CN111752099B - Photosensitive resin composition, application thereof, color filter and image display device - Google Patents
Photosensitive resin composition, application thereof, color filter and image display device Download PDFInfo
- Publication number
- CN111752099B CN111752099B CN201910253098.4A CN201910253098A CN111752099B CN 111752099 B CN111752099 B CN 111752099B CN 201910253098 A CN201910253098 A CN 201910253098A CN 111752099 B CN111752099 B CN 111752099B
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- photosensitive resin
- resin composition
- quantum dot
- dot particles
- photoinitiator
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- 239000011342 resin composition Substances 0.000 title claims abstract description 65
- 239000002245 particle Substances 0.000 claims abstract description 68
- 239000002096 quantum dot Substances 0.000 claims abstract description 64
- 150000001875 compounds Chemical class 0.000 claims abstract description 43
- 150000002148 esters Chemical class 0.000 claims abstract description 24
- 239000011347 resin Substances 0.000 claims abstract description 23
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 238000001723 curing Methods 0.000 claims abstract description 20
- 238000000016 photochemical curing Methods 0.000 claims abstract description 7
- -1 1- (4-thiophenylphenyl) - (3-cyclopentyl) -propane-1, 2-dione-2-oxime benzoate Chemical group 0.000 claims description 33
- 238000005424 photoluminescence Methods 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000000049 pigment Substances 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 239000002270 dispersing agent Substances 0.000 claims description 3
- WARNCFFMTDWCLS-UHFFFAOYSA-N CC1=C(C(=O)C2=C(C=CC=C2)P(C2=CC=CC=C2)(CC)=O)C(=CC(=C1)C)C Chemical compound CC1=C(C(=O)C2=C(C=CC=C2)P(C2=CC=CC=C2)(CC)=O)C(=CC(=C1)C)C WARNCFFMTDWCLS-UHFFFAOYSA-N 0.000 claims description 2
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 claims description 2
- 239000000654 additive Substances 0.000 claims description 2
- BFYJDHRWCNNYJQ-UHFFFAOYSA-N oxo-(3-oxo-3-phenylpropoxy)-(2,4,6-trimethylphenyl)phosphanium Chemical group CC1=CC(C)=CC(C)=C1[P+](=O)OCCC(=O)C1=CC=CC=C1 BFYJDHRWCNNYJQ-UHFFFAOYSA-N 0.000 claims description 2
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- 239000003999 initiator Substances 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 11
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- 239000000203 mixture Substances 0.000 description 28
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 26
- 238000000034 method Methods 0.000 description 21
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 20
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- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 12
- 125000001424 substituent group Chemical group 0.000 description 11
- 239000000178 monomer Substances 0.000 description 10
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 10
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- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 8
- 239000010408 film Substances 0.000 description 8
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 7
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 7
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical compound C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 7
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- 239000011258 core-shell material Substances 0.000 description 6
- 125000004093 cyano group Chemical group *C#N 0.000 description 6
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- 229910052736 halogen Inorganic materials 0.000 description 6
- 150000002367 halogens Chemical class 0.000 description 6
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- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 6
- 125000000542 sulfonic acid group Chemical group 0.000 description 6
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 5
- 239000004926 polymethyl methacrylate Substances 0.000 description 5
- 239000001384 succinic acid Substances 0.000 description 5
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 125000005119 alkyl cycloalkyl group Chemical group 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
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- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 229920001610 polycaprolactone Polymers 0.000 description 4
- 239000004632 polycaprolactone Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910052717 sulfur Inorganic materials 0.000 description 4
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 3
- 229910004613 CdTe Inorganic materials 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 3
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- 229910021480 group 4 element Inorganic materials 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 3
- 239000002105 nanoparticle Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 3
- 238000007704 wet chemistry method Methods 0.000 description 3
- YBNMDCCMCLUHBL-UHFFFAOYSA-N (2,5-dioxopyrrolidin-1-yl) 4-pyren-1-ylbutanoate Chemical compound C=1C=C(C2=C34)C=CC3=CC=CC4=CC=C2C=1CCCC(=O)ON1C(=O)CCC1=O YBNMDCCMCLUHBL-UHFFFAOYSA-N 0.000 description 2
- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 description 2
- UAJRSHJHFRVGMG-UHFFFAOYSA-N 1-ethenyl-4-methoxybenzene Chemical compound COC1=CC=C(C=C)C=C1 UAJRSHJHFRVGMG-UHFFFAOYSA-N 0.000 description 2
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- WFJQDNNVQAUSON-UHFFFAOYSA-N CC(COC(C1=CC=CC=C1C(O)=O)=O)(O)O Chemical compound CC(COC(C1=CC=CC=C1C(O)=O)=O)(O)O WFJQDNNVQAUSON-UHFFFAOYSA-N 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
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- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
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- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
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- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 description 2
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- POTYORUTRLSAGZ-UHFFFAOYSA-N (3-chloro-2-hydroxypropyl) prop-2-enoate Chemical compound ClCC(O)COC(=O)C=C POTYORUTRLSAGZ-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
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- ZZSKMNCIAKKVRB-UHFFFAOYSA-N morpholin-4-yl-(2-nitrophenyl)methanone Chemical compound [O-][N+](=O)C1=CC=CC=C1C(=O)N1CCOCC1 ZZSKMNCIAKKVRB-UHFFFAOYSA-N 0.000 description 1
- BSCJIBOZTKGXQP-UHFFFAOYSA-N n-(2-hydroxyethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCCO BSCJIBOZTKGXQP-UHFFFAOYSA-N 0.000 description 1
- UUORTJUPDJJXST-UHFFFAOYSA-N n-(2-hydroxyethyl)prop-2-enamide Chemical compound OCCNC(=O)C=C UUORTJUPDJJXST-UHFFFAOYSA-N 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- QNILTEGFHQSKFF-UHFFFAOYSA-N n-propan-2-ylprop-2-enamide Chemical compound CC(C)NC(=O)C=C QNILTEGFHQSKFF-UHFFFAOYSA-N 0.000 description 1
- SFBTTWXNCQVIEC-UHFFFAOYSA-N o-Vinylanisole Chemical compound COC1=CC=CC=C1C=C SFBTTWXNCQVIEC-UHFFFAOYSA-N 0.000 description 1
- FSAJWMJJORKPKS-UHFFFAOYSA-N octadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C=C FSAJWMJJORKPKS-UHFFFAOYSA-N 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical class C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229940059574 pentaerithrityl Drugs 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- QTECDUFMBMSHKR-UHFFFAOYSA-N prop-2-enyl prop-2-enoate Chemical compound C=CCOC(=O)C=C QTECDUFMBMSHKR-UHFFFAOYSA-N 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000001062 red colorant Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- RSVDRWTUCMTKBV-UHFFFAOYSA-N sbb057044 Chemical compound C12CC=CC2C2CC(OCCOC(=O)C=C)C1C2 RSVDRWTUCMTKBV-UHFFFAOYSA-N 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052950 sphalerite Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 230000000638 stimulation Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- GRPURDFRFHUDSP-UHFFFAOYSA-N tris(prop-2-enyl) benzene-1,2,4-tricarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C(C(=O)OCC=C)=C1 GRPURDFRFHUDSP-UHFFFAOYSA-N 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Optics & Photonics (AREA)
- Materials For Photolithography (AREA)
Abstract
The invention provides a photosensitive resin composition, application thereof, a color filter and an image display device. The photosensitive resin composition comprises: (A) photoluminescent quantum dot particles; (B) the photoinitiator comprises ketoxime ester photoinitiators; (C) an alkali-soluble resin; (D) a photopolymerizable compound; the ketoxime ester photoinitiator is selected from one or more compounds with the structure shown in formula (I). The ketoxime ester photoinitiator contains conjugated groups, so that a larger delocalized structure can be formed, fragments formed by the initiator still have higher stability and photocuring effect after initiation reaction, and further deeper curing reaction is facilitated. On the basis, the photosensitive resin composition containing the initiator has high initiation activity and stability, and a photosensitive resin layer formed after curing has high bottom curing rate.
Description
Technical Field
The invention relates to the field of photocuring, in particular to a photosensitive resin composition, application, a color filter and an image display device.
Background
In general, a color filter is manufactured by forming pixels of red, green, and blue on a transparent substrate by a dyeing method, a printing method, an electro-deposition method, a pigment dispersion method, and the like. Among them, the pigment dispersion method is currently the mainstream method in industry. The pigment dispersion method is a method in which a photosensitive resin composition containing a coloring material is coated on a transparent substrate, followed by image exposure, development and, optionally, post-curing, and a color filter is formed by repeating these processes. The method has the advantages of high heat resistance, no need of dyeing, and can form a high-precision pixel coloring layer.
There is a limit in improving contrast and brightness. Therefore, when a dye is used as the colorant, the brightness of an image displayed can be improved by utilizing the color purity of the dye itself. In addition, since the dye does not have coarse particles, it is considered that the contrast can be improved. In addition, in the field of color filters, in order to achieve high color purity of display elements and high color resolution of light receiving elements, the concentration of a colorant tends to be high, and residues or stains are likely to be generated on the base or light shielding layer of unexposed portions during development, which may result in insufficient adhesion to a substrate, insufficient hardening, or poor pattern formability in exposed portions. It is mentioned in the prior art that the colorants generally trap the active radicals generated by the initiator, thus deactivating it and failing to achieve sufficient hardening.
Although color reproduction is achieved by light emitted from a light source passing through a color filter, in this process, a part of the light is absorbed by the color filter, so that light efficiency is lowered, and there is a fundamental limit that perfect color reproduction cannot be achieved due to the characteristics of the pigment as the color filter. In view of this, quantum dot photoresist technology is continuously developed, and the prior literature reports the application of different quantum dot-containing photosensitive compositions, so as to solve the problem of color saturation to a certain extent.
Compared with the LCD technology, the QLED technology needs water and oxygen resistance, which increases a certain film thickness and has higher requirements on the comprehensive performance of the initiator. However, in the formula of the quantum dot composition disclosed in the prior art, the initiator is easy to deactivate in the initiation process, the bottom curing efficiency is not ideal, and the development of the quantum dot technology is limited to a certain extent.
Disclosure of Invention
The invention mainly aims to provide a photosensitive resin composition, application thereof, a color filter and an image display device, and aims to solve the problems of low initiation activity, easy inactivation and poor bottom curing efficiency of the conventional photosensitive resin composition.
In order to achieve the above object, according to one aspect of the present invention, there is provided a photosensitive resin composition comprising: (A) photoluminescent quantum dot particles; (B) the photoinitiator comprises ketoxime ester photoinitiators; (C) an alkali-soluble resin; (D) a photopolymerizable compound; the ketoxime ester photoinitiator is selected from one or more compounds with the structure shown in the formula (I):
wherein, in the formula (I), R1Represented as the following group containing two benzene rings:
wherein X is an unsubstituted group, a linker or C1-C5Alkyl radical of (2), Y is O, S, R4N or CR5R6，R4，R5，R6Independently represent hydrogen and C1-C20Straight or branched alkyl, C3-C20Cycloalkyl radical, C4-C20Cycloalkylalkyl of (C)4-C20Alkylcycloalkyl of (A), C2-C20Straight or branched chain alkenes, or groups obtained by substituting the above groups with substituents containing O, N, S, phenyl or aryl;
R3is represented as C1-C20Straight or branched alkyl of (2), C3-C20Cycloalkyl of, C4-C20Cycloalkylalkyl of (C)4-C20Alkylcycloalkyl of (A), C3-C20Heteroaryl group, C6-C20Aryl, or a group obtained by substituting the above group with one or more first substituents, each of which is independently selected from halogen, phenyl, nitro, hydroxyl, carboxyl, sulfonic acid group, amino, cyano or alkoxy;
R2is represented as C1-C20Straight or branched alkyl of (2), C3-C20Cycloalkyl of, C4-C20Cycloalkylalkyl of (C)4-C20Or a group obtained by substituting the above group with one or more second substituents, each of which is independently selected from halogen, nitro, hydroxyl, carboxyl, sulfonic acid group, amino, cyano or alkoxy;
and R is2And/or R4The alkyl cycloalkyl is shown in a formula (II) and contains unsubstituted or one or more third substituent groups, the alkyl cycloalkyl has a structure shown in the formula (II), and each third substituent group is independently selected from halogen, nitro, hydroxyl, carboxyl, sulfonic acid group, amino, cyano or alkoxy,
According to another aspect of the present invention, there is provided a color filter comprising a substrate and a pattern layer disposed on a surface of the substrate, wherein the pattern layer is formed by coating, exposing, developing and curing a photosensitive resin composition, and the photosensitive resin composition comprises the above photosensitive resin composition.
According to still another aspect of the present invention, there is provided an image display device including a color filter including the above color filter.
According to still another aspect of the present invention, there is provided a use of the above photosensitive resin composition in the field of photocuring.
By applying the technical scheme of the invention, in the photosensitive resin composition, the photoluminescence quantum dot particles can emit colored light, the color reproducibility is excellent, and the photoluminescence quantum dot particles can emit light in all directions after being excited by external energy, so that the luminous efficiency of the photosensitive resin composition is improved; and under the action of a photoinitiator, carrying out polymerization reaction on the photopolymerizable compound, the alkali-soluble resin and the photoluminescence quantum dot particles to form a photosensitive resin layer. The ketoxime ester photoinitiator contains conjugated groups, so that a larger delocalized structure can be formed, fragments formed by the initiator still have higher stability and photocuring effect after initiation reaction, and further deeper curing reaction is facilitated. On the basis, the photosensitive resin composition containing the initiator has high initiation activity and stability, and a photosensitive resin layer formed after curing has high bottom curing rate.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail with reference to examples.
As described in the background art, the conventional photosensitive resin composition has problems of low initiation activity, easy deactivation and poor bottom curing efficiency. In order to solve the above technical problem, the present application provides a photosensitive resin composition comprising: (A) photoluminescent quantum dot particles; (B) ketoxime ester photoinitiators or a mixture of acylphosphine oxide photoinitiators and ketoxime ester photoinitiators; (C) an alkali-soluble resin; (D) a photopolymerizable compound; wherein the acylphosphine oxide photoinitiator is one or more selected from the group consisting of 2,4, 6-trimethylbenzoyl-ethoxy-phenylphosphine oxide, 2,4, 6-trimethylbenzoyl-ethyldiphenylphosphine oxide and bis (2,4, 6-trimethylbenzoyl) phenylphosphine oxide; the ketoxime ester photoinitiator is selected from one or more compounds with the structure shown in the formula (I):
wherein, in the formula (I), R1Represented as the following group containing two benzene rings:
wherein X is an unsubstituted group, a linker or C1-C5Alkyl radical of (2), Y is O, S, R4N orCR5R6，R4，R5，R6Independently represent hydrogen and C1-C20Straight or branched alkyl, C3-C20Cycloalkyl radical, C4-C20Cycloalkylalkyl of (C)4-C20Alkylcycloalkyl of (A), C2-C20Straight or branched chain alkenes, or groups obtained by substituting the above groups with substituents containing O, N, S, phenyl or aryl;
R3is represented as C1-C20Straight or branched alkyl of (2), C3-C20Cycloalkyl of, C4-C20Cycloalkylalkyl of (C)4-C20Alkylcycloalkyl of (A), C3-C20Heteroaryl group, C6-C20Aryl, or a group obtained by substituting the above group with one or more first substituents, each of which is independently selected from halogen, phenyl, nitro, hydroxyl, carboxyl, sulfonic acid group, amino, cyano or alkoxy;
R2is represented as C1-C20Straight or branched alkyl of (2), C3-C20Cycloalkyl of, C4-C20Cycloalkylalkyl of (C)4-C20Or a group obtained by substituting the above group with one or more second substituents, each of which is independently selected from halogen, nitro, hydroxyl, carboxyl, sulfonic acid group, amino, cyano or alkoxy;
and R is2And/or R4The alkyl cycloalkyl is shown in a formula (II) and contains unsubstituted or one or more third substituent groups, the alkyl cycloalkyl has a structure shown in the formula (II), and each third substituent group is independently selected from halogen, nitro, hydroxyl, carboxyl, sulfonic acid group, amino, cyano or alkoxy,
In the photosensitive resin composition, the photoluminescence quantum dot particles can emit colored light, the color reproducibility is excellent, and the photoluminescence quantum dot particles can emit light in all directions after being excited by external energy, so that the luminous efficiency of the photosensitive resin composition is improved; and under the action of a photoinitiator, carrying out polymerization reaction on the photopolymerizable compound, the alkali-soluble resin and the photoluminescence quantum dot particles to form a photosensitive resin layer. The ketoxime ester photoinitiator contains conjugated groups, so that a larger delocalized structure can be formed, fragments formed by the initiator still have higher stability and photocuring effect after initiation reaction, and further deeper curing reaction is facilitated. On the basis, the photosensitive resin composition containing the initiator has high initiation activity and stability, and a photosensitive resin layer formed after curing has high bottom curing rate.
In addition, R is1Wherein, when X is an unsubstituted group, the structures shown in the formula (I) are connected only through Y. Such as R1Wherein when X is an unsubstituted group and Y is S, R is1Is composed of
For better understanding of the present application, the photosensitive resin composition of the present invention comprises components (a), (B), (C) (D) and (E), each of which will be described in more detail below.
< photoluminescent Quantum dot particles >
The photosensitive resin composition of the present invention contains photoluminescent quantum dot particles.
Quantum dots are semiconductor substances of nanometer size, and are called quantum dots when each of the nanoparticles has semiconductor characteristics, particularly, when atoms form molecules and the molecules form clusters as small molecular aggregates to form nanoparticles.
When the quantum dot receives energy from the outside and becomes a floating state, energy corresponding to its own energy band gap (energy band gap) is released.
The photosensitive resin composition of the present invention contains such photoluminescence quantum dot particles, and a color filter produced from the same can emit light (photoluminescence) by light irradiation.
In a typical image display device including a color filter, white light passes through the color filter to appear in color, but in this process, a part of the light is absorbed by the color filter, and thus the light efficiency is lowered.
However, when the color filter manufactured from the photosensitive resin composition of the present invention is included, the color filter emits light by itself by light from a light source, and thus more excellent light efficiency can be achieved.
Further, since light having a hue is emitted, color reproducibility is more excellent, and since light is emitted in all directions by photoluminescence, the viewing angle can be improved.
The quantum dot particles of the present invention are not particularly limited as long as they can emit light by light stimulation, and can be selected from, for example, II-VI semiconductor compounds, III-V semiconductor compounds, IV-VI semiconductor compounds, group IV elements, compounds containing the group IV elements, and combinations thereof. These may be used alone or in combination of two or more.
The above II-VI group semiconductor compound may be selected from a binary compound selected from CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe and mixtures thereof; a ternary compound selected from the group consisting of CdSeS, CdSeTe, CdSTe, ZnSeS s, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, and mixtures thereof; and a quaternary element compound selected from the group consisting of CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe and mixtures thereof, and the above group III-V semiconductor compound may be selected from the group consisting of the following compounds; a binary compound selected from the group consisting of GaN, GaP, GaAs, GaSb, AIN, AIP, AIAs, AlSb, InN, InP, InAs, InSb, and mixtures thereof; a tertiary element compound selected from the group consisting of GaNP, GaNAs, GaNSb, GaGaAs, GaPSb, AINP, AINAs, AINSb, AIPAs, AIPSb, InNP, InNAs, InNSb, InPAs, InPSb, GaAINP, and mixtures thereof; and a quaternary element compound selected from the group consisting of GaAINAs, GaAINSb, GaAIPAs, GaAIPSb, galnp, GalnNAs, galnsb, GalnPAs, GalnPSb, InAINP, inainainainainainainanas, InAINSb, InAIPAs, InAIPSb and mixtures thereof, wherein the group IV-VI semiconductor compound may be selected from the group consisting of; a binary compound selected from the group consisting of SnS, SnSe, SnTe, PbS, PbSe, PbTe and mixtures thereof; a ternary compound selected from the group consisting of SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe, and mixtures thereof; and a four-element compound selected from the group consisting of SnPbSSe, SnPbSeTe, SnPbSTe, and mixtures thereof, and the above group IV element or the compound containing the element may be selected from the group consisting of the following compounds; a compound of an element selected from the group consisting of Si, Ge, and mixtures thereof; and a binary compound selected from the group consisting of SiC, SiGe, and mixtures thereof.
The quantum dot particles may be of the following structure: double structures such as homogeneous (homogeneous) single structures, core-shell (core-shell), gradient (gradient) structures, and the like; or a hybrid structure thereof.
In the core-shell (core-shell) dual structure, the substances forming the respective core (core) and shell (shell) may be composed of the above-mentioned semiconductor compounds different from each other. For example, the core may include one or more selected from CdSe, CdS, ZnS, ZnSe, CdTe, CdSeTe, CdZnS, PbSe, aglnnzns, and ZnO, but is not limited thereto. The shell may contain one or more substances selected from CdSe, ZnS, ZnTe, CdTe, PbS, TiO, SrSe, and HgSe, but is not limited thereto. The diameter of the quantum dot particle of the present invention is not particularly limited, and for example, the average particle diameter may be 1 to 40 nm. In addition, in the case of a core-shell (core-shell) dual structure, the average particle diameter of the core may be 0.5 to 10nm, and the average thickness of the shell may be 0.5 to 30 nm. When the average particle diameter and the thickness are within the above ranges, the composition can have different dispersibility, and can exhibit a color when irradiated with light, and can be used for manufacturing a color filter.
The colored photosensitive resin composition for manufacturing a general color filter includes red, green and blue colorants in order to represent a hue, and the photoluminescence quantum dot particles may be classified into red quantum dot particles, green quantum dot particles and blue quantum dot particles, and the quantum dot particles of the present invention may be red quantum dot particles, green quantum dot particles or blue quantum dot particles.
The red, green, and blue quantum dot particles may be classified according to particle size, but the particle size decreases in the order of red, green, and blue. Specifically, the particle size of the red quantum dot particles may be 5 to 10nm, the particle size of the green quantum dot particles may be more than 3 to 5nm, and the particle size of the blue quantum dot particles may be 1 to 3 nm. The quantum dot particles with the particle size are used as the components of the photosensitive resin composition, so that the luminescence property of the photosensitive resin composition is further improved.
When light is irradiated, the red quantum dot particles emit red light, the green quantum dot particles emit green light, and the blue quantum dot particles emit blue light.
The quantum dot particles can be synthesized by a wet chemical process (wet chemical process), a metal organic chemical vapor deposition process, or a molecular beam epitaxy process. The wet chemical process is a method of growing particles by adding a precursor substance to an organic solvent. Since the organic solvent naturally coordinates to the surface of the quantum dot crystal and functions as a dispersant to regulate the crystal growth during crystal growth, the growth of nanoparticles can be controlled by a process that is easier and cheaper than a vapor deposition method such as Metal Organic Chemical Vapor Deposition (MOCVD) or Molecular Beam Epitaxy (MBE).
The content of the quantum dot particles of the present invention is not particularly limited, and for example, the quantum dot particles may be contained in an amount of 3 to 80 parts by weight, preferably 20 to 50 parts by weight, based on 100 parts by weight of the total weight of the solid content of the photosensitive resin composition. If the content of the quantum dot particles is less than 3 wt%, the luminous efficiency is not good, and if the content of the quantum dot particles exceeds 80 wt%, the content of other compositions is relatively insufficient, and there is a problem in that it is difficult to form a pixel pattern.
< acylphosphine oxide photoinitiator or/and ketoxime ester photoinitiator (B) >
The photoinitiator in the photosensitive resin composition can be an acylphosphine oxide photoinitiator and/or a ketoxime ester photoinitiator with a structure shown as a general formula (I).
In a preferred embodiment, the photosensitive resin composition includes a ketoxime ester photoinitiator having a structure represented by formula (I). The ketoxime ester photoinitiator also contains an electron-withdrawing group, so that the initiating activity of the photosensitive resin composition is improved; meanwhile, due to the self characteristics of the structure shown in the formula (I), the formed free radicals have high stability, and the photosensitive resin layer formed after curing has high stability, so that the photosensitive resin layer has the advantage of high bottom curing rate.
In order to further improve the overall performance of the photosensitive resin composition, R may be the same as R1Is further optimized, preferably R1One selected from the following groups:
in a preferred embodiment, the ketoxime ester photoinitiators include, but are not limited to, oxime 1- (4-phenylthiophenyl) -n-octane-1, 2-dione-2-benzoate, oxime 1- (4-phenylthiophenyl) - (3-cyclopentyl) -propane-1, 2-dione-2-benzoate, oxime 1- (4-phenylthiophenyl) - (3-cyclohexyl) -propane-1, 2-dione-2-cyclohexanecarboxylate, oxime 1- [6- (2-methylbenzoyl) -9-ethylcarbazol-3-yl ] - (3-cyclopentyl) -propane-1, 2-dione-2-acetate, oxime ester of methyl-phenyl-n-octane-1, 2-dione-2-benzoate, oxime ester of methyl-phenyl-2-methyl-phenyl-1, 2-dione-2-acetate, oxime ester of methyl-phenyl-9-ethyl-carbazol-3-yl-methyl-phenyl-1, 2-methyl-phenyl-ethyl-methyl-phenyl-2-benzoate, 2-methyl-phenyl-ethyl-carboxylate, 2-methyl-phenyl-ethyl-methyl-phenyl-methyl-carboxylate, ethyl-methyl-phenyl-ethyl-methyl-ethyl-methyl-carboxylate, ethyl-methyl-ethyl-methyl-ethyl-2-ethyl, 1- (6-o-methylbenzoyl-9-ethylcarbazol-3-yl) - (3-cyclopentyl) -propane-1, 2-dione-2-oxime benzoate, 1- (6-o-methylbenzoyl-9-ethylcarbazol-3-yl) - (3-cyclopentyl) -propane-1, 2-dione-2-o-methylbenzoate, 1- (4-thiophenylphenyl) - (3-cyclopentyl) -propane-1, 2-dione-2-oxime benzoate, 1- (4-benzoyldiphenylsulfide) - (3-cyclopentyl) -propane-1, 2-dione-2-oxime acetate, and mixtures thereof, 1- (6-furoyl-9-ethylcarbazol-3-yl) - (3-cyclohexyl) -propane-1, 2-dione-2-oxime acetate, 1- (4-thiophenylphenyl) - (3-cyclohexyl) -propane-1, 2-dione-3-oxime benzoate, 1- (6-thenoyl-9-ethylcarbazol-3-yl) - (3-cyclohexyl) -propane-1, 2-dione-2-oxime acetate, and pharmaceutically acceptable salts thereof, 1-phenyl-1, 2-propanedione-2- (oxoacetyl) oxime, 1- (4-phenylthiophenyl) -2- (2-methylphenyl) -ethane-1, 2-dione-2-oxime acetate, 1- {4- [4- (thiophene-2-formyl) phenylthiophenyl ] phenyl } -3-cyclopentylpropane-1, 2-dione-2-oxime acetate, 1- [9, 9-dibutyl-2-yl ] -3-cyclohexylpropylpropane-1, 2-dione-2-oxime acetate, 1- [6- (2-benzoyloxyimino) -3-cyclohexylpropyl-9-ethylcarbazol-3-yl ] octane-1, 2-diketone-2-benzoxyme ester, 1- [7- (2-methylbenzoyl) -9, 9-dibutyl fluorene-2-yl ] -3-cyclohexyl propane-1, 2-diketone-2-acetoxyme ester and 1- [6- (furan-2-formyl) -9-ethyl carbazole-3-yl ] -3-cyclohexyl propane-1, 2-diketone-2-carbethoxy hydroxyme ester.
Preferably, the photoinitiator is contained in an amount of 1 to 20 parts by weight, preferably 1 to 10 parts by weight, based on 100 parts by weight of the total weight of the solid components of the photosensitive resin composition. If the content of the photopolymerization initiator (B) is too small, there is a defect that photosensitivity is decreased; on the other hand, if the content of the photopolymerization initiator (B) is too large, there is a defect that the resist pattern tends to be widened beyond the line width of the photomask.
< alkali-soluble resin (C) >
The alkali-soluble resin (C) of the present invention is not particularly limited, and is preferably selected from the viewpoints of heat resistance, developability, and acquisition properties. The alkali-soluble resin having an acid group such as a carboxyl group or a phenolic hydroxyl group is preferable, the alkali-soluble resin of a carboxyl group-containing copolymer is more preferable, and the copolymer of an ethylenically unsaturated monomer having 1 or more carboxyl groups [ hereinafter referred to as "carboxyl group-containing unsaturated monomer" (P) ] and another copolymerizable ethylenically unsaturated monomer [ hereinafter referred to as "copolymerizable unsaturated monomer" (Q) ] is particularly preferable [ hereinafter referred to as "carboxyl group-containing copolymer" (R) ].
Examples of the carboxyl group-containing unsaturated monomer (P) include the following compounds: unsaturated monocarboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, α -chloroacrylic acid, cinnamic acid, etc.; unsaturated dicarboxylic acids such as maleic acid, maleic anhydride, fumaric acid, itaconic anhydride, citraconic acid, citraconic anhydride, and mesaconic acid, or anhydrides thereof; three or more membered unsaturated polycarboxylic acids or anhydrides thereof; mono [ (meth) acryloyloxyalkyl ] esters of dibasic or higher polycarboxylic acids such as succinic acid mono (2-acryloyloxyethyl), succinic acid mono (2-methacryloyloxyethyl), phthalic acid mono (2-acryloyloxyethyl) and phthalic acid mono (2-methacryloyloxyethyl); and mono (meth) acrylates of polymers having carboxyl groups and hydroxyl groups at both ends, such as ω -carboxy polycaprolactone monoacrylate and ω -carboxy polycaprolactone monomethacrylate. These carboxyl group-containing unsaturated monomers may be used alone or in combination of two or more.
Examples of the copolymerizable unsaturated monomer (Q) include aromatic vinyl compounds such as styrene, α -methylstyrene, o-vinyltoluene, m-vinyltoluene, p-chlorostyrene, o-methoxystyrene, m-methoxystyrene, p-methoxystyrene, o-vinylbenzyl methyl ether, m-vinylbenzyl methyl ether, p-vinylbenzyl methyl ether, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, and p-vinylbenzyl glycidyl ether; unsaturated carboxylic acid glycidyl esters such as indene-based glycidyl acrylates and glycidyl methacrylates, e.g., indene and 1-methylindene; vinyl carboxylates such as vinyl acetate, vinyl propionate, vinyl butyrate, and vinyl benzoate; unsaturated ethers such as vinyl methyl ether, vinyl ethyl ether and allyl glycidyl ether; vinyl cyanide compounds such as acrylonitrile, methacrylonitrile, α -chloroacrylonitrile, and vinylidene cyanide; unsaturated amides such as acrylamide, methacrylamide, α -chloroacrylamide, N-2-hydroxyethylacrylamide, and N-2-hydroxyethylmethacrylamide; unsaturated imides such as maleimide, N-phenylmaleimide and N-cyclohexylmaleimide; aliphatic conjugated dienes such as 1, 3-butadiene, isoprene and chloroprene; macromonomers having a monoacryloyl group or a monomethacryloyl group at the end of a polymer molecular chain of polystyrene, polymethyl acrylate, polymethyl methacrylate, poly-n-butyl acrylate, poly-n-butyl methacrylate, polysiloxane, or the like. These copolymerizable unsaturated monomers may be used alone or in combination of two or more.
The carboxyl group-containing copolymer [ hereinafter referred to as "carboxyl group-containing copolymer" (R) ] preferred in the present invention is obtained by polymerizing (P) and (Q). The (P) is a carboxyl group-containing unsaturated monomer component containing acrylic acid and/or methacrylic acid as an essential component and further containing at least 1 compound selected from the group consisting of succinic acid mono (2-acryloyloxyethyl group), succinic acid mono (2-methacryloyloxyethyl group), omega-carboxy polycaprolactone monoacrylate and omega-carboxy polycaprolactone monomethacrylate, as the case may be; the (Q) is at least 1 monomer selected from styrene, methyl acrylate, methyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, allyl acrylate, allyl methacrylate, benzyl acrylate, benzyl methacrylate, glycerol monoacrylate, glycerol monomethacrylate, N-phenylmaleimide, polystyrene macromonomer and polymethyl methacrylate macromonomer.
Specific examples of the carboxyl group-containing copolymer (R) include a (meth) acrylic acid/methyl (meth) acrylate copolymer, a (meth) acrylic acid/benzyl (meth) acrylate copolymer, a (meth) acrylic acid/2-hydroxyethyl (meth) acrylate/benzyl (meth) acrylate copolymer, a (meth) acrylic acid/methyl (meth) acrylate/polystyrene macromonomer copolymer, a (meth) acrylic acid/methyl (meth) acrylate/polymethyl methacrylate macromonomer copolymer, a (meth) acrylic acid/benzyl (meth) acrylate/polystyrene macromonomer copolymer, a (meth) acrylic acid/benzyl (meth) acrylate/polymethyl methacrylate macromonomer copolymer, and a (meth) acrylic acid/2-hydroxyethyl (meth) acrylate/methyl (meth) acrylate macromonomer copolymer A benzyl) acrylate/polystyrene macromonomer copolymer, a (meth) acrylic acid/2-hydroxyethyl (meth) acrylate/benzyl (meth) acrylate/polymethyl methacrylate macromonomer copolymer, a methacrylic acid/styrene/benzyl (meth) acrylate/N-phenylmaleimide copolymer, a (meth) acrylic acid/succinic acid mono [2- (meth) acryloyloxyethyl ]/styrene/allyl (meth) acrylate/N-phenylmaleimide copolymer, a copolymer of benzyl (meth) acrylate/N-phenylmaleimide, a copolymer of benzyl (meth) acrylate/styrene, a copolymer of benzyl (meth) acrylate/N-phenylmaleimide, a copolymer of benzyl (meth) acrylate/N-acryloyloxyethyl (meth) acrylate, a copolymer of styrene, a copolymer of benzyl (meth) acrylate/N-phenylmaleimide, a copolymer of styrene, a styrene copolymer of styrene, a styrene, and a styrene copolymer of styrene, a styrene, and a styrene copolymer of styrene, a styrene, and a styrene copolymer of styrene, and a styrene copolymer, and a styrene, and a styrene copolymer of styrene, and a styrene, The substituent present in the molecule of the carboxyl group-containing copolymer such as (meth) acrylic acid/styrene/(meth) acrylic acid benzyl ester/glycerin mono (meth) acrylate/N-phenylmaleimide copolymer, and (meth) acrylic acid/ω -carboxypolycaprolactone mono (meth) acrylate/styrene/(meth) acrylic acid benzyl ester/glycerin mono (meth) acrylate/N-phenylmaleimide copolymer may be modified with other materials.
In the present invention, the alkali-soluble resin (C) may be used alone or in combination of two or more.
In order to improve the developability and the liquid viscosity, the alkali-soluble resin is preferably a polymer having a weight average molecular weight (polystyrene equivalent value measured by GPC) of 1000-200000, more preferably 2000-100000, and most preferably 5000-50000.
The amount of component (C) in the photosensitive resin composition is 5 to 60 parts by weight, preferably 10 to 50 parts by weight, in 100 parts by weight of the photosensitive resin composition. If the content of the alkali-soluble resin is too small, there is a defect that adhesion to the substrate becomes poor or alkali developability of the photocured portion is reduced; on the other hand, if the content of the alkali-soluble resin is too large, there is a defect that the light-shielding property is deteriorated. In particular, alkali-soluble resins disclosed in patent publication nos. CN106554459A and CN106397660A are preferred.
< photopolymerizable Compound (D) >
The photopolymerizable compound of the invention is a compound polymerizable by the action of a photopolymerization initiator described later, and these compounds may be used alone or in combination of two or more.
Examples of such photopolymerizable compounds include unsaturated carboxylic acids such as acrylates, methacrylates, itaconic acid, crotonic acid, isocrotonic acid, and maleic acid, and salts, esters, urethanes, amides, and anhydrides thereof, acrylonitrile, styrene, and vinyl ethers thereof, and also radical polymerizable compounds such as various unsaturated polyesters, unsaturated polyethers, unsaturated polyamides, and unsaturated polyurethanes, but the present invention is not limited thereto.
Exemplary acrylic compounds include: methyl acrylate, ethyl acrylate, propyl acrylate, isopropyl acrylate, butyl acrylate, isoamyl acrylate, hexyl acrylate, 2-ethylhexyl acrylate, octyl acrylate, decyl acrylate, dodecyl acrylate, octadecyl acrylate, isobornyl acrylate, cyclohexyl acrylate, dicyclopentenyl acrylate, dicyclopentenyloxyethyl acrylate, benzyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxy-3-chloropropyl acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-hydroxy-3-allyloxypropyl acrylate, 2-acryloyloxyethyl-2-hydroxypropyl phthalate, methyl acrylate, ethyl acrylate, decyl acrylate, dodecyl acrylate, isobutyl acrylate, dodecyl acrylate, 2-hydroxy-3-allyloxypropyl acrylate, 2-hydroxy-2-hydroxypropyl phthalate, 2-acryloyloxyethyl phthalate, 2-acryloyloxyethyl phthalate, 2-hydroxy-2-hydroxy-propyl phthalate, etc., methyl acrylate, etc., or-2-acrylate, etc., and-2-propyl acrylate, etc., and so as-2-one, etc., and so as-2-one, and so as a mixture, and a mixture of a mixture, 2,2, 2-trifluoroethyl acrylate, 1, 3-butanediol methyl ether acrylate, butoxyethyl acrylate, beta-carboxyethyl acrylate, monoacryloxyethyl succinate, omega-carboxypolycaprolactone monoacrylate, trimethylsiloxyethyl acrylate, diphenyl-2-acryloxyethyl phosphate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, bisphenol A diacrylate, EO-modified bisphenol A diacrylate, PO-modified bisphenol A diacrylate, hydrogenated bisphenol A diacrylate, EO-modified hydrogenated bisphenol A diacrylate, PO-modified hydrogenated bisphenol A diacrylate, bisphenol F diacrylate, EO-modified bisphenol F diacrylate, PO-modified bisphenol F diacrylate, EO-modified tetrabromobisphenol A diacrylate, bisphenol A diacrylate, acrylate, bisphenol A, acrylate, Tricyclodecane dihydroxymethyl diacrylate, glycerol PO modified triacrylate, trimethylolpropane triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate monopropionate, dipentaerythritol hexaacrylate, tetramethylolmethane tetraacrylate, and the like.
Exemplary methacrylic compounds include: methyl methacrylate, ethyl methacrylate, hydroxyethyl methacrylate, propyl methacrylate, isopropyl methacrylate, butyl methacrylate, isoamyl methacrylate, hexyl methacrylate, 2-ethylhexyl methacrylate, octyl methacrylate, decyl methacrylate, dodecyl methacrylate, octadecyl methacrylate, isobornyl methacrylate, cyclohexyl methacrylate, dicyclopentenyl methacrylate, dicyclopentenyloxyethyl methacrylate, benzyl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 2-hydroxy-3-chloropropyl methacrylate, 2-hydroxy-3-phenoxypropyl methacrylate, methyl methacrylate, hexyl methacrylate, 2-ethylhexyl methacrylate, octyl methacrylate, decyl methacrylate, dodecyl methacrylate, octadecyl methacrylate, isobornyl methacrylate, cyclohexyl methacrylate, dicyclopentenyl methacrylate, benzyl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, n-butyl methacrylate, n-2-butyl methacrylate, n-2-hydroxyethyl methacrylate, p-2-hydroxypropyl methacrylate, n-butyl methacrylate, n-2-pentyl methacrylate, n-2-pentyl methacrylate, p-2-hydroxy-hydroxypropyl methacrylate, p-2-hydroxy-3-hydroxypropyl methacrylate, p-hydroxypropyl methacrylate, n-2-hydroxypropyl methacrylate, n-3-hydroxypropyl methacrylate, p-2-hydroxypropyl methacrylate, n-2-hydroxypropyl methacrylate, p-2-3-hydroxypropyl methacrylate, and p-phenoxypropyl methacrylate, n-2-propyl methacrylate, p-2-p-2-propyl methacrylate, p-2-propyl methacrylate, p-2-p-propyl methacrylate, p-y-propyl methacrylate, p-y-2-p-2-p-y-2-p-y-p-2-p-y, 2,2, 2-trifluoroethyl methacrylate, 2,2,3, 3-tetrafluoropropyl methacrylate, 1H-hexafluoroisopropyl methacrylate, 2-methoxyethyl methacrylate, 1, 3-butanediol methyl ether methacrylate, butoxyethyl methacrylate, methoxytriethylene glycol methacrylate, methoxypolyethylene glycol #400 methacrylate, methoxypropylene glycol methacrylate, ethoxydiethylene glycol methacrylate, 2-ethylhexyl carbitol methacrylate, tetrahydrofurfuryl methacrylate, phenoxyethyl methacrylate, pentaerythritol tetramethacrylate, dipentaerythritol pentamethacrylate monopropionate, pentaerythritol penta (meth) acrylate, poly (meth) acrylate, poly (acrylate), poly, Dipentaerythritol hexamethacrylate, and the like.
Illustrative examples thereof include allyl glycidyl ether, diallyl phthalate, triallyl trimellitate, triallyl isocyanurate, acrylamide, N-methylolacrylamide, diacetoneacrylamide, N-dimethylacrylamide, N-diethylacrylamide, N-isopropylacrylamide, acryloylmorpholine, styrene, p-hydroxystyrene, p-chlorostyrene, p-bromostyrene, p-methylstyrene, vinyl acetate, vinyl monochloroacetate, vinyl benzoate, vinyl pivalate, vinyl butyrate, vinyl laurate, and divinyl adipate.
The compound having at least one polymerizable unsaturated bond of the present invention (D may be used alone, or two or more compounds may be mixed at an arbitrary ratio to improve desired characteristics.
The amount of component (D) in the photosensitive resin composition is 5 to 50 parts by weight, preferably 10 to 30 parts by weight, in 100 parts by weight of the photosensitive resin composition. If the content of the component (D) is too small, there is a defect that photosensitivity is lowered; on the other hand, if the content of the component (D) is too large, there is a defect that the resist pattern tends to be widened beyond the line width of the photomask.
< other optional additives E >
In addition to the above components (a) to (D), it will be apparent to those skilled in the art that organic and/or inorganic auxiliaries commonly used in the art, including but not limited to pigments, leveling agents, dispersants, curing agents, solvents, and the like, may be optionally added to the photocurable composition of the present invention according to the requirements of the product application. In addition, a sensitizer and/or other photoinitiator can be added into the composition for compounding without generating negative influence on the application effect of the composition.
According to application requirements, one or more macromolecules or high molecular compounds can be optionally added into the composition to improve the application performance of the composition in the using process, and the macromolecules or high molecular compounds can be polyalcohol or polyester polyol; polymers having no reactive functional group, which are generally resins having acidic functional groups such as phenolic hydroxyl groups and carboxyl groups, may also be optionally added.
< color Filter and method for producing the same >
Another aspect of the present application provides a color filter, including a substrate and a pattern layer disposed on a surface of the substrate, wherein the pattern layer is formed by coating, exposing, developing and curing a photosensitive resin composition, and the photosensitive resin composition includes the above photosensitive resin composition.
The substrate may be the color filter itself or a portion where the color filter is located in a display device or the like, and is not particularly limited. The substrate may be glass, silicon (Si), silicon oxide (SiO)x) Or a polymer substrate, and the polymer substrate may be polyether sulfone (PES), Polycarbonate (PC), or the like.
The pattern layer is a layer containing the photosensitive resin composition of the present invention, and may be a layer formed by applying the photosensitive resin composition, and then exposing, developing, and thermally curing the applied layer in accordance with a predetermined pattern.
The pattern layer formed by the photosensitive resin composition comprises a red pattern layer containing red quantum dot particles; a green pattern layer containing green quantum dot particles; and a blue pattern layer containing blue quantum dot particles. When light is irradiated, the red pattern layer emits red light, the green pattern layer emits green light, and the blue pattern layer emits blue light.
The photosensitive resin composition can be applied to a plurality of scenes in the field of photocuring, and has good effect.
< image display apparatus >
In addition, the invention also provides an image display device comprising the color filter.
When the color filter of the present invention is applied to an image display device, light is emitted by light from a light source of the display device, and therefore, more excellent light efficiency can be achieved. Further, since light having a hue is emitted, color reproducibility is more excellent, and since light is emitted in all directions by photoluminescence, the viewing angle can be improved.
In this case, the light emitted from the light source used in the image display device is not particularly limited, but a light source emitting blue light can be preferably used from the viewpoint of more excellent luminance and color reproducibility.
According to another embodiment of the present invention, the pattern layer includes a red pattern layer, a green pattern layer, and a transparent pattern layer without quantum dot particles. In this case, as a light source of the image display device including the pattern layer, a light source emitting blue light can be used. At this time, the red pattern layer emits red light, the green pattern layer emits green light, and the transparent pattern layer is blue light directly transmitted.
The color filter including the substrate and the pattern layer as described above may further include a rib wall formed between the patterns, and may further include a black matrix. In addition, the color filter may further include a protective film formed on the upper portion of the pattern layer of the color filter.
The color filter of the present invention can be applied not only to a general liquid crystal display device but also to various image display devices such as an electroluminescence display device, a plasma display device, and a field emission display device.
The image display device of the present invention may include a color filter including a red pattern layer containing red quantum dot particles; a green pattern layer containing green quantum dot particles; and a blue pattern layer containing blue quantum dot particles. In this case, the light emitted from the light source used in the image display device is not particularly limited, but a light source emitting blue light can be preferably used in terms of more excellent color reproducibility.
According to still another embodiment of the present invention, an image display device of the present invention may be provided with a color filter including a red pattern layer, a green pattern layer, and a transparent pattern layer not containing quantum dot particles.
In this case, a light source emitting blue light may be used as the light source. In this case, the red quantum dot particles emit red light, the green quantum dot particles emit green light, and the transparent pattern layer is directly transmitted by blue light to exhibit blue color.
The image display device of the present invention has excellent light efficiency, high brightness, excellent color reproducibility and wide viewing angle.
It will be apparent to those skilled in the art that various changes and modifications can be made in the embodiments within the scope of the invention and the technical spirit, and such changes and modifications also fall within the scope of the appended claims.
The present invention is further illustrated by the following examples, which should not be construed as limiting the scope of the invention.
(1) Preparation of photosensitive resin composition
The photosensitive resin composition was prepared by diluting the composition (parts by weight) shown in table 1 below with propylene glycol monomethyl ether acetate so that the solid content became 18 wt%, followed by stirring.
TABLE 1
(2) Manufacture of color filter
After the photosensitive resin compositions of examples and comparative examples were applied onto a glass substrate by a spin coating method, the substrate was placed on a hot plate and held at a temperature of 100 ℃ for 3 minutes to form a thin film. A test photomask having a 20mm × 20mm square transmission pattern and a 1-100 μm line/space pattern was placed on the thin film, and irradiated with ultraviolet light with a gap of 100 μm between the thin film and the test photomask.
In this case, a high-pressure mercury lamp 1PCS light source was used as a light source of ultraviolet rays. The coating film is fully exposed by ultraviolet rays with the wavelength of 365nm through the gaps of the mask plate (the exposure is 200 mJ/cm)2) Then, the resultant was immersed in a 2.5 wt% sodium carbonate solution at 25 ℃ for 20 seconds for development, washed with ultrapure water, air-dried, and hard-baked at 220 ℃ for 30 minutes to fix the pattern, thereby producing a color filter. The thickness of the manufactured color filter pattern layer was 10.0 μm.
Evaluation of Performance
(1) Evaluation of whether or not a fine Pattern can be formed
In the color filters manufactured from the compositions of the examples and comparative examples, the width of the pattern obtained through the line/space pattern mask having an opening width of 100 μm was measured using an OM apparatus (ECLIPSELV100POL, NIKON corporation), and the difference between the opening width and the pattern width of the pattern mask was determined, as shown in table 2 below. The smaller the difference between the opening width of the pattern mask and the pattern width, the more minute the pattern can be formed.
If the absolute value of the difference is 20 μm or more, it is difficult to express fine pixels, and if the difference is a negative value, a process failure may be caused.
(2) Measurement of luminescence intensity
In the color filters manufactured from the compositions of the examples and comparative examples, a pattern portion of 20mm × 20mm was irradiated with light using a 365nm tube type 4WUV irradiator (VL-4LC, vilberlorourmat), and the intensity (intensity) of light in a wavelength region (red quantum dots are 640nm) emitted by photoluminescence was measured using a spectrometer (oceanooptics), as shown in table 2 below.
The stronger the measured light intensity is, the more excellent photoluminescence characteristics can be judged to be exhibited.
(3) Sensitivity of the probe
The sensitivity of the photosensitive resin compositions of examples 1 to 8 and comparative examples 1 to 4 was evaluated by taking out a PET template and forming a coating film having a film thickness of about 10 μm by wire bar coating. The substrate on which the coating film was formed was cooled to room temperature, a mask plate was attached, the coating film was exposed to ultraviolet rays having a wavelength of 365nm through the gap of the mask plate with a 1PCS light source of a high-pressure mercury lamp, and then developed by dipping in a 2.5 wt% sodium carbonate solution at 25 ℃ for 20 seconds, washed with ultrapure water, air-dried, hard-baked at 220 ℃ for 30min to fix the pattern, and the obtained pattern was evaluated.
At the time of exposure, the minimum exposure amount at which the residual film ratio after development of the light-irradiated region in the exposure step is 90% or more is evaluated as the exposure demand. The smaller the exposure requirement, the higher the sensitivity, and the specific evaluation results are shown in Table 2.
TABLE 2
From the above description of table 2, it can be seen that the above-described embodiments of the present invention achieve the following technical effects: the photosensitive resin composition of the present invention has a small difference between the width of the opening of the pattern mask and the pattern width, can form a fine pattern, can suppress undercut of the developed pattern, and has excellent photoluminescence intensity, high brightness and excellent sensitivity.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. A photosensitive resin composition, characterized in that the photosensitive resin composition comprises, based on 100 parts by weight of the total weight of the solid content of the photosensitive resin composition:
(A) 3-80 parts by weight of photoluminescent quantum dot particles;
(B) 1-20 parts by weight of a photoinitiator, wherein the photoinitiator comprises a ketoxime ester photoinitiator and an acylphosphine oxide photoinitiator, and the weight ratio of the ketoxime ester photoinitiator to the acylphosphine oxide photoinitiator is 1 (0.5-2);
(C) 5-60 parts by weight of an alkali-soluble resin;
(D)5 to 50 parts by weight of a photopolymerizable compound;
the ketoxime ester photoinitiator is selected from 1- (4-thiophenylphenyl) - (3-cyclopentyl) -propane-1, 2-dione-2-oxime benzoate, 1- [9, 9-dibutyl-2-yl ] -3-cyclohexylpropylpropane-1, 2-dione-2-oxime acetate, 1- [6- (furan-2-formyl) -9-ethylcarbazole-3-yl ] -3-cyclohexylpropane-1, 2-dione-2-ethoxycarbonyloxime ester or 1- (6-o-methylbenzoyl-9-ethylcarbazole-3-yl) - (3-cyclopentyl) -propane-1, 2-diketone-2-benzonic acid oxime ester,
the acylphosphine oxide photoinitiator is selected from 2,4, 6-trimethylbenzoyl-ethoxy-phenylphosphine oxide, 2,4, 6-trimethylbenzoyl-ethyldiphenylphosphine oxide or [ bis (2,4, 6-trimethylbenzoyl) phenylphosphine oxide ].
2. The photosensitive resin composition according to claim 1, wherein the photoinitiator is contained in an amount of 1 to 10 parts by weight based on 100 parts by weight of the total weight of the solid content of the photosensitive resin composition.
3. The photosensitive resin composition according to claim 2, wherein the photoluminescence quantum dot particles are selected from one or more of red quantum dot particles, green quantum dot particles and blue quantum dot particles.
4. The photosensitive resin composition according to claim 3, wherein the particle size of the red quantum dot particles is 5 to 10nm, the particle size of the green quantum dot particles is 3 to 5nm, and the particle size of the blue quantum dot particles is 1 to 3 nm.
5. The photosensitive resin composition according to claim 3, wherein the content of the photoluminescence quantum dot particles is 20 to 5 parts by weight based on 100 parts by weight of the total weight of the solid components of the photosensitive resin composition.
6. The photosensitive resin composition according to any one of claims 1 to 5, further comprising: (E) an additive, preferably one or more selected from the group consisting of pigments, leveling agents, dispersants, curing agents, sensitizers, and solvents.
7. A color filter comprising a substrate and a pattern layer provided on a surface of the substrate, the pattern layer being formed by coating, exposing, developing and curing a photosensitive resin composition, wherein the photosensitive resin composition comprises the photosensitive resin composition according to any one of claims 1 to 6.
8. An image display device comprising a color filter, wherein the color filter comprises the color filter according to claim 7.
9. Use of the photosensitive resin composition according to any one of claims 1 to 6 in the field of photocuring.
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| CN105785719A (en) * | 2015-01-13 | 2016-07-20 | 东友精细化工有限公司 | Self emission type photosensitive resin composition and display device comprising color conversion layer prepared thereby |
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