JPH11347756A - Device and method for removing burr - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the device and method for removing burrs by which resin burrs can be sufficiently removed. SOLUTION: A laser beam burr removing device 100 is composed of laser beam oscillator 1 outputting a second harmonic wave YAG laser beam 11, laser beam optical system 2 leading the laser beam 11 to a target position, XY stage 3 holding an IC frame 8, observing optical system 4 observing the IC frame 8 and the land surface of an IC tip equipped by the IC frame 8, image processor 5 transferring the arrangement position of the IC frame 8 and the presence or the absence of the attachment of the resin burrs to the land surface in before and after irradiation by the laser beam to a sequencer 6 according to a picture signal from the observing optical system 4, sequencer 6 moving the XY stage by a prescribed distance according to the arrangement position of the IC frame 8, which has been transferred from the image processor 5 and indicating the removal of the resin burrs to a controller 7 when the resin burrs have been attached to the land surface, and the controller 7 controlling and driving the laser beam oscillator 1 and the laser beam optical system 2 and scanning a second harmonic YAG laser beam.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an apparatus and a method for removing resin burrs using a laser.

[0002]

2. Description of the Related Art A BGA (Ball Grid) having a solder ball on an electrode land surface provided on the back surface of an IC chip.
In an Array type IC chip, when the resin is sealed, the resin may overflow from the mold and resin burrs may adhere to the electrode land surface. Therefore, there is a problem that it is difficult to fix the solder ball to the electrode land surface.

In order to solve such a problem, attempts have been made to remove resin burrs using a chemical, a water jet, a YAG laser, a fourth harmonic YAG laser, an excimer laser, a CO ₂ laser, or the like. Has been put to practical use.

However, in the case of removing resin burrs with a chemical, there is a problem that when the chemical adheres to the mold resin portion, it adversely affects the mold portion.

In the case of using a water jet, it is necessary to remove the resin burrs, so that it is difficult to remove the resin burrs when the resin burrs adhere to the entire land surface. There is.

A laser deburring apparatus using a laser beam such as a YAG laser, a fourth harmonic YAG laser, an excimer laser, and a CO ₂ laser has the following problems.

Since the YAG laser is hardly absorbed by resin burrs, it is difficult to remove the resin burrs. Since the laser beam of the fourth harmonic YAG laser has a low output, it takes a long time to remove resin burrs. Further, Japanese Utility Model Publication No. Hei 1-87578 discloses a technique of scanning a second harmonic of a YAG laser to remove a conductive paste that forms a defective portion of a circuit pattern. This is a technique for removing unnecessary conductive paste on an unfired ceramic substrate, and is completely different from a technique for removing resin burrs on electrodes.

In the excimer laser, it is difficult to efficiently focus the laser beam on the electrode land surface, and the processing cost increases.

Since the laser beam of the CO ₂ laser has a long wavelength, it is processed by heat, and after the processing, carbides of resin burrs remain on the electrode land surface.

[0010]

Due to these problems, when removing resin burrs, solder balls may be attached to the electrode lands with carbides or resin burrs attached (remaining). there were. For this reason, it has been difficult to securely attach the solder ball to the electrode land surface.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a deburring apparatus and a deburring method capable of removing resin burrs.

[0012]

In order to achieve the above object, a deburring apparatus according to a first aspect of the present invention comprises a holding table on which a workpiece to which a resin burr is attached is placed, and a second harmonic generator. A laser source that outputs a laser beam of a wave YAG laser, and a laser optical system that guides the laser beam from the laser source to the workpiece.
By irradiating a laser beam of a laser beam to resin burrs attached to the object to be processed, removing resin burrs,
It is characterized by.

According to such a configuration, the laser beam of the second harmonic YAG laser output from the laser source is guided by the laser optical system to the resin burr adhered to the workpiece mounted on the holding table. Irradiate resin burrs. The resin burrs irradiated by the laser beam are decomposed and removed from the object to be processed. Therefore, it is possible to remove the resin burrs in a short time without leaving any carbide after removing the resin burrs.

The deburring device further includes a control device, wherein the holding table mounts a plurality of objects to be processed, and the control device irradiates the resin burr with a laser beam.
Observe whether or not resin burrs are attached to the processing object irradiated with the laser beam.If not, observe whether or not resin burrs are attached to the next processing object. When burrs are attached, it is desirable to control the laser optical system and the laser oscillator so that the resin burrs are irradiated with a laser beam.

Further, when the control device determines from observation after irradiating the laser beam that the resin burr is attached to the object to be processed, the control device re-irradiates the resin burr with the laser beam. It is desirable to control the laser optical system and the laser oscillator.

Further, the control device is configured to previously store an image of the object to be processed without resin burrs attached thereto, and to store the image of the object to be processed obtained by the observation and the storage unit. Means for comparing the image of the processing object in a state where the resin burr is not attached to the processing object to determine whether the resin burr is attached to the processing object.

According to such a deburring device, the control device obtains, by irradiating the resin burr with the laser beam, an image of the processing object in a state where the resin burr is not adhered beforehand and an observation. The image of the processed object is compared with the image of the processed object, and it is observed whether or not resin burrs are attached to the processed object. When the control device determines from the observation that resin burrs are not attached to the processing object, the control device observes whether or not resin burrs are attached to other processing objects, and determines that the resin burr is attached. Then, the resin beam is irradiated again to remove the resin burr. Therefore, even when the resin burr is not sufficiently removed by the laser beam irradiation, the resin burr can be removed by re-irradiating the laser beam.

The laser optical system includes a scanning pattern storage unit that stores a predetermined scanning pattern, and a scanning unit that scans the laser beam on the workpiece in accordance with the scanning pattern stored in the scanning pattern storage unit. May be provided.

[0019] The laser optical system may further include means for registering a scanning pattern in the scanning pattern storage means.

Further, the scanning means includes a selection means for selecting one of the plurality of scanning patterns stored in the scanning pattern storage means, and a means for scanning a laser beam in accordance with the scanning pattern selected by the selection means. May be provided.

Furthermore, the laser optical system adjusts the diameter of the laser beam from the laser source according to the size of the object, and irradiates the object with the laser beam whose diameter has been adjusted. Means.

According to such a configuration, the user registers the scanning pattern in the scanning pattern storage means according to the shape of the object to be processed. The scanning means scans a laser beam on the workpiece according to the operation pattern stored in the scanning pattern storage means. Therefore, it is possible to efficiently scan the laser beam according to the shape of the processing target.

Preferably, the object to be processed is made of metal.

Preferably, the object to be processed is a land surface of an electrode of a semiconductor chip.

According to such a deburring apparatus, resin burrs attached to the electrode land surface can be efficiently removed. Further, since the base is made of metal, there is no possibility that the base is damaged. Further, since the wavelength of the laser is short, the resin burr receiving the laser beam 11 is not processed by heat but is decomposed and removed, so that the carbide can be prevented from adhering to the land surface.

In order to achieve the above object, a burr removing method according to a second aspect of the present invention is directed to a burr removing method for removing resin burr adhering to a workpiece, wherein the burr removing method comprises the steps of: An irradiation step of irradiating a second harmonic YAG laser thereto.

According to such a deburring method, in the irradiation step, the laser beam of the second harmonic YAG laser is applied to the resin burr adhering to the workpiece. The resin burr irradiated with the laser beam is decomposed and removed from the object to be processed. Therefore, it is possible to remove the resin burrs in a short time without leaving any carbide after removing the resin burrs.

In the irradiating step, after irradiating the laser, a discriminating step for discriminating whether or not the resin burr remains, and when the discriminating step discriminates that the resin burr remains adhered, And a re-irradiation step of irradiating the laser again to the resin burr.

According to such a burr removing method, in the determining step, after the resin burr is irradiated with the laser beam, it is determined whether or not the resin burr has adhered to the object to be processed, and the resin burr is remaining attached. If it is determined that the resin burr is present, the resin burr is irradiated again with the laser beam to remove the resin burr. Therefore, even if the resin burrs attached to the object to be processed by the laser beam irradiation are not sufficiently removed, the resin burrs can be removed by irradiating the laser beam again.

[0030]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a laser deburring apparatus 100 according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 shows a laser deburring apparatus 10 according to a first embodiment.
FIG. 2 is a plan view showing an IC frame 8 to be processed by the laser deburring apparatus 100 and an IC chip 81 provided in the IC frame 8.

The laser deburring apparatus 100 according to the first embodiment is, for example, a BGA (Ball Grid) disposed at a predetermined interval on the IC frame 8 shown in FIG.
This is for removing resin burrs adhered to land surfaces (electrode terminals) 811 of Array type IC chips 81 to 85 using a second harmonic YAG laser. The resin burrs are burrs formed when a molding resin such as an epoxy resin adheres to the land surface 811 or the like when the IC chip is molded.

As shown in FIG. 1, the laser deburring apparatus 100 includes a laser oscillator 1 for generating a second harmonic YAG laser, a laser optical system 2 for guiding the second harmonic YAG laser to a target position, and an IC frame. The XY stage 3 holding the XY stage 3, the observation optical system 4 for observing the IC frame 8 on the XY stage 3, the position of the IC frame 8, and the adhesion state of the resin burrs on the land surfaces 811 of the IC chips 81 to 85 ) To the sequencer 6, a sequencer 6 for controlling and driving the XY stage 3 and the controller 7, a laser oscillator 1, and a laser optical system 2.
And a control device 7 for controlling and driving the above.

The laser oscillator 1 is provided with a YAG rod having Y ₂ AL ₅ O ₁₂ as a crystal matrix, and a harmonic crystal made of a crystal such as LiNbO ₃ or Ba ₂ NaNb ₅ O _15. According to the output instruction signal of the device 7,
Start output of a YAG laser having a fundamental wavelength of 1.06 μm,
The wavelength of this YAG laser is converted by a harmonic crystal, and a second harmonic YAG laser (laser beam) 11 having a wavelength of 532 nm is generated and output.

The laser optical system 2 includes a plurality of folding mirrors 21 for reflecting the laser beam 11 emitted from the laser oscillator 1 in a predetermined direction, a beam expander 22 for expanding the diameter of the laser beam 11, and a polarization of the laser beam 11. A λ / 4 plate 23 for eliminating the directionality of the direction, a galvano mirror 24 for reflecting the laser beam 11 to a target position, and a condenser lens 25 for condensing the laser beam 11 are provided. The galvanomirror 24 is driven under the control of the control device 7, and irradiates the laser beam 11 to a target position.

The XY stage 3 places the IC frame 8 to be processed, a positioning signal output from the sequencer 6 for instructing positioning of the IC frame 8 to a target position, and a movement for instructing horizontal movement by a predetermined distance. The IC frame 8 is moved in the horizontal direction according to the signal.

The observation optical system 4 is an IC on the XY stage 3.
The digital camera includes a digital camera that captures an image of the frame 8 and outputs an image signal to the image processing device 5 and the display device, and a display device that displays an image acquired by the digital camera.

The image processing device 5 compares the actual position of the IC frame 8 with the reference position based on the normal position (reference position) of the IC frame 8 previously stored in the internal memory and the image signal supplied from the camera. A position shift signal indicating the amount of shift between the X direction and the Y direction is output to the sequencer 6. Further, the image processing device 5 responds to the state determination signal supplied from the sequencer 6 and, in response to the image of the normal land surface (the land surface on which the resin burr does not adhere) stored in the internal memory, and the observation optical system 4. And outputs a burr state signal to the sequencer 6 indicating whether or not resin burrs are adhered to the land surface indicated by the image signal supplied from the printer.

The sequencer 6 outputs a positioning signal indicating the amount of movement of the XY stage 3 in the X and Y directions to the XY stage 3 based on the position shift signal supplied from the image processing device 5. Further, the sequencer 6 transmits a state determination signal to the image processing apparatus 5, and the burr state signal supplied from the image processing apparatus 5 in response to the state determination signal indicates that the resin burr is attached to the target land surface. Signal, the controller 7 sends a removal signal instructing removal of the resin burr.
If it is determined that the object is not attached, a positioning signal is transmitted to the XY stage in order to move the processing target to the next land portion.

The control device 7 includes a computer (hereinafter, a personal computer) 71 equipped with marker software, a marker controller 72, and a galvano driver 73, and controls and drives the galvanometer mirror 24 and the laser oscillator 1.

The personal computer 71 includes a communication unit, an input unit, and a storage unit, and scans the scanning data indicating the scanning order of the laser beam 11 with marker software (generally, sets the scanning order of a laser beam for laser processing and scans the data). The program is set in advance using a program that performs The scanning data indicates, for example, a scanning order such as a raster shape 711, an arc shape 712, and a spiral shape 713 that irradiate a laser beam on the land surface 811 in the direction of the arrow, as shown in FIG. 3. In response to the removal signal from the sequencer 6, the personal computer 71 outputs to the marker controller 72 a scanning control signal for instructing the irradiation order of the laser beam 11 on the land surface based on the scanning data.

The marker controller 72 includes a personal computer 71
Laser beam 1 based on the scanning control signal supplied from
A drive signal for driving the galvanomirror 24 is output to the galvano driver 73 so that the laser beam 1 is scanned along the route defined by the scan data, and an output control signal for instructing the output of the laser beam is output to the laser oscillator 1. Output.

The galvano driver 73 operates the galvanometer mirror 24 in accordance with the drive signal supplied from the marker controller 72.

Next, the operation of the laser deburring apparatus 100 according to this embodiment will be described.

The transfer robot and the like are placed on the XY stage 3,
For example, the IC frame 8 shown in FIG. 2 is placed. The camera of the observation optical system 4 is an IC mounted on the XY stage 3.
The frame 8 is photographed, and the image signal is output to the image processing device 5.

The image processing device 5 obtains the position of the IC frame 8 on the XY stage from the image signal, compares it with the normal position of the IC frame 8 stored in advance, and obtains the deviation in each of the X and Y directions. , And transmits a position shift signal indicating the obtained shift (deviation) to the sequencer 6. The amount of positional deviation can be determined, for example, by determining the amount of deviation between a positioning mark formed on the IC chip and the reference position.

The sequencer 6 operates according to the displacement signal.
A movement signal is transmitted to the XY stage 3 to adjust the displacement. The XY stage 3 horizontally moves in the X and Y directions based on the movement signal, and arranges the IC frame 8 at a target position.

The image processing device 5 determines again whether or not the IC frame 8 is located at the target position based on the output image of the observation optical system 4, and determines that the IC frame 8 is not located at the target position. Sequencer 6
And the XY stage is finely adjusted again, and the same operation is repeated until the target position is reached. IC frame 8
Is determined at the target position, the image of the normal land surface stored in advance is compared with the image of the land surface output by the observation optical system 4 to determine whether resin burrs are attached to the land surface. Is transmitted to the sequencer 6. For example, the image processing device 5 performs pattern matching between the image of the normal land surface stored in advance and the image of the land surface output by the interpolating optical system 4. For example, when the matching degree is 90% or more, A burr state signal indicating that no resin burr is present, otherwise outputting a burr state signal indicating that the resin burr is attached.

The sequencer 6 determines whether or not resin burrs are attached to the target land surface based on the received burr state signal. A removal signal instructing removal of the PC 7
Send to 1.

In response to the removal signal, the personal computer 71 sets the laser beam 1 based on the previously input scanning data.
A scanning control signal indicating the first irradiation pattern is transmitted to the marker controller 72. The marker controller 72 outputs a drive control signal for controlling the operation of the galvanometer mirror 24 to the galvano driver 73 based on the scanning control signal, and transmits an output instruction signal for instructing the output start of the laser beam 11 to the laser oscillator 1. I do. The galvanometer driver 73 drives the galvanometer mirror 24 according to the drive control signal.

In response to the output instruction signal, the laser oscillator 1
Converts the wavelength of the laser beam 11 of the YAG laser by the harmonic crystal, and generates the laser beam 11 of the second harmonic YAG laser.

The laser beam 11 is reflected by the folding mirror 21
Is guided to the beam expander 22, the beam diameter is expanded by the beam expander 22, and the λ / 4 plate 2
To 3. The laser beam 11 is converted from linearly polarized light into circularly polarized light by the λ / 4 plate 23, and guided to the galvano mirror 24 by the return mirror 21.

The galvanometer mirror 24 scans the laser beam 11 by driving the galvanometer driver 73. The laser beam 11 scanned by the galvanomirror 24 is condensed by a condenser lens 25, irradiated on a target land surface, and scanned in a pattern as shown in FIG.

The resin burrs attached to the land surface are decomposed and removed from the land surface when irradiated with the laser beam.

When the scanning by the laser beam 11 is completed, the image processing device 5 compares the image of the normal land surface stored in advance with the image of the land surface indicated by the image signal from the observation optical system 4, and A burr state signal indicating the presence or absence of a burr is transmitted to the sequencer 6.

The sequencer 6, which has received the burr state signal,
It is determined whether resin burrs are attached to the land surface. If it is determined that resin burrs are attached to the land surface, a removal signal instructing removal of the resin burr is output to the control device 7 again.

The control device 7 having received the removal signal controls and drives the laser oscillator 1 and the galvanomirror 24,
The resin burr adhering to the land surface is removed again.

When the sequencer 6 determines that no resin burr is attached to the land surface, the sequencer 6 outputs a land surface switching signal to the control device 7.

The control device 7 responds to the land surface switching signal.
Performs the same processing as described above on the land surface in the next order in accordance with the order stored in advance to remove resin burrs.

When the sequencer 6 finishes removing the resin burrs on all the land surfaces of one IC chip, it outputs a movement signal to the XY stage 3 to move the XY stage 3 horizontally by a predetermined distance, and The IC chip 82 to be processed is located in the observation range of the observation optical system 4, and subsequently,
The resin burr is removed by the laser burr removing device 100.

As described above, the laser deburring apparatus 100 removes resin burrs by scanning the land surface of the IC chip 81 with the second harmonic YAG laser. The second harmonic YAG laser has a high resin absorptance and can efficiently remove resin burrs. Further, since the base is made of metal, there is no possibility that the base is damaged. Further, since the wavelength of the laser is short, the resin burr receiving the laser beam 11 is not processed by heat but is decomposed and removed, so that the carbide can be prevented from adhering to the land surface.

Further, even if the resin burr cannot be completely removed by the first scanning of the laser beam 11, if the resin remains on the land surface, the laser beam 11 is scanned again. Can be almost completely removed. Therefore, solder balls can be more easily attached to the land surface, and the yield of IC chips can be increased. Further, a relatively small capacity laser oscillator (laser source) can be used.

Laser deburring apparatus 1 according to this embodiment
In No. 00, the laser beam 11 was scanned on the land surface to remove resin burrs adhering to the land surface. However, the present invention is not limited to this configuration.
Any configuration capable of removing resin burrs by irradiating a G laser can be employed.

For example, the laser deburring apparatus 2 shown in FIG.
As in the case of 00, the entire land surface to be processed may be irradiated with laser.

The laser deburring apparatus 200 has substantially the same configuration as the laser deburring apparatus 100 shown in FIG. However, the laser deburring apparatus 200 includes a circular mask instead of the λ / 4 plate. The circular mask 26 has a hole slightly larger than the shape of the land surface.
The diameter of the laser beam 11 that has passed through 6 becomes almost the same as that of the hole.

Hereinafter, the operation of the laser deburring apparatus 200 will be described. The laser oscillator 1 converts the wavelength of the laser beam 11 of the YAG laser by using the crystal for harmonics, and generates the laser beam 11 of the second harmonic YAG laser.

The laser beam 11 is reflected by the folding mirror 21
The beam is expanded by the beam expander 22, and the beam diameter is expanded by the beam expander 22 to reach the circular mask 26. The diameter of the laser beam 11 is narrowed down to a diameter slightly larger than the land surface by the circular mask 26, and is guided to the galvano mirror 24 by the return mirror 21.

The galvanometer mirror 24 guides the laser beam 11 to a target land surface in accordance with the driving of the galvanometer driver 73. The laser beam 11 guided to the galvanomirror 24 is condensed by the condensing lens 25 so as to have substantially the same diameter as the land surface, and is irradiated on the target land surface.

The resin burrs attached to the land surface are decomposed and removed from the land surface when irradiated with the laser beam.

According to such a configuration, the laser beam 1
It is not necessary to scan 1 and control for resin burr is easy.

In the configuration of FIG. 1, the scan data for specifying a predetermined scan pattern is stored in the personal computer 71. For example, the scan data for specifying a plurality of scan patterns is stored in the personal computer 71. According to the shape and size of the land surface to be processed, arbitrary scanning data may be selected from, for example, a keyboard or the like.
According to such a configuration, it is possible to quickly and easily select a process according to a land surface to be processed. further,
The processing object is not limited to the land surface of the metal electrode of the BGA type IC chip, and can be used for removing various burrs to which resin burrs adhere. Further, the configuration for guiding the laser to the object to be processed is not limited to the configuration shown in FIG. 1 or FIG. 4, and any configuration can be adopted.

[0071]

As described above, according to the laser deburring apparatus of the present invention, the resin burr is irradiated with the second harmonic YAG laser, so that the resin burr can be appropriately removed.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a laser deburring apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view showing an IC chip to be processed by the laser deburring apparatus of FIG. 1 and an IC frame provided with the IC chip.

FIG. 3 is a plan view showing scanning data of the laser deburring apparatus of FIG. 1;

FIG. 4 is a configuration diagram showing a modified example of the laser deburring apparatus according to the embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Laser oscillator 11 YAG laser (laser beam) 2 Laser optical system 21 Folding mirror 22 Beam expander 23 λ / 4 plate 24 Galvano mirror 25 Condensing lens 26 Circular mask 3 XY stage 4 Observation optical system 5 Image processing device 6 Sequencer 7 Control device 71 Personal computer 711 Scan data 712 Scan data 713 Scan data 72 Marker controller 73 Galvano driver 8 IC frame 81 IC chip 82 IC chip 83 IC chip 84 IC chip 85 IC chip 811 Land surface 100 Laser deburring device 200 Laser deburring device

──────────────────────────────────────────────────続 き Continued on front page (51) Int.Cl. ⁶ Identification code FI // B29L 31:34

Claims (12)

[Claims] 1. A holding table on which a workpiece to which resin burrs adhere is placed, a laser source for outputting a laser beam of a second harmonic YAG laser, and a laser beam from the laser source for the workpiece. A laser optical system that guides the laser beam to the processing object, and irradiating a laser beam of the second harmonic YAG laser to a resin burr adhered to the object to be processed, thereby removing the resin burr. . 2. The apparatus according to claim 1, further comprising a control device, wherein the holding table mounts a plurality of processing objects, and the control device irradiates the resin burrs with a laser beam and then irradiates the processing object with the laser beam. Observe whether resin burrs are attached to the object, if not, observe whether resin burrs are attached to the next workpiece, and if resin burrs are attached The deburring apparatus according to claim 1, wherein the laser optical system and the laser oscillator are controlled so as to irradiate the resin burr with a laser beam. 3. The control device according to claim 1, wherein, when the control device determines that resin burrs are adhered to the workpiece by observation after irradiating the laser beam, the controller irradiates the resin burrs again with the laser beam. The deburring device according to claim 2, wherein the laser optical system and the laser oscillator are controlled. 4. The processing device according to claim 1, wherein the control device is configured to store in advance an image of the processing object to which no resin burr is attached, and to store the processing object image obtained by the observation and the storage means. Means for comparing the image of the processing object in a state where the resin burr is not attached to the processing object to determine whether the resin burr is attached to the processing object. The deburring device according to claim 2. 5. A laser optical system, comprising: a scan pattern storage unit for storing a predetermined scan pattern; and a scan for scanning the laser beam on the workpiece in accordance with the scan pattern stored in the scan pattern storage unit. The deburring apparatus according to any one of claims 1 to 4, further comprising means. 6. The deburring apparatus according to claim 5, further comprising means for registering a scanning pattern in said scanning pattern storage means. 7. The scanning means includes: a selection means for selecting one of a plurality of scanning patterns stored in the scanning pattern storage means; and a means for scanning a laser beam according to the scanning pattern selected by the selection means. The deburring apparatus according to claim 5 or 6, further comprising: 8. A laser optical system, comprising: means for adjusting a diameter of a laser beam from the laser source in accordance with a size of the processing object; and irradiating the processing object with the laser beam whose diameter has been adjusted. The deburring apparatus according to any one of claims 1 to 4, further comprising means. 9. The deburring apparatus according to claim 1, wherein the object to be processed is made of metal. 10. The deburring apparatus according to claim 1, wherein the object to be processed is a land surface of an electrode of a semiconductor chip. 11. A burr removing method for removing resin burr adhering to a workpiece, wherein the burr removing method includes an irradiation step of irradiating the resin burr with a second harmonic YAG laser. Burr removal method. 12. The irradiating step, after irradiating the laser,
A discriminating step of discriminating whether or not the resin burr remains; and a re-irradiating step of re-irradiating the laser to the resin burr when the discriminating step determines that the resin burr is remaining attached. The method according to claim 11, further comprising: