CN110783491B - Display panel, preparation method thereof and display device - Google Patents
Display panel, preparation method thereof and display device Download PDFInfo
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- CN110783491B CN110783491B CN201911173942.9A CN201911173942A CN110783491B CN 110783491 B CN110783491 B CN 110783491B CN 201911173942 A CN201911173942 A CN 201911173942A CN 110783491 B CN110783491 B CN 110783491B
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- H10K50/00—Organic light-emitting devices
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- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
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- H10K50/844—Encapsulations
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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Abstract
The invention discloses a display panel, a preparation method thereof and a display device. The display panel comprises a mounting hole and a packaging area surrounding the mounting hole, the packaging area comprises a substrate base plate and an isolation structure arranged on the substrate base plate, the isolation structure comprises an isolation column and gentle layers formed behind the isolation column and located on two sides of the isolation column, each gentle layer comprises a filling portion in contact with the side wall of the isolation column, and the surface of one side of the substrate base plate deviating from the filling portion is gradually far away from the position of the isolation column towards the direction close to the position of the isolation column. This display panel has eliminated the sharp-pointed surface that is located insulated column lateral wall bottom for insulated column lateral wall bottom surface is gentler, thereby, can be so that the membrane thickness on inorganic encapsulation layer is more even, has avoided the encapsulation to become invalid, has guaranteed the encapsulation effect, has guaranteed display area OLED's life-span.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device.
Background
An Organic Light Emitting Diode (OLED) is an active Light Emitting display device, and has the advantages of self-luminescence, wide viewing angle, high contrast, low power consumption, and fast response speed. With the continuous development of display technologies, the OLED technology is increasingly applied to various display devices, especially to smart terminal products such as mobile phones and tablet computers.
With the development of Active Matrix Organic Light-emitting Diode (AMOLED) technology, the requirement for the display area of a display device is higher and higher, such as a full-screen and a frameless screen, so as to bring dazzling visual impact to users. Because products such as intelligent terminal need set up hardware such as leading camera, infrared sensor, earphone usually, in order to realize the full screen, set up the scheme of mounting hole in order to set up hardware such as camera in display device display area, receive more and more attention. The scheme that the mounting holes are formed in the display area to arrange hardware such as cameras can achieve a full-screen to a certain degree. However, the display area is provided with the mounting hole, and the organic functional layer and the cathode are exposed from the side wall of the mounting hole, so that water and oxygen in the atmosphere invade the display area, the organic functional layer of the display area is invalid, and poor display is brought.
In the prior art, in order to ensure the effectiveness of the organic functional layer in the display region, the encapsulation region is usually arranged around the mounting hole to avoid the intrusion of water and oxygen. Generally, the package region structure includes an isolation pillar on the substrate in a plane perpendicular to the display panel, and the cross section of the isolation pillar is an inverted trapezoid. The packaging region structure further comprises an inorganic packaging layer wrapped on the isolation column, and the inorganic packaging layer can prevent water and oxygen from entering so as to package the packaging region.
In the prior art, as shown in fig. 1, fig. 1 is a schematic diagram of an encapsulation region of a display panel, because an angle θ of a foot of an isolation pillar of an inverted trapezoid structure is small, and a thickness of an inorganic encapsulation layer at the foot of the isolation pillar is small, the inorganic encapsulation layer is easily damaged at the foot of the isolation pillar, which causes encapsulation failure, so that water and oxygen intrude into an OLED through the isolation pillar, and the service life of the OLED is affected.
Disclosure of Invention
An object of the embodiments of the present invention is to provide a display panel, a manufacturing method thereof, and a display device, so as to improve a packaging effect of a display panel packaging area.
In order to solve the above technical problem, an embodiment of the present invention provides a display panel, where, on a plane parallel to the display panel, the display panel includes a display area, a mounting hole located in the display area, and a package area disposed between the mounting hole and the display area, and on a plane perpendicular to the display panel, the package area includes a substrate and an isolation structure disposed on the substrate, the isolation structure includes an isolation pillar and a smoothing layer formed behind the isolation pillar and located on two sides of the isolation pillar, the smoothing layer includes a filling portion contacting a sidewall of the isolation pillar, and a surface of the filling portion on a side away from the substrate gradually gets away from the substrate from a position of the isolation pillar toward a position close to the isolation pillar.
Optionally, the flattish layer further comprises a flat portion, a surface of the flat portion, which is on a side facing away from the substrate base plate, is a flat surface, and the flat portion is connected with the filling portion.
Optionally, the material of the gentle layer includes a polymer material.
Optionally, the isolation structure further includes a base layer disposed on the substrate base plate, and the isolation pillar is disposed on the base layer.
Optionally, the isolation structure further includes an isolation layer disposed on the gentle layer, and the isolation layer covers the isolation pillar and the gentle layer.
Optionally, in a plane perpendicular to the display panel, the structure of the display region includes a substrate base plate, an anode disposed on the substrate base plate, a pixel defining layer disposed on the anode, a light emitting functional layer disposed on the pixel defining layer, a first inorganic encapsulating layer disposed on the light emitting functional layer, an organic encapsulating layer disposed on the first inorganic encapsulating layer, and a second inorganic encapsulating layer disposed on the organic encapsulating layer, the light-emitting functional layer is also positioned in the packaging area, the light-emitting functional layer is positioned on the isolation structure in the packaging area and is disconnected by the isolation structure, the packaging region further comprises an inorganic packaging layer arranged on the light-emitting functional layer, and the inorganic packaging layer comprises the second inorganic packaging layer or the first inorganic packaging layer and the second inorganic packaging layer which are sequentially stacked.
In order to solve the above technical problem, an embodiment of the present invention further provides a method for manufacturing a display panel, where the display panel includes a display area, a mounting hole located in the display area, and an encapsulation area disposed between the mounting hole and the display area, the method includes forming an isolation structure located on a substrate in the encapsulation area, and the forming of the isolation structure includes:
forming an isolation column on the substrate in the packaging region;
and forming gentle layers in the packaging area, wherein the gentle layers are positioned on two sides of the isolation column and comprise filling parts in contact with the side wall of the isolation column, and the surface of one side of the filling part, which is far away from the substrate base plate, is gradually far away from the substrate base plate from the position of the isolation column towards the direction close to the position of the isolation column.
Optionally, a smoothing layer is formed in the encapsulation area, including:
coating a mild solution on a substrate base plate;
removing the gentle solution located in the display area;
curing the gentle solution in the packaging area to form a gentle layer in the packaging area,
alternatively, the first and second electrodes may be,
forming a gentle solution in the encapsulation area by an inkjet printing process;
the mild solution is solidified into a film to form a mild layer.
Optionally, the mild solution comprises a polymer material and a solvent, wherein the polymer material comprises one or more of polyimide, rubber, polystyrene and phenolic resin, and the solvent comprises one or more of ethanol, acetone, toluene, dimethyl sulfoxide and nitrogen methyl pyrrolidone.
Optionally, the mass fraction of the polymer material in the mild solution is 5% to 50%.
Optionally, forming the isolation structure further comprises: and forming an isolation layer on the gentle layer in the packaging area, wherein the isolation layer covers the isolation column and the gentle layer.
Optionally, forming an isolation pillar on the substrate in the package region includes:
forming a base layer on the substrate in the encapsulation region;
and forming isolation columns on the substrate layer in the packaging area.
Alternatively, the method of making, comprising:
forming an anode on the substrate in the display region;
and forming a pixel definition layer on the anode in the display area, wherein the base layer and the pixel definition layer are formed by a one-time mask process.
Optionally, the preparation method further comprises:
forming a light emitting function layer on the isolation structure in the packaging area, wherein the light emitting function layer is disconnected by the isolation structure;
and forming an inorganic packaging layer on the light-emitting function layer.
In order to solve the above technical problem, an embodiment of the present invention further provides a display device, including the display panel described above.
According to the display panel provided by the embodiment of the invention, the gentle layer is arranged and comprises the filling part which is in contact with the side wall of the isolation column, the upper surface of the filling part is gradually far away from the isolation column position towards the direction close to the isolation column position, and the sharp surface at the bottom of the side wall of the isolation column is eliminated, so that the bottom surface of the side wall of the isolation column in the embodiment of the invention is more gentle relative to the bottom surface of the side wall of the isolation column in the prior art, and therefore, when the inorganic packaging layer is formed subsequently, the thickness of the inorganic packaging layer at the bottom surface of the side wall of the isolation column tends to be consistent with the thickness of other positions, the thickness of the inorganic packaging layer is more uniform, the thickness of the inorganic packaging layer at the bottom surface of the side wall of the isolation column is prevented from being too thin, the packaging failure is avoided, the packaging effect is ensured, and the service life of an OLED in the display area is ensured.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the example serve to explain the principles of the invention and not to limit the invention.
FIG. 1 is a diagram of a package region of a display panel;
FIG. 2a is a schematic plan view of an OLED display panel;
FIG. 2B is a schematic cross-sectional view of a display panel shown in FIG. 2a taken along line B-B;
FIG. 3 is a schematic cross-sectional view taken along line B-B of FIG. 2a of the display panel according to the first embodiment of the present invention;
fig. 4 is an enlarged schematic view of portion C of fig. 3;
FIG. 5a is a schematic diagram of a display panel after an anode is formed thereon;
FIG. 5b is a schematic structural diagram of the display panel after forming a pixel defining layer and a substrate layer;
FIG. 5c is a schematic structural diagram of the display panel after the isolation pillars are formed;
FIG. 5d-1 is a schematic diagram of a structure after a gentle solution is formed in the display panel;
FIG. 5d-2 is a schematic structural diagram of the display panel after a smoothing layer is formed;
FIG. 5e is a schematic structural diagram of the display panel after forming an isolation layer;
FIG. 5f is a schematic structural diagram of a display panel after a light-emitting functional layer is formed;
FIG. 5g is a schematic structural diagram of a display panel after a first inorganic encapsulation layer is formed;
FIG. 5h is a schematic diagram illustrating a structure of a display panel after an organic encapsulation layer is formed thereon;
fig. 5i is a schematic structural diagram of the display panel after a second inorganic encapsulation layer is formed.
Description of reference numerals:
10-a display area; 11-mounting holes; 12-a packaging area;
20-a substrate base plate; 21-an anode; 22 — a light emitting functional layer;
221 — organic functional layer; 222 — a cathode; 23-pixel definition layer;
31-an isolation column; 32-a flat layer; 321 — a filling part;
322 — a flat portion; 33-an isolation layer; 34-a base layer;
41-a first inorganic encapsulation layer; 42-organic encapsulation layer; 43-second inorganic encapsulation layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.
Fig. 2a is a schematic plan view of an OLED display panel, and fig. 2B is a schematic cross-sectional view of the display panel taken along line B-B in fig. 2a, as shown in fig. 2a and fig. 2B, the display panel includes a display area 10, a mounting hole 11 is disposed in the display area 10, and an encapsulation area 12 is disposed around the mounting hole 11 and between the display area 10 and the mounting hole 11. On a cross section B-B perpendicular to the display panel, as shown in fig. 2B, the structure of the encapsulation region 12 includes a substrate base plate 20, and an isolation pillar 31 located on the substrate base plate 20, where the isolation pillar 31 has an inverted trapezoid structure. The encapsulation region 12 further includes an organic functional layer 221 and a cathode 222 sequentially disposed on the separator 31. Under the action of the separator 31, the organic functional layer 221 and the cathode 222 are disconnected at both sides of the separator 31. The encapsulation region 12 further includes an inorganic encapsulation layer 40 covering the cathode 222 and the separator 31. The isolation column 31 is of an inverted trapezoid structure, so that an angle theta between the side wall of the isolation column 31 and the upper surface of the substrate base plate 20 is small, and a sharp surface is formed between the side wall of the isolation column 31 and the upper surface of the substrate base plate 20, so that the thickness of the inorganic encapsulation layer 40 at the position of the foot C of the isolation column 31 is relatively thin, the inorganic encapsulation layer 40 is easily damaged at the position of the foot C of the isolation column 31, encapsulation failure is caused, water and oxygen permeate into the OLED through the isolation column, and the service life of the OLED is influenced.
In order to solve the above technical problem, an embodiment of the present invention provides a display panel. The display panel is arranged on a plane parallel to the display panel, the display panel comprises a display area, a mounting hole located in the display area and a packaging area arranged between the mounting hole and the display area, the packaging area comprises a substrate base plate and an isolation structure arranged on the substrate base plate, the isolation structure comprises an isolation column and gentle layers formed behind the isolation column and located on two sides of the isolation column, each gentle layer comprises a filling portion in contact with the side wall of the isolation column, and the surface of one side of the substrate base plate deviating from the filling portion gradually keeps away from the substrate base plate from the position of the isolation column towards the direction close to the position of the isolation column.
The display panel of the embodiment of the invention has the advantages that the gentle layer is arranged, the gentle layer comprises the filling part contacted with the side wall of the isolation column, the upper surface of the filling part is gradually far away from the substrate base plate from the position far away from the isolation column to the direction close to the position of the isolation column, the sharp surface at the bottom of the side wall of the isolation column is eliminated, the bottom surface of the sidewall of the isolation column in the embodiment of the invention is more gentle than that of the sidewall of the isolation column in the prior art, so that, when the inorganic packaging layer is formed subsequently, the thickness of the inorganic packaging layer at the bottom surface of the side wall of the isolation column tends to be consistent with the thickness of the inorganic packaging layer at other positions, the thickness of the inorganic packaging layer is more uniform, the thickness of the inorganic packaging layer at the bottom surface of the side wall of the isolation column is prevented from being thinner, packaging failure is avoided, the packaging effect is guaranteed, and the service life of the OLED in the display area is guaranteed.
The technical contents of the present invention will be described in detail by specific embodiments. The "thickness" hereinafter is the dimension of the film layer in the direction perpendicular to the substrate base plate.
The first embodiment:
fig. 2a is a schematic plan view of a display panel according to an embodiment of the present invention, fig. 3 is a schematic sectional view taken along line B-B in fig. 2a of the display panel according to the first embodiment of the present invention, and fig. 4 is an enlarged schematic view of portion C in fig. 3. As shown in fig. 2a and 3, the display panel of the embodiment of the invention includes a display area 10 on a plane parallel to the display panel, a mounting hole 11 is disposed in the display area 10, and a packaging region 12 located between the display area 10 and the mounting hole 11 is disposed around the mounting hole 11.
As shown in fig. 3, the structure of the package region includes an isolation structure 30 disposed on the substrate base plate 20 in a plane perpendicular to the display panel, the isolation structure 30 being disposed around the mounting hole 11. The isolation structure 30 includes isolation pillars 31 disposed on the substrate base plate 20. On a plane perpendicular to the display panel, the cross section of the isolation pillar 31 is in an inverted trapezoid or an inverted trapezoid-like shape, or an orthogonal projection of a side of the isolation pillar 31 close to the substrate base plate 20 on the substrate base plate 20 is located within an orthogonal projection of a side of the isolation pillar 31 far from the substrate base plate 20 on the substrate base plate 20, that is, an orthogonal projection boundary of a side of the isolation pillar 31 close to the substrate base plate 20 on the substrate base plate 20 is located inside an orthogonal projection boundary of a side of the isolation pillar 31 far from the substrate base plate 20 on the substrate base plate 20. The isolation structure 30 further includes a smoothing layer 32 disposed on the isolation pillar 31 (i.e., formed after the isolation pillar 31), the smoothing layer 32 being located at both sides of the isolation pillar 31. As shown in fig. 3 and 4, the gentle layer 32 includes a filling portion 321 in contact with the sidewall of the isolation pillar 31, and an upper surface (i.e., a surface on a side away from the substrate base plate 20) of the filling portion 321 gradually gets away from the substrate base plate 20 from a position away from the isolation pillar 31 toward a position close to the isolation pillar 31, that is, the upper surface of the filling portion 321 has a climbing structure from a position away from the isolation pillar 31 toward a position close to the isolation pillar 31, or the upper surface of the filling portion 321 gradually rises from a position away from the isolation pillar 31 toward a position close to the isolation pillar 31.
As shown in fig. 3 and 4, the flattening layer 32 further includes a flat portion 322 connected to the filling portion 321, an upper surface (i.e., a surface facing away from the substrate base plate 20) of the flat portion 322 is a flat surface, and an upper surface of the flat portion 322 is smoothly connected to an upper surface of the filling portion 321.
Comparing fig. 2b with fig. 3 and fig. 4, in fig. 2b, there is a sharp angle θ on the bottom surface of the sidewall of the isolation pillar, so that after the inorganic encapsulation layer is formed, the thickness of the inorganic encapsulation layer on the bottom surface of the sidewall of the isolation pillar is thinner than the thickness of the inorganic encapsulation layer at other positions, which is likely to cause package failure; in fig. 3 and 4, the filling portion 321 is disposed such that the angle of the bottom surface of the sidewall of the isolation pillar is β, β is greater than or equal to 90 °, and therefore, compared with the structure shown in fig. 2b, the bottom surface of the sidewall of the isolation pillar in the embodiment of the present invention is more gentle, and therefore, when the inorganic encapsulation layer is formed subsequently, the thickness of the inorganic encapsulation layer on the bottom surface of the sidewall of the isolation pillar tends to be consistent with the thickness of other positions, so that the film thickness of the inorganic encapsulation layer is more uniform, and the encapsulation failure caused by the thinness of the inorganic encapsulation layer is avoided.
In the display panel of the embodiment of the invention, by arranging the gentle layer 32, the gentle layer 32 comprises the filling part 321 which is in contact with the side wall of the isolation column 31, the upper surface of the filling part 321 is gradually far away from the substrate base plate 20 from the position far away from the isolation column 31 to the direction close to the position of the isolation column 31, the sharp surface at the bottom of the side wall of the isolation column 31 is eliminated, the spacer side wall bottom surface shown in fig. 3 is made more gradual than the spacer side wall bottom surface shown in fig. 2b, and thus, when the inorganic packaging layer is formed subsequently, the thickness of the inorganic packaging layer at the bottom surface of the side wall of the isolation column tends to be consistent with the thickness of the inorganic packaging layer at other positions, the thickness of the inorganic packaging layer is more uniform, the thickness of the inorganic packaging layer at the bottom surface of the side wall of the isolation column is prevented from being thinner, packaging failure is avoided, the packaging effect is guaranteed, and the service life of the OLED in the display area is guaranteed.
In one embodiment, as shown in fig. 3, the structure of the encapsulation region further includes a light-emitting functional layer 22, the light-emitting functional layer 22 is disposed on the gentle layer 32, and an inorganic encapsulation layer is disposed on the light-emitting functional layer 22, and covers the light-emitting functional layer 22 and the surface of the isolation structure 30. The inorganic packaging layer can play a role in isolating water and oxygen, so that the water and oxygen cannot penetrate through the inorganic packaging layer to invade the display area from the upper part of the isolation column. The light emitting functional layer 22 may include an organic functional layer and a cathode sequentially disposed on the flattening layer 32. Under the action of the isolation columns 31, the light-emitting functional layer 22 is disconnected on two sides of the isolation columns 31, so that water and oxygen are prevented from invading the display area through the side walls of the mounting holes.
In one embodiment, as shown in fig. 3, the isolation structure 30 may further include an isolation layer 33, the isolation layer 33 is disposed on the gentle layer 32, the isolation layer 33 covers the isolation pillar 31 and the gentle layer 32, and the light emitting functional layer 22 is disposed on the isolation layer 33. The isolation layer 33 can form a gentle connection on the bottom surface of the sidewall of the isolation pillar 31, so that a package failure caused by cracks formed at the bottoms of the two sides of the isolation pillar 31 in a subsequently formed inorganic package layer can be further avoided. In addition, the light-emitting functional layer 22 is disposed between the isolation layer 33 and the inorganic sealing layer, and the isolation layer 33 is usually made of inorganic materials such as silicon oxide, silicon nitride, or silicon oxynitride, so that water and oxygen can be prevented from entering from the upper and lower sides of the light-emitting functional layer 22, and further water and oxygen can be prevented from entering the OLED.
In one embodiment, as shown in fig. 3, the isolation structure 30 may further include a base layer 34, the base layer 34 being disposed between the substrate base plate 20 and the isolation pillars 31.
The number of the isolation structures of the package region shown in fig. 3 is two, and in practical implementation, the number of the isolation structures may be set as required, and may be 1, 2 or more, and a plurality of the isolation structures are sequentially disposed around the mounting hole.
As shown in fig. 3, the structure of the display region includes a plurality of light emitting units distributed in an array on a plane perpendicular to the display panel, each light emitting unit including an anode 21 disposed on a substrate 20, a light emitting function layer, and an encapsulation structure layer. The base substrate 20 includes a thin film transistor correspondingly connected to the anode 21. Specifically, the structure of the display region includes an anode 21 provided on the base substrate 20, a pixel defining layer 23 provided on the anode 21, and a light-emitting function layer 22 provided on the pixel defining layer 23. The encapsulation structure layer includes a first inorganic encapsulation layer 41 on the light emitting function layer 22, an organic encapsulation layer 43 disposed on the first inorganic encapsulation layer 41, and a second inorganic encapsulation layer 42 disposed on the organic encapsulation layer 43. The inorganic encapsulation layer of the encapsulation region includes the second inorganic encapsulation layer 42, or includes the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 42 stacked in this order.
In this embodiment, the encapsulation structure layer includes two inorganic encapsulation layers, i.e. the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 42, in other embodiments, the encapsulation structure layer may further include more inorganic encapsulation layers, and at least the inorganic encapsulation layer on the side away from the substrate is located in both the display region and the encapsulation region.
The base layer 34 and the pixel defining layer 23 may be formed by a single mask process. The first inorganic packaging layer of the display area and the first inorganic packaging layer of the packaging area are the same layer, the second inorganic packaging layer of the display area and the second inorganic packaging layer of the packaging area are the same layer, and the light emitting function layer of the display area and the light emitting function layer of the packaging area are the same layer.
The technical solution of the embodiment of the present invention is further described by the manufacturing process of the display panel of this embodiment. It is to be understood that the "patterning process" referred to in this embodiment includes processes of depositing a film layer, coating a photoresist, exposing a mask, developing, etching, stripping a photoresist, and the like; the "photolithography process" in this embodiment includes coating film coating, mask exposure, development, and the like, and evaporation, deposition, coating, and the like in this embodiment are well-established production processes in the related art.
The preparation process of the display panel comprises the following steps:
s1: forming an OLED light-emitting unit, specifically comprising:
s11: providing the substrate 20, the substrate 20 can be prepared by conventional techniques in the art, and will not be described herein.
S12: an anode electrode located in a display region is formed on the base substrate 20. The method specifically comprises the following steps: a conductive thin film is deposited on the substrate base plate 20, the conductive thin film is patterned through a patterning process, an anode 21 is formed in the display area, the anode 21 is electrically connected with the thin film transistor of the substrate base plate 20, as shown in fig. 5a, and fig. 5a is a schematic structural view after the anode is formed in the display panel. Wherein the conductive film of the anode electrode 21 formed at the display region, the encapsulation region and the mounting hole is etched away. The conductive film can be made of Indium Tin Oxide (ITO) or Indium Zinc Oxide (IZO).
S13: a pixel defining layer and a base layer are formed. The method specifically comprises the following steps: a Pixel definition film is formed on the substrate with the aforementioned structure, and a Pixel Definition Layer (PDL) 23 located in the display region and a base Layer 34 located in the frame sealing region and the mounting hole are formed through a mask process, as shown in fig. 5b, where fig. 5b is a schematic structural diagram of the display panel after the Pixel definition Layer and the base Layer are formed. The pixel defining layer and the substrate layer may be made of photoresist (e.g., positive photoresist), polyimide, acrylic, or polyethylene terephthalate. In other embodiments, the material of the pixel defining layer and the substrate layer may also be an inorganic material such as amorphous silicon (a-Si), silicon nitride, or silicon oxide. When the pixel defining layer and the substrate layer are made of organic materials, the pixel defining layer and the substrate layer can be formed through a photoetching process or a dry etching process; when the pixel defining layer and the base layer are made of inorganic materials, the pixel defining layer and the base layer may be formed by a dry etching process. It is easily understood that, in this process, the shape of the pixel defining layer 23 formed in the display region is the same as that of the related art.
In another embodiment, the base layer and the pixel defining layer may be formed by different mask processes, and at this time, the material of the base layer may be a metal material such as aluminum, silver, iron, or a metal oxide material such as indium tin oxide, aluminum oxide, and the pattern of the base layer may be formed by a wet etching process.
S14: isolation pillars are formed on the base layer in the encapsulation region. The method specifically comprises the following steps: forming an isolation film on the substrate 20 with the aforementioned structure, forming an isolation pillar 31 through a mask process, where the isolation pillar 31 is located in the encapsulation region, and removing the isolation film outside the isolation pillar, as shown in fig. 5c, where fig. 5c is a schematic structural view after the isolation pillar is formed in the display panel. On a plane perpendicular to the display panel, the cross section of the isolation pillar 31 is in an inverted trapezoid or an inverted trapezoid-like shape, an angle θ between the sidewall of the isolation pillar 31 and the upper surface of the substrate layer 34 may be 10 ° to 70 °, and in one embodiment, θ is 10 ° to 53 °; alternatively, the orthographic projection of the side of the isolation pillar 31 close to the substrate base plate 20 on the substrate base plate 20 is located in the orthographic projection of the side of the isolation pillar 31 far from the substrate base plate 20 on the substrate base plate 20, that is, the orthographic projection boundary of the side of the isolation pillar 31 close to the substrate base plate 20 on the substrate base plate 20 is located inside the orthographic projection boundary of the side of the isolation pillar 31 far from the substrate base plate 20 on the substrate base plate 20. The spacer 31 is disposed around the mounting hole. The structure of the isolation pillars may be formed using a conventional technique in the art, and will not be described in detail herein. The specific structural shape of the isolation column is not limited, as long as the subsequently formed light-emitting functional layer can be disconnected on the two sides of the isolation column. The height of the isolation pillars 31 may be 0.1 μm to 10 μm, and in one embodiment, the height of the isolation pillars 31 is 1 μm to 3 μm.
The isolation pillars may be made of photoresist (e.g., negative photoresist), polyimide, acrylic, or polyethylene terephthalate. In other embodiments, the material of the isolation pillar may also be an inorganic material such as amorphous silicon (a-Si), silicon nitride, or silicon oxide. When the isolation column is made of organic materials, the isolation column can be formed through a photoetching process or a dry etching process; when the isolation pillars are made of an inorganic material, the isolation pillars may be formed through a dry etching process.
In another embodiment, the isolation pillars may be made of a metal material such as aluminum, silver, iron, or a metal oxide material such as indium tin oxide, aluminum oxide, and the isolation pillars may be formed by a wet etching process.
In a preferred embodiment, the isolation pillars and the substrate layer are made of the same type of material, for example, the isolation pillars and the substrate layer are made of organic material, inorganic material, metal oxide material, or the like. When the isolation pillars and the substrate layer are made of organic materials, the isolation pillars and the substrate layer are made of organic materials with opposite illumination performance, for example, the substrate layer is made of positive photoresist, and the isolation pillars are made of negative photoresist.
S15: and forming gentle layers which are positioned on the isolation column and positioned at two sides of the isolation column in the packaging region. The method specifically comprises the following steps:
s151: the substrate 20 on which the isolation pillars are formed is coated with a gentle solution 32', as shown in fig. 5d-1, and fig. 5d-1 is a schematic structural view of the display panel after the gentle solution is formed. The upper surface of the mild solution 32' may be slightly higher than the upper surface of the isolation column 31, or may be lower than or equal to the upper surface of the isolation column 31, which is not specifically limited herein, as long as the mild solution is lower than the upper surface of the isolation column after being solidified into a film. The coating can be carried out by a conventional coating process such as spin coating or spray coating.
S152: removing the gentle solution in the display area by using a chemical substance, and reserving the gentle solution in the packaging area; the smoothing solution 32' in the encapsulation area is cured into a film by a curing process (e.g., drying) to form a smoothing layer 32, as shown in fig. 5d-2, and fig. 5d-2 is a schematic structural diagram of the display panel after the smoothing layer is formed. It is easily understood that, in this process, the gentle film at the position of the mounting hole may also be removed, and the gentle layer 32 located at the encapsulation area is directly formed; or, the gentle solution at the packaging area and the mounting hole is reserved, after the solution is solidified to form a film, the gentle film is positioned at the packaging area and the mounting hole, and the gentle film at the mounting hole is removed together when the mounting hole is formed subsequently, so that a gentle layer positioned in the packaging area is formed.
In other embodiments, an ink-jet printing process may be used to form a smooth solution only in the encapsulation area, and a smooth layer located in the encapsulation area may be formed directly after curing to form a film.
In one embodiment, the mild solution may be a polymer solution. The solute in the mild solution may include one or more of a polymer material, such as polyimide, rubber, polystyrene, phenolic resin, and the like. The solute in the mild solution may also include reactants capable of forming a polymeric material, such as polyamic acid capable of reacting to form polyimide, formaldehyde and phenol capable of reacting to form phenolic resin, and the like. In a preferred embodiment, the polymeric material in the mild solution includes a material with a high glass transition temperature, such as polyimide, phenolic resin, or the like.
The molecular weight of the polymer material in the mild solution may be 1000-1000000g/mol, preferably 1000-100000 g/mol. The polymer material may be a linear or branched polymer material.
The solvent in the mild solution may include any solvent or mixture thereof capable of dissolving the selected polymer material, such as ethanol, acetone, toluene, dimethyl sulfoxide, nitrogen methyl pyrrolidone, etc., preferably a low boiling point solvent.
The mass fraction of solute in the mild solution is 1% to 80%, preferably 5% to 50%.
In the process of curing the solution to form the film, the curing temperature can be a constant temperature lower than the boiling point of the solvent or a temperature with gradient rise.
In the process of curing the mild solution into a film, the solvent in the mild solution volatilizes, so that the solute shrinks from the edge to the middle, and thus, in the process of curing the mild solution at the two sides of the isolation column 31, the solute shrinks from the edge close to the isolation column toward the direction far away from the isolation column, so that the two sides of the isolation column 31 form a high polymer film with thick edge and thin middle, namely the mild layer 32. Therefore, the gentle layer is formed to include the filling portion 321 contacting the sidewall of the isolation pillar 31 and the flat portion 322 located at the center and connected to the filling portion 321. The upper surface of the filling part 321 is in a climbing structure from a position far away from the isolation column 31 to a position close to the isolation column 31, the upper surface of the flat part 322 is a flat surface, and the upper surface of the flat part 322 is smoothly connected with the upper surface of the filling part 321.
In one embodiment, the thickness of the flattening layer (the thickness of the flat portion) d may be 0.01 to 0.8 micrometers. In one embodiment, the thickness d of the flattish layer is between 0.05 and 0.5 microns.
S16: an isolation layer 33 is formed on the flattening layer 32 in the encapsulation area. The specific process of forming the isolation layer 33 includes: an isolation film is deposited on the substrate 20 on which the smoothing layer 32 is formed, the isolation film is patterned through a patterning process, the isolation film located in the display area is removed, and the isolation film located in the encapsulation area and the mounting hole is retained to form an isolation layer 33, as shown in fig. 5e, where fig. 5e is a schematic structural view after the isolation layer is formed in the display panel. It is to be understood that the spacer film located at the mounting hole may be removed together when the spacer film is subjected to the patterning process. The isolation film may be made of silicon nitride SiNx, silicon oxide SiOx, or the like, and may be a single layer or a multilayer structure of silicon nitride/silicon oxide.
S17: a light emitting functional layer is formed, which may include an organic functional layer and a cathode. The method specifically comprises the following steps: an organic functional material and a cathode metal film are sequentially deposited on the substrate forming the aforementioned structure to form a light-emitting functional layer 22 (generally including an organic functional layer and a cathode), as shown in fig. 5f, fig. 5f is a schematic structural diagram of the display panel after the light-emitting functional layer is formed. It will be readily appreciated that the organic functional layer and the cathode may be formed by means commonly used in the art, such as evaporation, and the light-emitting functional layer 22 (organic functional layer and cathode) is spread over the surface of the substrate, as shown in fig. 5 f. In the packaging area, as the isolation column 31 is arranged in the packaging area, and the isolation column 31 has the characteristic of being wide at the top and narrow at the bottom, the isolation column 31 can enable the light-emitting function layer 22 to be broken at the side wall of the isolation column, one part of the light-emitting function layer 22 is positioned on the isolation layer 33 at the upper end of the isolation column 31, the other part of the light-emitting function layer 22 is positioned on the isolation layers 33 at the two sides of the isolation column 31, so that the light-emitting function layer 22 is completely broken in the packaging area, the light-emitting function layer 22 is isolated between the display area and the mounting hole, water and oxygen are prevented from entering the light-emitting function layer from the side wall of the mounting hole, and the service life of the OLED device is prolonged.
Among them, the light emitting functional layer may include an organic functional layer mainly including an emission layer (EML) and a cathode. In practical implementation, the organic functional layer may include a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer, which are sequentially disposed, to improve efficiency of injecting electrons and holes into the light emitting layer, and the cathode may be made of one of metal materials such as magnesium Mg, silver Ag, aluminum Al, copper Cu, lithium Li, or an alloy of the above metals.
S2: forming a packaging structure layer, wherein the specific process comprises the following steps:
s21: a first inorganic encapsulation layer is formed. The method specifically comprises the following steps: a first inorganic film is deposited on the substrate with the aforementioned structure, and the first inorganic film covers the display area, the encapsulation area, and the mounting hole to form a first inorganic encapsulation layer 41, as shown in fig. 5g, where fig. 5g is a schematic structural view after the first inorganic encapsulation layer is formed in the display panel.
S22: and forming an organic packaging layer. The method specifically comprises the following steps: on the substrate on which the foregoing structure is formed, an organic encapsulation layer 43 is formed in the display region. The organic encapsulation solution may be formed in the display region by Ink Jet Printing (IJP) and then cured to form the organic encapsulation layer 43, as shown in fig. 5h, where fig. 5h is a schematic structural diagram of the display panel after the organic encapsulation layer is formed. In this embodiment, an organic encapsulation layer is also disposed on a side of the encapsulation region adjacent to the display region, and when an organic encapsulation solution is formed by inkjet printing, the isolation pillars 31 of the encapsulation region close to the display region can play a role of blocking, so as to prevent the organic encapsulation solution from flowing into the encapsulation region.
S23: forming a second inorganic encapsulation layer. The method specifically comprises the following steps: a second inorganic thin film is deposited on the substrate with the aforementioned structure, and the second inorganic thin film covers the display region, the encapsulation region, and the mounting hole, so as to form a second inorganic encapsulation layer 43, as shown in fig. 5i, where fig. 5i is a schematic structural view after the second inorganic encapsulation layer is formed in the display panel.
Finally, etching away the structural film layers of the mounting hole by using related processes such as laser and the like to form the OLED display panel according to the embodiment of the invention, as shown in fig. 3. In practical implementation, all the structural film layers and the substrate of the mounting hole can be etched away to form a through hole, and part of the structural film layers of the mounting hole can be etched away to form a blind hole.
Second embodiment:
based on the technical concept of the embodiment of the invention, the embodiment of the invention also provides a preparation method of the display panel. The display panel comprises a display area, a mounting hole positioned in the display area and an encapsulation area arranged between the mounting hole and the display area, the preparation method comprises the following steps of forming an isolation structure positioned on a substrate in the encapsulation area, and the forming of the isolation structure comprises the following steps:
forming an isolation column on a substrate in a packaging area, wherein the orthographic projection of one side, close to the substrate, of the isolation column on the substrate is positioned in the orthographic projection of one side, far away from the substrate, of the isolation column on the substrate;
and forming gentle layers in the packaging area, wherein the gentle layers are positioned on two sides of the isolation column and comprise filling parts in contact with the side wall of the isolation column, and the surface of one side of the filling part, which is far away from the substrate base plate, is of a climbing structure in the direction towards the isolation column from the isolation column.
In one embodiment, forming a smoothing layer in the encapsulation area includes:
coating a mild solution on a substrate base plate;
removing the gentle solution located in the display area;
curing the gentle solution in the packaging area to form a gentle layer in the packaging area,
alternatively, the first and second electrodes may be,
forming a gentle solution in the encapsulation area by an inkjet printing process;
the mild solution is solidified into a film to form a mild layer.
In one embodiment, the mild solution includes a polymer material including one or more of polyimide, rubber, polystyrene, phenolic resin, and a solvent including one or more of ethanol, acetone, toluene, dimethyl sulfoxide, and azomethylpyrrolidone.
In one embodiment, the mass fraction of the polymeric material in the mild solution is 5% to 50%.
In one embodiment, forming the isolation structure further comprises: and forming an isolation layer on the gentle layer in the packaging area, wherein the isolation layer covers the isolation column and the gentle layer.
In one embodiment, forming an isolation pillar on a substrate at a package region includes:
forming a base layer on the substrate in the encapsulation region;
and forming isolation columns on the substrate layer in the packaging area.
In one embodiment, a method of manufacturing a display panel includes:
forming an anode on the substrate in the display region;
forming a pixel defining layer on the anode electrode in the display region,
the base layer and the pixel definition layer are formed through a mask process.
In one embodiment, the preparation method further comprises:
forming a light-emitting functional layer on the isolation structure in the encapsulation region, wherein the light-emitting functional layer is disconnected by the isolation structure;
and forming an inorganic packaging layer on the light-emitting function layer.
In this embodiment, the structure, material, related parameters, and detailed preparation process of each film layer have been described in detail in the foregoing embodiments, and are not described herein again.
The third embodiment:
based on the inventive concept of the foregoing embodiments, an embodiment of the present invention also provides a display device including the display panel employing the foregoing embodiments. The display device may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
In the description of the embodiments of the present invention, it should be understood that the terms "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Although the embodiments of the present invention have been described above, the above description is only for the convenience of understanding the present invention, and is not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (12)
1. A display panel is arranged on a plane parallel to the display panel, and comprises a display area, a mounting hole positioned in the display area and a packaging area arranged between the mounting hole and the display area, and is characterized in that on the plane perpendicular to the display panel, the packaging area comprises a substrate base plate and an isolation structure arranged on the substrate base plate, the isolation structure comprises an isolation column and gentle layers formed behind the isolation column and positioned on two sides of the isolation column, each gentle layer comprises a filling part contacted with the side wall of the isolation column, and the surface of one side of the filling part, which is far away from the substrate base plate, is gradually far away from the isolation column position towards the direction close to the isolation column position;
the display panel further comprises an anode arranged on the substrate base plate and a pixel definition layer arranged on the anode, the isolation structure further comprises a base layer, the base layer and the anode are arranged on the substrate base plate, and the base layer and the pixel definition layer are formed through a mask process.
2. The display panel according to claim 1, wherein the flattening layer further comprises a flat portion, a surface of the flat portion on a side facing away from the substrate base plate is a flat surface, and the flat portion is connected to the filling portion.
3. The display panel according to claim 1, wherein the material of the flattening layer comprises a polymer material.
4. The display panel according to claim 1, wherein the isolation structure further comprises an isolation layer provided on the gentle layer, the isolation layer covering the isolation pillar and the gentle layer.
5. A display panel as claimed in any one of claims 1 to 4, characterized in that, in a plane perpendicular to the display panel, the structure of the display area comprises a substrate, an anode arranged on the substrate, a pixel definition layer arranged on the anode, a light-emitting function layer arranged on the pixel definition layer, a first inorganic packaging layer arranged on the light-emitting function layer, an organic packaging layer arranged on the first inorganic packaging layer and a second inorganic packaging layer arranged on the organic packaging layer, the light-emitting functional layer is also positioned in the packaging area, the light-emitting functional layer is positioned on the isolation structure in the packaging area and is disconnected by the isolation structure, the packaging region further comprises an inorganic packaging layer arranged on the light-emitting functional layer, and the inorganic packaging layer comprises the second inorganic packaging layer or the first inorganic packaging layer and the second inorganic packaging layer which are sequentially stacked.
6. A preparation method of a display panel, wherein the display panel comprises a display area, a mounting hole in the display area and an encapsulation area arranged between the mounting hole and the display area, the preparation method comprises forming an isolation structure on a substrate in the encapsulation area, and the forming of the isolation structure comprises:
forming an isolation column on the substrate in the packaging region;
forming gentle layers in the packaging area, wherein the gentle layers are positioned on two sides of the isolation column and comprise filling parts in contact with the side walls of the isolation column, and the surface of one side of each filling part, which is far away from the substrate base plate, is gradually far away from the substrate base plate from the position far away from the isolation column towards the direction close to the position of the isolation column;
forming an isolation pillar on the substrate at the encapsulation region, including:
forming a base layer on the substrate in the packaging region;
forming isolation pillars on the base layer in the packaging area;
the method further comprises the following steps:
forming an anode on the substrate in the display region;
and forming a pixel definition layer on the anode in the display area, wherein the base layer and the pixel definition layer are formed by a one-time mask process.
7. The manufacturing method according to claim 6, wherein forming a gentle layer in the encapsulation area includes:
coating a mild solution on a substrate base plate;
removing the gentle solution located in the display area;
curing the gentle solution in the packaging area to form a gentle layer in the packaging area,
alternatively, the first and second electrodes may be,
forming a gentle solution in the encapsulation area by an inkjet printing process;
the mild solution is solidified into a film to form a mild layer.
8. The method of claim 7, wherein the mild solution comprises a polymer material and a solvent, the polymer material comprises one or more of polyimide, rubber, polystyrene and phenolic resin, and the solvent comprises one or more of ethanol, acetone, toluene, dimethyl sulfoxide and azomethine pyrrolidone.
9. The preparation method according to claim 8, wherein the mass fraction of the polymer material in the mild solution is 5% to 50%.
10. The method according to any one of claims 6 to 9, wherein forming the isolation structure further comprises: and forming an isolation layer on the gentle layer in the packaging area, wherein the isolation layer covers the isolation column and the gentle layer.
11. The method of manufacturing according to claim 6, further comprising:
forming a light emitting function layer on the isolation structure in the packaging area, wherein the light emitting function layer is disconnected by the isolation structure;
and forming an inorganic packaging layer on the light-emitting function layer.
12. A display device comprising the display panel according to any one of claims 1 to 5.
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