping device, a first processing station, a second processing station;
when the processing signal is a first signal, controlling the optical path selection mechanism to send the initial laser to the first processing mechanism according to the first signal, and controlling the first processing mechanism to perform laser processing, including:
when the processing signal is a first signal, controlling the light path selection mechanism to send the initial laser to the first processing mechanism according to the first signal, controlling the first processing mechanism to carry out laser processing on the workpiece of the first processing station, and controlling the gripping device to carry out workpiece blanking and workpiece loading on the second processing station in sequence;
when the processing signal is a second signal, controlling the optical path selection mechanism to send the initial laser to the second processing mechanism according to the second signal, and controlling the second processing mechanism to perform laser processing, including:
when the processing signal is a second signal, the light path selection mechanism is controlled to send the initial laser to the second processing mechanism according to the second signal, the second processing mechanism is controlled to carry out laser processing on the workpiece of the second processing station, and the grabbing device is controlled to sequentially carry out workpiece discharging and workpiece feeding on the first processing station.
In summary, the controller of the laser processing apparatus of the present invention obtains the first signal, controls the optical path selection mechanism to transmit the initial laser to the first processing mechanism according to the first signal, controls the first processing mechanism to perform laser processing according to the first signal, obtains the second signal, controls the optical path selection mechanism to transmit the initial laser to the second processing mechanism according to the second signal, and controls the second processing mechanism to perform laser processing according to the second signal, so that the initial laser emitted by the laser is used for the first processing mechanism and the second processing mechanism to perform laser processing in a time-sharing manner, the laser does not wait for three steps of visual photographing positioning, loading and unloading, the utilization rate of laser energy is improved, and the efficiency of laser processing is improved. Therefore, the invention realizes that the initial laser emitted by the laser is used for the first processing mechanism and the second processing mechanism to carry out laser processing in a time-sharing manner, improves the utilization rate of laser energy and improves the efficiency of laser processing.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Wherein:
FIG. 1 is a block diagram showing the structure of a laser processing apparatus according to an embodiment;
FIG. 2 is a block diagram of the laser processing apparatus of FIG. 1 employing a telescopic member;
FIG. 3 is a block diagram of the laser processing apparatus of FIG. 1 employing a rotating member;
FIG. 4 is a block diagram of the laser processing apparatus of FIG. 1 employing an acousto-optic deflection component;
FIG. 5 is a block diagram of the laser processing apparatus of FIG. 1 employing a polarization conversion member;
FIG. 6 is a flow diagram of an embodiment laser machining method;
FIG. 7 is a flowchart of a laser processing method in another embodiment;
fig. 8 is a pulse timing diagram of the laser processing method of fig. 6.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 5, in one embodiment, there is provided a laser processing apparatus including: a laser 10, an optical path selection mechanism 20, a first processing mechanism 31, a second processing mechanism 32, and a controller;
the optical path selection mechanism 20 is disposed between the laser 10 and the first and second processing mechanisms 31 and 32;
the laser 10 is used for emitting initial laser;
the controller is configured to be in communication connection with the optical path selecting mechanism 20, the first processing mechanism 31, and the second processing mechanism 32, so as to obtain a first signal, control the optical path selecting mechanism 20 to send the initial laser to the first processing mechanism 31 according to the first signal, and control the first processing mechanism 31 to perform laser processing according to the first signal;
the controller is further configured to obtain a second signal, control the optical path selection mechanism 20 to send the initial laser to the second processing mechanism 32 according to the second signal, and control the second processing mechanism 32 to perform laser processing according to the second signal.
The controller of the laser processing device of the embodiment realizes acquiring a first signal, controls the optical path selection mechanism 20 to transmit the initial laser to the first processing mechanism 31 according to the first signal, controls the first processing mechanism 31 to perform laser processing according to the first signal, acquires a second signal, controls the optical path selection mechanism 20 to transmit the initial laser to the second processing mechanism 32 according to the second signal, and controls the second processing mechanism 32 to perform laser processing according to the second signal, thereby realizing that the initial laser transmitted by the laser 10 is used for the first processing mechanism 31 and the second processing mechanism 32 to perform laser processing in a time-sharing manner, the laser 10 does not need to wait for three procedures of visual photographing positioning, loading and unloading, the utilization rate of laser energy is improved, and the efficiency of laser processing is improved.
The laser 10 may be selected from the prior art as a laser generating device, and will not be described herein.
The Controller may be selected from the prior art and may be an industrial personal computer and/or a PLC (Programmable Logic Controller) and/or an FPGA (Field Programmable Gate Array) and/or a PC (personal computer), which are not specifically limited by the examples herein.
The first signal and the second signal may be generated by a software program in the controller according to a signal generation rule, or may be sent by an equipment controller of the laser processing equipment, which is not specifically limited herein.
The first signal and the second signal may be signals transmitted at time intervals or may be persistent signals, which is not specifically limited by this example.
Optionally, the initial laser is a gaussian beam.
The laser processing includes laser cutting, laser drilling, and laser marking, and is not limited to this example.
The first processing mechanism 31 is configured according to the requirements of laser processing, and is not particularly limited herein.
The structure of the second processing mechanism 32 is set according to the requirements of laser processing, and is not particularly limited herein.
It is understood that the first processing mechanism 31 and the second processing mechanism 32 may have the same or different structures, and are not limited herein.
It is understood that the laser processing apparatus may further include more processing mechanisms, each of which corresponds to a control signal, for example, for a third processing mechanism, the controller is further configured to obtain a third signal (i.e., a control signal), control the optical path selecting mechanism 20 to transmit the initial laser to the third processing mechanism according to the third signal, and control the third processing mechanism to perform laser processing according to the third signal.
In one embodiment, when the laser processing apparatus employs more than two processing mechanisms, a plurality of optical path selection mechanisms 20 may be used in cooperation, and the controller sends the initial laser to the corresponding processing mechanism according to a control signal.
In one embodiment, the controller is communicatively connected to the laser 10 for controlling the laser 10 to emit the initial laser light or to suspend emitting the initial laser light. The laser 10 is controlled to emit initial laser when laser processing is needed, so that the utilization rate of laser energy is further improved.
It will be appreciated that in another embodiment, the laser 10 always emits the initial laser light.
As shown in fig. 2, in one embodiment, the optical path selection mechanism 20 includes a first mirror 211, a telescopic member 212;
the first reflecting mirror 211 is connected to the telescopic member 212;
the controller is in communication connection with the telescopic component 212 to control the telescopic component 212 to make telescopic motion according to the first signal and control the telescopic component 212 to make telescopic motion according to the second signal;
the extending movement of the telescopic member 212 drives the first reflecting mirror 211 to approach the initial laser and reflect the initial laser to the first processing mechanism 31, and the retracting movement of the telescopic member 212 drives the first reflecting mirror 211 to be away from the initial laser so that the laser is directly emitted into the second processing mechanism 32. The initial laser emitted by the laser 10 is used for the first processing mechanism 31 and the second processing mechanism 32 to perform laser processing in a time-sharing manner through the telescopic part 212 and the first reflector 211, the laser 10 does not need to wait for three procedures of visual photographing positioning, loading and unloading, and the laser processing efficiency is improved.
It is understood that the first mirror 211 is at an angle α with respect to the initial laser light, 0 ° < α < 90 °.
Alternatively, α is equal to 45 °, facilitating the layout of said first machining means 31.
The first reflector 211 may be a mirror selected from the prior art, such as a plane mirror, which can reflect light, and is not limited in this embodiment.
The telescopic member 212 may be selected from the prior art, for example, an adjustable cylinder, a voice coil motor, and the like, and is not limited in this embodiment.
Optionally, the direction of the telescopic motion of the telescopic member 212 is perpendicular to the propagation direction of the initial laser emitted by the laser.
As shown in fig. 3, in one embodiment, the optical path selecting mechanism 20 further includes a second mirror (2211, 2212), a rotating component (not shown in the figure);
the second mirror (2211, 2212) is connected to the rotating member;
the controller is in communication with the rotating component to control the rotating component to rotate the second mirror (2211, 2212) to a first position (2211 in fig. 3) according to the first signal, and to control the rotating component to rotate the second mirror (2211, 2212) to a second position (2212 in fig. 3) according to the second signal;
wherein the second mirror (2211, 2212) reflects the initial laser light to the first processing mechanism 31 when the second mirror (2211, 2212) is in the first position and the second mirror (2211, 2212) reflects the initial laser light to the second processing mechanism 32 when the second mirror (2211, 2212) is in the second position. The initial laser emitted by the laser 10 is used for the first processing mechanism 31 and the second processing mechanism 32 to perform laser processing in a time-sharing manner through the rotating component and the second reflecting mirror (2211 and 2212), the laser 10 does not need to wait for three procedures of visual photographing positioning, loading and unloading, and the laser processing efficiency is improved.
It is understood that the second mirror (2211, 2212) is at an angle β with respect to the initial laser, 0 ° < β < 180 °.
The second reflector (2211, 2212) may be selected from the prior art, such as a plane reflector, which can reflect light, and this example is not limited in particular.
The rotating component may be selected from the prior art, for example, a rotating motor, an angularly adjustable rotating cylinder, and is not limited in this example.
As shown in FIG. 4, in one embodiment, the optical path selection mechanism 20 further comprises an acousto-optic deflection member 231;
the controller is in communication connection with the acousto-optic deflection component 231 to implement controlling the acousto-optic deflection component 231 to diffract the initial laser light into the first processing mechanism 31 according to the first signal, and controlling the acousto-optic deflection component 231 to diffract the initial laser light into the second processing mechanism 32 according to the second signal. The acousto-optic deflection component 231 is used for time-sharing the initial laser emitted by the laser 10 for the first processing mechanism 31 and the second processing mechanism 32 to carry out laser processing, the laser 10 does not need to wait for three procedures of visual photographing positioning, loading and unloading, and the laser processing efficiency is improved.
The controlling the acousto-optic deflection component 231 to diffract the initial laser light into the first processing mechanism 31 according to the first signal includes: according to the first signal, the acoustic wave frequency loaded on the acousto-optic deflection component 231 is made to be the maximum value of the bandwidth range of the acousto-optic deflection component 231, so that the initial laser light is diffracted into the first processing mechanism 31 through the acousto-optic deflection component 231.
The controlling the acousto-optic deflection component 231 to diffract the initial laser light into the second processing mechanism 32 according to the second signal includes: the acoustic frequency loaded on the acousto-optic deflection component 231 is made to be the minimum value of the bandwidth range of the acousto-optic deflection component 231 according to the second signal, so that the initial laser light is diffracted into the second processing mechanism 32 through the acousto-optic deflection component 231.
The acousto-optic deflection component 231 may be selected from the prior art acousto-optic deflectors, and is not specifically limited by way of example.
As shown in fig. 5, in one embodiment, the optical path selecting mechanism 20 further includes a polarization conversion component 241, a polarization splitting prism 242;
the controller is in communication connection with the polarization conversion component 241, so as to control the polarization conversion component 241 to perform polarization conversion on the initial laser according to the first signal to obtain laser in a first polarization state, and control the polarization conversion component 241 to perform polarization conversion on the initial laser according to the second signal to obtain laser in a second polarization state;
the polarization beam splitter prism 242 is configured to reflect the laser light in the first polarization state to the first processing mechanism 31, and transmit the laser light in the second polarization state to the second processing mechanism 32. The polarization conversion component 241 and the polarization beam splitter 242 realize that the initial laser emitted by the laser 10 is used for the first processing mechanism 31 and the second processing mechanism 32 in a time-sharing manner for laser processing, the laser 10 does not need to wait for three procedures of visual photographing positioning, loading and unloading, and the utilization rate of laser energy is improved.
The controlling the polarization conversion component 241 (taking an electro-optical modulator as an example) according to the first signal to perform polarization conversion on the initial laser light to obtain laser light in a first polarization state includes: and loading a specific voltage on the electro-optical modulator according to the first signal, converting the initial laser into modulated light in an S polarization state, and taking the modulated light in the S polarization state as the laser in the first polarization state.
The controlling the polarization conversion component 241 according to the second signal (taking an electro-optical modulator as an example) to perform polarization conversion on the initial laser light to obtain laser light in a second polarization state includes: and loading a specific voltage on the electro-optical modulator according to the second signal, converting the initial laser into modulated light in a P polarization state, and taking the modulated light in the P polarization state as the laser in the second polarization state.
The polarization conversion member 241 may be an electro-optical modulator, a half-wave plate fixed on the rotating motor, or the like selected from the prior art, and is not limited thereto.
The polarization conversion part 241 may be an electric light modulator selected from the prior art, and is not specifically limited by this example.
The polarization splitting prism 242 may select optical elements for separating horizontal polarization and vertical polarization of light from the prior art, and is not limited in detail.
In one embodiment, the initial laser has a wavelength of 300nm to 1100 nm;
the pulse repetition frequency of the initial laser is 1MHz to 10 MHz;
the pulse width of the initial laser is less than 50 ns. Thereby making the laser processing device suitable for most laser processing application scenarios.
In one embodiment, the first processing mechanism 31 includes a first galvanometer mirror 311, a first field lens 312;
the second processing mechanism 32 comprises a second scanning galvanometer 321 and a second field lens 322;
the first galvanometer scanner 311 is located between the optical path selection mechanism 20 and the first field lens 312;
the second scanning galvanometer 321 is located between the optical path selection mechanism 20 and the second field lens 322;
the controller is in communication connection with the first scanning galvanometer 311 and the second scanning galvanometer 321 to control the first scanning galvanometer 311 to perform processing scanning according to the first signal and control the second scanning galvanometer 321 to perform working scanning movement to perform processing scanning according to the second signal. The first processing mechanism 31 is adapted to an application scene needing scanning laser processing through the first scanning galvanometer 311, and the second processing mechanism 32 is adapted to an application scene needing scanning laser processing through the second scanning galvanometer 321; for example, the insulating layer of the back electric field of the cell is scribed and exposed out of the silicon substrate by scanning laser processing, which facilitates printing and sintering of the back electric field to form a good ohmic contact, and obviously improves electrical performance parameters of the cell, such as open-circuit voltage, cell efficiency, and the like, and the examples are not limited specifically. The machining beam output from the first machining means 31 is focused by the first field lens 312, and the machining beam output from the first machining means 31 is focused by the second field lens 322.
The first scanning galvanometer 311 and the second scanning galvanometer 321 may be scanning galvanometers selected from the prior art, which is not described herein again.
The first field lens 312 and the second field lens 322 may be field lenses selected from the prior art, which is not described herein.
In one embodiment, the first machining mechanism 31 further comprises a first beam expanding and collimating component 313;
the first expanded beam collimating component 313 is located between the optical path selecting mechanism 20 and the first galvanometer mirror 311, and is configured to expand and collimate the laser beam sent by the optical path selecting mechanism 20.
In one embodiment, the second machining mechanism 32 further comprises a second beam expanding and collimating component 323;
the second expanded beam collimating component 323 is located between the optical path selecting mechanism 20 and the second scanning galvanometer 321, and is configured to expand and collimate the laser beam sent by the optical path selecting mechanism 20.
The first beam expanding and collimating component 313 and the second beam expanding and collimating component 323 may be beam expanding collimators selected from the prior art, which is not described herein again.
In one embodiment, the first machining mechanism 31 further includes at least one third mirror 314;
the third reflecting mirror 314 is used to change the propagation direction of the laser light in the first processing mechanism 31. Thereby facilitating adjustment of the mounting position of the first processing mechanism 31.
In one embodiment, the second machining mechanism 32 further includes at least one fourth mirror 324;
the fourth mirror 324 is used to change the propagation direction of the laser light in the second processing mechanism 32. Thereby facilitating adjustment of the mounting position of the second processing mechanism 32.
The third reflector 314 and the fourth reflector 324 may be mirrors selected from the prior art, such as plane mirrors, which can reflect light, and the examples are not limited thereto.
In one embodiment, a laser machining apparatus is provided, the apparatus comprising at least one laser machining device as described in any one of the above.
The controller of the laser processing device of the laser processing equipment of the embodiment realizes acquiring a first signal, controls the optical path selection mechanism 20 to send the initial laser to the first processing mechanism 31 according to the first signal, controls the first processing mechanism 31 to perform laser processing according to the first signal, acquires a second signal, controls the optical path selection mechanism 20 to send the initial laser to the second processing mechanism 32 according to the second signal, and controls the second processing mechanism 32 to perform laser processing according to the second signal, so that the initial laser emitted by the laser 10 is used for the first processing mechanism 31 and the second processing mechanism 32 to perform laser processing in a time-sharing manner, the laser 10 does not need to wait for three processes of visual photographing positioning, loading and unloading, and the efficiency of laser processing is improved.
The laser processing equipment further comprises an equipment controller, and the equipment controller is used for controlling the work of the components of the laser processing equipment.
It is to be understood that the device controller and the controller of the laser processing apparatus may be provided separately, or the same controller may be used.
In one embodiment, a laser machining system is presented, the system comprising: at least one laser machining apparatus as described in any one of the preceding claims, or at least one laser machining apparatus as described above.
The controller of the laser processing device of the laser processing system of the embodiment realizes acquiring a first signal, controlling the optical path selection mechanism 20 to send the initial laser to the first processing mechanism 31 according to the first signal, controlling the first processing mechanism 31 to perform laser processing according to the first signal, acquiring a second signal, controlling the optical path selection mechanism 20 to send the initial laser to the second processing mechanism 32 according to the second signal, and controlling the second processing mechanism 32 to perform laser processing according to the second signal, thereby realizing that the initial laser emitted by the laser 10 is used for the first processing mechanism 31 and the second processing mechanism 32 to perform laser processing in a time-sharing manner, the laser 10 does not need to wait for three processes of visual photographing positioning, loading and unloading, and the efficiency of laser processing is improved.
The laser processing system further comprises a processing management module, and the processing management module is in communication connection with the laser processing device and is used for controlling the laser processing device to work.
The processing management module is implemented in the form of software, and can be loaded in a desktop computer or a server.
As shown in fig. 6, in one embodiment, a laser processing method is provided, which is applied to a laser processing apparatus including at least one laser processing device as described in any one of the above;
the method comprises the following steps:
s602, acquiring a processing signal, wherein the processing signal comprises a first signal and a second signal;
the software program in the controller of the laser processing device generates a processing signal according to a signal generation rule, or the controller of the laser processing device receives the processing signal sent by the equipment controller of the laser processing equipment.
The first signal and the second signal may be signals transmitted at time intervals or may be persistent signals, which is not specifically limited by this example.
It will be appreciated that the first signal and the second signal are not of the same value.
Optionally, the processing signal is a rectangular wave.
Optionally, when the first signal and the second signal are duration signals, a duration of the first signal may be the same as or different from a duration of the second signal, and is not limited herein.
Optionally, when the first signal and the second signal are signals transmitted at time intervals, a time interval between transmitting the first signal and transmitting the second signal may be the same as or different from a time interval between transmitting the second signal and transmitting the first signal, which is not limited herein.
S604, when the processing signal is a first signal, controlling the optical path selection mechanism to send the initial laser to the first processing mechanism according to the first signal, and controlling the first processing mechanism to perform laser processing;
the controller of the laser processing device controls the optical path selection mechanism to send the initial laser to the first processing mechanism according to the first signal, and controls the first processing mechanism to perform laser processing.
Optionally, the controller of the laser processing apparatus controls the optical path selection mechanism and the first processing mechanism to start working simultaneously according to the first signal.
Optionally, the time when the first processing mechanism starts to operate is later than the time when the optical path selection mechanism starts to operate.
Optionally, the time when the first processing mechanism finishes working is the same as the time when the optical path selection mechanism finishes working.
And S606, when the processing signal is a second signal, controlling the optical path selection mechanism to send the initial laser to the second processing mechanism according to the second signal, and controlling the second processing mechanism to perform laser processing.
And the controller of the laser processing device controls the optical path selection mechanism to send the initial laser to the second processing mechanism according to the second signal, and controls the second processing mechanism to perform laser processing.
Optionally, the controller of the laser processing apparatus controls the optical path selection mechanism and the second processing mechanism to start working simultaneously according to the second signal.
Optionally, the time when the second processing mechanism starts to work is later than the time when the optical path selection mechanism starts to select the optical path.
Optionally, the time when the second processing mechanism finishes working is the same as the time when the optical path selection mechanism finishes working.
According to the laser processing method, the first signal is obtained, the light path selection mechanism is controlled to send the initial laser to the first processing mechanism according to the first signal, the first processing mechanism is controlled to carry out laser processing according to the first signal, the second signal is obtained, the light path selection mechanism is controlled to send the initial laser to the second processing mechanism according to the second signal, and the second processing mechanism is controlled to carry out laser processing according to the second signal, so that the initial laser emitted by the laser is used for the first processing mechanism in a time-sharing mode, the second processing mechanism carries out laser processing, the laser does not need to wait for three procedures of visual photographing positioning, loading and unloading, the utilization rate of laser energy is improved, and the efficiency of laser processing is improved.
As shown in fig. 7, in one embodiment, the apparatus further comprises a gripping device, a first processing station, a second processing station;
s702, acquiring a processing signal, wherein the processing signal comprises a first signal and a second signal;
s704, when the machining signal is a first signal, controlling the light path selection mechanism to send the initial laser to the first machining mechanism according to the first signal, controlling the first machining mechanism to perform laser machining on the workpiece of the first machining station, and controlling the gripping device to sequentially perform workpiece blanking and workpiece loading on the second machining station;
the controller of the laser processing device controls the light path selection mechanism to send the initial laser to the first processing mechanism according to the first signal, controls the first processing mechanism to carry out laser processing on the workpiece of the first processing station, and controls the grabbing device to sequentially carry out workpiece discharging and workpiece feeding on the second processing station.
The workpiece is a product part in a manufacturing process.
The gripping device may be a manipulator selected from the prior art, which is not described in detail herein.
Optionally, the controller of the laser processing apparatus controls the optical path selecting mechanism, the first processing mechanism, and the grasping apparatus simultaneously according to the first signal.
Optionally, the time for the gripping device to start to sequentially perform workpiece blanking and workpiece loading on the second machining station is later than the starting time for the optical path selection mechanism to select the optical path according to the first signal.
Optionally, the time for the gripping device to start to sequentially perform workpiece blanking and workpiece loading on the second machining station is not later than the start time of the second signal.
Optionally, the first processing station is disposed directly below the first processing mechanism.
Optionally, the second processing station is disposed directly below the second processing mechanism.
Wherein, and control grabbing device is right after work piece unloading and work piece material loading are carried out in proper order to the second machining station, still include: and the controller of the laser processing device controls the second processing mechanism to position and align the workpiece.
The second machining mechanism further comprises a second visual positioning component; the controller is in communication connection with the second visual positioning component to control the second visual positioning component to position and align the workpiece.
The second visual positioning component may be a camera selected from the prior art, and is not specifically limited by way of example.
S706, when the processing signal is a second signal, controlling the light path selection mechanism to send the initial laser to the second processing mechanism according to the second signal, controlling the second processing mechanism to carry out laser processing on the workpiece of the second processing station, and controlling the gripping device to carry out workpiece discharging and workpiece feeding on the first processing station in sequence.
The controller of the laser processing device controls the light path selection mechanism to send the initial laser to the second processing mechanism according to the second signal, controls the second processing mechanism to carry out laser processing on the workpiece of the second processing station, and controls the grabbing device to sequentially carry out workpiece discharging and workpiece feeding on the first processing station.
Optionally, the controller of the laser processing apparatus controls the light path selecting mechanism, the second processing mechanism, and the grasping apparatus simultaneously according to the second signal.
Optionally, the time for the gripping device to start to sequentially perform workpiece blanking and workpiece loading on the first processing station is later than the starting time for the optical path selection mechanism to select the optical path according to the second signal.
Optionally, the time for the gripping device to start the workpiece blanking and the workpiece loading in sequence on the first processing station is not later than the start time of the first signal.
Wherein and control grabbing device is right after work piece unloading and work piece material loading are carried out in proper order to first processing station, still include: and the controller of the laser processing device controls the first processing mechanism to position and align the workpiece, and controls the first processing mechanism to carry out laser processing on the workpiece.
The first processing mechanism further comprises a first visual positioning component; the controller is in communication connection with the first visual positioning component to control the first visual positioning component to position and align the workpiece.
The first visual positioning component may be a camera selected from the prior art, and is not specifically limited by this example.
FIG. 8 shows a pulse timing diagram of a laser machining method, the machining signal being shown in curve 4; when a controller of the laser processing device acquires a first signal, the laser is synchronously controlled to emit initial laser and scan by a first scanning galvanometer (refer to curve 2), so that the initial laser emitted by the laser enters a first processing mechanism through a light path selection mechanism in a time period of t1, meanwhile, a gripping device is controlled to sequentially perform workpiece blanking and workpiece loading on a second processing station, and the laser is controlled to pause to emit the initial laser after the processing is finished; when the controller of the laser processing device acquires a second signal, the laser is synchronously controlled to emit initial laser and scan a second scanning galvanometer (refer to curve 3), so that the initial laser emitted by the laser enters a second processing mechanism through a light path selection mechanism in a time period of t2, meanwhile, the grabbing device is controlled to sequentially perform workpiece blanking and workpiece loading on the first processing station, and the laser is controlled to pause to emit the initial laser after the processing is completed; the above processes are circulated, so that the processing of two samples can be completed at one time in the same working process, the processing efficiency is improved by two times, and the utilization rate of laser energy is improved.
It should be noted that, the above-mentioned laser processing device, laser processing apparatus, laser processing system and laser processing method belong to a general inventive concept, and the contents in the embodiments of a laser processing device, a laser processing apparatus, a laser processing system and a laser processing method are mutually applicable.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention, and it is therefore to be understood that the invention is not limited by the scope of the appended claims.
Claims (11)
1. A laser processing apparatus, characterized in that the apparatus comprises: the device comprises a laser, a light path selection mechanism, a first processing mechanism, a second processing mechanism and a controller;
the optical path selection mechanism is arranged between the laser and the first processing mechanism and the second processing mechanism;
the laser is used for emitting initial laser;
the controller is used for being in communication connection with the light path selection mechanism, the first processing mechanism and the second processing mechanism so as to obtain a first signal, controlling the light path selection mechanism to send the initial laser to the first processing mechanism according to the first signal, and controlling the first processing mechanism to perform laser processing according to the first signal;
the controller is further configured to acquire a second signal, control the optical path selection mechanism to send the initial laser to the second processing mechanism according to the second signal, and control the second processing mechanism to perform laser processing according to the second signal.
2. The apparatus of claim 1, wherein the optical path selection mechanism comprises a first mirror, a telescopic member;
the first reflector is connected with the telescopic component;
the controller is in communication connection with the telescopic component so as to control the telescopic component to do telescopic motion according to the first signal and control the telescopic component to do telescopic motion according to the second signal;
the telescopic component drives the first reflector to be close to the initial laser and reflect the initial laser to the first processing mechanism, and the telescopic component drives the first reflector to be far away from the initial laser so that the laser is directly injected into the second processing mechanism.
3. The apparatus of claim 1, wherein the optical path selection mechanism further comprises a second mirror, a rotating member;
the second reflector is connected with the rotating component;
the controller is in communication connection with the rotating component so as to control the rotating component to drive the second reflector to rotate to a first position according to the first signal and control the rotating component to drive the second reflector to rotate to a second position according to the second signal;
wherein the second mirror reflects the initial laser light to the first processing mechanism when the second mirror is in the first position and reflects the initial laser light to the second processing mechanism when the second mirror is in the second position.
4. The apparatus of claim 1, wherein the optical path selection mechanism further comprises an acousto-optic deflection member;
the controller is in communication connection with the acousto-optic deflection component to control the acousto-optic deflection component to diffract the initial laser to enter the first processing mechanism according to the first signal, and control the acousto-optic deflection component to diffract the initial laser to enter the second processing mechanism according to the second signal.
5. The apparatus of claim 1, wherein the optical path selection mechanism further comprises a polarization conversion member, a polarization splitting prism;
the controller is in communication connection with the polarization conversion component to control the polarization conversion component to perform polarization conversion on the initial laser according to the first signal to obtain laser in a first polarization state, and control the polarization conversion component to perform polarization conversion on the initial laser according to the second signal to obtain laser in a second polarization state;
the polarization beam splitter prism is used for reflecting the laser in the first polarization state to the first processing mechanism and transmitting the laser in the second polarization state to the second processing mechanism.
6. The apparatus of any of claims 1 to 5, wherein the initial laser light has a wavelength of 300nm to 1100 nm;
the pulse repetition frequency of the initial laser is 1MHz to 10 MHz;
the pulse width of the initial laser is less than 50 ns.
7. The apparatus according to any one of claims 1 to 5, wherein the first processing means comprises a first galvanometer scanner, a first field lens;
the second processing mechanism comprises a second scanning galvanometer and a second field lens;
the first scanning galvanometer is positioned between the light path selection mechanism and the first field lens;
the second scanning galvanometer is positioned between the light path selection mechanism and the second field lens;
the controller is in communication connection with the first scanning galvanometer and the second scanning galvanometer so as to control the first scanning galvanometer to carry out processing scanning according to the first signal and control the second scanning galvanometer to carry out processing scanning according to the second signal.
8. A laser machining apparatus, characterized in that the apparatus comprises at least one laser machining device according to any one of claims 1 to 7.
9. A laser machining system, characterized in that the system comprises: at least one laser machining device according to any one of claims 1 to 7, or at least one laser machining apparatus according to claim 8.
10. A laser processing method applied to a laser processing apparatus including at least one laser processing device according to any one of claims 1 to 7;
the method comprises the following steps:
acquiring a processing signal, wherein the processing signal comprises a first signal and a second signal;
when the processing signal is a first signal, controlling the optical path selection mechanism to send the initial laser to the first processing mechanism according to the first signal, and controlling the first processing mechanism to perform laser processing;
and when the processing signal is a second signal, controlling the optical path selection mechanism to send the initial laser to the second processing mechanism according to the second signal, and controlling the second processing mechanism to perform laser processing.
11. The method of claim 10, wherein the apparatus further comprises a grasping device, a first processing station, a second processing station;
when the processing signal is a first signal, controlling the optical path selection mechanism to send the initial laser to the first processing mechanism according to the first signal, and controlling the first processing mechanism to perform laser processing, including:
when the processing signal is a first signal, controlling the light path selection mechanism to send the initial laser to the first processing mechanism according to the first signal, controlling the first processing mechanism to carry out laser processing on the workpiece of the first processing station, and controlling the gripping device to carry out workpiece blanking and workpiece loading on the second processing station in sequence;
when the processing signal is a second signal, controlling the optical path selection mechanism to send the initial laser to the second processing mechanism according to the second signal, and controlling the second processing mechanism to perform laser processing, including:
when the processing signal is a second signal, the light path selection mechanism is controlled to send the initial laser to the second processing mechanism according to the second signal, the second processing mechanism is controlled to carry out laser processing on the workpiece of the second processing station, and the grabbing device is controlled to sequentially carry out workpiece discharging and workpiece feeding on the first processing station.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010533864.5A CN111922511A (en) | 2020-06-12 | 2020-06-12 | Laser processing device, processing equipment, processing system and processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010533864.5A CN111922511A (en) | 2020-06-12 | 2020-06-12 | Laser processing device, processing equipment, processing system and processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111922511A true CN111922511A (en) | 2020-11-13 |
Family
ID=73317413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010533864.5A Pending CN111922511A (en) | 2020-06-12 | 2020-06-12 | Laser processing device, processing equipment, processing system and processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111922511A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114951975A (en) * | 2022-05-31 | 2022-08-30 | 苏州科韵激光科技有限公司 | Laser processing apparatus and method |
| CN116329769A (en) * | 2023-05-29 | 2023-06-27 | 上海凯来仪器有限公司 | Laser ablation laser ionization device, method and mass spectrometer |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1675020A (en) * | 2002-08-09 | 2005-09-28 | Tdk株式会社 | Laser processing device, processing method, and method of producing circuit substrate using the method |
| CN102520525A (en) * | 2011-11-14 | 2012-06-27 | 镭射谷科技(深圳)有限公司 | Light beam converting device and laser processing equipment using the same |
| CN203076785U (en) * | 2012-12-25 | 2013-07-24 | 武汉帝尔激光科技有限公司 | Time sharing light splitting system |
| CN104475971A (en) * | 2014-11-04 | 2015-04-01 | 龚传波 | Beam splitting laser multi-station time sharing cutting machine and machining method |
| CN204381660U (en) * | 2014-12-16 | 2015-06-10 | 上海胜容机械技术有限公司 | The small-sized Splicing welding machine of line before and after robot material loading |
| CN104801852A (en) * | 2015-04-17 | 2015-07-29 | 温州大学 | Beam splitting double-focus-point laser processing head |
| CN105005149A (en) * | 2015-08-10 | 2015-10-28 | 武汉华工激光工程有限责任公司 | Apparatus for carrying out light splitting on linear polarization laser and marking control |
| CN108941900A (en) * | 2018-09-30 | 2018-12-07 | 武汉帝尔激光科技股份有限公司 | Laser splitting device and double-station laser process equipment and method |
-
2020
- 2020-06-12 CN CN202010533864.5A patent/CN111922511A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1675020A (en) * | 2002-08-09 | 2005-09-28 | Tdk株式会社 | Laser processing device, processing method, and method of producing circuit substrate using the method |
| CN102520525A (en) * | 2011-11-14 | 2012-06-27 | 镭射谷科技(深圳)有限公司 | Light beam converting device and laser processing equipment using the same |
| CN203076785U (en) * | 2012-12-25 | 2013-07-24 | 武汉帝尔激光科技有限公司 | Time sharing light splitting system |
| CN104475971A (en) * | 2014-11-04 | 2015-04-01 | 龚传波 | Beam splitting laser multi-station time sharing cutting machine and machining method |
| CN204381660U (en) * | 2014-12-16 | 2015-06-10 | 上海胜容机械技术有限公司 | The small-sized Splicing welding machine of line before and after robot material loading |
| CN104801852A (en) * | 2015-04-17 | 2015-07-29 | 温州大学 | Beam splitting double-focus-point laser processing head |
| CN105005149A (en) * | 2015-08-10 | 2015-10-28 | 武汉华工激光工程有限责任公司 | Apparatus for carrying out light splitting on linear polarization laser and marking control |
| CN108941900A (en) * | 2018-09-30 | 2018-12-07 | 武汉帝尔激光科技股份有限公司 | Laser splitting device and double-station laser process equipment and method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114951975A (en) * | 2022-05-31 | 2022-08-30 | 苏州科韵激光科技有限公司 | Laser processing apparatus and method |
| CN116329769A (en) * | 2023-05-29 | 2023-06-27 | 上海凯来仪器有限公司 | Laser ablation laser ionization device, method and mass spectrometer |
| CN116329769B (en) * | 2023-05-29 | 2023-08-04 | 上海凯来仪器有限公司 | Laser ablation laser ionization device, method and mass spectrometer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111922511A (en) | Laser processing device, processing equipment, processing system and processing method | |
| US20050224469A1 (en) | Efficient micro-machining apparatus and method employing multiple laser beams | |
| US4927226A (en) | Multiplexer for high power CW lasers | |
| EP1031396A1 (en) | Laser processing apparatus and method | |
| JP2003053576A (en) | Method and device for laser beam machining | |
| US11571767B2 (en) | Laser processing device and laser processing method | |
| CN108581182A (en) | Laser processing device and method | |
| TW202216333A (en) | Method and apparatus for laser drilling blind vias | |
| US20120051376A1 (en) | System and method for laser modulation | |
| KR20230113530A (en) | Optical Relay Systems and How to Use and Manufacture | |
| CN109513927A (en) | A kind of high-power part forming device of SLM and manufacturing process | |
| CN113579468A (en) | Linear array type laser 3D printing device and method | |
| JP3463281B2 (en) | Multi-axis laser processing apparatus and laser processing method | |
| JP2023525724A (en) | Laser processing apparatus and method of operating same to facilitate directed inspection of laser processed workpieces | |
| JP2003048093A (en) | Device and method for laser beam machining | |
| CN109901301B (en) | Laser beam combining device | |
| JP2018094582A (en) | Laser processing device and laser processing method | |
| JPH11347756A (en) | Device and method for removing burr | |
| JP4647576B2 (en) | Laser processing apparatus and laser processing method | |
| KR101392982B1 (en) | Apparatus and method for controlling scanner | |
| CN115319278A (en) | Wafer laser de-bonding system and method based on two-dimensional acousto-optic deflector | |
| CN114101701A (en) | Multi-beam additive manufacturing method | |
| WO2022164465A1 (en) | Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same | |
| JP2004167545A (en) | Multi-axes laser beam machining apparatus and machining method | |
| JP2010066702A (en) | Method and apparatus for laser beam scanning |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201113 |