CN111725428A - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN111725428A CN111725428A CN202010614897.2A CN202010614897A CN111725428A CN 111725428 A CN111725428 A CN 111725428A CN 202010614897 A CN202010614897 A CN 202010614897A CN 111725428 A CN111725428 A CN 111725428A
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- heat dissipation
- display panel
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
Abstract
The application discloses display panel and display device, wherein, display panel's barricade layer includes a plurality of barricade structures and a plurality of barricade opening, just barricade structure includes the first heat dissipation layer that two at least different layers set up, and two at least different layers set up first heat dissipation layer provides the heat dissipation channel that two at least different layers set up for the heat that the luminescence unit that sets up in the barricade opening produced can outwards give off through the heat dissipation channel that these two at least different layers set up, is favorable to promoting display panel's heat-sinking capability, avoids because the heat of luminescence unit is around the luminescence unit or the inside accumulation and produces the condition of harmful effects to the performance of luminescence unit and appears.
Description
Technical Field
The present application relates to the field of display technologies, and more particularly, to a display panel and a display device.
Background
For the display panel, the luminous unit of display panel can produce the heat at the course of the work, along with the continuous work of luminous unit, the heat that luminous unit produced also constantly increases, if these heats distribute away in time, can influence the functioning speed of luminous element or the inside other components of display panel, reduces the display panel performance, influences user experience.
Disclosure of Invention
In order to solve the technical problem, the application provides a display panel and a display device to realize the purpose of improving the heat dissipation capability of the display panel and avoid the occurrence of the situation of adverse effect on the performance of a light-emitting unit due to the heat accumulation of the light-emitting unit.
In order to achieve the technical purpose, the embodiment of the application provides the following technical scheme:
a display panel, comprising:
a substrate;
the retaining wall layer is positioned on one side of the substrate and comprises a plurality of retaining wall structures and a plurality of retaining wall openings, each retaining wall structure comprises at least two first heat dissipation layers which are arranged in different layers, and the extending direction of each first heat dissipation layer is parallel to the surface of the substrate;
and the light-emitting unit is arranged in the opening of the retaining wall.
A display device comprises the display panel.
It can be seen from the above technical scheme that this application embodiment provides a display panel and display device, wherein, display panel's barricade layer includes a plurality of barricade structures and a plurality of barricade opening, just barricade structure includes the first heat dissipation layer that at least two-layer different layers set up, and at least two-layer different layers set up first heat dissipation layer provides the heat dissipation channel that at least two different layers set up for the heat that the luminescence unit that sets up in the barricade opening produced can outwards distribute through the heat dissipation channel that these at least two different layers set up, is favorable to promoting display panel's heat-sinking capability, avoids producing harmful effects's the condition to luminescence unit because luminescence unit's heat is around luminescence unit or inside accumulation and appears.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view illustrating a display panel according to an embodiment of the present disclosure;
fig. 2 is a schematic cross-sectional view of a display panel according to another embodiment of the present disclosure;
fig. 3 is a schematic cross-sectional view illustrating a display panel according to another embodiment of the present application;
fig. 4 is a schematic cross-sectional view illustrating a display panel according to still another embodiment of the present disclosure;
fig. 5 is a schematic cross-sectional view of a display panel according to an alternative embodiment of the present application;
fig. 6 is a schematic cross-sectional view of a display panel according to another alternative embodiment of the present application;
fig. 7 is a schematic cross-sectional view of a display panel according to yet another alternative embodiment of the present application;
fig. 8 is a schematic cross-sectional view of a display panel according to still another alternative embodiment of the present application;
fig. 9 is a schematic cross-sectional view of a display panel according to an embodiment of the present disclosure;
fig. 10 is a schematic cross-sectional view of a display panel according to another embodiment of the present application;
fig. 11 is a schematic cross-sectional view illustrating a display panel according to still another embodiment of the present disclosure;
fig. 12 is a schematic top view illustrating a display panel according to an embodiment of the present disclosure;
FIG. 13 is a schematic cross-sectional view taken along line AA' of FIG. 12;
fig. 14 is an external view of a display device according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
An embodiment of the present application provides a display panel, as shown in fig. 1, where fig. 1 is a schematic cross-sectional structure diagram of the display panel, and the display panel includes:
a substrate 10.
Be located the barricade layer of base plate 10 one side, the barricade layer includes a plurality of barricade structures 40 and a plurality of barricade opening, barricade structure 40 includes the first heat dissipation layer 42 of at least two-layer different layer setting, the extending direction of first heat dissipation layer 42 with base plate 10 surface is parallel.
And a light emitting unit 30 disposed in the opening of the retaining wall.
In this embodiment, the function of retaining wall layer includes three at least, and one is for passing through the barricade opening is injectd luminescence unit 30 sets up the position, and its two are for passing through barricade structure 40 blocks external dust or steam and corrodes luminescence unit 30, and its three is for passing through first heat dissipation layer 42 that at least two-layer different layer set up in the barricade structure 40 does luminescence unit 30 provides the heat dissipation channel that two at least different layers set up, makes barricade structure 40 has the function of outwards giving off the heat that luminescence unit 30 produced on the basis that possesses waterproof dustproof function concurrently to be favorable to promoting display panel's heat-sinking capability, avoid because luminescence unit 30's heat is around luminescence unit 30 or the condition that inside accumulation produced harmful effects to luminescence unit 30 appears.
Regarding the substrate 10, the substrate 10 may be a rigid substrate or a flexible substrate, and when the substrate 10 is a flexible substrate, the substrate 10 may include a "substantially flat portion" and a "curved portion", and the "curved portion" may be used to achieve a "curved surface display" effect of a display panel, and may also be used to bend a trace connecting the light emitting units 30 and a step area for binding a chip to the back of the display area, so as to substantially or completely achieve a "full screen" display effect. The "substantially flat portion" may be a portion whose surface is completely flat, or may be a portion having a certain curvature but a smaller curvature, or a curvature smaller than that of the "curved portion".
Based on this, the description about "the extending direction of the first heat dissipation layer 42 is parallel to the surface of the substrate 10" is as follows:
for the "substantially flat portion" of the rigid substrate or the flexible substrate, the case where the extending direction of the first heat dissipation layer 42 is parallel to the surface of the substrate 10 may include the case where the extending direction of the first heat dissipation layer 42 is completely parallel to the surface of the substrate 10, and may also include the case where the extending direction of the first heat dissipation layer 42 is substantially parallel to the surface of the substrate 10, where the extending direction of the first heat dissipation layer 42 is substantially parallel to the surface of the substrate 10 means that: an angle between the extending direction of the first heat dissipation layer 42 and a direction parallel to the surface of the substrate 10 is smaller than or equal to a predetermined angle value, which may be, for example, 1 ° or 0.5 °.
As for the "curved portion" of the flexible substrate, it is understood that, if the "curved portion" of the flexible substrate 10 is also used for displaying, that is, the "curved portion" is also used for disposing the barrier layer and the light emitting unit 30, the first heat dissipation layer 42 in the barrier layer also needs to be bent along with the bending of the flexible substrate 10, and the extending direction of the first heat dissipation layer 42 in parallel with the surface of the substrate 10 may refer to a case that the surface tangential direction of the first heat dissipation layer 42 is completely parallel to the tangential direction of the surface of the substrate 10 at the position corresponding to the first heat dissipation layer 42, or may refer to a case that the surface tangential direction of the first heat dissipation layer 42 is substantially parallel to the tangential direction of the surface of the substrate 10 at the position corresponding to the first heat dissipation layer 42, which is not limited in this application, depending on the actual situation.
In addition, in fig. 1, the film layer designated by reference numeral 20 is a driving film layer of the display panel, and includes a plurality of layers of metals and a plurality of insulating layers for separating the plurality of layers of metals, the plurality of layers of metals respectively serving as gate lines, data lines, and control electrodes, first electrodes, and second electrodes of thin film transistors, at least one thin film transistor constituting a pixel driving circuit electrically connected to the anode of the light emitting unit 30 through a via hole penetrating the insulating layers.
In fig. 1, the structure indicated by reference numeral 31 is an Encapsulation structure of the light emitting unit 30, and the Encapsulation structure may be a Thin-Film Encapsulation (TFE) structure or a rigid Encapsulation structure, and is illustrated in fig. 1 by way of example as a full-area Encapsulation structure, and in other embodiments of the present application, the Encapsulation mode of the light emitting unit 30 may be a single Encapsulation structure, which is not limited in this application.
On the basis of the above embodiment, in an embodiment of the present application, still referring to fig. 1, the retaining wall structure 40 further includes: a plurality of layers 41 of spacer material.
A plurality of the spacer material layers 41 and at least two of the first heat dissipation layers 42 are alternately stacked.
The function of the isolating material layer 41 is mainly to isolate or absorb moisture or dust from the outside. In fig. 1, the outermost layer of the retaining wall structure 40 is the isolation material layer 41, and the number of the isolation material layers 41 in the retaining wall structure 40 is more than the number of the first heat dissipation layers 42, which is beneficial to ensuring the waterproof and dustproof performance of the retaining wall structure 40, and the retaining wall structure 40 shown in fig. 1 is more suitable for the Light Emitting unit 30 having a certain requirement on the waterproof and dustproof performance, for example, the Light Emitting unit 30 may be an OLED (Organic Light-Emitting Diode) Light Emitting unit 30. However, in other embodiments of the present application, referring to fig. 2, fig. 2 is a schematic cross-sectional structure diagram of a display panel provided in the embodiments of the present application, in fig. 2, the outermost layers of the retaining wall structures 40 may also be the first heat dissipation layers 42, at this time, the number of the first heat dissipation layers 42 in the retaining wall structures 40 needs to be larger than the number of the isolation material layers 41, so that more heat dissipation channels can be provided for the light emitting units 30, and the retaining wall structures 40 shown in fig. 2 are more suitable for the light emitting units 30 which have better waterproof and dustproof performance but have certain requirements for heat dissipation performance, such as Micro-LED light emitting units 30. In fig. 1, the number of the first heat dissipation layers 42 is 2, and the number of the isolation material layers 41 is 3, which are taken as an example for description, in fig. 2, the number of the first heat dissipation layers 42 is 3, and the number of the isolation material layers 41 is 2, which are taken as an example for description, in other embodiments of the present application, the number of the first heat dissipation layers 42 may also be 4, 5, 6, and so on, and similarly, the number of the isolation material layers 41 may also be 4, 5, 6, and so on, and the outermost layers of the retaining wall structure 40 may be the same material layer, or may be different material layers (for example, the uppermost layer is the first heat dissipation layer 42, the lowermost layer is the isolation material layer 41, or the uppermost layer is the isolation material layer 41, and the lowermost layer is the first heat dissipation layer 42, and so on). The number of the isolating material layer 41 and the first heat dissipation layer 42 and the kind of the outermost film layer of the isolating structure are not limited in this application, which is determined by the actual situation.
On the basis of the above embodiments, in another embodiment of the present application, as shown in fig. 3, fig. 3 is a schematic cross-sectional structure diagram of the display panel, and the retaining wall structure 40 further includes at least one first connection structure 43, where the first connection structure 43 connects two adjacent first heat dissipation layers 42.
Still referring to fig. 3, one of the first connection structures 43 is disposed between two adjacent first heat dissipation layers 42 to connect the two adjacent first heat dissipation layers 42. The extending direction of the first connecting structure 43 may be perpendicular to the extending direction of the first heat dissipation layer 42, or may intersect the extending direction of the first heat dissipation layer 42. The first connection structure 43 may be formed by etching the isolation material layer 41 through an etching process to form a cavity after the isolation material layer 41 is formed, and then forming the first connection structure 43 in the cavity.
In this embodiment, when the heat generation amounts of different positions of the light emitting unit 30 are different, the first connecting structure 43 connects two adjacent first heat dissipation layers 42, so that the heat in the two adjacent first heat dissipation layers 42 can be transferred to each other, the heat inside the connected first heat dissipation layers 42 is uniform, and the heat dissipation performance of the first heat dissipation layers 42 can be fully utilized. The material forming the first connection structure 43 may be the same as the material forming the first heat dissipation layer 42, or may be different from the material forming the first heat dissipation layer 42, but since the first connection structure 43 needs to have a certain heat transfer and heat conduction capability, the material forming the first connection structure 43 needs to have a good heat dissipation or heat conduction capability.
The first heat dissipation layer 42 may be a semiconductor heat dissipation layer or a metal heat dissipation layer including a silver metal layer or a copper metal layer or an aluminum alloy layer. The thickness of the first heat dissipation layer 42 can be selected from a range of 1nm to 1000 nm.
In fig. 3, only one first connection structure 43 is taken as an example of the retaining wall structure 40 for explanation, referring to fig. 4, fig. 4 is a schematic cross-sectional structure diagram of the display panel, in fig. 4, the retaining wall structure 40 includes a plurality (greater than or equal to 2) of the first connection structures 43, and the front projections of the first connection structures 43 of different layers on the substrate 10 do not overlap each other.
As mentioned above, an etching process such as photolithography may be included in the formation process of the first connection structure 43, and setting the formation positions of the first connection structures 43 of different layers to be different from each other (i.e. the orthographic projections of the first connection structures 43 of different layers on the substrate 10 do not overlap) may reduce the thermal influence caused by frequent or multiple etching of the film layers in the same area.
In fig. 3 and fig. 4, two adjacent first heat dissipation layers 42 are illustrated as including only one first connection structure 43, in other embodiments of the present application, referring to fig. 5, fig. 5 is a schematic cross-sectional view of the display panel, two adjacent first heat dissipation layers 42 may also be connected by a plurality of first connection structures 43, the plurality of first connection structures 43 may make the heat conductivity of two adjacent first heat dissipation layers 42 better, and when the size of the display panel is larger, it may also be ensured that the heat in two adjacent first heat dissipation layers 42 may be transferred to each other by the plurality of first connection structures 43.
As for the implementation manner of the first connection structure 43, in addition to the manner shown in fig. 3-5, referring to fig. 6, fig. 6 is a schematic cross-sectional structure diagram of the display panel, and a manner of multiplexing a reflective layer 50 covering the sidewall of the retaining wall structure 40 as the first connection structure 43 may also be adopted, where the reflective layer 50 is used for reflecting the emergent light of the light-emitting unit 30, so as to achieve the function of improving the light utilization rate, and also achieve the above-mentioned function of the first connection structure 43.
On the basis of the above embodiments, in one embodiment of the present application, the first heat dissipation layer 42 is also used for receiving a fixed potential.
In this embodiment, the fixed potential may be a ground potential (GND), and at this time, the first heat dissipation layer 42 may further provide a shielding effect of an external interference signal for a pixel circuit in the display panel or provide an electrostatic protection effect for the display panel, so as to improve an electrostatic Discharge (ESD) performance of the display panel.
In another embodiment of the present application, the first heat dissipation layer 42 is electrically connected to the cathodes of the light emitting cells 30, or the first heat dissipation layer 42 is electrically connected to the power signal lines of the display panel.
In the present embodiment, when the first heat dissipation layer 42 is electrically connected to the cathode of the light emitting cell 30, the cathode area of the light emitting cell 30 may be increased, thereby reducing the cathode resistance of the light emitting cell 30. Similarly, when the first heat dissipation layer 42 is electrically connected to the power signal line, it is advantageous to increase the area of the power signal line, thereby reducing the resistance of the power signal line. The power signal line may be a high-level power signal line (PVDD) or a low-level power signal line (PVEE).
On the basis of the above embodiments, in another embodiment of the present application, as shown in fig. 7 and fig. 8, fig. 7 and fig. 8 are schematic cross-sectional views of the display panel, the display panel further includes at least one second heat dissipation layer 60, the second heat dissipation layer 60 is located in the substrate 10 (refer to fig. 7) and/or the second heat dissipation layer 60 is located on a side of the substrate 10 away from the retaining wall layer (refer to fig. 8).
Still referring to fig. 7, when the second heat dissipation layer 60 is located in the substrate 10, the second heat dissipation layer 60 may be located between the substrate 10 and the retaining wall layer.
At least one layer of the second heat dissipation layer 60 may provide at least one bottom heat dissipation channel for the bottom of the light emitting unit 30, and at least one layer of the second heat dissipation layer 60 cooperates with at least two layers of the first heat dissipation layers 42 arranged in different layers to provide a comprehensive heat dissipation network for the light emitting unit 30.
In fig. 7 and fig. 8, only one layer of the second heat dissipation layer 60 is shown, in other embodiments of the present application, the second heat dissipation layer 60 may be multiple layers, and the second heat dissipation layer 60 may be located in the display panel and on the side of the substrate 10 away from the retaining wall layer.
As for the shape of the second heat dissipation layer 60, fig. 7 and 8 both use the second heat dissipation layer 60 as a plane for example to illustrate, but in other embodiments of the present application, referring to fig. 9 and 10, fig. 9 and 10 are both schematic cross-sectional structures of the display panel, and in a cross section perpendicular to the display panel, the second heat dissipation layer 60 may also be in a wave shape. In fig. 9 and 10, in order to ensure that the plane of the waved second heat dissipation layer 60 is flat, an insulating layer 61 for planarization is also shown in fig. 9 and 10.
The undulations may be regular undulations (as shown in fig. 9), in which case the height of the ridges and the depth of the valleys of the undulations are the same, and the period of repetition of the valleys and ridges is the same. The undulations may also be irregular undulations (as shown in fig. 10) where the undulations have different peak (ridge) heights and valley (valley) depths, and different repeat periods of the valley ridges.
Still referring to fig. 9 and 10, when the second heat dissipation layer 60 has a wave shape in a cross section perpendicular to the display panel, a forward projection of a valley of the wave shape of the second heat dissipation layer 60 on the substrate 10 overlaps a forward projection of the light emitting unit 30 on the substrate 10, and a forward projection of a ridge of the wave shape of the second heat dissipation layer 60 on the substrate 10 overlaps a forward projection of the retaining wall structure 40 on the substrate 10.
On the basis of the above embodiments, in a further embodiment of the present application, referring to fig. 11, fig. 11 is a schematic cross-sectional structure diagram of the display panel, where the display panel further includes:
a second connecting structure 62, the second connecting structure 62 connecting the first heat spreading layer 42 and the second heat spreading layer 60.
In the structure shown in fig. 11, the second connecting structure 62 connects the first heat dissipation layer 42 and the second heat dissipation layer 60 together, so that the heat in the second heat dissipation layer 60 and the first heat dissipation layer 42 can be transferred to each other, and when the heat generation amount is different at each portion of the light emitting unit 30, the heat in the second heat dissipation layer 60 and the first heat dissipation layer 42 connected together can be transferred to each other, so that the heat in the first heat dissipation layer 42 and the second heat dissipation layer 60 connected together is uniform, which is beneficial to fully utilizing the heat dissipation performance of the first heat dissipation layer 42 and the second heat dissipation layer 60.
Similar to the first connection structure 43, the material forming the second connection structure 62 may be the same as the material forming the first heat dissipation layer 42 and/or the second heat dissipation layer 60, or may be different from the material forming the first heat dissipation layer 42 and/or the second heat dissipation layer 60, but since the second connection structure 62 needs to have a certain heat transfer and heat conduction capability, the material forming the second connection structure 62 needs to have a better heat dissipation or heat conduction capability.
In addition, since the orthographic projection of the wave-shaped valley of the second heat dissipation layer 60 on the substrate 10 overlaps with the orthographic projection of the light emitting unit 30 on the substrate 10, and the orthographic projection of the wave-shaped ridge of the second heat dissipation layer 60 on the substrate 10 overlaps with the orthographic projection of the retaining wall structure 40 on the substrate 10, the distance between the valley of the second heat dissipation layer 60 and the first heat dissipation layer 42 is relatively short, which is beneficial to reducing the extension length of the second connection structure 62 in the direction perpendicular to the substrate 10, and simultaneously, when the second connection structure 62 is prepared, the etching depth when the via hole for accommodating the second connection structure 62 is prepared is beneficial to reducing, thereby reducing the process difficulty.
With respect to the thickness of each of the first heat dissipation layers 42, still referring to fig. 6-11, the thickness of each of the first heat dissipation layers 42 is inversely proportional to the vertical distance between the first heat dissipation layer 42 and the second heat dissipation layer 60. It should be understood that, under the condition of the same factors of area, material, etc., the heat dissipation capability of the first heat dissipation layer 42 with the larger thickness is better, and in this embodiment, the thickness of the first heat dissipation layer 42 closer to the second heat dissipation layer 60 is larger, so that most of the heat generated by the light emitting unit 30 can be transmitted through the first heat dissipation layer 42 close to the second heat dissipation layer 60, which is beneficial to transmitting the heat in each first heat dissipation layer 42 to the second heat dissipation layer 60 through the first connection structure 43 and the second connection structure 62, so that most of the heat is conducted out through the second heat dissipation layer 60 at the bottom, and the adverse effect of the heat on each film layer of the retaining wall structure 40 is avoided.
In a direction perpendicular to the substrate 10 pointing to the light emitting surface of the display panel, the area of the first heat dissipation layer 42 gradually decreases. Similarly, in the case of the same thickness, material, etc., the larger area of the first heat dissipation layer 42 is better, and in this embodiment, the larger area of the first heat dissipation layer 42 closer to the second heat dissipation layer 60 is, so that most of the heat generated by the light emitting unit 30 can be transmitted through the first heat dissipation layer 42 close to the second heat dissipation layer 60, which is beneficial to transmitting the heat in each layer of the first heat dissipation layer 42 to the second heat dissipation layer 60 through the first connection structure 43 and the second connection structure 62, so that most of the heat is conducted out through the bottom second heat dissipation layer 60, and the adverse effect of the heat on each film layer of the retaining wall structure 40 is avoided.
The thickness of the first heat dissipation layer 42 is gradually decreased in a direction perpendicular to the direction in which the substrate 10 points to the light emitting surface of the display panel. Similarly, in the case of the same area, material and the like, the heat dissipation capability of the first heat dissipation layer 42 with a larger thickness is better, and in this embodiment, the thickness of the first heat dissipation layer 42 closer to the second heat dissipation layer 60 is larger, so that most of the heat generated by the light emitting unit 30 can be transmitted through the first heat dissipation layer 42 close to the second heat dissipation layer 60, which is beneficial to transmitting the heat in each first heat dissipation layer 42 to the second heat dissipation layer 60 through the first connection structure 43 and the second connection structure 62, so that most of the heat is conducted out through the second heat dissipation layer 60 at the bottom, and the adverse effect of the heat on each film layer of the retaining wall structure 40 is avoided.
On the basis of the above embodiments, in an alternative embodiment of the present application, referring to fig. 12 and 13, fig. 12 is a schematic top view structure of the display panel (for clearly illustrating the state of the first heat dissipation layer 42, the outermost isolation material layer 41 in the retaining wall structure 40 is not shown in fig. 12), fig. 13 is a schematic cross-sectional structure along line AA' of fig. 12, as can be seen from fig. 12 and 13, in this embodiment, the retaining wall structures 40 are disposed around the retaining wall openings, the first heat dissipation layers 42 located in the same layer in adjacent retaining wall structures 40 are connected to each other to form a heat dissipation layer extending to the whole layer of the edge of the substrate, and then the first heat dissipation layers 42 disposed in at least two different layers in the plurality of retaining wall structures 40 form heat dissipation channels in different layers to diffuse heat generated by the light emitting units 30 located in the retaining wall openings to the edge of the display panel, that is, the heat in the first heat dissipation layer 42 is diffused to the periphery of the display panel, so that the purpose of four-side heat dissipation of the light emitting unit is achieved, and the heat dissipation performance of the display panel is improved.
Correspondingly, an embodiment of the present application further provides a display device, as shown in fig. 14, fig. 14 is an external schematic view of the display device a100, and the display device a100 includes the display panel according to any embodiment of the present application.
To sum up, this application embodiment provides a display panel and display device, wherein, display panel's barricade layer includes a plurality of barricade structures and a plurality of barricade opening, just barricade structure includes the first heat dissipation layer that two at least different layers set up, and two at least different layers set up first heat dissipation layer provides the heat dissipation channel that two at least different layers set up for the heat that the luminescence unit that sets up in the barricade opening produced can outwards give off through the heat dissipation channel that these two at least different layers set up, is favorable to promoting display panel's heat-sinking capability, avoids appearing because luminescence unit's heat is around luminescence unit or inside accumulation and produces harmful effects to luminescence unit's performance.
Features described in the embodiments in the present specification may be replaced with or combined with each other, each embodiment is described with a focus on differences from other embodiments, and the same and similar portions among the embodiments may be referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (17)
1. A display panel, comprising:
a substrate;
the retaining wall layer is positioned on one side of the substrate and comprises a plurality of retaining wall structures and a plurality of retaining wall openings, each retaining wall structure comprises at least two first heat dissipation layers which are arranged in different layers, and the extending direction of each first heat dissipation layer is parallel to the surface of the substrate;
and the light-emitting unit is arranged in the opening of the retaining wall.
2. The display panel of claim 1, wherein the retaining wall structure further comprises a plurality of layers of barrier material;
the isolating material layers and the first heat dissipation layers are alternately stacked.
3. The display panel of claim 2, wherein the retaining wall structure further comprises at least one first connecting structure, and the first connecting structure connects two adjacent first heat dissipation layers.
4. The display panel according to claim 3, wherein the first connection structures of different layers do not overlap in an orthogonal projection of the substrate.
5. The display panel according to claim 3, wherein the display panel further comprises a light reflecting layer covering the sidewall of the bank structure; the light reflecting layer is reused as the first connecting structure.
6. The display panel according to claim 3, wherein the first heat dissipation layer receives a fixed potential.
7. The display panel according to claim 6, wherein the first heat dissipation layer is electrically connected to a cathode of the light emitting unit or is electrically connected to a power supply signal line of the display panel.
8. The display panel according to claim 3, wherein the display panel further comprises at least one second heat dissipation layer, the second heat dissipation layer is located in the substrate or/and the second heat dissipation layer is located on a side of the substrate away from the retaining wall layer.
9. The display panel according to claim 8, wherein the second heat dissipation layer has a wave shape in a cross section perpendicular to the display panel.
10. The display panel according to claim 9, wherein the orthographic projection of the wave-shaped valleys of the second heat dissipation layer on the substrate overlaps with the orthographic projection of the light emitting unit on the substrate, and the orthographic projection of the wave-shaped ridges of the second heat dissipation layer on the substrate overlaps with the orthographic projection of the retaining wall structures on the substrate.
11. The display panel according to claim 8 or 10, further comprising:
a second connection structure connecting the first heat dissipation layer and the second heat dissipation layer.
12. The display panel according to claim 8,
the thickness of each first heat dissipation layer is inversely proportional to the vertical distance between the first heat dissipation layer and the second heat dissipation layer.
13. The display panel according to claim 8,
in a direction perpendicular to the direction from the substrate to the light-emitting surface of the display panel, the area of the first heat dissipation layer is gradually reduced.
14. The display panel according to claim 8,
in a direction perpendicular to the direction from the substrate to the light-emitting surface of the display panel, the thickness of the first heat dissipation layer is gradually reduced.
15. The display panel of claim 1, wherein the first heat dissipation layers of the barrier layers located on the same layer are connected to each other and extend to the edge of the substrate.
16. The display panel according to claim 1,
the light emitting unit comprises an OLED light emitting unit or a micro-LED light emitting unit.
17. A display device, comprising: the display panel of any one of claims 1-16.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010614897.2A CN111725428B (en) | 2020-06-30 | 2020-06-30 | Display panel and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010614897.2A CN111725428B (en) | 2020-06-30 | 2020-06-30 | Display panel and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111725428A true CN111725428A (en) | 2020-09-29 |
| CN111725428B CN111725428B (en) | 2023-04-21 |
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| CN202010614897.2A Active CN111725428B (en) | 2020-06-30 | 2020-06-30 | Display panel and display device |
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| CN112786760A (en) * | 2020-12-31 | 2021-05-11 | 厦门天马微电子有限公司 | Display panel, preparation method and display device |
| CN113345336A (en) * | 2021-05-31 | 2021-09-03 | 上海天马微电子有限公司 | Display panel and manufacturing method thereof |
| CN114267780A (en) * | 2021-12-14 | 2022-04-01 | Tcl华星光电技术有限公司 | Display panel and manufacturing method thereof |
| WO2022217883A1 (en) * | 2021-04-16 | 2022-10-20 | 京东方科技集团股份有限公司 | Quantum dot light-emitting device and display apparatus |
| WO2023206662A1 (en) * | 2022-04-27 | 2023-11-02 | 深圳市华星光电半导体显示技术有限公司 | Display panel |
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