CN111863685A - 一种cob固晶机 - Google Patents

一种cob固晶机 Download PDF

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Publication number
CN111863685A
CN111863685A CN202010758763.8A CN202010758763A CN111863685A CN 111863685 A CN111863685 A CN 111863685A CN 202010758763 A CN202010758763 A CN 202010758763A CN 111863685 A CN111863685 A CN 111863685A
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wafer
wafer disc
die bonding
disc
die
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曾逸
刘耀金
谢启全
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Shenzhen Taluer Technology Co ltd
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Shenzhen Taluer Technology Co ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67121Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67144Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages

Abstract

本发明提供了一种COB固晶机,包括支座、固晶台、晶圆盘传送机构和摆臂,所述固晶台、晶圆盘传送机构分别设置在所述支座上,所述晶圆盘传送机构有两个并分别位于所述固晶台的两侧,所述摆臂有两个并分别位于所述固晶台、晶圆盘传送机构之间,所述摆臂具有Z轴电机可上下调整位置,所述摆臂的一端为转动端,另一端为晶圆抓取及固定端,每个所述摆臂的所述转动端均对应连接一个摆臂驱动电机,所述摆臂驱动电机驱动所述摆臂的晶圆抓取端在所述晶圆盘传送机构、固晶台之间进行往复运动。本发明的有益效果是:采用两个摆臂配合两个晶圆盘传送机构共同对一个固晶台进行固晶,以提高固晶生产节拍,提高固晶效率。

Description

一种COB固晶机
技术领域
本发明涉及固晶机,尤其涉及一种COB固晶机。
背景技术
COB技术是一门新兴的LED封装技术,和传统的SMD正封装技术不同,它是倒装技术,直接将发光芯片焊接到PCB。随着LED晶圆尺寸变小,同样PCB面积的灯珠数更多,在刷完锡膏后需要尽快固晶完毕,但现有的固晶装置要么固晶效率较低,要么是双摆臂对应双固晶台,都难以满足上述单板的工艺要求。
发明内容
为了解决现有技术中的问题,本发明提供了一种固晶效率较高的COB固晶机。
本发明提供了一种COB固晶机,包括支座、固晶台、晶圆盘传送机构和摆臂,所述固晶台、晶圆盘传送机构分别设置在所述支座上,所述晶圆盘传送机构有两个并分别位于所述固晶台的两侧,所述摆臂有两个并分别位于所述固晶台、晶圆盘传送机构之间,所述摆臂的一端为转动端,另一端为晶圆抓取及固定端,每个所述摆臂的所述转动端均对应连接一个摆臂驱动电机,所述摆臂驱动电机驱动所述摆臂的晶圆抓取端在所述晶圆盘传送机构、固晶台之间进行往复运动。
作为本发明的进一步改进,所述晶圆盘传送机构包括晶圆盘XY传送机构、晶圆盘传送台和晶圆盘,所述晶圆盘XY传送机构与所述晶圆盘传送台连接,所述晶圆盘设置在所述晶圆盘传送台上,通过所述晶圆盘XY传送机构调节所述晶圆盘的位置。
作为本发明的进一步改进,所述晶圆盘传送台上设有至少两个所述晶圆盘。
作为本发明的进一步改进,所述晶圆盘连接有驱动其旋转的圆盘旋转驱动电机,以方便调整晶圆方向。
作为本发明的进一步改进,所述支座上设有三个高速相机,其中一个高速相机位于固晶台的上方,另外两个高速相机分别位于所述固晶台的两侧的两个晶圆盘传送机构的晶圆盘的上方。
作为本发明的进一步改进,所述支座上设有固晶台XY传送机构,所述固晶台XY传送机构与所述固晶台连接,通过所述固晶台XY传送机构调节所述固晶台的位置。
作为本发明的进一步改进,所述摆臂驱动电机连接有Z轴电机,可上下调整位置。
本发明的有益效果是:通过上述方案,采用两个摆臂配合两个晶圆盘传送机构同时对同一个固晶台进行固晶,以提高固晶生产节拍,提高固晶效率。
附图说明
图1是本发明一种COB固晶机的示意图。
具体实施方式
下面结合附图说明及具体实施方式对本发明作进一步说明。
如图1所示,一种COB固晶机,包括底座1、固晶台3、晶圆盘传送机构2和摆臂4,所述固晶台3、晶圆盘传送机构2分别设置在所述支座1上,所述晶圆盘传送机构2有两个并分别位于所述固晶台3的两侧,所述摆臂4有两个并分别位于所述固晶台3、晶圆盘传送机构2之间,所述摆臂4的一端为转动端,另一端为晶圆抓取端,每个所述摆臂4的所述转动端均对应连接一个摆臂驱动电机及Z轴电机,所述摆臂驱动电机驱动所述摆臂4的晶圆抓取端在所述晶圆盘传送机构2、固晶台3之间进行往复运动
如图1所示,所述晶圆盘传送机构2包括晶圆盘XY传送机构21、晶圆盘传送台22和晶圆盘23,所述晶圆盘XY传送机构21与所述晶圆盘传送台22连接,所述晶圆盘23设置在所述晶圆盘传送台22上,通过所述晶圆盘XY传送机构21调节所述晶圆盘23的位置,晶圆盘XY传送机构21优选为XY精密直线电机。
如图1所示,所述晶圆盘传送台22上设有多个所述晶圆盘23。
如图1所示,所述晶圆盘23连接有驱动其旋转的圆盘旋转驱动电机,以方便调整晶圆方向。
如图1所示,所述支座上设有高速相机51、高速相机52、高速相机53,高速相机52位于固晶台3的上方高速相机51、高速相机53分别位于所述固晶台3的两侧的两个晶圆盘传送机构2的晶圆23盘的上方,3个高速相机用于视觉判断,分别用于识别晶圆和焊盘、判断固晶结果(漏晶、按裂、漏固、碎晶)。
如图1所示,所述支座1上设有固晶台XY传送机构31,所述固晶台XY传送机构31与所述固晶台3连接,通过所述固晶台XY传送机构31调节所述固晶台3的位置,固晶台XY传送机构31优选为XY精密直线电机。
如图1所示,所述摆臂驱动电机连接有Z轴电机,以调节摆臂4的高度。
本发明提供的一种COB固晶机,可以通过两个固晶头将多个晶圆盘23中晶圆按某一种混打方法对一块基板(PCB)进行固晶;多个晶园盘23分布在固晶台3的两边,对称分布,如两边各两个,三个,四个等;单边多个晶圆盘用同一个精密直线电机驱动,可以快速的进行晶圆盘选择;双固晶头,双机器视觉,同时对一个固晶台3进行作业,是普通固晶机的2倍效率;晶圆盘双边布局,支持混打。
以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明,不能认定本发明的具体实施只局限于这些说明。对于本发明所属技术领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干简单推演或替换,都应当视为属于本发明的保护范围。

Claims (7)

1.一种COB固晶机,其特征在于:包括支座、固晶台、晶圆盘传送机构和摆臂,所述固晶台、晶圆盘传送机构分别设置在所述支座上,所述晶圆盘传送机构有两个并分别位于所述固晶台的两侧,所述摆臂有两个并分别位于所述固晶台、晶圆盘传送机构之间,所述摆臂的一端为转动端,另一端为晶圆抓取及固定端,每个所述摆臂的所述转动端均对应连接一个摆臂驱动电机,所述摆臂驱动电机驱动所述摆臂的晶圆抓取端在所述晶圆盘传送机构、固晶台之间进行往复运动。
2.根据权利要求1所述的COB固晶机,其特征在于:所述晶圆盘传送机构包括晶圆盘XY传送机构、晶圆盘传送台和晶圆盘,所述晶圆盘XY传送机构与所述晶圆盘传送台连接,所述晶圆盘设置在所述晶圆盘传送台上,通过所述晶圆盘XY传送机构调节所述晶圆盘的位置。
3.根据权利要求2所述的COB固晶机,其特征在于:所述晶圆盘传送台上设有至少两个所述晶圆盘。
4.根据权利要求2所述的COB固晶机,其特征在于:所述晶圆盘连接有驱动其旋转的晶圆盘旋转驱动电机。
5.根据权利要求1所述的COB固晶机,其特征在于:所述支座上设有三个高速相机,其中一个高速相机位于固晶台的上方,另外两个高速相机分别位于所述固晶台的两侧的两个晶圆盘传送机构的晶圆盘的上方。
6.根据权利要求1所述的COB固晶机,其特征在于:所述支座上设有固晶台XY传送机构,所述固晶台XY传送机构与所述固晶台连接,通过所述固晶台XY传送机构调节所述固晶台的位置。
7.根据权利要求1所述的COB固晶机,其特征在于:所述摆臂驱动电机连接有Z轴电机。
CN202010758763.8A 2020-07-31 2020-07-31 一种cob固晶机 Pending CN111863685A (zh)

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CN113539913A (zh) * 2021-06-18 2021-10-22 深圳市卓兴半导体科技有限公司 固晶设备及固晶方法
WO2022262194A1 (zh) * 2021-06-18 2022-12-22 深圳市卓兴半导体科技有限公司 固晶设备及固晶方法

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