CN116523062B - Quantum computing device for weakening induction electromagnetic waves - Google Patents
Quantum computing device for weakening induction electromagnetic waves Download PDFInfo
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- CN116523062B CN116523062B CN202310769191.7A CN202310769191A CN116523062B CN 116523062 B CN116523062 B CN 116523062B CN 202310769191 A CN202310769191 A CN 202310769191A CN 116523062 B CN116523062 B CN 116523062B
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- 230000006698 induction Effects 0.000 title abstract description 17
- 230000003313 weakening effect Effects 0.000 title abstract description 14
- 238000004806 packaging method and process Methods 0.000 claims abstract description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 229910021389 graphene Inorganic materials 0.000 claims description 8
- 229910000859 α-Fe Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 4
- 239000002096 quantum dot Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002887 superconductor Substances 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N10/00—Quantum computing, i.e. information processing based on quantum-mechanical phenomena
- G06N10/40—Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The invention relates to the technical field of quantum computing, in particular to a quantum computing device for weakening induction electromagnetic waves. A quantum computing device for attenuating induced electromagnetic waves, comprising a quantum chip and a wave guide disposed in a package; the waveguide comprises a first surface and a second surface which are both curved surfaces and are connected with each other at the edges, the first surface and the second surface are both convex towards the direction of the quantum chip, the first surface is the surface of the waveguide facing the packaging shell, the second surface is the surface of the waveguide facing the quantum chip, the waveguide comprises two sharp corners, and the projection of the waveguide along the thickness direction of the quantum chip is a spindle shape comprising the two sharp corners; and the two sharp corners of the wave guide body are respectively connected with the quantum chip and the inner wall of the packaging shell. The invention provides a quantum computing device for weakening induction electromagnetic waves, which can provide a quantum chip for weakening or eliminating induction electromagnetic waves.
Description
Technical Field
The invention relates to the technical field of quantum computing, in particular to a quantum computing device for weakening induction electromagnetic waves.
Background
Quantum chips are necessary elements to implement quantum computing.
When quantum computation is performed, microwave pulse is required to be applied to the quantum chip to operate the bit quantum state, and then the state information of the quantum bit is obtained by receiving the returned pulse signal, so that the quantum computation is completed. However, in addition to affecting the qubit, the microwave pulse may also affect the surface of the quantum chip, so that the quantum chip generates an induced electromagnetic wave, and the induced electromagnetic wave generated on the surface of the quantum chip may interfere with the quantum state of the qubit.
At present, a quantum chip capable of weakening or eliminating the induced electromagnetic wave is lacking.
Disclosure of Invention
The embodiment of the invention provides a quantum computing device for weakening induction electromagnetic waves, which can provide a quantum chip for weakening or eliminating induction electromagnetic waves.
The embodiment of the invention provides a quantum computing device for weakening induction electromagnetic waves, which comprises a quantum chip and a wave guide body, wherein the quantum chip and the wave guide body are arranged in a packaging shell;
the waveguide comprises a first surface and a second surface which are both curved surfaces and are connected with each other at the edges, the first surface and the second surface are both convex towards the direction of the quantum chip, the first surface is the surface of the waveguide facing the packaging shell, the second surface is the surface of the waveguide facing the quantum chip, the waveguide comprises two sharp corners, and the projection of the waveguide along the thickness direction of the quantum chip is a spindle shape comprising the two sharp corners;
and the two sharp corners of the wave guide body are respectively connected with the quantum chip and the inner wall of the packaging shell.
In one possible design, one sharp corner of the waveguide is connected to the quantum chip by a connection line.
In one possible design, the connection line is curved.
In one possible design, the inner wall of the package shell connected with the wave guide body is provided with a wave absorbing layer, and the wave absorbing layer is used for absorbing electromagnetic waves from the wave guide body.
In one possible design, the wave absorbing layer includes carbonyl iron powder, ferrite, and graphene.
In one possible design, the mass ratio of the carbonyl iron powder, the ferrite and the graphene is (50-70): (10-30): (15-20).
In one possible design, the angle of the two sharp corners of the spindle is 30-60 °.
In one possible design, the corner of the waveguide that connects with the package is folded toward the package to reduce traveling wave scattering of the waveguide.
In one possible design, the first surface and the second surface are connected by an annular curved surface protruding outside the waveguide, and the annular curved surface and the first surface and the second surface are both smoothly connected.
In one possible design, the waveguide and the connection line are made of aluminum.
Compared with the prior art, the invention has at least the following beneficial effects:
in an embodiment of the present invention, the waveguide includes two first surfaces and two second surfaces protruding toward the vector microchip, and each of the first surfaces and the second surfaces is a curved surface. The junction of the first surface and the second surface is the edge of the wave guide body, and the wave guide body has two edges with separated bending directions, namely, the projection of the wave guide body towards the quantum chip is in a spindle shape. The wave guide body comprises two sharp corners, the two sharp corners are respectively connected with the quantum chip and the packaging shell, when the vibration induction electromagnetic wave generated on the surface of the quantum chip, the induction electromagnetic wave is conducted to the packaging shell through the conduction of the wave guide body, and the induction electromagnetic wave generated on the surface of the quantum chip is further conducted to the packaging shell, so that the effect of eliminating or weakening the induction electromagnetic wave on the surface of the quantum chip is achieved.
In this embodiment, a tip angle of the waveguide is connected to the quantum chip, electromagnetic waves on the surface of the quantum chip can be converged onto the waveguide by the tip angle, and in the converging process, the electromagnetic waves propagate along the waveguide without scattering, because the first surface and the second surface of the waveguide are both curved surfaces, the waveguide is in a spindle shape, and the propagation direction is from one tip angle to the other tip angle, so that the waveguide has an excellent guided wave effect for a microwave band due to the special shape, and scattering electromagnetic waves generated when the electromagnetic waves are on the waveguide are prevented from scattering back to the quantum chip.
In addition, when the electromagnetic wave propagates to the inner wall of the package shell through the wave guide body, a part of the electromagnetic wave can be scattered to the first surface of the wave guide body by the inner wall of the package shell, the electromagnetic wave incident on the first surface can be converged and vertically reflected back to the inner wall of the package shell due to the downward concave of the first surface, and the electromagnetic wave can be reflected to the first surface again due to the vertical reflection of the electromagnetic wave back to the inner wall of the package shell, so that the oscillation interference of the electromagnetic wave between the first surface and the inner wall of the package shell is reduced.
It should be noted that, the quantum computing device of this embodiment further includes a wire, one end of the wire passes through the package case and is connected with the quantum chip, and the other end is connected with the external microwave pulse device, the signal receiving device, and other devices.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a quantum computing device for weakening an induced electromagnetic wave according to an embodiment of the present invention.
In the figure:
1-packaging a shell;
11-a wave absorbing layer;
111-chip resistor;
2-quantum chip;
3-wave-guide;
31-a first surface;
32-a second surface;
33-an annular curved surface;
4-connecting lines.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments, and all other embodiments obtained by those skilled in the art without making any inventive effort based on the embodiments of the present invention are within the scope of protection of the present invention.
In the description of embodiments of the present invention, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying any relative importance unless explicitly specified or limited otherwise; the term "plurality" means two or more, unless specified or indicated otherwise; the terms "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of the present specification, it should be understood that the terms "upper", "lower", and the like used in the embodiments of the present invention are described in terms of the angles shown in the drawings, and should not be construed as limiting the embodiments of the present invention. In the context of this document, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on the other element or be indirectly on the other element through intervening elements.
As shown in fig. 1, an embodiment of the present invention provides a quantum computing device for attenuating induced electromagnetic waves, including a quantum chip 2 and a waveguide 3 disposed in a package case 1;
the wave guide body 3 comprises a first surface 31 and a second surface 32 which are both curved surfaces and are connected with each other at the edges, the first surface 31 and the second surface 32 are both convex towards the direction of the quantum chip 2, the first surface 31 is the surface of the wave guide body 3 facing the package shell 1, the second surface 32 is the surface of the wave guide body 3 facing the quantum chip 2, the wave guide body 3 comprises two sharp corners, and the projection of the wave guide body 3 along the thickness direction of the quantum chip 2 is a spindle shape comprising the two sharp corners;
two sharp corners of the wave guide body 3 are respectively connected with the quantum chip 2 and the inner wall of the packaging shell 1.
In the embodiment of the present invention, the waveguide 3 includes two first surfaces 31 and second surfaces 32 protruding toward the vector microchip 2, and each of the first surfaces 31 and the second surfaces 32 is a curved surface. The junction of the first surface 31 and the second surface 32 is the edge of the waveguide 3, and the waveguide 3 has two edges separated in the bending direction, i.e. the projection of the waveguide 3 to the quantum chip 2 is spindle-shaped. The wave guide body 3 comprises two sharp corners, the two sharp corners are respectively connected with the quantum chip 2 and the packaging shell 1, when the vibration induction electromagnetic wave generated on the surface of the quantum chip 2, the induction electromagnetic wave is conducted to the packaging shell 1 through the conduction of the wave guide body 3, and then the effect of eliminating or weakening the induction electromagnetic wave on the surface of the quantum chip 2 is achieved.
In this embodiment, one sharp corner of the waveguide 3 is connected to the quantum chip 2, electromagnetic waves on the surface of the quantum chip 2 can be converged onto the waveguide 3 by the sharp corner, and the electromagnetic waves propagate along the waveguide 3 in the converging process without scattering, because the first surface 31 and the second surface 32 of the waveguide 3 are both curved surfaces, the waveguide 3 is fusiform, and the propagation direction is from one sharp corner to the other sharp corner, so that the waveguide 3 has an excellent guided wave effect for the microwave band by the special shape, and the scattered electromagnetic waves generated when the electromagnetic waves are on the waveguide 3 are prevented from scattering back to the quantum chip 2.
In addition, when the electromagnetic wave propagates to the inner wall of the package shell 1 through the waveguide 3, a part of the electromagnetic wave is scattered by the inner wall of the package shell 1 to the first surface 31 of the waveguide 3, and the electromagnetic wave incident on the first surface 31 is converged and vertically reflected back to the inner wall of the package shell 1 due to the downward depression of the first surface 31, and the electromagnetic wave is reflected back to the inner wall of the package shell 1 again to the first surface 31 due to the vertical reflection of the electromagnetic wave, so that the oscillation interference of the electromagnetic wave between the first surface 31 and the inner wall of the package shell 1 is reduced.
It should be noted that, the quantum computing device of this embodiment further includes a wire, one end of which passes through the package 1 and is connected to the quantum chip 2, and the other end of which is connected to an external microwave pulse device, a signal receiving device, and other devices.
In some embodiments of the invention, one sharp corner of the waveguide 3 is connected to the quantum chip 2 by a connection line 4.
In the present embodiment, the position adjustable range of the waveguide 3 in the package case 1 is small due to the shape limitation of the waveguide 3, but the tip angle of the waveguide 3 toward the quantum chip 2 does not necessarily correspond to the position where the induction electromagnetic wave is strongest on the surface of the quantum chip 2. Therefore, the connecting wire 4 is provided, and the connecting wire 4 connects the position where the quantum chip 2 senses the electromagnetic wave most strongly with the sharp corner of the waveguide 3, so that the efficiency of weakening and eliminating the electromagnetic wave by the waveguide 3 is higher.
It will be appreciated that after the quantum chip 2 is fabricated, the position where the intensity of the induced electromagnetic wave is strongest on the surface of the quantum chip 2 may be detected by a detection device, and the connection line 4 is provided at this position.
The number of the connection lines 4 may be one or a plurality of. The connecting line 4 has a circular or oval cross section.
In some embodiments of the invention, the connection line 4 is curved.
In the present embodiment, the connecting line 4 is curved to reduce scattering of electromagnetic waves.
In some embodiments of the present invention, the inner wall of the package case 1 connected to the wave guide 3 is provided with a wave absorbing layer 11, and the wave absorbing layer 11 is used to absorb electromagnetic waves from the wave guide 3.
In the present embodiment, in order to reduce reflection and scattering of electromagnetic waves conducted to the package 1, a wave absorbing layer 11 is provided on the inner wall of the package 1 to absorb electromagnetic waves.
It is to be understood that the wave-absorbing layer 11 may be provided only on the inner wall of the package 1 to which the waveguide 3 is connected, or the wave-absorbing layer 11 may be provided on the entire inner wall of the package 1.
In some embodiments of the present invention, the wave-absorbing layer 11 includes carbonyl iron powder, ferrite, and graphene.
In the present embodiment, carbonyl iron powder is used for loss of electromagnetic waves, ferrite is used for absorption of electromagnetic waves, and graphene is used for adjustment of the impedance and dielectric constant of the entire wave-absorbing layer 11.
In some embodiments of the present invention, in order to further increase the wave absorbing performance of the wave absorbing layer 11, increase the wave absorbing capability of the wave absorbing layer 11, reduce the electromagnetic scattering generated by the wave absorbing layer 11 outwards, a plurality of chip resistors 111 are disposed in the wave absorbing layer 11, and the distribution density of the chip resistors 111 gradually decreases from the center to the outside with the connection point of the waveguide 3 and the package shell 1 as the center, so as to form a gradient resistor structure, and the gradient resistor structure breaks up electromagnetic waves in the wave absorbing layer 11, so that the intensity of the electromagnetic waves in the wave absorbing layer 11 is relatively average, and the wave absorbing capability of the wave absorbing layer 11 is enhanced.
Further, the thickness of the chip resistor 111 is smaller than the thickness of the wave-absorbing layer 11, and the chip resistor 111 is disposed at the center in the thickness direction of the wave-absorbing layer 11. Thus, electromagnetic waves are prevented from being reflected out of the wave-absorbing layer 11 when they are incident on the chip resistor 111.
In some embodiments of the present invention, the mass ratio of carbonyl iron powder, ferrite and graphene is (50-70): (10-30): (15-20).
In this embodiment, the mass ratio of carbonyl iron powder, ferrite and graphene is set to (50-70): (10-30): (15-20) such that the real part of the dielectric constant of the wave-absorbing layer 11 is 2-4 and the imaginary part is 0.2-0.4. The dielectric constant is controlled within the above range, and the electromagnetic wave on the waveguide 3 can be hardly reflected when entering the wave-absorbing layer 11.
In some embodiments of the invention, the angle of the two sharp corners of the spindle is 30-60 °.
In this embodiment, the angle of the two sharp corners of the spindle shape is 30-60 degrees, so that polarization scattering of electromagnetic waves can be obviously reduced.
In some embodiments of the present invention, the corner of the waveguide 3 connected to the package 1 is bent toward the package 1 to reduce the traveling wave scattering of the waveguide 3.
In this embodiment, the sharp corners of the bend can reduce polarization scattering in addition to reducing traveling wave scattering.
In some embodiments of the present invention, the first surface 31 and the second surface 32 are connected by an annular curved surface 33 protruding outward of the waveguide 3, and the annular curved surface 33 and the first surface 31 and the second surface 32 are both smoothly connected.
In the present embodiment, the first surface 31 and the second surface 32 are connected by the annular curved surface 33, and thus, the waveguide 3 has no sharp edge, and almost no scattering occurs when the electromagnetic wave propagates from the second surface 32 to the first surface 31.
In some embodiments of the invention, the material of preparation of the wave-guide 3 and the connection line 4 is aluminum.
In this embodiment, aluminum is a superconductor in an ultra-low temperature environment, and the use of an aluminum material for the waveguide 3 and the connection line 4 is more advantageous for conducting electromagnetic waves.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A quantum computing device for attenuating induced electromagnetic waves, characterized by comprising a quantum chip (2) and a wave guide (3) arranged in a package (1);
the waveguide (3) comprises a first surface (31) and a second surface (32) which are both curved surfaces and are connected with each other at edges, the first surface (31) and the second surface (32) are both convex towards the direction of the quantum chip (2), the first surface (31) is the surface of the waveguide (3) facing the package shell (1), the second surface (32) is the surface of the waveguide (3) facing the quantum chip (2), the waveguide (3) comprises two sharp corners, and the projection of the waveguide (3) along the thickness direction of the quantum chip (2) is a spindle shape comprising two sharp corners;
the two sharp angles of the wave guide body (3) are respectively connected with the quantum chip (2) and the inner wall of the packaging shell (1).
2. Quantum computing device according to claim 1, characterized in that one sharp corner of the waveguide (3) is connected to the quantum chip (2) by a connecting line (4).
3. Quantum computing device according to claim 2, characterized in that the connection line (4) is curved.
4. The quantum computing device according to claim 1, characterized in that an inner wall of the package (1) connected to the wave guide (3) is provided with a wave absorbing layer (11), the wave absorbing layer (11) being for absorbing electromagnetic waves from the wave guide (3).
5. The quantum computing device according to claim 4, characterized in that the wave-absorbing layer (11) comprises carbonyl iron powder, ferrite and graphene.
6. The quantum computing device of claim 5, wherein a mass ratio of the carbonyl iron powder, the ferrite, and the graphene is (50-70): (10-30): (15-20).
7. The quantum computing device of claim 1, wherein the angle of the two sharp corners of the spindle is 30-60 °.
8. The quantum computing device according to claim 1, characterized in that the angle at which the waveguide (3) is connected to the package (1) is folded towards the package (1) to reduce the travelling wave scattering of the waveguide (3).
9. The quantum computing device according to claim 1, characterized in that the first surface (31) and the second surface (32) are connected by an annular curved surface (33) protruding outwards of the wave-guide (3), the annular curved surface (33) and the first surface (31) and the second surface (32) being both smoothly connected.
10. Quantum computing device according to claim 2, characterized in that the material of preparation of the wave-guide (3) and the connecting wire (4) is aluminium.
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| CN202310769191.7A CN116523062B (en) | 2023-06-28 | 2023-06-28 | Quantum computing device for weakening induction electromagnetic waves |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113376738A (en) * | 2021-05-25 | 2021-09-10 | 太原理工大学 | Funnel-shaped photonic crystal waveguide structure for realizing optical wave unidirectional transmission |
| WO2022020454A1 (en) * | 2020-07-22 | 2022-01-27 | Alibaba Group Holding Limited | Quantum chip preparation method, apparatus, and device and quantum chip |
| CN116258209A (en) * | 2023-05-10 | 2023-06-13 | 中诚华隆计算机技术有限公司 | Computing device carrying superconducting quantum chip |
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| US10664640B2 (en) * | 2018-07-19 | 2020-05-26 | International Business Machines Corporation | Coherent placement of slotline mode suppression structures in coplanar waveguides for quantum devices |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022020454A1 (en) * | 2020-07-22 | 2022-01-27 | Alibaba Group Holding Limited | Quantum chip preparation method, apparatus, and device and quantum chip |
| CN113376738A (en) * | 2021-05-25 | 2021-09-10 | 太原理工大学 | Funnel-shaped photonic crystal waveguide structure for realizing optical wave unidirectional transmission |
| CN116258209A (en) * | 2023-05-10 | 2023-06-13 | 中诚华隆计算机技术有限公司 | Computing device carrying superconducting quantum chip |
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