CN111883463A - High-power chip routing packaging device - Google Patents
High-power chip routing packaging device Download PDFInfo
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- CN111883463A CN111883463A CN202010770292.2A CN202010770292A CN111883463A CN 111883463 A CN111883463 A CN 111883463A CN 202010770292 A CN202010770292 A CN 202010770292A CN 111883463 A CN111883463 A CN 111883463A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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Abstract
The invention discloses a high-power chip routing packaging device which comprises a packaging device body, wherein a cavity is formed in the top of the packaging device body, an air cooling structure is arranged in an inner cavity of the cavity, mounting cavities are formed in two sides of an inner cavity of the air cooling structure, connecting plates are fixedly connected to two sides of the air cooling structure, and an electric telescopic rod is fixedly connected to the bottom of the inner cavity of the mounting cavity. The high-power chip routing packaging device has the advantages that the power of up-and-down movement is generated by the electric telescopic rod, the air cooling structure is driven to stretch in the inner cavity of the cavity, the motor fixed in the air cooling structure is used for driving the fan blades to rotate, the air flow speed is increased, the heat generated during chip packaging is taken away by air flow, the heat dissipation effect is achieved, the high-power chip routing packaging device has the advantage of high cooling speed, the heat generated during chip packaging and processing can be dissipated quickly as required in the processing process, and the effect of cooling the surface of the chip is achieved.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a high-power chip routing packaging device.
Background
The package for mounting semiconductor integrated circuit chip is used for placing, fixing, sealing and protecting chip and enhancing electric heating property, and is also a bridge for communicating the internal world of chip with external circuit, the connection points on chip are connected with pins of package shell by means of conducting wire, these pins are connected with other devices by means of conducting wire on printed board, so that the package can play an important role for CPU and other LSI integrated circuits, the chip-on-board process is characterized by that firstly, the silicon chip placing points are covered with heat-conducting epoxy resin (generally using epoxy resin mixed with silver granules), then the silicon chip is directly placed on the substrate surface, heat treatment is implemented until the silicon chip is firmly fixed on the substrate, then the wire-bonding method is used to directly establish electric connection between the silicon chip and substrate, the bare chip technology mainly has two forms: one is COB technology, the other is flip-chip technology, chip-on-board packaging, semiconductor chips are cross-bonded on a printed wiring board, electrical connection of the chip and the substrate is achieved by a wire-stitch method, and is covered with resin to ensure reliability.
The existing chip routing packaging method is a routing method in a chip packaging process, and the application number is CN200810035894.2, and the method is used for connecting a bonding wire between a routing bonding pad of a chip and a pin of a bearing element bearing the chip, and comprises the following steps: (1) the solder is dotted on a bearing unit of the chip bearing piece; (2) placing a chip on the bearing unit with the solder; (3) rotating and pressure welding the chip to enable a routing welding pad on the chip to incline relative to the pins of the bearing piece; (4) and routing on the wire bonding welding pad of the rotated chip and the pin of the bearing piece. Starting from the characteristics of the existing machine, the conventional die bonding mode is broken, the chip is rotationally pressed and welded on the bearing unit, the wire bonding area of a wire bonding welding pad is relatively increased or the distance between the wire bonding welding pad and a bearing part pin is prolonged during wire bonding, the normal welding of a welding wire is facilitated, and the occurrence rate of open/short circuit test waste products and wrong welding waste products is reduced.
Also disclosed is a chip process for integrated wire bonding and flip chip packaging, application No. CN200410011861.6, which comprises the following steps: firstly, providing a chip, wherein the chip is provided with a protective layer and a plurality of chip welding pads exposed out of the protective layer; then, forming an under bump metallurgy layer composed of Al/Ni-V/Cu metal on each of the chip pads; then, removing the copper layer and the nickel-vanadium layer in the under ball metal layer on part of the chip bonding pad, so that the under ball metal layer on part of the chip bonding pad is only composed of an aluminum layer; then, defining a plurality of openings by using the photoresist to expose the under bump metallurgy layer containing Al/Ni-V/Cu metal, and filling solder into the openings; finally, a reflow step is performed to form a plurality of solder balls on the under bump metallurgy layer containing Al/Ni-V/Cu metal. In addition, the integrated routing and flip-chip packaging chip structure manufactured by the integrated routing and flip-chip packaging chip manufacturing process is further provided.
The high-power chip routing packaging device is one of devices for chip packaging, and the existing high-power chip routing packaging device has the defect of low cooling speed in the using process, so that the processing speed of the existing high-power chip routing packaging device in the processing process is low, the production efficiency of enterprises is reduced, the normal production of the enterprises is not convenient, and the practicability of the high-power chip routing packaging device is reduced.
Disclosure of Invention
The invention aims to provide a high-power chip routing packaging device which has the advantage of high cooling speed and solves the problems that the existing high-power chip routing packaging device has the defect of low cooling speed in the using process, so that the processing speed of the existing high-power chip routing packaging device is low in the processing process, the production efficiency of enterprises is reduced, and the normal production of the enterprises is inconvenient.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a high-power chip routing packaging hardware, includes the packaging hardware body, the cavity has been seted up at the top of packaging hardware body, the inner chamber of cavity is provided with the forced air cooling structure, the installation cavity has all been seted up to the both sides of forced air cooling structure inner chamber, the equal fixedly connected with connecting plate in both sides of forced air cooling structure, the bottom fixedly connected with electric telescopic handle of installation cavity inner chamber, electric telescopic handle's output and connecting plate fixed connection, the both sides of cavity inner chamber bottom all run through and are provided with damper.
Preferably, the air cooling structure includes the mounting bracket that is located the cavity inner chamber, the mounting hole has been seted up on the positive surface of mounting bracket, the inner chamber fixedly connected with mount of mounting hole, the inner chamber fixedly connected with motor of mount, the output shaft fixedly connected with flabellum of motor.
Preferably, damper includes the round hole of seting up in cavity inner chamber bottom both sides, the inner chamber swing joint of round hole has the fly leaf, the bottom fixedly connected with spring of fly leaf, the bottom and the packaging hardware body fixed connection of spring, the top fixedly connected with snubber block of fly leaf, the inner chamber to the cavity is run through at the top of snubber block.
Preferably, the limiting grooves are formed in two sides of the inner cavity of the circular hole, the inner cavity of each limiting groove is movably connected with a limiting block, and one side, far away from the limiting grooves, of each limiting block is fixedly connected with the movable plate.
Preferably, the top of the damper block is shaped like a hemisphere, and the surface of the damper block is smooth.
Preferably, the mounting hole is circular, and the diameter of the mounting hole is not less than ten centimeters.
Preferably, the height of the mounting frame is not less than twenty centimeters, and the thickness of the mounting frame is not less than five centimeters.
Preferably, four corners of the bottom of the packaging device body are fixedly connected with non-slip pads, and the bottom of each non-slip pad is provided with non-slip lines.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention utilizes the electric telescopic rod to generate the power of up-and-down movement to drive the air cooling structure to realize the extension and contraction in the inner cavity of the cavity, utilizes the motor fixed in the air cooling structure to drive the fan blade to rotate, realizes the function of accelerating the air flow rate, utilizes the air flow to take away the heat generated during the chip packaging, and achieves the function of heat dissipation, the high-power chip routing packaging device has the advantage of high cooling speed, can quickly dissipate the heat generated during the chip packaging and processing according to the needs in the processing process, realizes the function of cooling the surface of the chip, improves the processing speed of the high-power chip routing packaging device in the processing process, improves the production efficiency of enterprises, is beneficial to the normal production of the enterprises, improves the practicability of the high-power chip routing packaging device, and solves the defect that the existing high-power chip routing packaging device has slow cooling speed in the use process, the processing speed of the conventional high-power chip routing packaging device is low in the processing process, the production efficiency of enterprises is reduced, and the enterprise is inconvenient for normal production.
2. The packaging device has the advantages that the mounting frame, the mounting hole, the fixing frame, the motor and the fan blades are matched for use, the working principle that the fan blades are driven to rotate by the motor is utilized, the air flow speed is accelerated, the damping effect is realized by the matching use of the round hole, the movable plate, the spring and the damping block, the direct collision of the air cooling structure and the packaging device body is avoided, the movable plate is limited by the matching use of the limiting groove and the limiting block, the moving stability of the movable plate is improved, the contact area between the air cooling structure and the air cooling structure is reduced by the hemispherical shape design of the top of the damping block, the service life of the damping block is greatly prolonged, and the stability of the packaging device body is improved by the arrangement of the anti-slip pads at the four corners of the bottom of the packaging device body.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a perspective view of the air-cooled structure of the present invention;
FIG. 3 is a front sectional view of a partial structure of the present invention;
fig. 4 is a partial enlarged view of a in fig. 3 according to the present invention.
In the figure: 1. a packaging device body; 2. a cavity; 3. an air-cooled structure; 31. a mounting frame; 32. mounting holes; 33. a fixed mount; 34. a motor; 35. a fan blade; 4. a mounting cavity; 5. a connecting plate; 6. an electric telescopic rod; 7. a damping mechanism; 71. a circular hole; 72. a movable plate; 73. a spring; 74. a damper block; 75. a limiting groove; 76. and a limiting block.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution:
example 1: a high-power chip routing packaging device comprises a packaging device body 1, four corners of the bottom of the packaging device body 1 are fixedly connected with non-slip mats, the bottom of each non-slip mat is provided with anti-slip patterns, the stability of the packaging device body 1 is improved through the arrangement of the non-slip mats at the four corners of the bottom of the packaging device body 1, the top of the packaging device body 1 is provided with a cavity 2, an inner cavity of the cavity 2 is provided with an air cooling structure 3, the air cooling structure 3 comprises a mounting frame 31 positioned in the inner cavity of the cavity 2, a mounting hole 32 is formed in the front surface of the mounting frame 31, a fixing frame 33 is fixedly connected with the inner cavity of the mounting hole 32, a motor 34 is fixedly connected with the inner cavity of the fixing frame 33, an output shaft of the motor 34 is fixedly connected with a fan blade 35, the mounting frame 31, the mounting hole 32, the fixing, the air flow speed is accelerated, the mounting hole 32 is circular, the diameter of the mounting hole 32 is not less than ten centimeters, the height of the mounting frame 31 is not less than twenty centimeters, the thickness of the mounting frame 31 is not less than five centimeters, the mounting cavities 4 are formed in two sides of the inner cavity of the air cooling structure 3, the connecting plates 5 are fixedly connected to two sides of the air cooling structure 3, the electric telescopic rod 6 is fixedly connected to the bottom of the inner cavity of the mounting cavity 4, the output end of the electric telescopic rod 6 is fixedly connected with the connecting plates 5, the damping mechanisms 7 are arranged on two sides of the bottom of the inner cavity of the cavity 2 in a penetrating manner, each damping mechanism 7 comprises a round hole 71 formed in each of the two sides of the bottom of the inner cavity of the cavity 2, the inner cavity of each round hole 71 is movably connected with a movable plate 72, the bottom of each movable plate 72 is, the top of snubber block 74 runs through to the inner chamber of cavity 2, spacing groove 75 has all been seted up to the both sides of round hole 71 inner chamber, the inner chamber swing joint of spacing groove 75 has stopper 76, one side and fly leaf 72 fixed connection that spacing groove 75 was kept away from to stopper 76, the shape at snubber block 74 top is the hemisphere, the surface of snubber block 74 is smooth, through the hemispherical appearance design in snubber block 74 top, the effect that has played and reduced and forced air cooling structure 3 between area of contact, very big extension the life of snubber block 74.
Example 2: a high-power chip routing packaging device comprises a packaging device body 1, four corners of the bottom of the packaging device body 1 are fixedly connected with anti-slip pads, anti-slip patterns are arranged at the bottom of the anti-slip pads, a cavity 2 is formed in the top of the packaging device body 1, an air cooling structure 3 is arranged in the cavity of the cavity 2, the air cooling structure 3 comprises a mounting frame 31 positioned in the cavity of the cavity 2, a mounting hole 32 is formed in the front surface of the mounting frame 31, a fixing frame 33 is fixedly connected to the inner cavity of the mounting hole 32, a motor 34 is fixedly connected to the inner cavity of the fixing frame 33, a fan blade 35 is fixedly connected to an output shaft of the motor 34, the mounting frame 31, the mounting hole 32, the fixing frame 33, the motor 34 and the fan blade 35 are matched for use, the working principle that the motor 34 is used for driving the fan blade 35 to rotate is achieved, the effect of, the height of the mounting frame 31 is not less than twenty centimeters, the thickness of the mounting frame 31 is not less than five centimeters, mounting cavities 4 are respectively formed in two sides of an inner cavity of the air cooling structure 3, connecting plates 5 are respectively and fixedly connected to two sides of the air cooling structure 3, an electric telescopic rod 6 is fixedly connected to the bottom of the inner cavity of the mounting cavity 4, the output end of the electric telescopic rod 6 is fixedly connected with the connecting plates 5, damping mechanisms 7 are respectively arranged on two sides of the bottom of the inner cavity of the cavity 2 in a penetrating manner, each damping mechanism 7 comprises a round hole 71 formed in two sides of the bottom of the inner cavity of the cavity 2, a movable plate 72 is movably connected to the inner cavity of each round hole 71, a spring 73 is fixedly connected to the bottom of each movable plate 72, the bottom of each spring 73 is fixedly connected with the packaging device body 1, a damping block 74 is fixedly connected to the top, the effect of absorbing shock has been played, it directly collides with packaging hardware body 1 to have avoided air-cooled structure 3, spacing groove 75 has all been seted up to the both sides of round hole 71 inner chamber, the inner chamber swing joint of spacing groove 75 has stopper 76, one side and fly leaf 72 fixed connection that stopper 76 kept away from spacing groove 75, use through the cooperation of spacing groove 75 and stopper 76, played and carried out spacing effect to fly leaf 72, the stability that fly leaf 72 reciprocated has been improved, the shape at snubber block 74 top is the hemisphere, the surface of snubber block 74 is smooth.
Example 3: a high-power chip routing packaging device comprises a packaging device body 1, four corners of the bottom of the packaging device body 1 are fixedly connected with non-slip mats, the bottom of each non-slip mat is provided with anti-slip patterns, the stability of the packaging device body 1 is improved through the arrangement of the non-slip mats at the four corners of the bottom of the packaging device body 1, the top of the packaging device body 1 is provided with a cavity 2, an inner cavity of the cavity 2 is provided with an air cooling structure 3, the air cooling structure 3 comprises a mounting frame 31 positioned in the inner cavity of the cavity 2, a mounting hole 32 is formed in the front surface of the mounting frame 31, a fixing frame 33 is fixedly connected with the inner cavity of the mounting hole 32, a motor 34 is fixedly connected with the inner cavity of the fixing frame 33, an output shaft of the motor 34 is fixedly connected with a fan blade 35, the mounting frame 31, the mounting hole 32, the fixing, the air flow speed is accelerated, the mounting hole 32 is circular, the diameter of the mounting hole 32 is not less than ten centimeters, the height of the mounting frame 31 is not less than twenty centimeters, the thickness of the mounting frame 31 is not less than five centimeters, the mounting cavities 4 are formed in two sides of the inner cavity of the air cooling structure 3, the connecting plates 5 are fixedly connected to two sides of the air cooling structure 3, the electric telescopic rod 6 is fixedly connected to the bottom of the inner cavity of the mounting cavity 4, the output end of the electric telescopic rod 6 is fixedly connected with the connecting plates 5, the damping mechanisms 7 are arranged on two sides of the bottom of the inner cavity of the cavity 2 in a penetrating manner, each damping mechanism 7 comprises a round hole 71 formed in each of the two sides of the bottom of the inner cavity of the cavity 2, the inner cavity of each round hole 71 is movably connected with a movable plate 72, the bottom of each movable plate 72 is, the top of the damping block 74 penetrates into the inner cavity of the cavity 2, and the circular hole 71, the movable plate 72, the spring 73 and the damping block 74 are used in cooperation, so that a damping effect is achieved, the air cooling structure 3 is prevented from directly colliding with the packaging device body 1, the two sides of the inner cavity of the circular hole 71 are both provided with limiting grooves 75, the inner cavity of each limiting groove 75 is movably connected with a limiting block 76, one side of each limiting block 76, which is far away from the corresponding limiting groove 75, is fixedly connected with the movable plate 72, the limit groove 75 and the limit block 76 are matched to limit the movable plate 72, so that the up-and-down movement stability of the movable plate 72 is improved, the top of the shock absorption block 74 is hemispherical, the surface of the shock absorption block 74 is smooth, through the hemispherical appearance design in snubber block 74 top, played reduce with the effect of forced air cooling structure 3 between area of contact, very big extension snubber block 74's life.
Example 4: the utility model provides a high-power chip routing packaging hardware, including packaging hardware body 1, cavity 2 has been seted up at packaging hardware body 1's top, cavity 2's inner chamber is provided with forced air cooling structure 3, installation cavity 4 has all been seted up to the both sides of 3 inner chambers of forced air cooling structure, the equal fixedly connected with connecting plate 5 in both sides of forced air cooling structure 3, the bottom fixedly connected with electric telescopic handle 6 in installation cavity 4 inner chamber, electric telescopic handle 6's output and 5 fixed connection of connecting plate, the both sides of 2 inner chamber bottoms of cavity all run through and are provided with damper 7.
In the invention: air-cooled structure 3 includes the mounting bracket 31 that is located the 2 inner chambers of cavity, mounting hole 32 has been seted up on the positive surface of mounting bracket 31, the inner chamber fixedly connected with mount 33 of mounting hole 32, the inner chamber fixedly connected with motor 34 of mount 33, the output shaft fixedly connected with flabellum 35 of motor 34, the shape of mounting hole 32 is circular, the diameter of mounting hole 32 is not less than ten centimetres, mounting bracket 31 highly is not less than twenty centimetres, mounting bracket 31's thickness is not less than five centimetres, through mounting bracket 31, mounting hole 32, mount 33, the cooperation of motor 34 and flabellum 35 is used, the rotatory theory of operation of utilizing motor 34 to drive flabellum 35 has been played, the effect of accelerating air flow rate has been.
In the invention: the damping mechanism 7 comprises round holes 71 arranged at two sides of the bottom of the inner cavity of the cavity 2, the inner cavity of the round hole 71 is movably connected with a movable plate 72, the bottom of the movable plate 72 is fixedly connected with a spring 73, the bottom of the spring 73 is fixedly connected with the packaging device body 1, the top of the movable plate 72 is fixedly connected with a damping block 74, the top of the damping block 74 penetrates through the inner cavity of the cavity 2, two sides of the inner cavity of the round hole 71 are respectively provided with a limiting groove 75, the inner cavity of the limiting groove 75 is movably connected with a limiting block 76, one side of the limiting block 76 far away from the limiting groove 75 is fixedly connected with the movable plate 72, the top of the damping block 74 is hemispherical, the surface of the damping block 74 is smooth, the damping effect is achieved through the matching use of the round hole 71, the movable plate 72, the spring 73 and the damping block 74, the direct collision, the effect of limiting the movable plate 72 is achieved, the stability of the movable plate 72 in moving up and down is improved, the effect of reducing the contact area between the damping block 74 and the air cooling structure 3 is achieved through the hemispherical appearance design of the top of the damping block 74, and the service life of the damping block 74 is greatly prolonged.
In the invention: the equal fixedly connected with slipmat in four corners of packaging hardware body 1 bottom, the bottom of slipmat is provided with anti-skidding line, through the setting of the slipmat in four corners of packaging hardware body 1 bottom, has improved packaging hardware body 1's stability.
The working principle is as follows: when the invention is used, a user drives the mounting frame 31 to stretch in the inner cavity of the cavity 2 by utilizing the power generated by the electric telescopic rod 6 to move up and down, the motor 34 is started, the output shaft of the motor 34 drives the fan blade 35 to rotate, the fan blade 35 realizes the function of accelerating the air flow rate, the heat generated during chip packaging is taken away by utilizing the air flow, namely, the heat dissipation function is achieved, the air cooling structure 3 can be accommodated by the electric telescopic rod 6 when in use, the high-power chip routing packaging device is convenient for the user to use, has the advantage of high cooling speed, can quickly dissipate the heat generated during chip packaging and processing according to the requirement in the processing process, realizes the function of cooling the surface of a chip, improves the processing speed of the high-power chip routing packaging device in the processing process, improves the production efficiency of enterprises, and is beneficial to the normal production of the enterprises, the practicability of the high-power chip routing packaging device is improved.
In summary, the following steps: the high-power chip routing packaging device has the advantages that the high-power chip routing packaging device has the advantage of high cooling speed, the heat generated during chip packaging and processing can be quickly dissipated according to needs in the processing process, the effect of cooling the surface of a chip is realized, the processing speed of the high-power chip routing packaging device in the processing process is improved, the production efficiency of an enterprise is improved, the normal production of the enterprise is facilitated, the practicability of the high-power chip routing packaging device is improved, and the defect that the cooling speed is low in the use process of the existing high-power chip routing packaging device is overcome, the processing speed of the existing high-power chip routing packaging device is low in the processing process, the production efficiency of an enterprise is reduced, and the enterprise is inconvenient for normal production, the working principle that the fan blade 35 is driven by the motor 34 to rotate is achieved through the matching use of the mounting frame 31, the mounting hole 32, the fixing frame 33, the motor 34 and the fan blade 35, the effect of accelerating the air flow rate is achieved, the damping effect is achieved through the matching use of the round hole 71, the movable plate 72, the spring 73 and the damping block 74, the direct collision between the air cooling structure 3 and the packaging device body 1 is avoided, the limiting effect on the movable plate 72 is achieved through the matching use of the limiting groove 75 and the limiting block 76, the up-and-down movement stability of the movable plate 72 is improved, the effect of reducing the contact area between the air cooling structure 3 is achieved through the hemispherical shape design on the top of the damping block 74, the service life of snubber block 74 has greatly been prolonged, through the setting of the four corners slipmat in packaging hardware body 1 bottom, has improved packaging hardware body 1's stability.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The electrical components presented in the document are all electrically connected with an external master controller and 220V mains, and the master controller can be a conventional known device controlled by a computer or the like.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a high-power chip routing packaging hardware, includes packaging hardware body (1), its characterized in that: cavity (2) have been seted up at the top of packaging hardware body (1), the inner chamber of cavity (2) is provided with forced air cooling structure (3), installation cavity (4) have all been seted up to the both sides of forced air cooling structure (3) inner chamber, the equal fixedly connected with connecting plate (5) in both sides of forced air cooling structure (3), the bottom fixedly connected with electric telescopic handle (6) of installation cavity (4) inner chamber, the output and connecting plate (5) fixed connection of electric telescopic handle (6), the both sides of cavity (2) inner chamber bottom all run through and are provided with damper (7).
2. The high-power chip wire bonding packaging device according to claim 1, wherein: air-cooled structure (3) include mounting bracket (31) that are located cavity (2) inner chamber, mounting hole (32) have been seted up on the positive surface of mounting bracket (31), the inner chamber fixedly connected with mount (33) of mounting hole (32), the inner chamber fixedly connected with motor (34) of mount (33), the output shaft fixedly connected with flabellum (35) of motor (34).
3. The high-power chip wire bonding packaging device according to claim 1, wherein: damper (7) include round hole (71) of seting up in cavity (2) inner chamber bottom both sides, the inner chamber swing joint of round hole (71) has fly leaf (72), the bottom fixedly connected with spring (73) of fly leaf (72), the bottom and packaging hardware body (1) fixed connection of spring (73), the top fixedly connected with snubber block (74) of fly leaf (72), the inner chamber to cavity (2) is run through at the top of snubber block (74).
4. The high-power chip wire bonding packaging device according to claim 3, wherein: spacing groove (75) have all been seted up to the both sides of round hole (71) inner chamber, the inner chamber swing joint of spacing groove (75) has stopper (76), one side and fly leaf (72) fixed connection that spacing groove (75) were kept away from in stopper (76).
5. The high-power chip wire bonding packaging device according to claim 1, wherein: the top of the shock absorption block (74) is in a hemispherical shape, and the surface of the shock absorption block (74) is smooth.
6. The wire bonding packaging device for the high-power chip according to claim 2, wherein: the mounting hole (32) is circular, and the diameter of the mounting hole (32) is not less than ten centimeters.
7. The wire bonding packaging device for the high-power chip according to claim 2, wherein: the height of the mounting frame (31) is not less than twenty centimeters, and the thickness of the mounting frame (31) is not less than five centimeters.
8. The high-power chip wire bonding packaging device according to claim 1, wherein: four corners of the bottom of the packaging device body (1) are fixedly connected with non-slip pads, and the bottom of each non-slip pad is provided with non-slip lines.
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| CN202010770292.2A CN111883463B (en) | 2020-08-04 | 2020-08-04 | High-power chip routing packaging device |
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| CN202010770292.2A CN111883463B (en) | 2020-08-04 | 2020-08-04 | High-power chip routing packaging device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112992706A (en) * | 2021-01-25 | 2021-06-18 | 上海磬采电力科技开发有限公司 | Chip pin wire bonding needle device |
| CN113707578A (en) * | 2021-08-30 | 2021-11-26 | 重庆电子工程职业学院 | Packaging device convenient for packaging integrated circuit chip and use method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112992706A (en) * | 2021-01-25 | 2021-06-18 | 上海磬采电力科技开发有限公司 | Chip pin wire bonding needle device |
| CN112992706B (en) * | 2021-01-25 | 2022-12-09 | 芯峰光电技术(深圳)有限公司 | Chip pin wire bonding needle device |
| CN113707578A (en) * | 2021-08-30 | 2021-11-26 | 重庆电子工程职业学院 | Packaging device convenient for packaging integrated circuit chip and use method thereof |
| CN113707578B (en) * | 2021-08-30 | 2023-07-04 | 重庆电子工程职业学院 | Packaging device convenient for packaging integrated circuit chip and application method thereof |
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| CN111883463B (en) | 2021-03-16 |
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