CN111817138A - 边发射大功率激光器及其制造方法 - Google Patents
边发射大功率激光器及其制造方法 Download PDFInfo
- Publication number
- CN111817138A CN111817138A CN202010892596.6A CN202010892596A CN111817138A CN 111817138 A CN111817138 A CN 111817138A CN 202010892596 A CN202010892596 A CN 202010892596A CN 111817138 A CN111817138 A CN 111817138A
- Authority
- CN
- China
- Prior art keywords
- layer
- type
- waveguide
- edge
- power laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2214—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on oxides or nitrides
- H01S5/2215—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on oxides or nitrides using native oxidation of semiconductor layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
- H01S5/18311—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement using selective oxidation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
N型衬底 | 11 | 上波导层 | 16 | |
N型缓冲层 | 12 | P型覆盖层 | 17 | |
N型覆盖层 | 13 | P型欧姆接触层 | 18 | |
下波导层 | 14 | 绝缘层 | 19 | |
有源区 | 15 |
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010892596.6A CN111817138B (zh) | 2020-08-31 | 2020-08-31 | 边发射大功率激光器及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010892596.6A CN111817138B (zh) | 2020-08-31 | 2020-08-31 | 边发射大功率激光器及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111817138A true CN111817138A (zh) | 2020-10-23 |
CN111817138B CN111817138B (zh) | 2021-02-26 |
Family
ID=72859743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010892596.6A Active CN111817138B (zh) | 2020-08-31 | 2020-08-31 | 边发射大功率激光器及其制造方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111817138B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112290384A (zh) * | 2020-12-29 | 2021-01-29 | 江西铭德半导体科技有限公司 | 边发射大功率激光器及其制造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000188442A (ja) * | 1998-10-15 | 2000-07-04 | Furukawa Electric Co Ltd:The | 半導体レ―ザ素子 |
CN1812214A (zh) * | 2005-01-24 | 2006-08-02 | 松下电器产业株式会社 | 氮化物半导体激光元件及其制造方法 |
US20070086499A1 (en) * | 2003-11-10 | 2007-04-19 | Tomonori Hino | Semiconductor light-emitting device and method of manufacturing the same |
JP2011142212A (ja) * | 2010-01-07 | 2011-07-21 | Furukawa Electric Co Ltd:The | 半導体レーザおよびその製造方法 |
CN109216183A (zh) * | 2018-08-22 | 2019-01-15 | 深亮智能技术(中山)有限公司 | 一种砷化镓的干法蚀刻工艺及其应用 |
-
2020
- 2020-08-31 CN CN202010892596.6A patent/CN111817138B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000188442A (ja) * | 1998-10-15 | 2000-07-04 | Furukawa Electric Co Ltd:The | 半導体レ―ザ素子 |
US20070086499A1 (en) * | 2003-11-10 | 2007-04-19 | Tomonori Hino | Semiconductor light-emitting device and method of manufacturing the same |
CN1812214A (zh) * | 2005-01-24 | 2006-08-02 | 松下电器产业株式会社 | 氮化物半导体激光元件及其制造方法 |
JP2011142212A (ja) * | 2010-01-07 | 2011-07-21 | Furukawa Electric Co Ltd:The | 半導体レーザおよびその製造方法 |
CN109216183A (zh) * | 2018-08-22 | 2019-01-15 | 深亮智能技术(中山)有限公司 | 一种砷化镓的干法蚀刻工艺及其应用 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112290384A (zh) * | 2020-12-29 | 2021-01-29 | 江西铭德半导体科技有限公司 | 边发射大功率激光器及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN111817138B (zh) | 2021-02-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6816527B2 (en) | Surface emitting semiconductor laser | |
US6618414B1 (en) | Hybrid vertical cavity laser with buried interface | |
US7408967B2 (en) | Method of fabricating single mode VCSEL for optical mouse | |
US20040066820A1 (en) | Versatile method and system for single mode VCSELs | |
US11437780B2 (en) | Semiconductor laser device, semiconductor laser module, and welding laser light source system | |
JP4311610B2 (ja) | 面発光レーザ | |
WO2002017360A1 (en) | Double intracavity contacted long-wavelength vcsels and method of fabricating same | |
JP2008227367A (ja) | 分布帰還型半導体レーザ素子 | |
CN111711070A (zh) | 边发射单模激光器及制造方法 | |
US7567603B2 (en) | Semiconductor laser diode with advanced window structure | |
US8111726B2 (en) | Semiconductor laser device | |
KR100651705B1 (ko) | 반도체 레이저 장치 및 이것을 이용한 광 픽업 장치 | |
CN111817138B (zh) | 边发射大功率激光器及其制造方法 | |
US20030047738A1 (en) | Semiconductor laser device having selective absorption qualities over a wide temperature range | |
US20020146053A1 (en) | Surface emitting semiconductor laser device | |
US11063404B1 (en) | Bidirectionally emitting semiconductor laser devices | |
KR100404043B1 (ko) | 수직으로 집적화된 고출력 면발광 반도체 레이저 장치 및그 제조 방법 | |
US7215694B2 (en) | Semiconductor laser device | |
CN109038217B (zh) | 延长使用寿命的vcsel芯片及制作方法和电子器件 | |
JP2006019470A (ja) | 面発光半導体レーザおよび光モジュール | |
JP2009076640A (ja) | 半導体発光素子 | |
JP2004103679A (ja) | 半導体発光素子および半導体発光素子モジュール | |
JP2022501815A (ja) | 利得導波型半導体レーザおよびその製造方法 | |
JP7295739B2 (ja) | 半導体レーザ素子およびチップオンサブマウント | |
JP4163343B2 (ja) | 発光素子および発光素子モジュール |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information |
Inventor after: Ke Maolong Inventor after: Li Chunyong Inventor after: Shu Kai Inventor after: Qiu Bocang Inventor after: Xu Huayong Inventor after: Feng Ou Inventor before: Ke Maolong Inventor before: Li Chunyong Inventor before: Shu Kai Inventor before: Qiu Bocang Inventor before: Xu Huayong Inventor before: Feng Ou |
|
CB03 | Change of inventor or designer information | ||
TR01 | Transfer of patent right |
Effective date of registration: 20211027 Address after: 330000 South of Fushan Avenue and West of Jinhu Lake, Xiaolan Economic and Technological Development Zone, Nanchang City, Jiangxi Province Patentee after: JIANGXI DERAY PHOTOELECTRIC TECHNOLOGY Co.,Ltd. Address before: 330000, 2nd floor, Derui photoelectric building, south of Fushan Avenue and west of Jinhu, Nanchang County, Nanchang City, Jiangxi Province Patentee before: Jiangxi Mingde Semiconductor Technology Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Edge emitting high-power laser and its manufacturing method Effective date of registration: 20230412 Granted publication date: 20210226 Pledgee: Nanchang County Sub branch of Bank of Beijing Co.,Ltd. Pledgor: JIANGXI DERAY PHOTOELECTRIC TECHNOLOGY Co.,Ltd. Registration number: Y2023980037902 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |