CN111725428B - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
- Publication number
- CN111725428B CN111725428B CN202010614897.2A CN202010614897A CN111725428B CN 111725428 B CN111725428 B CN 111725428B CN 202010614897 A CN202010614897 A CN 202010614897A CN 111725428 B CN111725428 B CN 111725428B
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- display panel
- layer
- dissipation layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 168
- 239000000758 substrate Substances 0.000 claims description 57
- 239000000463 material Substances 0.000 claims description 29
- 230000004888 barrier function Effects 0.000 claims description 5
- 238000004020 luminiscence type Methods 0.000 abstract description 8
- 230000002349 favourable effect Effects 0.000 abstract description 6
- 238000009825 accumulation Methods 0.000 abstract description 3
- 230000001737 promoting effect Effects 0.000 abstract description 3
- 230000009931 harmful effect Effects 0.000 abstract 1
- 238000002955 isolation Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 10
- 230000002411 adverse Effects 0.000 description 7
- 239000010408 film Substances 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application discloses display panel and display device, wherein, display panel's barricade layer includes a plurality of barricade structures and a plurality of barricade opening, just barricade structure includes the first heat dissipation layer that two-layer at least different layers set up, two-layer at least different layers set up first heat dissipation layer provides the heat dissipation passageway that two at least different layers set up for the heat that the luminescence unit that sets up in the barricade opening produced can outwards give off through the heat dissipation passageway that two at least different layers set up, is favorable to promoting display panel's heat-sinking capability, avoids because the heat of luminescence unit is around luminescence unit or inside accumulation and produces the condition of harmful effect to luminescence unit's performance to appear.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a display panel and a display device.
Background
For the display panel, the light-emitting unit of the display panel can generate heat in the working process, and along with the continuous working of the light-emitting unit, the heat generated by the light-emitting unit is also increased, and if the heat is not timely emitted, the running speed of the light-emitting element or other elements in the display panel can be influenced, the performance of the display panel is reduced, and the user experience is influenced.
Disclosure of Invention
In order to solve the technical problem, the application provides a display panel and a display device, so as to achieve the purpose of improving the heat dissipation capacity of the display panel and avoid the occurrence of the situation that the performance of a light-emitting unit is adversely affected due to heat accumulation of the light-emitting unit.
In order to achieve the technical purpose, the embodiment of the application provides the following technical scheme:
a display panel, comprising:
a substrate;
the retaining wall layer comprises a plurality of retaining wall structures and a plurality of retaining wall openings, the retaining wall structures comprise at least two first heat dissipation layers arranged in different layers, and the extending direction of the first heat dissipation layers is parallel to the surface of the substrate;
and the light-emitting unit is arranged in the retaining wall opening.
A display device comprising a display panel as described above.
It can be seen from the above technical scheme that the embodiment of the application provides a display panel and a display device, wherein, display panel's barricade layer includes a plurality of barricade structures and a plurality of barricade openings, just barricade structure includes the first heat dissipation layer that two-layer at least different layers set up, and two-layer at least different layers set up first heat dissipation layer provides the heat dissipation passageway that two at least different layers set up for the heat that the luminous element that sets up in the barricade opening produced can outwards give off through the heat dissipation passageway that these two at least different layers set up, is favorable to promoting display panel's heat dissipation, avoids because luminous element's heat is accumulated around luminous element or inside and produces the condition that the adverse effect to luminous element's performance appears.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present application, and that other drawings may be obtained according to the provided drawings without inventive effort to a person skilled in the art.
Fig. 1 is a schematic cross-sectional structure of a display panel according to an embodiment of the present disclosure;
fig. 2 is a schematic cross-sectional structure of a display panel according to another embodiment of the present disclosure;
fig. 3 is a schematic cross-sectional structure of a display panel according to another embodiment of the present disclosure;
fig. 4 is a schematic cross-sectional structure of a display panel according to still another embodiment of the present application;
FIG. 5 is a schematic cross-sectional view of a display panel according to an alternative embodiment of the present disclosure;
FIG. 6 is a schematic cross-sectional view of a display panel according to another embodiment of the present disclosure;
FIG. 7 is a schematic cross-sectional view of a display panel according to another embodiment of the present disclosure;
FIG. 8 is a schematic cross-sectional view of a display panel according to still another alternative embodiment of the present application;
fig. 9 is a schematic cross-sectional structure of a display panel according to an embodiment of the present application;
fig. 10 is a schematic cross-sectional structure of a display panel according to another embodiment of the present disclosure;
FIG. 11 is a schematic cross-sectional view of a display panel according to still another embodiment of the present application;
fig. 12 is a schematic top view of a display panel according to an embodiment of the present disclosure;
FIG. 13 is a schematic cross-sectional view of FIG. 12 along line AA';
fig. 14 is an external view of a display device according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
An embodiment of the present application provides a display panel, as shown in fig. 1, fig. 1 is a schematic cross-sectional structure of the display panel, where the display panel includes:
a substrate 10.
The retaining wall layer is located at one side of the substrate 10, the retaining wall layer includes a plurality of retaining wall structures 40 and a plurality of retaining wall openings, the retaining wall structures 40 include at least two different layers of first heat dissipation layers 42, and an extending direction of the first heat dissipation layers 42 is parallel to the surface of the substrate 10.
The light emitting unit 30 is disposed in the wall opening.
In this embodiment, the functions of the retaining wall layer include at least three, one of which is to limit the setting position of the light emitting unit 30 through the retaining wall opening, the other of which is to block outside dust or water vapor from eroding the light emitting unit 30 through the retaining wall structure 40, and the third of which is to provide at least two different layers of heat dissipation channels for the light emitting unit 30 through the first heat dissipation layer 42 provided by at least two different layers of the retaining wall structure 40, so that the retaining wall structure 40 has the function of dissipating heat generated by the light emitting unit 30 outwards on the basis of having the waterproof and dustproof functions, thereby being beneficial to improving the heat dissipation capability of the display panel and avoiding the occurrence of adverse effects on the performance of the light emitting unit 30 due to the accumulation of heat of the light emitting unit 30 around or inside the light emitting unit 30.
Regarding the substrate 10, the substrate 10 may be a hard substrate or a flexible substrate, and when the substrate 10 is a flexible substrate, the substrate 10 may include a "substantially flat portion" and a "curved portion", where the "curved portion" may be used to achieve a "curved display" effect of the display panel, and may also be used to bend a trace connecting the light emitting unit 30 and a step area for binding a chip to the back of the display area, thereby achieving a display effect of a "full screen" substantially or completely. The "substantially flat portion" may be a portion where the surface is completely flat, or may be a portion having a curvature, but a smaller curvature, or a curvature smaller than that of the "curved portion".
Based on this, the description about "the extending direction of the first heat dissipation layer 42 is parallel to the surface of the substrate 10" is as follows:
for the "substantially flat portion" of the rigid substrate or the flexible substrate, the extending direction of the first heat dissipation layer 42 being parallel to the surface of the substrate 10 may include a case where the extending direction of the first heat dissipation layer 42 is completely parallel to the surface of the substrate 10, and may also include a case where the extending direction of the first heat dissipation layer 42 is substantially parallel to the surface of the substrate 10, where the extending direction of the first heat dissipation layer 42 is substantially parallel to the surface of the substrate 10 means that: the angle between the extending direction of the first heat dissipation layer 42 and the direction parallel to the surface of the substrate 10 is less than or equal to a preset angle, which may be, for example, 1 ° or 0.5 °.
As for the "curved portion" of the flexible substrate, it is understood that if the "curved portion" of the flexible substrate 10 is used for display as well, that is, the "curved portion" is used for disposing the barrier layer and the light emitting unit 30 as well, the first heat dissipation layer 42 in the barrier layer needs to be bent along with bending of the flexible substrate 10, and in this case, the extending direction of the first heat dissipation layer 42 parallel to the surface of the substrate 10 may refer to the tangential direction of the surface of the first heat dissipation layer 42 and the tangential direction of the surface of the substrate 10 at the position corresponding to the first heat dissipation layer 42 being completely parallel, or may refer to the tangential direction of the surface of the first heat dissipation layer 42 and the tangential direction of the surface of the substrate 10 at the position corresponding to the first heat dissipation layer 42 being substantially parallel, which is not limited in this application, and is specific to practical situations.
In fig. 1, the film indicated by reference numeral 20 is a driving film of the display panel, and includes a plurality of metal layers and a plurality of insulating layers isolating the plurality of metal layers, wherein the plurality of metal layers serve as gate lines, data lines, and control electrodes, first electrodes, and second electrodes of thin film transistors, respectively, and at least one thin film transistor constitutes a pixel driving circuit electrically connected to an anode of the light emitting unit 30 through a via hole penetrating the insulating layer.
In fig. 1, the structure indicated by reference numeral 31 is a package structure of the light emitting unit 30, and the package structure may be a Thin film package (Thin-Film Encapsulation, TFE) structure or a hard package structure, and in fig. 1, a whole package is illustrated as an example, and in other embodiments of the present application, the package manner of the light emitting unit 30 may also be a single package, which is not limited in this application.
Based on the above embodiments, in one embodiment of the present application, still referring to fig. 1, the retaining wall structure 40 further comprises: a plurality of layers 41 of spacer material.
The plurality of insulating material layers 41 and at least two of the first heat dissipation layers 42 are alternately stacked.
The isolating material layer 41 mainly isolates or absorbs external moisture or dust. In fig. 1, the outermost layers of the retaining wall structure 40 are the isolation material layers 41, and at this time, the number of the isolation material layers 41 in the retaining wall structure 40 is greater than the number of the first heat dissipation layers 42, which is favorable for ensuring the waterproof and dustproof performance of the retaining wall structure 40, and the retaining wall structure 40 shown in fig. 1 is more suitable for the Light Emitting unit 30 having a certain requirement for the waterproof and dustproof performance, for example, the Light Emitting unit 30 may be an OLED (Organic Light-Emitting Diode) Light Emitting unit 30. However, in other embodiments of the present application, referring to fig. 2, fig. 2 is a schematic cross-sectional structure of the display panel provided in the embodiments of the present application, in fig. 2, the outermost layers of the wall structures 40 may also be the first heat dissipation layers 42, and at this time, the number of the first heat dissipation layers 42 in the wall structures 40 needs to be the number of the redundant isolation material layers 41, so that more heat dissipation channels may be provided for the light emitting units 30, and the wall structures 40 shown in fig. 2 are more suitable for the light emitting units 30 with better waterproof and dustproof properties, but have certain requirements on heat dissipation properties, such as Micro-LED light emitting units 30. In fig. 1, the number of the first heat dissipation layers 42 is 2, the number of the isolation material layers 41 is 3, in fig. 2, the number of the first heat dissipation layers 42 is 3, the number of the isolation material layers 41 is 2, in other embodiments of the present application, the number of the first heat dissipation layers 42 may also be 4, 5, 6, etc., the number of similar isolation material layers 41 may also be 4, 5, 6, etc., and the outermost layer of the retaining wall structure 40 may be the same material layer or may be different material layers (for example, the uppermost layer is the first heat dissipation layer 42, the lowermost layer is the isolation material layer 41, or the uppermost layer is the isolation material layer 41, the lowermost layer is the first heat dissipation layer 42, etc.). The number of the isolation material layers 41 and the first heat dissipation layer 42 and the kind of the outermost film layer of the isolation structure are not limited in this application, and may be specific according to the actual situation.
In another embodiment of the present application, as shown in fig. 3, fig. 3 is a schematic cross-sectional structure of the display panel, where the retaining wall structure 40 further includes at least one first connection structure 43, and the first connection structure 43 connects two adjacent layers of the first heat dissipation layer 42.
Still referring to fig. 3, one of the first connection structures 43 is disposed between two adjacent first heat dissipation layers 42, and connects the two adjacent first heat dissipation layers 42. The extending direction of the first connection structure 43 may be perpendicular to the extending direction of the first heat dissipation layer 42, or may intersect the extending direction of the first heat dissipation layer 42. The first connection structure 43 may be formed by etching the isolation material layer 41 to form a cavity through an etching process after the isolation material layer 41 is formed, and then forming the first connection structure 43 in the cavity.
In this embodiment, when the heat values of the different positions of the light emitting unit 30 are inconsistent, the first connection structure 43 connects the two adjacent first heat dissipation layers 42, so that the heat in the two adjacent first heat dissipation layers 42 can be transferred to each other, so that the heat inside the connected first heat dissipation layers 42 is uniform, which is beneficial to fully utilizing the heat dissipation performance of the first heat dissipation layers 42. The material forming the first connection structure 43 may be the same as the material forming the first heat dissipation layer 42 or may be different from the material forming the first heat dissipation layer 42, but since the first connection structure 43 needs to have a certain heat transfer and heat conduction capability, the material forming the first connection structure 43 needs to have a better heat dissipation or heat conduction capability.
The first heat dissipation layer 42 may be a semiconductor heat dissipation layer or a metal heat dissipation layer including a silver metal layer or a copper metal layer or an aluminum alloy layer. The thickness of the first heat dissipation layer 42 may be selected to be 1nm to 1000nm.
In fig. 3, only an example of the retaining wall structure 40 having one first connection structure 43 is illustrated, referring to fig. 4, fig. 4 is a schematic cross-sectional structure of the display panel, in fig. 4, the retaining wall structure 40 includes a plurality (greater than or equal to 2) of first connection structures 43, and the front projections of the first connection structures 43 of different layers on the substrate 10 do not overlap each other.
As described above, the formation process of the first connection structure 43 may include an etching process such as photolithography, and setting the formation positions of the first connection structures 43 of different layers to be different from each other (i.e., the front projections of the first connection structures 43 of different layers on the substrate 10 do not overlap), so as to reduce the thermal influence caused by frequently or multiple etching of the film layers in the same region.
In fig. 3 and fig. 4, two adjacent layers of the first heat dissipation layers 42 are each illustrated by taking only one first connection structure 43 as an example, in other embodiments of the present application, referring to fig. 5, fig. 5 is a schematic cross-sectional structure of the display panel, two adjacent layers of the first heat dissipation layers 42 may be further connected by a plurality of first connection structures 43, and a plurality of first connection structures 43 may enable two adjacent layers of the first heat dissipation layers 42 to have better heat conducting performance, so that when the size of the display panel is larger, heat in two adjacent layers of the first heat dissipation layers 42 may be also guaranteed to be transferred by a plurality of first connection structures 43.
For the implementation manner of the first connection structure 43, referring to fig. 6 in addition to the manner shown in fig. 3-5, fig. 6 is a schematic cross-sectional structure of the display panel, and the light reflecting layer 50 covering the side wall of the retaining wall structure 40 may be multiplexed into the first connection structure 43, where the light reflecting layer 50 is used to reflect the outgoing light of the light emitting unit 30, and the above-mentioned function of the first connection structure 43 is also performed.
On the basis of the above embodiments, in one embodiment of the present application, the first heat dissipation layer 42 is further configured to receive a fixed potential.
In this embodiment, the fixed potential may be a ground potential (GND), and at this time, the first heat dissipation layer 42 may also provide a shielding effect of an external interference signal for a pixel circuit in the display panel or provide an electrostatic protection effect for the display panel, so as to improve an electrostatic Discharge (ESD) performance of the display panel.
In another embodiment of the present application, the first heat dissipation layer 42 is electrically connected to the cathode of the light emitting unit 30, or the first heat dissipation layer 42 is electrically connected to the power signal line of the display panel.
In this embodiment, when the first heat dissipation layer 42 is electrically connected to the cathode of the light emitting unit 30, the cathode area of the light emitting unit 30 may be increased, thereby reducing the cathode resistance of the light emitting unit 30. Similarly, when the first heat dissipation layer 42 is electrically connected to the power signal line, it is advantageous to increase the area of the power signal line, thereby reducing the resistance of the power signal line. The power signal line may be a high-level power signal line (PVDD) or a low-level power signal line (PVEE).
In addition to the above embodiments, in yet another embodiment of the present application, as shown in fig. 7 and 8, fig. 7 and 8 are schematic cross-sectional structures of the display panel, and the display panel further includes at least one second heat dissipation layer 60, where the second heat dissipation layer 60 is located in the substrate 10 (refer to fig. 7) and/or the second heat dissipation layer 60 is located on a side of the substrate 10 away from the retaining wall layer (refer to fig. 8).
Still referring to fig. 7, when the second heat dissipation layer 60 is located within the substrate 10, the second heat dissipation layer 60 may be located between the substrate 10 and the barrier layer.
At least one of the second heat dissipation layers 60 may provide at least one bottom heat dissipation channel for the bottom of the light emitting unit 30, and at least one of the second heat dissipation layers 60, in cooperation with at least two different layers of the first heat dissipation layer 42, provides a comprehensive heat dissipation network for the light emitting unit 30.
In fig. 7 and 8, only a case where the second heat dissipation layer 60 is one layer is shown, in other embodiments of the present application, the second heat dissipation layer 60 may be multiple layers, and the second heat dissipation layer 60 may be located in the display panel and on a side of the substrate 10 away from the retaining wall layer at the same time.
As for the shape of the second heat dissipation layer 60, the second heat dissipation layer 60 is exemplified as a plane in fig. 7 and 8, but in other embodiments of the present application, referring to fig. 9 and 10, fig. 9 and 10 are schematic cross-sectional structures of the display panel, and the second heat dissipation layer 60 may also have a wave shape in a cross section perpendicular to the display panel. In fig. 9 and 10, in order to ensure that the plane of the waved second heat dissipation layer 60 is flat, an insulating layer 61 for planarization is also shown in fig. 9 and 10.
The undulations may be regular undulations (as shown in fig. 9) where the undulation has the same height of the protrusions (ridges) and depth of the depressions (valleys) and the repetition period of the valleys is the same. The undulations may also be irregular undulations (as shown in fig. 10), where the undulations differ in the height of the ridges and the depth of the valleys and the repetition period of the valleys differs.
Still referring to fig. 9 and 10, when the second heat dissipation layer 60 is waved in a cross section perpendicular to the display panel, the front projection of the waved valleys of the second heat dissipation layer 60 on the substrate 10 overlaps with the front projection of the light emitting unit 30 on the substrate 10, and the front projection of the waved ridges of the second heat dissipation layer 60 on the substrate 10 overlaps with the front projection of the retaining wall structure 40 on the substrate 10.
In still another embodiment of the present application, referring to fig. 11, fig. 11 is a schematic cross-sectional structure of the display panel, and the display panel further includes:
and a second connection structure 62, wherein the second connection structure 62 connects the first heat dissipation layer 42 and the second heat dissipation layer 60.
In the structure shown in fig. 11, the second connection structure 62 connects the first heat dissipation layer 42 and the second heat dissipation layer 60 together, so that heat in the second heat dissipation layer 60 and the first heat dissipation layer 42 can be transferred to each other, and when the heat generation amounts of the respective portions of the light emitting unit 30 are different, the heat in the second heat dissipation layer 60 and the first heat dissipation layer 42 connected together can be transferred to each other, so that the heat in the first heat dissipation layer 42 and the second heat dissipation layer 60 connected together is uniform, which is beneficial to fully utilizing the heat dissipation performance of the first heat dissipation layer 42 and the second heat dissipation layer 60.
Similar to the first connection structure 43, the material forming the second connection structure 62 may be the same as the material forming the first heat dissipation layer 42 and/or the second heat dissipation layer 60, or may be different from the material forming the first heat dissipation layer 42 and/or the second heat dissipation layer 60, but since the second connection structure 62 needs to have a certain heat transfer and heat conduction capability, the material forming the second connection structure 62 needs to have a better heat dissipation or heat conduction capability.
In addition, since the front projection of the wavy valley of the second heat dissipation layer 60 on the substrate 10 overlaps with the front projection of the light emitting unit 30 on the substrate 10, the front projection of the wavy ridge of the second heat dissipation layer 60 on the substrate 10 overlaps with the front projection of the retaining wall structure 40 on the substrate 10, which makes the distance between the valley of the second heat dissipation layer 60 and the first heat dissipation layer 42 closer, is beneficial to reducing the extension length of the second connection structure 62 in the direction perpendicular to the substrate 10, and simultaneously, is beneficial to reducing the etching depth when preparing the via hole for accommodating the second connection structure 62 when preparing the second connection structure 62, thereby reducing the process difficulty.
For the thickness of each of the first heat dissipation layers 42, still referring to fig. 6-11, the thickness of each of the first heat dissipation layers 42 is inversely proportional to the vertical distance between the first heat dissipation layer 42 and the second heat dissipation layer 60. It will be appreciated that, in the case of the same factors such as area and material, the larger the thickness of the first heat dissipation layer 42 is, the better the heat dissipation capability, while in this embodiment, the larger the thickness of the first heat dissipation layer 42 closer to the second heat dissipation layer 60 is, so that the heat generated by the light emitting unit 30 can be mostly transferred through the first heat dissipation layer 42 closer to the second heat dissipation layer 60, which is favorable for transferring the heat in each layer of the first heat dissipation layer 42 to the second heat dissipation layer 60 through the first connection structure 43 and the second connection structure 62, so that most of the heat is led out through the second heat dissipation layer 60 at the bottom, and adverse effects of the heat on each film layer of the retaining wall structure 40 are avoided.
The area of the first heat dissipation layer 42 is gradually reduced in a direction perpendicular to the substrate 10 and directed to the light emitting surface of the display panel. Similarly, in the case that the thickness, the material and other factors are the same, the heat dissipation capability of the first heat dissipation layer 42 with a larger area is better, while in the present embodiment, the area of the first heat dissipation layer 42 closer to the second heat dissipation layer 60 is larger, so that most of the heat generated by the light emitting unit 30 can be transmitted through the first heat dissipation layer 42 closer to the second heat dissipation layer 60, which is favorable for transmitting the heat in each layer of the first heat dissipation layer 42 to the second heat dissipation layer 60 through the first connection structure 43 and the second connection structure 62, so that most of the heat is led out through the second heat dissipation layer 60 at the bottom, and adverse effects of the heat on each film layer of the retaining wall structure 40 are avoided.
The thickness of the first heat dissipation layer 42 is gradually reduced in a direction perpendicular to the substrate 10 and directed to the light emitting surface of the display panel. Similarly, in the case that the factors such as the area and the material are the same, the heat dissipation capability of the first heat dissipation layer 42 with a larger thickness is better, while in the present embodiment, the thickness of the first heat dissipation layer 42 closer to the second heat dissipation layer 60 is larger, so that most of the heat generated by the light emitting unit 30 can be transmitted through the first heat dissipation layer 42 closer to the second heat dissipation layer 60, which is beneficial to transmitting the heat in each layer of the first heat dissipation layer 42 to the second heat dissipation layer 60 through the first connection structure 43 and the second connection structure 62, so that most of the heat is led out through the second heat dissipation layer 60 at the bottom, and adverse effects of the heat on each film layer of the retaining wall structure 40 are avoided.
Based on the above embodiments, in an alternative embodiment of the present application, referring to fig. 12 and 13, fig. 12 is a schematic top view structure of the display panel (for clearly showing the state of the first heat dissipation layer 42, the outermost isolation material layer 41 in the retaining wall structure 40 is not shown in fig. 12), fig. 13 is a schematic cross-sectional structure along the line AA' of fig. 12, and as can be seen from fig. 12 and 13, in this embodiment, the retaining wall structure 40 is disposed around the retaining wall opening, the first heat dissipation layers 42 located in the same layer adjacent to the retaining wall structure 40 are connected to each other, so as to form a heat dissipation layer extending to the whole layer of the edge of the substrate, and then the first heat dissipation layers 42 located in at least two different layers in the plurality of retaining wall structures 40 form a plurality of heat dissipation channels of different layers, so that the heat generated by the light emitting unit 30 located in the retaining wall opening is diffused to the edge of the display panel, that is diffused around the display panel, thereby achieving the purpose of heat dissipation of the light emitting unit, and improving the heat dissipation performance of the display panel.
Correspondingly, the embodiment of the application further provides a display device, as shown in fig. 14, fig. 14 is an external schematic view of the display device a100, where the display device a100 includes the display panel according to any of the embodiments described above.
In summary, the embodiment of the application provides a display panel and a display device, wherein, the retaining wall layer of the display panel includes a plurality of retaining wall structures and a plurality of retaining wall openings, just the retaining wall structure includes the first heat dissipation layer that two-layer at least different layers set up, and two-layer at least different layers set up the heat dissipation channel that two at least different layers set up is provided to the first heat dissipation layer for the heat that the luminescence unit that sets up in the retaining wall opening produced can outwards give off through the heat dissipation channel that two at least different layers set up, is favorable to promoting the heat dispersion of display panel, avoids producing the condition that the adverse effect to the performance of luminescence unit appears because the heat of luminescence unit is accumulated around or inside luminescence unit.
Features described in the embodiments in this specification may be replaced or combined with each other, and each embodiment is mainly described in the differences from the other embodiments, and identical and similar parts between the embodiments are all enough to be referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (14)
1. A display panel, comprising:
a substrate;
the retaining wall layer comprises a plurality of retaining wall structures and a plurality of retaining wall openings, the retaining wall structures comprise at least two first radiating layers arranged in different layers, a plurality of isolating material layers and at least one first connecting structure, the extending direction of the first radiating layers is parallel to the surface of the substrate, the isolating material layers and the at least two first radiating layers are alternately laminated, and the first connecting structure is connected with two adjacent first radiating layers;
a reflective layer covering the sidewall of the retaining wall structure; the reflective layer is multiplexed into the first connection structure;
and the light-emitting unit is arranged in the retaining wall opening.
2. The display panel of claim 1, wherein the front projections of the first connection structures of different layers at the substrate do not overlap.
3. The display panel of claim 1, wherein the first heat sink layer receives a fixed potential.
4. A display panel according to claim 3, wherein the first heat dissipation layer is electrically connected to a cathode of the light emitting unit or the first heat dissipation layer is electrically connected to a power signal line of the display panel.
5. The display panel according to claim 1, further comprising at least one second heat dissipation layer, wherein the second heat dissipation layer is located in the substrate or/and the second heat dissipation layer is located at a side of the substrate away from the barrier layer.
6. The display panel according to claim 5, wherein the second heat dissipation layer has a wave shape in a cross section perpendicular to the display panel.
7. The display panel of claim 6, wherein an orthographic projection of the valleys of the undulations of the second heat sink layer at the substrate overlaps an orthographic projection of the light emitting cells at the substrate, and wherein an orthographic projection of the ridges of the undulations of the second heat sink layer at the substrate overlaps an orthographic projection of the retaining wall structures at the substrate.
8. The display panel according to claim 5 or 7, further comprising:
the second connecting structure is connected with the first heat dissipation layer and the second heat dissipation layer.
9. The display panel of claim 5, wherein the display panel comprises,
the thickness of each of the first heat dissipation layers is inversely proportional to the vertical distance between the first heat dissipation layer and the second heat dissipation layer.
10. The display panel of claim 5, wherein the display panel comprises,
the area of the first heat dissipation layer is gradually reduced in the direction perpendicular to the direction of the substrate pointing to the light emitting surface of the display panel.
11. The display panel of claim 5, wherein the display panel comprises,
in the direction perpendicular to the substrate and pointing to the light emitting surface of the display panel, the thickness of the first heat dissipation layer is gradually reduced.
12. The display panel of claim 1, wherein the first heat dissipation layers of the same layer of the barrier layer are connected to each other and extend to an edge of the substrate.
13. The display panel of claim 1, wherein the display panel comprises,
the light emitting unit comprises an OLED light emitting unit or a micro-LED light emitting unit.
14. A display device, comprising: the display panel of any one of claims 1-13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010614897.2A CN111725428B (en) | 2020-06-30 | 2020-06-30 | Display panel and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010614897.2A CN111725428B (en) | 2020-06-30 | 2020-06-30 | Display panel and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111725428A CN111725428A (en) | 2020-09-29 |
| CN111725428B true CN111725428B (en) | 2023-04-21 |
Family
ID=72570447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010614897.2A Active CN111725428B (en) | 2020-06-30 | 2020-06-30 | Display panel and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111725428B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112599552B (en) * | 2020-12-14 | 2024-02-20 | 苏州芯聚半导体有限公司 | Micro light emitting diode display panel and preparation method thereof |
| CN112786760B (en) * | 2020-12-31 | 2022-12-13 | 厦门天马微电子有限公司 | Display panel, preparation method and display device |
| CN115224213A (en) * | 2021-04-16 | 2022-10-21 | 北京京东方技术开发有限公司 | Quantum dot light-emitting device and display device |
| CN113224103A (en) | 2021-04-28 | 2021-08-06 | 上海天马微电子有限公司 | Display panel and display device |
| CN113345336B (en) * | 2021-05-31 | 2023-06-06 | 上海天马微电子有限公司 | Display panel and manufacturing method thereof |
| CN114267780A (en) * | 2021-12-14 | 2022-04-01 | Tcl华星光电技术有限公司 | Display panel and manufacturing method thereof |
| CN114695499A (en) * | 2022-04-27 | 2022-07-01 | 深圳市华星光电半导体显示技术有限公司 | Display panel |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1395449A (en) * | 2002-06-14 | 2003-02-05 | 光磊科技股份有限公司 | Organic electroluminescent element |
| JP2006236744A (en) * | 2005-02-24 | 2006-09-07 | Seiko Epson Corp | Organic el device, its manufacturing method, and electronic equipment |
| CN102368529A (en) * | 2011-06-03 | 2012-03-07 | 王双喜 | Packaging structure of light source of high power LED |
| CN102368532A (en) * | 2011-06-03 | 2012-03-07 | 王双喜 | LED (light emitting diode) encapsulation structure with metal radiating fins |
| CN107705713A (en) * | 2017-10-13 | 2018-02-16 | 上海天马微电子有限公司 | Display panel and display device |
| CN110690362A (en) * | 2019-10-15 | 2020-01-14 | 昆山国显光电有限公司 | Display panel and display device |
| CN110828530A (en) * | 2019-11-28 | 2020-02-21 | 武汉华星光电半导体显示技术有限公司 | Display panel, preparation method thereof and display device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8901804B2 (en) * | 2009-10-02 | 2014-12-02 | Sharp Kabushiki Kaisha | Organic EL illumination device and method for manufacturing the same |
| KR102478676B1 (en) * | 2017-09-29 | 2022-12-16 | 엘지디스플레이 주식회사 | Organic Light-Emitting Display device having an encapsulating substrate of high thermal conductivity |
| KR102534189B1 (en) * | 2018-12-17 | 2023-05-17 | 엘지디스플레이 주식회사 | Heat radiation member for flexible display and electronic device using the same |
-
2020
- 2020-06-30 CN CN202010614897.2A patent/CN111725428B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1395449A (en) * | 2002-06-14 | 2003-02-05 | 光磊科技股份有限公司 | Organic electroluminescent element |
| JP2006236744A (en) * | 2005-02-24 | 2006-09-07 | Seiko Epson Corp | Organic el device, its manufacturing method, and electronic equipment |
| CN102368529A (en) * | 2011-06-03 | 2012-03-07 | 王双喜 | Packaging structure of light source of high power LED |
| CN102368532A (en) * | 2011-06-03 | 2012-03-07 | 王双喜 | LED (light emitting diode) encapsulation structure with metal radiating fins |
| CN107705713A (en) * | 2017-10-13 | 2018-02-16 | 上海天马微电子有限公司 | Display panel and display device |
| CN110690362A (en) * | 2019-10-15 | 2020-01-14 | 昆山国显光电有限公司 | Display panel and display device |
| CN110828530A (en) * | 2019-11-28 | 2020-02-21 | 武汉华星光电半导体显示技术有限公司 | Display panel, preparation method thereof and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111725428A (en) | 2020-09-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111725428B (en) | Display panel and display device | |
| CN109962092B (en) | Display panel and display device | |
| US20220223658A1 (en) | Electronic device | |
| KR20240045195A (en) | Transparent organic light emitting display apparatus and method of manufacturing the same | |
| CN111798759B (en) | Flexible display device and electronic equipment | |
| CN110165071B (en) | Organic light-emitting display panel and organic light-emitting display device | |
| CN108615819B (en) | Display panel, display panel manufacturing method and display terminal | |
| US10673021B2 (en) | Package structure, flexible display screen, and method for manufacturing package structure | |
| JP7343614B2 (en) | Display substrate, manufacturing method thereof, display device | |
| CN110045874B (en) | Touch display panel and touch display device | |
| CN110911582A (en) | Display panel and display device | |
| CN111092101B (en) | Display device | |
| CN115274790B (en) | Display panel and manufacturing method thereof | |
| CN113097374A (en) | Display panel and display device | |
| CN209912873U (en) | Organic light emitting display panel | |
| CN113838996B (en) | Display panel and preparation method thereof | |
| CN218918892U (en) | LED display panel, display screen and electronic equipment | |
| CN114975751B (en) | Light-emitting panel, display device and backlight module | |
| CN110600520A (en) | Display panel and display device | |
| CN116130583A (en) | Display panel and display device | |
| CN112868100A (en) | Light unit and display device including the same | |
| CN215935347U (en) | Packaging heat dissipation structure of micro display array | |
| US11984459B2 (en) | Array substrate and OLED display panel | |
| US20220310752A1 (en) | Display Substrate and Display Apparatus | |
| CN115881756A (en) | Array substrate and display panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |