CN111741613A - Processing method of printed circuit board for large-size 5G antenna - Google Patents
Processing method of printed circuit board for large-size 5G antenna Download PDFInfo
- Publication number
- CN111741613A CN111741613A CN201910228227.4A CN201910228227A CN111741613A CN 111741613 A CN111741613 A CN 111741613A CN 201910228227 A CN201910228227 A CN 201910228227A CN 111741613 A CN111741613 A CN 111741613A
- Authority
- CN
- China
- Prior art keywords
- printing
- processing method
- circuit board
- size
- antenna
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Abstract
The invention relates to a processing method of a printed circuit board for a large-size 5G antenna, which comprises the following steps: drilling, copper deposition, electroplating, etching, tin melting, solder mask pretreatment, solder mask printing, pre-examination, exposure, development and final baking. The invention adopts four times of printing instead of two times of electroplating operation mode, line sectional exposure counterpoint operation mode and solder resist printing to realize the large-size chemical tin 5G multilayer line antenna board, and the maximum size of the product can reach 29 inches.
Description
Technical Field
The invention belongs to the field of processing of circuit boards, and particularly relates to a processing method of a printed circuit board for a large-size 5G antenna.
Background
The circuit board, also called as circuit board or printed circuit board, is one of the important parts in the electronic industry, and is the support of electronic components and carriers for electrical connection. With the continuous update of the application technology and the improvement of functions of electronic products, the design of the circuit board is more and more precise, denser, high-performance and diversified, and the length of the circuit board is not limited to only 813 mm. In the prior art, an oversized circuit board is often used, the maximum unilateral size of the current multilayer high-frequency antenna board does not exceed 24', and the working size of the multilayer PCB antenna board for 5G can reach 29 inches. These are not produced by the circuit board factories due to the processing capability of the different process equipment.
In addition, in the conventional circuit board manufacturing, the maximum length of the film is 813mm, and if the circuit board with the length larger than 813mm is manufactured, two films need to be spliced together, and then, the circuit board is directly exposed once to manufacture a circuit pattern. However, because the splicing and overlapping position of the two films has a height difference, the films and the plates at the overlapping position are not tightly attached, and the line width of the circuit pattern at the overlapping position is reduced due to the refraction of light in the exposure process, so that the line dense position has risks of insufficient line width, open circuit and the like, and a circuit board with the line distance less than or equal to 0.1mm cannot be produced, namely a large-size precise circuit board cannot be produced.
Disclosure of Invention
In order to overcome the defects, the invention provides a processing method of a large-size printed circuit board for a 5G antenna, which is used for processing the large-size circuit board in a segmentation and grading mode, so that the equipment problem of processing the large-size printed circuit board is solved, and the processing precision and the quality of the large-size printed circuit board are improved.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a processing method of a printed circuit board for a large-size 5G antenna is characterized by comprising the following steps: drilling, copper deposition, electroplating, etching, tin melting, solder mask pretreatment, solder mask printing, pre-examination, exposure, development and final baking.
As a further improvement of the invention: the electroplating step is carried out by adopting a fractional electroplating method, so that the copper thickness of the electroplating device is greatly improved, the uniformity of the copper thickness is improved, and the passive intermodulation, standing wave and other electric properties of the electroplating device are improved.
As a further improvement of the invention: the step of solder mask printing is carried out by adopting a multi-time subarea printing method, so that the defect of insufficient coverage area of the traditional printing mode is effectively overcome.
As a preferred embodiment of the present invention: the solder mask printing step adopts a four-time printing method: the method comprises the steps of dividing the front surface into two half areas for front surface printing, and dividing the back surface into two half areas for back surface printing.
As a further improvement of the invention: the exposure step is carried out by adopting a sectional exposure alignment operation mode, and the problem of insufficient precision caused by the traditional film splicing exposure is effectively solved.
The processing technology has the advantages that:
the invention better matches the related equipment of the 5G antenna, and realizes the large-size chemical tin 5G multilayer circuit antenna board by adopting a twice electroplating operation mode, a circuit subsection exposure counterpoint operation mode and four times of printing instead of solder mask printing. The maximum size of the product can reach 29 inches.
Detailed Description
In order to enhance the understanding of the present invention, the present invention will be described in further detail with reference to the following examples.
The embodiment relates to a processing method of a printed circuit board for a large-size 5G antenna, which comprises the following steps: drilling, copper deposition, electroplating, etching, tin melting, solder mask pretreatment, solder mask printing, pre-examination, exposure, development and final baking.
In this embodiment, the electroplating step is performed by a method of electroplating twice, and the thickness and uniformity of the copper layer electroplated twice are respectively controlled, so that the uniformity of the copper thickness is within 10um, and thus the passive intermodulation, standing wave and other electrical properties of the copper layer are improved.
In this embodiment, the solder mask printing step adopts a four-time printing method: printing the front side, printing the front side twice, printing half of the front side, pre-baking at 50 ℃ for 20min +75 ℃ for 20min, and then printing the other half of the front side, pre-baking at 50 ℃ for 20min +75 ℃ for 20 min; printing the back side, wherein the back side is printed twice, half of the back side is printed, and the back side is pre-baked at 50 ℃ for 20min +75 ℃ for 20 min; and the other half is printed again, and the printing mode is pre-baked at 50 ℃ 20min +75 ℃ 20min, so that the defect of insufficient coverage area in the traditional printing mode is effectively overcome.
In this embodiment, the exposure step is performed in a segmented exposure alignment mode, and the precision of this mode can be controlled to be 4 mils, thereby effectively solving the problem of insufficient precision caused by the conventional film splicing exposure.
The above-mentioned embodiment of the present invention is only one embodiment of the present invention, and is only used for explaining the present invention, and not to limit the protection scope of the present invention, and all equivalent structures made by using the content of the present specification are directly or indirectly applied to other related technical fields, and the same shall be within the protection scope of the present invention.
Claims (5)
1. A processing method of a printed circuit board for a large-size 5G antenna is characterized by comprising the following steps: drilling, copper deposition, electroplating, etching, tin melting, solder mask pretreatment, solder mask printing, pre-examination, exposure, development and final baking.
2. The processing method of a printed wiring board for a large-sized 5G antenna according to claim 1, characterized in that: the electroplating step is carried out by adopting a fractional electroplating method.
3. The processing method of a printed wiring board for a large-sized 5G antenna according to claim 1, characterized in that: and the step of solder mask printing is carried out by adopting a multi-time subarea printing method.
4. The processing method of the printed wiring board for a large-sized 5G antenna according to claim 3, characterized in that: the solder mask printing step adopts a four-time printing method: the method comprises the steps of dividing the front surface into two half areas for front surface printing, and dividing the back surface into two half areas for back surface printing.
5. The processing method of a printed wiring board for a large-sized 5G antenna according to claim 1, characterized in that: the exposure step is carried out by adopting a sectional exposure contraposition operation mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910228227.4A CN111741613A (en) | 2019-03-25 | 2019-03-25 | Processing method of printed circuit board for large-size 5G antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910228227.4A CN111741613A (en) | 2019-03-25 | 2019-03-25 | Processing method of printed circuit board for large-size 5G antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111741613A true CN111741613A (en) | 2020-10-02 |
Family
ID=72646243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910228227.4A Pending CN111741613A (en) | 2019-03-25 | 2019-03-25 | Processing method of printed circuit board for large-size 5G antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111741613A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116598065A (en) * | 2022-05-18 | 2023-08-15 | 广州优刻谷科技有限公司 | Graphene-silver composite RFID tag and preparation method and application thereof |
-
2019
- 2019-03-25 CN CN201910228227.4A patent/CN111741613A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116598065A (en) * | 2022-05-18 | 2023-08-15 | 广州优刻谷科技有限公司 | Graphene-silver composite RFID tag and preparation method and application thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20201002 |
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| WD01 | Invention patent application deemed withdrawn after publication |