CN111830295B - Device for testing electrical performance of micro-component - Google Patents
Device for testing electrical performance of micro-component Download PDFInfo
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- CN111830295B CN111830295B CN201910313185.4A CN201910313185A CN111830295B CN 111830295 B CN111830295 B CN 111830295B CN 201910313185 A CN201910313185 A CN 201910313185A CN 111830295 B CN111830295 B CN 111830295B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
Abstract
The application discloses a device of test microelement electrical property, the device includes: the array-arranged multiple probe test units comprise substrate units, first electrodes, piezoelectric films and second electrodes which are sequentially laminated; the first electrode and the second electrode generate a voltage difference to control the piezoelectric film to deform, and accordingly the probe test unit is controlled to bend towards one side. Through the mode, the micro-component electrical performance test can be realized, and the efficiency is higher.
Description
Technical Field
The present application relates to the field of testing technologies, and in particular, to a device for testing electrical performance of micro-components.
Background
In the process of manufacturing the display panel, in order to reduce the cost and improve the efficiency, a batch transfer technology is generally adopted to transfer the micro-components at present. To ensure the effectiveness of the batch transfer, the electrical performance of the microcomponents generally needs to be tested before the batch transfer to reject microcomponents whose electrical performance does not pass.
The inventor of the application finds that the surface structure is complex and has the conditions of high and low fluctuation and the like due to the small electrode size of the micro-component in the long-term research process; the traditional testing device has larger size of the testing needle, and the electrical performance of the micro-component is difficult to test; and the traditional testing device can only test single or a plurality of micro-components at a time, and has lower efficiency.
Disclosure of Invention
The technical problem that this application mainly solves is to provide a device of test microelement electric property, can realize microelement electric property test and efficiency is higher.
In order to solve the technical problems, one technical scheme adopted by the application is as follows: there is provided an apparatus for testing the electrical performance of a micro-component, the apparatus comprising: the array-arranged multiple probe test units comprise substrate units, first electrodes, piezoelectric films and second electrodes which are sequentially laminated; the first electrode and the second electrode generate a voltage difference to control the piezoelectric film to deform, and accordingly the probe test unit is controlled to bend towards one side.
And one side of each substrate unit, which is opposite to the first electrode, is concaved inwards to form a thinning area, the thinning areas, the first electrodes, the piezoelectric films and the second electrodes are in one-to-one correspondence, and orthographic projections of each group of thinning areas, the first electrodes, the piezoelectric films and the second electrodes on the substrate unit are provided with overlapping areas.
Wherein the substrate unit includes: the first base layer is provided with a plurality of through holes, and the first base layers of the adjacent probe test units are connected with each other; the second base layer is positioned between the first base layer and the first electrode and covers the holes, the second base layer corresponding to the holes forms the thinning area, the second base layer adjacent to the probe test unit is disconnected, and the second base layer deforms along with the deformation of the piezoelectric film.
Wherein the thickness of the second base layer is 0.5-20 microns.
The first electrode and the piezoelectric film are strip-shaped, the width of the piezoelectric film is larger than that of the first electrode, the piezoelectric film covers the first electrode in the width direction, and the first electrode and the second electrode are completely separated by the piezoelectric film.
Wherein, in the length direction, the first electrode protrudes from the piezoelectric film.
Wherein the probe test unit further comprises: and a third electrode extending from the second electrode to the first surface of the substrate unit, the third electrode being disposed on the first surface of the substrate unit in the same layer as the first electrode and having a predetermined interval.
In the row direction, the first electrodes corresponding to the adjacent probe test units are disconnected from each other, and the third electrodes corresponding to the adjacent probe test units are disconnected from each other; the first electrode corresponding to each probe test unit is led out through a first lead, the third electrode corresponding to each probe test unit is led out through a second lead, and each probe test unit is independently controlled through the first lead and the second lead.
In the row direction, the first electrodes corresponding to the adjacent probe test units are electrically connected through first metal wires, and the third electrodes corresponding to the adjacent probe test units are electrically connected through second metal wires; the first electrodes corresponding to all the probe test units are led out through a first lead, the third electrodes corresponding to all the probe test units are led out through a second lead, and all the probe test units are controlled uniformly through the first lead and the second lead.
Wherein the probe test unit further comprises: and the contact convex points are positioned on one side of the second electrode far away from the piezoelectric film and are contacted with the electrodes of the micro-component.
The beneficial effects of this application are: different from the situation of the prior art, the device for testing the electrical performance of the micro-component provided by the application comprises a plurality of probe test units arranged in an array, wherein each probe test unit comprises a substrate unit, a first electrode, a piezoelectric film and a second electrode which are sequentially stacked; when a voltage difference is generated between the first electrode and the second electrode, the piezoelectric film deforms, and the piezoelectric film drives the first electrode and the second electrode to deform, so that the probe test unit is bent towards one side. The bending degree of the probe test unit is adjusted by controlling the voltage difference between the first electrode and the second electrode, so that the contact reliability of the probe test unit and the electrodes of the micro-component is ensured, and the virtual connection problem of the probe test unit when the heights of the micro-component electrodes are inconsistent due to the factors such as structural design of the micro-component, wafer warpage, process fluctuation and the like is reduced; the electrical performance test of a plurality of micro-components with different heights can be simultaneously realized in a single test, so that the test efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Wherein:
FIG. 1 is a schematic diagram of an embodiment of an apparatus for testing electrical performance of a micro-device according to the present application;
FIG. 2 is a schematic view of the piezoelectric film of FIG. 1 after bending;
FIG. 3 is a schematic top view of an embodiment of the device for testing electrical performance of micro-devices of FIG. 1;
FIG. 4 is a schematic top view of another embodiment of the device for testing electrical properties of micro-components of FIG. 1;
FIG. 5 is a schematic top view of yet another embodiment of the apparatus for testing electrical properties of micro-components of FIG. 1;
FIG. 6 is a schematic flow chart diagram of an embodiment of a method for manufacturing an apparatus for testing electrical properties of micro-devices according to the present application;
FIG. 7 is a flow chart of an embodiment of a method for testing electrical performance of a micro device according to the present application;
fig. 8 is a schematic structural diagram of an embodiment corresponding to step S201 to step S203 in fig. 7.
Detailed Description
The following description of the technical solutions in the embodiments of the present application will be made clearly and completely with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
Referring to fig. 1-2, fig. 1 is a schematic structural diagram of an embodiment of an apparatus for testing electrical performance of micro-devices according to the present application, and fig. 2 is a schematic structural diagram of an embodiment of a piezoelectric film after bending in fig. 1, where the apparatus 1 includes: a plurality of probe test units 10 arranged in an array, the probe test units 10 including a substrate unit 100, a first electrode 102, a piezoelectric film 104, and a second electrode 106 sequentially stacked; the materials of the first electrode 102 and the second electrode 106 may be metals (for example, aluminum, copper, etc.), and the material of the piezoelectric film 104 may be an inorganic piezoelectric material (for example, quartz crystal, piezoelectric ceramic, etc.), an organic piezoelectric material (for example, vinylidene fluoride, etc.), or a composite piezoelectric material (for example, an inorganic piezoelectric material embedded in an organic piezoelectric material). The voltage difference generated by the first electrode 102 and the second electrode 106 is configured to control the piezoelectric film 104 to deform, and the piezoelectric film 104 drives the first electrode 102 and the second electrode 106 to deform, so that the corresponding probe testing unit 10 is controlled to bend towards one side (as shown in fig. 2). The bending degree of the probe test unit 10 is adjusted by controlling the voltage difference between the first electrode 102 and the second electrode 106, so that the reliability of the contact between the probe test unit 10 and the electrodes of the micro-component is ensured, and the virtual connection problem of the probe test unit 10 when the heights of the micro-component electrodes are inconsistent due to the factors such as the structural design of the micro-component, the warpage of a wafer, the process fluctuation and the like is reduced; the electrical performance test of a plurality of micro-components with different heights can be simultaneously realized in a single test, so that the test efficiency is improved.
In one embodiment, referring to fig. 1, the probe testing unit 10 provided in the present application further includes: the contact bump 108 is located on the side of the second electrode 106 away from the piezoelectric film 104 and contacts the electrode of the micro-component. The contact bumps 108 may be cylindrical, prismatic, etc., and the contact bumps 108 may ensure the contact area between the probe test unit 10 and the micro component, and accordingly improve the contact reliability between the probe test unit 10 and the electrodes of the micro component.
In yet another embodiment, referring to fig. 1, a side of each substrate unit 100 facing away from the first electrode 102 is concave to form a thinned area a, where the thinned areas a, the first electrode 102, the piezoelectric film 104, and the second electrode 106 are in one-to-one correspondence, and the orthographic projections of each set of thinned areas a, the first electrode 102, the piezoelectric film 104, and the second electrode 106 on the substrate unit 100 have overlapping areas. When the probe test unit 10 includes the contact bumps 108, the projection of the contact bumps 108 onto the substrate unit 100 may be located at the center of the overlap region. The above-mentioned thinned area a can enable the stacked first electrode 102, piezoelectric film 104 and second electrode 106 above the substrate unit 100 to form an overhead beam structure, and under the action of the voltage difference, the piezoelectric film 104 more easily drives the first electrode 102 and second electrode 106 to deform.
In an application scenario, please continue to refer to fig. 1, the substrate unit 100 includes: a first base layer 1000 and a second base layer 1002; the first base layer 1000 is provided with a plurality of through holes B, and the first base layers 1000 of adjacent probe test units 10 are connected to each other, i.e. all the first base layers 1000 in the device 1 are connected to each other, so as to form a monolithic plate structure. The second base layer 1002 is located between the first base layer 1000 and the first electrode 102, and covers the hole B, the second base layer 1002 corresponding to the hole B forms a thinned area a, the second base layer 1002 of the adjacent probe test unit 10 is disconnected, and the second base layer 1002 can deform along with the corresponding piezoelectric film 104. On the one hand, the design of stacking the first base layer 1000 and the second base layer 1002 and the design of interconnection between adjacent first base layers 1000 may make the preparation of the substrate unit 100 simpler; on the other hand, the design manner of breaking the second base layers 1002 of the adjacent probe test units 10 can reduce the influence of the adjacent probe test units 10 on each other during deformation, and reduce the probability of breaking the second base layers 1002. Of course, in other application scenarios, the second base layer 1002 may not be provided when the mechanical strength of the first electrode 102 is sufficiently high.
In this embodiment, the thickness of the second base layer 1002 is 0.5 microns to 20 microns, e.g., 0.5 microns, 5 microns, 10 microns, 20 microns, etc. The design may be such that the second base layer 1002 is sufficiently deformed by the piezoelectric film 104.
In another embodiment, referring to fig. 3, fig. 3 is a schematic top view of an embodiment of the apparatus for testing electrical properties of micro-devices in fig. 1. The first electrode 102 and the piezoelectric film 104 are stripe-shaped, the width of the piezoelectric film 104 is larger than the width of the first electrode 102, and in the width direction, the piezoelectric film 104 completely covers the first electrode 102, and the first electrode 102 and the second electrode 106 are completely separated by the piezoelectric film 104. In this embodiment, the portion of the piezoelectric film 104 having a width exceeding the first electrode 102 may extend to the surface of the substrate unit 100 (e.g., the first base layer 1000). In addition, the length of the first electrode 102 may be greater than the length of the piezoelectric film 104, and in the length direction, the first electrode 102 has an end portion protruding from the piezoelectric film 104, which may facilitate the later-stage wiring, i.e., the later-stage connection of the first electrode 102 to the first power supply voltage V1. At this time, in order to insulate the first electrode 102 from the second electrode 106, the length of the second electrode 106 may be equal to or less than the length of the piezoelectric film 104, and the second electrode 106 is controlled not to contact with the first electrode 102 and short-circuit. Since the first electrode 102 has been covered with the piezoelectric film 104 in the width direction, the width of the second electrode 106 at this time may be smaller than or equal to or larger than the width of the piezoelectric film 104.
In another embodiment, referring to fig. 3, in this embodiment, the probe testing unit 10 further includes: the third electrode 101 extends from the second electrode 106 to the first surface (not shown) of the substrate unit 100, and the third electrode 101 on the first surface of the substrate unit 100 is disposed in the same layer as the first electrode 102 and has a predetermined interval, where the predetermined interval can prevent a short circuit between the first electrode 102 and the third electrode 101. In the present embodiment, the second electrode 106 and the third electrode 101 are not clearly distinguished, and the third electrode 101 may be formed simultaneously when the second electrode 106 is formed, and the third electrode 101 may be disposed so as to facilitate the later-stage wiring, that is, the later-stage connection of the second electrode 106 to the second power supply voltage V2.
In an application scenario, please continue to refer to fig. 3, in the row direction X or the column direction Y, the first electrodes 102 corresponding to the adjacent probe test units 10 are disconnected from each other, and the third electrodes 101 corresponding to the adjacent probe test units 10 are disconnected from each other; the corresponding first electrode 102 of each probe test unit 10 is led out through one first lead 103, the first electrode 102 is connected to a first power supply voltage V1 through the first lead 103, the corresponding third electrode 101 of each probe test unit 10 is led out through one second lead 105, and the second electrode 106 is connected to a second power supply voltage V2 through the third electrode 101 and the second lead 105. In the row direction X or the column direction Y, each of the probe test units 10 is individually controlled by the first and second leads 103 and 105, and the voltage values of the first power voltages V1 connected to the adjacent probe test units 10 may be the same or different, and the voltage values of the second power voltages V2 connected to the adjacent probe test units 10 may be the same or different. At this time, each probe test unit 10 can adjust its bending degree according to the electrode height adaptability of its corresponding micro component.
In another application scenario, referring to fig. 4, fig. 4 is a schematic top view of another embodiment of the apparatus for testing electrical performance of micro-devices in fig. 1. In the present embodiment, in the row direction X or the column direction Y, the first electrodes 102 corresponding to the adjacent probe test units 10 are electrically connected through the first metal lines 200, and the third electrodes 101 corresponding to the adjacent probe test units 10 are electrically connected through the second metal lines 202; the first electrodes 102 corresponding to all the probe test units 10 are led out through a first lead 204, and the first electrodes 102 are connected to a first power supply voltage V3 through the first lead 204; all the corresponding third electrodes 101 of the probe test unit 10 are led out through one second lead 206, and the second electrode 106 is connected to the second power supply voltage V4 through the third electrodes 101 and the second lead 206. In the row direction X or the column direction Y, all the probe test units 10 are controlled uniformly by the first lead 204 and the second lead 206, the first power voltage V3 received by the adjacent probe test units 10 is the same, and the second power voltage V4 received by the adjacent probe test units 10 is the same. At this time, in order to ensure that all the probe test units 10 in the row direction are in good contact with the electrodes of the corresponding micro-components, the magnitudes of the first power supply voltage V3 and the second power supply voltage V4 are determined by the electrodes of the micro-component farthest from the probe test unit 10.
In yet another application scenario, referring to fig. 5, fig. 5 is a schematic top view of another embodiment of the apparatus for testing electrical properties of micro-components in fig. 1. In this embodiment, the first electrodes 102 corresponding to all the adjacent probe test units 10 in the device 1b are electrically connected through the first metal wire 300, the first electrodes 102 corresponding to all the probe test units 10 are led out through one first lead 304, and the first electrodes 102 are connected to the first power supply voltage V5 through the first lead 304. All the third electrodes 101 corresponding to the adjacent probe test units 10 in the device 1b are electrically connected through the second metal wire 302, all the third electrodes 101 corresponding to the probe test units 10 are led out through one second lead 306, and the second electrode 106 is connected to the second power supply voltage V6 through the third electrodes 101 and the second lead 306. In the whole device 1b, all the probe test units 10 are controlled uniformly through the first lead 304 and the second lead 306, the first power supply voltage V5 received by all the probe test units 10 is the same, and the second power supply voltage V6 received by all the probe test units 10 is the same. At this time, in order to ensure that all the probe test units 10 are in good contact with the electrodes of the corresponding micro-components, the magnitudes of the first power voltage V5 and the second power voltage V6 are determined by the electrodes of the micro-component farthest from the probe test unit 10.
Referring to fig. 6, fig. 6 is a schematic flow chart of an embodiment of a method for preparing an apparatus for testing electrical properties of micro-devices according to the present application, the method comprising:
s101: first electrodes are formed on surfaces of a plurality of substrate units arranged in an array. Specifically, the first electrode may be formed on the surfaces of the plurality of substrate units using an etching or lift-off (lift-off) process or the like; the first electrodes corresponding to the adjacent substrate units are disconnected from each other. It should be noted that, the disconnection referred to herein refers to a disconnection on the first electrode film layer, and is not referred to in terms of electrical connection.
S102: a piezoelectric film is formed on a side of the first electrode away from the substrate unit. Specifically, a whole layer of piezoelectric film can be formed on the surface of the first electrode, which is far away from the substrate unit, and then the patterned piezoelectric film is formed through photoetching and dry etching (or wet etching), wherein the piezoelectric films corresponding to the adjacent substrate units are disconnected with each other.
S103: forming a second electrode on one side of the piezoelectric film away from the first electrode; the first electrode and the second electrode generate a voltage difference to be configured to control the piezoelectric film to deform, and accordingly control the probe test unit to bend towards one side. Specifically, the second electrode may be formed on the surface of the piezoelectric film by etching or lift-off (lift-off) or the like.
In one embodiment, after the step S103, the preparation method provided in the present application further includes: forming a contact bump on one side of the second electrode away from the piezoelectric film; the contact bumps may be formed by a lift-off process.
In another embodiment, when the structure of the substrate unit is as shown in fig. 1, that is, includes a first base layer and a second base layer, the step S102 includes: providing a first base layer (e.g., a silicon-based layer); a third base layer (for example, a silicon oxide base layer) is formed on the surface of the first base layer, and the third base layer is etched, and is divided into a plurality of mutually independent second base layers. The step S101 specifically includes: first electrodes are formed on the surfaces of a plurality of second base layers arranged in an array. After the step S103, the preparation method provided in the present application further includes: and etching one side of the first base layer, which is away from the first electrode, to form a through hole, wherein the hole corresponds to the second base layer one by one, and the size of the hole is smaller than that of the second base layer.
Referring to fig. 7-8, fig. 7 is a flow chart illustrating an embodiment of a method for testing electrical performance of a micro device according to the present application, and fig. 8 is a structural diagram illustrating an embodiment corresponding to step S201-step S203 in fig. 7. The micro-component referred to in the present application may be a micro LED chip, and the LED chip may be a vertical LED chip or a lateral LED chip, and the test method includes:
s201: a conductive substrate 40 is provided, and a plurality of micro-components 42a, 42b, 42c arranged in an array are disposed on the conductive substrate 40. In particular, as shown in fig. 8 a. One of the electrodes of the plurality of micro-components 42a, 42b, 42c is in contact with the conductive substrate 40, and the height of the plurality of micro-components 42a, 42b, 42c may be non-uniform, e.g., the height of the micro-component 42b is less than the height of the micro-components 42a and 42c.
S202: the plurality of probe test units 10a, 10b, 10c in the device 1 for testing the electrical performance of micro-components are aligned with the plurality of micro-components 42a, 42b, 42c, one probe test unit 10a or 10b or 10c corresponding to one micro-component 42a or 42b or 42c. In particular, as shown in FIG. 8b
S203: the device 1 is brought close to the conductive substrate 40, when the distance between the device 1 and one micro-component 42a or 42b or 42c on the conductive substrate 40 is smaller than a threshold value, a first electrode 102 of the plurality of probe test units 10a, 10b, 10c in the device 1 is connected to a first power supply voltage, a second electrode 106 of the plurality of probe test units 10a, 10b, 10c in the device 1 is connected to a second power supply voltage, and the piezoelectric film 104 is bent towards the micro-component 42a, 42b, 42c side under the driving of a voltage difference, and a corresponding contact bump 108 is in contact with the other electrode of the micro-component 42a or 42b or 42c. Specifically, as shown in fig. 8c, in the present embodiment, the height of the micro-component 42b is smaller than the heights of the micro-components 42a and 42c, at this time, the deformation of the probe test unit 10b corresponding to the micro-component 42b is larger than the other two, the voltage difference corresponding to the probe test unit 10b is larger than the other two, or the voltage difference required for the probe test unit 10b to contact with the micro-component 42b when the voltage differences of all the probe test units 10a, 10b, and 10c are the same.
S204: the plurality of micro-components 42a, 42b, 42c are tested for electrical performance. At this time, the conductive temporary substrate 40 and the contact bump 108 apply a test voltage/test current simultaneously to both electrodes of the micro-component 42a, 42b, 42c, while the contact bump 108 is at the same voltage as the second electrode 106.
The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the patent application, and all equivalent structures or equivalent processes using the descriptions and the contents of the present application or other related technical fields are included in the scope of the patent application.
Claims (6)
1. An apparatus for testing the electrical performance of a micro-component, the apparatus comprising:
the array-arranged multiple probe test units comprise substrate units, first electrodes, piezoelectric films and second electrodes which are sequentially laminated;
wherein, the voltage difference generated by the first electrode and the second electrode is configured to control the piezoelectric film to deform, and correspondingly control the probe test unit to bend towards one side;
the first electrode and the piezoelectric film are strip-shaped, the width of the piezoelectric film is larger than that of the first electrode, the piezoelectric film covers the first electrode in the width direction, and the first electrode and the second electrode are completely separated by the piezoelectric film;
in the length direction, the first electrode protrudes out of the piezoelectric film, and the length of the second electrode is smaller than or equal to the length of the piezoelectric film;
one side of each substrate unit, which is opposite to the first electrode, is concave inwards to form a thinning area;
the thinning areas, the first electrodes, the piezoelectric thin films and the second electrodes are in one-to-one correspondence, and orthographic projections of each group of the thinning areas, the first electrodes, the piezoelectric thin films and the second electrodes on the substrate unit are provided with overlapping areas;
the first base layer is provided with a plurality of through holes, and the first base layers of the adjacent probe test units are connected with each other;
the second base layer is positioned between the first base layer and the first electrode and covers the holes, the second base layer corresponding to the holes forms the thinning area, the second base layer adjacent to the probe test unit is disconnected, and the second base layer deforms along with the deformation of the piezoelectric film.
2. The apparatus of claim 1, wherein the device comprises a plurality of sensors,
the thickness of the second base layer is 0.5-20 microns.
3. The apparatus of claim 1, wherein the probe test unit further comprises:
and a third electrode extending from the second electrode to the first surface of the substrate unit, the third electrode being disposed on the first surface of the substrate unit in the same layer as the first electrode and having a predetermined interval.
4. The apparatus of claim 3, wherein the device comprises a plurality of sensors,
in the row direction, the first electrodes corresponding to the adjacent probe test units are disconnected from each other, and the third electrodes corresponding to the adjacent probe test units are disconnected from each other; the first electrode corresponding to each probe test unit is led out through a first lead, the third electrode corresponding to each probe test unit is led out through a second lead, and each probe test unit is independently controlled through the first lead and the second lead.
5. The apparatus of claim 3, wherein the device comprises a plurality of sensors,
in the row direction, the first electrodes corresponding to the adjacent probe test units are electrically connected through first metal wires, and the third electrodes corresponding to the adjacent probe test units are electrically connected through second metal wires; the first electrodes corresponding to all the probe test units are led out through a first lead, the third electrodes corresponding to all the probe test units are led out through a second lead, and all the probe test units are controlled uniformly through the first lead and the second lead.
6. The apparatus of claim 1, wherein the probe test unit further comprises:
and the contact convex points are positioned on one side of the second electrode far away from the piezoelectric film and are contacted with the electrodes of the micro-component.
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| CN112750714B (en) * | 2020-12-31 | 2021-11-23 | 深圳市思坦科技有限公司 | LED chip detection method |
| CN114441918B (en) * | 2022-01-07 | 2023-03-24 | 强一半导体（苏州）有限公司 | Prevent film probe head and film probe card that probe drops |
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