CN111863663B - PIN automatic PIN inserting machine - Google Patents
PIN automatic PIN inserting machine Download PDFInfo
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- CN111863663B CN111863663B CN202010738371.5A CN202010738371A CN111863663B CN 111863663 B CN111863663 B CN 111863663B CN 202010738371 A CN202010738371 A CN 202010738371A CN 111863663 B CN111863663 B CN 111863663B
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- 230000007246 mechanism Effects 0.000 claims abstract description 248
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- 230000000007 visual effect Effects 0.000 claims abstract description 24
- 238000007599 discharging Methods 0.000 claims abstract description 16
- 238000003780 insertion Methods 0.000 claims abstract description 16
- 230000037431 insertion Effects 0.000 claims abstract description 16
- 238000012546 transfer Methods 0.000 claims abstract description 14
- 238000012544 monitoring process Methods 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims description 73
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 53
- 229910052802 copper Inorganic materials 0.000 claims description 53
- 239000010949 copper Substances 0.000 claims description 53
- 238000013519 translation Methods 0.000 claims description 24
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- 238000006073 displacement reaction Methods 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 9
- 239000000523 sample Substances 0.000 claims description 7
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- 230000006872 improvement Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
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- 238000011179 visual inspection Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
Abstract
The invention relates to the field of PIN inserting machines, in particular to a PIN automatic PIN inserting machine which comprises a main body frame, wherein an XY axis moving mechanism, a CCD visual detection mechanism, a connecting material PIN automatic feeding mechanism, a PIN twist-off transfer mechanism, a PIN inserting mechanism and a PIN connecting material reel discharging mechanism are respectively arranged on the main body frame, and the PIN inserting mechanism further comprises a PIN height detection assembly. The invention integrates the functions of visual photographing guide, contact PIN insertion force monitoring feedback, PIN automatic feeding, contact PIN post height detection, PIN twisting off and contact PIN depth flexible adjustment, has simple structure, good needle feeding stability, improves the production efficiency, is convenient to maintain, and truly realizes high-flexibility production.
Description
Technical Field
The invention relates to the field of PIN inserting machines, in particular to a PIN automatic PIN inserting machine, which is mainly aimed at the semiconductor chip industry, and has the main function of inserting different PIN needles (shown in figure 1) on a chip copper substrate.
Background
In the current market, pin machines are called: pin machine equipment, automatic PIN machines, and the like, which can be categorized into a broad class of PIN equipment.
The automatic pin inserting machine is widely applied to various industries of electronic transformer coil frameworks, relay coil frameworks, fan motor coil frameworks, micro motor coil frameworks, stepping motor coil frameworks, high-low-package coil frameworks, charger coil frameworks, inductance coil frameworks, middle-circumference coil frameworks, energy-saving lamp coil frameworks, automobile ignition coil frameworks, automobile connectors and semiconductor chips.
Manufacturers who mainly make PIN inserting machines in the market mainly take a cam structure as a main part, namely a motor drives the cam mechanism to finish the processes of automatic feeding, automatic cutting, automatic PIN inserting and the like of PIN PINs.
The advantages and disadvantages of this device are as follows:
the advantages are that: 1) The cam contact pin has compact structure, and the mechanism can be made small and exquisite, thereby saving space; 2) The efficiency is high, and the contact pin speed is high.
The defects are mainly that: 1) The flexibility is poor, as the mechanism adopts a cam, the design is complex, no adjustability exists after the design, and if the later stage wants to change a certain action of the equipment, parts are required to be manufactured again; 2) The cam mechanism is connected with the high pair, so that the equipment runs for a long time and is easy to wear high pair contact parts, thereby causing the abnormal contact pin of the contact pin equipment.
Therefore, in view of the above situation, there is an urgent need to develop a PIN automatic PIN machine that enables PIN equipment to have higher flexible production capability, and also meets the use requirements of customers in terms of production efficiency and maintenance, so as to overcome the shortcomings in the current practical application.
Disclosure of Invention
The embodiment of the invention aims to provide a PIN automatic PIN inserting machine so as to solve the problems in the background technology.
In order to achieve the above object, the embodiment of the present invention provides the following technical solutions:
the automatic PIN inserting machine comprises a main body frame, wherein an XY axis moving mechanism, a CCD visual detection mechanism, a connecting PIN automatic feeding mechanism, a PIN twist-off transferring mechanism, a PIN inserting mechanism and a PIN connecting reel discharging mechanism are respectively arranged on the main body frame, the XY axis moving mechanism is used for moving a chip copper substrate to a photographing area of the CCD visual detection mechanism, and the CCD visual detection mechanism is used for photographing the chip copper substrate conveyed by the XY axis moving mechanism and capturing the needle cap position of the chip copper substrate through a visual system of the chip copper substrate; the PIN is even expects reel blowing mechanism be used for to link material PIN autoloading mechanism carries the PIN needle, even expects PIN autoloading mechanism and is used for carrying the PIN needle to the position of twisting off of PIN twist-off transfer mechanism and twist-off link material PIN needle, PIN twist-off transfer mechanism still is used for the centre gripping PIN needle and carries it to contact PIN mechanism below, contact PIN mechanism is arranged in the centre gripping after twisting off PIN needle and inserts it in the needle cap of chip copper base plate, contact PIN mechanism still including PIN height detection subassembly, PIN height detection subassembly is used for carrying out the height detection to the PIN needle of the chip copper base plate of inserting the PIN needle.
Compared with the prior art, the embodiment of the invention has the beneficial effects that:
this PIN automatic PIN machine has integrated vision guide of shooing, contact PIN insertion force monitoring feedback, PIN autoloading, high detection behind the contact PIN, PIN twist-off and contact PIN degree of depth flexible regulation's function, simple structure, and send the needle stability good, improve production efficiency, and be convenient for maintain, really realized high flexible production.
Drawings
Fig. 1 is a schematic diagram of a semi-finished chip after a pin is inserted by a pin inserting machine in the prior art.
Fig. 2 is a schematic diagram of the overall assembly structure of the embodiment of the present invention.
Fig. 3 is a schematic structural view of the internal components of fig. 1.
Fig. 4 is a schematic structural diagram of an XY axis moving mechanism in the embodiment of the invention.
Fig. 5 is a schematic structural diagram of a CCD visual inspection mechanism according to an embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a connecting PIN automatic feeding mechanism in an embodiment of the present invention.
Fig. 7 is a schematic structural diagram of a PIN twist-off transfer mechanism in an embodiment of the present invention.
Fig. 8 is a schematic structural diagram of a pin machine mechanism according to an embodiment of the present invention.
Fig. 9 is a schematic structural diagram of a PIN height detecting component in an embodiment of the present invention.
Fig. 10 is a schematic structural diagram of a PIN connecting reel discharging mechanism in an embodiment of the present invention.
Fig. 11 is a schematic structural diagram of a main body frame according to an embodiment of the present invention.
In the figure: 10-main body frame, 20-XY axis moving mechanism, 30-CCD visual detection mechanism, 40-connection PIN automatic feeding mechanism, 50-PIN twist-off transfer mechanism, 60-contact PIN mechanism, 70-PIN height detection component, 80-PIN connection reel discharging mechanism, 90-equipment visual protective cover, 100-equipment man-machine interaction interface, 110-equipment compressed air processing unit, 120-equipment power interface, 101-equipment adjusting foot margin, 102-equipment main body frame, 103-equipment substrate, 201-movement auxiliary guide rail, 202-Y axis movement servo module, 203-copper substrate fixing jig, 204-X axis movement servo module, 205-Y axis movement servo motor, 206-X axis movement servo motor, 301-support base, 302-moving cylinder, 303-CCD camera, 304-camera lens, 305-camera light source, 401-supporting substrate, 402-PIN feeding post position detector, 403-PIN feeding track, 404-PIN correction mechanism, 405-PIN, 406-PIN feeding post pressing mechanism, 407-PIN stirring mechanism, 408-step feeding mechanism, 409-twist-off limit mechanism, 501-supporting fixed plate, 502-translation guide rail, 503-translation cylinder, 504-PIN clamping twist-off mechanism, 505-rotating mechanism, 506-translation limit mechanism, 601-PIN clamping PIN mechanism, 603-first servo motor, 604-pressure feedback monitoring mechanism, 605-PIN lifting servo module, 606-second servo motor, 701-PIN detection probe, 702-GT displacement sensor, 703-movable propelling cylinder, 704-movable guide rail, 801-PIN material reel, 802-PIN material protection cover, 803-PIN material reel fixation clamp, 804-blowing motor, 805-mechanism fixation bracket, 806-mechanism adjustment anchor, 807-PIN guide cover.
Detailed Description
The technical scheme of the patent is further described in detail below with reference to the specific embodiments.
Embodiments of the present patent are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present patent and are not to be construed as limiting the present patent.
Example 1
Referring to fig. 2-11, in an embodiment of the present invention, a PIN automatic PIN inserting machine includes a main body frame 10, an XY axis moving mechanism 20, a CCD visual detecting mechanism 30, a PIN automatic feeding mechanism 40 for connecting materials, a PIN twist-off transferring mechanism 50, a PIN inserting mechanism 60, a PIN height detecting assembly 70 and a PIN connecting material reel discharging mechanism 80 are respectively installed on the main body frame 10, the XY axis moving mechanism 20 is used for moving a chip copper substrate to a photographing area of the CCD visual detecting mechanism 30, and the CCD visual detecting mechanism 30 is used for photographing the chip copper substrate conveyed by the XY axis moving mechanism 20 and capturing a needle cap position of the chip copper substrate through a visual system thereof; the PIN connecting reel discharging mechanism 80 is used for conveying PIN needles to the connecting PIN automatic feeding mechanism 40, the connecting PIN automatic feeding mechanism 40 is used for conveying the PIN needles to the twisting-off position of the PIN twisting-off transferring mechanism 50 and twisting-off the connecting PIN needles, the PIN twisting-off transferring mechanism 50 is also used for clamping the PIN needles and conveying the PIN needles to the lower part of the PIN inserting mechanism 60, the PIN inserting mechanism 60 is used for clamping the twisted PIN needles and inserting the twisted PIN needles into the PIN caps of the chip copper substrates, the PIN inserting mechanism 60 comprises a PIN height detecting assembly 70, and the PIN height detecting assembly 70 is used for detecting the heights of the PIN needles of the chip copper substrates inserted with the PIN needles.
Before the PIN device is started, materials (the PIN and the copper chip substrate) are required to be placed in the device. The PIN is manually placed on the external PIN connecting reel discharging mechanism 80 and locked, the connecting PIN is pulled out from the lower part of the reel, the PIN is transmitted to the connecting PIN automatic feeding mechanism 40, the PIN is clamped on the feeding part, and at the moment, the PIN material feeding preparation work is completed. Manually placing the chip copper substrate in a jig of the XY axis moving mechanism 20, and automatically locking the chip copper substrate by the mechanism jig to finish feeding; starting a machine switch, conveying the chip copper substrate to the lower part of the CCD visual detection mechanism 30 by the XY axis moving mechanism 20, controlling the CCD camera to start photographing the chip copper substrate on the jig by the system, capturing and recording the needle cap position on the chip copper substrate and transmitting data to the system, stopping the XY axis moving mechanism 20 after photographing is completed, and waiting for a contact pin; the XY axle moving mechanism 20 and CCD vision detection mechanism 30 are running, link material PIN autoloading mechanism 40 is running the pay-off too, link material PIN autoloading mechanism 40 is sending the PIN needle to PIN twist-off transfer mechanism 50 in, PIN twist-off transfer mechanism 50 self-holding PIN needle, outside cylinder pushing mechanism, the mechanism is rotated 180 along the PIN needle center and is twisted off with link material PIN, after twisting off, translation cylinder promotes clamping mechanism, send the single PIN needle on the clamping mechanism below the contact PIN mechanism 60, after transferring the position, contact PIN mechanism 60 descends, the clamping PIN is opened to the head clamping jaw, clamping mechanism opens on the PIN twist-off transfer mechanism 50, contact PIN mechanism 60 rises to the contact PIN position, single PIN needle is accomplished and is transferred. The PIN twist-off transfer mechanism 50 returns to the twist-off position, the XY axis moving mechanism 20 carries the chip copper substrate to the lower side of the PIN inserting mechanism 60, the system inserts PINs according to the data recorded by CCD photographing, and the PIN PINs are inserted into the PIN caps of the chip copper substrate. In the process of inserting the pin, the pressure sensor on the pin mechanism 60 records the insertion pressure in real time, transmits the pressure data to the system for storage and judgment, and when the insertion pressure is judged not to be within the range of the set value, the equipment automatically stops the pin and judges the pin NG. After the PINs are finished, the XY axis moving mechanism 20 carries the chip copper substrate after the PINs to the position below the PIN height detecting assembly 70 for detection, judges whether the PIN insertion depth on the chip copper substrate is qualified or not, and transmits detected data to the system for storage. Finally, the XY axis moving mechanism 20 conveys the chip copper substrate after the pin insertion to a manual loading and unloading position for blanking, and the pin insertion equipment completes single-cycle operation.
Example 2
Referring to fig. 2-11, the difference between the present embodiment and embodiment 1 is that:
in this embodiment, as shown in fig. 4, the XY axis moving mechanism 20 includes a moving auxiliary rail 201, a Y axis moving servo module 202, a copper substrate fixing jig 203, an X axis moving servo module 204, a Y axis moving servo motor 205, and an X axis moving servo motor 206, where the moving auxiliary rail 201 and the X axis moving servo module 204 are both installed at the top of the main body frame 10, the moving auxiliary rail 201 mainly plays a supporting role, so as to ensure that the mechanism is stable in the process of the pin and the rapid translation, one end of the X axis moving servo module 204 is installed with the X axis moving servo motor 206 for driving the X axis moving servo module 204, one end of the X axis moving servo module 204 and the moving auxiliary rail 201 is also installed with the Y axis moving servo module 202, one end of the Y axis moving servo module 202 is installed with the Y axis moving servo motor 205 for driving the X axis moving servo module 202, and the Y axis moving servo module 202 is also installed with the copper substrate fixing jig 203; in the process of inserting the pins, the product is ensured to move on the Y axis at will, the copper substrate is tightly pressed by the copper substrate fixing jig 203, and the pins are ensured not to shake in the process of moving; the X-axis moving servo module 204 is provided with a product fixture and the Y-axis moving servo module 202, and the whole mechanism is ensured to move on the X axis at will in the process of inserting pins; the Y-axis moving servomotor 205 and the X-axis moving servomotor 206 control the displacement of the mechanism on the XY axis.
In this embodiment, as shown in fig. 5, the CCD vision detecting mechanism 30 includes a supporting base 301, a moving cylinder 302, a CCD camera 303, a camera lens 304 and a camera light source 305, where the supporting base 301 is installed and fixed on the top of the main body frame 10, the supporting base 301 plays a role in fixing the whole mechanism, the moving cylinder 302 is installed and fixed on the supporting base 301, a vision mechanism is installed and fixed at the lower end of the moving cylinder 302, and the vision mechanism includes the CCD camera 303, the camera lens 304 and the camera light source 305 that are installed in cooperation, the moving cylinder 302 drives the vision mechanism to lift, mainly to change the photographing focal length of the CCD camera 303, the CCD camera 303 mainly performs photographing on a chip copper substrate, and captures the position of a needle cap on the copper substrate, the camera lens 304 adjusts the photographing focal length when photographing, and the camera light source 305 ensures that the CCD camera 303 has enough brightness in the photographing process, so that the photographed picture is clearer.
In this embodiment, as shown in fig. 6, the automatic PIN feeding mechanism 40 includes a supporting substrate 401, a PIN feeding post-feeding position detector 402, a PIN feeding track 403, a PIN correcting mechanism 404, a PIN feeding post-pressing mechanism 406, a PIN shifting mechanism 407, a step feeding mechanism 408 and a torsion breaking limiting mechanism 409, where the supporting substrate 401 is fixed on the top of the main frame 10, the supporting substrate 401 serves to fix the whole mechanism, the upper part of the supporting substrate 401 is provided with a PIN correcting mechanism 404 for correcting and transmitting the PIN405, a PIN feeding track 403 is installed below the PIN correcting mechanism 404 on the supporting substrate 401, one side of the PIN feeding track 403 is provided with the PIN feeding post-position detector 402, the other side of the PIN feeding track 403 is provided with the PIN feeding post-pressing mechanism 406 and the PIN shifting mechanism 407, the lower side of the PIN shifting mechanism is provided with the step feeding mechanism 408 on the supporting substrate 401, and the torsion breaking limiting mechanism 409 is installed on the lower side of the supporting substrate 401; the PIN continuous feeding position detector 402 is used for detecting whether feeding is accurate or not; the PIN material feeding track 403 is mainly used for limiting the material PIN405 and ensuring that the material does not shake; the connecting material PIN correction mechanism 404 is used for correcting the connecting material before entering the track, so that the connecting material entering the track is straight and has no bending phenomenon; the connection PIN405 is a raw material for the PIN equipment; the pressing mechanism 406 is used for pressing the connecting material after the feeding is completed, so as to prevent the connecting material from moving up and down in the track; parts in the mechanism of the connecting PIN shifting mechanism 407 are clamped at V-Cut at the end-to-end connection position of PIN, so that automatic feeding is completed; the step distance feeding mechanism 408 is used for feeding materials equidistantly according to the PIN length; the twisting-off limiting mechanism 409 is used for ensuring that the connecting material above the twisting-off position cannot rotate in the rotating process of the twisting-off mechanism.
In this embodiment, as shown in fig. 7, the PIN twisting and transferring mechanism 50 includes a supporting and fixing plate 501, a translation guide rail 502, a translation cylinder 503, a PIN clamping and twisting and breaking mechanism 504, a rotating mechanism 505 and a translation limiting mechanism 506, where the supporting and fixing plate 501 is fixed on the top of the main body frame 10, the supporting and fixing plate 501 plays a role of fixing the whole mechanism and an adjusting mechanism, the translation guide rail 502 is fixed on the top of the supporting and fixing plate 501, the translation guide rail 502 is used to ensure smooth and stable movement of the mechanism in the moving process, the translation guide rail 502 is driven by the translation cylinder 503 installed on the top of the main body frame 10, that is, the translation cylinder 503 provides mechanism translation power, the PIN clamping and twisting and breaking mechanism 504 and the rotating mechanism 505 are installed on the translation guide rail 502, the PIN clamping and twisting and breaking mechanism 504 is used to clamp a single PIN to be twisted and broken, and then the whole mechanism is driven to rotate by the rotating mechanism 505, so that the PIN is twisted and broken; the support fixing plate 501 is further provided with a translation limiting mechanism 506 for transferring the twisted PIN needle to the PIN position, so that the accurate transfer position is ensured.
In this embodiment, as shown in fig. 8, the PIN mechanism 60 further includes a PIN clamping PIN mechanism 601, a first servo motor 603, a pressure feedback monitoring mechanism 604, a PIN lifting servo module 605 and a second servo motor 606, where the second servo motor 606 is mounted and fixed on the top of the main body frame 10, the second servo motor 606 is connected with the PIN lifting servo module 605, the PIN lifting servo module 605 is driven to move up and down by the second servo motor 606, the PIN lifting servo module 605 is respectively provided with the PIN clamping PIN mechanism 601 and the first servo motor 603, the first servo motor 603 is used to drive the PIN clamping PIN mechanism 601 to rotate, and the PIN height detecting assembly 70 and the pressure feedback monitoring mechanism 604 are mounted on the PIN lifting servo module 605; the PIN clamping PIN inserting mechanism 601 mainly clamps a single PIN and inserts the clamped PIN into a PIN cap of a chip copper substrate; the PIN height detection component 70 mainly detects the PIN height on the PIN-plugged chip copper substrate; the second servo motor 606 and the first servo motor 603 are respectively used for providing power for mechanism descent and rotation; the pressure feedback monitoring mechanism 604 is used for performing feedback monitoring on the insertion force in the process of inserting the needle; the pin lifting servo module 605 is used for ensuring that the mechanism lifts quickly and completes pin action.
In this embodiment, as shown in fig. 9, the PIN height detection assembly 70 includes a PIN detection probe 701, a GT displacement sensor 702, a moving pushing cylinder 703 and a moving rail 704, where the moving pushing cylinder 703 is mounted and fixed on the PIN lifting servo module 605, the moving pushing cylinder 703 is connected with the moving rail 704, the PIN detection probe 701 and the GT displacement sensor 702 are respectively mounted on the moving rail 704, and the PIN detection probe 701 mainly contacts with a single PIN on the copper substrate after the PIN is inserted, and the height is indirectly fed back; the GT displacement sensor 702 mainly detects the height of the PIN on the copper substrate of the chip after the PIN is inserted, and feeds back the specific height; the moving propulsion cylinder 703 provides the power for the mechanism to lift; the moving rail 704 ensures that the mechanism moves up and down in the vertical direction.
In this embodiment, as shown in fig. 10, the PIN-connecting-material-reel discharging mechanism 80 includes a PIN-connecting-material reel 801, a PIN-connecting-material protecting cover 802, a PIN-connecting-material-reel fixing clamp 803, a discharging motor 804, a mechanism fixing bracket 805, a mechanism adjusting anchor 806 and a PIN guiding cover 807, wherein the mechanism fixing bracket 805 is disposed on one side of the main body frame 10, a plurality of mechanism adjusting anchors 806 are further mounted at the bottom of the mechanism fixing bracket 805, the PIN-connecting-material reel 801 is mounted on the mechanism fixing bracket 805, the PIN-connecting-material-reel fixing clamp 803 is mounted on the PIN-connecting-material-reel 801, the PIN-connecting-material-protecting cover 802 is further mounted and fixed on the lower side of the PIN-connecting-material-reel 801, and the PIN guiding cover 807 matched with the PIN-connecting-material protecting cover 802 is further mounted on the mechanism fixing bracket 805; the PIN connecting material reel 801 is used for bearing equipment production raw materials; the PIN connecting material protection cover 802 is used for protecting materials in the rotating process of the turntable; PIN web reel retention clip 803 is used to flexibly retain the reel; the discharging motor 804 is used for discharging by matching with a feeding mechanism in the process of inserting the pins; the mechanism fixing bracket 805 is used for supporting and fixing the whole mechanism; the mechanism adjusting anchor 806 is used for ensuring the height consistency with the host machine, so that the material feeding is smooth; the PIN guide cover 807 is used to ensure accurate placement of the web into the feed rail.
In this embodiment, as shown in fig. 11, the main body frame 10 includes an equipment adjusting anchor 101, an equipment main body frame 102 and an equipment substrate 103, the equipment substrate 103 is fixedly mounted on the top of the equipment main body frame 102, and the equipment adjusting anchor 101 is fixedly mounted on the bottom of the equipment main body frame 102; the equipment adjusting anchor 101 is used for ensuring that the whole equipment mechanism is in a horizontal state in the use process of equipment; the equipment main body frame 102 is formed by welding square steel with the specification of 60mm multiplied by 5mm, and supports a hardware mechanism of the whole equipment, so that the equipment has enough rigidity; all hardware mechanisms on the pin equipment are fixed on the equipment substrate 103, and the hardware mechanisms are the standard of the hardware mechanisms of the equipment and play a role in fixing and positioning.
The PIN automatic PIN inserting machine can further comprise a device visual protective cover 90, a device man-machine interaction interface 100, a device compressed air processing unit 110 and a device power interface 120 (shown in fig. 2), wherein the device visual protective cover 90 is used for carrying out safety protection, the device man-machine interaction interface 100 is convenient for controlling and setting parameters, the running states of all mechanisms of the device can be monitored and checked in real time, the user is greatly facilitated, the device compressed air processing unit 110 is used for providing power for all cylinders, and the device power interface 120 is used for carrying out integral power supply.
The automatic PIN inserting device integrates the functions of visual photographing guide, PIN inserting force monitoring feedback, PIN automatic feeding, PIN post-PIN height detection, PIN twisting off and PIN depth flexible adjustment compared with the existing PIN inserting device.
Before the equipment pins, the pin caps on the chip copper substrate are photographed, the positions of each pin cap on the chip copper substrate are read, the positions are transmitted to the equipment control system, the control system controls the XY axis moving mechanism 20 to automatically adjust the positions of the correction pins according to the read pin cap positions in real time, and even if the pin cap positions of each chip copper substrate are different, the equipment can recognize and judge to finish the pins, so that high-flexibility production is truly realized, and the traditional pin equipment cannot finish flexible production.
In the process of inserting the pin, the pressure monitoring system monitors the feedback insertion force in real time, and when the insertion force is abnormal and exceeds or is lower than a set value, the equipment immediately stops the pin.
After the PINs are completed, the PIN height detection assembly 70 detects each PIN on the copper substrate of the chip to determine whether the insertion depth is correct, and the height data of each PIN is transmitted to the device control system for storage.
The automatic feeding and PIN twist-off transfer mechanism 50 of the PIN apparatus is uniquely designed and is quite different from a conventional PIN machine. PIN autoloading is according to connecting material PIN405 head and tail department V-Cut characteristic, designs out card material part, realizes the autoloading function, and its biggest characteristics are: simple structure and good needle feeding stability.
The material PIN405 in the market at present cuts the PIN before the contact PIN, and material PIN405 is cut into single PIN, and the instrument of cutting is simple and easy cutting mould generally, and the mould cuts for a long time, and the PIN cuts the department and probably can appear the burr and arouse badly, generally appears this kind of condition, and the PIN after cutting needs to scrap, cuts mould and needs to change corresponding edge of a knife and cutter. Such a situation is often not easily found, and the risk of scrapping the copper substrate of the whole chip is easily caused; the cutting die knife edge and the cutter belong to the loss piece, and also need to be regularly maintained and maintained, so that the complexity of equipment application is increased intangibly.
Aiming at the hidden danger of cutting, the invention adopts a twisting-off mode, thereby effectively avoiding the risk of burrs caused by cutting. The PIN automatic feeding mechanism 40 sends the PIN to the twisting off position, the clamping jaw on the PIN twisting off transferring mechanism 50 clamps a single PIN, the external cylinder provides power to push the clamping mechanism, the clamping mechanism rotates 180 degrees around the PIN connecting center to complete twisting off action, and the twisting off point is V-Cut at the end-to-end joint of the PIN.
The PIN automatic PIN inserting machine mainly comprises the following operation steps:
1) Manually loading the chip copper substrate into the jig of the XY axis moving mechanism 20;
2) The XY axis moving mechanism 20 moves the jig to a CCD area for photographing, and the vision system captures the needle cap position of the chip copper substrate;
3) The PIN feeding system (i.e., the connecting PIN automatic feeding mechanism 40) sends the PIN needle to the twist-off position and twist-off the connecting PIN405;
4) The PIN twist-off transfer mechanism 50 grips the PIN and sends it under the PIN mechanism 60 to wait for removal;
5) The PIN inserting mechanism 60 clamps the twisted PIN needle and inserts the PIN needle into the PIN cap of the chip copper substrate, and in the PIN inserting process, the pressure sensor detects the insertion force in real time, transmits data of the insertion force to the equipment control system, and monitors, feeds back and judges the insertion force;
6) The chip copper substrate after the PIN is inserted is moved out to a detection position, and a displacement sensor detects the height of each PIN PIN and judges whether the insertion depth is qualified or not;
7) And (5) manually discharging, and placing qualified products and unqualified products in a designated area by manpower.
The related circuits, electronic components and modules are all in the prior art, and can be completely implemented by those skilled in the art, and needless to say, the protection of the present invention does not relate to improvement of software programs.
The foregoing is merely a preferred embodiment of the present invention, and it should be noted that modifications and improvements can be made by those skilled in the art without departing from the spirit of the present invention, and these should also be considered as the scope of the present invention, which does not affect the effect of the implementation of the present invention and the utility of the patent.
Claims (3)
1. The utility model provides an automatic contact PIN machine of PIN, includes main part frame (10), its characterized in that:
an XY axis moving mechanism (20), a CCD visual detection mechanism (30), a connecting PIN automatic feeding mechanism (40), a PIN twist-off transfer mechanism (50), a PIN inserting mechanism (60) and a PIN connecting reel discharging mechanism (80) are respectively arranged on the main body frame (10);
the XY axis moving mechanism (20) is used for moving the chip copper substrate to a photographing area of the CCD visual detection mechanism (30), and the CCD visual detection mechanism (30) is used for photographing the chip copper substrate conveyed by the XY axis moving mechanism (20) and capturing the needle cap position of the chip copper substrate through a visual system of the chip copper substrate;
the PIN connecting reel discharging mechanism (80) is used for conveying PIN needles to the connecting PIN automatic feeding mechanism (40), the connecting PIN automatic feeding mechanism (40) is used for conveying the PIN needles to the twisting-off position of the PIN twisting-off transferring mechanism (50) and twisting-off the connecting PIN needles, and the PIN twisting-off transferring mechanism (50) is also used for clamping the PIN needles and conveying the PIN needles to the lower part of the contact PIN mechanism (60);
the PIN inserting mechanism (60) is used for clamping the twisted PIN needle and inserting the twisted PIN needle into the PIN cap of the chip copper substrate, the PIN inserting mechanism (60) further comprises a PIN height detecting assembly (70), and the PIN height detecting assembly (70) is used for detecting the height of the PIN needle of the chip copper substrate inserted with the PIN needle;
the XY axis moving mechanism (20) comprises a moving auxiliary guide rail (201), a Y axis moving servo module (202), a copper substrate fixing jig (203), an X axis moving servo module (204), a Y axis moving servo motor (205) and an X axis moving servo motor (206); the X-axis moving servo module (204) and the X-axis moving servo module (201) are both arranged at the top of the main body frame (10), one end of the X-axis moving servo module (204) is provided with an X-axis moving servo motor (206) for driving the X-axis moving servo module to operate, the X-axis moving servo module (204) and the moving auxiliary guide rail (201) are also provided with a Y-axis moving servo module (202), one end of the Y-axis moving servo module (202) is provided with a Y-axis moving servo motor (205) for driving the Y-axis moving servo module to operate, and the Y-axis moving servo module (202) is also provided with a copper substrate fixing jig (203);
the CCD visual detection mechanism (30) comprises a support base (301), a movable cylinder (302), a CCD camera (303), a camera lens (304) and a camera light source (305); the device comprises a main body frame (10), a support base (301), a movable cylinder (302) and a visual mechanism, wherein the support base (301) is fixedly arranged at the top of the main body frame (10), the movable cylinder (302) is fixedly arranged on the support base (301), the visual mechanism is fixedly arranged at the lower end of the movable cylinder (302), and the visual mechanism comprises a CCD camera (303), a camera lens (304) and a camera light source (305) which are cooperatively arranged;
the connecting PIN automatic feeding mechanism (40) comprises a supporting substrate (401), a PIN connecting feeding rear position degree detector (402), a PIN connecting feeding track (403), a connecting PIN correcting mechanism (404), a connecting PIN feeding rear pressing mechanism (406), a connecting PIN stirring mechanism (407), a step feeding mechanism (408) and a torsion-breaking limiting mechanism (409); the PIN feeding device comprises a main body rack (10), a supporting substrate (401), a PIN connecting feeding track (403) and a PIN connecting feeding position detector (402), wherein the supporting substrate (401) is fixedly arranged at the top of the main body rack (10), a connecting PIN correcting mechanism (404) for correcting and transmitting a connecting PIN (405) is arranged at the upper part of the supporting substrate (401), a PIN connecting feeding track (403) for limiting the connecting PIN (405) is arranged below the connecting PIN correcting mechanism (404) on the supporting substrate (401), one side of the PIN connecting feeding track (403) is provided with a PIN connecting feeding post position detector (402) for detecting whether feeding is accurate, the other side of the PIN connecting feeding track (403) is provided with a connecting PIN feeding post-pressing mechanism (406) and a connecting PIN stirring mechanism (407), and the connecting PIN feeding post-pressing mechanism (406) is used for pressing a connecting material after feeding is completed; the connecting PIN stirring mechanism (407) is used for being clamped at the end-to-end connection position of the PIN needle; a step feeding mechanism (408) for equidistant feeding according to the length of a PIN needle is arranged on the lower side of the connecting PIN stirring mechanism (407) on the supporting substrate (401), and a twist-off limiting mechanism (409) is arranged on the lower side of the PIN connecting material feeding track (403) on the supporting substrate (401);
the PIN twist-off transfer mechanism (50) comprises a supporting and fixing plate (501), a translation guide rail (502), a translation cylinder (503), a PIN clamping twist-off mechanism (504), a rotating mechanism (505) and a translation limiting mechanism (506); the support fixing plate (501) is fixedly arranged at the top of the main body frame (10), the translation guide rail (502) is fixedly arranged at the top of the support fixing plate (501), the translation guide rail (502) is driven to move by a translation cylinder (503) arranged at the top of the main body frame (10), the PIN clamping twisting-off mechanism (504) and the rotating mechanism (505) are respectively arranged on the translation guide rail (502), the PIN clamping twisting-off mechanism (504) is used for clamping a single PIN needle which needs to be twisted off, and the rotating mechanism (505) is used for driving the PIN clamping twisting-off mechanism (504) to rotate; the support fixing plate (501) is also provided with a translation limiting mechanism (506) for transferring the twisted PIN needle to the position of the contact PIN;
the PIN inserting mechanism (60) further comprises a PIN clamping PIN inserting mechanism (601), a first servo motor (603), a pressure feedback monitoring mechanism (604), a PIN lifting servo module (605) and a second servo motor (606); the second servo motor (606) is arranged and fixed at the top of the main body frame (10), the second servo motor (606) is connected with the PIN lifting servo module (605), a PIN clamping PIN mechanism (601) and a first servo motor (603) are respectively arranged on the PIN lifting servo module (605), the first servo motor (603) is used for driving the PIN clamping PIN mechanism (601) to rotate, and the PIN clamping PIN mechanism (601) is used for clamping a single PIN PIN and then inserting the single PIN into a PIN cap of a chip copper substrate; the PIN height detection assembly (70) and the pressure feedback monitoring mechanism (604) are arranged on the PIN lifting servo module (605), and the pressure feedback monitoring mechanism (604) is used for carrying out feedback monitoring on the insertion force in the process of inserting the PIN;
the PIN height detection assembly (70) comprises a PIN detection probe (701), a GT displacement sensor (702), a movable pushing cylinder (703) and a movable guide rail (704); the movable pushing cylinder (703) is fixedly arranged on the PIN lifting servo module (605), the movable pushing cylinder (703) is connected with the movable guide rail (704), the movable guide rail (704) is respectively provided with a PIN detection probe (701) and a GT displacement sensor (702), and the PIN detection probe (701) is used for contacting with a single PIN needle on the chip copper substrate after the PINs are inserted, so that the height is indirectly fed back; the GT displacement sensor (702) is used for detecting the height of a PIN needle on the chip copper substrate after the PIN is inserted, and feeding back the specific height of the PIN needle.
2. The automatic PIN inserting machine according to claim 1, wherein the PIN connecting material reel discharging mechanism (80) comprises a PIN connecting material reel (801), a PIN connecting material protection cover (802), a PIN connecting material reel fixing clamp (803), a discharging motor (804), a mechanism fixing bracket (805), a mechanism adjusting foot margin (806) and a PIN guiding cover (807); mechanism's fixed bolster (805) set up in one side of main part frame (10), and a plurality of mechanisms of adjusting ground feet (806) are still installed to the bottom of mechanism's fixed bolster (805), install PIN material reel (801) on mechanism's fixed bolster (805), install PIN material reel fixation clamp (803) on PIN material reel (801), still install on mechanism's fixed bolster (805) and be used for driving PIN material reel (801) pivoted blowing motor (804), the downside of PIN material reel (801) still installs and is fixed with PIN material safety cover (802), still install on mechanism's fixed bolster (805) PIN direction cover (807) with PIN material safety cover (802) matched with.
3. The PIN automatic PIN inserting machine according to claim 2, wherein the main body frame (10) comprises an equipment adjusting foot (101), an equipment main body frame (102) and an equipment substrate (103); an equipment substrate (103) is fixedly arranged at the top of the equipment main body frame (102), and equipment adjusting feet (101) are fixedly arranged at the bottom of the equipment main body frame (102).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010738371.5A CN111863663B (en) | 2020-07-28 | 2020-07-28 | PIN automatic PIN inserting machine |
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| CN202010738371.5A CN111863663B (en) | 2020-07-28 | 2020-07-28 | PIN automatic PIN inserting machine |
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| CN111863663B true CN111863663B (en) | 2024-03-26 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112964733A (en) * | 2021-02-05 | 2021-06-15 | 北京卫星环境工程研究所 | Electric connector contact pin appearance detection device |
| CN216485120U (en) * | 2021-05-21 | 2022-05-10 | 京东方科技集团股份有限公司 | Plug wire jig and detection equipment |
| CN113964047B (en) * | 2021-10-20 | 2024-03-15 | 智汇轩田智能系统(杭州)有限公司 | Electronic cam pin inserting mechanism |
| CN114188251B (en) * | 2021-12-23 | 2023-10-13 | 津上智造智能科技江苏有限公司 | Automatic PIN inserting production system for IGBT |
| CN115555829B (en) * | 2022-11-10 | 2023-04-07 | 龙口市埃迪克自动化设备有限公司 | Pin inserting machine's permutation feeding system |
| CN116313897B (en) * | 2022-12-28 | 2023-11-24 | 津上智造智能科技江苏有限公司 | IGBT pin inserting machine |
| CN116705682B (en) * | 2023-08-02 | 2023-10-03 | 常州科瑞尔科技有限公司 | Needle belt type contact pin feeding mechanism and working method thereof |
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