CN111900259B - Display panel, display device and preparation method of display panel - Google Patents
Display panel, display device and preparation method of display panel Download PDFInfo
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- CN111900259B CN111900259B CN202010544742.6A CN202010544742A CN111900259B CN 111900259 B CN111900259 B CN 111900259B CN 202010544742 A CN202010544742 A CN 202010544742A CN 111900259 B CN111900259 B CN 111900259B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
- H10K59/65—OLEDs integrated with inorganic image sensors
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Abstract
The application discloses a display panel, display equipment and a preparation method of the display panel, wherein the display panel comprises an array substrate, a light-emitting device layer and a packaging layer, wherein the array substrate comprises a substrate and an array layer; the light emitting device layer is positioned on one side of the array layer away from the substrate; the packaging layer is positioned on one side of the light-emitting device layer far away from the substrate; the display panel comprises a light-transmitting area, and the light-transmitting area is provided with at least one light-transmitting hole which penetrates through the array substrate and the light-emitting device layer and is not deep to the packaging layer.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel, display equipment and a preparation method of the display panel.
Background
With the development of display technology, the full-screen has received wide attention due to its advantages such as large screen occupation ratio and ultra-narrow frame. However, in a full-screen display device, functional devices such as a front camera, a receiver and an identification sensor are also arranged for realizing other functions, and in order to reduce the occupation of the functional devices on the front space of the display device and improve the screen occupation ratio of a display panel, technologies such as through holes, blind holes and a camera under the screen are adopted in the current industry in the direction of comparison with the mainstream. However, these techniques have certain disadvantages, such as difficult process of the via technology and poor reliability of the via area package. The technology of the camera under the screen has many technical difficulties to be overcome, such as diffraction, transmittance and the like. The blind via technology also has the problem of transmittance, and improvement on the current technology is urgently needed.
Disclosure of Invention
The technical problem mainly solved by the application is to provide a display panel, a display device and a preparation method of the display panel, which can reduce the performance influence of the display panel on functional devices below the display panel.
A first aspect of embodiments of the present application provides a display panel, which includes an array substrate, a light emitting device layer, and an encapsulation layer, wherein the array substrate includes a substrate and an array layer; the light emitting device layer is positioned on one side of the array layer away from the substrate; the packaging layer is positioned on one side of the light-emitting device layer far away from the substrate; the display panel comprises a light-transmitting area, and the light-transmitting area is provided with at least one light-transmitting hole which penetrates through the array substrate and the light-emitting device layer and is not deep to the packaging layer.
In an alternative embodiment, the light-transmitting holes are filled with a light-transmitting material layer.
In an alternative embodiment, the surface of the light-transmissive material layer remote from the substrate is at least flush with the surface of the light-emitting device layer remote from the substrate.
In an alternative embodiment, the material forming the light-transmissive material layer includes a light-transmissive organic material.
In an alternative embodiment, the light transmissive organic material comprises an ink, a transparent polyimide material.
A second aspect of embodiments of the present application provides a display apparatus, which includes a display panel including the display panel of any of the above embodiments, and a functional device located below the display panel and corresponding to the light-transmitting region.
A third aspect of the embodiments of the present application provides a method for manufacturing a display panel, where the method for manufacturing a display panel includes providing an array substrate, where the array substrate includes a substrate and an array layer; forming a prefabricated hole on the array substrate, wherein the prefabricated hole at least penetrates through the array layer and is deep to the substrate; forming a light-emitting device layer on the array substrate, wherein the light-emitting device layer forms a section difference at the prefabricated hole, and the light-emitting device layer material corresponding to the prefabricated hole area is deposited in the prefabricated hole; forming an encapsulation layer on the light-emitting device layer, wherein the encapsulation layer covers the light-emitting device layer and the prefabricated holes; and removing the light emitting device layer material formed in the prefabricated holes to form light transmission holes penetrating through the array substrate and the light emitting device layer on the display panel.
In an alternative embodiment, before the step of forming the encapsulation layer on the light emitting device layer, the method further includes: and filling a light-transmitting material in the prefabricated hole to form a light-transmitting material layer, wherein the surface of the light-transmitting material layer, which is far away from the substrate, is at least flush with the surface of the light-emitting device layer, which is far away from the substrate.
In an optional embodiment, the method for manufacturing a display panel further includes: providing a glass substrate, forming an array substrate on the glass substrate, wherein the prefabricated holes are through holes penetrating through the array layer and the substrate; the method for forming the light emitting device layer on the array substrate includes: the material of the light-emitting device layer in the prefabricated hole is formed on the glass carrier plate; removing the light emitting device layer material formed in the pre-holes includes: and stripping the glass carrier plate to remove the material of the light-emitting device layer formed on the glass carrier plate.
In an alternative embodiment, after the step of peeling the glass carrier, the method further includes: and thinning the substrate, and removing the material of the light-emitting device layer remained on the substrate.
In an alternative embodiment, the substrate is thinned using laser technology.
In an alternative embodiment, the preformed holes are blind holes that extend through the array layer and deep to but not through the substrate; a step of forming a light emitting device layer on an array substrate, comprising: the light-emitting device layer material in the prefabricated hole is formed on the substrate; removing the light emitting device layer material formed in the pre-holes includes: and thinning the substrate to remove the material of the light-emitting device layer formed on the substrate.
In an alternative embodiment, the step of forming the preformed hole on the array substrate includes: and forming a prefabricated hole on the array substrate by utilizing a laser etching or dry etching technology, wherein the prefabricated hole is a through hole penetrating through the array layer and the substrate or a blind hole penetrating through the array layer and reaching the depth of the substrate but not penetrating through the substrate.
This application sets up to run through whole array substrate and light emitting device layer through with the light trap. The position of the light hole is not covered by any functional film layer, particularly, the position of the light hole is not covered by an anode layer, so that the light transmittance of the light hole can be improved, and the influence on the performance of a light-emitting device is reduced.
Drawings
FIG. 1 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of another display panel in the embodiment of the present application;
fig. 3 is a schematic structural diagram of a display device in an embodiment of the present application;
FIG. 4 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present disclosure;
FIG. 5 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present disclosure;
fig. 6 is a schematic flow chart of a display panel manufacturing method according to an embodiment of the present application.
Detailed Description
In order to make the purpose, technical solution and effect of the present application clearer and clearer, the present application is further described in detail below with reference to the accompanying drawings and examples.
The first aspect of this application provides a display panel, and display panel includes the printing opacity district, and the printing opacity district can be corresponding like the position that sets up of camera with the function device, and external light is received in camera accessible printing opacity district, realizes the function of shooing. The light-transmitting area has at least one light-transmitting hole that runs through array substrate and light emitting device layer, sets up the light-transmitting hole into running through array substrate and light emitting device layer, can reduce array substrate rete and light emitting device rete and to the sheltering from of light, improves the luminousness. The display panel disclosed in the present application can be used in various display modes, such as Organic Light Emitting Diode (OLED) display, quantum dot display, micro-LED display, and the like. Here, the OLED display is taken as an example for explanation, but is not limited to this display mode.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure. In this embodiment, the display panel includes an array substrate 10, a light emitting device layer 20, and an encapsulation layer 30.
The array substrate 10 includes a substrate 101 and an array layer 102, and the substrate 101 may be a flexible substrate or a rigid substrate to form a flexible display panel or a rigid display panel. The flexible display panel can adopt materials such as polyimide and the like as the substrate 101, so that the flexible display panel has better bending performance; the rigid display panel may use glass or the like as the substrate 101, so that the rigid display panel has better rigidity. The array layer 102 is provided with a driving circuit for controlling the light emitting device to emit light, the array layer 102 generally comprises inorganic film layers such as a metal layer, a semiconductor layer (active layer), and an insulating layer, and the inorganic film layers are patterned to form the driving circuit for controlling the light emitting device to emit light.
The light emitting device layer 20 is positioned on the side of the array layer 102 away from the substrate 101; the light emitting device layer 20 includes an anode layer, a light emitting layer, and a cathode layer, and the light emitting layer includes a light emitting material layer and an organic common layer (a hole transport layer, an electron transport layer, and the like). When the anode layer and the cathode layer are electrified, electrons and holes are respectively transferred to the light-emitting material layer from the electron transport layer and the hole transport layer and meet in the light-emitting material layer to form excitons so as to excite light-emitting molecules, thereby generating visible light and achieving the purpose of display.
The encapsulation layer 30 is located on the side of the light emitting device layer 20 away from the substrate 101 and covers the light emitting device layer 20 for protecting the light emitting device layer 20 from moisture and oxygen attack. The encapsulation layer 30 may be a thin film encapsulation layer (TFE), including an inorganic encapsulation layer, an organic encapsulation layer, and an inorganic encapsulation layer stacked to provide a moisture and oxygen barrier.
In order to realize other functions besides display, the display device may further include a front camera, an earpiece, a recognition sensor (e.g., a light sensor, a distance sensor), and other functional devices (not shown). In order to reduce the occupation of these functional devices to the display device front space, improve display panel's screen and account for than, can set up the functional device in the display panel below to set up at least one light trap 50 on display panel, so that during external light can see through light trap 50 and get into the functional device, light trap 50 corresponds the functional device setting, and the size (aperture), the number etc. of light trap 50 match the functional device setting, do not do the restriction here.
In this embodiment, the light transmission hole 50 extends through the entire array substrate 10 and the light emitting device layer 20 and does not extend to the encapsulation layer 30. Through setting up the light trap, get rid of the rete in array substrate and the light emitting device layer, especially the metal film layer that the light transmissivity is low, like drive circuit's electrode layer, the cathode layer in the light emitting device layer etc. can improve the luminousness in the light zone.
Referring to fig. 2, fig. 2 is a schematic structural diagram of another display panel in the embodiment of the present application. In this embodiment, the light-transmissive hole 50 is filled with a light-transmissive material to form a light-transmissive material layer 60. Due to the existence of the light holes 50, the support of the encapsulation layer 30 covering the light holes 50 is lost, and the encapsulation layer 30 and the array substrate 10 are easily deformed, which easily causes adverse effects on the display quality of the display panel and the functions of the functional devices. Meanwhile, a step may occur when the encapsulation layer 30 is formed, thereby reducing the encapsulation effect.
On the basis, the light-transmitting hole 50 is filled with the light-transmitting material, so that on one hand, the packaging layer 30 and the array substrate 10 can be supported, and the packaging layer 30 and the array substrate 10 are prevented from deforming; on the other hand, the package layer 30 can be planarized to improve the package effect.
The light-transmitting material may be a light-transmitting organic material, such as ink, or a transparent Polyimide (CPI) material. Alternatively, the surface of the light transmissive material layer 60 remote from the substrate 101 is at least flush with the surface of the light emitting device layer 20 remote from the substrate 101, i.e. the light transmissive material layer may be at the same height as the light emitting device layer. In another alternative embodiment, the transparent material layer may be at the same height as the Supporting Posts (SPC) or slightly lower than the SPC, that is, the surface of the transparent material layer 60 away from the substrate 101 is flush with the surface of the supporting posts away from the substrate 101. It is understood that the support posts are disposed on the pixel defining layer of the light emitting device layer and are displaced from the pixel openings. On the one hand, the substrate strength can be improved, and on the other hand, the TFE package can be planarized to prevent TFE from breaking there.
In another alternative embodiment, the light-transmitting hole 50 may not be filled, but when the encapsulation layer 30 is manufactured, the encapsulation layer material is directly used to fill the light-transmitting hole 50, and optionally, the light-transmitting material layer and at least one film layer of the encapsulation layer are integrally formed to achieve the planarization effect. The structure of the encapsulation layer 30 may be an organic encapsulation layer, an inorganic encapsulation layer, an organic encapsulation layer, or an inorganic encapsulation layer. By depositing the organic encapsulating layer on the light emitting device layer 20, the light transmitting holes 50 can be filled with the fluidity of the material of the organic encapsulating layer, and then the inorganic encapsulating layer, the organic encapsulating layer and the inorganic encapsulating layer are sequentially formed, so that the blocking of water vapor and oxygen is realized.
Fig. 3 is a schematic structural diagram of a display device according to an embodiment of the present disclosure. In this embodiment, the display apparatus includes a functional device 40 and a display panel. The display panel includes an array substrate 10, a light emitting device layer 20, and a package layer 30, and includes a light-transmitting region corresponding to the functional device 40, where the light-transmitting region has at least one light-transmitting hole 50 that penetrates through the array substrate and the light emitting device layer and is not deep enough to reach the package layer. The functional device 40 is located below the display panel and corresponds to the light transmission region, and the functional device 40 may be a camera, a light sensor, a distance sensor, or the like. When the display equipment is applied, the display equipment has the advantages of high screen ratio, good performance of functional devices, good packaging reliability, stable performance, long service life and the like. The display device may be a display screen of a mobile phone, a television, an MP3, VR glasses, etc.
Referring to fig. 4, fig. 4 is a schematic flow chart illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure. In this embodiment, a method of manufacturing a display panel includes:
s110: an array substrate is provided.
The array substrate comprises a substrate and an array layer.
S120: a pre-fabricated hole is formed on the array substrate.
Wherein the pre-fabricated holes at least penetrate through the array layer and reach the substrate.
S130: and forming a light emitting device layer on the array substrate.
And the light-emitting device layer forms a section difference at the prefabricated hole, and the light-emitting device layer material corresponding to the prefabricated hole area is deposited in the prefabricated hole.
S140: an encapsulation layer is formed on the light emitting device layer.
Wherein the encapsulation layer covers the light emitting device layer and the preformed hole.
S150: and removing the light emitting device layer material formed in the prefabricated holes to form light transmission holes penetrating through the array substrate and the light emitting device layer on the display panel.
In this embodiment, when the array substrate (array) is manufactured, all the film layers in the light-transmitting hole region corresponding to the functional device, including all the film layers such as the array layer (active layer, metal layer, insulating layer) and the organic glue, are removed, and at the same time, part or all of the substrate corresponding to the light-transmitting hole is removed. In this way, when the light emitting device layer is formed subsequently, the material of the light emitting device layer forms a step at the light transmitting hole, and then the material of the light emitting device layer at the light transmitting hole is removed, so that the display panel with the light transmitting hole penetrating through the array substrate and the light emitting device layer can be obtained. By the method, a special etching process is not needed to remove the light-emitting device layer material (especially the cathode material) at the light-transmitting hole, so that the process can be saved, the process is simpler, and the light-emitting device layer can be prevented from being damaged when the cathode is removed by laser. And the cathode mask does not need to be changed, the die sinking of the cathode mask is saved, and the process cost is reduced.
Referring to fig. 5, fig. 5 is a schematic flow chart of a display panel manufacturing method according to an embodiment of the present disclosure, in which the display panel manufacturing method includes:
an array substrate 10 is provided, the array substrate 10 includes a substrate 101 and an array layer 102, and the array substrate 10 may be formed on a glass carrier 70. The glass carrier 70 is used for carrying the array substrate 10 to provide a supporting force to prevent the array substrate 10 from deforming during the process of manufacturing the display panel.
The preformed hole 80 is formed on the array substrate 10 at a position corresponding to the functional device, and the preformed hole 80 penetrates through the substrate 101 and the array layer 102 to expose the glass carrier 70 at the position corresponding to the preformed hole 80. The substrate 101 and the array layer 102 may be removed by laser etching, dry etching, grinding, etc. to form the pre-fabricated holes 80, which is not limited herein.
After the pre-holes 80 are formed, film layers such as an anode layer, a hole transport layer, a light emitting material layer, an electron transport layer, and a cathode layer are sequentially formed on the array substrate 10, thereby forming the light emitting device layer 20. In which a full-surface Mask is used to perform full-surface vapor deposition when forming an organic common layer (including a hole transport layer, an electron transport layer, and the like) and a cathode layer. Due to the existence of the preformed hole 80, when the organic common layer and the cathode layer are evaporated, a step is formed at the preformed hole 80, and the organic common layer and the cathode layer at the preformed hole 80 are directly formed on the glass carrier plate 70.
After the light emitting device layer 20 is formed, the light transmissive material layer 60 is filled in the preformed hole 80, and a high light transmissive material, such as ink for ink jet printing, may be filled in the through hole 80 by evaporation, ink jet printing, and the like, and the transparent material layer is formed after curing. The upper surface of the formed transparent material layer is flush with the upper surface of the light emitting device layer. The upper surface here is the side remote from the substrate. In other embodiments, a transparent inorganic material, such as silicon oxide, silicon oxynitride, or the like, may also be selectively deposited.
After the filling of the preformed hole 80, the encapsulation layer 30 may be formed on the light emitting device layer 20, and may be a thin film encapsulation layer including a first inorganic thin film encapsulation layer, an organic thin film encapsulation layer, and a second inorganic thin film encapsulation layer stacked one on another. The inorganic film forming the encapsulation film layer is formed by a Chemical Vapor Deposition (CVD) process, and the material of the inorganic film is typically silicon oxide, silicon nitride, or silicon oxynitride. The organic film forming the encapsulation film layer is formed by inkjet printing, and the organic film is generally a high molecular polymer, which may include, but is not limited to, the following materials: one of epoxy resin, polyethylene terephthalate, polyethylene naphthalate, polystyrene, polycarbonate, polyimide, polyvinyl sulfonate, polyoxymethylene, polyarylate, acrylic, hexamethyldisiloxane and the like.
After the encapsulation is completed, the glass carrier plate 70 can be stripped, and the organic common layer and the cathode layer deposited on the glass carrier plate 70 are removed while the glass carrier plate 70 is removed, so that the purpose of removing the cathode layer is achieved, the light holes completely penetrate through the array layer and the substrate, the light transmittance of the light holes is improved, and the influence on the performance of the light-emitting device is reduced. Alternatively, the glass carrier plate may be peeled using a laser lift-off technique (LLO).
After the glass carrier plate is stripped, if the cathode has micro residues on the side of the substrate, the substrate can be thinned, the residual cathode can be removed, and meanwhile, the transmittance can be further improved due to the thinning of the substrate.
In the embodiment, the cathode removal is realized by opening the holes on the array film layer, the process is simple, a cathode mask plate can be saved, or the light-emitting device is prevented from being damaged when the cathode is removed by laser, and the light transmittance requirement of a light-transmitting area can be met.
Referring to fig. 6, fig. 6 is a schematic flow chart illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure, in which the method for manufacturing a display panel includes:
an array substrate 10 is provided, the array substrate 10 includes a substrate 101 and an array layer 102, and the array substrate 10 may be formed on a glass carrier 70. The glass carrier 70 is used for carrying the array substrate 10 to provide a supporting force to prevent the array substrate 10 from being deformed during the process of manufacturing the display panel.
The pre-holes 90 are formed on the array substrate 10 at positions corresponding to the functional devices, and the pre-holes 90 penetrate through the array layer 102 and reach the substrate 101, but do not penetrate through the substrate 101. That is, when the array layer and the substrate are opened, the substrate may not be completely etched through, and a part of the substrate may be remained, for example, 1-5um may be remained without etching through.
After the above steps, the light emitting device layer 20 is formed on the array substrate, the preformed hole 90 is filled, and then the encapsulation layer 30 is formed.
After the package layer 30 is formed, the glass carrier 70 may be peeled off by the LLO technique, and the substrate 101 may be thinned by the laser technique, where the thinned thickness at least includes the sum of the thickness of the light emitting device layer material formed in the light hole and the thickness of the substrate not penetrated by the light hole.
In the embodiment, by adopting the mode, the strength of the substrate before the glass substrate is stripped can be enhanced, the falling-off phenomenon in the manufacturing process can be prevented, and the light transmittance of the light-transmitting area can be improved due to the thinning of the substrate after the glass substrate is stripped.
Above scheme realizes the negative pole through trompil on the array rete and gets rid of, and simple process both can save cathode mask plate, perhaps damages light emitting device when avoiding laser to get rid of the negative pole, can satisfy the light transmissivity demand in printing opacity district again.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (12)
1. A method for manufacturing a display panel, comprising:
providing an array substrate, wherein the array substrate comprises a substrate and an array layer;
forming a pre-fabricated hole on the array substrate, wherein the pre-fabricated hole at least penetrates through the array layer and is deep to the substrate;
forming a light emitting device layer on the array substrate, wherein the light emitting device layer forms a step at the preformed hole, and the light emitting device layer material corresponding to the preformed hole region is deposited in the preformed hole;
forming an encapsulation layer on the light emitting device layer, the encapsulation layer covering the light emitting device layer and the prefabricated hole;
thinning the substrate, and removing the material of the light-emitting device layer formed in the prefabricated hole so as to form a light hole penetrating through the array substrate and the light-emitting device layer on the display panel.
2. The method for manufacturing a display panel according to claim 1, wherein before the step of forming an encapsulation layer on the light emitting device layer, the method further comprises:
and filling a light-transmitting material in the prefabricated hole to form a light-transmitting material layer, wherein the surface of the light-transmitting material layer, which is far away from the substrate, is at least flush with the surface of the light-emitting device layer, which is far away from the substrate.
3. The method for manufacturing a display panel according to claim 1, comprising:
providing a glass substrate;
forming the array substrate on the glass substrate, and forming a prefabricated hole on the array substrate, wherein the prefabricated hole is a through hole penetrating through the array layer and the substrate;
forming the light-emitting device layer on the array substrate, wherein the light-emitting device layer material in the prefabricated hole is formed on the glass carrier plate;
peeling the glass substrate to remove the material of the light-emitting device layer formed on the glass carrier;
and thinning the substrate, and removing the material of the light-emitting device layer remained on the substrate.
4. The method for manufacturing a display panel according to claim 1,
and thinning the substrate by using a laser technology.
5. The method for manufacturing a display panel according to claim 1, wherein the preformed hole is a blind hole penetrating through the array layer and deep to but not penetrating through the substrate, the method comprising:
forming a light-emitting device layer on the array substrate, wherein the light-emitting device layer material in the prefabricated hole is formed on the substrate;
and thinning the substrate to remove the material of the light-emitting device layer formed on the substrate.
6. The method of manufacturing a display panel according to claim 1, wherein the step of forming a pre-hole in the array substrate includes:
and forming the prefabricated holes on the array substrate by utilizing a laser etching or dry etching technology, wherein the prefabricated holes are through holes penetrating through the array layer and the substrate or blind holes penetrating through the array layer and reaching as deep as but not penetrating through the substrate.
7. A display panel, comprising:
the array substrate comprises a substrate and an array layer;
the light-emitting device layer is positioned on one side, far away from the substrate, of the array layer;
the packaging layer is positioned on one side, far away from the substrate, of the light-emitting device layer;
the display panel comprises a light-transmitting area, wherein the light-transmitting area is provided with at least one light-transmitting hole which penetrates through the array substrate and the light-emitting device layer and is not deep to the packaging layer;
wherein the display panel is manufactured by the manufacturing method of the display panel according to any one of claims 1 to 6.
8. The display panel according to claim 7,
the light-transmitting hole is filled with a light-transmitting material layer 。
9. The display panel according to claim 8,
the surface of the light-transmitting material layer far away from the substrate is at least flush with the surface of the light-emitting device layer far away from the substrate.
10. The display panel according to claim 8,
the material for forming the light-transmitting material layer comprises a light-transmitting organic material.
11. The display panel according to claim 10,
the light-transmitting organic material comprises ink and a transparent polyimide material.
12. A display device, comprising:
the display panel according to any one of claims 7 to 11;
and the functional device is positioned below the display panel and corresponds to the light-transmitting area.
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| WO2022188168A1 (en) * | 2021-03-12 | 2022-09-15 | 京东方科技集团股份有限公司 | Display substrate, preparation method therefor, and display device |
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| CN110212107A (en) * | 2019-05-16 | 2019-09-06 | 武汉华星光电半导体显示技术有限公司 | A kind of display screen and electronic device |
| CN115440784A (en) * | 2019-06-14 | 2022-12-06 | 京东方科技集团股份有限公司 | Display substrate and display panel |
| CN110233167B (en) * | 2019-06-18 | 2021-12-03 | 京东方科技集团股份有限公司 | Display panel, display device and manufacturing method of display panel |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111129085A (en) * | 2019-12-12 | 2020-05-08 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device thereof |
| CN111244326A (en) * | 2020-01-22 | 2020-06-05 | 合肥鑫晟光电科技有限公司 | OLED display substrate, manufacturing method thereof and display device |
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