CN111770675A - Hot pressing method and hot pressing equipment for manufacturing curved surface module, curved surface module and application - Google Patents
Hot pressing method and hot pressing equipment for manufacturing curved surface module, curved surface module and application Download PDFInfo
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- CN111770675A CN111770675A CN202010566798.1A CN202010566798A CN111770675A CN 111770675 A CN111770675 A CN 111770675A CN 202010566798 A CN202010566798 A CN 202010566798A CN 111770675 A CN111770675 A CN 111770675A
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- curved surface
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
Abstract
The invention relates to a hot pressing method and hot pressing equipment for manufacturing a curved surface module, the curved surface module and application. The hot pressing method for manufacturing the curved surface module comprises the following steps: sequentially laminating a conducting adhesive layer and a laminating material layer on the curved-surface substrate to obtain a laminated member, wherein the conducting adhesive layer comprises a binder and conductive particles; carrying out laser irradiation on the laminated piece to focus laser spots on the conducting adhesive layer so as to cure the binder of the conducting adhesive layer; and (3) pressurizing the laminated piece by adopting a pressure head to obtain a curved surface module, wherein the shape of the pressure head is matched with that of the curved surface substrate. The hot pressing method for manufacturing the curved surface module can obtain the module with the curved surface shape, and the pressing parallelism and the pressing precision between the pressing material layer and the base material are good.
Description
Technical Field
The invention relates to a hot pressing method and hot pressing equipment for manufacturing a curved surface module, the curved surface module and application.
Background
The hot-pressing binding process of the module technology in the display industry refers to that a pressing material layer (such as an IC drive chip, a COF flip chip film, an FPC flexible printed circuit board and the like) is pressed with glass (such as a liquid crystal display or a touch screen and the like) or a flexible substrate (such as an OLED flexible screen, a touch layer or a film material and the like) through the reaction of an ACF (anisotropic conductive film) under the condition of certain temperature and pressure, so that the purpose of conducting the pressing material layer and the glass or the flexible substrate is achieved.
In the conventional industry, a hot pressing head is used to perform planar pressing on a pressing material layer and glass or a flexible substrate, that is, the pressing of the pressing material layer and the glass or the flexible substrate occurs in a planar state. With the development of products and new technologies, such as earphones, cameras, glasses and other products, the appearance of the curved surface becomes a new development trend. And traditional hot pressing binding technology is plane hot pressing, when being used for curved surface hot pressing, because the hot pressing head has great deformation under high temperature to make the pressfitting material layer and glass or flexible substrate's hot pressing depth of parallelism and precision difficult to guarantee, thereby can't satisfy the technical demand of curved surface hot pressing.
Disclosure of Invention
Therefore, it is necessary to provide a hot pressing method for manufacturing a curved surface module, which can improve the parallelism and precision of the pressing between the pressing material layer and the substrate.
In addition, still provide the hot pressing equipment of the application and the preparation curved surface module of a curved surface module, curved surface module.
A hot pressing method for manufacturing a curved surface module comprises the following steps:
sequentially laminating a conducting adhesive layer and a laminating material layer on the curved-surface substrate to obtain a laminated member, wherein the conducting adhesive layer comprises a binder and conductive particles;
laser irradiating the laminate such that a spot of laser light is focused on the conductive adhesive layer to cure the adhesive of the conductive adhesive layer; and
and (3) adopting a pressure head to carry out pressurization treatment on the laminated member to obtain a curved surface module, wherein the shape of the pressure head is adapted to the shape of the curved surface substrate.
In one embodiment, the step of laser irradiating the laminate to focus a laser spot on the conductive glue layer comprises: and carrying out laser irradiation on the laminated member, and then carrying out optical path adjustment on the laser to ensure that the direction of the laser incident to any point of the conductive adhesive layer is the same as the curvature direction of any point on the conductive adhesive layer.
In one embodiment, the curved substrate is selected from at least one of glass and a flexible substrate.
In one embodiment, the lamination material layer is at least one selected from an IC chip, a flip chip, and a flexible printed circuit board.
In one embodiment, the conductive adhesive layer is an anisotropic conductive adhesive layer.
In one embodiment, the step of applying pressure to the laminate using a pressure head comprises: the side of the laminate adjacent the curved substrate is placed on a support platform and the laminate is then subjected to a pressure from the side adjacent the layer of laminating material using the pressure head.
In one embodiment, the step of laser irradiating the laminate and the step of pressing the laminate with an indenter are performed simultaneously.
In one embodiment, the step of laser irradiating the laminate includes laser irradiating the laminate from a side proximate to the curved substrate, and the step of press processing the laminate includes press processing the laminate from a side remote from the curved substrate.
A curved surface module is manufactured by the hot pressing method for manufacturing the curved surface module.
The curved surface module is applied to the preparation of earphones, cameras, display screens or glasses.
The utility model provides a hot pressing equipment of preparation curved surface module, includes:
the laminating piece comprises a curved surface substrate, a conducting adhesive layer and a laminating material layer which are sequentially stacked, and the shape of the pressure head is adapted to the shape of the curved surface substrate; and
a laser apparatus including a laser emitting unit capable of emitting laser light, and a spot of the laser light emitted by the laser emitting unit is capable of being focused on the conductive adhesive layer of the laminate to cure the adhesive of the conductive adhesive layer.
In one embodiment, the laser device further includes a light path adjusting unit, and the light path adjusting unit can adjust the direction of the laser emitted by the laser emitting unit, so that the direction of the laser incident to any point on the conductive adhesive layer is the same as the curvature direction of any point on the conductive adhesive layer.
In one embodiment, the optical path adjusting unit includes at least one of a beam reduction mirror, a beam expansion mirror, a reflecting mirror, a beam splitter, a polarizer, and an integrated optical path control module.
In one embodiment, the pressing device further comprises a support platform capable of supporting the stack, and the support platform is shaped to conform to the shape of the curved substrate.
According to the hot pressing method for manufacturing the curved surface module, laser irradiation is carried out on the laminated piece, laser light spots are focused on the conducting adhesive layer, and therefore heating treatment is carried out on the conducting adhesive layer, the binder in the conducting adhesive layer is solidified, and the pressing material layer and the curved surface substrate are bonded together. The pressure head is used for pressurizing the laminated piece, and the pressure head is not required to be heated or kept in a low-temperature state, so that the pressure head is not deformed at high temperature, and the parallelism and the precision during pressing are improved. Therefore, the hot pressing method for manufacturing the curved surface module can obtain the module with the curved surface shape, and the pressing parallelism and the precision between the pressing material layer and the base material are good.
Drawings
FIG. 1 is a process flow diagram of a hot pressing method for manufacturing a curved surface module according to an embodiment;
FIG. 2 is a schematic view of a hot pressing method for manufacturing a curved surface module when the curved surface substrate is a convex surface substrate;
FIG. 3 is a schematic view of a hot pressing method for manufacturing a curved surface module when the curved surface substrate is a concave surface substrate;
fig. 4 is a schematic diagram of a hot-pressing method for manufacturing a curved surface module when the curved surface substrate is a convex surface substrate and the laser path is adjusted.
Detailed Description
In order that the invention may be more fully understood, reference will now be made to the following description taken in conjunction with the accompanying drawings. The detailed description sets forth the preferred embodiments of the invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
In this specification, the curvature direction of a certain point on the conductive adhesive layer refers to a direction perpendicular to a tangent line of the certain point on the conductive adhesive layer. The curvature refers to the degree of curvature of the curved material or curved substrate to be laminated, and can be defined by the radius of curvature.
Referring to fig. 1, a hot pressing method for manufacturing a curved surface module according to an embodiment includes the following steps:
step S110: and sequentially laminating a conducting adhesive layer and a laminating material layer on the curved substrate to obtain the laminated member, wherein the conducting adhesive layer comprises a binder and conductive particles.
Wherein, the curved substrate is selected from at least one of glass and flexible substrate. The laminating material layer is at least one selected from an IC chip, a Chip On Film (COF) and a Flexible Printed Circuit (FPC).
Specifically, in one embodiment, the curved substrate is glass, and the laminating material layer is an IC chip.
In one embodiment, the curved substrate is glass, and the laminating material layer is a flexible printed circuit board.
In one embodiment, the curved substrate is glass and the laminating material layer is a flip-chip film.
In one embodiment, the curved substrate is a flip-chip film or a flexible substrate, and the laminated material layer is a flexible printed circuit board.
In one embodiment, the curved substrate is a flexible substrate, and the laminating material layer is an IC chip.
In one embodiment, the curved substrate is a flexible substrate, and the laminating material layer is a flexible printed circuit board or a flip-chip film.
Specifically, the curved substrate is a concave substrate or a convex substrate.
The material of the conductive adhesive layer comprises conductive particles and a binder. The adhesive can be solidified under the heating condition, so that the laminating material layer and the curved substrate are bonded together. In one embodiment, the binder is a thermosetting resin. Specifically, the binder may also be epoxy resin, polyimide, or the like. In one embodiment, the conductive particles are nickel-plated polymeric microspheres or gold-plated polymeric microspheres. In the conductive adhesive layer, the conductive particles are uniformly dispersed in the binder.
In one embodiment, the conductive adhesive layer is an anisotropic conductive Adhesive (ACF). The anisotropic conductive adhesive layer is formed by dispersing micron-sized monodisperse nickel (or gold) plated polymer microspheres with uniform particle sizes in resin. The anisotropic conductive adhesive layer is conductive in the thickness direction and insulating in the plane direction. It is to be understood that the conductive adhesive layer in this embodiment is not limited to an anisotropic conductive adhesive layer, and any conductive adhesive layer having a conductive and adhesive function may be used as the conductive adhesive layer in this embodiment.
Specifically, in this embodiment, the shape of the conductive adhesive layer, the shape of the pressing material layer, and the shape of the curved substrate are adapted to make the conductive adhesive layer, the pressing material layer, and the curved substrate closely fit. In one embodiment, the shape of the conductive adhesive layer, the shape of the laminating material layer and the shape of the curved substrate are the same.
Step S120: and carrying out laser irradiation on the laminated piece, and focusing laser spots on the conducting adhesive layer so as to cure the binder of the conducting adhesive layer.
Adopt laser to heat the glue film that switches on for the pressure head need not reheat or keep the lower temperature state when carrying out the pressfitting with the pressure head, thereby avoids the pressure head to produce deformation when the high temperature, effectively improves the depth of parallelism and the precision when the pressfitting. In addition, the laser is adopted for heating, the heating position can be accurately controlled, and compared with the traditional mode of adopting a high-temperature high-pressure head, the conduction of the temperature between the pressing material layer and the conduction glue layer is reduced.
In one embodiment, step S120 includes: and carrying out laser irradiation on the laminated piece, and then carrying out light path adjustment on the laser to ensure that the direction of the laser incident to any point on the conductive adhesive layer is consistent with the curvature direction of any point on the conductive adhesive layer. Further, in the present embodiment, the laminate is irradiated with laser light in a direction close to the curved substrate.
The direction of the laser which is incident to the conducting adhesive layer is adjusted, so that the laser is uniformly incident to the conducting adhesive layer, the heating conditions of different positions on the conducting adhesive layer are the same, and the binder on different positions of the conducting adhesive layer is uniformly cured to uniformly bond the substrate and the press-fit material layer together.
Specifically, in the present embodiment, the wavelength and power of the laser, the irradiation time of the laser, and the like can be adjusted depending on the material of the conductive adhesive layer.
Specifically, in the step of adjusting the optical path of the laser, the optical path of the laser may be adjusted by using an optical path adjusting unit. The optical path adjusting unit comprises at least one of a beam shrinking mirror, a beam expanding mirror, a reflecting mirror, a beam splitting mirror, a polaroid and an integrated optical path control module. It is understood that in other embodiments, the optical path adjusting unit may also include other structures.
Step S130: and (3) pressurizing the laminated piece by adopting a pressure head, wherein the shape of the pressure head is matched with that of the curved surface substrate, so that the curved surface module is obtained.
Specifically, the shape of the pressure head is adapted to the shape of the curved substrate, so that the pressure head is tightly attached to the curved substrate. In one embodiment, the indenter has the same shape as the curved substrate.
Specifically, the step of pressing the laminate with the indenter includes: the side of the laminate adjacent the curved substrate is placed on a support platform and the laminate is then pressed from the side adjacent the layer of laminating material using a press head. Wherein, the shape of the supporting platform is adapted to the shape of the curved surface base material. Specifically, the shape of the support platform is the same as the shape of the curved substrate.
Specifically, the step of irradiating the laminate with laser light to focus a spot of the laser light on the conductive adhesive layer to cure the adhesive of the conductive adhesive layer and the step of pressing the laminate with a pressing head are performed simultaneously. In one embodiment, the step of irradiating the laminate with laser light includes irradiating the laminate with laser light from a side close to the curved substrate, and the step of pressing the laminate includes pressing the laminate from a side away from the curved substrate. Therefore, in the actual processing process, the laser irradiates on the conducting glue layer, the pressure head is not heated, and the deformation of the pressure head at high temperature is avoided.
In step S130, the conductive particles in the conductive adhesive layer along the vertical direction are contacted and conducted, so that the curved surface module is conducted in the vertical direction.
Specifically, referring to fig. 2, the curved substrate 210 is a convex substrate, the conductive adhesive layer 220 is stacked on the curved substrate 210, and the pressing material layer 230 is stacked on a side of the conductive adhesive layer 220 away from the curved substrate 210. Under the irradiation of the laser 410, a laser spot is focused on the conductive adhesive layer 220, so that the adhesive in the conductive adhesive layer 220 is cured. Then, the stacked body is placed on the supporting platform 320, and the stacked body is pressed by the pressing head 310 to conduct the conductive particles in the conductive adhesive layer 220.
Referring to fig. 3, the curved substrate 210 is a concave substrate, the conductive adhesive layer 220 is stacked on the curved substrate 210, and the pressing material layer 230 is stacked on a side of the conductive adhesive layer 220 away from the curved substrate 210. Under the irradiation of the laser 410, a laser spot is focused on the conductive adhesive layer 220, so that the adhesive in the conductive adhesive layer 220 is cured. Then, the stacked body is placed on the supporting platform 320, and the stacked body is pressed by the pressing head 310 to conduct the conductive particles in the conductive adhesive layer 220.
When the optical path adjustment unit 420 is used to adjust the optical path, referring to fig. 4, the curved substrate 210 is a convex substrate, the conductive adhesive layer 220 is stacked on the curved substrate 210, and the pressing material layer 230 is stacked on a side of the conductive adhesive layer 220 away from the curved substrate 210. The laser 410 passes through the light path adjusting unit 420 to adjust the incident direction, and is incident on the conductive adhesive layer 220 along the curvature direction of the conductive adhesive layer 220, so that the light is uniformly emitted, and the binder in the conductive adhesive layer 220 is uniformly cured. Then, the stacked body is placed on the supporting platform 320, and the stacked body is pressed by the pressing head 310 to conduct the conductive particles in the conductive adhesive layer 220.
With the development of products and new technologies, such as earphones, cameras, glasses and other products, the appearance of the curved surface becomes a new development trend. The traditional hot-pressing binding process is planar hot pressing and cannot meet the technical requirement of curved surface hot pressing (including concave surfaces and convex surfaces). Similar to the hot-press binding, for example, curved surface pressing in which a pressing material layer and a curved surface substrate are attached together by a material with conduction or bonding characteristics also requires development of a process for directly pressing curved surfaces due to process or material limitations; such as COP, that is, after the IC chip is thermally pressed on the flexible OLED, if the curved surface is attached, there is a risk that the IC chip may be poorly cleaved when bent.
The hot pressing method for manufacturing the curved surface module at least has the following advantages:
(1) according to the hot pressing method for manufacturing the curved surface module, the laser heating mode is adopted, laser spots are directly focused on the curved surface conducting adhesive layer by controlling laser light emitting, pressing is carried out by using the pressing head, the pressing head does not need to be heated or keeps a low-temperature state, so that the pressing head is prevented from deforming at a high temperature, and the parallelism and the precision during pressing are effectively improved.
(2) According to the hot pressing method for manufacturing the curved surface module, the curvature direction of the curved surface substrate is fitted by adjusting the direction of the laser incident to the conductive adhesive layer, so that the requirement of uniform light emission of the curved surface is met.
(3) The hot pressing method for manufacturing the curved surface module is simple in process and easy for industrial preparation of the curved surface module.
(4) Future products and materials are more and more sensitive to temperature, the heat conduction of the temperature among different materials needs to be reduced as much as possible, the temperature heating position control and precision requirements are higher and higher, the heating position can be accurately controlled by adopting a laser technology, and compared with the traditional mode of adopting a high-temperature high-pressure head, the conduction of the temperature between a laminating material layer and a conducting adhesive layer is reduced.
The curved surface module of an embodiment is manufactured by the hot pressing method for manufacturing the curved surface module of the above embodiment. Specifically, the shape of the curved surface module of the present embodiment is a curved surface, such as a concave surface or a convex surface, so that the curved surface module can be used in the preparation of curved surface products.
The curved surface module of an embodiment is applied to the preparation of earphones, display screens, cameras or glasses. Specifically, the display screen may include a Liquid Crystal Display (LCD), an Organic Light Emitting Diode (OLED), a sub-millimeter light emitting diode (mini-LED), a Micro light emitting diode (Micro-LED), or the like.
The hot pressing device for manufacturing the curved surface module of the embodiment comprises a laser device and a pressurizing device.
Wherein, the pressure device includes the pressure head, and the pressure head can carry out pressurization processing to the lamination. The laminated member comprises a curved surface base material, a conductive adhesive layer and a pressing material layer which are sequentially arranged in a laminated manner, and the shape of the pressure head is adapted to the shape of the curved surface base material. In this embodiment, the configuration of the indenter may be one commonly used in the art.
Wherein, the curved substrate is selected from at least one of glass and flexible substrate. The laminating material layer is at least one selected from an IC chip, a Chip On Film (COF) and a Flexible Printed Circuit (FPC).
Specifically, in one embodiment, the curved substrate is glass, and the laminating material layer is an IC chip.
In one embodiment, the curved substrate is glass, and the laminating material layer is a flexible printed circuit board.
In one embodiment, the curved substrate is glass and the laminating material layer is a flip-chip film.
In one embodiment, the curved substrate is a flip-chip film or a flexible substrate, and the laminated material layer is a flexible printed circuit board.
In one embodiment, the curved substrate is a flexible substrate, and the laminating material layer is an IC chip.
In one embodiment, the curved substrate is a flexible substrate, and the laminating material layer is a flexible printed circuit board or a flip-chip film.
Specifically, the curved substrate is a concave substrate or a convex substrate.
The material of the conductive adhesive layer comprises conductive particles and a binder. The adhesive can be solidified under the heating condition, so that the laminating material layer and the curved substrate are bonded together. In one embodiment, the binder is a thermosetting resin. Specifically, the binder may also be epoxy resin, polyimide, or the like. In one embodiment, the conductive particles are nickel-plated polymeric microspheres or gold-plated polymeric microspheres. The conductive particles are uniformly dispersed in the binder in the conductive adhesive layer.
In one embodiment, the conductive adhesive layer is an anisotropic conductive Adhesive (ACF). The anisotropic conductive adhesive layer is formed by dispersing micron-sized monodisperse nickel (or gold) plated polymer microspheres with uniform particle sizes in resin. The anisotropic conductive adhesive layer is conductive in the thickness direction and insulating in the plane direction. It is to be understood that the conductive adhesive layer in this embodiment is not limited to an anisotropic conductive adhesive layer, and any conductive adhesive layer having a conductive and adhesive function may be used as the conductive adhesive layer in this embodiment.
Specifically, in this embodiment, the shape of the conductive adhesive layer, the shape of the pressing material layer, and the shape of the curved substrate are adapted to make the conductive adhesive layer, the pressing material layer, and the curved substrate closely fit. In one embodiment, the shape of the conductive adhesive layer, the shape of the laminating material layer and the shape of the curved substrate are the same.
In some embodiments, the compression device further comprises a support platform. The support platform is capable of supporting the stack and is shaped to conform to the shape of the curved substrate. In particular, the support platform is disposed on a side of the stack adjacent to the curved substrate. The support platform is configured to provide a support force to the stack when the pressure head is used to apply pressure to the stack.
The laser device can carry out laser heating treatment on the conducting adhesive layer of the laminated piece so as to cure the binder of the conducting adhesive layer.
Specifically, the laser apparatus includes a laser emitting unit capable of emitting laser light and a spot of the laser light emitted by the laser emitting unit is capable of being focused on the conductive adhesive layer of the laminate to cure the adhesive of the conductive adhesive layer. Specifically, the laser emitting unit may be a laser, such as a solid laser, a liquid laser, a gas laser, a semiconductor laser, or a fiber laser. In this embodiment, the laser emitting unit may be plural. The laser that a plurality of laser emission units sent interferes each other to through the position and the wavelength of adjusting a plurality of laser emission units, make the laser that a plurality of laser emission units sent incide on the glue film that switches on along the camber direction that switches on the glue film.
Further, in some embodiments, the laser apparatus further includes an optical path adjusting unit capable of adjusting a propagation direction of the laser light emitted by the laser emitting unit. Specifically, the optical path adjusting unit can make the direction of the laser incident to any point on the conductive adhesive layer be the same as the curvature direction of any point on the conductive adhesive layer. The propagation direction of the laser emitted by the laser emitting unit can be adjusted by arranging the light path adjusting unit, so that the laser can be uniformly incident on the conductive adhesive layer.
In one embodiment, the optical path adjusting unit includes at least one of a beam reduction mirror, a beam expansion mirror, a reflection mirror, a beam splitter, a polarizer, and an integrated optical path control module. It is understood that in other embodiments, the optical path adjusting unit may also include other structures.
The hot pressing equipment for manufacturing the curved surface module at least has the following advantages:
(1) above-mentioned hot pressing equipment of preparation curved surface module can make the module that obtains the curved surface shape, and laser device can heat the glue film that switches on of lamination in the preparation equipment of curved surface module, and the position that can the accurate control heating, and avoids adopting traditional pressure device to heat the deformation that causes the pressure head to lamination to the depth of parallelism and the precision of pressfitting material layer with the substrate pressfitting in-process have been improved.
(2) The hot pressing equipment for manufacturing the curved surface module is simple in structure, can be used for manufacturing various curved surface modules, and is easy for industrial production.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A hot pressing method for manufacturing a curved surface module is characterized by comprising the following steps:
sequentially laminating a conducting adhesive layer and a laminating material layer on the curved-surface substrate to obtain a laminated member, wherein the conducting adhesive layer comprises a binder and conductive particles;
laser irradiating the laminate such that a spot of laser light is focused on the conductive adhesive layer to cure the adhesive of the conductive adhesive layer; and
and (3) adopting a pressure head to carry out pressurization treatment on the laminated member to obtain a curved surface module, wherein the shape of the pressure head is adapted to the shape of the curved surface substrate.
2. The method according to claim 1, wherein the step of irradiating the laminate with laser light to focus the laser spot on the conductive adhesive layer comprises: and carrying out laser irradiation on the laminated member, and then carrying out optical path adjustment on the laser to ensure that the direction of the laser incident to any point on the conductive adhesive layer is the same as the curvature direction of any point on the conductive adhesive layer.
3. The hot-pressing method for manufacturing a curved surface module according to claim 1, wherein the curved surface substrate is at least one selected from glass and flexible substrate; and/or the presence of a catalyst in the reaction mixture,
the laminating material layer is selected from at least one of an IC chip, a chip on film and a flexible printed circuit board; and/or the presence of a catalyst in the reaction mixture,
the conduction glue layer is an anisotropic conductive glue layer.
4. A method according to any one of claims 1 to 3, wherein the step of applying pressure to the stack using a press head comprises: placing the side of the laminate close to the curved substrate on a support platform, and then pressing the laminate with the press head from the side close to the press material layer; and/or the presence of a catalyst in the reaction mixture,
the step of laser irradiating the laminate and the step of press treating the laminate are performed simultaneously; and/or the presence of a catalyst in the reaction mixture,
the step of laser irradiating the laminate may be performed from a side near the curved substrate, and the step of press-processing the laminate may be performed from a side remote from the curved substrate.
5. A curved surface module, which is manufactured by the hot pressing method for manufacturing a curved surface module according to any one of claims 1 to 4.
6. Use of the curved surface module of claim 5 in the manufacture of an earphone, a camera, a display screen or spectacles.
7. The utility model provides a hot pressing equipment of preparation curved surface module which characterized in that includes:
the laminating piece comprises a curved surface substrate, a conducting adhesive layer and a laminating material layer which are sequentially stacked, and the shape of the pressure head is adapted to the shape of the curved surface substrate; and
a laser apparatus including a laser emitting unit capable of emitting laser light, and a spot of the laser light emitted by the laser emitting unit is capable of being focused on the conductive adhesive layer of the laminate to cure the adhesive of the conductive adhesive layer.
8. The hot pressing apparatus for manufacturing curved surface modules according to claim 7, wherein the laser device further comprises a light path adjusting unit, and the light path adjusting unit can adjust the direction of the laser emitted by the laser emitting unit, so that the direction of the laser incident to any point on the conductive adhesive layer is the same as the curvature direction of any point on the conductive adhesive layer.
9. The apparatus according to claim 8, wherein the optical path adjusting unit comprises at least one of a beam shrinking mirror, a beam expanding mirror, a reflector, a beam splitter, a polarizer, and an integrated optical path control module.
10. The apparatus according to any one of claims 7 to 9, wherein the pressing device further comprises a support platform capable of supporting the stacked layer, and the support platform is adapted to the curved substrate.
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