CN116259591B - Refrigerating method applied to superconducting quantum chip and quantum computing device - Google Patents
Refrigerating method applied to superconducting quantum chip and quantum computing device Download PDFInfo
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- CN116259591B CN116259591B CN202310547695.4A CN202310547695A CN116259591B CN 116259591 B CN116259591 B CN 116259591B CN 202310547695 A CN202310547695 A CN 202310547695A CN 116259591 B CN116259591 B CN 116259591B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N10/00—Quantum computing, i.e. information processing based on quantum-mechanical phenomena
- G06N10/20—Models of quantum computing, e.g. quantum circuits or universal quantum computers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N10/00—Quantum computing, i.e. information processing based on quantum-mechanical phenomena
- G06N10/40—Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
Abstract
The invention relates to the technical field of quantum computing, in particular to a refrigeration method applied to a superconducting quantum chip and a quantum computing device. The method comprises the following steps: preparing a first shell and a second shell; vacuumizing the first shell and the second shell respectively to enable the first shell and the second shell to be in vacuum environments; applying an electric field to the inside of the second housing to capture the charged microspheres preset in the second housing; wherein the charged microspheres are fluorescently labeled; collecting fluorescence information released by the charged microspheres; wherein the fluorescence information includes the intensity of fluorescence; and adjusting the electric field according to the fluorescence information to weaken the vibration of the charged microspheres, and providing an ultralow temperature environment for the superconducting quantum chip. The embodiment of the invention provides a refrigeration method and a quantum computing device applied to a superconducting quantum chip, which can provide an ultralow-temperature computing environment for the superconducting quantum chip.
Description
Technical Field
The invention relates to the technical field of quantum computing, in particular to a refrigeration method applied to a superconducting quantum chip and a quantum computing device.
Background
As the size of components on conventional chips continues to shrink, the performance of the chips continues to increase. However, there is a minimum size limit for elements on the chip, such as transistors, and the presence of quantum tunneling significantly reduces the computational results of the computer when the dimensions of the elements reach the nanometer scale. Therefore, quantum chips with increased calculation speed and calculation excess index become the main attack direction of future researches.
Quantum chips achieve their excellent performance based on quantum entanglement. The existing quantum chip types mainly comprise three types, namely superconducting quantum chips, semiconductor quantum chips and ion trap quantum chips. The superconducting quantum chip needs to work in an ultralow temperature environment, and the lower the temperature is, the more excellent and stable the performance of the quantum chip is. However, there is currently a lack of methods and apparatus capable of providing milli-opening temperatures for superconducting quantum chips.
Disclosure of Invention
The embodiment of the invention provides a refrigeration method and a quantum computing device applied to a superconducting quantum chip, which can provide an ultralow-temperature computing environment for the superconducting quantum chip.
In a first aspect, an embodiment of the present invention provides a refrigeration method applied to a superconducting quantum chip, including:
preparing a first shell and a second shell; the second shell is connected with the first shell through a heat conducting plate, and one surface of the superconducting quantum chip is attached to the surface, facing the inside of the first shell, of the heat conducting plate;
vacuumizing the first shell and the second shell respectively to enable the first shell and the second shell to be in vacuum environments;
applying an electric field to the inside of the second housing to capture the charged microspheres preset in the second housing; wherein the charged microspheres are fluorescently labeled;
collecting fluorescence information released by the charged microspheres; wherein the fluorescence information includes the intensity of fluorescence;
and adjusting the electric field according to the fluorescence information to weaken the vibration of the charged microspheres, and providing an ultralow temperature environment for the superconducting quantum chip.
In one possible design, the adjusting the electric field to attenuate the vibration of the charged microspheres based on the fluorescence information includes:
judging the real-time vibration direction of the charged microspheres according to the real-time change of the fluorescence information;
and adjusting the electric field according to the real-time vibration direction of the charged microspheres so as to weaken the vibration of the charged microspheres.
In one possible design, after the vacuuming the first and second housings to make the first and second housings in vacuum environments, before applying an electric field to the inside of the second housing to capture the charged microspheres preset in the second housing, further comprising:
the maximum variable frequency and the maximum field strength of the electric field are selected according to the diameter of the charged microsphere.
In a second aspect, the embodiment of the invention also provides a quantum computing device, which comprises a superconducting quantum chip, a first shell, a second shell, a vacuumizing device, an electric field device, a fluorescence receiving device and a control device; the second shell is connected with the first shell through a heat conducting plate, and one surface of the superconducting quantum chip is attached to the surface, facing the inside of the first shell, of the heat conducting plate;
the vacuumizing device is used for vacuumizing the first shell and the second shell respectively so that the first shell and the second shell are in vacuum environments;
the electric field device is used for applying an electric field to the interior of the second shell to capture the charged microspheres preset in the second shell, and the charged microspheres are marked with fluorescence;
the fluorescence receiving device is used for collecting fluorescence information, and the fluorescence information comprises the intensity of fluorescence;
the control device is used for receiving the fluorescence information in the second shell;
the control device is used for adjusting the electric field of the electric field device according to the fluorescence information so as to weaken the vibration of the charged microspheres and provide an ultralow temperature environment for the superconducting quantum chip.
In one possible design, the charged microspheres are charged glass microspheres having a diameter of 400 nanometers.
In one possible design, the second housing is a cuboid composed of 6 plates, and the quantum computing device comprises two fluorescence receiving devices, wherein the two fluorescence receiving devices are respectively arranged on the inner walls of the two plates perpendicular to each other of the second housing.
In one possible design, the heat conducting plate is provided with an infrared reflecting film on the surface facing the second shell;
an infrared transmission film is arranged on one surface of the heat conducting plate, which faces the first shell.
In one possible embodiment, the plate body of the second housing has a radiation-proof heat-insulating function, except for the heat-conducting plate.
In one possible embodiment, the plate body is made of radiation-proof heat-insulating material, except for the heat-conducting plate.
In one possible design, the plate body except the heat conducting plate is a composite plate, and the composite plate is heat insulating material and radiation-proof material from outside to inside.
Compared with the prior art, the invention has at least the following beneficial effects:
in the embodiment of the present invention, first, the first case and the second case are prepared, and the first case and the second case share the heat conductive plate, that is, the heat conductive plate is the plate body forming both the first case and the second case. The superconducting quantum chip is adhered and fixed on the surface of the heat conducting plate facing the first shell, namely the superconducting quantum chip is positioned in the first shell. And vacuumizing the first shell and the second shell to preliminarily reduce the temperature in the first shell and the second shell, and simultaneously, reducing the loss of the temperature after the vacuum environment is at ultralow temperature. The second shell is internally provided with charged microspheres, and the charged microspheres are movably arranged on the target position of the second shell. The electric field is applied to capture the charged microspheres, and the electric field can be adjusted to drive the charged microspheres to the preset position of the second shell after the charged microspheres are captured. The charged microsphere marked with fluorescence can release fluorescence, fluorescence information in the second shell is collected, and the electric field is regulated according to the fluorescence information to inhibit the vibration of the charged microsphere so as to manufacture an ultralow-temperature environment. So, be in ultra-low temperature environment in the second casing, the heat transfer of superconductive quantum chip in the first casing gives the heat-conducting plate, and the heat-conducting plate has heat conduction speed fast, and the heat-radiating capacity is strong nature, and the heat-conducting plate passes through the heat transfer and receives the heat of superconductive quantum chip, then passes through the mode of heat radiation and transmits to electrified microballon, and the trend of vibration behind electrified microballon absorption heat is strengthened, restraines the vibration of electrified microballon in order to subtract the motion trend of electrified microballon through adjusting electric field, and then reaches the purpose of cooling.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a refrigeration method applied to a superconducting quantum chip provided by an embodiment of the invention;
fig. 2 is a schematic structural diagram of a quantum computing device according to an embodiment of the present invention.
In the figure:
1-a superconducting quantum chip;
2-a first housing;
3-cryogenic fluid piping;
31-a pipe section;
32-a heat sink;
4-a gas collection device;
5-a second housing;
6-electric field means;
7-charged microspheres.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments, and all other embodiments obtained by those skilled in the art without making any inventive effort based on the embodiments of the present invention are within the scope of protection of the present invention.
In the description of embodiments of the present invention, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying any relative importance unless explicitly specified or limited otherwise; the term "plurality" means two or more, unless specified or indicated otherwise; the terms "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of the present specification, it should be understood that the terms "upper", "lower", and the like used in the embodiments of the present invention are described in terms of the angles shown in the drawings, and should not be construed as limiting the embodiments of the present invention. In the context of this document, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on the other element or be indirectly on the other element through intervening elements.
As shown in fig. 1, an embodiment of the present invention provides a refrigeration method applied to a superconducting quantum chip, including:
s1, preparing a first shell and a second shell; the second shell is connected with the first shell through a heat conducting plate, and one surface of the superconducting quantum chip is attached to the surface, facing the inside of the first shell, of the heat conducting plate;
s2, vacuumizing the first shell and the second shell respectively to enable the first shell and the second shell to be in vacuum environments;
s3, applying an electric field to the inside of the second shell to capture the preset charged microspheres in the second shell; wherein the charged microspheres are provided with fluorescent markers;
s4, collecting fluorescence information released by the charged microspheres; wherein the fluorescence information includes the intensity of fluorescence;
and S5, adjusting an electric field according to fluorescence information to weaken vibration of the charged microspheres and providing an ultralow temperature environment for the superconducting quantum chip.
In the embodiment of the present invention, first, the first case and the second case are prepared, and the first case and the second case share the heat conductive plate, that is, the heat conductive plate is the plate body forming both the first case and the second case. The superconducting quantum chip is adhered and fixed on the surface of the heat conducting plate facing the first shell, namely the superconducting quantum chip is positioned in the first shell. And vacuumizing the first shell and the second shell to preliminarily reduce the temperature in the first shell and the second shell, and simultaneously, reducing the loss of the temperature after the vacuum environment is at ultralow temperature. The second shell is internally provided with charged microspheres, and the charged microspheres are movably arranged on the target position of the second shell. The electric field is applied to capture the charged microspheres, and the electric field can be adjusted to drive the charged microspheres to the preset position of the second shell after the charged microspheres are captured. The charged microsphere marked with fluorescence can release fluorescence, fluorescence information in the second shell is collected, and the electric field is regulated according to the fluorescence information to inhibit the vibration of the charged microsphere so as to manufacture an ultralow-temperature environment. So, be in ultra-low temperature environment in the second casing, the heat transfer of superconductive quantum chip in the first casing gives the heat-conducting plate, and the heat-conducting plate has heat conduction speed fast, and the heat-radiating capacity is strong nature, and the heat-conducting plate passes through the heat transfer and receives the heat of superconductive quantum chip, then passes through the mode of heat radiation and transmits to electrified microballon, and the trend of vibration behind electrified microballon absorption heat is strengthened, restraines the vibration of electrified microballon in order to subtract the motion trend of electrified microballon through adjusting electric field, and then reaches the purpose of cooling.
In some embodiments of the invention, adjusting the electric field to attenuate the vibration of the charged microspheres based on the fluorescence information comprises:
judging the real-time vibration direction of the charged microspheres according to the real-time change of the fluorescence information;
the electric field is adjusted according to the real-time vibration direction of the charged microspheres to weaken the vibration of the charged microspheres.
In this embodiment, the fluorescence information includes fluorescence intensity, and the change in the position of the charged microsphere can be determined according to the change in fluorescence intensity, so that the vibration direction and vibration amplitude of the charged microsphere can be determined. The intensity and the direction of the electric field are regulated through the vibration direction and the vibration amplitude of the charged microspheres, so that the movement of the charged microspheres is restrained to enable the charged microspheres to approach to static state infinitely, and the milli-opening temperature can be reached in the second shell.
In some embodiments of the present invention, after the first housing and the second housing are vacuumized to make the first housing and the second housing in vacuum environments, before the electric field is applied to the inside of the second housing to capture the charged microspheres preset in the second housing, the method further comprises:
the maximum variable frequency and the maximum field strength of the electric field are selected according to the diameter of the charged microsphere.
The electric field may be provided by an electric field device, the voltage of a power source to which the electric field device is connected may be variable, so that the electric field strength of the electric field device may be adjusted by adjusting the voltage. The power supply provides high-frequency alternating current, and the frequency of the alternating current is greater than the vibration frequency of the charged microspheres, so that the vibration of the charged microspheres can be inhibited by continuously changing the positive and negative polarities of the electric field.
The embodiment of the invention also provides a quantum computing device which comprises a superconducting quantum chip 1, a first shell 2, a second shell 5, a vacuumizing device, an electric field device 6, a fluorescence receiving device and a control device; the second shell 5 is connected with the first shell 2 through a heat conducting plate, and one surface of the superconducting quantum chip 1 is attached to the surface of the heat conducting plate facing the inside of the first shell 2;
the vacuumizing device is used for vacuumizing the first shell and the second shell respectively so that the first shell and the second shell are in vacuum environments;
the electric field device 6 is used for applying an electric field to the interior of the second shell to capture charged microspheres 7 preset in the second shell, and the charged microspheres are marked with fluorescence;
the fluorescence receiving device is used for collecting fluorescence information, and the fluorescence information comprises the intensity of fluorescence;
the control device is used for receiving fluorescence information in the second shell;
the control device is used for adjusting the electric field of the electric field device according to the fluorescence information so as to weaken the vibration of the charged microsphere 7 and provide an ultralow temperature environment for the superconducting quantum chip.
A second housing 5 is arranged next to the outside of the first housing 2, and an electric field device is arranged in the second housing 5, wherein the electric field device provides a variable electric field capable of capturing the charged microspheres 7. The essence of temperature, i.e. the vibration of particles in space, is that the second housing 5 is in a vacuum environment and the charged microspheres 7 are the only particles present in the second housing 5, so that the amplitude and frequency of the vibration of the charged microspheres 7 directly affects the temperature in the second housing 5. The second shell 5 is provided with a fluorescence receiving device, the charged microspheres 7 are marked with fluorescence, the fluorescence receiving device can receive fluorescence information sent by the charged microspheres 7, the control device can calculate the positions of the charged microspheres 7 in real time according to the fluorescence information, further judge the motion state of the charged microspheres 7, and the control device reversely adjusts the electric field device according to the real-time motion state of the charged microspheres 7, further achieve the effect of inhibiting the motion of the charged microspheres 7, and enable the charged microspheres 7 to approach to static infinitely so as to prepare an environment approaching to absolute zero. The superconducting quantum chip 1 in the first shell 2 is attached to a heat conducting plate, heat of the superconducting quantum chip 1 is conducted to the heat conducting plate through heat transfer, the heat conducting plate dissipates heat in a heat radiation mode, the charged microspheres 7 are heated through heat radiation, vibration of the charged microspheres 7 is increased, and the vibration of the charged microspheres 7 is reduced through the cooperation of the control device and the electric field device, so that the temperature of the superconducting quantum chip 1 is reduced; the other surface of the superconducting quantum chip 1 radiates heat by the heat radiation portion 32 bonded thereto. This can provide ultra-low temperatures on the milli-opening scale for the superconducting quantum chip 1.
It will be appreciated that the volume of the second housing 5 may be smaller than the first housing 2, the plate of the second housing 5 facing the first housing 2 being a heat conductive plate, and the heat conductive plate constituting only a part of the plate of the first housing 2 facing the second housing 5.
The plate body provided with the superconducting quantum chip 1 may be a heat-conducting plate, or may be a part of the plate body, that is, the part of the plate body attached to the superconducting quantum chip 1 is a heat-conducting plate, and the rest part is a common plate body.
It should be noted that the fluorescent receiving device and the electric field device should be avoided being disposed on the same inner wall of the plate of the second housing, so that the two devices can be prevented from interfering with each other.
In some embodiments of the invention, the charged microspheres 7 are charged glass microspheres having a diameter of 400 nanometers.
In this embodiment, the charged microsphere 7 is a charged glass microsphere, and the charged microsphere 7 with different diameters may be selected according to the field strength of the electric field device, for example, 100 nm, 200 nm, 300 nm or 400 nm.
In some embodiments of the present invention, the second housing is a cuboid formed by 6 plates, and the quantum computing device includes two fluorescence receiving devices, where the two fluorescence receiving devices are respectively disposed on inner walls of two plates perpendicular to each other of the second housing 5.
In this embodiment, two fluorescent receiving devices respectively disposed on two inner walls of the second housing 5 perpendicular to each other can obtain fluorescent information of the charged microsphere 7 on two surfaces, and according to the fluorescent information of the charged microsphere on the two surfaces, the actual position of the charged microsphere 7 in the second housing 5 can be determined. The two fluorescence receiving devices receive different intensities of fluorescence information, the position information of the point with the strongest fluorescence intensity in each fluorescence receiving device is input to the control device, the position of the point is the projection of the charged microsphere 7 on the surface where the fluorescence receiving device is located, the position of the charged microsphere 7 can be obtained according to the position of the point with the strongest fluorescence intensity on the surface where the two fluorescence receiving devices are located, and then the motion state and the vibration direction of the charged microsphere 7 can be judged in real time according to the change of the position.
In some embodiments of the invention, the side of the heat conducting plate facing the second housing 5 is provided with an infrared reflecting film;
the heat conductive plate is provided with an infrared transmitting film on a side facing the first housing 2.
In this embodiment, since the temperature of the heat conducting plate is low, the heat radiation mainly includes infrared radiation, and therefore, in order to prevent the infrared radiation from being reflected back onto the heat conducting plate, an infrared reflecting film is provided on a side of the heat conducting plate facing the second housing 5, for reflecting the infrared radiation, and preventing the infrared radiation from transmitting heat back onto the heat conducting plate. Providing an infrared transmitting film on the side of the heat conductive plate facing the first housing 2 can promote the entry of infrared radiation into the heat conductive plate and prevent the infrared radiation generated by the heat conductive plate from being transmitted to the superconducting quantum chip 1.
In some embodiments of the present invention, among the plate bodies constituting the second housing 5, the plate bodies other than the heat conductive plate have a radiation protection and heat insulation function.
In some embodiments of the invention, the plate body other than the heat conductive plate is made of a radiation-proof heat insulating material.
In some embodiments of the present invention, the plate body other than the heat conductive plate is a composite plate material, and the composite plate material is a heat insulating material and a radiation protection material sequentially from outside to inside.
In the present invention, the plate body constituting the second casing 5 may be a radiation-proof heat insulating material, or may be a composite plate-like material comprising a heat insulating material and a radiation-proof material in this order from the outside to the inside. By the arrangement, the plate body can prevent the external heat from interfering the temperature of the inner wall of the second shell 5 and prevent the external heat radiation from interfering the inside of the second shell 5.
The heat conducting plate forms the first housing 2 and the second housing 5, and the plate bodies of the first housing 2 and the second housing 5 except the heat conducting plate are made of heat insulating materials. The second casing 5 is in a vacuum environment, and the first casing 2 is in a vacuum environment, so that volatilization of the low-temperature fluid in the heat radiating portion 32 can be promoted. The vacuum degree in the gas collection device 4 is larger than or equal to the vacuum degree of the first shell 2, and the air pump can further accelerate the speed of the gas in the first shell 2 entering the gas collection device 4.
In this embodiment, in order to further ensure that superconducting quantum chip 1 is in a low temperature environment, the quantum computing device further includes a low temperature fluid conduit 3 and a gas collection device 4;
the low-temperature fluid pipeline 3 comprises a pipeline part 31 and a heat dissipation part 32, the pipeline part 31 penetrates into the first shell 2, the heat dissipation part 32 is positioned in the first shell 2 and is attached to the superconducting quantum chip 1, the heat dissipation part 32 is provided with heat dissipation holes, and low-temperature fluid flows into the heat dissipation part 32 through the pipeline part 31;
the gas collecting device 4 is communicated with the first shell 2 through a gas collecting pipeline, and the gas collecting device 4 is used for collecting gas formed by evaporation and gasification of the low-temperature fluid.
In the embodiment of the present invention, the pipe portion 31 passes through the first housing 2, the pipe portion 31 communicates with the heat dissipation portion 32, the heat dissipation portion 32 is attached to the superconducting quantum chip 1, and the heat dissipation portion 32 is provided with a plurality of heat dissipation holes. The low-temperature fluid enters the heat radiating part 32 and exchanges heat with the superconducting quantum chip 1, so that the temperature of the superconducting quantum chip 1 is reduced. The low-temperature fluid in the heat dissipation part 32 is phase-changed and evaporated through the heat dissipation holes, so that the effect of reducing the temperature of the superconducting quantum chip 1 is further improved, and the ultra-low-temperature computing environment is finally provided for the superconducting quantum chip 1. The gas collecting device 4 connected with the shell can collect volatilized gas to recycle the cooling working medium on one hand, and on the other hand, the evaporation speed of the low-temperature fluid in the heat radiating part 32 can be accelerated after the gas enters the gas collecting device 4.
It will be appreciated that the cryogenic fluid flows into the heat sink 32. One surface of the superconducting quantum chip 1 is attached with a heat conducting plate to dissipate heat through the second shell 5, and the other surface of the superconducting quantum chip 1 is attached with a heat dissipating part 32 to dissipate heat. This can provide ultra-low temperatures on the milli-opening scale for the superconducting quantum chip 1.
It should be noted that, the quantum computing device of this embodiment further includes a wire, one end of which passes through the first housing 2 and is connected to the quantum chip 1, and the other end of which is connected to an external microwave pulse device, a signal receiving device, and other devices. The low-temperature fluid flowing through the low-temperature fluid pipeline 3 can be liquid hydrogen, liquid nitrogen or liquid helium, preferably liquid helium with the temperature below 4K, and the liquid helium has excellent properties such as superfluity, creeping film phenomenon, superconductivity, viscosity coefficient close to zero and the like, so that excellent heat dissipation and refrigeration performance can be provided, and the operation of the superconducting quantum chip 1 is not influenced.
In some embodiments of the invention, the gas collection device 4 is provided with a suction pump for sucking the gas in the first housing 2 into the gas collection device 4.
In this embodiment, the air pump can rapidly pump the air in the first housing 2 into the air collecting device 4, so that the evaporation speed of the cryogenic fluid can be further increased, and the refrigeration efficiency can be further increased.
In some embodiments of the present invention, two cryogenic fluid pipes 3 are included, and two heat dissipation parts 32 of the two cryogenic fluid pipes 3 are respectively disposed at two largest faces of the superconducting quantum chip 1.
In the present embodiment, the two heat dissipating portions 32 can increase the heat dissipating rate, and the heat dissipating rate can be increased as well as the maximum surface connection of the quantum chip 1.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A refrigeration method applied to a superconducting quantum chip, comprising:
preparing a first shell and a second shell; the second shell is connected with the first shell through a heat conducting plate, and one surface of the superconducting quantum chip is attached to the surface, facing the inside of the first shell, of the heat conducting plate;
vacuumizing the first shell and the second shell respectively to enable the first shell and the second shell to be in vacuum environments;
applying an electric field to the inside of the second housing to capture the charged microspheres preset in the second housing; wherein the charged microspheres are fluorescently labeled;
collecting fluorescence information released by the charged microspheres; wherein the fluorescence information includes the intensity of fluorescence;
and adjusting the electric field according to the fluorescence information to weaken the vibration of the charged microspheres, and providing an ultralow temperature environment for the superconducting quantum chip.
2. The method of claim 1, wherein said adjusting said electric field to attenuate vibration of said charged microspheres based on said fluorescence information comprises:
judging the real-time vibration direction of the charged microspheres according to the real-time change of the fluorescence information;
and adjusting the electric field according to the real-time vibration direction of the charged microspheres so as to weaken the vibration of the charged microspheres.
3. The method of claim 1, further comprising, after the evacuating the first housing and the second housing, respectively, to make both the first housing and the second housing a vacuum environment, before applying an electric field to the inside of the second housing to capture the charged microspheres preset in the second housing:
the maximum variable frequency and the maximum field strength of the electric field are selected according to the diameter of the charged microsphere.
4. The quantum computing device is characterized by comprising a superconducting quantum chip (1), a first shell (2), a second shell (5), a vacuumizing device, an electric field device (6), a fluorescence receiving device and a control device; the second shell (5) is connected with the first shell (2) through a heat conducting plate, the heat conducting plate forms the first shell (2) and the second shell (5), and one surface of the superconducting quantum chip (1) is attached to the surface, facing the inside of the first shell (2), of the heat conducting plate;
the vacuumizing device is used for vacuumizing the first shell and the second shell respectively so that the first shell and the second shell are in vacuum environments;
the electric field device (6) is used for applying an electric field to the inside of the second shell to capture charged microspheres (7) preset in the second shell, and the charged microspheres are marked with fluorescence;
the fluorescence receiving device is used for collecting fluorescence information, and the fluorescence information comprises the intensity of fluorescence;
the control device is used for receiving the fluorescence information in the second shell;
the control device is used for adjusting the electric field of the electric field device according to the fluorescence information so as to weaken the vibration of the charged microspheres (7) and provide an ultralow temperature environment for the superconducting quantum chip.
5. The quantum computing device according to claim 4, characterized in that the charged microspheres (7) are charged glass microspheres with a diameter of 400 nm.
6. The quantum computing device according to claim 4, wherein the second housing is a rectangular parallelepiped formed of 6 plates, and the quantum computing device includes two fluorescence receiving devices, which are respectively provided on inner walls of two plates of the second housing (5) perpendicular to each other.
7. The quantum computing device according to claim 4, characterized in that a face of the heat conducting plate facing the second housing (5) is provided with an infrared reflecting film;
an infrared transmission film is arranged on one surface of the heat conduction plate, which faces the first shell (2).
8. The quantum computing device according to claim 4, wherein the plate body other than the heat conductive plate has a radiation protection and heat insulation function among the plate bodies constituting the second housing (5).
9. The quantum computing device of claim 8, wherein the fabrication material of the plate body other than the heat conducting plate is a radiation-proof heat insulating material.
10. The quantum computing device of claim 8, wherein the plate body other than the heat conducting plate is a composite plate material, and the composite plate material is a heat insulating material and a radiation protection material in sequence from outside to inside.
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| CN116596080B (en) * | 2023-07-19 | 2023-09-26 | 中诚华隆计算机技术有限公司 | Method for improving quantum computing stability |
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