CN111883544A - Display panel, display device, electronic equipment and preparation method - Google Patents
Display panel, display device, electronic equipment and preparation method Download PDFInfo
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- CN111883544A CN111883544A CN202010861806.5A CN202010861806A CN111883544A CN 111883544 A CN111883544 A CN 111883544A CN 202010861806 A CN202010861806 A CN 202010861806A CN 111883544 A CN111883544 A CN 111883544A
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- 238000002360 preparation method Methods 0.000 title abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 96
- 238000005538 encapsulation Methods 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 111
- 239000012790 adhesive layer Substances 0.000 claims description 47
- 239000003292 glue Substances 0.000 claims description 46
- 239000000725 suspension Substances 0.000 claims description 27
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 229920002120 photoresistant polymer Polymers 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- 239000011229 interlayer Substances 0.000 claims description 11
- 239000013013 elastic material Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000011161 development Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
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- 239000011368 organic material Substances 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
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Abstract
The application discloses a display panel, a display device, electronic equipment and a preparation method, and relates to the technical field of display. A display panel comprises a TFT substrate, a pixel defining layer, an electroluminescent device layer and an encapsulation layer which are sequentially stacked, wherein a plurality of grooves are formed in the direction away from the pixel defining layer on one side of the TFT substrate, the grooves divide the TFT substrate into a plurality of sub-display areas which are spaced from each other, and at least one sub-pixel is accommodated in each sub-display area; still include a plurality of overlap joint bridges, the overlap joint bridge is taken on the recess, just the both ends of overlap joint bridge are connected respectively the recess both sides sub-display area for the adjacent sub-pixel of recess both sides provides the wiring passageway. The display panel provided by the application increases the wiring position at the groove, reduces wiring and increases sub-pixels in the original bridge area, and can effectively improve the resolution of the display panel.
Description
Technical Field
The present disclosure relates to the field of display device technologies, and in particular, to a display panel, a display device, an electronic apparatus, and a manufacturing method.
Background
With the development of display technology, in the field of wearable display, a rigid screen no longer meets the requirements, and a stretchable display screen comes along with the development; the stretchable display panel is stretchable by using stress in the opening area, and connection between the island areas is realized by routing in the bridge area.
However, more routing wires in the bridge area occupy a larger space of the display panel, which causes a relatively smaller arrangement space for pixels on the display panel, thereby resulting in a lower resolution of the display panel and failing to meet higher requirements.
Disclosure of Invention
The embodiment of the application provides a display panel, a display device, electronic equipment and a preparation method, and aims to solve the problems that the original bridge area wiring of the existing stretchable display screen occupies more display panel space, so that the pixel arrangement space is small, the resolution ratio of the display panel is low, and the higher requirement cannot be met.
In order to solve the above technical problem, an embodiment of the present application provides the following technical solutions:
a first aspect of the present application provides a display panel comprising a TFT substrate, a pixel defining layer, an electroluminescent device layer, and an encapsulation layer, which are sequentially stacked,
a plurality of grooves are formed in the TFT substrate in the direction away from the pixel defining layer from one side of the TFT substrate facing the pixel defining layer, the TFT substrate is divided into a plurality of sub-display areas which are spaced from each other by the grooves, and each sub-display area contains at least one sub-pixel;
still include a plurality of overlap joint bridges, the overlap joint bridge is taken on the recess, just the both ends of overlap joint bridge are connected respectively the recess both sides sub-display area for the adjacent sub-pixel of recess both sides provides the wiring passageway.
In some variations of the first aspect of the present application, the display panel described above, wherein the bridge is made of an elastic material.
In some modified embodiments of the first aspect of the present application, in the display panel, the bridge includes at least a first glue layer;
the first glue film comprises an overlapping portion and a suspension portion, the suspension portion corresponds to the groove, two ends of the suspension portion are respectively connected with the overlapping portion, and the overlapping portion is respectively connected to the sub-display areas on two sides of the groove.
In some modified embodiments of the first aspect of the present application, in the display panel, the suspension portion is disposed in parallel to the TFT substrate.
In some modified embodiments of the first aspect of the present application, in the display panel described above, the suspension is disposed non-parallel to the TFT substrate.
In some modified embodiments of the first aspect of the present application, the display panel further includes an interlayer dielectric layer disposed between the TFT substrate and the pixel defining layer;
the lap joint bridge also comprises a second adhesive layer;
the second adhesive layer is arranged between the TFT substrate and the first adhesive layer, and the second adhesive layer is arranged corresponding to the lap joint part;
the second adhesive layer and the interlayer dielectric layer are arranged on the same layer.
In some modified embodiments of the first aspect of the present application, the display panel described above, wherein the groove includes a first groove extending along a first direction and a second groove extending along a second direction;
the extending direction of the bridging bridge is vertical to the extending direction of the first groove/the second groove;
wherein the first direction is perpendicular to the second direction.
A second aspect of the present application provides a display device including the above display panel.
A third aspect of the present application provides an electronic apparatus including the display device described above.
A fourth aspect of the present application provides a method for manufacturing a display panel, which includes the following steps:
preparing a TFT substrate, and forming a plurality of grooves on the TFT substrate;
preparing the plurality of bridging bridges on the TFT substrate;
a pixel defining layer, an electroluminescent device layer, and an encapsulation layer are sequentially prepared.
In some variations of the fourth aspect of the present application, the step of fabricating the plurality of bridge connections on the TFT substrate includes:
preparing a second adhesive layer on the TFT substrate, and forming a bearing part of the lapping bridge at the groove;
preparing a first adhesive layer on one side of the supporting part, which is far away from the TFT substrate;
and removing the bearing part to form the overlap bridge.
In some variations of the fourth aspect of the present application, wherein the first glue layer is a negative photoresist;
the second glue layer is positive photoresist.
In some variations of the fourth aspect of the present application, the support is parallel/non-parallel to the TFT substrate.
Compared with the prior art, the display panel provided by the first aspect of the application has the advantages that the lap-joint bridge is bridged on the groove of the TFT substrate, and the two ends of the lap-joint bridge are respectively connected with the sub-display areas on the two sides of the groove, so that the groove is directly crossed, wiring is carried out to connect the adjacent sub-pixels on the two sides of the groove, the sub-pixels are arranged at the original bridge area, and the resolution of the display panel is improved; therefore, the problems that the original bridge area routing of the conventional stretchable display screen occupies more display panel space, so that the pixel arrangement space is small, the resolution of the display panel is low, and the high requirement cannot be met are effectively solved; the display panel provided by the application increases the wiring position at the groove, reduces wiring and increases sub-pixels in the original bridge area, and can effectively improve the resolution of the display panel.
Drawings
The above and other objects, features and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the present application are illustrated by way of example and not by way of limitation in the figures of the accompanying drawings and in which like reference numerals refer to similar or corresponding parts and in which:
fig. 1 schematically illustrates a schematic diagram of a display panel provided in an embodiment of the present application;
FIG. 2 is a schematic cross-sectional view taken along line B-B of area A of FIG. 1;
FIG. 3 is a schematic diagram illustrating a first portion of a display panel manufacturing process according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram illustrating a second portion of a display panel manufacturing process according to an embodiment of the present disclosure;
FIG. 5 is a schematic diagram illustrating a third part of a display panel manufacturing process according to an embodiment of the present disclosure;
fig. 6 schematically illustrates a structural diagram of a supporting part in a display panel preparation process according to an embodiment of the present application;
fig. 7 schematically illustrates an intermediate structure of a first adhesive layer prepared in a display panel preparation process according to an embodiment of the present application;
fig. 8 schematically illustrates a structural diagram of a first adhesive layer in a display panel preparation process provided by an embodiment of the present application;
fig. 9 schematically illustrates another structural diagram of a supporting part in a display panel manufacturing process according to an embodiment of the present application;
fig. 10 schematically illustrates another structural diagram of the first adhesive layer in the process of manufacturing a display panel according to an embodiment of the present application;
fig. 11 schematically illustrates a flow chart of a method for manufacturing a display panel according to an embodiment of the present application;
fig. 12 schematically illustrates a flow chart of manufacturing a bridge in a display panel manufacturing method according to an embodiment of the present application;
the reference numbers illustrate: the liquid crystal display device comprises a TFT substrate 1, a sub-display area 11, a substrate 12, a first flexible substrate 13, a buffer layer 14, a second flexible substrate 15, a TFT layer 16, a pixel defining layer 2, an electroluminescent device layer 3, a sub-pixel 31, an encapsulation layer 4, a groove 5, a first groove 51, a second groove 52, a lap joint bridge 6, a first glue layer 61, a lap joint part 611, a suspension part 612, a second glue layer 62, a support part 622, an interlayer dielectric layer 7, a first direction a and a second direction b.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
It is to be noted that, unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which this application belongs.
In order to solve the technical problems, the general idea of the embodiment of the application is as follows:
example 1
Referring to fig. 1 and 2, a display panel provided in an embodiment of the present application includes a TFT substrate 1, a pixel defining layer 2, an electroluminescent device layer 3, and an encapsulation layer 4, which are sequentially stacked, where:
a plurality of grooves 5 are formed in the TFT substrate 1 in the direction away from the pixel defining layer 2 towards the side facing the pixel defining layer 2, the TFT substrate 1 is divided into a plurality of sub-display areas 11 which are spaced from each other by the grooves 5, and each sub-display area 11 is provided with at least one sub-pixel 31;
still include a plurality of overlap joint bridges 6, overlap joint bridge 6 is taken on recess 5, just the both ends of overlap joint bridge 6 are connected respectively 5 both sides of recess sub-display area 31 is used for doing the adjacent subpixel 31 of recess 5 both sides provides the wiring passageway.
Specifically, in order to solve the problem that the existing stretchable display screen has the disadvantages that the conventional bridge area wiring occupies more display panel space, and the pixel arrangement space is small, so that the resolution of the display panel is low and the requirement for high resolution cannot be achieved, the display panel provided by the embodiment is connected to the TFT substrate 1 through the bridging bridge 6 on the groove 5, so that the two ends of the bridging bridge 6 are respectively connected to the sub-display areas 31 on the two sides of the groove 5, and then the two sides of the groove 5 are surrounded by the connecting lines of the adjacent sub-pixels 31 separated by the groove 5, which can be arranged through the bridging bridge 6, so that the conventional bridge area wiring is changed to directly cross the groove 5 for wiring, the wiring is reduced in the conventional bridge area, the sub-pixels are increased, and the resolution of the display panel can be effectively improved.
Referring to fig. 5, the TFT substrate 1 includes a substrate 12, a first flexible substrate 13, a buffer layer 14, a second flexible substrate 15, and a TFT layer 16, which are sequentially stacked, and the above structure can be easily understood by those skilled in the art, and is not described herein; referring to fig. 1, the TFT substrate 1 is divided into sub-display regions 11 spaced from each other by the plurality of grooves 5, that is, in this embodiment, a bridge region for routing in a conventional stretchable display panel is removed, so that regions on the display panel except for the grooves 5 are all the sub-display regions 11, and thus, under the condition that the size of the display panel is fixed, the number of sub-pixels 31 is greatly increased, thereby improving the resolution of the display panel.
Referring to fig. 5, the groove 5 extends from the TFT layer 16 to the buffer layer 14, and the groove 5 is disposed such that the TFT substrate 1 and the display panel formed by the TFT substrate 1 can be stretched along the extending direction of the groove 5 to form a stretchable display panel, that is, the groove 5 corresponds to an opening region in a conventional stretchable display panel, which can be easily understood by those skilled in the art and is not limited thereto.
Referring to fig. 1, the extending direction of the groove 5 may be parallel to the length/width direction of the TFT substrate 1, or may be obliquely disposed on the TFT substrate 1, and it can be understood that: the extending direction of the groove 5 depends on the stretching direction of the TFT substrate 1 or the display panel, which can be easily understood and implemented by those skilled in the art, and will not be described in detail herein.
The overlap bridge 6 plays a role of a bridge for carrying the notch of the groove 5, the overlap bridge 6 connects the sub-display areas 11 on both sides of the groove 5, and further, a wiring channel can be provided for the sub-pixels 31 which need to cross the groove 5 to be electrically connected in the sub-display areas 11 on both sides of the groove 5, so that the wiring can directly pass through the groove 5 without bypassing the groove 5 to occupy unnecessary display panel space; the bridging bridge 6 may be straight or curved, as long as the communication between the sub-display areas 11 at the two sides of the groove 5 can be realized; and the bridging bridge 6 can be deformed, and then the display panel utilizes when recess 5 is stretched, bridging bridge 5 can be deformed thereupon to avoid bridging bridge 6 fracture, influence shows.
According to the above list, in the display panel provided by the first aspect of the present application, the bridging bridge 6 is bridged on the groove 5 of the TFT substrate 1, and two ends of the bridging bridge 6 are respectively connected to the sub-display regions 11 on two sides of the groove 5, so that the adjacent sub-pixels 31 on two sides of the groove 5 are wired and connected directly across the groove 5, and the sub-pixels 31 are arranged at the original bridge region, thereby improving the resolution of the display panel; the display panel provided by the application increases the routing position at the groove 5, reduces the routing at the original bridge area and increases the sub-pixels 31, and can effectively improve the resolution of the display panel.
The term "and/or" herein is merely an associative relationship describing an associated object, meaning that three relationships may exist, e.g., a and/or B, specifically understood as: both a and B may be included, a may be present alone, or B may be present alone, and any of the three cases can be provided.
Further, in the display panel provided in the embodiments of the present application, in a specific implementation, the bridge 6 is made of an elastic material.
Specifically, in order to ensure that the bridge 6 can deform along with the stretching of the display panel, in this embodiment, the material of the bridge 6 is set as an elastic material, for example: metal, organic matter, metal and organic matter combination and the like, wherein when the bridging bridge 6 is made of metal, the bridging bridge can pass through the form of a metal sheet/elastic sheet; when the bridge 6 is made of organic material, the material properties already determine that it is deformable; when the bridge 6 is made of a combination of metal and organic material, reference can be made to the above two methods; the foregoing can be easily understood and implemented by those skilled in the art, and thus will not be described in detail herein.
Further, referring to fig. 8 and fig. 10, in a display panel provided in the embodiment of the present application, in a specific implementation, the bridge 6 at least includes a first glue layer 61;
the first adhesive layer 61 includes overlapping portions 611 and suspending portions 612, the suspending portions 612 correspond to the grooves 5, two ends of the suspending portions 612 are respectively connected to one of the overlapping portions 611, and the overlapping portions 611 are respectively connected to the sub-display regions 11 on two sides of the grooves 5.
Specifically, in order to ensure that the bridge 6 can provide a routing channel for the sub-pixels 31 on both sides of the groove 5, in this embodiment, the bridge 6 is set to at least include the first glue layer 61, the first glue layer 61 is a negative photoresist (transparent colloid), in the manufacturing process, referring to fig. 7, it is necessary to coat a second glue layer 62 on one side of the TFT layer 16 away from the substrate 12, the second glue layer 62 is a positive photoresist (transparent colloid), the support portion 622 is formed at a position corresponding to the groove 5, then the first glue layer 61 is coated on the second glue layer 62, exposure and development are performed with a large exposure amount, so that the first glue layer 61 of the negative photoresist is cured, the second glue layer 62 of the positive photoresist is dissolved, and referring to fig. 8, the first glue layer 61 remaining at a position corresponding to the groove 51 is the suspension portion 612, the first glue layers 62 on both sides of the groove 5 are the overlapping parts 611; the suspending portion 612 may be concave toward the groove 5 as shown in fig. 8, or convex away from the groove 5 as shown in fig. 10, when the suspending portion 612 is concave, the coating thickness of the second adhesive layer 62 may be set to be smaller when the second adhesive layer 62 is coated, so as to ensure that the second adhesive layer 62 is concave in the groove 5 as shown in fig. 6, and thus when the first adhesive layer 61 is coated, the suspending portion 612 is concave in the groove 5; correspondingly, when the overhang portion 612 is convex, the coating thickness of the second adhesive layer 62 can be set to be larger when the second adhesive layer 62 is coated, so as to ensure that the second adhesive layer 62 shown in fig. 9 protrudes out of the groove 5, and therefore, when the first adhesive layer 61 is coated, the overhang portion 612 is concave in the groove 5; the coating, exposing and developing of the first adhesive layer 61 and the second adhesive layer 62 can be easily understood and realized by those skilled in the art, and will not be described in detail herein.
Further, referring to fig. 8 and 10, in a specific implementation of the display panel provided in the embodiment of the present application, the suspension portion 612 is disposed parallel to the TFT substrate 1, or the suspension portion 612 is disposed non-parallel to the TFT substrate 1.
Specifically, in order to prevent the display panel from being deformed when the display panel is stretched through the groove 5 and avoid the occurrence of bridge fracture and affecting the display, in the present embodiment, on the premise that the bridge 6 is made of an elastic material, the overhang 612 may be disposed in a direction parallel/non-parallel to the TFT substrate 1, and when the overhang 612 is parallel to the TFT substrate 1, referring to fig. 8, the bridge 6 horizontally overlaps the groove 5, and the suspension 612 is horizontally disposed, when the display panel is stretched by the groove 5, the overhang portion 612 can be deformed to some extent in the stretching direction, i.e. the left-right direction in the drawing, specifically, as shown in fig. 8 and 10, the extending direction of the groove 5 is a direction perpendicular to the inside and outside of the picture, and the extending direction is a left-right direction in the picture; preferably, the suspension 612 is configured to be non-parallel to the TFT substrate 1, i.e. concave as shown in fig. 8 or convex as shown in fig. 10, and may also be in the form of zigzag, wave, etc., so that the amount of redundancy of the suspension 612 in all directions in the groove 5 is large enough, thereby greatly improving the deformability of the suspension 612 and ensuring that the bridge 6 will not break along with the stretching of the display panel, which will affect the display.
Further, referring to fig. 2, in a specific implementation, the display panel provided in the embodiment of the present application further includes an interlayer dielectric layer 7, where the interlayer dielectric layer 7 is disposed between the TFT substrate 1 and the pixel defining layer 2;
the bridging bridge 6 further comprises a second glue layer 62;
the second adhesive layer 62 is disposed between the TFT substrate 1 and the first adhesive layer 61, and the second adhesive layer 62 is disposed corresponding to the bonding portion 611;
the second glue layer 62 and the interlayer dielectric layer 7 are arranged on the same layer.
Specifically, in order to simplify the manufacturing process on the premise that the suspension portion 612 of the overlap bridge 6 can be smoothly formed and the arrangement of the original functional layers of the display panel is not affected, in this embodiment, the second adhesive layer 62 and the interlayer dielectric layer 7 are arranged on the same layer and the same material, so that the supporting portion 622 required by the formation of the suspension portion 612 can be formed, and the arrangement of the second adhesive layer 62 can be planned in the preparation process of the interlayer dielectric layer 7, so that the arrangement of the second adhesive layer 62 or the supporting portion 622 is realized on the premise that the preparation process steps are not increased, and the arrangement of the suspension portion 612 of the overlap bridge 6 is padded; it is of course to be understood that: if the second glue layer 62 is not disposed on the same layer as the interlayer dielectric layer 7, the second glue layer 62 may not be present in the display panel structure in the family, for example: as shown in fig. 9, when the coating thickness of the second adhesive layer 62 is large, so that the supporting portion 622 protrudes out of the groove 5, when the position of the second adhesive layer 62 corresponding to the overlapping portion 611 is exposed and developed, the supporting portion 622 corresponding to the groove 5 can be retained, the second adhesive layer 62 corresponding to the overlapping portion 611 is completely dissolved away, and the finally formed overlapping bridge 6 does not have the second adhesive layer 62.
Further, referring to fig. 1, in a display panel provided in an embodiment of the present application, in a specific implementation, the groove 5 includes a first groove 51 extending along a first direction a and a second groove 52 extending along a second direction b;
the extending direction of the bridge 6 is perpendicular to the extending direction of the first groove 51/the second groove 52;
wherein the first direction a is perpendicular to the second direction b.
Specifically, in order to realize the stretchability of the display panel, in this embodiment, the groove 5 is configured to include a groove 5 extending along the first direction a and the second direction b, where the first direction a and the second direction b are respectively a length direction and a width direction of the display panel (TFT substrate 1), and when corresponding to the groove 5 disposed along the length direction of the display panel (TFT substrate 1), the display panel (TFT substrate 1) may be stretched along the width direction thereof, and when corresponding to the groove 5 disposed along the width direction of the display panel (TFT substrate 1), the display panel (TFT substrate 1) may be stretched along the length direction thereof; it should be noted that: the grooves 5 are arranged along the length or width direction of the display panel (TFT substrate 1) only in a common manner, and may also be arranged along other inclined directions on the display panel (TFT substrate 1), and it can be understood that: the extending direction of the groove 5 depends on the stretching direction of the TFT substrate 1 or the display panel, which can be easily understood and implemented by those skilled in the art, and will not be described in detail herein.
The extending direction of the bridge 6 is perpendicular to the extending direction of the groove 5, when the bridge 6 is disposed on the first groove 51, the extending direction of the groove 5 is perpendicular to the extending direction of the first groove 51, and when the bridge 6 is disposed on the second groove 52, the extending direction of the groove 5 is perpendicular to the extending direction of the second groove 52, so that the bridge 6 directly crosses over the groove 5 to connect the sub-display regions 11 on both sides of the groove 5; of course, the arrangement of the groove 5 in other shapes can be inferred from the technical solution of the present application, and therefore, all of them should belong to the protection scope of the present application, for example: if the recess 5 is circular, the bridge 6 can then bridge the recess 5 in any direction along the diameter of the recess 5.
Example 2
Further, an embodiment of the present application provides a display device, which includes the display panel.
The detailed description of the specific structure and the principle of improving the resolution of the display panel described in embodiment 1 is referred to the above detailed description of embodiment 1, and will not be repeated herein.
Example 3
Further, an embodiment of the present application provides an electronic device, which includes the display device.
For a specific structure and a resolution enhancement principle of the display device described in embodiment 2, please refer to the detailed description of embodiment 1 and embodiment 2, which is not described herein again.
Example 4
Further, referring to fig. 11, an embodiment of the present application provides a method for manufacturing a display panel according to embodiment 1, which includes the following steps:
101. preparing a TFT substrate 1, and forming a plurality of grooves 5 on the TFT substrate 1;
specifically, referring to fig. 2, the TFT substrate 1 includes a substrate 12, a first flexible substrate 13, a buffer layer 14, a second flexible substrate 15, and a TFT layer 16, which are sequentially stacked, and in the specific preparation process, referring to fig. 3, fig. 4, and fig. 5, and fig. 3, a polyimide solution is coated on the substrate 12, and is dried under reduced pressure and baked and dried to form the first flexible substrate (PI)13, and the first flexible substrate (PI)13 is etched to form the groove 5; then, forming the buffer layer 14 on one side of the first flexible substrate (PI)13, which is away from the substrate 12, and performing patterning processing on the position, corresponding to the groove 5, of the buffer layer 14, and reserving the groove 5; next, referring to fig. 4, a polyimide solution is formed and coated on a side of the buffer layer 14 away from the substrate base plate 12, and the second flexible base Plate (PI)15 is formed through reduced pressure drying and baking drying, and is etched corresponding to the position of the groove 5, and the groove 5 is reserved; then, referring to fig. 5, the TFT layer 16 is disposed on a side of the second flexible substrate (PI)15 away from the substrate 12, and the position of the groove 5 is also ensured to be left; the arrangement of the TFT substrate 1 is easily understood and implemented by those skilled in the art, and thus will not be described herein.
102. Preparing the plurality of bridging bridges 6 on the TFT substrate 1;
specifically, as shown in fig. 2, 8 and 10, a plurality of the bridging bridges 6 are disposed on the TFT substrate 1, that is, on a side of the TFT layer 16 away from the substrate 12, corresponding to the plurality of the grooves 5, so that the bridging bridges 6 cross over the grooves 5 and are respectively connected to the sub-display regions 11 on two sides of the grooves 5.
103. Preparing a pixel defining layer 2, an electroluminescent device layer 3 and an encapsulation layer 4 in sequence;
specifically, referring to fig. 2, in order to ensure the integrity of the display panel provided in this embodiment, the pixel defining layer 2, the electroluminescent device layer 3, and the encapsulation layer 4 are sequentially stacked upward on a side of the bridge 6 away from the substrate 12, and the arrangement manner of the above structures is the same as that in the prior art, and the arrangement manner is well known and can be easily implemented by those skilled in the art, so that redundant description is not repeated in this embodiment.
Further, referring to fig. 12, the step 102 specifically includes the following steps:
201. preparing a second glue layer 62 on the TFT substrate 1, and forming a supporting portion 622 of the bridge 6 at the groove 5;
specifically, the second glue layer 62 is coated on a side of the TFT layer 16 away from the base substrate 12, where the second glue layer 62 is a positive photoresist, so that the supporting portion 622 is formed; in order to ensure that the suspension portion 622 of the finally formed bridge 6 is concave or convex or has another shape, in this embodiment, the shape of the support portion 622 needs to be designed in advance, the shape of the support portion 622 may be concave as shown in fig. 6, or convex as shown in fig. 9, or may be wave-shaped, zigzag-shaped, or the like, and only the mask shape or the mask position in the exposure process needs to be adjusted; in order to ensure that the suspension portion 612 has sufficient deformation redundancy at the groove 5, in this embodiment, when the supporting portion 622 is disposed, firstly, the supporting portion 622 is ensured to have sufficient deformation redundancy, and then the second glue layer 62 is exposed and developed properly to have a significant non-parallel extending manner to the TFT substrate 1;
for example: referring to fig. 6, when the coating thickness of the second adhesive layer 62 is small, since the layer thickness is uniform and the groove 5 needs to be filled at the groove 5, the second adhesive layer 62 is recessed in the groove 5, and in order to increase the redundancy of the suspension portion 612, in this embodiment, the second adhesive layer 62 in the groove 5 is exposed and developed, so that the supporting portion 622 with a larger recessed degree is obtained;
another example is: referring to fig. 9, when the coating thickness of the second adhesive layer 62 is larger, the second adhesive layer 62 protrudes from the groove 5, in order to increase the redundancy of the suspension portion 612, in this embodiment, the second adhesive layer 62 outside the groove 5 is exposed and developed (in this process, if the second adhesive layer 62 and the interlayer dielectric layer 7 are disposed on the same layer, the second adhesive layer 62 outside the groove 5 cannot be completely removed, and on the contrary, the second adhesive layer can be completely removed), so that the supporting portion 622 with a larger protruding degree is obtained.
202. Preparing a first glue layer 61 on one side of the supporting portion 622 departing from the TFT substrate 1;
specifically, the first glue layer 61 is coated on a side of the second glue layer 62 away from the base substrate 12, the first glue layer 61 is a negative photoresist, and the first glue layer 61 is cured and formed through exposure and development, which will be described in detail below in correspondence to two examples in the step 201:
referring to fig. 7, the first glue layer 61 is coated on a side of the second glue layer 62 away from the substrate 12, the first glue layer 61 is a positive photoresist, and is exposed and developed to be cured on the second glue layer 62, so that a suspension portion 612 having the same shape as the supporting portion 622, i.e., a concave shape, is formed in the groove 5;
the first glue layer 61 is coated on the side, away from the substrate base plate 12, of the second glue layer 62, the first glue layer 61 is a positive photoresist, exposure and development are performed on the positive photoresist, the positive photoresist is solidified on the second glue layer 62, and then a suspension portion 612 which is in the same shape as the bearing portion 622, namely is convex upward, is formed outside the groove 5.
203. Removing the supporting part 622 to form the bridging bridge 6;
specifically, after the first glue layer 61 is cured and formed on the second glue layer 62, the supporting portion 622 needs to be removed to form the final complete bridge 6, the removing method is to increase the exposure to expose and develop the supporting portion 622 (second glue layer 62) in the groove 5, and since the second glue layer 62 is a positive photoresist, it will be dissolved, and the following two examples corresponding to the above step 201 will be described in detail:
referring to fig. 7, the recess 5 is exposed again to a larger exposure, so that the recessed supporting portion 622 in the recess 5 is dissolved, and only the recessed suspending portion 612 is retained in the recess 5, and finally the recessed bridge 6 shown in fig. 8 is formed;
referring to fig. 9, the recess 5 is exposed again to a larger exposure, so that the convex supporting portions 622 in the recess 5 are dissolved, and only the convex suspending portions 612 are retained in the recess 5, and finally the concave bridge 6 shown in fig. 10 is formed.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (13)
1. A display panel comprises a TFT substrate, a pixel defining layer, an electroluminescent device layer and an encapsulation layer which are sequentially stacked, and is characterized in that:
a plurality of grooves are formed in the TFT substrate in the direction away from the pixel defining layer from one side of the TFT substrate facing the pixel defining layer, the TFT substrate is divided into a plurality of sub-display areas which are spaced from each other by the grooves, and each sub-display area contains at least one sub-pixel;
still include a plurality of overlap joint bridges, the overlap joint bridge is taken on the recess, just the both ends of overlap joint bridge are connected respectively the recess both sides sub-display area for the adjacent sub-pixel of recess both sides provides the wiring passageway.
2. The display panel according to claim 1, characterized in that:
the bridge is made of an elastic material.
3. The display panel according to claim 1, characterized in that:
the lap joint bridge at least comprises a first glue layer;
the first glue film comprises an overlapping portion and a suspension portion, the suspension portion corresponds to the groove, two ends of the suspension portion are respectively connected with the overlapping portion, and the overlapping portion is respectively connected to the sub-display areas on two sides of the groove.
4. The display panel according to claim 3, wherein:
the suspension portion is arranged in parallel to the TFT substrate.
5. The display panel according to claim 3, wherein:
the suspension is disposed non-parallel to the TFT substrate.
6. The display panel according to claim 3, wherein:
the TFT substrate is arranged on the pixel defining layer, and the pixel defining layer is arranged on the TFT substrate;
the lap joint bridge also comprises a second adhesive layer;
the second adhesive layer is arranged between the TFT substrate and the first adhesive layer, and the second adhesive layer is arranged corresponding to the lap joint part;
the second adhesive layer and the interlayer dielectric layer are arranged on the same layer.
7. The display panel according to claim 1, characterized in that:
the grooves comprise a first groove extending along a first direction and a second groove extending along a second direction;
the extending direction of the bridging bridge is vertical to the extending direction of the first groove/the second groove;
wherein the first direction is perpendicular to the second direction.
8. A display device, characterized in that it comprises:
the display panel of any one of claims 1-7.
9. An electronic device, comprising:
the display device of claim 7.
10. A method for manufacturing a display panel according to claims 1-7, comprising the steps of:
preparing a TFT substrate, and forming a plurality of grooves on the TFT substrate;
preparing the plurality of bridging bridges on the TFT substrate;
a pixel defining layer, an electroluminescent device layer, and an encapsulation layer are sequentially prepared.
11. The method for manufacturing a display panel according to claim 10, wherein: the step of preparing the plurality of bridging bridges on the TFT substrate includes:
preparing a second adhesive layer on the TFT substrate, and forming a bearing part of the lapping bridge at the groove;
preparing a first adhesive layer on one side of the supporting part, which is far away from the TFT substrate;
and removing the bearing part to form the overlap bridge.
12. The method for manufacturing a display panel according to claim 11, wherein:
the first glue layer is a negative photoresist;
the second glue layer is positive photoresist.
13. The method for manufacturing a display panel according to claim 11, wherein:
the supporting part is parallel/non-parallel to the TFT substrate.
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