CN111834274A - Expansion device and expansion method - Google Patents

Expansion device and expansion method Download PDF

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Publication number
CN111834274A
CN111834274A CN202010273122.3A CN202010273122A CN111834274A CN 111834274 A CN111834274 A CN 111834274A CN 202010273122 A CN202010273122 A CN 202010273122A CN 111834274 A CN111834274 A CN 111834274A
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China
Prior art keywords
expanding
sheet
unit
air
workpiece
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CN202010273122.3A
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Chinese (zh)
Inventor
松田智人
川口吉洋
齐藤亮太
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Disco Corp
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Disco Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

Provided are an expanding device and an expanding method, which can efficiently contract an expanding sheet. The expanding device expands an expanding sheet of a processed object unit, the processed object unit comprises a processed object, an expanding sheet adhered to the processed object and an annular frame adhered to the outer periphery of the expanding sheet, the expanding device is provided with an expanding unit capable of expanding the expanding sheet and a sheet contracting unit for heating and contracting the expanding sheet, the sheet shrinking unit comprises a hot air outlet, an air supply path, a heating unit for heating the inside of the air supply path, and a valve for controlling the supply and interruption of air from an air supply source, the sheet contracting unit opens the valve to supply the air to the air supply passage, and can jet the heated air from the hot air jet port, the sheet shrinking unit can stop the air heated by the hot air jetting port from jetting without stopping the heating unit by closing the valve.

Description

Expansion device and expansion method
Technical Field
The present invention relates to an expanding apparatus and an expanding method for expanding an expanding sheet having an outer peripheral side attached to a ring frame.
Background
A plurality of planned dividing lines (also referred to as streets) intersecting each other are set on the front surface of a disk-shaped wafer, devices are formed in each region partitioned by the planned dividing lines, and then the wafer is divided along the planned dividing lines, whereby each device chip can be formed. The formed device chip is mounted on an electronic device or the like and used.
The wafer is divided, for example, by using a laser processing apparatus. For example, a laser beam having a wavelength that is transparent to the wafer is converged into the wafer along the lines to be divided, thereby forming modified layers as division starting points along the lines to be divided.
A sheet called an extension sheet is previously attached to the back surface side of the wafer. An annular frame made of metal or the like is attached to the outer peripheral side of the expansion sheet. When the wafer is bonded to the extension sheet, a workpiece unit is formed in which the wafer, the extension sheet, and the ring frame are integrated.
When the extension piece is extended radially outward in a state where the modified layer is formed inside the wafer along the planned dividing lines, the wafer is broken using the modified layer as a starting point to form device chips, and the space between the device chips is further extended. When the distance between the device chips is widened, the device chips are less likely to contact each other when the workpiece unit is transported later, and damage to the device chips is suppressed.
However, when the spread of the spread sheet is released, the spread sheet is loosened, and therefore, the following process called heat shrinkage is performed: the stretched sheet having the slack is heated to be thermally contracted (see, for example, patent documents 1 and 2). When the expansion sheet is contracted, the slack of the expansion sheet is reduced, thereby maintaining the interval between the device chips.
Patent document 1: japanese patent application laid-open No. 2010-206136
Patent document 2: japanese patent laid-open publication No. 2011-100920
Conventionally, when expanding the expanded pieces of a plurality of workpiece units one by one and contracting the expanded pieces, the operation and stop of the heating unit are repeated every time the expanded pieces are heated. In this case, the temperature of the heating unit decreases after the expansion sheet of a certain workpiece unit is shrunk until the expansion sheet of the next workpiece unit is shrunk.
When the temperature of the heating means is lower than the predetermined temperature, the expansion sheet cannot be appropriately contracted to a predetermined degree. Therefore, when the expansion sheet is shrunk, it is necessary to operate the heating means and wait until the temperature of the heating means reaches a predetermined temperature. When the expansion of the extension pieces is performed one by one, a problem of a decrease in processing efficiency due to a waiting time until the contraction of the extension pieces is performed is remarkable, and improvement is desired.
Disclosure of Invention
The present invention has been made in view of the above problems, and an object thereof is to provide an expanding apparatus and an expanding method capable of efficiently contracting an expanding sheet.
According to one aspect of the present invention, there is provided an expanding apparatus for expanding an expanding sheet of a workpiece unit including a workpiece, the expanding sheet attached to the workpiece, and a ring frame to which an outer peripheral side of the expanding sheet is attached, the expanding apparatus including: a frame holding unit capable of holding the annular frame of the workpiece unit; an expanding unit that can expand the expansion piece included in the workpiece unit having the annular frame held by the frame holding unit; and a sheet contracting unit that heats a region of the expanding sheet included in the workpiece unit having the annular frame held by the frame holding unit, the region being located between the outer periphery of the workpiece and the inner periphery of the annular frame, and contracts the region of the expanding sheet, thereby reducing the slack of the expanding sheet that is relaxed by the expansion by the expanding unit, the sheet contracting unit including: a hot air ejection port facing the extension sheet; an air supply path having one end communicating with the hot air ejection port and the other end connected to an air supply source; a heating unit that heats the inside of the air supply path, thereby heating the air supplied from the air supply source; a valve that controls supply and interruption of air from the air supply source; and a switch that switches heating and stopping of heating by the heating unit, the sheet contraction unit opens the valve to supply the air from the air supply source to the air supply path, the air is heated by the heating unit in the air supply path, and thus the heated air can be ejected from the hot air ejection port, and the sheet contraction unit closes the valve to block the supply of the air from the air supply source to the air supply path, and thus the ejection of the heated air from the hot air ejection port can be stopped without stopping the heating unit.
According to another aspect of the present invention, there is provided an expanding method for expanding an expanding sheet of a plurality of workpiece units one by one, the plurality of workpiece units each including a workpiece, the expanding sheet attached to the workpiece, and a ring frame to which an outer peripheral side of the expanding sheet is attached, the expanding method including the steps of: an expanding step of expanding the expansion piece by holding the annular frame; and a sheet shrinking step of, after the expanding step is performed, spraying air heated by a heating unit to a region of the expanded sheet located between the outer periphery of the workpiece and the inner periphery of the annular frame to shrink the region of the expanded sheet, thereby reducing slack of the expanded sheet generated in the expanding step, wherein the operation of the heating unit is not stopped while the expanding step and the sheet shrinking step are performed on the plurality of workpiece units one by one, and the sheet shrinking step is started by starting the spraying of the air and is ended by stopping the spraying of the air.
In the expanding device and the expanding method according to one aspect of the present invention, air is heated by the heating means, and the expanded sheet is heated by injecting the heated air. The air injection is stopped without stopping the heating means while the expansion sheet is not contracted. Therefore, the temperature of the heating unit is not lowered while the heating of the spread sheet is not performed.
In this case, when heating the extension sheet, it is not necessary to wait until the temperature of the heating means reaches a predetermined temperature. In the expanding apparatus and the expanding method according to one aspect of the present invention, the expansion and contraction of the expanding sheet of the workpiece unit can be performed in a short time, and therefore, the processing efficiency can be improved.
Therefore, according to the present invention, an expanding apparatus and an expanding method capable of efficiently contracting an expanding sheet are provided.
Drawings
Fig. 1 is a perspective view schematically showing an example of the expanding device.
Fig. 2 is a cross-sectional view schematically showing the expanding device into which the workpiece unit is carried.
FIG. 3 is a sectional view schematically showing the stent in a state where the stent sheet is fixed.
FIG. 4 is a sectional view schematically showing an expanding device for performing expansion of an expanding sheet.
Fig. 5 is a sectional view schematically showing a spreading device that performs heating of the spread sheet in which the slack is generated.
Description of the reference symbols
1: a workpiece; 3: a modified layer; 5: a device; 7: expanding the sheet; 7 a: DAF (die attach film); 9: a frame; 11: a workpiece unit; 13: dividing the groove; 15: a device chip; 2: an expansion device; 4: a frame holding unit; 6: a frame support portion; 6a, 8 a: an opening; 8: a frame pressing portion; 10. 26: a cylinder; 12. 28: a rod; 14: an extension unit; 16: a holding table; 18: an aspiration path; 20: a suction port; 22. 42: an opening and closing valve; 24: an attraction source; 30: a sheet contracting unit; 32: a rod; 32a, 34 a: an air supply tube; 34: a support plate; 36: a heating unit; 38: an air supply path; 38 a: a hot air ejection port; 40: an air supply source; 44: a coil heater; 46: a switch; 48: a rotary motor; 50: a rotating shaft; 52: a shutter; 52 a: and (4) opening.
Detailed Description
Embodiments of the present invention will be described with reference to the accompanying drawings. In the expanding apparatus and the expanding method according to the present embodiment, the expanding piece of the workpiece unit in which the workpiece, the expanding piece, and the ring frame are integrated is expanded. Fig. 2 and the like show a cross section of the workpiece unit 11.
The extension sheet 7 included in the workpiece unit 11 includes, for example, a base layer made of vinyl chloride, polyolefin, or the like and a paste layer supported by the base layer. The central region of one surface of the expansion sheet 7 is bonded to the workpiece 1. Further, the outer peripheral portion of the expanding sheet 7 is bonded to the inner peripheral portion of the annular frame 9 having the opening.
The workpiece 1 is, for example, a wafer made of silicon, SiC (silicon carbide), or other semiconductor material, or a substantially disk-shaped substrate made of sapphire, glass, quartz, or other material. The front surface of the workpiece 1 is divided into a plurality of regions by a plurality of lines to divide (streets) intersecting each other, and devices 5 such as ICs (integrated circuits) are formed in each of the divided regions. When the object 1 is divided along the lines to divide, the device chips can be formed.
The modified layer 3 is formed inside the workpiece 1 along the planned dividing line as a division start point. For example, the modified layer 3 may be formed by converging a laser beam having a wavelength that is transparent to the object 1 (a wavelength that can transmit the object 1) into the object 1 along the lines to divide.
When a force directed radially outward is applied to the object 1 having the modified layer 3 formed therein along the line to divide the object 1, cracks are generated from the modified layer 3 to the upper and lower surfaces of the object 1, and the object 1 is divided into the device chips 15 (see fig. 4 and the like). Then, in order to easily pick up the respective device chips 15 from the expansion sheet 7, the expansion sheet 7 is further expanded, thereby expanding the intervals between the device chips 15.
In addition, DAF (die attach film) may be provided in advance on the workpiece 1. The DAF is a film that functions as an adhesive when the device chip 15 is mounted on a predetermined mounting object. The expanding device can divide the object 1 provided with the DAF together with the DAF. In this case, the device chip 15 provided with the DAF is formed.
The expansion device of the present embodiment will be described with reference to fig. 1 to 5. Fig. 1 schematically shows a perspective view of the expanding device 2, and fig. 2 schematically shows a cross-sectional view of the expanding device 2 into which the workpiece unit 11 is carried.
The expansion device 2 includes: a frame holding unit 4 that fixes the annular frame 9 of the workpiece unit 11; and an expanding unit 14 capable of expanding the expanding sheet 7 of the workpiece unit 11. The expanding device 2 further includes a sheet contracting unit 30, and the sheet contracting unit 30 heats and contracts the expanding sheet 7 that has been expanded and relaxed, thereby reducing the relaxation. Hereinafter, each component of the expansion device 2 will be described in detail.
The frame holding unit 4 has a frame supporting portion 6 capable of supporting the annular frame 9 of the workpiece unit 11. The frame support portion 6 is a ring-shaped member having a flat upper surface, and has an opening 6a having a diameter corresponding to the diameter of the opening of the ring frame 9 at the center. The upper ends of a plurality of rods 12 are connected to the lower surface of the frame support portion 6, and the lower ends of the rods 12 are respectively housed in an elevating mechanism such as a cylinder 10. The frame support portion 6 can be moved up and down by moving the rod 12 up and down by operating the cylinder 10.
The frame holding unit 4 further includes an annular frame pressing portion 8 capable of sandwiching the annular frame 9 together with the frame supporting portion 6. The frame pressing portion 8 is an annular member having an opening 8a with the same diameter as the opening 6a of the frame support portion 6 at the center and a flat lower surface.
When the frame support portion 6 on which the ring frame 9 is placed is raised and the ring frame 9 is brought into contact with the lower surface of the frame pressing portion 8, the ring frame 9 is held between the frame support portion 6 and the frame pressing portion 8. The frame pressing part 8 can grip the ring frame 9 with a strong force so that the fixed ring frame 9 does not shift in position.
Further, the frame pressing portion 8 may be provided with a cooling mechanism capable of supplying cold air to the workpiece unit 11 held by the frame holding unit 4. When the extension piece 7 is cooled by the cooling mechanism in advance when the extension piece 7 is extended, the extension piece 7 can be hardened.
When the expansion piece 7 is expanded without hardening the expansion piece 7, the expansion piece 7 is stretched only in the region between the outer periphery of the workpiece 1 and the inner peripheral edge of the annular frame 9, and it is not easy to appropriately apply a force directed radially outward to the workpiece 1. Therefore, when the extension piece 7 is cooled and hardened by the cooling mechanism, the extension piece 7 becomes less likely to extend, and the extension piece 7 is extended by the extension unit 14 described below to appropriately apply the force to the workpiece 1, thereby dividing the workpiece 1.
The expanding means 14 can expand the expanding sheet 7 included in the workpiece unit 11 having the annular frame 9 held by the frame holding means 4. The extension unit 14 has a holding table 16 housed in the opening 6a of the frame support portion 6 of the frame holding unit 4. The workpiece 1 is placed on the upper surface of the holding table 16 via the extension sheet 7 included in the workpiece unit 11 having the annular frame 9 fixed to the frame holding unit 4.
The holding table 16 can hold the workpiece 1 by suction through the expanding sheet 7. A plurality of suction ports 20 are formed in the upper surface of the holding table 16, and a suction passage 18 connected to each suction port 20 is formed inside the holding table 16. The suction path 18 is connected to a suction source 24 disposed outside the holding table 16.
An on-off valve (valve) 22 is provided between the suction passage 18 and the suction source 24. When the opening/closing valve 22 is opened, the negative pressure generated by the suction source 24 can be applied to the object placed on the upper surface of the holding table 16 through the suction passage 18 and the suction port 20. That is, the suction path 18, the suction port 20, the opening/closing valve 22, the suction source 24, and the like function as holding means for holding the workpiece 1 by suction via the expanding sheet 7.
The upper ends of a plurality of rods 28 are connected to the lower surface of the holding table 16, and the lower ends of the rods 28 are respectively housed in an elevating mechanism such as an air cylinder 26. The holding table 16 can be moved up and down by moving the rod 28 up and down by operating the air cylinder 26. When the holding table 16 is raised in a state where the ring frame 9 is fixed to the frame holding unit 4, the extension piece 7 attached to the ring frame 9 is extended radially outward.
The sheet shrinking unit 30 heats and shrinks a region between the inner peripheral edge of the annular frame 9 of the expanded sheet 7, which is expanded and loosened, and the outer peripheral edge of the workpiece 1, thereby reducing the looseness of the expanded sheet 7. The sheet contracting unit 30 has: a rod 32 that supports the components of the sheet contracting unit 30 from above; a disc-shaped support plate 34 connected to a lower end of the rod 32; and a plurality of heating units 36 provided on the lower surface of the outer peripheral portion of the support plate 34.
The heating unit 36 has a function of heating air and ejecting the heated air downward. A cross section of the heating unit 36 is shown in fig. 2. The heating unit 36 includes an air supply passage 38, and the air supply passage 38 includes a cylindrical housing extending in the vertical direction.
An air supply source 40 is connected to an upper end of the air supply path 38 via an air supply pipe 34a provided inside the support plate 34 and an air supply pipe 32a provided inside the rod 32. An on-off valve (valve) 42 is provided between the air supply passage 38 and the air supply source 40, and when the on-off valve 42 is opened, air can be supplied from the air supply source 40 to the air supply passage 38.
A coil heater 44 is provided inside the air supply path 38 as a heat source for heating the air supplied from the air supply source 40. A hot air outlet 38a is provided on the lower surface of the air supply passage 38. The coil heater 44 is connected to a power supply and switch 46, and when the switch 46 is turned on and a current flows through the coil heater 44, heat is generated from the coil heater 44 to heat the air supplied from the air supply source 40.
When the opening/closing valve 42 is opened in a state where the coil heater 44 generates heat, air (hot air) heated by the coil heater 44 is discharged downward from the hot air discharge port 38 a. In the expanding apparatus 2 according to the present embodiment, the switch 46 is always turned on. The start and stop of the heated air supplied from the heating unit 36 to the extension piece 7 are controlled by controlling the opening and closing of the opening and closing valve 42.
For example, the switch 46 is turned on when the operation of the expanding device 2 is started, and the switch 46 is turned off when the operation of the expanding device 2 is finished after the expanding pieces 7 of the plurality of workpiece units 11 are expanded. Therefore, the air heated to a predetermined temperature or higher is stably discharged from the hot air discharge port 38 a.
The sheet contraction unit 30 includes a rotation motor 48 on a central lower surface of the support plate 34, and an upper end of a rotation shaft 50 along the vertical direction is attached to the rotation motor 48. A disc-shaped shutter 52 is connected to the lower end of the rotary shaft 50. The diameter of the disc-shaped shutter 52 is slightly smaller than the diameter of the opening 8a of the frame pressing portion 8 of the frame holding unit 4. The frame pressing portion 8 can be lifted and lowered relative to the shutter 52 in a state where the shutter 52 is accommodated in the opening 8 a.
The shutter 52 has a plurality of openings 52a (see fig. 1 and 5) in an arrangement corresponding to the arrangement of the plurality of heating units 36 in the support plate 34. For example, the support plate 34 has the heating units 36 at a plurality of fixed positions arranged at equal intervals, each of which has a predetermined radial length from the center of the lower surface of the support plate 34. The shield 52 has openings 52a in the same number as the number of the heating units 36 at a plurality of positions arranged at equal intervals, the radial length from the center of the shield 52 being the predetermined radial length.
The shield 52 has a function of preventing heat from the heating unit 36 from being unnecessarily transmitted to the workpiece unit 11. When it is desired to block the heat transfer from the heating unit 36 to the workpiece unit 11, the rotary motor 48 is operated to rotate the rotary shaft 50, and the shutter 52 is rotated to shift the positions of the heating units 36 from the positions of the openings 52 a.
When the expanding sheet 7 of the workpiece unit 11 that has been loosened is contracted by the sheet contraction unit 30, the shutter 52 is rotated to align the positions of the openings 52a with the positions of the heating units 36. The heated air is supplied to the extending sheet 7 through the hot air outlets 38a of the air supply path 38 of the heating unit 36 and the opening 52a of the mask 52.
The form of the shutter 52 is not limited to this. For example, the shutter 52 may have an opening/closing mechanism capable of opening and closing each opening 52 a. In this case, the sheet contracting unit 30 does not need to have the rotating motor 48 that rotates the shutter 52. Each heating unit 36 may have a shutter having an opening and closing mechanism below the hot air outlet 38a of the air supply passage 38.
A rotary motor, not shown, is connected to an upper end of the rod 32 of the sheet contracting unit 30. When the rotary motor is operated while heated air is supplied to the expansion sheet 7 by the heating means 36, the region between the object 1 to be processed of the expansion sheet 7, which has been expanded and loosened, and the inner peripheral edge of the ring frame 9 is heated along the entire circumference. The expansion sheet 7 contracts and the slack thereof decreases.
When the supply of air from the air supply source 40 to the air supply passage 38 is stopped by closing the open/close valve 42 after completion of contraction of the extending piece 7, the supply of heated air to the extending piece 7 can be stopped. At this time, the switch 46 does not need to be closed to stop the current flowing through the coil heater 44.
Further, by operating the rotary motor 48 to rotate the rotary shaft 50, the shutter 52 is rotated to shift the positions of the heating units 36 and the openings 52 a. In this case, the shield 52 enters between the air supply passage 38 and the expansion piece 7, and therefore, the heat transfer to the expansion piece 7 is more reliably shielded.
The sheet contraction unit 30 can inject the heated air from the hot air ejection port 38a by opening the opening/closing valve 42 (valve) to supply the air from the air supply source 40 to the air supply passage 38 and heating the air in the air supply passage 38 by the heating unit 36. Further, the sheet shrinking unit 30 closes the valve to block the supply of air from the air supply source 40 to the air supply path 38, and thus can stop the injection of the heated air from the hot air ejection port 38a without stopping the coil heater 44 of the heating unit 36.
Conventionally, the operation and stop of the heating unit 36 are repeated every time the heating of the extension piece 7 is performed when the extension pieces 7 of the plurality of workpiece units 11 are extended one by one and the extended extension pieces 7 are contracted. In this case, the temperature of the heating unit 36 decreases after the contraction of the extension sheet 7 of a certain workpiece unit 11 is performed until the contraction of the extension sheet 7 of the next workpiece unit 11 is performed.
When the temperature of the heating means 36 does not reach the predetermined temperature, the contraction of the extension sheet 7 cannot be uniformly performed to a predetermined degree. Therefore, when the expansion sheet 7 is contracted, it is necessary to wait until the temperature of the heating unit 36 reaches a predetermined temperature after the heating unit 36 is operated.
In contrast, in the expanding apparatus 2 of the present embodiment, after the contraction of the expanding sheet 7 is performed, the heating of the expanding sheet 7 can be stopped even in a state where the switch 46 of the coil heater 44 is turned on. While a new workpiece unit 11 is carried into the expanding device 2, the expanding sheet 7 is expanded, and the expanding sheet 7 is contracted, the coil heater 44 continues to generate heat at a predetermined output. Then, the heated air can be supplied to the expansion sheet 7 by opening the opening/closing valve 42.
Therefore, the temperature of the coil heater 44 does not decrease while the contraction of the extension sheet 7 is not performed, and therefore, the contraction of the extension sheet 7 can be started without waiting for the temperature of the coil heater 44 to increase to a predetermined temperature. Thus, according to the expanding apparatus 2 of the present embodiment, the expansion and contraction of the expanding sheet 7 of the workpiece unit 11 can be performed in a short time, and thus the processing efficiency can be improved.
However, the expanding apparatus 2 of the present embodiment may have a time period during which the switch 46 of the coil heater 44 is turned off while the expansion sheet 7 is not being contracted. In this case, the time required from the turning on of the switch 46 until the coil heater 44 rises to the predetermined temperature is considered, and the switch 46 is switched on by securing the time before the contraction of the expanding piece 7 is performed.
Next, an expanding method of the present embodiment will be described. This expansion method is implemented in the expansion device 2, for example. The expanding method of the present embodiment will be described below by taking a case of being implemented by the expanding device 2 as an example. In the expanding method, the expanding sheet 7 of each of a plurality of workpiece units 11 including the workpiece 1, the expanding sheet 7 attached to the workpiece 1, and the ring frame 9 attached to the outer peripheral side of the expanding sheet 7 is expanded one by one.
First, in the expanding method of the present embodiment, a loading step of loading the workpiece unit 11 into the expanding device 2 may be performed. Fig. 2 schematically shows the workpiece unit 11 and the expanding device 2 in a state of being carried into the expanding device 2. Fig. 2 and subsequent drawings show a cross-sectional view of a part of the components of the expansion device 2 and the like.
When the workpiece unit 11 is carried in, as shown in fig. 2, the annular frame 9 of the workpiece unit 11 is placed on the frame support portion 6 of the frame holding unit 4, and the workpiece 1 is placed on the holding table 16 via the expanding sheet 7.
Next, an expanding step of expanding the expanding piece 7 by holding the annular frame 9 of the workpiece unit 11 is performed. Fig. 3 is a sectional view schematically showing an expansion step. When the expanding piece 7 is expanded, first, the cylinder 10 is operated to raise the rod 12, and the frame support portion 6 is raised until the annular frame 9 abuts against the upper frame pressing portion 8. In this case, the annular frame 9 of the workpiece unit 11 is held between the frame supporting portion 6 and the frame pressing portion 8.
Subsequently, the expanding piece 7 is expanded radially outward. Fig. 4 shows a cross section of the expansion device 2 for expanding the expansion plate 7 and the expanded expansion plate 7. When the expanding piece 7 is expanded radially outward, the cylinder 26 of the expanding unit 14 is operated to raise the rod 28, and the holding table 16 is raised.
In this case, the extension piece 7 is extended to apply a force directed radially outward to the workpiece 1, so that cracks are generated in the vertical direction from the modified layer 3, and the workpiece 1 is divided from the modified layer 3 as a starting point. When the object 1 is divided, the device chips 15 each having the device 5 are formed. The device chip 15 continues to be held by the expansion sheet 7.
The expanding device 2 may have a cooling mechanism for cooling the workpiece unit 11 by cool air, and when expanding the expanding sheet 7, the workpiece unit 11 may be cooled inside the expanding device 2 by the cooling mechanism in advance. When the expansion piece 7 is cooled, the expansion piece 7 becomes hard, and when the expansion piece 7 is expanded radially outward, a force due to expansion tends to be applied to the workpiece 1 appropriately. After the expansion sheet 7 is expanded, the cooling of the expansion sheet 7 and the like is stopped.
Further, a cooling mechanism may be provided on the holding table 16 of the expansion device 2. In the case where the DAF is disposed on the workpiece 1, the cooling mechanism attached to the holding table 16 may be operated as necessary to cool the workpiece 1 through the extending piece 7. When the workpiece 1 is cooled, the extension of the DAF can be suppressed, and therefore the DAF can be easily divided together with the workpiece 1.
When the expansion of the expansion piece 7 is released, the cylinder 26 is operated to lower the rod 28, and the holding table 16 is lowered. Here, the opening/closing valve 22 is opened in advance after the expansion piece 7 is expanded and before the expansion of the expansion piece 7 is released. Then, the negative pressure generated by the suction source 24 is applied to the extension piece 7 of the workpiece unit 11 and the workpiece 1 via the suction path 18 and the suction port 20, and the extension piece 7 and the like are held on the holding table 16.
When the expansion of the expansion sheet 7 is released, a slack is generated in the expansion sheet 7. At this time, since the region of the expansion piece 7 overlapping the workpiece 1 is fixed by the holding mechanism of the holding table 16, as shown in fig. 5, slack is concentrated in the region between the outer periphery of the workpiece 1 of the expansion piece 7 and the inner peripheral edge of the annular frame 9.
Therefore, in order to reduce the slack, a sheet shrinking step of heating and shrinking the expansion sheet 7 is performed next. The process of shrinking the extended sheet 7 by heating is also referred to as heat shrinkage. Fig. 5 shows a cross-sectional view of the expanding device 2 and the expanding sheet 7 for heating the expanding sheet 7 after releasing the expansion thereof.
In the sheet shrinking step, the shutter 52 is rotated by operating the rotary motor 48, and the opening 52a is moved to the lower side of the heating unit 36. Then, the on-off valve 42 (valve) is opened to supply air from the air supply source 40 to the air supply passage 38. The switch 46 is opened in advance, and the coil heater 44 is heated to a predetermined temperature in advance. The switch 46 is opened, for example, at the same time as the activation of the expansion device 2.
When the air is supplied to the air supply path 38, the air is heated by the coil heater 44. The air heated inside the air supply passage 38 is ejected to the region of the spreading piece 7 where the slack is generated, through the hot air ejection port 38a of the air supply passage 38 and the opening 52a of the shroud. Next, when the lever 32 is rotated, the region of the expansion sheet 7 is heated along the entire region, and the slack is removed.
While the expansion device 2 is being operated, the switch 46 is always open, and the injection and stop of the heated air are switched by controlling the opening and closing of the open/close valve 42. The sheet shrinking step is started by starting the ejection of the air, and is ended by stopping the ejection of the air.
A certain time is required until the coil heater 44 reaches a predetermined temperature after the switch 46 is turned on, but when the switch 46 is always turned on, there is no need to wait for the temperature of the coil heater 44 to rise. Therefore, the opening and closing of the opening and closing valve 42 is controlled without switching the opening and closing of the switch 46, so that the start and stop of the sheet contraction step can be controlled.
When the heated air is ejected to the area of the expansion sheet 7 to be heated, the area of the expansion sheet 7 is contracted, so that the slack of the expansion sheet 7 generated in the expansion step can be reduced. In this case, when the operation of the holding mechanism holding the table 16 is stopped and the suction of the extension piece 7 is released, the extension piece 7 is maintained in the extended state in the region overlapping the workpiece 1.
When the slack of the spread sheet 7 is reduced, the distance between the device chips 15 is secured to be wide, and therefore, when the workpiece unit 11 is transported or the like later, the adjacent device chips 15 are less likely to contact each other, and damage to the device chips 15 is suppressed. After the sheet shrinking step is performed, the workpiece unit 11 is carried out of the expanding device 2, and the device chips 15 are picked up from the expanding sheet 7.
A new workpiece unit 11 is carried into the expanding device 2 from the outside. In the expanding apparatus 2, the expanding step and the sheet shrinking step are performed on the workpiece unit 11. As described above, in the expanding method of the present embodiment, the expanding step and the sheet shrinking step are performed on one of the plurality of workpiece units 11.
Here, while the expanding step and the slack eliminating step are performed on the plurality of workpiece units 11 one by one, the operation of the heating unit 36 is not stopped. The sheet contraction step is started by opening the on-off valve 42 (valve) to start the injection of the air, and is ended by closing the on-off valve 42 (valve) to stop the injection of the air.
Therefore, the temperature of the coil heater 44 is not lowered while the contraction of the extension sheet 7 is not performed, and therefore the sheet contraction step of the extension sheet 7 can be started without waiting for the temperature of the coil heater 44 to rise to a predetermined temperature. Thus, according to the expanding method of the present embodiment, expansion and contraction of the expanding sheet 7 of the workpiece unit 11 can be performed in a short time, and thus the processing efficiency can be improved.
The present invention is not limited to the above embodiments, and various modifications can be made. For example, in the above embodiment, the following case is explained: when the expansion piece 7 is expanded, the holding table 16 is raised in a state where the ring frame 9 is sandwiched between the frame supporting portion 6 and the frame pressing portion 8. However, one embodiment of the present invention is not limited to this.
For example, the expansion device 2 may have the following expansion mechanism: the expanding mechanism expands the expanding sheet 7 by pressing down an area inside the annular frame 9 of the expanding sheet 7 attached so as to seal the opening of the annular frame 9 from above. In this case, the direction of the workpiece unit 11 is adjusted so that the surface of the expanding sheet 7 to which the workpiece 1 is attached faces downward, and the workpiece unit 11 is carried into the expanding device 2.
The structure, method, and the like of the above embodiments may be appropriately modified and implemented without departing from the scope of the object of the present invention.

Claims (2)

1. An expanding apparatus for expanding an expanding sheet of a workpiece unit including a workpiece, the expanding sheet attached to the workpiece, and an annular frame to which an outer peripheral side of the expanding sheet is attached,
the expansion device has:
a frame holding unit capable of holding the annular frame of the workpiece unit;
an expanding unit that can expand the expansion piece included in the workpiece unit having the annular frame held by the frame holding unit; and
a sheet contracting unit that heats a region of the expanding sheet included in the workpiece unit having the annular frame held by the frame holding unit, the region being located between the outer periphery of the workpiece and the inner periphery of the annular frame, and contracts the region of the expanding sheet, thereby reducing the slack of the expanding sheet that is relaxed by the expansion by the expanding unit,
the sheet shrinkage unit includes:
a hot air ejection port facing the extension sheet;
an air supply path having one end communicating with the hot air ejection port and the other end connected to an air supply source;
a heating unit that heats the inside of the air supply path, thereby heating the air supplied from the air supply source;
a valve that controls supply and interruption of air from the air supply source; and
a switch that switches heating of the heating unit and stop of heating,
the sheet contracting unit opens the valve to supply the air from the air supply source to the air supply path, and the air is heated by the heating unit in the air supply path, whereby the heated air can be ejected from the hot air ejection port,
the sheet contracting unit closes the valve to block the supply of air from the air supply source to the air supply path, thereby stopping the ejection of the heated air from the hot air ejection port without stopping the heating unit.
2. An expanding method for expanding pieces of a plurality of object units to be processed one by one, the plurality of object units each including an object to be processed, the expanding piece attached to the object to be processed, and a ring frame to which an outer peripheral side of the expanding piece is attached,
the expanding method comprises the following steps:
an expanding step of expanding the expansion piece by holding the annular frame; and
a sheet shrinking step of, after the expanding step is performed, spraying air heated by a heating unit to a region of the expanded sheet between the outer periphery of the workpiece and the inner periphery of the ring frame to shrink the region of the expanded sheet, thereby reducing the slack of the expanded sheet generated in the expanding step,
while the expanding step and the sheet shrinking step are performed on the plurality of workpiece units one by one, the operation of the heating unit is not stopped,
the sheet shrinking step is started by starting the ejection of the air, and is ended by stopping the ejection of the air.
CN202010273122.3A 2019-04-15 2020-04-09 Expansion device and expansion method Pending CN111834274A (en)

Applications Claiming Priority (2)

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JP2019077153A JP7362202B2 (en) 2019-04-15 2019-04-15 Expanding device, expanding method

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JP4647831B2 (en) 2001-05-10 2011-03-09 株式会社ディスコ Workpiece division processing method and chip interval expansion apparatus used in the division processing method
JP4647830B2 (en) 2001-05-10 2011-03-09 株式会社ディスコ Workpiece division processing method and chip interval expansion apparatus used in the division processing method
JP5021553B2 (en) 2008-04-23 2012-09-12 リンテック株式会社 Sheet sticking device and sticking method
JP5791866B2 (en) 2009-03-06 2015-10-07 株式会社ディスコ Work dividing device
JP5409280B2 (en) 2009-11-09 2014-02-05 株式会社ディスコ Tip interval expansion method
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