CN111883544B - Display panel, display device, electronic equipment and preparation method - Google Patents
Display panel, display device, electronic equipment and preparation method Download PDFInfo
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- CN111883544B CN111883544B CN202010861806.5A CN202010861806A CN111883544B CN 111883544 B CN111883544 B CN 111883544B CN 202010861806 A CN202010861806 A CN 202010861806A CN 111883544 B CN111883544 B CN 111883544B
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- 238000002360 preparation method Methods 0.000 title abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 91
- 239000012790 adhesive layer Substances 0.000 claims description 86
- 239000010410 layer Substances 0.000 claims description 74
- 239000000725 suspension Substances 0.000 claims description 38
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 239000011229 interlayer Substances 0.000 claims description 13
- 229920002120 photoresistant polymer Polymers 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 6
- 239000013013 elastic material Substances 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 7
- 239000003292 glue Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application discloses a display panel, a display device, electronic equipment and a preparation method, and relates to the technical field of display. The display panel comprises a TFT substrate, a pixel defining layer, an electroluminescent device layer and a packaging layer which are sequentially stacked, wherein a plurality of grooves are formed in the TFT substrate in the direction of the side, facing the pixel defining layer, away from the pixel defining layer, and divide the TFT substrate into a plurality of mutually-spaced sub-display areas, and each sub-display area is provided with at least one sub-pixel; the display device further comprises a plurality of lap joints, wherein the lap joints are lapped on the grooves, and two ends of the lap joints are respectively connected with the sub-display areas on two sides of the grooves and used for providing wiring channels for adjacent sub-pixels on two sides of the grooves. The display panel provided by the application has the advantages that the wiring positions are increased at the grooves, the number of the wiring and the number of the sub-pixels are increased in the original bridge area, and the resolution of the display panel can be effectively improved.
Description
Technical Field
The present application relates to the field of display devices, and in particular, to a display panel, a display device, an electronic apparatus, and a manufacturing method thereof.
Background
With the development of display technology, in the field of wearable display, rigid screens no longer meet the requirements, and stretchable display screens have been developed; the stretchable display panel is stretchable by using stress in the open area and the connection between the islands is achieved by routing lines in the bridge area.
However, the more wires in the bridge area occupy a larger space of the display panel, which results in a relatively smaller layout space for the pixels on the display panel, thereby resulting in a lower resolution of the display panel and failing to meet the higher requirements.
Disclosure of Invention
The embodiment of the application provides a display panel, a display device, electronic equipment and a preparation method, which are used for solving the problems that the prior stretchable display screen occupies more display panel space due to the fact that the original bridge area wiring occupies less pixel arrangement space, so that the resolution of the display panel is low and higher requirements cannot be met.
In order to solve the technical problems, the embodiment of the application provides the following technical scheme:
The first aspect of the present application provides a display panel comprising a TFT substrate, a pixel defining layer, an electroluminescent device layer and an encapsulation layer, which are sequentially stacked,
A plurality of grooves are formed in the TFT substrate in the direction of the side, facing the pixel defining layer, away from the pixel defining layer, the grooves divide the TFT substrate into a plurality of mutually-spaced sub-display areas, and at least one sub-pixel is accommodated in each sub-display area;
the display device further comprises a plurality of lap joints, wherein the lap joints are lapped on the grooves, and two ends of the lap joints are respectively connected with the sub-display areas on two sides of the grooves and used for providing wiring channels for adjacent sub-pixels on two sides of the grooves.
In some modified embodiments of the first aspect of the present application, the display panel is as described above, wherein the bridge is made of an elastic material.
In some modified embodiments of the first aspect of the present application, the display panel includes at least a first adhesive layer;
The first adhesive layer comprises a lap joint part and a suspension part, the suspension part corresponds to the groove, two ends of the suspension part are respectively connected with one lap joint part, and the lap joint parts are respectively connected to sub-display areas on two sides of the groove.
In some modified embodiments of the first aspect of the present application, the aforementioned display panel, wherein the suspension portion is disposed parallel to the TFT substrate.
In some modified embodiments of the first aspect of the present application, the aforementioned display panel, wherein the suspension portion is disposed non-parallel to the TFT substrate.
In some modified embodiments of the first aspect of the present application, the display panel further includes an interlayer dielectric layer disposed between the TFT substrate and the pixel defining layer;
the overlap bridge further comprises a second adhesive layer;
the second adhesive layer is arranged between the TFT substrate and the first adhesive layer, and the second adhesive layer is correspondingly arranged with the lap joint part;
wherein the second adhesive layer and the interlayer dielectric layer are arranged on the same layer.
In some modified embodiments of the first aspect of the present application, the display panel includes a first groove extending along a first direction and a second groove extending along a second direction;
The extending direction of the lap joint bridge is perpendicular to the extending direction of the first groove/the second groove;
Wherein the first direction is perpendicular to the second direction.
A second aspect of the present application provides a display device including the above display panel.
A third aspect of the present application provides an electronic apparatus comprising the display device described above.
A fourth aspect of the present application provides a method for manufacturing a display panel, including the steps of:
preparing a TFT substrate, and forming a plurality of grooves on the TFT substrate;
Preparing the plurality of overlap bridges on the TFT substrate;
Sequentially preparing a pixel defining layer, an electroluminescent device layer and an encapsulation layer.
In some modified embodiments of the fourth aspect of the present application, the step of preparing the plurality of landing bridges on the TFT substrate includes:
Preparing a second adhesive layer on the TFT substrate, and forming a bearing part of the overlap bridge at the groove;
preparing a first adhesive layer on one side of the bearing part, which is away from the TFT substrate;
And removing the bearing part to form the lap joint bridge.
In some variations of the fourth aspect of the present application, wherein the first glue layer is a negative photoresist;
the second adhesive layer is a positive photoresist.
In some modified embodiments of the fourth aspect of the present application, the supporting portion is parallel/non-parallel to the TFT substrate.
Compared with the prior art, the display panel provided by the first aspect of the application has the advantages that the lap joint bridge is lapped on the groove of the TFT substrate, the two ends of the lap joint bridge are respectively connected with the sub-display areas at the two sides of the groove, the adjacent sub-pixels at the two sides of the groove are directly connected by crossing the wiring of the groove, the sub-pixels are arranged at the original bridge area, and the resolution of the display panel is improved; therefore, the problems that the original bridge area wiring of the existing stretchable display screen occupies more display panel space, the pixel arrangement space is small, the resolution of the display panel is low, and higher requirements cannot be met are effectively solved; the display panel provided by the application has the advantages that the wiring positions are increased at the grooves, the number of the wiring and the number of the sub-pixels are increased in the original bridge area, and the resolution of the display panel can be effectively improved.
Drawings
The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. In the drawings, wherein like or corresponding reference numerals indicate like or corresponding parts, there are shown by way of illustration, and not limitation, several embodiments of the application, in which:
Fig. 1 schematically illustrates a schematic view of a display panel according to an embodiment of the present application;
FIG. 2 is a schematic cross-sectional view of the region A of FIG. 1 taken along the line B-B;
Fig. 3 schematically illustrates a schematic structural diagram of a first portion in a manufacturing process of a display panel according to an embodiment of the present application;
fig. 4 schematically illustrates a structural diagram of a second portion in a manufacturing process of a display panel according to an embodiment of the present application;
fig. 5 schematically illustrates a structural diagram of a third portion in a manufacturing process of a display panel according to an embodiment of the present application;
Fig. 6 schematically illustrates a schematic structural diagram of a supporting portion in a manufacturing process of a display panel according to an embodiment of the present application;
Fig. 7 schematically illustrates an intermediate structure of a first adhesive layer prepared in a preparation process of a display panel according to an embodiment of the present application;
Fig. 8 schematically illustrates a schematic structural diagram of a first adhesive layer in a manufacturing process of a display panel according to an embodiment of the present application;
fig. 9 schematically illustrates another structural diagram of a supporting portion in a manufacturing process of a display panel according to an embodiment of the present application;
fig. 10 schematically illustrates another structural schematic diagram of a first adhesive layer in a manufacturing process of a display panel according to an embodiment of the present application;
Fig. 11 schematically illustrates a flowchart of a method for manufacturing a display panel according to an embodiment of the present application;
fig. 12 schematically illustrates a flow chart of a method for manufacturing a bridge in a method for manufacturing a display panel according to an embodiment of the present application;
Reference numerals illustrate: TFT substrate 1, sub-display region 11, substrate 12, first flexible substrate 13, buffer layer 14, second flexible substrate 15, TFT layer 16, pixel defining layer 2, electroluminescent device layer 3, sub-pixel 31, encapsulation layer 4, recess 5, first recess 51, second recess 52, bridge 6, first glue layer 61, bridge 611, suspension 612, second glue layer 62, support 622, interlayer dielectric layer 7, first direction a, second direction b.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
It is noted that unless otherwise indicated, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs.
The technical scheme of the embodiment of the application aims to solve the technical problems, and the overall thought is as follows:
Example 1
Referring to fig. 1 and 2, a display panel provided by an embodiment of the present application includes a TFT substrate 1, a pixel defining layer 2, an electroluminescent device layer 3, and an encapsulation layer 4, which are sequentially stacked, wherein:
A plurality of grooves 5 are formed in the TFT substrate 1 in a direction away from the pixel defining layer 2 on a side facing the pixel defining layer 2, the grooves 5 divide the TFT substrate 1 into a plurality of mutually spaced sub-display areas 11, and at least one sub-pixel 31 is accommodated in each sub-display area 11;
The display device further comprises a plurality of overlap bridges 6, wherein the overlap bridges 6 are overlapped on the grooves 5, and two ends of each overlap bridge 6 are respectively connected with the sub-display areas 31 at two sides of the grooves 5 and are used for providing wiring channels for adjacent sub-pixels 31 at two sides of the grooves 5.
Specifically, in order to solve the problem that the existing stretchable display screen occupies more display panel space, and causes small pixel arrangement space, so that the resolution of the display panel is low and cannot meet higher requirements, the display panel provided in this embodiment is formed by overlapping the overlap bridge 6 on the groove 5 of the TFT substrate 1, so that two ends of the overlap bridge 6 are respectively connected with the sub-display areas 31 on two sides of the groove 5, and then connecting lines of adjacent sub-pixels 31 separated by the groove 5 on two sides of the groove 5 can be arranged through the overlap bridge 6, so that the traditional bridge area routing is changed into directly crossing the groove 5 to perform routing, the number of routing is reduced in the original bridge area to increase the sub-pixels, and the resolution of the display panel can be effectively improved.
Referring to fig. 5, the TFT substrate 1 includes a substrate 12, a first flexible substrate 13, a buffer layer 14, a second flexible substrate 15, and a TFT layer 16, which are sequentially stacked, and the above structure is easily understood by those skilled in the art and will not be described in detail herein; referring to fig. 1, the TFT substrate 1 is divided into mutually spaced sub-display regions 11 by the plurality of grooves 5, that is, in this embodiment, a bridge region for routing in a conventional stretchable display panel is removed, so that all regions except for the areas where the grooves 5 are disposed on the display panel are the sub-display regions 11, thereby greatly increasing the number of the sub-pixels 31 under the condition that the size of the display panel is fixed, and improving the resolution of the display panel.
With reference to fig. 5, the grooves 5 extend from the TFT layer 16 to the buffer layer 14, and the grooves 5 are disposed so that the TFT substrate 1 and the display panel formed by the TFT substrate 1 can be stretched along the extending direction of the grooves 5 to form a stretchable display panel, that is, the grooves 5 correspond to the open areas in the conventional stretchable display panel, which is easily understood by those skilled in the art, and is not excessively limited herein.
With reference to fig. 1, the extending direction of the groove 5 may be parallel to the length/width direction of the TFT substrate 1, or may be obliquely disposed on the TFT substrate 1, which is to be understood as follows: the extending direction of the grooves 5 depends on the stretching direction of the TFT substrate 1 or the display panel, and this arrangement is easily understood and implemented by those skilled in the art, and will not be described herein in detail.
The bridge 6 plays a role of a bridge at the notch of the groove 5, and the bridge 6 connects the sub-display areas 11 at two sides of the groove 5, so that a wiring channel can be provided for the sub-pixels 31 in the sub-display areas 11 at two sides of the groove 5, which need to be electrically connected across the groove 5, so that wires can directly pass through the groove 5 without bypassing the groove 5 to occupy unnecessary display panel space; the bridge 6 may be straight or curved, as long as communication between the sub-display areas 11 on both sides of the groove 5 is enabled; and the bridge 6 is deformable, so that when the display panel is stretched by the groove 5, the bridge 5 can deform accordingly, thereby avoiding breakage of the bridge 6 and affecting display.
According to the above-mentioned list, in the display panel provided in the first aspect of the present application, by placing the bridge 6 on the groove 5 of the TFT substrate 1, and ensuring that two ends of the bridge 6 are respectively connected to the sub-display areas 11 on two sides of the groove 5, the adjacent sub-pixels 31 on two sides of the groove 5 are directly connected by wiring across the groove 5, and the sub-pixels 31 are arranged at the original bridge area positions, so that the resolution of the display panel is improved; the display panel provided by the application has the advantages that the wiring positions are increased at the groove 5, the number of the wiring increased sub-pixels 31 is reduced in the original bridge area, and the resolution of the display panel can be effectively improved.
The term "and/or" is herein merely an association relation describing an associated object, meaning that there may be three relations, e.g. a and/or B, specifically understood as: the composition may contain both a and B, and may contain a alone or B alone, and any of the above three cases may be provided.
Further, in an embodiment of the present application, the display panel, the bridge 6 is made of an elastic material.
Specifically, in order to ensure that the bridge 6 can deform along with the stretching of the display panel, in this embodiment, the bridge 6 is made of an elastic material, for example: metal, organic matter, combination of metal and organic matter, etc., wherein, when the bridge 6 is made of metal material, it may be in the form of a metal sheet/spring sheet; when the bridge 6 is made of organic material, the nature of the material itself has determined that it is deformable; when the bridge 6 is provided in the form of a combination of metal and organic material, reference is made appropriately to both of the above; the foregoing will be readily understood and implemented by those skilled in the art, and will not be described in detail herein.
Further, referring to fig. 8 and 10, in an embodiment of the present application, a display panel is provided, and in an implementation, the bridge 6 includes at least a first adhesive layer 61;
the first adhesive layer 61 includes a lap joint portion 611 and a suspension portion 612, the suspension portion 612 corresponds to the groove 5, two ends of the suspension portion 612 are respectively connected to the lap joint portion 611, and the lap joint portion 611 is respectively connected to the sub-display areas 11 at two sides of the groove 5.
Specifically, in order to ensure that the bridge 6 can provide routing channels for the sub-pixels 31 at two sides of the groove 5, in this embodiment, the bridge 6 is configured to include at least the first adhesive layer 61, where the first adhesive layer 61 is a negative photoresist (transparent colloid), in the manufacturing process, referring to fig. 7, it is required to coat a second adhesive layer 62 on a side of the TFT layer 16 facing away from the substrate 12, where the second adhesive layer 62 is a positive photoresist (transparent colloid), the supporting portion 622 is formed at a position corresponding to the groove 5, and then coat the first adhesive layer 61 on the second adhesive layer 62, and perform exposure and development with a large exposure, so that the first adhesive layer 61 of the negative photoresist is cured, the second adhesive layer 62 of the positive photoresist is dissolved, and thus, referring to fig. 8, where the first adhesive layer 61 remaining at a position corresponding to the groove 51 is the suspension portion 612, and the first adhesive layer 62 at two sides of the groove 5 is the overlapping portion 611; the suspension portion 612 may be concave toward the groove 5 as shown in fig. 8, or may be convex away from the groove 5 as shown in fig. 10, when the suspension portion 612 is concave, the coating thickness of the second adhesive layer 62 may be set smaller when the second adhesive layer 62 is coated, so that the second adhesive layer 62 is concave in the groove 5 as shown in fig. 6, and when the first adhesive layer 61 is coated, the suspension portion 612 is concave in the groove 5; correspondingly, when the suspension portion 612 is convex, the coating thickness of the second adhesive layer 62 may be set larger when the second adhesive layer 62 is coated, so as to ensure that the second adhesive layer 62 protrudes out of the groove 5 as shown in fig. 9, so that the suspension portion 612 is concave in the groove 5 when the first adhesive layer 61 is coated next; the application and exposure development of the first adhesive layer 61 and the second adhesive layer 62 are easily understood and implemented by those skilled in the art, and will not be repeated herein.
Further, referring to fig. 8 and 10, in a display panel according to an embodiment of the present application, in an implementation, the suspension portion 612 is disposed parallel to the TFT substrate 1, or the suspension portion 612 is disposed non-parallel to the TFT substrate 1.
Specifically, in order that the bridge 6 may deform when the display panel is stretched through the groove 5, so as to avoid the bridge from breaking and affecting the display, in this embodiment, on the premise that the bridge 6 is made of an elastic material, the suspension portion 612 may be disposed in a direction parallel to/non-parallel to the TFT substrate 1, when the suspension portion 612 is parallel to the TFT substrate 1, referring to fig. 8, the bridge 6 is horizontally overlapped on the groove 5, and the suspension portion 612 is horizontally disposed, and when the display panel is stretched through the groove 5, the suspension portion 612 may deform to a certain extent in a stretching direction, i.e., a left-right direction in the drawing, so as to match with the stretching, specifically, as shown in fig. 8 and 10, the extending direction of the groove 5 is a direction inside and outside the vertical picture, and the stretching direction is a left-right direction in the drawing; preferably, the suspension portion 612 is configured in a form non-parallel to the TFT substrate 1, i.e. concave as shown in fig. 8 or convex as shown in fig. 10, and may also be in a zigzag form, a wavy form, etc., so that the tensile deformation redundancy of the suspension portion 612 in all directions in the groove 5 is sufficiently large, thereby greatly improving the deformability of the suspension portion 612, and ensuring that the bridge 6 will not break along with the stretching of the display panel, and affecting the display.
Further, referring to fig. 2, in an embodiment of the present application, the display panel further includes an interlayer dielectric layer 7, where the interlayer dielectric layer 7 is disposed between the TFT substrate 1 and the pixel defining layer 2;
The bridge 6 further comprises a second glue layer 62;
The second adhesive layer 62 is disposed between the TFT substrate 1 and the first adhesive layer 61, and the second adhesive layer 62 is disposed corresponding to the overlap 611;
wherein the second adhesive layer 62 is arranged on the same layer as the interlayer dielectric layer 7.
Specifically, in order to simplify the preparation process on the premise that the suspension portion 612 of the overlap bridge 6 can be formed smoothly and the setting of the original functional layer of the display panel is not affected, in this embodiment, the second adhesive layer 62 and the interlayer dielectric layer 7 are set in the same layer and with the same material, so that not only the bearing portion 622 required for forming the suspension portion 612 can be formed, but also the setting of the second adhesive layer 62 can be planned to the preparation process of the interlayer dielectric layer 7, and on the premise that the preparation process steps are not increased, the setting of the second adhesive layer 62 or the bearing portion 622 is realized, and the setting of the suspension portion 612 of the overlap bridge 6 is padded; it will of course be appreciated that: if the second glue layer 62 is not arranged co-layer with the interlayer dielectric layer 7, the second glue layer 62 may not necessarily be present in the display panel structure of the family, for example: as shown in fig. 9, when the coating thickness of the second adhesive layer 62 is greater, so that the supporting portion 622 protrudes from the groove 5, when exposing and developing the position corresponding to the overlapping portion 611 on the second adhesive layer 62, the supporting portion 622 corresponding to the groove 5 may be remained, all the second adhesive layer 62 corresponding to the overlapping portion 611 is dissolved, and the second adhesive layer 62 is not included in the finally formed overlap bridge 6, which should be easily understood and implemented by those skilled in the art, and not described herein in detail.
Further, referring to fig. 1, in an embodiment of the present application, the recess 5 includes a first recess 51 extending along a first direction a and a second recess 52 extending along a second direction b;
the extending direction of the lap joint 6 is perpendicular to the extending direction of the first groove 51/the second groove 52;
Wherein the first direction a is perpendicular to the second direction b.
Specifically, in order to achieve the stretchability of the display panel, in this embodiment, the grooves 5 are configured to include grooves 5 extending in the first direction a and the second direction b, where the first direction a and the second direction b are the length direction and the width direction of the display panel (TFT substrate 1), respectively, and when the grooves 5 are configured along the length direction of the display panel (TFT substrate 1), the display panel (TFT substrate 1) may be stretched along the width direction thereof, and when the grooves 5 are configured along the width direction of the display panel (TFT substrate 1), the display panel (TFT substrate 1) may be stretched along the length direction thereof; it should be noted that: the grooves 5 are only more commonly arranged along the length or width direction of the display panel (TFT substrate 1), but may also be arranged along other oblique directions on the display panel (TFT substrate 1), and it is understood that: the extending direction of the grooves 5 depends on the stretching direction of the TFT substrate 1 or the display panel, and this arrangement is easily understood and implemented by those skilled in the art, and will not be described herein in detail.
Wherein, the extending direction of the bridge 6 is perpendicular to the extending direction of the groove 5, when the bridge 6 is disposed on the first groove 51, the extending direction of the groove 5 is perpendicular to the extending direction of the first groove 51, and when the bridge 6 is disposed on the second groove 52, the extending direction of the groove 5 is perpendicular to the extending direction of the second groove 52, so as to realize that the bridge 6 directly spans the groove 5 to connect the sub-display areas 11 on both sides of the groove 5; of course, the arrangement of the grooves 5 with other shapes can be deduced from the technical solution of the present application, and therefore, all the arrangements should belong to the protection scope of the present application, for example: when the recess 5 is circular, the bridge 6 may ride on the recess 5 in any radial direction of the recess 5.
Example 2
Further, an embodiment of the present application provides a display device, which includes the display panel.
The display panel is the display panel of embodiment 1, and the specific structure and the principle of improving resolution are described in detail in embodiment 1, and are not described in detail herein.
Example 3
Further, an embodiment of the application provides an electronic device, which comprises the display device.
The display device is the display device of embodiment 2, and the specific structure and the principle of improving resolution are described in detail in embodiments 1 and 2, and are not described in detail herein.
Example 4
Further, referring to fig. 11, an embodiment of the present application provides a method for manufacturing a display panel based on embodiment 1, which includes the following steps:
101. preparing a TFT substrate 1, and forming a plurality of grooves 5 on the TFT substrate 1;
specifically, referring to fig. 2, the TFT substrate 1 includes a substrate 12, a first flexible substrate 13, a buffer layer 14, a second flexible substrate 15, and a TFT layer 16 that are sequentially stacked, and then, in a specific preparation process, referring to fig. 3, fig. 4, and fig. 5, referring to fig. 3, a polyimide solution is coated on the substrate 12, and after drying under reduced pressure and baking, the first flexible substrate (PI) 13 is formed, and the first flexible substrate (PI) 13 is etched to form the groove 5; forming the buffer layer 14 on one side of the first flexible substrate (PI) 13 away from the substrate 12, and performing patterning treatment on the buffer layer 14 at a position corresponding to the groove 5, so as to retain the groove 5; next, referring to fig. 4, a polyimide solution is coated on a side of the buffer layer 14 facing away from the substrate 12, and after drying under reduced pressure and baking, the second flexible substrate (PI) 15 is formed, and etching is performed at a position corresponding to the groove 5, so as to retain the groove 5; then, referring to fig. 5, the TFT layer 16 is provided on the side of the second flexible substrate (PI) 15 facing away from the substrate 12, also ensuring that the position of the recess 5 is left; the TFT substrate 1 is disposed in a manner that can be easily understood and implemented by those skilled in the art, and thus will not be described herein in detail.
102. Preparing the plurality of overlap bridges 6 on the TFT substrate 1;
Specifically, as shown in fig. 2, 8 and 10, a plurality of the bridge 6 is disposed on the TFT substrate 1, that is, on a side of the TFT layer 16 facing away from the substrate 12, corresponding to the plurality of grooves 5, so that the bridge 6 spans the grooves 5 and is connected to the sub-display areas 11 on both sides of the grooves 5.
103. Sequentially preparing a pixel defining layer 2, an electroluminescent device layer 3 and a packaging layer 4;
Specifically, referring to fig. 2, in order to ensure the integrity of the display panel provided in this embodiment, the pixel defining layer 2, the electroluminescent device layer 3 and the packaging layer 4 are sequentially stacked upward on the side of the overlap bridge 6 away from the substrate 12, and the arrangement mode of the above structure is the same as that of the structure in the prior art, and the arrangement mode is well known to those skilled in the art and can be easily implemented, so that excessive details are not repeated in this embodiment.
Further, referring to fig. 12, the step 102 specifically includes the following steps:
201. preparing a second adhesive layer 62 on the TFT substrate 1, and forming a supporting portion 622 of the bridge 6 at the groove 5;
specifically, the second adhesive layer 62 is coated on the side of the TFT layer 16 facing away from the substrate 12, where the second adhesive layer 62 is a positive photoresist, so that the supporting portion 622 is formed; in order to ensure that the suspension portion 622 of the bridge 6 is concave, convex or other shapes, the shape of the supporting portion 622 needs to be designed in advance in this embodiment, and the shape of the supporting portion 622 may be concave downward as shown in fig. 6, convex upward as shown in fig. 9, or wavy, zigzag, etc. as mentioned above, and only the mask shape or mask position in the exposure process needs to be adjusted; in order to ensure that the suspension portion 612 has a sufficient deformation redundancy at the groove 5, in this embodiment, when the supporting portion 622 is provided, the supporting portion 622 is first ensured to have a sufficient deformation redundancy, and then the second adhesive layer 62 is properly exposed and developed to have a significant extension mode that is not parallel to the TFT substrate 1;
For example: referring to fig. 6, when the coating thickness of the second adhesive layer 62 is smaller, the groove 5 needs to be filled with the groove 5 because the layer thickness is uniform, so that the second adhesive layer 62 is recessed in the groove 5, and in order to increase the redundancy of the suspension portion 612, in this embodiment, the second adhesive layer 62 in the groove 5 is exposed and developed to obtain a supporting portion 622 with a greater recessed degree;
Also for example: referring to fig. 9, when the coating thickness of the second adhesive layer 62 is greater, the second adhesive layer 62 protrudes from the groove 5, in order to increase the redundancy of the suspension portion 612, in this embodiment, the second adhesive layer 62 outside the groove 5 is exposed and developed (in this process, if the second adhesive layer 62 and the interlayer dielectric layer 7 are disposed on the same layer, the second adhesive layer 62 outside the groove 5 may not be completely removed, but may be completely removed), so as to obtain a supporting portion 622 with a greater protruding degree.
202. Preparing a first adhesive layer 61 on one side of the supporting portion 622 away from the TFT substrate 1;
Specifically, the first adhesive layer 61 is coated on a side of the second adhesive layer 62 facing away from the substrate 12, where the first adhesive layer 61 is a negative photoresist, and the first adhesive layer 61 is cured and formed by exposure and development, which will be described in detail below with respect to two examples in the step 201:
Referring to fig. 7, the first adhesive layer 61 is coated on a side of the second adhesive layer 62 facing away from the substrate 12, the first adhesive layer 61 is a positive photoresist, and is exposed and developed to be cured on the second adhesive layer 62, so that a suspension portion 612 having a shape similar to that of the supporting portion 622, i.e., concave, is formed in the groove 5;
The first adhesive layer 61 is coated on a side of the second adhesive layer 62 facing away from the substrate 12, the first adhesive layer 61 is a positive photoresist, and is exposed and developed to be cured on the second adhesive layer 62, so that a suspension portion 612 having the same shape as the supporting portion 622, i.e., protruding upwards, is formed outside the groove 5.
203. Removing the bearing part 622 to form the lap bridge 6;
Specifically, after the first adhesive layer 61 is cured and formed on the second adhesive layer 62, the supporting portion 622 needs to be removed to form the final complete lap joint bridge 6, and the removal is performed by increasing the exposure to expose and develop the supporting portion 622 (the second adhesive layer 62) in the groove 5, and since the second adhesive layer 62 is a positive photoresist, it is dissolved, and the following will be described in detail with respect to two examples in the above step 201:
referring to fig. 7, the exposure to increase the exposure is performed again in the groove 5, so that the concave supporting portion 622 in the groove 5 is dissolved, and only the concave suspending portion 612 remains in the groove 5, so as to form the concave overlap bridge 6 shown in fig. 8;
Referring to fig. 9, the exposure to increase the exposure is performed again in the groove 5, so that the raised supporting portion 622 in the groove 5 is dissolved, and only the raised suspending portion 612 remains in the groove 5, so as to form the recessed lap bridge 6 shown in fig. 10.
The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (11)
1. The utility model provides a display panel, its includes TFT base plate, pixel defining layer, electroluminescent device layer and the encapsulation layer that stacks gradually set up, its characterized in that:
A plurality of grooves are formed in the TFT substrate in the direction of the side, facing the pixel defining layer, away from the pixel defining layer, the grooves divide the TFT substrate into a plurality of mutually-spaced sub-display areas, and at least one sub-pixel is accommodated in each sub-display area;
the display device further comprises a plurality of overlap bridges, wherein the overlap bridges are overlapped on the grooves, and two ends of each overlap bridge are respectively connected with the sub-display areas at two sides of each groove and used for providing wiring channels for adjacent sub-pixels at two sides of each groove;
the overlap bridge comprises a first adhesive layer and a second adhesive layer;
the first adhesive layer comprises a lap joint part and a suspension part, the suspension part corresponds to the groove, two ends of the suspension part are respectively connected with the lap joint part, and the lap joint part is respectively connected to sub-display areas at two sides of the groove;
the second adhesive layer is arranged between the TFT substrate and the first adhesive layer.
2. The display panel of claim 1, wherein:
the bridge is made of an elastic material.
3. The display panel of claim 1, wherein:
the suspension is disposed parallel to the TFT substrate.
4. The display panel of claim 1, wherein:
The suspension portion is disposed non-parallel to the TFT substrate.
5. The display panel of claim 1, wherein:
The pixel structure further comprises an interlayer dielectric layer, wherein the interlayer dielectric layer is arranged between the TFT substrate and the pixel defining layer;
The second adhesive layer is arranged corresponding to the lap joint part, and the second adhesive layer and the interlayer dielectric layer are arranged on the same layer.
6. The display panel of claim 1, wherein:
the grooves include a first groove extending in a first direction and a second groove extending in a second direction;
The extending direction of the lap joint bridge is perpendicular to the extending direction of the first groove/the second groove;
Wherein the first direction is perpendicular to the second direction.
7. A display device, comprising:
the display panel of any one of claims 1-6.
8. An electronic device, comprising:
The display device of claim 7.
9. A method for manufacturing a display panel according to any one of claims 1 to 6, characterized in that it comprises the steps of:
preparing a TFT substrate, and forming a plurality of grooves on the TFT substrate;
Preparing a second adhesive layer on the TFT substrate, and forming a bearing part of the overlap bridge at the groove;
preparing a first adhesive layer on one side of the bearing part, which is away from the TFT substrate;
Removing the bearing part to form the lap joint bridge;
Sequentially preparing a pixel defining layer, an electroluminescent device layer and an encapsulation layer.
10. The method of manufacturing a display panel according to claim 9, wherein:
The first adhesive layer is negative photoresist;
the second adhesive layer is a positive photoresist.
11. The method of manufacturing a display panel according to claim 9, wherein:
The supporting part is parallel/non-parallel to the TFT substrate.
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