CN111838262A - Ginkgo and quinoa wafer biscuit and preparation method thereof - Google Patents

Ginkgo and quinoa wafer biscuit and preparation method thereof Download PDF

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Publication number
CN111838262A
CN111838262A CN202010675509.1A CN202010675509A CN111838262A CN 111838262 A CN111838262 A CN 111838262A CN 202010675509 A CN202010675509 A CN 202010675509A CN 111838262 A CN111838262 A CN 111838262A
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parts
quinoa
wafer
ginkgo
powder
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Inventor
王卫东
于楠楠
孙月娥
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Xuzhou University of Technology
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Xuzhou University of Technology
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    • A—HUMAN NECESSITIES
    • A21—BAKING; EDIBLE DOUGHS
    • A21D—TREATMENT, e.g. PRESERVATION, OF FLOUR OR DOUGH, e.g. BY ADDITION OF MATERIALS; BAKING; BAKERY PRODUCTS; PRESERVATION THEREOF
    • A21D13/00—Finished or partly finished bakery products
    • A21D13/10—Multi-layered products
    • A21D13/16—Multi-layered pastry, e.g. puff pastry; Danish pastry or laminated dough
    • A—HUMAN NECESSITIES
    • A21—BAKING; EDIBLE DOUGHS
    • A21D—TREATMENT, e.g. PRESERVATION, OF FLOUR OR DOUGH, e.g. BY ADDITION OF MATERIALS; BAKING; BAKERY PRODUCTS; PRESERVATION THEREOF
    • A21D2/00—Treatment of flour or dough by adding materials thereto before or during baking
    • A21D2/02—Treatment of flour or dough by adding materials thereto before or during baking by adding inorganic substances
    • A—HUMAN NECESSITIES
    • A21—BAKING; EDIBLE DOUGHS
    • A21D—TREATMENT, e.g. PRESERVATION, OF FLOUR OR DOUGH, e.g. BY ADDITION OF MATERIALS; BAKING; BAKERY PRODUCTS; PRESERVATION THEREOF
    • A21D2/00—Treatment of flour or dough by adding materials thereto before or during baking
    • A21D2/08—Treatment of flour or dough by adding materials thereto before or during baking by adding organic substances
    • A21D2/14—Organic oxygen compounds
    • A21D2/18—Carbohydrates
    • A—HUMAN NECESSITIES
    • A21—BAKING; EDIBLE DOUGHS
    • A21D—TREATMENT, e.g. PRESERVATION, OF FLOUR OR DOUGH, e.g. BY ADDITION OF MATERIALS; BAKING; BAKERY PRODUCTS; PRESERVATION THEREOF
    • A21D2/00—Treatment of flour or dough by adding materials thereto before or during baking
    • A21D2/08—Treatment of flour or dough by adding materials thereto before or during baking by adding organic substances
    • A21D2/14—Organic oxygen compounds
    • A21D2/18—Carbohydrates
    • A21D2/181—Sugars or sugar alcohols
    • A—HUMAN NECESSITIES
    • A21—BAKING; EDIBLE DOUGHS
    • A21D—TREATMENT, e.g. PRESERVATION, OF FLOUR OR DOUGH, e.g. BY ADDITION OF MATERIALS; BAKING; BAKERY PRODUCTS; PRESERVATION THEREOF
    • A21D2/00—Treatment of flour or dough by adding materials thereto before or during baking
    • A21D2/08—Treatment of flour or dough by adding materials thereto before or during baking by adding organic substances
    • A21D2/14—Organic oxygen compounds
    • A21D2/18—Carbohydrates
    • A21D2/188—Cellulose; Derivatives thereof
    • A—HUMAN NECESSITIES
    • A21—BAKING; EDIBLE DOUGHS
    • A21D—TREATMENT, e.g. PRESERVATION, OF FLOUR OR DOUGH, e.g. BY ADDITION OF MATERIALS; BAKING; BAKERY PRODUCTS; PRESERVATION THEREOF
    • A21D2/00—Treatment of flour or dough by adding materials thereto before or during baking
    • A21D2/08—Treatment of flour or dough by adding materials thereto before or during baking by adding organic substances
    • A21D2/36—Vegetable material
    • A—HUMAN NECESSITIES
    • A21—BAKING; EDIBLE DOUGHS
    • A21D—TREATMENT, e.g. PRESERVATION, OF FLOUR OR DOUGH, e.g. BY ADDITION OF MATERIALS; BAKING; BAKERY PRODUCTS; PRESERVATION THEREOF
    • A21D2/00—Treatment of flour or dough by adding materials thereto before or during baking
    • A21D2/08—Treatment of flour or dough by adding materials thereto before or during baking by adding organic substances
    • A21D2/36—Vegetable material
    • A21D2/364—Nuts, e.g. cocoa

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  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Food Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Bakery Products And Manufacturing Methods Therefor (AREA)

Abstract

A gingko and quinoa wafer biscuit and a preparation method thereof are disclosed, wherein the wafer biscuit comprises the following raw materials: ginkgo nut powder, quinoa wheat powder, buckwheat powder, xylitol, fructose, inulin, butter, water, sodium bicarbonate and ammonium bicarbonate; according to the invention, quinoa and ginkgo nut powder are added into the raw materials to replace the traditional wheat flour, and xylitol and fructose are used to replace the traditional sucrose, so that the glycemic index of the product is reduced, and the prepared wafer biscuit has good taste and a certain health care function; meanwhile, the invention adopts segmented baking to prepare the cake crust and long-time cold storage wafer, can increase the content of resistant starch in the wafer, further reduce the glycemic index of the wafer, is suitable for hyperglycemia patients, is easy to be accepted by consumers, improves the economic value of the wafer, and provides a new way for deep processing of quinoa and ginkgo nuts.

Description

Ginkgo and quinoa wafer biscuit and preparation method thereof
Technical Field
The invention relates to a wafer biscuit, in particular to a gingko and chenopodium quinoa wafer biscuit and a preparation method thereof, belonging to the technical field of nutritional foods.
Background
The blood glucose generation index is an index reflecting the degree of blood glucose rise of a human body caused by food, is a real reaction of blood glucose change caused by digestion and absorption of the food, and particularly can better explain the influence of the food on the blood glucose of the human body for the food containing higher carbohydrate. The main raw materials of the biscuit comprise flour, a sweetening agent and grease, so that many diabetics give up eating the biscuit.
Quinoa has the characteristic of high protein, the protein content is equivalent to that of beef, unsaturated fatty acid in fat accounts for 83%, the glycemic index of quinoa is low, and the quinoa is rich in vitamins, polyphenols, flavonoids, saponins and phytosterols and has various health effects. The semen Ginkgo is nutritious, has natural health promotion effect, and can delay aging and prolong life after long-term consumption. In the aspect of medicinal value, Mingdian Lishizhen considers that the gingko enters lung channels, benefits spleen qi, decides cough and asthma and reduces defecation, and gingko nuts contain various components such as flavonoid glycoside, ginkgolic acid and the like, and have the effects of resisting tuberculosis, resisting fungi and inhibiting cancer cell diffusion. The ginkgo leaf has complex components, and the chemical components of the ginkgo leaf extract known so far are more than 160 types, mainly including flavonoids, phenols, alkaloids, ginkgols and the like.
In order to solve the problem that diabetics want to eat biscuits and afraid of excessive sugar in the biscuits, some so-called 'sugar-free' biscuits are developed, and the biscuits without sweeteners such as cane sugar, glucose, maltose and the like have the advantage that starch in raw material flour is digested and absorbed, is converted into glucose in the body, and can still cause the increase of blood sugar.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides the ginkgo and quinoa wafer biscuit and the preparation method thereof, which not only can improve the nutritional value of the biscuit, but also can reduce the blood sugar production index of the wafer biscuit, have the health-care effect, improve the economic value of the wafer biscuit, and provide a new way for deep processing of quinoa and ginkgo nuts.
In order to achieve the purpose, the invention adopts the technical scheme that: the ginkgo and quinoa wafer biscuit comprises the following raw materials in parts by weight: 30-40 parts of ginkgo nut powder, 20-30 parts of quinoa powder, 20-30 parts of buckwheat powder, 10-15 parts of xylitol, 2-5 parts of fructose, 1-2 parts of inulin, 5-10 parts of butter, 120 parts of water 100-containing materials, 0.1-0.3 part of sodium bicarbonate and 0.1-0.3 part of ammonium bicarbonate.
Preferably, the wafer biscuit comprises the following raw materials in parts by weight: 35 parts of ginkgo nut powder, 25 parts of quinoa powder, 25 parts of buckwheat powder, 12.5 parts of xylitol, 3.5 parts of fructose, 1.5 parts of inulin, 7.5 parts of butter, 110 parts of water, 0.2 part of sodium bicarbonate and 0.2 part of ammonium bicarbonate.
A preparation method of a gingko and quinoa wafer biscuit comprises the following steps:
preparing slurry: mixing and stirring quinoa wheat flour, buckwheat flour, ginkgo nut flour, water, sodium bicarbonate and ammonium bicarbonate uniformly, and then filtering;
Preparing the sandwich filling material: mixing xylitol, fructose, inulin and butter uniformly;
preparing the cake skin: heating a baking mold to 150-180 ℃, then brushing vegetable oil, injecting the slurry obtained in the step, baking at 160-180 ℃ for 3-5min, and baking at 200-180 ℃ for 5-7min to obtain cake skin;
coating with a sandwich: uniformly coating the sandwich stuffing of the step II on the cake crust, and combining the cake crust and the stuffing in different layers according to the requirement;
fifthly, refrigerating and wafering: refrigerating the wafer biscuit coated with the sandwich stuffing at 3-5 ℃ for 60-90 min;
sixthly, cutting into blocks and packaging: and (3) cutting the refrigerated wafer biscuits into blocks, putting the blocks into packaging bags, sealing and boxing to obtain finished products.
The ginkgo fruit powder is prepared by the following method:
the method comprises the steps of washing fresh gingko, boiling the washed gingko in boiling water for 10-15min, removing shells, boiling the gingko in hot water at 80-90 ℃ for 5-10min, and taking out inner seed coats and inner cores;
freezing the ginkgo with the inner core removed at the temperature of below 30 ℃ below zero for 24 hours to the central temperature of below 18 ℃ below zero;
thirdly, placing the frozen ginkgo into a freeze drying device to be dried until the moisture content is below 3%;
and crushing the freeze-dried ginkgo nuts by using an airflow crusher.
In the preparation process of the cake crust, the cake crust is baked at the temperature of 160-.
Compared with the prior art, the quinoa and ginkgo nut powder are added into the raw materials to replace the traditional wheat flour, and the xylitol and the fructose are used to replace the traditional cane sugar, so that the glycemic index of the product is reduced, and the prepared wafer biscuit has better taste and certain health care function; meanwhile, the invention adopts segmented baking to prepare the cake crust and long-time cold storage wafer, can increase the content of resistant starch in the wafer, further reduce the glycemic index of the wafer, is suitable for hyperglycemia patients, is easy to be accepted by consumers, improves the economic value of the wafer, and provides a new way for deep processing of quinoa and ginkgo nuts.
Detailed Description
The present invention is further described below.
The raw materials used in the examples are all conventional commercial products, and the equipment used is conventional equipment.
Example 1
The ginkgo and quinoa wafer biscuit comprises the following raw materials in parts by weight: 30 parts of ginkgo nut powder, 20 parts of quinoa powder, 20 parts of buckwheat powder, 10 parts of xylitol, 2 parts of fructose, 1 part of inulin, 5 parts of butter, 100 parts of water, 0.1 part of sodium bicarbonate and 0.1 part of ammonium bicarbonate.
A preparation method of a gingko and quinoa wafer biscuit comprises the following steps:
Preparing slurry: mixing and stirring quinoa wheat flour, buckwheat flour, ginkgo nut flour, water, sodium bicarbonate and ammonium bicarbonate uniformly, and then filtering;
preparing the sandwich filling material: mixing xylitol, fructose, inulin and butter uniformly;
preparing the cake skin: heating a baking die to 150 ℃, then brushing vegetable oil, injecting the slurry obtained in the step, baking at 160 ℃ for 3min, and baking at 180 ℃ for 5min to obtain a cake skin;
coating with a sandwich: uniformly coating the sandwich stuffing of the step II on the cake crust, and combining the cake crust and the stuffing in different layers according to the requirement;
fifthly, refrigerating and wafering: refrigerating the wafer biscuit coated with the sandwich stuffing at 3 ℃ for 60 min;
sixthly, cutting into blocks and packaging: and (3) cutting the refrigerated wafer biscuits into blocks, putting the blocks into packaging bags, sealing and boxing to obtain finished products.
The ginkgo fruit powder is prepared by the following method:
the method comprises the steps of washing fresh gingko, boiling the washed gingko with boiling water for 10min, removing shells, boiling the gingko in hot water of 80 ℃ for 5min, and taking out inner seed coats and inner cores;
freezing the ginkgo with the inner core removed at the temperature of below 30 ℃ below zero for 24 hours to the central temperature of below 18 ℃ below zero;
thirdly, placing the frozen ginkgo into a freeze drying device to be dried until the moisture content is below 3%;
And crushing the freeze-dried ginkgo nuts by using an airflow crusher.
Example 2
The ginkgo and quinoa wafer biscuit comprises the following raw materials in parts by weight: 35 parts of ginkgo nut powder, 25 parts of quinoa powder, 25 parts of buckwheat powder, 12.5 parts of xylitol, 3.5 parts of fructose, 1.5 parts of inulin, 7.5 parts of butter, 110 parts of water, 0.2 part of sodium bicarbonate and 0.2 part of ammonium bicarbonate.
A preparation method of a gingko and quinoa wafer biscuit comprises the following steps:
preparing slurry: mixing and stirring quinoa wheat flour, buckwheat flour, ginkgo nut flour, water, sodium bicarbonate and ammonium bicarbonate uniformly, and then filtering;
preparing the sandwich filling material: mixing xylitol, fructose, inulin and butter uniformly;
preparing the cake skin: heating a baking die to 165 ℃, then brushing vegetable oil, injecting the slurry obtained in the step, baking at 170 ℃ for 4min, and baking at 190 ℃ for 6min to obtain a cake skin;
coating with a sandwich: uniformly coating the sandwich stuffing of the step II on the cake crust, and combining the cake crust and the stuffing in different layers according to the requirement;
fifthly, refrigerating and wafering: refrigerating the wafer coated with the sandwich stuffing for 75min at 4 ℃;
sixthly, cutting into blocks and packaging: and (3) cutting the refrigerated wafer biscuits into blocks, putting the blocks into packaging bags, sealing and boxing to obtain finished products.
The ginkgo fruit powder is prepared by the following method:
the method comprises the steps of washing fresh gingko, boiling the washed gingko in boiling water for 10-15min, removing shells, boiling the gingko in hot water at 85 ℃ for 7.5min, and taking out inner seed coats and inner cores;
freezing the ginkgo with the inner core removed at the temperature of below 30 ℃ below zero for 24 hours to the central temperature of below 18 ℃ below zero;
thirdly, placing the frozen ginkgo into a freeze drying device to be dried until the moisture content is below 3%;
and crushing the freeze-dried ginkgo nuts by using an airflow crusher.
Example 3
The ginkgo and quinoa wafer biscuit comprises the following raw materials in parts by weight: 40 parts of ginkgo nut powder, 30 parts of quinoa powder, 30 parts of buckwheat powder, 15 parts of xylitol, 5 parts of fructose, 2 parts of inulin, 10 parts of butter, 120 parts of water, 0.3 part of sodium bicarbonate and 0.3 part of ammonium bicarbonate.
A preparation method of a gingko and quinoa wafer biscuit comprises the following steps:
preparing slurry: mixing and stirring quinoa wheat flour, buckwheat flour, ginkgo nut flour, water, sodium bicarbonate and ammonium bicarbonate uniformly, and then filtering;
preparing the sandwich filling material: mixing xylitol, fructose, inulin and butter uniformly;
preparing the cake skin: heating a baking die to 180 ℃, then brushing vegetable oil, injecting the slurry in the step, baking at 180 ℃ for 5min, and baking at 200 ℃ for 7min to obtain a cake skin;
Coating with a sandwich: uniformly coating the sandwich stuffing of the step II on the cake crust, and combining the cake crust and the stuffing in different layers according to the requirement;
fifthly, refrigerating and wafering: refrigerating the wafer coated with the sandwich stuffing for 90min at 5 ℃;
sixthly, cutting into blocks and packaging: and (3) cutting the refrigerated wafer biscuits into blocks, putting the blocks into packaging bags, sealing and boxing to obtain finished products.
The ginkgo fruit powder is prepared by the following method:
the method comprises the steps of washing fresh gingko, boiling the washed gingko with boiling water for 15min, removing shells, boiling the gingko in hot water at 90 ℃ for 10min, and taking out inner seed coats and inner cores;
freezing the ginkgo with the inner core removed at the temperature of below 30 ℃ below zero for 24 hours to the central temperature of below 18 ℃ below zero;
thirdly, placing the frozen ginkgo into a freeze drying device to be dried until the moisture content is below 3%;
and crushing the freeze-dried ginkgo nuts by using an airflow crusher.
The wafer biscuit has the beneficial effects that:
as shown in Table 1, the pure wheat flour wafer B is a wafer using wheat flour to replace quinoa and ginkgo, the red date wafer C is a wafer using 5% red date powder to replace wheat flour, the wafer A is a wafer added with ginkgo powder, after enzymolysis, starch hydrolysis indexes are measured, and blood glucose generation indexes are calculated and shown in Table 1.
TABLE 1 glycemic index of different biscuits
Figure BDA0002583893980000051

Claims (5)

1. The gingko and quinoa wafer biscuit is characterized by comprising the following raw materials in parts by weight: 30-40 parts of ginkgo nut powder, 20-30 parts of quinoa powder, 20-30 parts of buckwheat powder, 10-15 parts of xylitol, 2-5 parts of fructose, 1-2 parts of inulin, 5-10 parts of butter, 120 parts of water 100-containing materials, 0.1-0.3 part of sodium bicarbonate and 0.1-0.3 part of ammonium bicarbonate.
2. The gingko and quinoa wafer biscuit according to claim 1, wherein the wafer biscuit comprises the following raw materials in parts by weight: 35 parts of ginkgo nut powder, 25 parts of quinoa powder, 25 parts of buckwheat powder, 12.5 parts of xylitol, 3.5 parts of fructose, 1.5 parts of inulin, 7.5 parts of butter, 110 parts of water, 0.2 part of sodium bicarbonate and 0.2 part of ammonium bicarbonate.
3. The preparation method of the ginkgo quinoa wafer biscuit according to claim 1, which is characterized by comprising the following steps:
preparing slurry: mixing and stirring quinoa wheat flour, buckwheat flour, ginkgo nut flour, water, sodium bicarbonate and ammonium bicarbonate uniformly, and then filtering;
preparing the sandwich filling material: mixing xylitol, fructose, inulin and butter uniformly;
preparing the cake skin: heating a baking mold to 150-180 ℃, then brushing vegetable oil, injecting the slurry obtained in the step, baking at 160-180 ℃ for 3-5min, and baking at 200-180 ℃ for 5-7min to obtain cake skin;
Coating with a sandwich: uniformly coating the sandwich stuffing of the step II on the cake crust, and combining the cake crust and the stuffing in different layers according to the requirement;
fifthly, refrigerating and wafering: refrigerating the wafer biscuit coated with the sandwich stuffing at 3-5 ℃ for 60-90 min;
sixthly, cutting into blocks and packaging: and (3) cutting the refrigerated wafer biscuits into blocks, putting the blocks into packaging bags, sealing and boxing to obtain finished products.
4. The method for preparing the ginkgo quinoa wafer biscuit according to claim 3, wherein the ginkgo nut powder is prepared by the following method:
the method comprises the steps of washing fresh gingko, boiling the washed gingko in boiling water for 10-15min, removing shells, boiling the gingko in hot water at 80-90 ℃ for 5-10min, and taking out inner seed coats and inner cores;
freezing the ginkgo with the inner core removed at the temperature of below 30 ℃ below zero for 24 hours to the central temperature of below 18 ℃ below zero;
thirdly, placing the frozen ginkgo into a freeze drying device to be dried until the moisture content is below 3%;
and crushing the freeze-dried ginkgo nuts by using an airflow crusher.
5. The method as claimed in claim 3, wherein the baking is carried out at 160-180 ℃ for 4min and 180-200 ℃ for 6min during the preparation of the crust.
CN202010675509.1A 2020-07-14 2020-07-14 Ginkgo and quinoa wafer biscuit and preparation method thereof Pending CN111838262A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113396955A (en) * 2021-07-07 2021-09-17 舟山馋文化电子商务有限公司 Additive-free leavening agent wafer biscuit and preparation method thereof
CN114946909A (en) * 2021-12-16 2022-08-30 中国人民解放军空军特色医学中心 Wafer biscuit with effect of relieving obesity
CN115568486A (en) * 2022-10-21 2023-01-06 西北农林科技大学 Quinoa sandwich food and preparation method thereof

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CN103168815A (en) * 2013-03-11 2013-06-26 太原市素有苦荞食品有限公司 Gingko tartary buckwheat cookie and manufacturing method thereof
CN104068082A (en) * 2014-06-10 2014-10-01 南京泽朗农业发展有限公司 Low-sugar wafer biscuit
CN105341842A (en) * 2015-10-14 2016-02-24 张季成 Selenium-enriched ginkgo powder and preparation method thereof
CN105815414A (en) * 2016-06-07 2016-08-03 河南科技大学 Quinoa cookie and preparation method for same
CN106614916A (en) * 2017-01-12 2017-05-10 上海融朋电子商务有限公司 Low-glycemic-index biscuits and making method thereof
CN108271842A (en) * 2018-01-03 2018-07-13 杨春建 A kind of preparation method of buckwheat peanut wafer

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103168815A (en) * 2013-03-11 2013-06-26 太原市素有苦荞食品有限公司 Gingko tartary buckwheat cookie and manufacturing method thereof
CN104068082A (en) * 2014-06-10 2014-10-01 南京泽朗农业发展有限公司 Low-sugar wafer biscuit
CN105341842A (en) * 2015-10-14 2016-02-24 张季成 Selenium-enriched ginkgo powder and preparation method thereof
CN105815414A (en) * 2016-06-07 2016-08-03 河南科技大学 Quinoa cookie and preparation method for same
CN106614916A (en) * 2017-01-12 2017-05-10 上海融朋电子商务有限公司 Low-glycemic-index biscuits and making method thereof
CN108271842A (en) * 2018-01-03 2018-07-13 杨春建 A kind of preparation method of buckwheat peanut wafer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113396955A (en) * 2021-07-07 2021-09-17 舟山馋文化电子商务有限公司 Additive-free leavening agent wafer biscuit and preparation method thereof
CN114946909A (en) * 2021-12-16 2022-08-30 中国人民解放军空军特色医学中心 Wafer biscuit with effect of relieving obesity
CN114946909B (en) * 2021-12-16 2023-08-29 中国人民解放军空军特色医学中心 Wafer biscuit with obesity relieving effect
CN115568486A (en) * 2022-10-21 2023-01-06 西北农林科技大学 Quinoa sandwich food and preparation method thereof

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