CN1039077C - Spacer for light emitting deode - Google Patents
Spacer for light emitting deode Download PDFInfo
- Publication number
- CN1039077C CN1039077C CN95104056A CN95104056A CN1039077C CN 1039077 C CN1039077 C CN 1039077C CN 95104056 A CN95104056 A CN 95104056A CN 95104056 A CN95104056 A CN 95104056A CN 1039077 C CN1039077 C CN 1039077C
- Authority
- CN
- China
- Prior art keywords
- led
- aforementioned
- insulated column
- circuit board
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
Landscapes
- Led Device Packages (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
An LED spacer 10 is a cylindrical member nearly as long as a space between an LED main body 21 of an LED 20 mounted on a substrate 30 and so interposed between the LED main body 21 and the substrate 30 as to make its one end face come into contact with the substrate 30. Two insertion holes 11 through which the lead wires 22 of the LED 20 are inserted are provided to the LED spacer 10, and grooves 12 and 13 are cut in the end faces of the LED spacer where the insertion holes 11 are provided.
Description
The present invention relates to a kind of insulated column that is used for light-emitting diode, this post folder is inserted between printed circuit board (PCB) and the light-emitting diode (calling LED in the following text), and is crooked to prevent lead-in wire.
Before this, as shown in Figure 3, when the lead-in wire 52 usefulness scolding tin of LED50 are welded in printed circuit board (PCB) A, keep the interval of regulation in order to make LED main body 51 and printed circuit board (PCB) A, prevent 52 bendings that go between simultaneously, the insulated column 60 of LED is clipped between printed circuit board (PCB) A and the LED main body 51.
As shown in Figure 4, the insulated column 60 of LED is the cylindrical elements that highly equal aforementioned interval L, between end face 61 and the lower surface 62, forms the through hole 63 that connects aforesaid LED50 lead-in wire 52 thereon.
But, as shown in Figure 5,,, need to set the length of the insulated column 60 of LED so when stating the insulated column 60 of LED in the use, consider described bossing 53 because LED50 forms the bossing 53 of resin usually at the root of the lead-in wire 52 of LED main body 51.
In addition, as shown in Figure 6, in the time of on the lead-in wire 52 usefulness scolding tin of LED50 being welded in circuit board A, be provided with at circuit board A under the situation of through hole 64, because scolding tin passes through hole 64,, become the reason of short circuit not only at the back side of circuit board A but also overflow in the side of the insulated column 60 of LED.
Therefore, task of the present invention provides the insulated column that is easy to the few LED of preseting length and short circuit risk.
In order to solve above-mentioned task, it is the through hole that is provided with break-through light-emitting diode lead-in wire that the present invention constitutes, the insulated column of light-emitting diode is set between circuit board and light-emitting diodes tube body, zone at the aforementioned through-hole open end that comprises insulated column one end, form first recess, be housed in the part that raises up of light-emitting diode lead-in wire base portion formation resin, simultaneously, zone at the aforementioned through-hole open end that comprises its other end forms second recess, when aforementioned lead-in wire is welded in aforesaid circuit board with scolding tin, accommodate the residue scolding tin that from circuit board through-hole, overflows.
In addition, aforesaid first and second recesses are made of ditch.
The insulated column of the LED of Gou Chenging as described above makes first recess that is partially submerged into that the resin of the root of LED main body lead-in wire raises up, and the end face of insulated column 10 of following and LED of removing the LED main body of the part that resin raises up contacts.In addition, when being welded in lead-in wire on the circuit board with scolding tin, the remaining scolding tin that overflows from circuit board through-hole is accommodated in second recess, directly do not contact with the insulated column of LED,
Fig. 1 is the perspective view of expression one embodiment of the invention.
Fig. 2 is the cutaway view of expression one embodiment of the invention.
Fig. 3 is the end view of expression conventional example.
Fig. 4 is the perspective view of expression conventional example.
Fig. 5 is the end view of expression conventional example.
Fig. 6 is the cutaway view of expression conventional example user mode.
Wherein, the insulated column of label 10 expression LED
Embodiment
Below with reference to description of drawings embodiment.As shown in Figure 1, insulated column 10 structures of LED are cylindrical members that length is substantially equal to LED main body 21 and the distance between the circuit board 30 of the LED20 that is installed on the circuit board 30, and one end and circuit board 30 are clipped between aforementioned LED main body 21 and the circuit board 30 contiguously.Have two through holes 11 that connect aforementioned LED20 lead-in wire 22 on the insulated column 10 of LED, in both ends of the surface, at the ditch 12 and 13 of the open end zone formation that comprises aforementioned through-hole 11 as first and second recesses.
As shown in Figure 2, one distolateral ditch 12 of the insulated column 10 of LED, the part 23 of the projection of the resin that the base portion of the lead-in wire that stretches out from LED main body 21 forms is accommodated in the big activation of its size, if make aforesaid lead-in wire 22 by aforesaid through hole 11, because the bossing 23 of resin is housed in the ditch, the following of main body 21 of LED of having removed the bossing of aforementioned resin can contact with the end face of the insulated column 10 of LED.
In addition, insulated column 10 another distolateral ditches 13 of LED, be under the installment state at the insulated column 10 that makes LED, when the aforementioned lead-in wire 22 usefulness scolding tin that run through circuit board 30 through holes 31 being welded on the circuit paper tinsel that forms at circuit board 30 back sides, the residue scolding tin b that overflows from circuit board 30 surfaces can have the not exposure level that varies in size, and can suitably set for the size of exposure level not.
Having, as aforesaid first and second recesses, not necessarily must be ditch again, as long as can hold the bossing of resin, contacts with remaining scolding tin avoiding, and also can recess be set for each through hole.
As mentioned above, the insulated column of LED of the present invention, zone at the open end of the aforementioned through-hole that comprises insulated column one end, owing to form first recess, this recess is housed in the bossing of the resin that the lead-in wire base portion of aforementioned light-emitting diode forms, simultaneously form second recess in the zone of the aforementioned through-hole open end that comprises its other end, this recess is when being welded in aforementioned lead-in wire on the aforementioned circuit plate with scolding tin, accommodate the residue scolding tin that from circuit board through-hole, overflows, so when being welded in the aforementioned lead-in wire that connects circuit board through-hole on the circuit paper tinsel that back of circuit board forms with scolding tin, be housed in the part of the projection of the resin that the base portion of the lead-in wire that stretches out from the LED main body forms at its first recess, because removing the isolation end face of following and LED of LED main body of part of the projection of resin contacts, so, needn't consider the resin bossing of LED for the setting of the length of the insulated column of LED.Also have, by with the contact-making surface of circuit board on the setting of second recess that forms, when welding with scolding tin, the residue scolding tin that overflows at circuit board surface does not directly contact the insulated column of LED, can prevent because the short circuit that scolding tin is stretched and caused.
Claims (2)
1. insulated column that is used for light-emitting diode, this insulated column is provided with the through hole that connects the light-emitting diode lead-in wire, be arranged between printed circuit board (PCB) and the light-emitting diodes tube body, it is characterized in that, zone at the open end of the aforementioned through-hole that comprises the one end, form first recess, this recess is housed in the bossing of the resin that the base portion of aforementioned light-emitting diode lead-in wire forms, while is in the zone of the open end of the aforementioned through-hole that comprises its other end, form second recess, this recess is when with scolding tin aforementioned wire bonds on aforementioned printed circuit board (PCB) the time, being accommodated the residue scolding tin that overflows from aforementioned through-holes of printed circuit boards.
2. according to the insulated column that is used for light-emitting diode of claim 1, it is characterized in that aforesaid first and second recesses are formed by ditch.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP042483/94 | 1994-03-14 | ||
JP4248394A JPH07249851A (en) | 1994-03-14 | 1994-03-14 | Light emitting diode spacer |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1117257A CN1117257A (en) | 1996-02-21 |
CN1039077C true CN1039077C (en) | 1998-07-08 |
Family
ID=12637316
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN95104056A Expired - Fee Related CN1039077C (en) | 1994-03-14 | 1995-03-14 | Spacer for light emitting deode |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH07249851A (en) |
CN (1) | CN1039077C (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3939993B2 (en) * | 2002-01-30 | 2007-07-04 | 株式会社東海理化電機製作所 | Discrete electrical component support system |
JP4783166B2 (en) * | 2006-01-24 | 2011-09-28 | 新電元工業株式会社 | Electrical circuit device |
JP2009010081A (en) * | 2007-06-27 | 2009-01-15 | Mac Eight Co Ltd | Socket for light emitting diode |
CN101539279B (en) * | 2008-03-19 | 2010-09-29 | 富准精密工业(深圳)有限公司 | LED module |
CN102339941A (en) * | 2010-07-28 | 2012-02-01 | 展晶科技(深圳)有限公司 | Light emitting diode packaging structure and light emitting diode module |
JP2015082538A (en) * | 2013-10-22 | 2015-04-27 | 住友電装株式会社 | Printed circuit board, electronic apparatus including the same, and manufacturing method of the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63229896A (en) * | 1987-03-19 | 1988-09-26 | 株式会社富士通ゼネラル | Soldering |
-
1994
- 1994-03-14 JP JP4248394A patent/JPH07249851A/en active Pending
-
1995
- 1995-03-14 CN CN95104056A patent/CN1039077C/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63229896A (en) * | 1987-03-19 | 1988-09-26 | 株式会社富士通ゼネラル | Soldering |
Also Published As
Publication number | Publication date |
---|---|
JPH07249851A (en) | 1995-09-26 |
CN1117257A (en) | 1996-02-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |