CN111805435A - Surface treatment method of metal base for PECVD (plasma enhanced chemical vapor deposition) process - Google Patents

Surface treatment method of metal base for PECVD (plasma enhanced chemical vapor deposition) process Download PDF

Info

Publication number
CN111805435A
CN111805435A CN202010694236.5A CN202010694236A CN111805435A CN 111805435 A CN111805435 A CN 111805435A CN 202010694236 A CN202010694236 A CN 202010694236A CN 111805435 A CN111805435 A CN 111805435A
Authority
CN
China
Prior art keywords
metal base
sand blasting
metal
set value
spray gun
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010694236.5A
Other languages
Chinese (zh)
Inventor
高圣根
朱东海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hefei Weirui Optoelectronic Technology Co ltd
Original Assignee
Hefei Weirui Optoelectronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hefei Weirui Optoelectronic Technology Co ltd filed Critical Hefei Weirui Optoelectronic Technology Co ltd
Priority to CN202010694236.5A priority Critical patent/CN111805435A/en
Publication of CN111805435A publication Critical patent/CN111805435A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/06Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for producing matt surfaces, e.g. on plastic materials, on glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/04Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C11/00Selection of abrasive materials or additives for abrasive blasts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C7/00Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts
    • B24C7/0046Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a gaseous carrier
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C9/00Appurtenances of abrasive blasting machines or devices, e.g. working chambers, arrangements for handling used abrasive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a surface treatment method of a metal base for a PECVD (plasma enhanced chemical vapor deposition) process, which is characterized in that the surface treatment is carried out on the metal base based on a sand blasting treatment method, so that the process parameters are improved, the ratio of a peak value (Rp) to a valley value (Rv) of a rough surface can be controlled to be about 1:1 as far as possible while the surface of the metal base forms proper roughness (Ra), so that the rough surface has good uniformity, the heat conduction efficiency and the heat conduction uniformity of the metal base are improved, the temperature deviation is reduced, and when the PECVD process is carried out on a substrate which is in contact with the metal base, the heat radiation characteristic is uniform and the temperature transfer characteristic is good.

Description

Surface treatment method of metal base for PECVD (plasma enhanced chemical vapor deposition) process
Technical Field
The invention relates to the technical field of PECVD (plasma enhanced chemical vapor deposition) processes applied to semiconductor and LCD/OLED (liquid crystal display/organic light emitting diode) production, in particular to a surface treatment method of a metal base for the PECVD process.
Background
The metal base (aluminum base, hereinafter referred to as base) is widely applied in industrial processing production, and particularly in the field of semiconductor and LCD/OLED manufacturing, a PECVD (plasma enhanced chemical vapor deposition) process is often required to be performed on a glass substrate or a wafer substrate (hereinafter referred to as substrate), that is, a thin film is evaporated on a substrate by a chemical vapor reaction of a required substance, and the process generally requires a heating device built in the base to provide a certain amount of heat (temperature range value is 340-360 ℃) so as to meet the temperature condition required for performing the process.
In the process of implementing the PECVD process, the surface of the adopted base is a rough surface with certain roughness, so that the stability of the substrate in contact with the base can be effectively improved, the substrate can be prevented from being deviated due to the contact with the smooth surface of the base, the formation of a thin film is facilitated, and the evaporation efficiency can be improved.
Therefore, how to improve the surface roughness of the base is currently used as an important starting point and research direction in the industry. However, if the surface roughness of the susceptor is too high, it is difficult to form an oxide film on the surface of the susceptor by the anodic oxidation treatment, which greatly reduces the corrosion resistance of the susceptor and thus the service life of the susceptor.
In addition, the heat conductivity of the base is one of the core elements for implementing the PECVD process, and if the heat conductivity efficiency and the heat conductivity uniformity of the base are poor, when the PECVD process is implemented on a substrate in contact with the base, the heat radiation characteristic is not uniform, and the temperature transfer characteristic is not good, so that the process result is directly influenced, which is specifically embodied as follows:
1. when the heat conduction efficiency of the base is too low, the temperature transfer characteristic is not good, and the required proper temperature cannot be reached, the power of the built-in heating device of the base needs to be continuously increased, so that the required temperature condition is met, and the defects are as follows: (1) the power consumption is inevitably increased, and the cost is increased; (2) the higher the temperature of the base is, the more easily the surface of the base is corroded, the higher the maintenance cost is, the service life of an internal heating device can be shortened, and the worse the surface temperature uniformity is;
2. when the heat conduction uniformity of the base is poor and the heat radiation characteristic is not uniform, when a PECVD (plasma enhanced chemical vapor deposition) process is implemented to evaporate a film on the substrate, the film thickness uniformity of evaporation becomes poor, so that the related characteristics of the produced product are problematic, and a defective product is generated.
Obviously, the uneven surface of the base has poor heat conduction efficiency and uniformity.
The existing sand blasting method is adopted to carry out surface treatment on the base, only a rough surface with higher roughness can be formed on the surface of the base, but the rough surface cannot have good uniformity, so that the heat conduction efficiency and the heat conduction uniformity of the base cannot be improved.
Disclosure of Invention
The invention aims to overcome the defects and shortcomings of the prior art and provide a surface treatment method of a metal base for a PECVD (plasma enhanced chemical vapor deposition) process.
In order to achieve the purpose, the invention provides the following technical scheme:
1. a surface treatment method of a metal base for a PECVD process comprises the following steps of carrying out sand blasting treatment on the surface of the metal base to form a rough surface on the surface of the metal base, and is characterized in that: the method specifically comprises the following steps:
(1) selecting sand materials with basically consistent grain diameter and round shape as spraying materials;
(2) sending the metal base to be processed into the automatic sand blasting machine by adopting the automatic sand blasting machine as sand blasting processing equipment, and fixing the metal base by using a clamping mechanism;
(3) setting the pressure value of compressed air adopted by the automatic sand blasting machine to a set value, setting the moving speed of the spray gun to the set value, and adjusting the distance between the spray gun and the surface of the metal base to the set value;
(4) and starting an automatic sand blasting machine, carrying out sand blasting treatment on the surface of the metal base, and finally forming a rough surface with proper roughness and uniformity on the surface of the metal base.
Further, in the step (1), the sand material is white corundum or glass beads.
Further, in the step (1), the sand material has a hardness of 4.5-6 Mohs and an average particle size of 0.2-1.2 mm.
Further, the sand material has the optimum hardness of 5Mohs and the optimum average grain diameter of 1 mm.
Further, in the step (2), before the metal base is sent into the automatic sand blasting machine, a part which does not need sand blasting treatment on the metal base is shielded by using an adhesive tape or a silica gel strip.
Further, in the step (3), the set value of the pressure of the compressed air is 0.3-0.45 MPa, the set value of the moving speed of the spray gun is 150-250 mm/s, and the set value of the distance between the spray gun and the surface of the metal base is 400-600 mm.
Further, the optimal set value of the pressure of the compressed air is 0.4MPa, the optimal set value of the moving speed of the spray gun is 200mm/s, and the optimal set value of the distance between the spray gun and the surface of the metal base is 400 mm.
Further, in the step (3), an included angle between the spray gun and the surface of the metal base needs to be set to be 85-95 degrees.
Further, the optimum angle between the lance and the surface of the metal base is 90 °.
Compared with the prior art, the invention has the beneficial effects that:
the invention carries out surface treatment on the metal base based on the sand blasting method, improves the process parameters, can control the ratio of the peak value (Rp) to the valley value (Rv) of the rough surface to be about 1:1 as much as possible while forming proper roughness (Ra) on the surface of the metal base, ensures that the rough surface has good uniformity, improves the heat conduction efficiency and the heat conduction uniformity of the metal base, reduces the temperature deviation, and has uniform heat radiation characteristic and good temperature transfer characteristic when the PECVD process is carried out on a substrate which is in contact with the metal base.
Drawings
FIG. 1 is a schematic view (in an enlarged state) of the surface structure of a metal base treated by the present invention.
FIG. 2 is a schematic view of a sampling test performed on the surface of a metal base treated by the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
Referring to fig. 1 and 2, a surface treatment method of a metal base for a PECVD process includes performing sand blasting on a surface of the metal base to form a rough surface on the surface of the metal base, and specifically includes the steps of:
s1, selecting glass beads with the hardness of 5Mohs, the average grain diameter of 1mm and the shape of a circle as a spray material.
S2, adopting an automatic sand blasting machine as sand blasting equipment, firstly adopting an adhesive tape or a silica gel strip to shield the part of the metal base 100 which does not need sand blasting, then sending the metal base 100 into the automatic sand blasting machine, and fixing the metal base through a clamping mechanism of the automatic sand blasting machine.
S3, setting the pressure value of compressed air adopted by the automatic sand blasting machine to be 0.4MPa, setting the moving speed of the spray gun to be 200mm/S, adjusting the distance between the spray gun and the surface of the metal base 100 to be 400mm, and adjusting the included angle between the spray gun and the surface of the metal base 100 to be 90 degrees.
S4, starting an automatic sand blasting machine, and performing sand blasting treatment on the surface of the metal base 100, wherein the method comprises the following specific steps:
forming a high-speed spray beam by using compressed air as power, spraying glass beads on the surface of the metal base 100 at a high speed, wherein the continuously sprayed glass beads continuously impact the surface of the metal base 100 and rebound outwards, forming 'impressions' of a few thousands of inches on the surface of the metal base 100, namely forming a micron-sized rugged rough surface 200, wherein the roughness is recorded as Ra (mum), the sunken part is recorded as 'valley', the valley value is recorded as Rv (mum), the protruded part is recorded as 'peak', and the peak value is recorded as Rp (mum);
for the rough surface 200, randomly selecting a plurality of test points within the range of the sampling length L, respectively testing the peak value Rp (μm) and the valley value Rv (μm) of each test point, then calculating the roughness Ra average value (μm), the peak value Rp average value (μm) and the valley value Rv average value (μm), and repeatedly performing the test for three times to obtain the test data shown in table 1:
TABLE 1
Number of tests Ra mean value (μm) Average value of Rp (. mu.m) Mean value of Rv (. mu.m) Rp∶Rv
1 st time 19.2 69.8 54.9 1∶0.79
2 nd time 18.6 56.1 63.8 1∶1.14
3 rd time 18.9 54.5 66.2 1∶1.21
As is clear from Table 1, the roughness Ra (μm) of the rough surface 200 is suitable and close to 20 μm; and Rp and Rv are 1:1, so that the uniformity is good.
It should be noted that the sampling length L selected in this embodiment and the number of randomly selected test points in each test can be determined according to actual test requirements, and is not limited herein.
The metal base 100 treated by the above-mentioned method is required to be anodized, and an oxide film is formed on the surface of the metal base 100 to protect the metal base 100 and enhance the corrosion resistance of the metal base 100.
After the treatment by the above method, the roughness of the rough surface 200 formed on the surface of the metal base 100 is suitable, so that on one hand, the stability of the glass substrate or wafer substrate (hereinafter referred to as substrate) when contacting the surface of the metal base 100 can be effectively improved, and the substrate can be prevented from shifting due to the contact with the smooth surface of the metal base 100, thereby facilitating the formation of a thin film and improving the evaporation efficiency; on the other hand, after the metal base 100 is anodized, an oxide film can be surely formed on the surface of the metal base 100.
The heat transfer performance of the metal base 100 treated by the above method was tested as follows:
selecting 25 temperature measuring points of 5 multiplied by 5 at equal intervals on the surface of the metal base 100, respectively placing 25 glass sheets with the same material as the glass substrate on the 25 temperature measuring points, wherein the shape and the size of the 25 glass sheets are the same, and then electrifying and heating the metal base 100 for one hour. After one hour, respectively testing the temperature values of 25 glass sheets, calculating an average temperature value, recording as Tave (DEG C), calculating a temperature deviation value (namely a difference value between the highest temperature value and the lowest temperature value), recording as delta T (DEG C), and repeatedly carrying out three tests to obtain test data shown in table 2:
TABLE 2
Number of tests Tave(℃) ΔT(℃)
1 st time 342 4.8
2 nd time 342.9 3.1
3 rd time 342.6 4.6
As can be seen from Table 2, the average temperature value Tave (deg.C) is within the target temperature range (340-360 deg.C), which indicates that the temperature transfer characteristic of the metal base 100 is good; and the temperature deviation value is within the allowable deviation range (5 deg.C or less), indicating that the heat radiation characteristic of the metal base 100 is uniform.
Although the present description is described in terms of embodiments, not every embodiment includes only a single embodiment, and such description is for clarity only, and those skilled in the art should be able to integrate the description as a whole, and the embodiments can be appropriately combined to form other embodiments as will be understood by those skilled in the art.
Therefore, the above description is only a preferred embodiment of the present application, and is not intended to limit the scope of the present application; all changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims (9)

1. A surface treatment method of a metal base for a PECVD process comprises the following steps of carrying out sand blasting treatment on the surface of the metal base to form a rough surface on the surface of the metal base, and is characterized in that: the method specifically comprises the following steps:
(1) selecting sand materials with basically consistent grain diameter and round shape as spraying materials;
(2) sending the metal base to be processed into the automatic sand blasting machine by adopting the automatic sand blasting machine as sand blasting processing equipment, and fixing the metal base by using a clamping mechanism;
(3) setting the pressure value of compressed air adopted by the automatic sand blasting machine to a set value, setting the moving speed of the spray gun to the set value, and adjusting the distance between the spray gun and the surface of the metal base to the set value;
(4) and starting an automatic sand blasting machine, carrying out sand blasting treatment on the surface of the metal base, and finally forming a rough surface with proper roughness and uniformity on the surface of the metal base.
2. The method of claim 1, wherein the metal susceptor comprises: in the step (1), the sand material is white corundum or glass beads.
3. The method of claim 1, wherein the metal susceptor comprises: in the step (1), the sand material has the hardness of 4.5-6 Mohs and the average grain diameter of 0.2-1.2 mm.
4. The method of claim 3, wherein the metal susceptor comprises: the sand material has the optimum hardness of 5Mohs and the optimum average grain diameter of 1 mm.
5. The method of claim 1, wherein the metal susceptor comprises: in the step (2), before the metal base is sent into the automatic sand blasting machine, the part of the metal base which does not need sand blasting treatment is shielded by using an adhesive tape or a silica gel strip.
6. The method of claim 1, wherein the metal susceptor comprises: in the step (3), the set value of the pressure of the compressed air is 0.3-0.45 MPa, the set value of the moving speed of the spray gun is 150-250 mm/s, and the set value of the distance between the spray gun and the surface of the metal base is 400-600 mm.
7. The method of claim 6, wherein the metal susceptor comprises: the optimal set value of the pressure of the compressed air is 0.4MPa, the optimal set value of the moving speed of the spray gun is 200mm/s, and the optimal set value of the distance between the spray gun and the surface of the metal base is 400 mm.
8. The method of claim 1, wherein the metal susceptor comprises: in the step (3), an included angle between the spray gun and the surface of the metal base needs to be set to be 85-95 degrees.
9. The method of claim 8, wherein the metal susceptor comprises: the optimum angle between the lance and the surface of the metal base is 90 °.
CN202010694236.5A 2020-07-17 2020-07-17 Surface treatment method of metal base for PECVD (plasma enhanced chemical vapor deposition) process Pending CN111805435A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010694236.5A CN111805435A (en) 2020-07-17 2020-07-17 Surface treatment method of metal base for PECVD (plasma enhanced chemical vapor deposition) process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010694236.5A CN111805435A (en) 2020-07-17 2020-07-17 Surface treatment method of metal base for PECVD (plasma enhanced chemical vapor deposition) process

Publications (1)

Publication Number Publication Date
CN111805435A true CN111805435A (en) 2020-10-23

Family

ID=72866037

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010694236.5A Pending CN111805435A (en) 2020-07-17 2020-07-17 Surface treatment method of metal base for PECVD (plasma enhanced chemical vapor deposition) process

Country Status (1)

Country Link
CN (1) CN111805435A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103882365A (en) * 2012-12-21 2014-06-25 上海宝钢工业技术服务有限公司 Preparation method of surface compound coating for guide rail of large measuring machine
CN104593713A (en) * 2013-10-30 2015-05-06 上海宝钢工业技术服务有限公司 Preparation method for tension-roller thermal-sprayed coating
CN106312826A (en) * 2016-09-26 2017-01-11 中铁十四局集团第五工程有限公司 Prefabricated U-shaped beam template base sand blasting treatment method
CN110735118A (en) * 2018-07-18 2020-01-31 友矿材料股份有限公司 Roughness processing method for target sputtering surface

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103882365A (en) * 2012-12-21 2014-06-25 上海宝钢工业技术服务有限公司 Preparation method of surface compound coating for guide rail of large measuring machine
CN104593713A (en) * 2013-10-30 2015-05-06 上海宝钢工业技术服务有限公司 Preparation method for tension-roller thermal-sprayed coating
CN106312826A (en) * 2016-09-26 2017-01-11 中铁十四局集团第五工程有限公司 Prefabricated U-shaped beam template base sand blasting treatment method
CN110735118A (en) * 2018-07-18 2020-01-31 友矿材料股份有限公司 Roughness processing method for target sputtering surface

Similar Documents

Publication Publication Date Title
US7767268B2 (en) Spray-coated member having an excellent resistance to plasma erosion and method of producing the same
US8372205B2 (en) Reducing electrostatic charge by roughening the susceptor
CN107604304B (en) Metal plate, method for producing metal plate, and method for producing vapor deposition mask using metal plate
US8173228B2 (en) Particle reduction on surfaces of chemical vapor deposition processing apparatus
JP4546447B2 (en) Thermal spray coating coated member having excellent plasma erosion resistance and method for producing the same
US20060024517A1 (en) Coating for aluminum component
US20160076129A1 (en) Component for plasma processing apparatus, and manufacturing method therefor
CN110919193B (en) Nanosecond laser processing method for ceramic surface hole based on processing track optimization
CN103572225A (en) Production method of tantalum target and tantalum target component
JP2006228966A (en) Plasma treatment apparatus, its component, and lifetime detecting method of component
CN113774389B (en) Regeneration method of gas diffusion plate for large-generation liquid crystal display production
JP4546448B2 (en) Thermal spray coating coated member having excellent plasma erosion resistance and method for producing the same
KR200495564Y1 (en) Non-scratching and durable substrate support pin
JP3434947B2 (en) Shower plate
CN111805435A (en) Surface treatment method of metal base for PECVD (plasma enhanced chemical vapor deposition) process
TW201426852A (en) Upper electrode of dry etching chamber and method for manufacturing the same
JP4611217B2 (en) Wafer mounting electrode
CN102522306A (en) Spray head
CN102296262B (en) Leveling roller surface nanocrystalline enhancement and spot chromium plating texturing method
CN102965627A (en) Film forming device and target device
CN206052149U (en) Solar silicon wafers plated film graphite boat piece and graphite boat
US20210043426A1 (en) Shower plate, lower dielectric member and plasma processing apparatus
CN110369243A (en) The restorative procedure and reparation of reactor for polycrystalline silicon chassis surface, its holiday
KR100908227B1 (en) Electrostatic chuck reproducing method of tft fabrication equipment
CN116276671A (en) Diffusion plate dirt removing system and dirt removing process

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20201023