CN116258209A - Computing device carrying superconducting quantum chip - Google Patents
Computing device carrying superconducting quantum chip Download PDFInfo
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- CN116258209A CN116258209A CN202310518367.1A CN202310518367A CN116258209A CN 116258209 A CN116258209 A CN 116258209A CN 202310518367 A CN202310518367 A CN 202310518367A CN 116258209 A CN116258209 A CN 116258209A
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- G06—COMPUTING; CALCULATING OR COUNTING
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- G06N10/00—Quantum computing, i.e. information processing based on quantum-mechanical phenomena
- G06N10/40—Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The invention relates to the technical field of quantum computing, in particular to a computing device carrying a superconducting quantum chip. The embodiment of the invention provides a computing device carrying a superconducting quantum chip, which comprises the superconducting quantum chip, a first shell, a low-temperature fluid pipeline and a gas collecting device; the low-temperature fluid pipeline comprises a pipeline part and a heat dissipation part, the pipeline part penetrates into the first shell, the heat dissipation part is positioned in the first shell and is attached to the superconducting quantum chip, the heat dissipation part is provided with a heat dissipation hole, and low-temperature fluid flows into the heat dissipation part through the pipeline part; the gas collecting device is communicated with the first shell through a gas collecting pipeline and is used for collecting gas formed by evaporating and gasifying low-temperature fluid. The embodiment of the invention provides a computing device carrying a superconducting quantum chip, which can provide an ultralow-temperature computing environment for the superconducting quantum chip.
Description
Technical Field
The invention relates to the technical field of quantum computing, in particular to a computing device carrying a superconducting quantum chip.
Background
As the size of components on conventional chips continues to shrink, the performance of the chips continues to increase. However, there is a minimum size limit for elements on the chip, such as transistors, and the presence of quantum tunneling significantly reduces the computational results of the computer when the dimensions of the elements reach the nanometer scale. Therefore, quantum chips with increased calculation speed and calculation excess index become the main attack direction of future researches.
Quantum chips achieve their excellent performance based on quantum entanglement. The existing quantum chip types mainly comprise three types, namely superconducting quantum chips, semiconductor quantum chips and ion trap quantum chips. The superconducting quantum chip needs to work in an ultralow temperature environment, and the lower the temperature is, the more excellent and stable the performance of the quantum chip is. However, there is currently a lack of devices capable of providing milli-opening temperatures for superconducting quantum chips.
Disclosure of Invention
The embodiment of the invention provides a computing device carrying a superconducting quantum chip, which can provide an ultralow-temperature computing environment for the superconducting quantum chip.
The embodiment of the invention provides a computing device carrying a superconducting quantum chip, which comprises the superconducting quantum chip, a first shell, a low-temperature fluid pipeline and a gas collecting device;
the low-temperature fluid pipeline comprises a pipeline part and a heat dissipation part, the pipeline part penetrates into the first shell, the heat dissipation part is positioned in the first shell and is attached to the superconducting quantum chip, the heat dissipation part is provided with a heat dissipation hole, and low-temperature fluid flows into the heat dissipation part through the pipeline part;
the gas collecting device is communicated with the first shell through a gas collecting pipeline and is used for collecting gas formed by evaporating and gasifying low-temperature fluid.
In one possible design, the gas collection device is provided with a suction pump for sucking the gas in the first housing into the gas collection device.
In one possible design, the superconducting quantum chip comprises two low-temperature fluid pipelines, and two heat dissipation parts of the two low-temperature fluid pipelines are respectively arranged on two largest surfaces of the superconducting quantum chip.
In one possible design, the heat dissipation portion sequentially includes an evaporation portion, a shielding portion and a heat conduction insulating portion along a thickness direction, the heat conduction insulating portion is attached to the superconducting quantum chip, the evaporation portion is communicated with the pipeline portion, the heat dissipation hole is formed in one side, far away from the superconducting quantum chip, of the evaporation portion, the shielding portion is used for shielding electromagnetic wave signals to prevent electromagnetic waves from interfering with the superconducting quantum chip, the heat conduction insulating portion is used for cooling the superconducting quantum chip, the heat conduction insulating portion is provided with a cavity, and the cavity is communicated with the pipeline portion to circulate low-temperature fluid.
In one possible design, the shielding portion is a metamaterial for shielding the Ghz band;
the metamaterial comprises a periodic arrangement layer and a substrate layer;
the periodic arrangement layer is formed by periodically arranging a plurality of rectangular periodic units.
In one possible design, the periodic unit sequentially comprises a first circular ring, a regular hexagonal ring and a second circular ring from outside to inside, wherein the geometric centers of the first circular ring, the regular hexagonal ring and the second circular ring are coincident with the geometric center of the periodic unit.
In one possible design, the side length of the periodic unit is 6-9 mm, the ring width of the first circular ring is 2mm, the outer diameter of the first circular ring is 5-8 mm, the ring width of the regular hexagonal ring is 2mm, the outer diameter of the regular hexagonal ring is 4-7 mm, the ring width of the second circular ring is 1mm, and the outer diameter of the second circular ring is 3-5 mm;
the thickness of the periodically arranged layers is 0.5-0.8 mm, and the thickness of the substrate layer is 2-3 mm.
In one possible design, the thermally conductive and insulating portion is made of a material including at least one of silicone rubber, silicone resin, aluminum oxide, boron nitride, and aluminum nitride.
In one possible design, the superconducting quantum chip further comprises a second shell and a control device, wherein the second shell is connected with the first shell through a heat conducting plate, and one surface of the superconducting quantum chip is attached to the surface of the heat conducting plate facing the inside of the first shell;
the second shell is provided with two laser devices outside, two laser devices set up relatively, two laser devices are used for the laser beam of release in order to centre gripping reflection microballon, the reflection microballon is used for reflecting laser, laser devices is movable in order to adjust the motion state of reflection microballon, the inner wall of second shell is provided with light receiving arrangement, light receiving arrangement is used for receiving the light of reflection microballon reflection, controlling means is used for according to light control that light receiving arrangement received the laser device removes in order to reduce the vibration of reflection microballon.
In one possible design, the reflective microspheres are glass microspheres having a diameter of 400 nanometers.
Compared with the prior art, the invention has at least the following beneficial effects:
in the embodiment of the invention, the pipeline part penetrates through the first shell, the pipeline part is communicated with the heat dissipation part, the heat dissipation part is attached to the superconducting quantum chip, and the heat dissipation part is provided with a plurality of heat dissipation holes. And the low-temperature fluid enters the heat dissipation part and exchanges heat with the superconducting quantum chip, so that the temperature of the superconducting quantum chip is reduced. The low-temperature fluid in the heat dissipation part is phase-changed and evaporated through the heat dissipation holes, so that the effect of reducing the temperature of the superconducting quantum chip is further improved, and the ultra-low-temperature computing environment is finally provided for the superconducting quantum chip. The gas collecting device connected with the shell can collect volatilized gas to recycle the cooling working medium on one hand, and on the other hand, the evaporation speed of low-temperature fluid in the heat radiating part can be accelerated after the gas enters the gas collecting device.
It should be noted that, the quantum computing device of this embodiment further includes a wire, one end of the wire passes through the first housing and is connected with the quantum chip, and the other end is connected with the external microwave pulse device, the signal receiving device, and other devices. The low-temperature fluid flowing through the low-temperature fluid pipeline can be liquid hydrogen, liquid nitrogen or liquid helium, preferably liquid helium with the temperature below 4K, and has excellent properties of superfluity, creeping film phenomenon, superconductivity, viscosity coefficient close to zero and the like, so that excellent heat dissipation and refrigeration performance can be provided, and the operation of the superconducting quantum chip is not influenced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a computing device carrying a superconducting quantum chip according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of another computing device with a superconducting quantum chip according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a periodically arranged layer according to an embodiment of the present invention.
In the figure:
1-a superconducting quantum chip;
2-a first housing;
3-cryogenic fluid piping;
31-a pipe section;
32-a heat sink;
321-an evaporation section;
322-shielding portion;
322 a-a first ring;
322 b-regular hexagonal ring;
322 c-a second ring;
323-a thermally conductive insulating portion;
4-a gas collection device;
5-a second housing;
6-a laser device;
7-reflective microspheres;
8-glass window.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments, and all other embodiments obtained by those skilled in the art without making any inventive effort based on the embodiments of the present invention are within the scope of protection of the present invention.
In the description of embodiments of the present invention, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying any relative importance unless explicitly specified or limited otherwise; the term "plurality" means two or more, unless specified or indicated otherwise; the terms "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of the present specification, it should be understood that the terms "upper", "lower", and the like used in the embodiments of the present invention are described in terms of the angles shown in the drawings, and should not be construed as limiting the embodiments of the present invention. In the context of this document, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on the other element or be indirectly on the other element through intervening elements.
As shown in fig. 1, an embodiment of the present invention provides a computing device on which a superconducting quantum chip 1 is mounted, including the superconducting quantum chip 1, a first housing 2, a cryogenic fluid pipe 3, and a gas collecting device 4;
the low-temperature fluid pipeline 3 comprises a pipeline part 31 and a heat dissipation part 32, the pipeline part 31 penetrates into the first shell 2, the heat dissipation part 32 is positioned in the first shell 2 and is attached to the superconducting quantum chip 1, the heat dissipation part 32 is provided with heat dissipation holes, and low-temperature fluid flows into the heat dissipation part 32 through the pipeline part 31;
the gas collecting device 4 is communicated with the first shell 2 through a gas collecting pipeline, and the gas collecting device 4 is used for collecting gas formed by evaporation and gasification of the low-temperature fluid.
In the embodiment of the present invention, the pipe portion 31 passes through the first housing 2, the pipe portion 31 communicates with the heat dissipation portion 32, the heat dissipation portion 32 is attached to the superconducting quantum chip 1, and the heat dissipation portion 32 is provided with a plurality of heat dissipation holes. The low-temperature fluid enters the heat radiating part 32 and exchanges heat with the superconducting quantum chip 1, so that the temperature of the superconducting quantum chip 1 is reduced. The low-temperature fluid in the heat dissipation part 32 is phase-changed and evaporated through the heat dissipation holes, so that the effect of reducing the temperature of the superconducting quantum chip 1 is further improved, and the ultra-low-temperature computing environment is finally provided for the superconducting quantum chip 1. The gas collecting device 4 connected with the shell can collect volatilized gas to recycle the cooling working medium on one hand, and on the other hand, the evaporation speed of the low-temperature fluid in the heat radiating part 32 can be accelerated after the gas enters the gas collecting device 4.
It should be noted that, the quantum computing device of this embodiment further includes a wire, one end of which passes through the first housing 2 and is connected to the quantum chip 1, and the other end of which is connected to an external microwave pulse device, a signal receiving device, and other devices. The low-temperature fluid flowing through the low-temperature fluid pipeline 3 can be liquid hydrogen, liquid nitrogen or liquid helium, preferably liquid helium with the temperature below 4K, and the liquid helium has excellent properties such as superfluity, creeping film phenomenon, superconductivity, viscosity coefficient close to zero and the like, so that excellent heat dissipation and refrigeration performance can be provided, and the operation of the superconducting quantum chip 1 is not influenced.
In some embodiments of the invention, the gas collection device 4 is provided with a suction pump for sucking the gas in the first housing 2 into the gas collection device 4.
In this embodiment, the air pump can rapidly pump the air in the first housing 2 into the air collecting device 4, so that the evaporation speed of the cryogenic fluid can be further increased, and the refrigeration efficiency can be further increased.
In some embodiments of the present invention, two cryogenic fluid pipes 3 are included, and two heat dissipation parts 32 of the two cryogenic fluid pipes 3 are respectively disposed at two largest faces of the superconducting quantum chip 1.
In the present embodiment, the two heat dissipating portions 32 can increase the heat dissipating rate, and the heat dissipating rate can be increased as well as the maximum surface connection of the quantum chip 1.
In some embodiments of the present invention, the heat dissipating part 32 includes an evaporation part 321, a shielding part 322 and a heat conducting insulating part 323 in order along the thickness direction, the heat conducting insulating part 323 is attached to the superconducting quantum chip 1, the evaporation part 321 is communicated with the pipe part 31, the heat dissipating hole is arranged at one side of the evaporation part 321 far away from the superconducting quantum chip 1, the shielding part 322 is used for shielding electromagnetic wave signals to prevent interference of electromagnetic waves on the superconducting quantum chip 1, the heat conducting insulating part 323 is used for cooling the superconducting quantum chip 1, the inside of the heat conducting insulating part 323 is a cavity, and the cavity is communicated with the pipe part 31 to circulate low-temperature fluid.
In the present embodiment, the two shielding portions 322 of the plate-like heat dissipating parts 32 on both sides of the superconducting quantum chip 1 form a shielding structure capable of shielding electromagnetic waves that interfere with the superconducting quantum chip 1 while cooling. In order to achieve the effect of shielding electromagnetic waves, the shielding portion 322 cannot directly contact the superconducting quantum chip 1, and therefore, the heat conductive insulating portion 323 is provided to play a role of isolating the shielding portion 322 and the superconducting quantum chip 1, and at the same time, the heat conductive insulating portion 323 having a high heat conductive property can also ensure the cooling effect on the superconducting quantum chip 1.
It is understood that the cryogenic fluid flows into the evaporation section 321.
As shown in fig. 3, in some embodiments of the present invention, the shielding portion 322 is a metamaterial for shielding the Ghz band;
the metamaterial comprises a periodic arrangement layer and a substrate layer;
the periodic arrangement layer is formed by periodically arranging a plurality of rectangular periodic units;
the periodic unit sequentially comprises a first circular ring 322a, a regular hexagonal ring 322b and a second circular ring 322c from outside to inside, and the geometric centers of the first circular ring 322a, the regular hexagonal ring 322b and the second circular ring 322c are overlapped with the geometric center of the periodic unit;
the side length of the periodic unit is 6-9 mm, the ring width of the first circular ring 322a is 2mm, the outer diameter of the first circular ring is 5-8 mm, the ring width of the regular hexagonal ring 322b is 2mm, the outer diameter of the regular hexagonal ring is 4-7 mm, the ring width of the second circular ring 322c is 1mm, and the outer diameter of the second circular ring is 3-5 mm;
the thickness of the periodically arranged layers is 0.5-0.8 mm, and the thickness of the base layer is 2-3 mm.
In the present embodiment, the metamaterial is thin, and the use of the metamaterial in the present embodiment as the shielding portion 322 can achieve a superior shielding effect in a smaller space. The loss array formed by etching the periodic units with special shapes can form specific resistance which can shield electromagnetic waves with the wave band of 2-18 Ghz.
The direction of the periodic arrangement of the periodic units is the direction of two sides adjacent to the periodic unit, and the minimum period of the periodic arrangement is the side length of the periodic unit.
The special shape on the periodic unit can be obtained by a laser etching process on the polyimide film.
In some embodiments of the present invention, the thermally conductive and insulating portion 323 is made of a material including at least one of silicone rubber, silicone resin, aluminum oxide, boron nitride, and aluminum nitride.
In this embodiment, silicone rubber, silicone resin, aluminum oxide, boron nitride, and aluminum nitride are all insulating materials having excellent heat conduction functions.
As shown in fig. 2, in some embodiments of the present invention, the superconducting quantum chip further comprises a second housing 5 and a control device, wherein the second housing 5 is connected with the first housing 2 through a heat conducting plate, and one surface of the superconducting quantum chip 1 is attached to the surface of the heat conducting plate facing the interior of the first housing;
the second casing 5 is provided with two laser devices 6 outward, and two laser devices 6 set up relatively, and two laser devices 6 are used for the laser beam of release in order to centre gripping reflection microballon 7, and reflection microballon 7 is used for reflecting laser, and laser device 6 is movable in order to adjust the motion state of reflection microballon 7, and the inner wall of second casing 5 is provided with light receiving arrangement, and light receiving arrangement is used for receiving the light of reflection microballon 7 reflection, and controlling means is used for controlling the laser device 6 removal in order to reduce the vibration of reflection microballon 7 according to light that light receiving arrangement received.
In this embodiment, in order to further ensure that the superconducting quantum chip 1 is in a low-temperature environment, the second housing 5 is closely disposed on the outer side of the first housing 2, two laser devices 6 are disposed in the second housing 5, and the two laser devices 6 are disposed opposite to each other, so that the reflective microsphere 7 can be clamped by the light velocity emitted by the laser devices 6, and part of the laser light can be reflected by the reflective microsphere 7. The essence of the temperature, i.e. the vibration of the particles in the space, the second housing 5 is in a vacuum environment, the reflective microspheres 7 are the only particles present in the second housing 5, and thus the amplitude and frequency of the vibration of the reflective microspheres 7 directly affects the temperature in the second housing 5. The inner wall of the second shell 5 is provided with a light receiving device, the vibration of the reflective microspheres 7 can cause the change of the reflected light, the control device calculates the real-time motion state of the reflective microspheres 7 according to the light change received by the light receiving device, and then the control device reversely controls the laser device 6 according to the real-time motion state of the reflective microspheres 7 to inhibit the motion of the reflective microspheres 7, so that the reflective microspheres 7 approach to rest infinitely, and an environment approaching to absolute zero degree is prepared. The superconducting quantum chip 1 in the first shell 2 is attached to a heat conducting plate, heat of the superconducting quantum chip 1 is conducted to the heat conducting plate through heat transfer, the heat conducting plate dissipates heat in a heat radiation mode, the heat radiation heats the reflecting microspheres 7 to increase vibration of the reflecting microspheres 7, and the control device and the laser device 6 are matched to reduce the vibration of the reflecting microspheres 7 so as to reduce the temperature of the superconducting quantum chip 1; the other surface of the superconducting quantum chip 1 radiates heat by the heat radiation portion 32 bonded thereto. This can provide ultra-low temperatures on the milli-opening scale for the superconducting quantum chip 1.
The plate body constituting the second case 5 may be a radiation-proof heat insulating material, or may be a composite plate material of a heat insulating material and a radiation-proof material in this order from the outside to the inside. By the arrangement, the plate body can prevent the external heat from interfering the temperature of the inner wall of the second shell 5 and prevent the external heat radiation from interfering the inside of the second shell 5.
It will be appreciated that the second housing 5 is provided with a glass window 8 for allowing laser light to enter the second housing 5, a laser transmissive film is coated on a side of the glass window 8 facing the outside of the second housing 5, and a laser reflective film is provided on a side of the glass window 8 facing the inside of the second housing 5.
The heat conducting plate forms the first housing 2 and the second housing 5, and the plate bodies of the first housing 2 and the second housing 5 except the heat conducting plate are made of heat insulating materials. The second casing 5 is in a vacuum environment, and the first casing 2 is in a vacuum environment, so that volatilization of the low-temperature fluid in the heat radiating portion 32 can be promoted. The vacuum degree in the gas collection device 4 is larger than or equal to the vacuum degree of the first shell 2, and the air pump can further accelerate the speed of the gas in the first shell 2 entering the gas collection device 4.
It will be appreciated that the volume of the second housing 5 may be smaller than the first housing 2, the plate of the second housing 5 facing the first housing 2 being a heat conductive plate, and the heat conductive plate constituting only a part of the plate of the first housing 2 facing the second housing 5.
The laser beam is a tightly focused laser array.
In some embodiments of the invention, the reflective microspheres 7 are glass microspheres having a diameter of 400 nanometers.
In this embodiment, the reflective microspheres 7 are uncharged glass microspheres, and reflective microspheres 7 with different diameters may be selected according to the laser emitted by the laser device 6, for example, 100 nm, 200 nm, 300 nm or 400 nm.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A computing device carrying a superconducting quantum chip, which is characterized by comprising the superconducting quantum chip (1), a first shell (2), a low-temperature fluid pipeline (3) and a gas collecting device (4);
the low-temperature fluid pipeline (3) comprises a pipeline part (31) and a heat dissipation part (32), the pipeline part (31) penetrates into the first shell (2), the heat dissipation part (32) is positioned in the first shell (2) and is attached to the superconducting quantum chip (1), the heat dissipation part (32) is provided with a heat dissipation hole, and low-temperature fluid flows into the heat dissipation part (32) through the pipeline part (31);
the gas collecting device (4) is communicated with the first shell (2) through a gas collecting pipeline, and the gas collecting device (4) is used for collecting gas formed by evaporating and gasifying a low-temperature fluid.
2. The computing device according to claim 1, characterized in that the gas collection device (4) is provided with a suction pump for sucking gas in the first housing (2) into the gas collection device (4).
3. The computing device according to claim 1, characterized in that it comprises two of said cryogenic fluid pipes (3), the two heat sinks (32) of the two cryogenic fluid pipes (3) being arranged respectively at the two largest faces of the superconducting quantum chip (1).
4. A computing device according to claim 3, characterized in that the heat dissipating part (32) comprises an evaporation part (321), a shielding part (322) and a heat conducting insulating part (323) in sequence along the thickness direction, the heat conducting insulating part (323) is attached to the superconducting quantum chip (1), the evaporation part (321) is communicated with the pipeline part (31), the heat dissipating hole is arranged at one side of the evaporation part (321) away from the superconducting quantum chip (1), the shielding part (322) is used for shielding electromagnetic wave signals to prevent interference of electromagnetic waves on the superconducting quantum chip (1), the heat conducting insulating part (323) is used for cooling the superconducting quantum chip (1), and the inside of the heat conducting insulating part (323) is a cavity which is communicated with the pipeline part (31) to circulate low-temperature fluid.
5. The computing device according to claim 4, wherein the shielding portion (322) is a metamaterial for shielding the Ghz band;
the metamaterial comprises a periodic arrangement layer and a substrate layer;
the periodic arrangement layer is formed by periodically arranging a plurality of rectangular periodic units.
6. The computing device of claim 5, wherein the periodic unit comprises, in order from outside to inside, a first ring (322 a), a regular hexagonal ring (322 b), and a second ring (322 c), a geometric center of the first ring (322 a), the regular hexagonal ring (322 b), and the second ring (322 c) coinciding with a geometric center of the periodic unit.
7. The computing device of claim 6, wherein the periodic unit has a side length of 6-9 mm, the first ring (322 a) has a ring width of 2mm, an outer diameter of 5-8 mm, the regular hexagonal ring (322 b) has a ring width of 2mm, an outer diameter of 4-7 mm, and the second ring (322 c) has a ring width of 1mm, an outer diameter of 3-5 mm;
the thickness of the periodically arranged layers is 0.5-0.8 mm, and the thickness of the substrate layer is 2-3 mm.
8. The computing device of claim 4, wherein the thermally conductive and insulating portion (323) is made of a material comprising at least one of silicone rubber, silicone, aluminum oxide, boron nitride, and aluminum nitride.
9. The computing device according to claim 1, further comprising a second housing (5) and a control device, the second housing (5) being connected to the first housing (2) by a heat-conducting plate, one face of the superconducting quantum chip (1) being in abutment with a face of the heat-conducting plate facing the inside of the first housing;
the second shell (5) is externally provided with two laser devices (6), two the laser devices (6) are oppositely arranged, two laser devices (6) are used for releasing laser beams to clamp the reflecting microspheres (7), the reflecting microspheres (7) are used for reflecting laser, the laser devices (6) are movable to adjust the motion state of the reflecting microspheres (7), the inner wall of the second shell (5) is provided with a light receiving device, the light receiving device is used for receiving light reflected by the reflecting microspheres (7), and the control device is used for controlling the laser devices (6) to move to reduce vibration of the reflecting microspheres (7) according to the light received by the light receiving device.
10. The computing device according to claim 9, characterized in that the reflective microspheres (7) are glass microspheres with a diameter of 400 nm.
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| CN116523062A (en) * | 2023-06-28 | 2023-08-01 | 中诚华隆计算机技术有限公司 | Quantum computing device for weakening induction electromagnetic waves |
| CN116523062B (en) * | 2023-06-28 | 2023-09-15 | 中诚华隆计算机技术有限公司 | Quantum computing device for weakening induction electromagnetic waves |
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