CN111916416A - Integrated micro liquid cooling device for chip heat dissipation and liquid cooling heat dissipation method - Google Patents
Integrated micro liquid cooling device for chip heat dissipation and liquid cooling heat dissipation method Download PDFInfo
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- CN111916416A CN111916416A CN202010759950.8A CN202010759950A CN111916416A CN 111916416 A CN111916416 A CN 111916416A CN 202010759950 A CN202010759950 A CN 202010759950A CN 111916416 A CN111916416 A CN 111916416A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/001—Processes for the treatment of water whereby the filtration technique is of importance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses an integrated micro liquid cooling device for chip heat dissipation and a liquid cooling heat dissipation method, wherein the integrated micro liquid cooling device comprises a shell, a liquid driving pump, a micro-channel radiator, a precision filter, a heat dissipation fan and an electric control assembly, wherein the liquid driving pump, the micro-channel radiator, the precision filter, the heat dissipation fan and the electric control assembly are arranged in the shell; liquid drive pump, radiator fan all are connected with automatically controlled subassembly, and radiator fan is located the side of miniflow way radiator and during with the heat dissipation to the air of miniflow way radiator, and liquid drive pump, miniflow way radiator, precision filter all establish ties on the liquid cooling pipeline, and inlet, liquid outlet are connected respectively in the both ends of liquid cooling pipeline, and inlet, liquid outlet all with set up the heat transfer runner connection of the chip heat exchanger outside the casing. The invention can be designed into different specification forms according to the heat expansion of the chip, has the advantages of high integration level, convenient installation and modularized expansion, and can meet the heat dissipation requirements of chips with different heat flux densities.
Description
Technical Field
The invention relates to the field of chip heat dissipation, in particular to an integrated micro liquid cooling device for chip heat dissipation and a liquid cooling heat dissipation method.
Background
At present, in the field of chip heat dissipation, an air-cooled heat dissipation mode is mostly adopted, and the following two expression forms are mainly adopted: firstly, the natural convection heat dissipation mode is usually with the radiator with generate heat the chip and paste the dress together, and the heat passes through the chip and transmits to the radiator, and the natural convection of rethread air dissipates the heat from the radiator in the air. One is forced convection heat dissipation, which generally attaches a heat sink integrated with a fan to a heat-generating chip, and the heat is transferred to the heat sink via the chip, and then dissipated from the heat sink to the air by forced convection of the fan. The two air-cooling heat dissipation modes can solve the heat dissipation problem of the conventional low-heat-flux-density chip, but for the chip with larger heat dissipation power, the heat dissipation capacity of the above modes can not meet the heat dissipation requirement, and the obvious defects are that the heat dissipation capacity is limited and the occupied space is large. If the heat dissipation capability is improved, there are no more than two approaches: i.e. increasing the heat exchanger area of the heat sink and increasing the fan geometry, are not allowed in practical situations.
Disclosure of Invention
The invention aims to solve the technical problem of providing an integrated micro liquid cooling device and a liquid cooling heat dissipation method for chip heat dissipation, which have the advantages that the heat dissipation capacity is multiplied compared with the traditional air cooling heat dissipation mode, the heat dissipation capacity is greatly improved, and the power of a chip is fully released.
The technical scheme of the invention is as follows:
an integrated micro liquid cooling device for chip heat dissipation comprises a shell, a liquid driving pump, a micro-channel radiator, a precision filter, a cooling fan and an electric control assembly, wherein the liquid driving pump, the micro-channel radiator, the precision filter, the cooling fan and the electric control assembly are arranged in the shell; the casing on be provided with inlet, liquid outlet, power communication interface and display screen, liquid drive pump, miniflow way radiator, precision filter all establish ties on the liquid cooling pipeline, radiator fan be located the side of miniflow way radiator and with the heat dissipation of miniflow way radiator to the air in, the liquid cooling pipeline on be provided with liquid temperature sensor, flow sensor and hydraulic sensor, inlet, liquid outlet connect respectively in the both ends of liquid cooling pipeline, liquid drive pump, radiator fan, power communication interface, display screen, liquid temperature sensor, flow sensor and hydraulic sensor all be connected with automatically controlled subassembly, inlet, liquid outlet all be connected with the heat transfer runner that sets up the chip heat exchanger outside the casing.
The shell is also internally provided with an expansion container which is connected in series with the liquid cooling pipeline, and the expansion container is provided with an exhaust valve and a liquid discharge valve.
The outlet of the precision filter is connected with the liquid outlet through a liquid cooling pipeline.
The liquid cooling pipeline is provided with corresponding liquid temperature sensors at positions adjacent to the liquid inlet and the liquid outlet.
The precise filter is a powder metallurgy filter with micron-sized filtering precision.
The chip heat exchanger is of a micron-sized micro-channel structure.
The liquid cooling heat dissipation method of the integrated micro liquid cooling device specifically comprises the following steps: firstly, a liquid driving pump drives cooling liquid in a chip heat exchanger to enter a micro-channel pipeline of a micro-channel radiator through a liquid inlet under the driving of an electric control assembly, a cooling fan carries out air-cooling heat dissipation on the micro-channel radiator so as to dissipate heat of the micro-channel radiator into air, the cooling liquid after heat exchange flows out of the micro-channel radiator and enters a precision filter through the liquid driving pump to be filtered, then enters a micron-scale micro-channel of the chip heat exchanger through a liquid outlet to carry out liquid-cooling heat dissipation on a chip, and the steps are repeated after the cooling liquid is heated in the chip heat exchanger to enter an integrated micro liquid cooling device for heat exchange and cooling.
The liquid driving pump drives cooling liquid in the chip heat exchanger to flow through the expansion container after passing through the liquid inlet under the driving of the electric control assembly, the expansion container is used for balancing the volume expansion amount of the cooling liquid during long-time circulation at a high-temperature section, and meanwhile, hot gas and liquid in the liquid cooling pipeline can be discharged.
The invention has the advantages that:
the invention is integrated in the shell, has high integration level, has the function of liquid-cooling heat exchange of the heat on the chip, and can adjust the performance of the liquid driving pump and the radiating fan according to any parameter or combination parameter of temperature, flow and pressure, so that the radiating requirement of the chip is met; the precision filter has the advantages of high temperature resistance and high filtering precision, and can filter the circulating cooling liquid to ensure the purity of the liquid before entering the chip heat exchanger; the invention can be designed into different specifications according to the heat expansion of the chip, and meets the heat dissipation requirements of chips with different specifications.
Drawings
Fig. 1 is a schematic block diagram of the present invention, wherein "- -" is a liquid cooling pipeline and "- -" is an electric control circuit.
Fig. 2 is a longitudinal sectional view of the integrated micro liquid cooling device of the present invention.
FIG. 3 is a cross-sectional view of an integrated micro liquid cooling device of the present invention.
FIG. 4 is a side view of the integrated micro liquid cooling device of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, an integrated micro liquid cooling device for chip heat dissipation includes a housing 1, a liquid driving pump 2, a micro channel radiator 3, a precision filter 4, a heat dissipation fan 5, an expansion container 6 and an electric control component 7, which are disposed in the housing 1; the shell 1 is provided with a liquid inlet 8, a liquid outlet 9, a power supply communication interface 10 and a display screen 11, a liquid driving pump 2, a micro-channel radiator 3, a precision filter 4 and an expansion container 6 are all connected in series on a liquid cooling pipeline 12, a cooling fan 5 is positioned at the side of the micro-channel radiator 3 and dissipates the heat of the micro-channel radiator 3 into the air, the liquid cooling pipeline 12 is provided with a liquid temperature sensor 13, a flow sensor 14 and a hydraulic sensor 15, the liquid inlet 8 and the liquid outlet 9 are respectively connected with two ends of the liquid cooling pipeline 12, the outlet of the precision filter 4 is connected with the liquid outlet 9 through the liquid cooling pipeline 12, the positions on the liquid cooling pipeline 12 adjacent to the liquid inlet 8 and the liquid outlet 9 are respectively provided with a corresponding liquid temperature sensor 13, the liquid driving pump 2, the cooling fan 5, the power supply communication interface 10, the display screen 11, the liquid temperature sensor 13, the flow sensor, the liquid inlet 8 and the liquid outlet 9 are both connected with a heat exchange flow channel of a chip heat exchanger 16 arranged outside the shell 1, and the chip is connected to the chip heat exchanger 16 for liquid cooling heat dissipation.
Wherein, the precise filter 4 is a powder metallurgy filter with micron-sized filtering precision; the chip heat exchanger is of a micron-sized micro-channel structure.
The liquid cooling heat dissipation method of the integrated micro liquid cooling device specifically comprises the following steps:
the liquid driving pump 2 drives the cooling liquid in the chip heat exchanger 16 to flow through the expansion container 6 and the micro-channel radiator 3 after passing through the liquid inlet 9 under the driving of the electric control assembly 7, an exhaust valve and a liquid discharge valve are arranged on the expansion container 6 and are used for balancing the volume expansion amount of the cooling liquid when circulating at a high temperature section for a long time, hot gas and liquid in the liquid cooling pipeline 12 can be discharged at the same time, the cooling liquid enters the micro-channel pipeline of the micro-channel radiator 3, the heat radiation fan 5 carries out air-cooling heat radiation on the micro-channel radiator 3 so as to dissipate the heat of the micro-channel radiator 3 into the air, the cooling liquid after heat exchange flows out of the micro-channel radiator 3, enters the precision filter 4 through the liquid driving pump 2 to be filtered, then enters the micron-scale micro-channel of the chip heat exchanger through the liquid outlet 9 to carry out liquid-cooling heat radiation on the chip, and the steps are repeated after the cooling, the continuous normal work of the chip is ensured.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a be used for radiating miniature liquid cooling device of integrated form of chip which characterized in that: the device comprises a shell, a liquid driving pump, a micro-channel radiator, a precision filter, a radiating fan and an electric control assembly, wherein the liquid driving pump, the micro-channel radiator, the precision filter, the radiating fan and the electric control assembly are arranged in the shell; the casing on be provided with inlet, liquid outlet, power communication interface and display screen, liquid drive pump, miniflow way radiator, precision filter all establish ties on the liquid cooling pipeline, radiator fan be located the side of miniflow way radiator and with the heat dissipation of miniflow way radiator to the air in, the liquid cooling pipeline on be provided with liquid temperature sensor, flow sensor and hydraulic sensor, inlet, liquid outlet connect respectively in the both ends of liquid cooling pipeline, liquid drive pump, radiator fan, power communication interface, display screen, liquid temperature sensor, flow sensor and hydraulic sensor all be connected with automatically controlled subassembly, inlet, liquid outlet all be connected with the heat transfer runner that sets up the chip heat exchanger outside the casing.
2. The integrated micro liquid cooling device for chip heat dissipation of claim 1, wherein: the shell is also internally provided with an expansion container which is connected in series with the liquid cooling pipeline, and the expansion container is provided with an exhaust valve and a liquid discharge valve.
3. The integrated micro liquid cooling device for chip heat dissipation of claim 1, wherein: the outlet of the precision filter is connected with the liquid outlet through a liquid cooling pipeline.
4. The integrated micro liquid cooling device for chip heat dissipation of claim 1, wherein: the liquid cooling pipeline is provided with corresponding liquid temperature sensors at positions adjacent to the liquid inlet and the liquid outlet.
5. The integrated micro liquid cooling device for chip heat dissipation of claim 1, wherein: the precise filter is a powder metallurgy filter with micron-sized filtering precision.
6. The integrated micro liquid cooling device for chip heat dissipation of claim 1, wherein: the chip heat exchanger is of a micron-sized micro-channel structure.
7. The liquid cooling heat dissipation method of an integrated micro liquid cooling device as claimed in claim 1, wherein: the method specifically comprises the following steps: firstly, a liquid driving pump drives cooling liquid in a chip heat exchanger to enter a micro-channel pipeline of a micro-channel radiator through a liquid inlet under the driving of an electric control assembly, a cooling fan carries out air-cooling heat dissipation on the micro-channel radiator so as to dissipate heat of the micro-channel radiator into air, the cooling liquid after heat exchange flows out of the micro-channel radiator and enters a precision filter through the liquid driving pump to be filtered, then enters a micron-scale micro-channel of the chip heat exchanger through a liquid outlet to carry out liquid-cooling heat dissipation on a chip, and the steps are repeated after the cooling liquid is heated in the chip heat exchanger to enter an integrated micro liquid cooling device for heat exchange and cooling.
8. The liquid cooling heat dissipation method of claim 7, wherein: the liquid driving pump drives cooling liquid in the chip heat exchanger to flow through the expansion container after passing through the liquid inlet under the driving of the electric control assembly, the expansion container is used for balancing the volume expansion amount of the cooling liquid during long-time circulation at a high-temperature section, and meanwhile, hot gas and liquid in the liquid cooling pipeline can be discharged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010759950.8A CN111916416A (en) | 2020-07-31 | 2020-07-31 | Integrated micro liquid cooling device for chip heat dissipation and liquid cooling heat dissipation method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010759950.8A CN111916416A (en) | 2020-07-31 | 2020-07-31 | Integrated micro liquid cooling device for chip heat dissipation and liquid cooling heat dissipation method |
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| CN111916416A true CN111916416A (en) | 2020-11-10 |
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| CN202010759950.8A Pending CN111916416A (en) | 2020-07-31 | 2020-07-31 | Integrated micro liquid cooling device for chip heat dissipation and liquid cooling heat dissipation method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566480A (en) * | 2021-01-19 | 2021-03-26 | 程嘉俊 | Liquid cooling radiator and negative pressure structure thereof |
| CN116258209A (en) * | 2023-05-10 | 2023-06-13 | 中诚华隆计算机技术有限公司 | Computing device carrying superconducting quantum chip |
-
2020
- 2020-07-31 CN CN202010759950.8A patent/CN111916416A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566480A (en) * | 2021-01-19 | 2021-03-26 | 程嘉俊 | Liquid cooling radiator and negative pressure structure thereof |
| CN116258209A (en) * | 2023-05-10 | 2023-06-13 | 中诚华隆计算机技术有限公司 | Computing device carrying superconducting quantum chip |
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