CN111916389B

CN111916389B - Thimble device

Info

Publication number: CN111916389B
Application number: CN201910378435.2A
Authority: CN
Inventors: 蔡俊伟
Original assignee: Chroma ATE Suzhou Co Ltd
Current assignee: Chroma ATE Suzhou Co Ltd
Priority date: 2019-05-08
Filing date: 2019-05-08
Publication date: 2024-05-24
Anticipated expiration: 2039-05-08
Also published as: CN111916389A

Abstract

The invention provides a thimble device which is used for ejecting out a chip on a film, wherein the chip has a first length in a first direction and a first width in a second direction. The thimble device comprises a thimble cover, and the thimble cover is defined with a contact surface. The contact surface is provided with a top pinhole, wherein the top pinhole has a second length in the first direction and a second width in the second direction. The contact surface is used for contacting the film, and when the first length is greater than the second length, the first width is not greater than the second width. When the first width is greater than the second width, the first length is not greater than the second length.

Description

Thimble device

Technical Field

The present invention relates to a ejector pin device, and more particularly, to an ejector pin device for ejecting a chip on a film.

Background

Conventionally, after the wafer has completed the entire semiconductor process, alignment and dicing steps are required, so that the wafer may be divided into a plurality of chips having specific functions, and the plurality of chips thus diced are typically adhered to a film and regularly arranged. Generally, the advantage of using a film to attach chips is that collision and friction between chips can be avoided, and damage generated during transportation is reduced. In addition, the chip is temporarily fixed by using the adhesive material, so that the process of taking the chip is simpler, complicated precision equipment is not needed, and the efficiency of taking the chip can be increased.

For example, conventionally, when a chip is taken, a chip is pushed under a film by using a thimble, and after the chip is tilted or separated from the film, the chip is sucked out or nipped out. However, because the viscosities of different areas of the film may be slightly different, the ejector pin may not necessarily actually tilt or separate from the film when ejecting the chip, and thus the chip may not be sucked or nipped out smoothly. In addition, if the chip is in a strip shape or is fragile in structure, the chip is likely to be broken or damaged directly when the ejector pin ejects the chip. Therefore, there is a need for a new ejector pin device that can facilitate the separation of the chip from the film and reduce the breakage or breakage of the chip when the ejector pin ejects the chip on the film.

Disclosure of Invention

In view of this, the present invention provides a thimble device with better design of thimble cap, so that the chip can be separated from the film more easily, and the probability of breakage or breakage of the chip can be reduced.

The invention provides a thimble device which is used for ejecting a chip on a film, wherein the chip has a first length in a first direction and a first width in a second direction. The thimble device comprises a thimble cover, and the thimble cover is defined with a contact surface. The contact surface is provided with a top pinhole, wherein the top pinhole has a second length in the first direction and a second width in the second direction. Wherein the contact surface is configured to contact the film, and the first width is not greater than the second width when the first length is greater than the second length, or the first length is not greater than the second length when the first width is greater than the second width.

In an embodiment, the contact surface of the thimble cover may further have a plurality of air pumping holes, and the plurality of air pumping holes are communicated with the air pumping system, and when the contact surface contacts the film, the air pumping system provides negative pressure to adsorb the film through the plurality of air pumping holes. The contact surface of the ejector pin cover can be provided with a first recess, the first recess extends in the first direction, and at least part of the air suction hole is arranged in the first recess. The contact surface of the thimble cover can also be provided with a second recess, the second recess extends in the second direction, and at least part of the air exhaust hole is arranged in the second recess. The contact surface of the thimble cover can be further provided with a third recess, the third recess surrounds the thimble hole, and at least part of the air exhaust hole is arranged in the third recess. And the contact surface of the thimble cover is further provided with a plurality of fourth depressions, each air extraction hole corresponds to one of the fourth depressions, and the area of each fourth depression on the contact surface is larger than that of one air extraction hole on the contact surface.

In an embodiment, the ejector pin device may have a first ejector pin, where the first ejector pin selectively protrudes from the ejector pin hole to the contact surface, the top surface of the first ejector pin has a third length in the first direction, the top surface has a third width in the second direction, and the third length is greater than the third width. In addition, the thimble device can also be a second thimble and a third thimble, the second thimble and the third thimble selectively protrude out of the contact surface from the thimble hole, the second thimble and the third thimble are separated by a first distance, and the ratio of the first distance to the second length is between 0.3 and 0.7.

In an embodiment, the top pinhole may be rectangular, and the second length is the length of the long side of the rectangle, and the second width is the length of the short side of the rectangle. The pinhole may be elliptical, and the second length may be the length of the major axis of the ellipse, and the second width may be the length of the minor axis of the ellipse.

In summary, the ejector pin device provided by the invention designs a new ejector pin cover, the ejector pin hole on the ejector pin cover can enable the ejector pin to freely penetrate out, and the length of one side of the ejector pin hole is smaller than the length of the corresponding side of the chip. Therefore, when the film is slightly trapped in the top pinhole, the chip can be blocked on the contact surface, so that the chip can be separated from the film more easily, and the probability of breakage or breakage of the chip can be reduced.

Other features and embodiments of the present invention are described in detail below with reference to the accompanying drawings.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to the drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic perspective view of a thimble device according to an embodiment of the present invention;

FIG. 2 is a partial perspective view of an ejector pin assembly according to one embodiment of the present invention;

FIG. 3 is a schematic diagram illustrating an ejector pin apparatus according to an embodiment of the present invention;

FIG. 4 is a perspective view of a thimble device according to another embodiment of the present invention;

FIG. 5 is a partial perspective view of a thimble device according to another embodiment of the present invention.

Symbol description

1 Thimble device 10 thimble lid

10A contact surface 102 top pinhole

104 Air extraction holes 106a, 106b, 106c are recessed

12 Base 2 film

3 Chip 4 thimble device

40 Thimble cap 40a contact surface

402 Top pinhole 404 bleed hole

406 Concave 42 seat body

Detailed Description

The foregoing and other technical aspects, features and advantages of the present invention will become more apparent from the following detailed description of a preferred embodiment, which proceeds with reference to the accompanying drawings. The directional terms mentioned in the following embodiments are, for example: upper, lower, left, right, front or rear, etc., are merely references to the directions of the drawings. Thus, the directional terminology is used for purposes of illustration and is not intended to be limiting of the invention.

Referring to fig. 1 and 2, fig. 1 is a schematic perspective view illustrating an ejector pin device according to an embodiment of the invention, and fig. 2 is a schematic partial perspective view illustrating an ejector pin device according to an embodiment of the invention. As shown, the thimble device 1 may have a thimble cap 10 and a seat 12, the thimble cap 10 is mounted at one end of the seat 12, and the thimble cap 10 defines a contact surface 10a facing the outside of the thimble device 1. In one example, the spike cover 10 and the seat 12 may be integrally formed, or the spike cover 10 may be plate-shaped or sheet-shaped and detachably combined at one end of the seat 12, which is not limited herein. In addition, the present embodiment also does not limit how the spike cover 10 and the seat 12 are combined, provided that the spike cover 10 and the seat 12 are detachable. For example, the thimble cap 10 and the seat 12 may be engaged, adhered, screwed, etc., so long as the thimble cap 10 and the seat 12 can be fixed together, it is within the scope of the thimble cap 10 and the seat 12 described in this embodiment. In addition, the base 12 may be a hollow tube or a column, the base 12 may have a certain hardness, and a receiving space (not shown) may be provided inside the base 12. In practice, the accommodating space is used for accommodating a thimble (not shown) or a part of an air extraction system (not shown), for example, an air extraction pipeline communicated with the air extraction system can be accommodated in the accommodating space. In addition, the base 12 can be used for protecting the thimble or the air extraction pipeline, so that the thimble or the air extraction pipeline is prevented from being extruded or bent by external force from the side edge of the base 12.

Taking the ejector cover 10 shown in fig. 1 and 2 as an example, the outer surface of the ejector cover 10 may be defined as a contact surface 10a, and the contact surface 10a may be regarded as the most protruding end of the ejector device 1. In practice, the contact surface 10a of the ejector pin device 1 directly contacts the film in order to eject the chip on the film. In order to demonstrate the situation of the ejector device 1 during operation, please refer to fig. 2 and 3 together, fig. 3 is a schematic diagram illustrating the ejector device according to an embodiment of the present invention. As shown in the figure, a chip 3 may be adhered to one side of the film 2, and a contact surface 10a on the ejector cover 10 may contact the other side of the film 2, where the ejector cover 10 and the chip 3 are located at opposite positions on two sides of the film 2. In other words, the contact surface 10a of the ejector cover 10 may directly contact the film 2 and indirectly contact the chip 3 through the film 2. In one example, in order for ejector 1 to eject chip 3 correctly, ejector 1 and chip 3 need to be aligned first. Here, the present embodiment is not limited to the case of fixing the ejector 1 and moving the film 2, or the case of fixing the film 2 and moving the ejector 1, as long as the ejector 1 and the chip 3 can be aligned with each other.

In a practical example, the chip 3 will generally have a rectangular shape when viewed from the side above the chip 3. That is, the chip 3 may have a first length in the first direction and a first width in the second direction. For convenience of explanation, the first direction and the second direction may be directions of two perpendicular sides of the rectangle, respectively, i.e., the first direction may be perpendicular to the second direction. In other words, the first length may be the side length of one side of the chip 3 in the first direction, and the first width may be the side length of the other side of the chip 3 in the second direction. Here, if the chip is a square, the first length may be equal to the first width. If the chip is rectangular, the first length (long side length) may be greater than the first width (short side length).

With continued reference to fig. 2, the contact surface 10a of the ejector cover 10 has an ejector hole 102, and the ejector hole 102 may be substantially in a central area of the contact surface 10a, which is not limited herein. In the case where the ejector pin device 1 and the chip 3 have been subjected to positional alignment, the chip 3 may have a part of the vertical projection area overlapping the vertical projection area of the ejector pin hole 102. In other words, in the case where the ejector pin device 1 and the chip 3 have been subjected to the positional alignment, the chip 3 corresponds not only to the ejector pin hole 102 in position but also to the shape of the chip 3 substantially corresponding to the opening shape of the ejector pin hole 102 (for example, the long side and the short side of the rectangle have the same extending direction). In one example, top pinhole 102 has an opening length D1 (second length) in the first direction and an opening width D2 (second width) in the second direction.

In one example, the opening length D1 of the top pinhole 102 may be greater than the opening width D2, so that the top pinhole 102 may be rectangular. Or the opening length D1 of the top pinhole 102 may be substantially equal to the opening width D2, so that the top pinhole 102 may be a square. However, the top pinhole 102 does not necessarily have corners of a rectangle (rectangle or square). As shown in fig. 2 for the top pinhole 102, corners of the top pinhole 102 may be rounded, so that the top pinhole 102 may more closely approximate the shape of a capsule. In addition, the shape of top pinhole 102 may be more elliptical than rectangular. Taking the example where the shape of the top pinhole 102 is an ellipse, the opening length in the first direction (second length) may be the length of the major axis of the ellipse, and the opening width in the second direction (second width) may be the length of the minor axis of the ellipse.

It should be noted that, although the film 2 may be made of a soft material, the chip 3 is not substantially trapped inside the top pinhole 102 by properly designing the opening shape of the top pinhole 102. That is, after the engineer has known that the ejector 1 is used to pick up the chip 3 of a very small size, the chip 3 is not trapped in the ejector hole 102 by designing the ejector hole 102 in the ejector cover 10. In order to achieve the goal that the chip 3 does not fall into the top-pinhole 102, several possible designs of the top-pinhole 102 are provided in this embodiment. For example, one of them is that, since the side lengths of the chip 3 in the first direction and the second direction are known, when the side length (first length) of the chip 3 in the first direction is larger than the opening length D1 (second length) of the top pinhole 102 in the first direction, the side length (first width) of the chip 3 in the second direction is not larger than the opening width D2 (second width) of the top pinhole 102 in the second direction. For example, another is that when the side length (first width) of the chip 3 in the second direction is larger than the opening width D2 (second width) of the top pinhole 102 in the second direction, the side length (first length) of the chip 3 in the first direction is not larger than the opening length D1 (second length) of the top pinhole 102 in the first direction.

This embodiment illustrates that the chip 3 is not trapped in the top pinhole 102, and has practical significance. For practical example, when the ejector 1 and the chip 3 have completed the alignment and the ejector 1 is to eject the chip 3, the contact surface 10a contacts the film 2, and the pumping system is activated. In one example, the contact surface 10a of the ejector cover 10 further has a plurality of air extraction holes 104, and the plurality of air extraction holes 104 may be connected to the air extraction system through an air extraction pipeline, and the air extraction pipeline may be accommodated in the seat 12. When the pumping system is activated, the pumping system may provide a negative pressure via the pumping line such that the pumping aperture 104 assumes a pumping state (begins to draw gas into the pumping aperture 104). At this time, since the suction hole 104 is connected to the suction line at the negative pressure, the film 2 is closely adsorbed on the contact surface 10 a. In particular, the film 2 above the top pinhole 102 tends to be caught in the top pinhole 102 due to the suction force of the negative pressure. However, since the chip 3 is adhered over the film 2 and since the chip 3 is not caught in the top pinhole 102, the film 2 adhering the chip 3 is not easily caught in the top pinhole 102.

In this embodiment, the film 2 is pulled toward the top pinhole 102 by blocking the chip 3 above the top pinhole 102 (i.e., on the contact surface 10 a) by a design in which the top pinhole 102 is slightly smaller than the chip 3, instead of the film 2 and the chip 3 adhered above being caught in the top pinhole 102 together. It should be understood by those skilled in the art that by adjusting the negative pressure value provided by the air extraction system, the film 2 and the chip 3 can be separated appropriately as long as the tensile force of the negative pressure is slightly greater than the adhesion force between the film 2 and the chip 3. In one example, the pulling force of the negative pressure may be, for example, 101% -150% of the adhesive force between the film 2 and the chip 3, this percentage being related to the time when the film 2 is detached from the chip 3, the larger the difference between the pulling force and the adhesive force, the faster the detachment can be, of course, made, which can be adjusted by a person of ordinary skill in the art as desired.

It should be noted that, the chip 3 is easier to be taken after the chip 3 is separated from a certain area of the film 2. In order to make the film 2 more easily separated from the chip 3 by a certain area and to facilitate practical operation, the opening length D1 or the opening width D2 of the top pinhole 102 of the present embodiment may alternatively be smaller than the corresponding side length of the chip 3, and the other of the opening length D1 or the opening width D2 is larger than the other corresponding side length of the chip 3. Therefore, in addition to the larger area of the top pinhole 102, the negative pressure pulling force can be provided in a larger range, and the top pinhole 102 has one side longer than the chip 3, so that the film 2 exposed to the chip 3 but within the top pinhole 102 can be quickly trapped in the top pinhole 102 without being involved by the adhesive force of the chip 3. In conjunction with the film 2 having been trapped in the top-pin-hole 102, the film 2 under the chip 3 may be pulled laterally, so that the film 2 under the chip 3 is more likely to be trapped in the top-pin-hole 102 to be separated from the chip 3. In other words, the design of the top pinhole 102 of the present embodiment can make the chip 3 separate from the film 2 from the side rapidly, and simultaneously can clamp the chip 3 on the side of the top pinhole 102 shorter than the chip 3, so as to increase the efficiency and convenience of separating the chip 3 from the film 2.

In contrast, if the opening length or the opening width of the top pinhole is larger than the corresponding side length of the chip 3, the area of the chip 3 is smaller than the area of the top pinhole. At this time, the chip 3 and the film 2 will be trapped in the top pinhole together, so that the film 2 is not easily separated from the chip 3 by the pulling force of the negative pressure. On the other hand, if the opening length or opening width of the top pinhole is smaller than or equal to the corresponding side length of the chip 3, the area of the chip 3 is larger than or almost equal to the area of the top pinhole. At this time, unlike the design of the top pinhole 102 in the present embodiment, the chip 3 can be quickly separated from the film 2 from the side, and if the top pinhole is too small, the film 2 can only be pulled from below by negative pressure. Obviously, the design of the too small top-hole requires a larger negative pressure for separating the film 2 from the chip 3 in a certain area, and greatly increases the separation time of the film 2 from the chip 3.

On the other hand, in order to allow the film 2 to be more closely adsorbed to the contact surface 10a, the plurality of air suction holes 104 on the contact surface 10a may be uniformly arranged so that the film 2 may be subjected to a tensile force of negative pressure over a large area. The arrangement pattern of the plurality of air pumping holes 104 is not limited in this embodiment, for example, the plurality of air pumping holes 104 may have an array pattern, or the plurality of air pumping holes 104 may have a center diffusion pattern as shown in fig. 2. Furthermore, the contact surface 10a may have one or more depressions of different forms. As shown in fig. 2, the contact surface 10a may have a recess 106a (first recess), and the recess 106a extends in the first direction, and at least a portion of the pumping hole 104 is disposed in the recess 106 a. Here, the axial direction of the recess 106a may be the same as the longitudinal direction of the top pinhole 102 (first direction), in other words, some of the air extraction holes 104 may be located in the longitudinal direction of the top pinhole 102. Therefore, the film 2 having been caught in the recess 106a in the long axis direction of the top pinhole 102 may also laterally pull the film 2 under the chip 3, so that the film 2 under the chip 3 is more likely to be separated from the chip 3. The length and width of the recess 106a are not limited in this embodiment, as long as the air suction hole 104 can be disposed in the recess 106a, which falls into the category of the first recess described in this embodiment.

In addition, the contact surface 10a may also have a recess 106b (a second recess), and the recess 106b extends in the second direction, and at least a portion of the air extraction hole 104 is disposed in the recess 106 b. Here, the axial direction of the recess 106b may be the same as the short side axial direction of the top pinhole 102 (second direction), in other words, some of the pumping holes 104 may be located in the short side axial direction of the top pinhole 102. Therefore, the film 2 having been trapped in the recess 106b in the short axis direction of the top pinhole 102 may also laterally pull the film 2 under the chip 3, so that the film 2 under the chip 3 is more likely to be separated from the chip 3. The length and width of the recess 106b are not limited in this embodiment, as long as the air suction hole 104 can be disposed in the recess 106b, i.e. the second recess described in this embodiment.

In addition, the contact surface 10a may have a recess 106c (third recess), and the recess 106c surrounds the top pinhole 102, and at least a part of the air extraction holes 104 are disposed in the recess 106 c. Here, although three layers of circular recesses 106c are shown in fig. 2, the number of recesses 106c is not limited in the present embodiment, and for example, only one recess 106c may be used. Therefore, the film 2 having sunk into the recess 106c around the top pinhole 102 may also laterally pull the film 2 under the chip 3, so that the film 2 under the chip 3 is more likely to be separated from the chip 3. The size and width of the recess 106c are not limited in this embodiment, as long as the air-pumping hole 104 can be disposed in the recess 106c, and the center point of the circle of the recess 106c is substantially the same as the center point of the top pinhole 102, which belongs to the category of the third recess in this embodiment.

In practical operation, when the film 2 under the chip 3 is slightly separated from the chip 3 or the film 2 is separated from the chip 3 by a certain area, the ejector pin can be driven by the present embodiment, so that the ejector pin protrudes from the ejector pin hole 102 to the contact surface 10a. The ejector pin may have a top surface for ejecting the film 2 to eject the chip 3 from the film 2. In one example, the shape of the ejector pins may approximate the shape of the ejector pin holes 102, i.e., the top surface may also have a third length in the first direction and a third width in the second direction. When the shape of the top pinhole 102 is close to a rectangle or an ellipse, the third length is larger than the third width. Here, because the top surface of the ejector pin is not in a needle-tip shape but has a certain area, and because the film 2 is slightly separated from the chip 3, when the ejector pin ejects the film 2, the chip 3 on the film 2 is uniformly stressed, and the adhesive force between the film 2 and the chip 3 is lower, so that the chip 3 can be prevented from being broken or damaged. For example, the top surface area of the ejector pin may be 5% -35%, such as 10%, 20%, 30%, of the area of the ejector pin hole 102, which is not limited herein. The area of top pinhole 102 described herein should be the complete recessed area corresponding to the location of chip 3, and does not include recessed areas (e.g., recess 106a, recess 106b, recess 106 c) that are not substantially located at the location corresponding to chip 3.

In another example, the number of the ejector pins may be more than two, for example, a certain interval may be between two adjacent ejector pins. Assuming that the number of the ejector pins is two, and the two ejector pins are arranged along the first direction, a distance between the two ejector pins (a first distance) may have a proportional relationship with an opening length D1 (a second length) of the ejector pin hole 102 in the first direction. For example, the ratio of the first distance to the opening length D1 may be between 0.3 and 0.7, such as 0.4, 0.5, 0.6, etc., which is not limited herein. Here, assuming that the number of the pins is three and the three pins are arranged along the first direction, the distance between the first and last pins in the first direction may be the second distance, and the ratio of the second distance to the opening length D1 may be between 0.3 and 0.7, for example, 0.4, 0.5, 0.6, etc., which is not limited herein.

Of course, the present invention is not limited to the concave form, and fig. 4 and 5 are also referred to herein, in which fig. 4 is a schematic perspective view of a thimble device according to another embodiment of the present invention, and fig. 5 is a schematic partial perspective view of the thimble device according to another embodiment of the present invention. As shown, the ejector pin device 4 of another embodiment of the present invention may also have an ejector pin cover 40 and a seat body 42. As in the previous embodiment, the ejector cover 40 also has a contact surface 40a, an ejector hole 402, and an air extraction hole 404. In addition, the base 12 and the base 42 are substantially the same, and the description of the embodiment is omitted. In addition, the thimble cap 40 is also mounted at one end of the seat 42, and the thimble cap 40 also defines a contact surface 40a facing the outside of the thimble device 4. In addition, the thimble cap 40 and the seat body 42 may be integrally formed, or the thimble cap 40 may be plate-shaped or sheet-shaped, and may be detachably combined with one end of the seat body 42, which is not limited herein.

Unlike the previous embodiment, the concave shape on the contact surface 40a is different from the concave shape on the contact surface 10 a. As shown in fig. 5, the contact surface 40a may have a recess 406 (fourth recess), and the recess 406 surrounds the suction hole 404. In one example, the depressions 406 and the pumping holes 404 are in a one-to-one correspondence, i.e., one depression 406 surrounds one pumping hole 404. In addition, it can be seen that the area of the recess 406 on the contact surface 40a is larger than the area of the suction hole 404 on the contact surface 40a, so that the suction hole 404 is located inside the recess 406. Therefore, because the film is trapped in the evenly distributed recesses 406 on the contact surface 40a, the film can be more firmly adsorbed on the ejector cover 40, and the lateral tension of the film can be maintained to pull the film under the chip, so that the film under the chip is more easily separated from the chip. The size and width of the recess 406 are not limited in this embodiment, as long as the air vent 404 can be disposed in the recess 406, which is the category of the fourth recess described in this embodiment.

The above examples and/or embodiments are merely for illustrating the preferred embodiments and/or implementations of the present technology, and are not intended to limit the embodiments and implementations of the present technology in any way, and any person skilled in the art should be able to make some changes or modifications to the embodiments and/or implementations without departing from the scope of the technical means disclosed in the present disclosure, and it should be considered that the embodiments and implementations are substantially the same as the present technology.

Claims

1. A pin apparatus for ejecting a chip on a film, the chip having a first length in a first direction and a first width in a second direction, comprising:

The thimble cover is defined with a contact surface, the contact surface is provided with a thimble hole, the thimble hole has a second length in the first direction and a second width in the second direction;

Wherein the contact surface is configured to contact the film, and the first width is not greater than the second width when the first length is greater than the second length; when the first width is greater than the second width, the first length is not greater than the second length.

2. The ejector pin device of claim 1, wherein the contact surface of the ejector pin cover further comprises a plurality of air extraction holes, the air extraction holes are communicated with an air extraction system, and when the contact surface contacts the film, the air extraction system provides negative pressure through the air extraction holes to adsorb the film.

3. The ejector pin device of claim 2, wherein the contact surface of the ejector pin cover further comprises a first recess extending in the first direction, and at least a portion of the air extraction holes are disposed in the first recess.

4. The ejector pin device of claim 2, wherein the contact surface of the ejector pin cover further comprises a second recess extending in the second direction, and at least a portion of the air extraction holes are disposed in the second recess.

5. The ejector pin device of claim 2, wherein the contact surface of the ejector pin cover further comprises a third recess surrounding the ejector pin hole, and at least a portion of the air extraction holes are disposed in the third recess.

6. The ejector pin device of claim 2, wherein the contact surface of the ejector pin cover further comprises a plurality of fourth recesses, each of the air extraction holes corresponds to one of the fourth recesses, and an area of each of the fourth recesses at the contact surface is larger than an area of one of the air extraction holes at the contact surface.

7. The ejector pin device of claim 1, further comprising a first ejector pin selectively protruding from the ejector pin hole toward the contact surface, a top surface of the first ejector pin having a third length in the first direction, the top surface having a third width in the second direction, and the third length being greater than the third width.

8. The ejector device of claim 1, further comprising a second ejector pin and a third ejector pin, the second ejector pin and the third ejector pin selectively protruding from the ejector pin hole toward the contact surface, the second ejector pin and the third ejector pin being spaced apart by a first distance, a ratio of the first distance to the second length being between 0.3 and 0.7.

9. The ejector pin device of claim 1, wherein the ejector pin hole is a rectangle, and the second length is a length of a long side of the rectangle, and the second width is a length of a short side of the rectangle.

10. The ejector pin assembly of claim 1, wherein the ejector pin hole is an ellipse, and the second length is a length of a major axis of the ellipse, and the second width is a length of a minor axis of the ellipse.

11. The ejector pin device of claim 1, wherein the second length is greater than the second width.