CN1117257A - Spacer for light emitting deode - Google Patents

Spacer for light emitting deode Download PDF

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Publication number
CN1117257A
CN1117257A CN 95104056 CN95104056A CN1117257A CN 1117257 A CN1117257 A CN 1117257A CN 95104056 CN95104056 CN 95104056 CN 95104056 A CN95104056 A CN 95104056A CN 1117257 A CN1117257 A CN 1117257A
Authority
CN
China
Prior art keywords
led
aforementioned
insulated column
circuit board
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN 95104056
Other languages
Chinese (zh)
Other versions
CN1039077C (en
Inventor
柳生雅之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd filed Critical Sumitomo Wiring Systems Ltd
Publication of CN1117257A publication Critical patent/CN1117257A/en
Application granted granted Critical
Publication of CN1039077C publication Critical patent/CN1039077C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means

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  • Led Device Packages (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

An LED spacer 10 is a cylindrical member nearly as long as a space between an LED main body 21 of an LED 20 mounted on a substrate 30 and so interposed between the LED main body 21 and the substrate 30 as to make its one end face come into contact with the substrate 30. Two insertion holes 11 through which the lead wires 22 of the LED 20 are inserted are provided to the LED spacer 10, and grooves 12 and 13 are cut in the end faces of the LED spacer where the insertion holes 11 are provided.

Description

The insulated column that is used for light-emitting diode
The present invention relates to a kind of insulated column that is used for light-emitting diode, this post folder is inserted between printed circuit board (PCB) and the light-emitting diode (calling LED in the following text), and is crooked to prevent lead-in wire.
Before this, as shown in Figure 3, when the lead-in wire 52 usefulness scolding tin of LED50 are welded in printed circuit board (PCB) A, keep the interval of regulation in order to make LED main body 51 and printed circuit board (PCB) A, prevent 52 bendings that go between simultaneously, the insulated column 60 of LED is clipped between printed circuit board (PCB) A and the LED main body 51.
As shown in Figure 4, the insulated column 60 of LED is the cylindrical elements that highly equal aforementioned interval L, between end face 61 and the lower surface 62, forms the interspersed through hole 63 that connects aforesaid LED50 lead-in wire 52 thereon.
But, as shown in Figure 5,,, need to set the length of the insulated column 60 of LED so when stating the insulated column 60 of LED in the use, consider that described distension plays part 53 because LED50 plays part 53 at the distension that the root of the lead-in wire 52 of LED main body 51 forms resin usually.
In addition, as shown in Figure 6, in the time of on the lead-in wire 52 usefulness scolding tin of LED50 being welded in circuit board A, be provided with at circuit board A under the situation of through hole 64, because scolding tin passes through hole 64,, become the reason of short circuit not only at the back side of circuit board A but also overflow in the side of the insulated column 60 of LED.
Therefore, task of the present invention provides the insulated column that is easy to the few LED of preseting length and short circuit risk.
In order to solve above-mentioned task, it is the interspersed through hole that is provided with break-through light-emitting diode lead-in wire that the present invention constitutes, the insulated column of light-emitting diode is set between circuit board and light-emitting diodes tube body, zone at the aforementioned interspersed through hole open end that comprises insulated column one end, form first recess, the upwards distension that is housed in light-emitting diode lead-in wire base portion formation resin plays part, simultaneously, zone at the aforementioned interspersed through hole open end that comprises its other end forms second recess, when aforementioned lead-in wire is welded in aforesaid circuit board with scolding tin, accommodate the residue scolding tin that from circuit board through-hole, overflows.
In addition, aforesaid first and second recesses are made of ditch.
The insulated column of the LED of Gou Chenging as described above, the resin of the root of LED main body lead-in wire is made progress, and distension rises is partially submerged into first recess, removes the make progress end face of insulated column 10 of following and LED of LED main body of the part that distension rises of resin and contacts.In addition, when being welded in lead-in wire on the circuit board with scolding tin, the remaining scolding tin that overflows from circuit board through-hole is accommodated in second recess, does not directly contact with the insulated column of LED.
Fig. 1 is the perspective view of expression one embodiment of the invention.
Fig. 2 is the cutaway view of expression one embodiment of the invention.
Fig. 3 is the end view of expression conventional example.
Fig. 4 is the perspective view of expression conventional example.
Fig. 5 is the end view of expression conventional example.
Fig. 6 is the cutaway view of expression conventional example user mode.
Wherein, the insulated column of label 10 expression LED
Embodiment
Below with reference to description of drawings embodiment.As shown in Figure 1, insulated column 10 structures of LED are cylindrical members that length is substantially equal to LED main body 21 and the distance between the circuit board 30 of the LED20 that is installed on the circuit board 30, and one end and circuit board 30 are clipped between aforementioned LED main body 21 and the circuit board 30 contiguously.Have two interspersed through holes 11 that connect aforementioned LED20 lead-in wire 22 on the insulated column 10 of LED, in both ends of the surface, at the ditch 12 and 13 of the open end zone formation that comprises aforementioned interspersed through hole 11 as first and second recesses.
As shown in Figure 2, one distolateral ditch 12 of the insulated column 10 of LED, the part 23 of the distension of the resin that the base portion of the lead-in wire that stretches out from LED main body 21 forms is accommodated in the big activation of its size, if make aforesaid lead-in wire 22 by aforesaid interspersed through hole 11, owing to the distension of resin is played part 23 be housed in the ditch, the following of main body 21 that the distension of having removed aforementioned resin plays LED partly can contact with the end face of the insulated column 10 of LED.
In addition, insulated column 10 another distolateral ditches 13 of LED, be under the installment state at the insulated column 10 that makes LED, when the aforementioned lead-in wire 22 usefulness scolding tin that run through circuit board 30 through holes 31 being welded on the circuit paper tinsel that forms at circuit board 30 back sides, the residue scolding tin b that overflows from circuit board 30 surfaces can have the not exposure level that varies in size, and can suitably set for the size of exposure level not.
Having, as aforesaid first and second recesses, not necessarily must be ditch again, can absorb the part that dendritic distension rises, if avoid remaining the scolding tin contact.Also can recess be set for each interspersed through hole.
As mentioned above, the insulated column of LED of the present invention, zone at the open end of the aforementioned interspersed through hole that comprises insulated column one end, owing to form first recess, the distension that this recess is housed in the resin that the lead-in wire base portion of aforementioned light-emitting diode forms plays part, simultaneously form second recess in the zone of the aforementioned interspersed through hole open end that comprises its other end, this recess is when being welded in aforementioned lead-in wire on the aforementioned circuit plate with scolding tin, accommodate the residue scolding tin that from circuit board through-hole, overflows, so when being welded in the aforementioned lead-in wire that connects circuit board through-hole on the circuit paper tinsel that back of circuit board forms with scolding tin, be housed in the part of the distension of the resin that the base portion of the lead-in wire that stretches out from the LED main body forms at its first recess, because removing the isolation end face of following and LED of the LED main body of the part that the distension of resin rises contacts, so, needn't consider that the resin distension of LED plays part for the setting of the length of the insulated column of LED.Also have, by with the contact-making surface of circuit board on the setting of second recess that forms, when welding with scolding tin, the residue scolding tin that overflows at circuit board surface does not directly contact the insulated column of LED, can prevent because the short circuit that scolding tin is stretched and caused.

Claims (2)

1. insulated column that is used for light-emitting diode, this insulated column is provided with the through hole that connects the light-emitting diode lead-in wire, be arranged between printed circuit board (PCB) and the light-emitting diodes tube body, it is characterized in that, zone at the open end of the aforementioned interspersed through hole that comprises the one end, form first recess, the distension that this recess is housed in the resin that the base portion of aforementioned light-emitting diode lead-in wire forms plays part, while is in the zone of the open end of the aforementioned through-hole that comprises its other end, form second recess, this recess is when with scolding tin aforementioned wire bonds on aforementioned printed circuit board (PCB) the time, being accommodated the residue scolding tin that overflows from aforementioned through-holes of printed circuit boards.
2. according to the insulated column that is used for light-emitting diode of claim 1, it is characterized in that aforesaid first and second recesses are formed by ditch.
CN95104056A 1994-03-14 1995-03-14 Spacer for light emitting deode Expired - Fee Related CN1039077C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP042483/94 1994-03-14
JP4248394A JPH07249851A (en) 1994-03-14 1994-03-14 Light emitting diode spacer

Publications (2)

Publication Number Publication Date
CN1117257A true CN1117257A (en) 1996-02-21
CN1039077C CN1039077C (en) 1998-07-08

Family

ID=12637316

Family Applications (1)

Application Number Title Priority Date Filing Date
CN95104056A Expired - Fee Related CN1039077C (en) 1994-03-14 1995-03-14 Spacer for light emitting deode

Country Status (2)

Country Link
JP (1) JPH07249851A (en)
CN (1) CN1039077C (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101539279B (en) * 2008-03-19 2010-09-29 富准精密工业(深圳)有限公司 LED module
CN102339941A (en) * 2010-07-28 2012-02-01 展晶科技(深圳)有限公司 Light emitting diode packaging structure and light emitting diode module

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3939993B2 (en) * 2002-01-30 2007-07-04 株式会社東海理化電機製作所 Discrete electrical component support system
JP4783166B2 (en) * 2006-01-24 2011-09-28 新電元工業株式会社 Electrical circuit device
JP2009010081A (en) * 2007-06-27 2009-01-15 Mac Eight Co Ltd Socket for light emitting diode
JP2015082538A (en) * 2013-10-22 2015-04-27 住友電装株式会社 Printed circuit board, electronic apparatus including the same, and manufacturing method of the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63229896A (en) * 1987-03-19 1988-09-26 株式会社富士通ゼネラル Soldering

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101539279B (en) * 2008-03-19 2010-09-29 富准精密工业(深圳)有限公司 LED module
US7845828B2 (en) 2008-03-19 2010-12-07 Foxconn Technology Co., Ltd. LED assembly incorporating a structure for preventing solder contamination when soldering electrode leads thereof together
CN102339941A (en) * 2010-07-28 2012-02-01 展晶科技(深圳)有限公司 Light emitting diode packaging structure and light emitting diode module

Also Published As

Publication number Publication date
JPH07249851A (en) 1995-09-26
CN1039077C (en) 1998-07-08

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C19 Lapse of patent right due to non-payment of the annual fee
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