CN111822880A - Ultrafast laser processing device and processing method for high-brightness metal - Google Patents
Ultrafast laser processing device and processing method for high-brightness metal Download PDFInfo
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- CN111822880A CN111822880A CN202010589111.6A CN202010589111A CN111822880A CN 111822880 A CN111822880 A CN 111822880A CN 202010589111 A CN202010589111 A CN 202010589111A CN 111822880 A CN111822880 A CN 111822880A
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- metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
According to the ultrafast laser processing device and the processing method for the high-brightness metal, the bearing jig is further provided with the glossy paper, the high-brightness surface of the high-brightness metal to be processed is in contact with the glossy paper, and when a product is processed, the glossy paper cannot generate harmful effects such as scratches on the high-brightness metal to be processed; and because the laser beam is incident and cut from the matte surface of the high-brightness metal to be processed, the phenomenon that the high-brightness surface of the high-brightness metal to be processed can generate strong reflected light in the prior art is avoided, the service life of an optical device is not facilitated, and the processing quality is improved.
Description
Technical Field
The invention relates to the technical field of optical processing, in particular to an ultrafast laser processing device and a processing method for high-brightness metal.
Background
With the increase of the consumption level of people, the appearance requirement of electronic products is increased, for example, LOGO on a notebook computer, some developers can select high-brightness metal (matte surface on the other side) to replace the previous metal paste, and the like. The high-brightness metal is particularly easy to scratch, so that the requirement on a processing technology is extremely high, burrs are generated on the cutting edge in the traditional processing, and the product has micro deformation due to contact processing.
At present, ultrafast laser processing belongs to cold processing, the molecular bond of a material is directly damaged by ultrashort pulse width and ultrahigh single pulse energy, the material is removed, a processed graph is convenient to modify, the restriction of a die does not exist, the method belongs to non-contact processing, and the problem of material deformation does not exist, so that attention is paid to the method.
When the existing ultrafast laser processing technology carries out laser cutting, the existing ultrafast laser processing technology is selected to be suspended, and the laser sweeping phenomenon is generated after the cutting is finished, so that the requirement of a client cannot be met; and because the matte surface of the product is directly placed on the jig, the highlight surface can generate stronger reflected light, the service life of an optical device is not facilitated, the highlight surface is directly contacted with the jig, and the material can be scratched inevitably.
Disclosure of Invention
Therefore, there is a need to provide an ultrafast laser processing apparatus for processing high-brightness metal with higher quality, which overcomes the drawbacks of the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
an ultrafast laser processing apparatus of a high bright metal, comprising: laser instrument module, beam expanding lens, speculum, scanning mirror module, light beam focusing module and be used for bearing the tool that bears of waiting to process high bright metal, it still is provided with oily glossy paper to bear the tool, wait to process high bright surface of high bright metal with oily glossy paper contact, wherein:
laser beams emitted by the laser module enter the reflector after being collimated by the beam expander, the reflector transmits incident laser beams to the scanning galvanometer module, and the laser beams scanned by the scanning galvanometer module are focused by the beam focusing module and then are incident on the matt surface of the to-be-processed high-brightness metal to cut the to-be-processed high-brightness metal.
In some embodiments, the laser module is an ultrafast laser with a wavelength band between 355 and 532 nm.
In some of these embodiments, the mirrors are two 45 ° mirrors.
In some of these embodiments, the scanning galvanometer module is an XY scanning galvanometer.
In some of these embodiments, the beam focusing module is a telecentric field lens.
In some embodiments, the supporting fixture is a ceramic adsorption plate.
In addition, the invention also provides a processing method of the ultra-fast laser processing device for the high-brightness metal, which comprises the following steps:
building a light path according to the ultrafast laser processing device of the high-brightness metal;
opening vacuum adsorption, and adsorbing the glossy paper on the bearing jig;
placing the to-be-processed high-brightness metal on the glossy paper, and enabling a high-brightness surface of the to-be-processed high-brightness metal to be in contact with the glossy paper;
opening a light path and enabling a laser beam to be incident from a sub-smooth surface of the to-be-machined high-brightness metal to cut the to-be-machined high-brightness metal;
and closing vacuum adsorption, taking out the to-be-processed high-brightness metal from the glossy paper, and carrying out ultrasonic cleaning to obtain the processed high-brightness metal.
The invention adopts the technical scheme that the method has the advantages that:
according to the ultrafast laser processing device and the processing method for the high-brightness metal, the bearing jig is further provided with the glossy paper, the high-brightness surface of the high-brightness metal to be processed is in contact with the glossy paper, and when a product is processed, the glossy paper cannot generate harmful effects such as scratches on the high-brightness metal to be processed; and because the laser beam is incident and cut from the matte surface of the high-brightness metal to be processed, the phenomenon that the high-brightness surface of the high-brightness metal to be processed can generate strong reflected light in the prior art is avoided, the service life of an optical device is not facilitated, and the processing quality is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an ultrafast laser processing apparatus for high-brightness metal according to embodiment 1 of the present invention.
Fig. 2 is a flowchart illustrating steps of a processing method of an ultrafast laser processing apparatus for high-brightness metal according to embodiment 2 of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1, which is a schematic structural diagram of an ultrafast laser processing apparatus for high bright metal according to an embodiment of the present invention, a laser module 1, a beam expander 2, a reflector 3, a scanning galvanometer module 4, a beam focusing module 5, and a carrying fixture (not shown) for carrying the high bright metal to be processed are further disposed on the carrying fixture, and the high bright surface of the high bright metal to be processed is in contact with the oily paper.
The working mode of the ultrafast laser processing device for high-brightness metal provided by the embodiment is as follows:
the laser beam that laser module 1 launched passes through beam expander 2 enters behind the collimation reflector 3, reflector 3 transmits the laser beam of incidence extremely scanning galvanometer module 4, the warp the laser beam after scanning galvanometer module 4 scans through 5 gathers the back by the matte face incidence of waiting to process the highlight metal is right the highlight metal of waiting to process cuts.
In some embodiments, the laser module is an ultrafast laser with a wavelength band between 355 and 532 nm. It can be understood that in practice, the wavelength of the ultraviolet laser can be selected as the wavelength for processing, and the wavelength can be from 355nm to 532 nm; meanwhile, in the laser pulse width, the picosecond level pulse width is selected, and the femtosecond level can be selectively used.
In some of these embodiments, the mirror 3 is a two-piece 45 ° mirror.
In some of these embodiments, the scanning galvanometer module 4 is an XY scanning galvanometer.
It can be understood that the scanning galvanometer module 4 is internally provided with two motors to drive the reflecting mirrors to control scanning patterns.
In some of these embodiments, the beam focusing module 5 is a telecentric field lens.
In some embodiments, the supporting fixture is a ceramic adsorption plate.
According to the ultrafast laser processing device for the high-brightness metal, the bearing jig is further provided with the glossy paper, the high-brightness surface of the high-brightness metal to be processed is in contact with the glossy paper, and when a product is processed, the glossy paper cannot generate harmful effects such as scratches on the high-brightness metal to be processed; and because the laser beam is incident and cut from the matte surface of the high-brightness metal to be processed, the phenomenon that the high-brightness surface of the high-brightness metal to be processed can generate strong reflected light in the prior art is avoided, the service life of an optical device is not facilitated, and the processing quality is improved.
Example 2
Referring to fig. 2, a flowchart of steps of a processing method of the ultrafast laser processing apparatus for high-brightness metal according to the above embodiment of the present invention includes the following steps:
step S110: and establishing a light path according to the ultrafast laser processing device of the high-brightness metal.
Step S120: and opening vacuum adsorption, and adsorbing the glossy paper on the bearing jig.
Step S130: and placing the to-be-processed high-brightness metal on the glossy paper, and enabling the high-brightness surface of the to-be-processed high-brightness metal to be in contact with the glossy paper.
It can be understood that if the matte surface of the highlight metal to be processed is directly placed on the bearing jig, the highlight surface can generate stronger reflected light, which is not beneficial to the service life of an optical device; and if the highlight surface of the highlight metal to be processed is directly contacted with the bearing jig, the material is inevitably scratched.
Step S140: and opening a light path and enabling a laser beam to be incident from a sub-smooth surface of the to-be-processed high-brightness metal to cut the to-be-processed high-brightness metal.
Step S150: and closing vacuum adsorption, taking out the to-be-processed high-brightness metal from the glossy paper, and carrying out ultrasonic cleaning to obtain the processed high-brightness metal.
According to the processing method of the ultrafast laser processing device for the high-brightness metal, provided by the invention, the bearing jig is also provided with the glossy paper, the high-brightness surface of the high-brightness metal to be processed is in contact with the glossy paper, and when a product is processed, the glossy paper does not have adverse effects such as scratches on the high-brightness metal to be processed; and because the laser beam is incident and cut from the matte surface of the high-brightness metal to be processed, the phenomenon that the high-brightness surface of the high-brightness metal to be processed can generate strong reflected light in the prior art is avoided, the service life of an optical device is not facilitated, and the processing quality is improved.
Of course, the ultrafast laser processing apparatus for high-brightness metal of the present invention may have various changes and modifications, and is not limited to the specific structure of the above-described embodiment. In conclusion, the scope of the present invention should include those changes or substitutions and modifications which are obvious to those of ordinary skill in the art.
Claims (7)
1. An ultrafast laser processing apparatus of a high bright metal, comprising: laser instrument module, beam expanding lens, speculum, scanning mirror module, light beam focusing module and be used for bearing the tool that bears of waiting to process high bright metal, it still is provided with oily glossy paper to bear on the tool, wait to process high bright surface of high bright metal with oily glossy paper contact, wherein:
laser beams emitted by the laser module enter the reflector after being collimated by the beam expander, the reflector transmits incident laser beams to the scanning galvanometer module, and the laser beams scanned by the scanning galvanometer module are focused by the beam focusing module and then are incident on the matt surface of the to-be-processed high-brightness metal to cut the to-be-processed high-brightness metal.
2. The ultrafast laser processing apparatus for highlight metals as claimed in claim 1, wherein said laser module is an ultrafast laser with a wavelength band between 355 and 532 nm.
3. The apparatus of claim 1, wherein said mirrors are two 45 ° mirrors.
4. The apparatus of claim 1, wherein the scanning galvanometer module is an XY scanning galvanometer.
5. The apparatus of claim 1, wherein said beam focusing module is a telecentric field lens.
6. The ultrafast laser processing apparatus of high bright metal as claimed in claim 1, wherein said carrying fixture is a ceramic adsorption plate.
7. The method for processing the ultra-fast laser processing device of the high-brightness metal according to claim 1, comprising the steps of:
building a light path according to the ultrafast laser processing device of the high-brightness metal;
opening vacuum adsorption, and adsorbing the glossy paper on the bearing jig;
placing the to-be-processed high-brightness metal on the glossy paper, and enabling a high-brightness surface of the to-be-processed high-brightness metal to be in contact with the glossy paper;
opening a light path and enabling a laser beam to be incident from a sub-smooth surface of the to-be-machined high-brightness metal to cut the to-be-machined high-brightness metal;
and closing vacuum adsorption, taking out the to-be-processed high-brightness metal from the glossy paper, and carrying out ultrasonic cleaning to obtain the processed high-brightness metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010589111.6A CN111822880A (en) | 2020-06-24 | 2020-06-24 | Ultrafast laser processing device and processing method for high-brightness metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010589111.6A CN111822880A (en) | 2020-06-24 | 2020-06-24 | Ultrafast laser processing device and processing method for high-brightness metal |
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| CN111822880A true CN111822880A (en) | 2020-10-27 |
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| CN202010589111.6A Pending CN111822880A (en) | 2020-06-24 | 2020-06-24 | Ultrafast laser processing device and processing method for high-brightness metal |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105127604A (en) * | 2015-09-06 | 2015-12-09 | 深圳英诺激光科技有限公司 | Laser processing system and method |
| US20160243649A1 (en) * | 2014-07-10 | 2016-08-25 | Guangzhou Institute of Advanced Technology, Chinise Academy of Sciences | Optical system for 3d printing and control method thereof |
| CN106584922A (en) * | 2016-11-16 | 2017-04-26 | 苏州炯灿电子有限公司 | Process for manufacturing mobile phone logo |
| CN108213734A (en) * | 2018-01-02 | 2018-06-29 | 大族激光科技产业集团股份有限公司 | A kind of method and apparatus for making stainless steel mark |
| CN111031158A (en) * | 2019-12-23 | 2020-04-17 | Oppo广东移动通信有限公司 | Ceramic shell, processing method of surface of ceramic shell and electronic equipment |
-
2020
- 2020-06-24 CN CN202010589111.6A patent/CN111822880A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160243649A1 (en) * | 2014-07-10 | 2016-08-25 | Guangzhou Institute of Advanced Technology, Chinise Academy of Sciences | Optical system for 3d printing and control method thereof |
| CN105127604A (en) * | 2015-09-06 | 2015-12-09 | 深圳英诺激光科技有限公司 | Laser processing system and method |
| CN106584922A (en) * | 2016-11-16 | 2017-04-26 | 苏州炯灿电子有限公司 | Process for manufacturing mobile phone logo |
| CN108213734A (en) * | 2018-01-02 | 2018-06-29 | 大族激光科技产业集团股份有限公司 | A kind of method and apparatus for making stainless steel mark |
| CN111031158A (en) * | 2019-12-23 | 2020-04-17 | Oppo广东移动通信有限公司 | Ceramic shell, processing method of surface of ceramic shell and electronic equipment |
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Application publication date: 20201027 |
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