CN111791421A - 适用于塑封功率模块的压缩模具及其塑封方法 - Google Patents

适用于塑封功率模块的压缩模具及其塑封方法 Download PDF

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CN111791421A
CN111791421A CN202010669257.1A CN202010669257A CN111791421A CN 111791421 A CN111791421 A CN 111791421A CN 202010669257 A CN202010669257 A CN 202010669257A CN 111791421 A CN111791421 A CN 111791421A
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power module
epoxy resin
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梁小广
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Wuxi Lipus Semiconductor Co ltd
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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Abstract

本发明提供了一种适用于塑封功率模块的压缩模具及其塑封方法，包括：上模和下模；所述上模包括功率模块固定区域，所述功率模块固定区域设置于所述上模的底面；所述下模的上表面设置有环氧树脂腔，所述环氧树脂腔的位置与所述功率模块固定区域相对应。本发明将功率模块倒装在上模下表面，然后将装有环氧树脂的下模向上推向上模，使得功率模块浸入环氧树脂中，防止环氧树脂流入功率模块的金属底板的复杂形状部分。

Description

适用于塑封功率模块的压缩模具及其塑封方法
技术领域
本发明涉及半导体封装技术领域，具体地，涉及一种适用于塑封功率模块的压缩模具及其塑封方法。
背景技术
在电源，电力电子变换器应用中，功率半导体(IGBT，MOSFET，SiC,GaN等)器件因为被广泛采用，在功率较大的场合下一般使用模块的封装形式。现在被广泛使用的封装形式如图1所示，功率模块主要由金属底板1，焊接层，DBC(双面覆铜陶瓷基板)，AMB(箔钎焊的覆铜陶瓷基板)，绝缘散热树脂薄膜或者其他绝缘散热材料，绑定线，外壳2以及硅胶3等组成。功率半导体晶片通过焊接固定到绝缘散热材料上后，通过铝绑定线进行电气连接。再通过回流焊或者烧结等工艺将DBC者其他绝缘散热材料焊接到金属底板上，功率半导体晶片的发出的热通过DBC或者其他绝缘散热材料，焊接层传导到金属底板上，金属底板再通过风冷或者水冷散热出去。在电动汽车或者其他发热密度较高，通过水冷进行冷却的应用中，金属底板往往使用比较复杂的形状，增加和冷却水和金属底板的接触面积，比如带有针翅的金属底板(Pinfin)。
传统的功率模块封装方式所使用材料较多，工艺复杂，生产效率低。使用压注模塑封封装的功率模块也被广泛采用，图2为塑封模块结构示意图，图3为压注模塑封封装工艺的例子，被加热成液体状的环氧树脂通过高压灌入压注模具中，成型为压注模塑封功率模块。压注模塑封封装使用环氧树脂代替外壳和硅胶，也不需要使用胶水来连接外壳和硅胶，工序少，生产效率高，大量生产时可以降低成本。
虽然压注模塑封封装有如此优点，但是当用于带有复杂形状的金属底板的功率模块(如带有针翅的金属底板(Pinfin))时，不能像平坦的金属底板那样在与压注模具的下模具的底面精密贴合，当被加热成液体状的环氧树脂通过高压灌入压注模具中时容易进入针翅区域，形成不良产品。
发明内容
针对现有技术中的缺陷，本发明的目的是提供一种适用于塑封功率模块的压缩模具及其塑封方法。
根据本发明提供的一种适用于塑封功率模块的压缩模具，包括：上模和下模；
所述上模包括功率模块固定区域，所述功率模块固定区域设置于所述上模的底面；
所述下模的上表面设置有环氧树脂腔，所述环氧树脂腔的位置与所述功率模块固定区域相对应。
优选地，所述功率模块固定区域的形状、尺寸与功率模块的金属底板外形相适配。
优选地，所述功率模块的金属底板上设置有针翅，所述功率模块固定区域上设置有相应的插孔。
优选地，所述上模的下表面或所述下模的上表面设置有密封件；
所述密封件设置于所述上模的下表面时，环绕设置于所述功率模块固定区域四周，所述环氧树脂腔位于所述密封件在所述下模的投影之内；
所述密封件设置于所述下模的上表面是，环绕设置于所述环氧树脂腔的四周，所述功率模块固定区域位于所述密封件在所述上模的投影之内。
优选地，密封件包括密封圈。
优选地，还包括抽气结构；
所述抽气结构包括气道，所述气道位于所述下模中，一端连通所述环氧树脂腔，另一端连通所述下模的外部；
所述气道的另一端连接有抽气设备，或者所述气道中密封连接有针管，所述针管与抽气设备连接。
优选地，所述功率模块固定区域内设置有真空吸盘或夹具。
根据本发明提供的一种塑封功率模块的方法，包括采用所述的适用于塑封功率模块的压缩模具，执行步骤包括：
S1、在开模状态下，将功率模块的金属底板侧固定至所述上模的功率模块固定区域，在所述下模的环氧树脂腔内填充环氧树脂液体；
S2、合模，使功率模块浸入环氧树脂液体中；
S3、固化环氧树脂液体，得到封装后的功率模块。
优选地，所述功率模块的金属底板上设置有针翅，所述功率模块固定区域上设置有相应的插孔；
在步骤S1中，将所述功率模块的针翅插入对应的插孔中。
优选地，在步骤S2中，合模后还包括对环氧树脂腔进行抽气预设的时间。
与现有技术相比，本发明具有如下的有益效果：
1、将功率模块倒装在上模下表面，然后将其浸入环氧树脂腔，防止环氧树脂流入功率模块的金属底板的复杂形状部分。
2、模具结构简单，无需对塑封工艺的具体参数做适应性调整。
附图说明
通过阅读参照以下附图对非限制性实施例所作的详细描述，本发明的其它特征、目的和优点将会变得更明显：
图1为功率器件的传统硅胶封装结构示意图；
图2为功率器件的环氧树脂封装结构示意图；
图3为功率器件的传统环氧树脂封装工艺示意图；
图4为本发明第一实施例开模状态下的结构示意图；
图5为本发明第一实施例合模状态下的结构示意图；
图6为本发明第二实施例合模状态下的结构示意图。
具体实施方式
下面结合具体实施例对本发明进行详细说明。以下实施例将有助于本领域的技术人员进一步理解本发明，但不以任何形式限制本发明。应当指出的是，对本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变化和改进。这些都属于本发明的保护范围。
实施例1
如图4所示，本发明提供的一种适用于塑封功率模块的压缩模具，包括：上模1和下模2。
上模1包括功率模块固定区域11，功率模块固定区域11设置于上模1的底面。下模2的上表面设置有环氧树脂腔21，环氧树脂腔21的位置与功率模块固定区域11相对应。
功率模块固定区域用于安装固定功率模块，因此其形状、尺寸与功率模块的金属底板外形相适配。固定功率模块的方式包括在功率模块固定区域内设置真空吸盘或夹具，在功率器件质量较轻时，采用真空吸盘进行固定，在功率器件质量较重时，采用夹具进行固定，本发明对此不作限制。
如图5所示，环氧树脂腔21内用于填充环氧树脂液体，在合模状态下，功率模块固定区域内的功率模块浸入环氧树脂腔21内，进行固化处理(如加热)后即可开模取出封装后的功率器件，如图2所示。
为了防止在合模状态下，环氧树脂腔21内的环氧树脂溢出，可以在上模1的下表面或下模2的上表面设置有密封件12，本实施例以在上模1的下表面设置密封件12为例，防止在合模状态下，环氧树脂从上模1和下模2之间的缝隙中溢出。具体的，密封件设置于上模的下表面时，环绕设置于功率模块固定区域四周，环氧树脂腔位于密封件在下模的投影之内；密封件设置于下模的上表面是，环绕设置于环氧树脂腔的四周，功率模块固定区域位于密封件在上模的投影之内。密封件12可以是密封圈等结构。
实施例2
考虑到功率模块的金属底板会有如图6所示的针翅结构(Pinfin)，本实施例在功率模块固定区域11上设置有相应的插孔，功率模块在固定在上模的下表面时，针翅插入相应的插孔内，避免形成导致环氧树脂流入的空间。
此外，由于向下模2的环氧树脂腔21内填充环氧树脂时容易在环氧树脂腔21的底部形成空气泡，从而导致封装失效，本实施例中，还包括抽气结构。
抽气结构包括气道，气道位于下模2中，一端连通环氧树脂腔21，另一端连通下模2的外部，气道的另一端连接有抽气设备，或者气道中密封连接有针管，针管与抽气设备连接。在填充环氧树脂时，通过抽气设备对环氧树脂腔21进行抽气预设的时间，从而将气泡抽出。
本发明还提供一种塑封功率模块的方法，包括使用上述的适用于塑封功率模块的压缩模具，执行步骤包括：
S1、在开模状态下，将功率模块的金属底板侧固定至上模的功率模块固定区域，在下模的环氧树脂腔内填充环氧树脂液体。在功率模块的金属底板上设置有针翅的情况下，功率模块固定区域上设置有相应的插孔，将功率模块的针翅插入对应的插孔中。
S2、合模，使功率模块浸入环氧树脂液体中。为了环氧树脂腔21内填充消除环氧树脂产生的气泡，在本步骤中可以同时采用抽气设备对环氧树脂腔进行抽气预设的时间。
S3、固化环氧树脂液体(如将模具放入加入设备中进行加热固化)，得到封装后的功率模块。
优选地，功率模块的金属底板上设置有针翅，功率模块固定区域上设置有相应的插孔；
在步骤S1中，将功率模块的针翅插入对应的插孔中。
在本申请的描述中，需要理解的是，术语“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
以上对本发明的具体实施例进行了描述。需要理解的是，本发明并不局限于上述特定实施方式，本领域技术人员可以在权利要求的范围内做出各种变化或修改，这并不影响本发明的实质内容。在不冲突的情况下，本申请的实施例和实施例中的特征可以任意相互组合。

Claims (10)

1.一种适用于塑封功率模块的压缩模具，其特征在于，包括：上模和下模；
所述上模包括功率模块固定区域，所述功率模块固定区域设置于所述上模的底面；
所述下模的上表面设置有环氧树脂腔，所述环氧树脂腔的位置与所述功率模块固定区域相对应。
2.根据权利要求1所述的适用于塑封功率模块的压缩模具，其特征在于，所述功率模块固定区域的形状、尺寸与功率模块的金属底板外形相适配。
3.根据权利要求2所述的适用于塑封功率模块的压缩模具，其特征在于，所述功率模块的金属底板上设置有针翅，所述功率模块固定区域上设置有相应的插孔。
4.根据权利要求1所述的适用于塑封功率模块的压缩模具，其特征在于，所述上模的下表面或所述下模的上表面设置有密封件；
所述密封件设置于所述上模的下表面时，环绕设置于所述功率模块固定区域四周，所述环氧树脂腔位于所述密封件在所述下模的投影之内；
所述密封件设置于所述下模的上表面是，环绕设置于所述环氧树脂腔的四周，所述功率模块固定区域位于所述密封件在所述上模的投影之内。
5.根据权利要求4所述的适用于塑封功率模块的压缩模具，其特征在于，密封件包括密封圈。
6.根据权利要求1所述的适用于塑封功率模块的压缩模具，其特征在于，还包括抽气结构；
所述抽气结构包括气道，所述气道位于所述下模中，一端连通所述环氧树脂腔，另一端连通所述下模的外部；
所述气道的另一端连接有抽气设备，或者所述气道中密封连接有针管，所述针管与抽气设备连接。
7.根据权利要求1所述的适用于塑封功率模块的压缩模具，其特征在于，所述功率模块固定区域内设置有真空吸盘或夹具。
8.一种塑封功率模块的方法，其特征在于，包括采用权利要求1至7任一项所述的适用于塑封功率模块的压缩模具，执行步骤包括：
S1、在开模状态下，将功率模块的金属底板侧固定至所述上模的功率模块固定区域，在所述下模的环氧树脂腔内填充环氧树脂液体；
S2、合模，使功率模块浸入环氧树脂液体中；
S3、固化环氧树脂液体，得到封装后的功率模块。
9.根据权利要求8所述的塑封功率模块的方法，其特征在于，所述功率模块的金属底板上设置有针翅，所述功率模块固定区域上设置有相应的插孔；
在步骤S1中，将所述功率模块的针翅插入对应的插孔中。
10.根据权利要求8所述的塑封功率模块的方法，其特征在于，在步骤S2中，合模后还包括对环氧树脂腔进行抽气预设的时间。
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