CN111823452A - Cleaning method for lead frame packaging and encapsulating mold based on resin gasket - Google Patents
Cleaning method for lead frame packaging and encapsulating mold based on resin gasket Download PDFInfo
- Publication number
- CN111823452A CN111823452A CN202010553600.6A CN202010553600A CN111823452A CN 111823452 A CN111823452 A CN 111823452A CN 202010553600 A CN202010553600 A CN 202010553600A CN 111823452 A CN111823452 A CN 111823452A
- Authority
- CN
- China
- Prior art keywords
- mold
- cleaning
- resin
- resin gasket
- injection molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
- B29C33/722—Compositions for cleaning moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1753—Cleaning or purging, e.g. of the injection unit
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3406—Components, e.g. resistors
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention provides a method for cleaning a lead frame packaging and encapsulating mold based on a resin gasket. The method can obviously simplify the technological process of encapsulating, packaging and cleaning the die for chip packaging, provide the cleaning quality of the die, reduce the packaging cost and shorten the processing period. The method provided by the invention also solves the problem of incomplete injection molding in the prior art through the design of the resin gasket exhaust port.
Description
Technical Field
The invention belongs to the technical field of microelectronic industry, particularly relates to the technical field of substrate packaging in the microelectronic industry, and particularly relates to a cleaning method of a lead frame packaging and encapsulating mold based on a resin gasket.
Background
The basic manufacturing flow of chips generally consists of die Bonding, Wire Bonding, Encapsulation and Testing. The packaging is to wrap the integrated circuit by using packaging materials to play a role in protection and isolation. In a chip packaging process chain, a packaging process is a process for plastically packaging, fixing and protecting an exposed chip and a lead, and plays a very critical role in the whole packaging process.
The mold is a place for molding and curing the plastic packaging material. Due to the action of heat, small molecular substances in the plastic packaging material can volatilize and be enriched on the die. Long-term heating can denature, cure or even carbonize these small molecules. Pollutants attached to the surface of the mold can obviously affect the flowability of the plastic packaging material in the mold cavity of the mold, so that the plastic packaging effect is affected. If carbon deposition is generated, the insoluble solid particles may flow into the chip along with EMC, and may impact gold wires, the chip and the like, thereby causing quality hidden trouble. Since mold contamination affects products and processes, such as pitted surface, poor plastic encapsulation, gold wire displacement, chip cracking, and other quality problems are common, the mold needs to be cleaned periodically.
CN109433741A discloses a method for cleaning a chip packaging mold by using dry ice, which aims to solve the problem that packaging plastics remain on the chip packaging mold and reduce the quality of a chip packaged product.
CN1225349C discloses a method for removing stains on the surface of a mold in molding a curable resin molding material, which comprises using a melamine-containing resin as a mold cleaning resin.
The conventional mold cleaning method disclosed in the prior art includes five steps: the cleaning process is shown in fig. 1, and comprises the steps of normal cleaning (normal cleaning) → tank cleaning (pot cleaning) → cake cleaning (sheet cleaning) → wax mold cleaning (wax cleaning). The method has long cleaning time, consumes more cleaning materials (melamine), has unstable cleaning quality and is easy to cause mold blockage.
The methods disclosed in the prior art only can clean the plane of the mold first and then clean the injection molding sleeve, and the operation is complicated.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the invention provides a cleaning method of a lead frame packaging and encapsulating mold based on a resin gasket, which aims to solve the technical problems that the traditional mold cleaning method is long in time consumption, consumes a large amount of cleaning materials and is unstable in mold cleaning quality.
The technical scheme adopted by the invention for solving the technical problems is as follows: the invention provides a method for cleaning a lead frame packaging and encapsulating mold based on a resin gasket, which comprises the following steps:
(1) and (3) conventional cleaning: putting melamine particles into a mold sleeve, putting a resin gasket on the surface of the mold, closing the mold, and opening an injection molding cleaning procedure;
(2) wax pattern washing: and putting a wax mold material and a resin gasket, closing the mold, and opening an injection molding cleaning procedure.
Further preferably, the wax molding compound in the step (2) is HITACHI RP-2.
Further preferably, the conventional cleaning in the step (1) is performed for more than 4 modules;
and (3) washing the wax pattern for more than 2 times.
Further preferably, the method comprises: putting melamine particles into a mold sleeve, putting a resin gasket on the surface of a mold, closing the mold, starting an injection molding cleaning procedure, taking out the melamine particles after the injection molding cleaning procedure is finished, and repeating the operation for more than 4 times; and (3) putting a wax mold material and a resin gasket in the step (2), closing the mold, opening an injection molding cleaning program, taking out and checking after the injection molding cleaning program is finished, repeating the step (2) for 2 times, and finishing the cleaning process after the checking.
Further, in the above method, the resin gasket in steps (1) and (2) has the characteristics of high temperature resistance of 200 ℃ and 30-ton injection molding pressure resistance.
Further, in the above method, the resin gasket is prepared by the following method:
(1) designing and drawing a resin gasket drawing based on a lead frame and an encapsulation injection molding drawing;
(2) the material is obtained by adopting a special resin compression molding mode and then machining; preferably, the special resin is a resin having a high temperature resistance (200 ℃) and a high pressure resistance (30 ton injection pressure).
Preferably, in the method for manufacturing the resin gasket, the position of the flow gate end surface is shifted outwards by 0.738-0.739 mm (as shown in fig. 5) in the design of the resin gasket, and the exhaust position is generated by the shift, and the exhaust port is not opened on the opposite side. And processing and molding the plane resin sheet by carving.
The step (1) of designing and drawing the resin gasket drawing based on the lead frame and the encapsulation injection molding drawing refers to drawing the resin gasket drawing with consistent size according to the lead frame and the encapsulation injection molding drawing.
The invention has the beneficial effects that:
firstly, compared with the traditional scheme that the surface of a mold is firstly coated with dust-free paper and matched with melamine to clean the surface of the mold, and then the injection molding rod is cleaned by the dust-free paper and matched with the melamine, the scheme of the invention can simultaneously clean the surface and the cavity by putting the melamine into the mold and putting the resin gasket on the working surface of the mold and using a direct injection molding mode, thereby omitting two steps of tank cleaning (pot clean) and cake cleaning (sheet clean) in the prior art, remarkably reducing the usage amount of granular melamine and flaky melamine, greatly shortening the cleaning time, and saving the cleaning time by more than 30 percent.
Secondly, after the mold cleaning resin gasket is added, the technical scheme has the beneficial effects that the mold cleaning material is smoothly demoulded, and the melamine resin is not adhered and the mold is not blocked.
Thirdly, the resin gasket used in the scheme of the invention has the characteristics of high temperature resistance (200 ℃) and high pressure resistance (30 tons of injection molding pressure), does not deform, does not generate adhesive substances under high temperature and high pressure, does not generate additional pollution, and also has the function of helping the cleaning material to demould.
Fourthly, the invention adopts the design of the exhaust port to solve the problem of incomplete injection molding. The traditional cleaning mould material has no exhaust design, the cleaning injection pressure can only reach about 50% of the normal injection pressure, and the resin gasket exhaust port design is added in the design, so that the cleaning injection pressure can reach the normal injection pressure (usually more than 30 tons), the flowability of the melamine of the cleaning material is improved, and the cleaning effect is enhanced.
The resin gasket and the special resin gasket can be prepared by the method disclosed by the prior art or the method provided by the invention. The prior art, for example, the specification of patent CN109135191B, discloses a method for preparing the resin gasket, and the disclosure of the resin gasket is incorporated by reference into the present invention.
Drawings
The technical solution of the present application is further explained below with reference to the drawings and the embodiments.
Fig. 1 is a flow chart of a conventional cleaning process for a package encapsulation mold;
FIG. 2 is a flow chart of a cleaning process for a resin pad based lead frame package encapsulation mold provided by the present invention;
fig. 3 is a design drawing and a photographic image of a mold wash resin shim for a TSOP 482 x 12 lead frame design according to example 1 of the present invention;
wherein the resin spacer matrix 2 × 12, the size 215.7 × 57.66 × 0.12, the unit mm, and the thickness 0.12 ± 0.015mm, fig. 3A is a photograph of the resin spacer product, and fig. 3B is a design drawing corresponding to fig. 3A.
Fig. 4 is a graph showing the effect of embodiment 2 of the present invention after cleaning the TSOP 482 × 12 lead frame package encapsulation mold based on the resin pad;
FIG. 5 is a partial layout of resin pad design and leadframe parameter comparison; the position of the flow gate end face is shifted outwardly by 0.738-0.739 mm as shown, and this shift creates a venting position with the EMC gate inside and the vent opposite.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
The resin mats used in the following examples may be prepared by the method disclosed in the specification of CN109135191B, or by the method mentioned in the present invention.
Example 1 mold wash resin shim design for TSOP 482 x 12 lead frame
(1) Designing and drawing a resin gasket drawing sheet (shown in figure 3B) with matched sizes according to the TSOP 482 x 12 lead frame and the encapsulation injection molding drawing sheet;
(2) then, after the special resin gasket is pressed and formed, the mold-washing resin gasket is obtained by machining (as shown in fig. 3A).
The special resin gasket is prepared by the following method:
s1: glue mixing: adding 8-40 parts by weight of epoxy resin, 10-30 parts by weight of quartz powder, 2-10 parts by weight of aluminum oxide and 1-8 parts by weight of calcium oxide into a solvent, stirring for dissolving, adding 1-8 parts by weight of a curing agent, and uniformly dispersing to obtain a resin glue solution;
s2: gum dipping: soaking 10-60 parts by weight of fiber glass cloth into the prepared resin glue solution to obtain the dipped cloth, and controlling the dipping amount to be 50-70g/m2；
S3: semi-curing: drying the dipped cloth, and controlling the pre-curing degree to be 30-50% to prepare a prepreg;
s4: stacking and pressing: and laminating a plurality of prepregs layer by layer, heating, laminating at the same time, keeping the temperature for a period of time, stopping heating, and cooling to obtain the resin gasket with the thickness of 0.12 mm.
Example 2 method for cleaning TSOP 482 x 12 lead frame package encapsulation mold based on resin gasket
(1) Putting melamine particles into a mold sleeve, putting the resin gasket prepared in the embodiment 1 on the surface of a mold, closing the mold, starting an injection molding cleaning procedure, taking out the resin gasket after the injection molding pressure is 30 tons, and repeating the operation for more than 4 times;
(2) then put WAX (WAX mold) material and the resin gasket prepared in example 1, close the mold, open the injection cleaning procedure with the injection pressure of 30 tons, take out and inspect after completion, repeat the above steps for 2 times, and complete the cleaning process after inspection. The effect of the product after washing is shown in figure 4.
In light of the foregoing description of the preferred embodiments according to the present application, it is to be understood that various changes and modifications may be made without departing from the spirit and scope of the invention. The technical scope of the present application is not limited to the contents of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. A lead frame packaging and packaging mold cleaning method based on a resin gasket is characterized by comprising the following steps:
(1) and (3) conventional cleaning: putting melamine particles into a mold sleeve, putting a resin gasket on the surface of the mold, closing the mold, and opening an injection molding cleaning procedure;
(2) wax pattern washing: and putting a wax mold material and a resin gasket, closing the mold, and opening an injection molding cleaning procedure.
2. The method of claim 1, wherein the wax molding compound of step (2) is HITACHIRP-2.
3. The method of claim 1, wherein the regular cleaning in step (1) is performed in 4 or more modules.
4. The method according to claim 1, wherein the wax pattern washing in step (2) is performed 2 or more times.
5. The method according to claim 1, wherein the step (1) comprises placing melamine particles into a mold sleeve, placing a resin gasket on the surface of the mold, closing the mold, opening an injection molding cleaning procedure, taking out the resin gasket after completion, and repeating the procedure for more than 4 times; and (3) putting a wax mold material and a resin gasket in the step (2), closing the mold, opening an injection molding cleaning program, taking out and checking after the injection molding cleaning program is finished, repeating the step (2) for 2 times, and finishing the cleaning process after the checking.
6. The method according to any one of claims 1 to 5, wherein the resin gasket obtained in steps (1) and (2) has a high temperature resistance of 200 ℃ and a 30 ton injection molding pressure resistance.
7. The method according to any one of claims 1 to 5, wherein the resin gasket is prepared by:
(1) designing and drawing a resin gasket drawing based on a lead frame and an encapsulation injection molding drawing;
(2) the high-temperature-resistant and injection-molding-pressure-resistant composite material is obtained by adopting a machining mode after being pressed and molded by resin with the characteristics of resisting high temperature of 200 ℃ and resisting injection pressure of 30 tons.
8. The method of claim 7, wherein step (1) moves the position of the flow gate end face outward during the resin shim design to create the exhaust location without further venting of the exhaust port opposite the flow gate end face.
9. The method of claim 8, wherein step (1) moves the position of the flow gate end face outward by 0.738 to 0.739mm during the design of the resin shim to create the venting position.
10. The method according to any one of claims 8 to 9, wherein the step (2) is carried out by engraving on the planar resin sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010553600.6A CN111823452A (en) | 2020-06-17 | 2020-06-17 | Cleaning method for lead frame packaging and encapsulating mold based on resin gasket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010553600.6A CN111823452A (en) | 2020-06-17 | 2020-06-17 | Cleaning method for lead frame packaging and encapsulating mold based on resin gasket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111823452A true CN111823452A (en) | 2020-10-27 |
Family
ID=72899018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010553600.6A Pending CN111823452A (en) | 2020-06-17 | 2020-06-17 | Cleaning method for lead frame packaging and encapsulating mold based on resin gasket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111823452A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112847973A (en) * | 2021-01-06 | 2021-05-28 | 珠海格力新元电子有限公司 | Mold cleaning method |
| TWI835120B (en) * | 2021-06-14 | 2024-03-11 | 日商Ｔｏｗａ股份有限公司 | Manufacturing method of resin molded products |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03202327A (en) * | 1989-12-28 | 1991-09-04 | Toowa Kk | Cleaning process of mold face for molding resin, sheet member for cleaning used in same process and continuous automatic resin-molding process |
| CN1194199A (en) * | 1997-03-20 | 1998-09-30 | 超丰电子股份有限公司 | Mold washing method improvement for thermosetting plastic injection forming mold |
| JP2001062846A (en) * | 1999-08-31 | 2001-03-13 | Towa Corp | Sheet for cleaning and mold cleaning method |
| US20020171173A1 (en) * | 2001-05-18 | 2002-11-21 | Kiyoshi Tsuchida | Mold cleaning sheet and manufacturing method of a semiconductor device using the same |
| JP2007208158A (en) * | 2006-02-06 | 2007-08-16 | Renesas Technology Corp | Molding mold cleaning sheet and manufacturing method of semiconductor device |
| CN101396853A (en) * | 2007-09-26 | 2009-04-01 | 中芯国际集成电路制造(上海)有限公司 | Frame for cleaning plastic packaging mold and method for cleaning plastic packaging mold |
| JP2009141294A (en) * | 2007-12-11 | 2009-06-25 | Towa Corp | Method of cleaning metal mold |
| CN103817836A (en) * | 2014-02-18 | 2014-05-28 | 成都先进功率半导体股份有限公司 | Semiconductor die cleaning method |
-
2020
- 2020-06-17 CN CN202010553600.6A patent/CN111823452A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03202327A (en) * | 1989-12-28 | 1991-09-04 | Toowa Kk | Cleaning process of mold face for molding resin, sheet member for cleaning used in same process and continuous automatic resin-molding process |
| CN1194199A (en) * | 1997-03-20 | 1998-09-30 | 超丰电子股份有限公司 | Mold washing method improvement for thermosetting plastic injection forming mold |
| JP2001062846A (en) * | 1999-08-31 | 2001-03-13 | Towa Corp | Sheet for cleaning and mold cleaning method |
| US20020171173A1 (en) * | 2001-05-18 | 2002-11-21 | Kiyoshi Tsuchida | Mold cleaning sheet and manufacturing method of a semiconductor device using the same |
| JP2007208158A (en) * | 2006-02-06 | 2007-08-16 | Renesas Technology Corp | Molding mold cleaning sheet and manufacturing method of semiconductor device |
| CN101396853A (en) * | 2007-09-26 | 2009-04-01 | 中芯国际集成电路制造(上海)有限公司 | Frame for cleaning plastic packaging mold and method for cleaning plastic packaging mold |
| JP2009141294A (en) * | 2007-12-11 | 2009-06-25 | Towa Corp | Method of cleaning metal mold |
| CN103817836A (en) * | 2014-02-18 | 2014-05-28 | 成都先进功率半导体股份有限公司 | Semiconductor die cleaning method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112847973A (en) * | 2021-01-06 | 2021-05-28 | 珠海格力新元电子有限公司 | Mold cleaning method |
| TWI835120B (en) * | 2021-06-14 | 2024-03-11 | 日商Ｔｏｗａ股份有限公司 | Manufacturing method of resin molded products |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111823452A (en) | Cleaning method for lead frame packaging and encapsulating mold based on resin gasket | |
| US20090162467A1 (en) | Resin Sealing/Molding Apparatus | |
| US7947530B2 (en) | Method of manufacturing wafer level package including coating and removing resin over the dicing lines | |
| JP2007307766A5 (en) | ||
| JP2007109831A (en) | Resin sealing molding method for electronic component | |
| JP6560498B2 (en) | Resin sealing method and resin molded product manufacturing method | |
| CN106128965A (en) | A kind of manufacture method of device without substrate package | |
| US5837558A (en) | Integrated circuit chip packaging method | |
| US7863094B2 (en) | Method for removing bubbles from adhesive layer of semiconductor chip package | |
| JP7465829B2 (en) | Manufacturing method of resin molded product, molding die and resin molding device | |
| CN111673960A (en) | Substrate packaging and encapsulating mold cleaning method based on resin gasket | |
| JPH01101363A (en) | Epoxy resin composition and semiconductor device using said resin composition | |
| JP2000021908A (en) | Manufacture of resin sealing-type electronic part | |
| TW201017779A (en) | Manufacturing process for improvement on warpage of molded packaging parts in fields of semiconductors and photo-electrics | |
| CN113085091A (en) | Mold, molding method of photocuring adhesive and packaging method of circuit board | |
| CN112908865A (en) | Method for removing bubbles from chip adhesive layer of semiconductor package | |
| EP0844655A2 (en) | An integrated circuit chip packaging method | |
| JP2001148447A (en) | Resin-sealed semiconductor device and method of manufacturing the same | |
| CN1167123C (en) | Semiconductor package whose package sealant possesses shoulder portion and mould for packaging said semiconductor package | |
| KR102274604B1 (en) | Melamine Resin Composition for Cleaning Semiconductor Mold | |
| US20030034049A1 (en) | Cleaning substrate for cleaning and regenerating a mold | |
| JP7530871B2 (en) | Manufacturing method of resin molded products | |
| US20110057329A1 (en) | Electronic device and manufacturing method of electronic device | |
| CN103698969B (en) | Light-resistance wall forming method | |
| Chou et al. | Optimum conditions of molding VFBGA chips with very minimal gold wire damage using the Taguchi methods |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201027 |
|
| RJ01 | Rejection of invention patent application after publication |